JPH09205048A - Method and system for planning production schedule of semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To plan a production schedule of semiconductor devices efficiently. SOLUTION: A memory means 3 stores group names and allowance of shifts for each of a plurality kinds of semiconductor devices. An identical group name is provided when a single wafer processing is performed under the same conditions in the production process except the batch processing and masking step. Upon receiving a production schedule data determining the timing for starting production of a plurality of kinds of semiconductor devices for a plurality of days based on a scheduled date of delivery and standard machining days, a production schedule alteration means 5 makes a decision whether predetermined number of semiconductor devices for batch processing, belonging to the same group name, are present within the allowance of the shift. If predetermined number of semiconductor devices are present, production schedule is altered to produce the semiconductor devices belonging to the same group are produced on the same day.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device manufacturing plan creating apparatus, and more particularly to facilitating the creation of a manufacturing plan.

[0002]

2. Description of the Related Art In the manufacturing process of a semiconductor device, manufacturing is performed by a combination of single wafer processing and batch processing. The single-wafer processing is processing for sequentially performing processing one by one, and includes a mask process, an etching process, an implantation process, and the like. In the single-wafer processing, if the processing conditions are the same, the setup change is not necessary, but if the processing conditions are different, the setup change is required before the next processing. The batch process is a process that is performed collectively on a plurality of lots, and the process is performed when the number of processable sheets is accumulated. The batch process includes, for example, a diffusion process and a CVD process.

A semiconductor device manufacturing plan is generally created based on a delivery date and a lead time. For example, FIG.
Given a delivery date and the number of lots for each product as shown in 5A, a manufacturing plan is created as follows. For each product, the products α1, α2, α3 and the products γ1, γ2, γ3 have the same batch processing. Further, the products β1, β2, and β3 and the products Δ1, Δ2, and Δ3 are subjected to the same batch processing. Note that β1, β2, β3 and δ1, δ
2 and δ3 are the same in batch processing but different in single-wafer processing.

First, based on the standard processing days of each product as shown in FIG. 15B, the required input date and the input lot number for each product as shown in FIG. 16 are obtained. Then, the order of loading is determined based on the number of processable input lots per day. For example, in this case, as the loading order, products α1, δ1, β1, α2, β2, γ2, γ1, δ3, α3, γ3,
δ1, β3, α1, δ1, β1, α2, β2, γ2, γ1, δ3,
α3, γ3, δ1, and β3. Based on this order, a manufacturing plan is created so that each lot can be processed in one day, and the lots are input. For example, assuming that the number of lots that can be processed in one day is 6, the product α1, δ1, β1, α2,
β2 and γ2 were introduced, and on October 4, products γ1, δ3 and α
3, γ3, δ1, and β3 will be input.

By thus creating the manufacturing plan, each semiconductor device can be manufactured in accordance with the delivery date.

[0006]

However, there are the following problems with the method of creating a manufacturing plan as described above. On October 3, two batch processes in total, one batch process for products α1, α2, and γ2, one batch process for products δ1, β1, and β2, are required. Further, at the time of single-wafer processing, even if the operator makes a successful setup, after processing the products α1, α2, γ3, the setup is changed and the product δ1 is processed, and the setup is changed again, and the product β1, There are two setup changes such as processing β2.

Regarding the batch processing, the batch processing is first performed when the products having the same batch processing content are accumulated by the number of processed sheets of the batch processing. Therefore, even though the single-wafer processing is completed, the products in the processing waiting state are accumulated before the batch processing. This prolongs the overall lead time.

Further, when it is not possible to wait due to the delivery date, it is necessary to carry out the batch processing even with a dummy wafer. The process using the dummy wafers means performing one batch process using the dummy wafers even when the number of batch processed sheets is not accumulated. In such a case, useless wafers are processed, and the overall processing capacity is reduced.

It is an object of the present invention to solve the above problems and to provide a manufacturing plan creating apparatus and method capable of efficiently manufacturing a semiconductor device.

[0010]

In a semiconductor device manufacturing plan creating apparatus according to a first aspect of the present invention, a batch processing for collectively processing a predetermined number of substrates and a single-wafer processing for sequentially processing one substrate are manufactured in combination. Is a device for producing manufacturing plan data for manufacturing a plurality of types of semiconductor devices to be manufactured, the method comprising: A) each of the following semiconductor devices:
Storage means for storing 2), a1) group name determined by whether or not the batch processing is performed under the same conditions in the manufacturing process, a2) shift tolerance including the allowable number of days for pre-emption, and B) planned shipping date Further, when the manufacturing plan data in which the time to start the manufacturing of the specific type of semiconductor device is determined based on the standard processing days and a plurality of days are given, the semiconductor devices belonging to the same group name within the shift tolerance are given. However, it is determined whether or not there is a predetermined number in the batch processing, and if there is, a manufacturing plan changing means for changing the manufacturing plan so that the semiconductor devices belonging to the same group are manufactured on the same day, It is characterized by having.

According to another aspect of the semiconductor device manufacturing plan creating apparatus of the present invention, the same group name is added to each of the semiconductor devices when the single-wafer processing other than the masking step is performed under the same conditions in the manufacturing process. It is characterized by being

According to another aspect of the semiconductor device manufacturing plan creation apparatus of the present invention, the allowable shift days include the allowable shift days after input, and the manufacturing plan changing means uses the changed manufacturing plan to determine the allowable shift days after input. If there is a semiconductor device that exceeds the limit, this is notified.

According to a fourth aspect of the present invention, there is provided a plurality of semiconductor devices manufactured by combining batch processing for collectively processing a predetermined number of substrates and single wafer processing for sequentially processing one substrate. A method for creating manufacturing plan data for manufacturing a type, comprising: a)
2) is memorized and a1) a group name determined by whether or not the batch processing is performed under the same conditions in the manufacturing process, a2) a tolerance for the shift including the allowable number of days of pre-emption, and B) a planned shipping date. Further, when the manufacturing plan data in which the time to start the manufacturing of the specific type of semiconductor device is determined based on the standard processing days and a plurality of days are given, the semiconductor devices belonging to the same group name within the shift tolerance are given. Determines whether there is a predetermined number in the batch processing, and C) if there is, changes the manufacturing plan so that the semiconductor devices belonging to the same group are started to be manufactured on the same day. And

In the method for preparing a semiconductor device manufacturing plan according to a fifth aspect, the same group name is added to each of the semiconductor devices when the single-wafer processing other than the masking step is performed under the same conditions in the manufacturing process. It is characterized by being

According to a sixth aspect of the present invention, there is provided a semiconductor device manufacturing plan creation method wherein the allowable shift days include the allowable shift days after input, and there is a semiconductor device that exceeds the allowable shift days after input in the changed manufacturing plan. In some cases, this is notified.

The storage medium of claim 7 is a computer-readable storage medium storing a computer-executable program, wherein the program realizes the apparatus or method according to any one of claims 1 to 6. It is characterized by being

[0017]

According to the semiconductor device manufacturing plan creating apparatus or the method of the first and fourth embodiments, the group name and the group name determined by whether or not the batch processing is performed under the same condition in the manufacturing process. If the manufacturing plan data determined based on the planned shipping date and the standard processing days is given for a plurality of days by storing the shift tolerance including the input preemptive tolerance days, the same group is included in the shift tolerance. It is determined whether there is a predetermined number of semiconductor devices belonging to the name in the batch processing. And
If it exists, the manufacturing plan is changed so that the semiconductor devices belonging to the same group are manufactured on the same day. In this way, batch processing can be efficiently performed by collectively starting the manufacturing of semiconductor devices having the same batch processing. Thereby, the semiconductor device can be efficiently manufactured.

According to another aspect of the present invention, there is provided a semiconductor device manufacturing plan creating apparatus or method thereof, wherein, for each of the semiconductor devices, a single-wafer processing other than the masking step is performed under the same conditions in the manufacturing process. The same group name is added. Therefore, when performing the single-wafer processing, the setup change is reduced. Thereby, the semiconductor device can be manufactured more efficiently.

According to another aspect of the present invention, there is provided the semiconductor device manufacturing plan creating apparatus or the method thereof, wherein the allowable number of days for shifting includes the allowable number of days for shifting after input, and the allowable number of days for shifting is allowed in the manufacturing plan after the change. If there is a semiconductor device that exceeds the number of days, this is notified. Therefore, the operator can know when the changed manufacturing plan data exceeds the delivery date. As a result, the semiconductor device can be manufactured efficiently and on time.

[0020]

BEST MODE FOR CARRYING OUT THE INVENTION

1. Regarding Functional Block Diagram One embodiment of the present invention will be described with reference to the drawings. A semiconductor device manufacturing plan creating apparatus 1 shown in FIG. 1 manufactures a plurality of types of semiconductor devices manufactured by combining a batch process for collectively processing a predetermined number of substrates and a single-wafer process for sequentially processing one substrate. It is an apparatus for creating manufacturing plan data, and is provided with a storage unit 3 and a manufacturing plan changing unit 5.

The storage means 3 stores a group name and a shift tolerance for each of a plurality of types of semiconductor devices. The same group name is added to the group name when the batch process is performed under the same conditions in the manufacturing process, and when the single-wafer process other than the masking process is also performed under the same condition. The shift tolerance refers to data indicating how far ahead of the manufacturing start date, which is determined based on the planned shipping date and the standard processing days, of each semiconductor device, and the shift tolerance after the input. Includes the number of days and the allowable number of days for pre-emption. The larger the allowable number of days for pre-emption, the higher the degree of freedom in manufacturing planning, but the more inventory. Also,
If the allowable number of days after input is set to a large value, it is necessary to set a long lead time for the product, considering the extra time.

The production plan changing means 5 produces the production plan data in which the time to start the production of the semiconductor device of the specific type is determined based on the planned shipping date and the standard processing days.
When given for a plurality of days, it is determined whether or not there is a predetermined number of semiconductor devices belonging to the same group name within the shift tolerance in the batch processing. If it exists, the manufacturing plan is changed so that the semiconductor devices belonging to the same group are started to be manufactured on the same day.
In addition, the manufacturing plan changing means 5 uses the changed manufacturing plan.
If there is a semiconductor device that exceeds the allowable number of days after insertion, this is notified.

As described above, the semiconductor devices are grouped in advance depending on whether the batch processing is performed under the same conditions or not, and the allowable number of days for prefetching is determined so that products in the same group can be processed collectively. By doing so, batch processing can be efficiently performed.

2. Regarding Hardware Configuration FIG. 2 shows an example of a hardware configuration in which the manufacturing plan creation device 1 shown in FIG. 1 is realized by using a CPU.

The manufacturing plan creating apparatus 1 includes a CPU 23, a memory 27, a hard disk 26, a CRT 28, and an FDD 2.
5, a printer 32 and a bus line 29.

The CPU 23 controls each unit via the bus line 29 according to the control program stored in the hard disk 26.

This control program is read out from the flexible disk storing the program via the FDD 25 and stored (installed) in the hard disk 26.

The hard disk 26 stores basic parameters including a group parameter or shift tolerance of products, which will be described later, and priorities. Memory 27
The calculation result and the like are temporarily stored in. The CRT 28 displays the produced manufacturing plan data and the like. In addition, CRT
28 may be composed of a liquid crystal display device. Printer 32
Prints the manufacturing plan data.

3. Flowchart Next, the programs stored in the hard disk 26 will be described with reference to FIG.

The CPU 23 first takes in order data (step ST1). For example, for product A, the delivery date is 200 pieces on March 1, 100 pieces on March 2, 200 pieces on March 3, 300 pieces on March 4, 50 pieces on March 5,
If there is order data such as 0, the order data is stored in the hard disk 26.

Next, the CPU 23 converts the lot number (step ST2 in FIG. 3). To do this, the required number of lots may be obtained from the standard number of lots per lot shown in FIG. For example, when 200 pieces of product A are required on March 1, it is possible to determine how many lots are required as 200 / Na. Similarly, the number of lots will be converted after March 2nd.

In the lot number conversion process, if some products are already manufactured, the number of products may be subtracted to obtain the number of lots.

Next, the CPU 23 creates the input plan primary data (step ST3 in FIG. 3). The input plan primary data is obtained by determining the input start date based on the delivery date and the standard processing days. Specifically, in order to deliver 200 pieces of the product A on March 1, the year-end and New Year holidays were set to 10 days, the number of processing days La of the product was set to 80 days, and the standard number of pieces taken per lot Na was set to 100. In one case
It can be seen that it is sufficient to add two lots of product A on February 1. In the same manner, the required injection dates for the products B, C, ... Are calculated. In this way, the input plan primary data is created.

FIG. 6 shows an example of primary data of the input plan.
According to FIG. 6, for product A, 2 lots on 1st December, 1 lot on 2nd December, 2 lots on 3rd December ...
・ It is planned to be introduced. In this embodiment, the number of lots that can be processed in one batch process is “6”, and the batch process can be performed twice per day, that is, 12 lots can be processed per day.

Next, the CPU 23 creates the manufacturing plan data based on this input plan primary data (step ST4 in FIG. 3). Figure 4 shows the production plan data creation.
This will be described with reference to FIG. Here, a case will be described in which the manufacturing plan data is created from the input plan primary data shown in FIG.

The CPU 23 determines whether or not the data for the next day and the data for the day after the next day already exist (step S in FIG. 4).
T5). In this case, since there is no data for the next day and the day after the next day, the process proceeds to step ST6, and the number of days i of charging is initialized (step ST7). Next, the CPU 23 initializes the processing group number j (step ST8) and sets the A flag to O.
Set to FF (step ST9). As will be described later, the A flag is a flag for distinguishing products in groups whose total is less than 6 lots.

Next, the CPU 23 determines the j-th group on the i-th day of input (step ST10 in FIG. 4). This process will be described with reference to FIG. The CPU 23
The number of postponed days k is initialized (step ST21 in FIG. 5).
Next, the product of the maximum lot number is searched for the i-th input date (step ST25). In this search, the search target is the A flag OFF and the decision flag B OFF. The A flag and the determination flag B will be described later.

Here, since the input days i = 0, the 0th product, that is, the product of the maximum lot number on December 1st is searched. In this case, since the product D is the largest in four lots, this is the product of interest. Next, the CPU 23 determines whether or not there is the same lot number (step ST27 in FIG. 5). In this case, since there is no product with the same lot number, the process proceeds to step ST31, and it is determined whether or not there are products belonging to the same group by the kth day.

Whether or not they are in the same group can be judged by a group parameter shown in FIG. In the present embodiment, when the batch processing classification and the single-wafer processing classification of the group parameters are the same, it is determined that they are the same group.

In this case, as shown in FIG. 7, the product D belongs to the same group as the product C. Here, since the number of postponed days k = 0, it is determined whether or not the product C exists on December 1. In this case, since it does not exist, the number k of advancements is incremented (step ST3 in FIG. 5).
7) It is determined whether or not the number of advance days k ≦ the allowable number of advance days kx (step ST38). The admissible number of advance days kx refers to the number of admissible days in advance in the product X. This is done by reading in the allowable number of days of pre-emption in advance shown in FIG. In this case, for the product D, since the allowable number of days for pre-fetching is “4”, the allowable number of advance days kx = 4. Therefore, since the number of advance days k is less than or equal to the allowable number of advance days kx, the process returns to step ST31 and the next day is December 2
Determine whether there are products belonging to the same group on a day.

As shown in FIG. 6, two lots of products D belong to the same group. Therefore, the process proceeds to step ST33, and it is determined whether the total is 6 lots or more. In this case, since the total is 6 lots, the process proceeds to step ST35, and the products of one batch group are determined. Then, for the decided product D, the decision flag B is turned ON for the lots on December 1st and 2nd. The priority in step ST35 will be described later.

When the processing of one batch group is thus determined, the process proceeds to step ST11 in FIG. 4, the processing group number j is incremented, and the processing group number j = 3.
It is determined whether or not (step ST13 in FIG. 4). In this case, since the processing group number j = 2, the processing of step ST10 in FIG. 4 is performed again.

The CPU 23 sets the number of advance delivery days k = 0 (step ST21), and pays attention to the product in the maximum lot number (step ST25). In this case, since the determination flag B for the product D has been set to ON by the determination process of the previous process (step ST35), the product of the maximum lot number is searched for other products. In this case, product A is 2
Since there are two lots of product E and the same number of lots exist, in step ST27, the process proceeds to step ST29, and the one with a high priority is selected.

The priority is stored in the hard disk 26. In the present embodiment, the priority is
The conditions are as follows.

Condition 1: The one with a long lead time is selected first.

Condition 2: If the lead times are the same, the one with the largest total order quantity at the time of planning is selected.

Condition 3: If the lead time and total order quantity are exactly the same, select the one with the smallest product number.

In the present embodiment, with respect to the lead time, the lead time of product A is La> product B.
Lead time Lb> product D lead time Ld> product C lead time Lc> product E lead time Le> product F lead time Lf> product G lead time Lg>
The lead time of product H is Lh>.

In this case, since the lead time La of the product A is longer than the lead time Le of the product E, the product A is
Is selected.

Next, the CPU 23 determines whether or not there is a product belonging to the same group by the kth day (step ST31). In this case, on December 1, there is one lot of product D belonging to the same group. Therefore, the process proceeds to step ST33, and it is determined whether the total is 6 lots or more. In this case, since there are three lots, the process proceeds to step ST37 and increments the number of days of advance k.

Next, the CPU 23 determines whether or not the number of advance days k ≦ the allowable number of advance days kx (step ST38).
In this case, the number of advance delivery days k ≦ the number of advance delivery allowable days kx, so it is determined whether or not there are products belonging to the same group on the next day (step ST31). In this case, the next day, that is, December 2, Product A has one lot and Product B has one lot.
Since there are 2 lots, the process proceeds to step ST33, and it is determined whether the total is 6 lots or more. In this case, since the total is 6 lots, the process proceeds to step ST35, the determination process is performed, and the determination flag B is turned on for the corresponding lot. In this way, the second batch group is determined.

The CPU 23 proceeds to step ST11 in FIG. 4 and increments the processing group number j. Then, it is determined whether or not the processing group number j = 3 (step S
T13). In this case, since the processing group number j = 3, the process proceeds to step ST15 and the replacement process is performed.

The exchange process is a process of sending a lot that cannot be input later and a process of sending a lot for which the decision flag B is ON first. As a result of this processing, as shown in FIG. 8, the products E, F, and C cannot be input on December 1, so they are sent on the next December 2. As for the products A and B, what should be originally introduced on December 2 are 3 lots of the product A and 3 lots of the product B on December 1. As for the product D, two lots to be put on December 2 are put on December 1. That is, as shown in FIG. 14, a total of 12 lots of product A3 lot, product B3 lot, and product D6 lot will be input on December 1st.

Next, the CPU 23 increments the input number of days i (step ST17 in FIG. 4) so that the input number of days i is 3
Or not (step ST19). In this case, since the number of input days i = 1, the processes in and after step ST8 are repeated. FIG. 9 shows the primary data of the charging plan after the replacement processing is completed. In this case, 2 lots of the product D, 3 lots of the product E, 3 lots of the product F, and 4 lots of the product G are scheduled to be input on December 2.

The CPU 23 first turns off the A flag (step ST9). Next, the batch group on the i-th day of input is determined (step ST10).

The CPU 23 initializes the number of advance days k (step ST21 in FIG. 5) and pays attention to the product of the maximum lot number (step ST25). In this case, since the product G has 4 lots on December 2, attention is paid to the product G. The CPU 23 determines whether or not there is the same lot number (step ST27). In this case, since there is no such lot, the process proceeds to step ST31 and determines whether or not there is a product belonging to the same group by the kth day (step ST27). Step ST
31). In this case, it is possible to determine that the products H belong to the same group by referring to the group parameter shown in FIG. Since the number of postponed days k = 0 here, 12
Since product H does not exist on the 2nd of the month, step ST37
Then, the number of postponed days k is incremented.

Next, the CPU 23 determines whether or not the number of advance delivery days k exceeds the number of advance acceptance days of the product G (step ST38). In this case, since it has not exceeded, it proceeds to step ST31 and determines whether or not there is a product belonging to the same group by the next day. In this case, since it does not exist on December 3, the number of advance delivery days k is incremented (step ST37), and it is determined whether the number of advance delivery days k exceeds the allowable number of days in advance. Hereinafter, similar processing is repeated.

In this case, as for the product G, the allowable number of days for pre-emption is “4”, and therefore the step ST is started up to four days ahead.
31 judgments are made. In this case, when the number of advance delivery days k = 4, in step ST38, the number of advance advance allowances is exceeded, so the process proceeds to step ST39, and the A flag is turned ON for the product. In this way, if there is no product belonging to the same group even after the number of days of pre-fetching is exceeded, it is set as a non-processing target on that day.

The CPU 23 then proceeds to step ST25.
Proceed to and search for the product in the maximum lot number with the A flag OFF. In this case, since the product E has three lots, attention is paid to this.

Next, the CPU 23 determines whether or not there are products of the same lot number (step ST27). In this case, since the product F having the lot number of 3 exists, selection is made based on the priority (step ST29). . In this case, since the lead time of the product E is longer than that of the product F, the product E is selected.

Next, the CPU 23 determines whether or not there is a product belonging to the same group until the kth day (step S).
T31). In this case, since there is a product F belonging to the same group on December 2, the process proceeds to step ST33 and the total is 6
Determine if it will be more than a lot. In this case, since the total is 6 lots, the process proceeds to step ST35 to make a decision. Then, for each of the three lots of the products E and F on December 2, the determination flag B is turned ON.

The CPU 23 then proceeds to step ST in FIG.
In step 11, the processing group number j is incremented. Next, it is judged whether or not the processing group number j = 3 (step ST13). In this case, the processing group number j = 2.
Therefore, the process of step ST10 is performed. As in the previous case, the number of days of advance delivery k is initialized and the product with the maximum lot number is searched. In this case, since the product D is the largest in two lots, it is determined whether or not there is a product in the same lot number (step ST27). In this case, since it does not exist, the process of step ST31 is performed. In this case, referring to FIG. 7, it can be seen that the product in the same group as the product D is the product C. Since the lot of the product C does not exist on December 2, the process proceeds to step ST37 and increments the number of days of advance k. The CPU 23 determines whether or not the number of days of advance delivery k exceeds the allowable number of days of preemption in the product D (step ST38). In this case, since the product D has the allowable number of pre-emption days of "4", which does not exceed the allowable number of pre-acquisition days, the process of step ST31 is performed.

Next, it is determined whether or not there are products belonging to the same group by the next day. In this case, on December 3, there are 5 lots of product C and 1 lot of product D.
Therefore, the process proceeds to step ST33, and it is determined whether the total is 6 lots or more. In this case, since the total is 6 lots or more, the process proceeds to step ST35 and is determined based on the priority. In this case, since the lead time of the product D is longer than that of the product C, 1 lot of the product D and 3 lots of the product C are selected (step ST3).
5). For the determined ones, the decision flag B
Is turned on.

The CPU 23 then proceeds to step ST in FIG.
In step 11, the processing group number j is incremented. Then, it is determined whether or not the processing group number j = 3. In this case, since the processing group number j = 3, the process proceeds to step ST15 to perform the replacement process.

That is, as shown in FIG. 9, the product G is advanced by 4 lots on December 3rd. In addition,
For the number of lots that have been postponed, the number of postponed days is stored. For products C and D, 1
Three lots and one lot on February 3 will be processed on December 2. For products E and F, 3 lots and 3 lots on December 2, respectively, will be introduced on December 2. As a result, as shown in FIG. 14, the product C,
A total of 12 lots of D, E, and F will be put in, 3 lots each.

FIG. 10 shows primary data of the input plan after December 3rd. 2 lots of product A and product B on December 3
3 lots, product C 2 lots, product F 2 lots, and product G 4 lots.

First, the CPU 23 increments the input number of days i (step ST17 in FIG. 4). As a result, the number of input days i becomes 2. The CPU 23 determines whether or not the number of input days i = 3, and in this case, the number of input days i = 2, the process returns from step ST19 to step ST8. CPU23
Initializes the processing group number j and turns off the A flag
(Step ST9).

Next, the CPU 23 carries out a process for determining the first batch group on the third input day (step ST1).
0). The CPU 23 initializes the number of advance days k (step ST21 in FIG. 5), and searches for the product in the maximum lot number (step ST25). In this case, on December 3, as shown in FIG. 10, since the product G is the largest in four lots, the product G is focused on. The CPU 23 determines whether or not there is the same lot number (step ST27). In this case, since there is no product with the same lot number, it is determined whether or not there are products belonging to the same group on the same day (step ST
31). In this case, since there is no product H existing in the same group, the process proceeds to step ST37 and increments the number of days of advance k. Then, it is determined whether or not the allowable number of days of pre-emption of the product G is exceeded (step ST3).
8). In this case, as shown in FIG. 7, the allowable number of days of pre-fetching of the product G is “4”, so it is determined that the number of days has not exceeded, and the process of step ST31 is performed.

The CPU 23 does not have a product belonging to the same group as the product G on the next December 4.
Further, even if the processes of step ST31, step ST37, and step ST38 are repeated up to the allowable number of pre-fetching days G of the product G, there is no such a case.
In step 39, the A flag for the product D is turned ON. Then, the process proceeds to step ST21.

The CPU 23 sets the number of days of advance delivery k to 0, and searches for the product in the maximum lot number (step ST25). In this case, it can be seen that the product B is the largest in three lots.

The CPU 23 determines whether or not there is a product of the same lot number (step ST27). In this case, since there is no such product, the process proceeds to step ST31 and whether or not there is a product belonging to the same group on December 3rd. To judge. In this case, for product B, product A exists as a product belonging to the same group. Therefore, the process proceeds to step ST33, and it is determined whether the total is 6 lots or more. In this case, since the total of product A and product B is 5 lots, the process proceeds to step ST37 and increments the number of postponement days k. Next, in step ST38, it is determined whether or not the allowable number of days for pre-fetching the product A (three days in this case) has been exceeded. In this case, since the allowable number of days for prefetching has not been exceeded, the process proceeds to step ST31 and it is determined whether or not there is a product belonging to the same group on the next day. In this case, since product A has 3 lots and product B has 2 lots, step S
The process proceeds to T33, and it is determined whether there is a total of 6 lots or more. In this case, since there are 6 lots or more in total, the process proceeds to step ST35, and the determination is performed based on the priority.

In this case, since the lead time of the product A is longer than that of the product B, the product A is selected. As a result, the determination flag B is turned on for the product A: 2 lots, the product B: 3 lots on December 3, and the product A: 1 lot on December 4th.

The CPU 23 then proceeds to step ST in FIG.
11, the processing group number j is incremented,
It is determined whether the processing group number j = 3 (step S
T13). In this case, since the processing group number j = 2, the processing of step ST10 is performed. The CPU 23 initializes the number of advance days k (step ST21 in FIG. 5) and searches for the product in the maximum lot number. In this case, there are two lots of the product C.

Next, the CPU 23 determines whether or not there is the same lot number (step ST27). In this case, since the products F of the same lot number exist, the product with high priority is selected. In this case, since product C has a longer lead time, product C is selected.

Next, the CPU 23 determines whether or not there are products belonging to the same group on the same day (step ST
31). In this case, it is determined whether or not there is an order for the product D belonging to the same group as the product C on December 3rd. In this case, since it does not exist, the number of advance delivery days k is incremented (step ST37), and it is determined whether or not the number of advance acceptance days is exceeded (step ST38). In this case, as to the product C, as shown in FIG. 7, since the allowable number of days in advance is “4”, it is determined that the allowable number of days in advance is not exceeded, and whether or not there is a product belonging to the same group by the next day. It is determined whether or not (step ST31). On December 4, there are two lots of the product D belonging to the same group, so the process proceeds to step ST33, and it is determined whether the total is six lots or more. In this case, since the total is 4 lots, the process proceeds to step ST37, increments the number of advance delivery days k, and determines whether or not the number of advance acceptance days is exceeded (step ST38).

In this case, since the pre-acceptance allowable number of days has not been exceeded, it is determined in step ST31 whether or not there is a product belonging to the same group by the next day. Since 3 lots of product C exist on December 5, step S
Proceed to T33 to determine whether the total is 6 lots or more. In this case, since the total is 7 lots, step S
Proceed to T35, 2 out of 3 lots of product C on December 5th
It is decided that the lot will be input on December 3rd.

The CPU 23 proceeds to step ST11 in FIG. 4 and increments the processing group number j. As a result, the processing group number j = 3. The CPU 23 determines whether or not the processing group number j = 3. In this case, the processing group number j = 3 (step S
In T13) and step ST15, the replacement process is performed. As a result, as shown in FIG. 10, two lots of the product F and four lots of the product G are postponed on December 4th.

Next, the CPU 23 increments the number of charging days i (step ST17), and determines whether the number of charging days i = 3. In this case, since the number of input days i = 3, the processing of FIG. 4 is terminated. As a result, as shown in FIG. 14, manufacturing plan data for November 1, 2 and 3 are created. In this way, in the initial state, the manufacturing plan data for the current day, the second day, and the third day are collectively generated.

In this embodiment, the manufacturing plan data for 3 days from the current day is created at first, but 1
Try to generate the minute for December 4th on February 2nd. The processing in this case will be described.

The processing in steps ST1, ST2 and ST3 in FIG. 3 is the same. In the process of step ST4, since the data of the next day and the data of the day after the next day exist in step ST5 of FIG. 4, the process of FIG. 12 is performed.

First, the processing group number j is initialized (step ST41), and then it is determined whether or not the number of shift allowable days after input is exceeded (step ST43). This is performed by determining whether or not the product that has been subjected to the advance processing by the replacement processing (step ST15) in FIG. 4 has exceeded the allowable number of days. FIG.
In the product shown in (4), product G has 4 lots. This is one lot on December 1st, and three lots on December 2nd, which are later shifted. Since the allowable shift days after the product G is “3”, there are lots that exceed the allowable shift delay days. Therefore, the CPU 23 determines that there is a product that has exceeded the allowable number of days among the products that have been subjected to the advance processing (NG), and performs exception processing (step ST45 in FIG. 12).

The exception process will be described with reference to FIG. The CPU 23 initializes the carry-over days ky (step ST51 in FIG. 13). Next, the target of exception processing is specified (step ST53). In this case, the product G is specified.

Then, the number of carry-over days ky is incremented (step ST55), and the number of carry-over days ky is added to the pre-take data allowance days kx of the exception processing target (step ST).
57). Next, it is determined whether or not there are products existing in the same group by the kth day (step ST59). In this case, since there is no product H belonging to the same group on December 4, the process proceeds to step ST55, the carry-over days ky is incremented, and the carry-over days ky are added to the preemption allowable days for the product G which is the exception processing target. In this case, the allowable number of days in advance is “6”.

Next, the CPU 23 determines whether or not there is a product belonging to the same group by the kth day. In this case, since it does not exist, the processes in and after step ST55 are repeated. When this process is repeated until December 10, there are one lot of product G and one lot of product H on December 10. Therefore, since there is a product belonging to the same group in step ST59, the process proceeds to step ST61. In this case, since the total is 6 lots or more, the carry-over days ky are displayed (step ST63). By displaying the carry-over days ky, it is possible to determine whether the production plan data can be created so that one batch processing can be performed for the product G that has been shifted after the input after the number of days before the input pre-take allowance is exceeded. The operator can judge. Here, the operator sees such a display and determines whether or not to admit this.

The CPU 23 determines whether or not the OK command is given (step ST65). When the OK command is given, the amount obtained by adding the carry-forward days ky to the allowable number of pre-taking days is set as one group. It is decided to manufacture (step ST67). As a result, as shown in FIG. 11, the product G1 lot and the product H1 lot for December 10 are manufactured on December 4.

Next, the CPU 23 determines whether or not the exception target processing remains (step ST70). In this case, since there are no remaining items, the exception processing ends.

If no OK command is given in step ST65, one group is determined using a dummy wafer. As a result, even if one lot of products belonging to a specific group are not available for a certain range, a manufacturing plan for that lot can be created.

Next, the CPU 23 proceeds to step ST46 shown in FIG. 12 and increments the processing group number j. Then, it is determined whether or not the processing group number j = 3 (step ST47). In this case, since the processing group number j = 2, the process proceeds to step ST43, and it is determined whether or not there is an NG product.

In this case, since it does not exist, step ST4
9, the number of input days i = 2 is set, and the process of step ST9 in FIG. 4 is performed. More specifically, first, the A flag is OF.
F is set, and the second batch group is determined on the input day of the second day (step ST10). Specifically, as shown in FIG. 5, the number k of advance days is initialized (step ST2).
1) Search for the product with the maximum lot number. 12 in this case
Since product F has 5 lots on the 4th of each month, product F is searched. Next, the CPU 23 determines whether or not there is the same lot number (step ST27). In this case, since there is no product with the same lot number, it is determined whether or not the products belong to the same group on the same day (step ST31). In this case, since one lot of the product E existing in the same group exists, it is determined whether the total is 6 lots or more (step ST33). In this case, the total is 6
Since it is a lot, the process proceeds to step ST35 to make a decision. In this way, the production plan data for 3 days is initially created, and thereafter the production plan data is created for each day. In order to create a manufacturing plan by such a procedure, orders for each product come in every day and the primary data of the input plan is changed. Therefore, by performing the processing of FIG. Because you can.

In this way, as shown in FIG.
As the production plan data on the 4th of a month, 1 lot of product E, 5 lots of product F, 5 lots of product G, and 1 lot of product H will be input.

As described above, when there is already a production plan for the next day or the day after the next day, it is possible to confirm the production plan in which the delivery date is strictly adhered to by checking whether or not there is a production schedule that exceeds the allowable number of days after shifting. Can be created.

As described above, the primary data of the input plan determined on the basis of the delivery date and the standard processing days are rearranged according to the rule grouped on the basis of the batch processing and the single-wafer processing classification, so that a more efficient semiconductor device can be obtained. Can be produced.

4. Others In the present embodiment, a batch parameter and a single wafer parameter are the same as the group parameter,
I try to judge them as one group. This eliminates the need for setup replacement in single-wafer processing.

Further, when the batch processing is the same and the single-wafer processing classifications are different, the same group may be determined. In this case, setup change may occur in the single-wafer processing, but at least the waiting state in the batch processing or the manufacturing using dummy wafers is not necessary.

In the present embodiment, for exception processing, the allowable number of days for prefetching is increased to search within a possible range. However, the present invention is not limited to this, and the operator may manually make the decision based on the primary data of the charging plan. In addition, in the present embodiment, the CPU 23 is used to realize each of the functions described above.
This is achieved by software. However, some or all of them may be realized by hardware such as a logic circuit.

[Brief description of drawings]

FIG. 1 is a functional block diagram of a manufacturing plan creation device 1 according to the present invention.

FIG. 2 is a diagram showing a hardware configuration in which the manufacturing plan creation device 1 shown in FIG. 1 is realized by a CPU.

FIG. 3 shows an overall flowchart.

FIG. 4 is a flowchart showing details of step ST4 in FIG.

FIG. 5 is a flowchart showing details of step ST10 in FIG.

FIG. 6 is a diagram showing an example of primary data of an input plan.

FIG. 7 is basic data showing a group parameter of a product, an allowable shift amount, and the like.

FIG. 8 is a diagram for explaining the operation of the input plan primary data shown in FIG. 6;

FIG. 9: December 1 of the primary data of the input plan shown in FIG.
It is a figure which shows the input plan primary data except the day (the determined part).

FIG. 10 is a diagram showing primary input plan data excluding December 2 (determined amount) from the primary input plan data shown in FIG. 9;

FIG. 11: 12 out of the primary data of the input plan shown in FIG.
It is a figure which shows the input plan primary data excluding the 3rd of a month (determined part).

FIG. 12 is a diagram showing a flowchart in the case where manufacturing plan data for two days ahead has already been created in FIG. 4;

FIG. 13 is a detailed flowchart of step ST45 of FIG.

FIG. 14 is a diagram showing finally determined manufacturing planning data.

FIG. 15 is a diagram showing an order of a conventional product and standard processing days.

FIG. 16 is a diagram showing a necessary input date for a conventional product.

[Explanation of symbols]

 3 ... storage means 5 ... manufacturing plan changing means

Claims (7)

[Claims] 1. An apparatus for creating manufacturing plan data for manufacturing a plurality of types of semiconductor devices manufactured by combining batch processing for collectively processing a predetermined number of substrates and single-wafer processing for sequentially processing one substrate. A) For each of the semiconductor devices, the following a1), a
Storage means for storing 2), a1) group name determined by whether or not the batch processing is performed under the same conditions in the manufacturing process, a2) shift tolerance including the allowable number of days for pre-emption, and B) planned shipping date Further, when the manufacturing plan data in which the time to start the manufacturing of the specific type of semiconductor device is determined based on the standard processing days and a plurality of days are given, the semiconductor devices belonging to the same group name within the shift tolerance are given. However, it is determined whether or not there is a predetermined number in the batch processing, and if there is, a manufacturing plan changing means for changing the manufacturing plan so that the semiconductor devices belonging to the same group are manufactured on the same day, An apparatus for preparing a semiconductor device manufacturing plan, comprising: 2. The semiconductor device manufacturing plan creating apparatus according to claim 1, wherein the same group name is added to each of the semiconductor devices when a single-wafer process other than the masking process is performed under the same condition in the manufacturing process. The semiconductor device manufacturing plan creation device characterized by the following. 3. The semiconductor device manufacturing plan creating apparatus according to claim 1, wherein the allowable number of days for shifting includes the allowable number of days for shifting after input, and the manufacturing plan changing means is configured to allow the amount of shift after input for the manufacturing plan after change. If there are semiconductor devices that exceed the number of days,
A semiconductor device manufacturing plan creation device characterized by notifying this. 4. A method for creating manufacturing plan data for manufacturing a plurality of types of semiconductor devices manufactured by combining batch processing for collectively processing a predetermined number of substrates and single-wafer processing for sequentially processing one substrate. A) For each of the semiconductor devices, the following a1), a
2) is memorized and a1) a group name determined by whether or not the batch processing is performed under the same conditions in the manufacturing process, a2) a tolerance for the shift including the allowable number of days of pre-emption, and B) a planned shipping date. Further, when the manufacturing plan data in which the time to start the manufacturing of the specific type of semiconductor device is determined based on the standard processing days and a plurality of days are given, the semiconductor devices belonging to the same group name within the shift tolerance are given. Determines whether there is a predetermined number of sheets in the batch processing, and C) if there is, changes the manufacturing plan so that the semiconductor devices belonging to the same group are started to be manufactured on the same day. Semiconductor device manufacturing plan creation method. 5. The semiconductor device manufacturing plan creation method according to claim 4, wherein the same group name is added to each of the semiconductor devices when a single-wafer process other than the masking process is performed under the same conditions in the manufacturing process. A method for preparing a semiconductor device manufacturing plan, characterized by: 6. The method for preparing a semiconductor device manufacturing plan according to claim 4, wherein the allowable number of days for shifting includes the allowable number of days for shifting after input, and a semiconductor device that exceeds the allowable number of days for shifting after input in the changed manufacturing plan. A semiconductor device manufacturing plan creation method characterized by, if any, notifying this. 7. A computer-readable storage medium storing a computer-executable program, wherein the program realizes the apparatus or method according to any one of claims 1 to 6. Storage medium.