JPH09204945A - Double-sided chip jumper - Google Patents

Abstract

(57) 【Abstract】 PROBLEM TO BE SOLVED: To provide a double-sided chip capable of rationally connecting a wiring pattern on a front surface and a wiring pattern on a back surface of a wiring board with a minimum of cost increase and without any trouble. Provide jumpers. SOLUTION: The wiring patterns 51 to 54 on the front surface 50A of the wiring board 50 and the wiring patterns 55, 56 on the rear surface 50B are inserted into insertion holes 62 formed in the wiring board 50.
.. A plurality of terminals 15 for connecting to and are provided, and a specific portion of each of the plurality of terminals 15, 15, ... Except for the connection portion connected to the wiring pattern 51 to is made of resin. The base 12 is cast and encapsulated and integrally connected.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a double-sided chip jumper which is mounted on a wiring board having wiring patterns formed on both front and back surfaces thereof to connect a front wiring pattern and a rear wiring pattern.

[0002]

2. Description of the Related Art Conventionally, in a wiring board in which wiring patterns are formed on both front and back surfaces and electronic circuit components (chip components such as resistors and capacitors, discrete components) are mounted on both surfaces, the wiring patterns on the front surface and the wiring on the back surface. When it is necessary to connect a pattern, a through hole covered with copper or silver is formed in a portion where the wiring pattern on the front surface and the wiring pattern on the back surface to be connected in the wiring board overlap each other in plan view (orthographic projection). It was general to make.

[0003]

However, as described above, in addition to forming the wiring pattern on the wiring board and mounting the electronic circuit parts, it is of course necessary to form a through hole coated with copper or silver. However, as the number of man-hours increases, expensive materials such as copper and silver are required, resulting in a significant increase in cost.

In order to solve the above-mentioned problems, the present invention starts from focusing on a chip jumper as a connecting means instead of a through hole. The purpose of the invention is to form a wiring pattern on the surface of a wiring board. (EN) It is possible to provide a double-sided chip jumper capable of rationally connecting the wiring pattern on the back side and the wiring pattern on the back side with minimal effort and cost reduction.

[0005]

In order to achieve the above object, a double-sided chip jumper according to the present invention is mounted on a wiring board having wiring patterns formed on both front and back surfaces, and is formed on the wiring board. A plurality of terminals that are inserted into the insertion holes to connect the wiring pattern on the front surface and the wiring pattern on the back surface of the wiring board, and each of the terminals is connected to the wiring pattern. It is characterized in that the specific parts except for are casted by a resin base part and are integrally connected.

The double-sided chip jumper of the present invention can be manufactured by using a method called insert molding in injection molding and the like.
It may be mentioned that a convex portion is provided so as to project on the base portion made of the resin so as to partition between the connection portions of two adjacent terminals.

In another preferred embodiment, the base body of the resin is in the shape of a rectangular plate or a thin rectangular parallelepiped, and a corner portion thereof has a substantially "L" shape in a plan view and a side view and a front view. An example is one in which terminals having an approximate “7” shape are arranged. In the present invention, the shape or the like of the terminal is not particularly limited, but as a preferable example thereof, the plan view is generally “L” -shaped and the side view and the front view are generally “7”.
In addition to the letter-shaped one, a metal plate provided with a plate-shaped first connecting portion and a second connecting portion bent perpendicular to the first connecting portion can be cited. In addition,
The size of the double-sided chip jumper of the present invention is not particularly limited, but the vertical and horizontal lengths and the total height are 0.5 mm to 5 mm, which are the same as those of ordinary chip-shaped electronic circuit parts (capacitors, filters, etc.) mounted on a wiring board. It is desirable to be within the range.

The double-sided chip jumper according to the present invention configured as described above is mounted on the wiring board in the same manner as other chip-shaped electronic circuit parts. That is, a plurality of terminals are respectively inserted into the insertion holes formed in the wiring board, and, for example, the connecting portion protruding on the back surface side is soldered to the wiring pattern on the back surface by the dip soldering method to be connected to the front surface side. Is connected to the wiring pattern on the surface by soldering by the reflow soldering method.

Therefore, if the double-sided chip jumper of the present invention is used, it is not necessary to form through holes in the wiring board, which is troublesome and uses an expensive material. Further, since the double-sided chip jumper of the present invention can be mounted on the wiring board in a manner that takes advantage of the mounting process (including the soldering process) of other chip-shaped electronic circuit components, a new process for mounting the double-sided chip jumper is required. Does not need.

In addition to the above, in the double-sided chip jumper of the present invention, a plurality of terminals obtained by bending an inexpensive metal plate or wire into an appropriate shape is insert-molded with a resin. Since it is manufactured only by itself, it is more cost effective than through holes, and since it has a plurality of terminals, it is possible to connect wiring patterns on the front and back at a plurality of locations at the same time.

As a result, according to the double-sided chip jumper of the present invention, the wiring pattern on the front surface and the wiring pattern on the back surface of the wiring board can be rationally connected without any trouble while suppressing the cost increase as much as possible. obtain.

Further, by using the double-sided chip jumper of the present invention, even if the wiring pattern on the front surface and the wiring pattern on the back surface to be connected do not overlap at all in plan view, they can be formed by devising the positions and shapes of the terminals. Can be connected, and the degree of freedom in designing the layout of wiring patterns and electronic circuit components can be increased. Further, since the convex portion is provided on the base portion so as to partition the connection portion between two adjacent terminals, it is possible to reliably prevent the solder on one terminal side from flowing into the adjacent terminal side.

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of a double-sided chip jumper according to the present invention will be described below with reference to the drawings.

FIG. 1 shows a double-sided chip jumper 10 according to an embodiment of the present invention, which has wiring patterns 51, 52,
It shows a state of being mounted on the wiring board 50 on which 53, 54, 55, 56, ... Are formed. As can be seen by referring to FIG. 3 in addition to FIG. 1, the double-sided chip jumper 10 of the present embodiment has four corner portions of a rectangular plate-shaped or thin rectangular parallelepiped-shaped base body 12 made of resin, respectively. As shown in FIG. 2, terminals 15 and 1 each having a substantially “L” shape in a plan view and a “7” shape in a side view and a front view.
5, 15, 15 are arranged in an upright posture.

These four terminals 15, 15, 15, 15
Are made of conductive metal plates, respectively, and have wiring patterns 51, 52, 53, 5 on the surface 50A of the wiring board 50.
4 and the wiring board 5
, Which are inserted into the insertion holes 62, 62, ... formed in No. 0 and are connected to the wiring patterns 55, 56, ..
c, and the surface thereof is tin-plated or solder-plated as required. Then, the intermediate portions 15c, 15c of the terminals 15, 15, 15, 15
15c and 15c are cast in a base 12 made of resin and are integrally connected.

Further, the two adjacent terminals 15 and 15
The protrusions 12a, 12a are provided on the base body 12 made of the resin so as to partition the front surface side connecting portions 15a, 15a.

In this double-sided chip jumper 10, the length of the base 12 is about 2 mm.

In the double-sided chip jumper 10 configured as described above, the four terminals 15, 15, 15,
15 are insertion holes 62 formed in the wiring board 50,
, And the rear surface side connecting portion 15b protruding to the rear surface 50B side is formed by the dip soldering method on the rear surface 50B.
Solder to the wiring patterns 55, 56, ... (72)
Are connected to each other, and the front surface side connection portion 15a is formed by the reflow soldering method on the wiring patterns 51, 52, 53, 5 on the front surface 50A.
4 is soldered (74) and connected.

Therefore, the double-sided chip jumper 1
When 0 is used, it is not necessary to form through holes in the wiring board, which is laborious and uses an expensive material. Further, the double-sided chip jumper 10 of the present invention has a mounting step (including a soldering step) for mounting other chip-shaped electronic circuit components.
Since it can be mounted on the wiring board in the form of a piggyback, it does not require a new step for mounting the double-sided chip jumper 10.

In addition to the above, the double-sided chip jumper 10
Is manufactured by simply casting a plurality of terminals 15, 15, 15, 15 obtained by bending an inexpensive metal plate into an appropriate shape by insert molding with a resin, It is more cost effective than the through hole, and moreover, because it has a plurality of terminals 15, 15, 15, 15,
It is possible to simultaneously connect wiring patterns on the front and back at a plurality of locations.

As a result, this double-sided chip jumper 10
According to the wiring pattern 5 on the surface 50A of the wiring board 50,
1-54 and the wiring patterns 55, 56, ...
-It is possible to connect the and to the rational connection with minimal cost and without any trouble.

If the double-sided chip jumper 10 is used, the wiring pattern (for example, 5
Even if 1) and the wiring pattern (for example, 55) on the back surface 50B do not overlap at all in a plan view, they can be connected depending on the position and shape of the terminal, and the wiring pattern and the layout design of the electronic circuit component can be designed. The degree of freedom is increased.

Furthermore, the two adjacent terminals 15 and 1
Since the protrusions 12a and 12a are provided on the base portion 12 so as to partition between the front surface side connection portions 15a and 15a of FIG. 5, it is ensured that the reflow solder 72 on one terminal side flows into the adjacent terminal side. It can be prevented.

FIG. 4 shows a second embodiment of the double-sided chip jumper. In the double-sided chip jumper 20, a plurality of terminals 25 are provided on both sides of a rectangular plate-shaped or thin rectangular parallelepiped base portion 22 made of resin. , 25, ... Are arranged at predetermined intervals. The terminals 25 and 2
5, ... are made of a metal plate, and are a plate-shaped rear surface side connecting portion 25b and a front surface side connecting portion 25a which is vertically bent so as to be punched from the rear surface side connecting portion 25b leaving a base end portion. Are provided, and an upper end portion 25c thereof is bent, is cast in the base portion 22, and is embedded.

Also in this case, the terminals 25, 25, ... Are inserted through holes 62, 62, 62 formed in the wiring board 50, respectively.
, And the rear surface side connecting portion 25b protruding toward the rear surface 50B is soldered (72) to the wiring pattern (not shown) of the rear surface 50B by the dip soldering method to be connected to the front surface side connecting portion 25a. Surface 5 by reflow soldering method
It is soldered (74) and connected to a 0A wiring pattern (not shown).

Also in this double-sided chip jumper 20, substantially the same operational effects as in the above-described first embodiment can be obtained. Particularly, in this product, the terminals 25, 25, ... Can be manufactured relatively easily, and the terminals 25, 25, ...
・ It is suitable for wiring boards that have many wiring patterns to be connected on the front and back sides, because any number of can be regularly arranged.

As in the double-sided chip jumper 30 of the third embodiment shown in FIG. 5, terminals 35, 35, 3 are provided.
It is also possible to dispose 5, ... Crossing the base portion 32 in the vertical and horizontal directions.

In the double-sided chip jumper 40 of the fourth embodiment shown in FIG. 6, only two terminals 45 having substantially the same shape as the terminal 15 of the double-sided chip jumper 10 of the first embodiment are arranged on the left and right. The double-sided chip jumper 40 is formed by casting and connecting the base portion 42 made of resin, and as shown in FIG.
5 and four side surfaces of the base portion 42, a draft S and a clearance space S are formed for the convenience of resin molding.

[0029]

As can be understood from the above description, the double-sided chip jumper of the present invention can be mounted on a wiring board in a manner that takes advantage of the mounting process (including the soldering process) of other chip-shaped electronic circuit components. In addition, because it is made by insert-molding a plurality of terminals that are obtained by bending an inexpensive metal plate or wire into an appropriate shape by insert molding, it is possible to compare it with a through hole. This is advantageous in terms of cost, and moreover, since it has a plurality of terminals, it becomes possible to simultaneously connect wiring patterns on the front and back at a plurality of locations.

As a result, according to the double-sided chip jumper of the present invention, the wiring pattern on the front surface and the wiring pattern on the back surface of the wiring board can be rationally connected without increasing the cost while suppressing the cost increase as much as possible. be able to.

[Brief description of drawings]

FIG. 1 is a perspective view showing a first embodiment of a double-sided chip jumper according to the present invention mounted on a substrate.

FIG. 2 is a perspective view showing terminals of the double-sided chip jumper shown in FIG.

FIG. 3 is a three-sided view of the double-sided chip jumper shown in FIG.

FIG. 4 shows a second embodiment of a double-sided chip jumper according to the present invention, (A) is a partial perspective view, and (B) is a partial sectional view.

FIG. 5 is a vertical sectional view showing a third embodiment of the double-sided chip jumper according to the present invention.

FIG. 6 is a trihedral view of a double-sided chip jumper according to a fourth embodiment of the present invention.

7A is a sectional view taken along the line AA of FIG. 6, and FIG. 7B is a sectional view taken along the line BB of FIG.

[Explanation of symbols]

 10 Double-sided Chip Jumper (First Embodiment) 12 Base Part 15 Terminal 20 Double-sided Chip Jumper (Second Embodiment) 30 Double-sided Chip Jumper (Third Embodiment) 40 Double-sided Chip Jumper (Fourth Embodiment) 50 Wiring Board 51 to 56 Wiring pattern 62 Insertion hole 72 Reflow solder 74 Dip solder

Claims (4)

[Claims] 1. A double-sided chip jumper mounted on a wiring board having wiring patterns formed on both front and back surfaces, the wiring pattern on the front surface and the back surface of the wiring board being inserted into an insertion hole formed in the wiring board. A plurality of terminals for connecting to the wiring pattern, and a specific portion of each of the plurality of terminals excluding the connecting portion connected to the wiring pattern is integrally molded by being wrapped in a base portion made of resin. Double-sided chip jumper characterized by being connected to. 2. The double-sided chip according to claim 1, wherein a convex portion is provided on the base portion made of the resin so as to partition the connection portions of two adjacent terminals from each other. jumper. 3. The resin base portion is formed into a rectangular plate shape or a thin rectangular parallelepiped shape, and a corner portion thereof has a substantially “L” shape in a plan view and a “7” shape in a side view and a front view. The resist stripping apparatus according to claim 1 or 2, wherein terminals are arranged. 4. The terminal is made of a metal plate provided with a plate-shaped first connecting portion and a second connecting portion bent perpendicular to the first connecting portion. The double-sided chip jumper according to claim 1 or 2, which is characterized.