JPH0920587A - Molecular beam source - Google Patents

Molecular beam source

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Publication number
JPH0920587A
JPH0920587A JP16741395A JP16741395A JPH0920587A JP H0920587 A JPH0920587 A JP H0920587A JP 16741395 A JP16741395 A JP 16741395A JP 16741395 A JP16741395 A JP 16741395A JP H0920587 A JPH0920587 A JP H0920587A
Authority
JP
Japan
Prior art keywords
source material
molecular beam
crucible
source
evaporation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP16741395A
Other languages
Japanese (ja)
Inventor
Kazuo Nanbu
和夫 南部
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP16741395A priority Critical patent/JPH0920587A/en
Publication of JPH0920587A publication Critical patent/JPH0920587A/en
Withdrawn legal-status Critical Current

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  • Crystals, And After-Treatments Of Crystals (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)

Abstract

(57)【要約】 【目的】 分子線源に関し、分子線強度を安定化するこ
とを目的とする。 【構成】 ソース材を収納するルツボと、該ソース材を
覆うようにルツボ内に挿入された遮蔽板とを備え、ソー
ス材から発生させた分子線を遮蔽板を介して外部へ射出
するようにした分子線源であって、該遮蔽板はソース材
が変形したときそれに応じてルツボ内で移動可能となる
ように構成する。
(57) [Abstract] [Purpose] The purpose of the molecular beam source is to stabilize the molecular beam intensity. [Composition] A crucible for accommodating a source material and a shielding plate inserted into the crucible so as to cover the source material are provided, and a molecular beam generated from the source material is emitted to the outside through the shielding plate. In this case, the shielding plate is configured to be movable in the crucible when the source material is deformed.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は分子線結晶成長装置に用
いられる分子線源に関する。分子線結晶成長装置(以
下、MBE装置と称する)は半導体薄膜結晶の組成比や
膜厚の制御を正確かつ容易に行うことができるため広く
用いられているが、近年における薄膜結晶の高品質化の
要求を満足させるためには、より一層の制御性の改善が
必要である。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a molecular beam source used in a molecular beam crystal growth apparatus. A molecular beam crystal growth apparatus (hereinafter referred to as an MBE apparatus) is widely used because it can accurately and easily control the composition ratio and film thickness of a semiconductor thin film crystal. In order to satisfy the above requirement, it is necessary to further improve the controllability.

【0002】[0002]

【従来の技術】図4はMBE装置の要部断面図を示した
ものである。真空容器6内に半導体基板7と分子線源8
を互いに対向する位置に配置し、分子線源8から射出さ
れた分子線を半導体基板7に照射して薄膜結晶を成長さ
せるものである。分子線源8は薄膜結晶を構成する元素
の種類に応じて複数個設けてあり、各分子線源から射出
される分子線強度を調整することにより薄膜結晶の膜厚
や構成元素の組成比等を制御するようにしている。例え
ば、GaAlAs結晶を成長させる場合には、GaとAlとAsから
なるソース材をそれぞれ収納した3つの分子線源を用い
る。
2. Description of the Related Art FIG. 4 is a sectional view showing the main part of an MBE device. The semiconductor substrate 7 and the molecular beam source 8 are placed in the vacuum container 6.
Are arranged so as to face each other, and the semiconductor substrate 7 is irradiated with the molecular beam emitted from the molecular beam source 8 to grow a thin film crystal. A plurality of molecular beam sources 8 are provided in accordance with the types of elements that make up the thin film crystal. By adjusting the intensity of the molecular beam emitted from each molecular beam source, the film thickness of the thin film crystal, the composition ratio of the constituent elements, etc. Are trying to control. For example, in the case of growing a GaAlAs crystal, three molecular beam sources each containing a source material composed of Ga, Al and As are used.

【0003】図5は従来の分子線源の要部断面図であ
り、ソース材としてAsを用いた場合を示している。同図
において、1はルツボ、2はルツボ1の外側に配置され
たヒータ、3はAsソース材である。Asは昇華性物質であ
り常温では固体となっているためルツボ1の内部形状に
合わせて成形したものをソース材として用い、これをル
ツボ1内に収納する。
FIG. 5 is a cross-sectional view of a main part of a conventional molecular beam source, showing a case where As is used as a source material. In the figure, 1 is a crucible, 2 is a heater arranged outside the crucible 1, and 3 is an As source material. Since As is a sublimable substance and is solid at room temperature, it is stored in the crucible 1 as a source material formed according to the internal shape of the crucible 1.

【0004】以上のような構成の分子線源をMBE装置
にセットしヒータ2によりルツボ1を加熱すると、Asソ
ース材3は固体状態で蒸発し分子線となって外部に射出
される。ルツボ1の温度を調整してAsソース材3の蒸発
量を制御し、これにより分子線強度を制御するようにし
ている。
When the molecular beam source having the above-mentioned structure is set in the MBE apparatus and the crucible 1 is heated by the heater 2, the As source material 3 is vaporized in a solid state to be a molecular beam and injected to the outside. The temperature of the crucible 1 is adjusted to control the evaporation amount of the As source material 3, and thereby the molecular beam intensity is controlled.

【0005】[0005]

【発明が解決しようとする課題】図5において、(a) は
Asソース材3の蒸発前の状態、(b) 、(c) は蒸発が進ん
だときの状態を時間を追って模式的に示したものであ
り、Asソース材3は蒸発が進むとともに縮小変形してい
くことがわかる。Asソース材3が同図に見られるような
形状変化する原因は以下のように考えられる。
In FIG. 5, (a) is
The state before evaporation of the As source material 3, (b) and (c) schematically show the state when evaporation proceeds, and the As source material 3 shrinks and deforms as the evaporation progresses. I understand that it will go. The cause of the shape change of the As source material 3 as shown in the figure is considered as follows.

【0006】前述したようにAsは昇華性を有しているた
め固体状態のままで表面から蒸発が進む。蒸発量はAsソ
ース材3の表面積に比例するが表面温度にも依存してい
る。一方、Asソース材3はルツボ1に収納されたときの
配置状態、例えば、ルツボ1の内壁への接触の程度やAs
ソース材3の各部分のルツボ内壁からの距離等に依存し
てその表面温度は均一ではない。そのため、温度の高く
なった部分で局所的に蒸発が進んでこの部分のAsの消費
量が増加しAsソース材3の形状が変化する。蒸発が進行
するとともに上述のような過程が進行して図5(b) 、
(c) に見られるようなAsソース材3の形状変化が生じる
ものと考えられる。
As described above, As has a sublimation property, so that evaporation proceeds from the surface in a solid state. The evaporation amount is proportional to the surface area of the As source material 3, but also depends on the surface temperature. On the other hand, the As source material 3 is arranged in the crucible 1 when it is housed in the crucible 1.
The surface temperature of the source material 3 is not uniform depending on the distance from the inner wall of the crucible and the like. Therefore, evaporation locally progresses in the portion where the temperature rises, the consumption amount of As in this portion increases, and the shape of the As source material 3 changes. As the evaporation progresses, the process described above progresses, as shown in FIG.
It is considered that the shape change of the As source material 3 as shown in (c) occurs.

【0007】図6はAs分子線強度の時間依存性を示した
ものであり、縦軸にAs分子線強度、横軸にはAs分子線源
の使用を開始した後の時間経過を週単位で示している。
As分子線強度は不規則な変化を示しており、また、Asソ
ース材3の蒸発が進行したとき図5(b) 、(c) に見られ
るようにその表面積が縮小したように見えるにもかかわ
らず分子線強度は緩やかに増加している。これは、Asの
蒸発がAsソース材3の表面のみならずその内部からも起
こり、その結果、Asソース材3の表面近くが多孔性構造
に変わって見かけ上の表面積の減少とは逆に実効的な表
面積が増加することによるものと思われる。また、表面
近くの多孔性構造を有する部分は脆くなっているため僅
かの衝撃でその形状が崩れて表面積が突発的に変化する
こともあり、これが図6に見られる分子線強度の不規則
な変化をもたらす原因になっていると考えられる。
FIG. 6 shows the time dependence of As molecular beam intensity, where the vertical axis represents the As molecular beam intensity and the horizontal axis represents the time lapse after the start of use of the As molecular beam source in week units. Shows.
The As molecular beam intensity shows irregular changes, and when the evaporation of As source material 3 proceeds, it seems that the surface area of the As source material 3 has decreased, as shown in Figs. 5 (b) and 5 (c). Nevertheless, the molecular beam intensity increases moderately. This is because the evaporation of As occurs not only from the surface of the As source material 3 but also from inside the As source material 3, and as a result, the vicinity of the surface of the As source material 3 changes to a porous structure, which is contrary to the apparent reduction in surface area. This is probably due to the increase in the specific surface area. Further, since the portion having the porous structure near the surface is brittle, the shape may collapse and the surface area may suddenly change due to a slight impact. This is due to the irregular molecular beam intensity shown in FIG. It is thought to be the cause of change.

【0008】以上のように、従来の分子線源では昇華性
物質をソース材として用いた場合分子線強度が一定せ
ず、これに伴って半導体基板上に堆積されるAs量も不安
定となって薄膜結晶の膜厚や組成比が正確に制御できな
いという問題が生じる。
As described above, in the conventional molecular beam source, when the sublimable substance is used as the source material, the intensity of the molecular beam is not constant, and as a result, the amount of As deposited on the semiconductor substrate becomes unstable. As a result, there arises a problem that the film thickness and composition ratio of the thin film crystal cannot be controlled accurately.

【0009】そこで本発明では、分子線強度を安定化す
ることを目的とする。
Therefore, the present invention aims to stabilize the molecular beam intensity.

【0010】[0010]

【課題を解決するための手段】上記課題の解決は、ソー
ス材を収納するルツボと、該ソース材を覆うようにルツ
ボ内に挿入された遮蔽板とを備え、ソース材から発生さ
せた分子線を遮蔽板を介して外部へ射出するようにした
分子線源であって、該遮蔽板はソース材が変形したとき
それに応じてルツボ内で移動可能となっていることを特
徴とする分子線源、あるいは、上記分子線源において、
該遮蔽板は少なくとも一つの穴を有し、ルツボ内におい
て自重によりソース材の上面に接していることを特徴と
する分子線源によって達成される。
Means for Solving the Problems To solve the above problems, a molecular beam generated from a source material is provided, which comprises a crucible for accommodating a source material and a shielding plate inserted into the crucible so as to cover the source material. Is a molecular beam source adapted to be emitted to the outside through a shield plate, wherein the shield plate is movable in the crucible according to the deformation of the source material. , Or in the above molecular beam source,
The shielding plate has at least one hole and is brought into contact with the upper surface of the source material by its own weight in the crucible.

【0011】[0011]

【作用】遮蔽板はソース材に接した状態で移動可能とな
るように構成されているのでソース材が蒸発により縮小
変形した場合、それに応じて遮蔽板は下方に移動し常に
ソース材に接した状態でルツボ内にソース材を閉じ込め
ることになる。遮蔽板をソース材に接した状態で移動可
能とするためには、例えば、遮蔽板の径をルツボの内径
より小さな値に設定し、遮蔽板を自重でソース材の上に
乗せるようにすればよい。このような構成とすれば、遮
蔽板が熱伝導板の役割を果たすこととなりソース材表面
の温度がより均一になる。さらに、遮蔽板はソース材に
対して常に上から圧力を加えることによりソース材が変
形することを防いでおり、これによりソース材の蒸発が
進んだときのソース材の表面積の不規則な変化が抑えら
れることになる。蒸発したソース材は遮蔽板とルツボと
の間のすき間、あるいは、遮蔽板に設けられた孔から射
出される。以上のように、従来に比べてソース材の蒸発
量の不規則な変動が抑えられ、外部に射出される分子線
強度が安定することとなる。
[Function] Since the shielding plate is configured to be movable while being in contact with the source material, when the source material is reduced and deformed by evaporation, the shielding plate moves downward accordingly and is always in contact with the source material. As a result, the source material is confined in the crucible. In order to make the shield plate movable in contact with the source material, for example, if the diameter of the shield plate is set to a value smaller than the inner diameter of the crucible and the shield plate is placed on the source material by its own weight. Good. With such a configuration, the shielding plate functions as a heat conduction plate, and the temperature of the surface of the source material becomes more uniform. Furthermore, the shielding plate prevents the source material from being deformed by constantly applying pressure to the source material from above, which prevents irregular changes in the surface area of the source material when evaporation of the source material progresses. It will be suppressed. The vaporized source material is injected through a gap between the shield plate and the crucible or a hole provided in the shield plate. As described above, the irregular fluctuation of the evaporation amount of the source material is suppressed as compared with the conventional case, and the strength of the molecular beam emitted to the outside is stabilized.

【0012】[0012]

【実施例】図1は本発明の実施例を示す分子線源の要部
断面図であり、ソース材としてAsソースを用いている。
図1(a) はAsソース蒸発前の分子線源の状態を示してい
る。同図において、ルツボ1は内径80mm、長さ140 mmの
円筒形状をしておりBNからなる。BN以外にC、あるいは
AlN 等の耐熱性に優れた材料を用いてもよい。Asソース
材3はルツボ1の内部形状に合わせて円筒状に成形され
ルツボ1に収納される。Asソース材3の容積は600cc で
ある。遮蔽板4は直径760 mm、厚さ15mmの円板状をして
おり重量800 gのタンタル(Ta)で作製される。図2は
遮蔽板の平面図を示したものである。ルツボ1内部で蒸
発したAsを射出するために幅2mmの孔5を同心円状に多
数設けてある。孔の形状や位置、その個数はこの例に限
られない。
EXAMPLE FIG. 1 is a cross-sectional view of an essential part of a molecular beam source showing an example of the present invention, which uses an As source as a source material.
Figure 1 (a) shows the state of the molecular beam source before evaporation of the As source. In the figure, the crucible 1 has a cylindrical shape with an inner diameter of 80 mm and a length of 140 mm and is made of BN. C in addition to BN, or
A material having excellent heat resistance such as AlN may be used. The As source material 3 is formed into a cylindrical shape according to the internal shape of the crucible 1 and is housed in the crucible 1. The volume of As source material 3 is 600cc. The shield plate 4 has a disk shape with a diameter of 760 mm and a thickness of 15 mm and is made of tantalum (Ta) having a weight of 800 g. FIG. 2 is a plan view of the shield plate. A large number of holes 5 having a width of 2 mm are concentrically provided in order to eject As vaporized in the crucible 1. The shape and position of the holes and the number thereof are not limited to this example.

【0013】図1(a) に見られるように遮蔽板4はAsソ
ース材3の上に乗せられている。遮蔽板3の直径はルツ
ボ1の内径より僅かに小さくしてあり、そのため遮蔽板
3は落としブタの作用を有することとなり、Asソース材
3の上面に自重で接しAsソース材3をルツボ1内に閉じ
込めるとともにAsソース材3に対して常に上から圧力を
加えることになる。この状態でヒータ2によりルツボ1
を加熱するとAsソース材3の温度が上昇し固体状態で蒸
発して遮蔽板4に設けた孔5を通して外部へ射出され
る。蒸発によりAsの消費量が増加するにつれてAsソース
材3は図1(b) 、(c) に示したように次第に縮小してい
くが、図5(b) 、(c) と比較して明らかなように形状の
不規則な変化は抑えられている。これは、Asソース材3
が常に遮蔽板4と接した状態でルツボ1内に閉じ込めて
られているため、ルツボ1内壁の熱が遮蔽板4を介して
直接Asソース材3に伝達されその表面温度がより均一化
され、その結果、Asソース材3表面における局所的な蒸
発量の変化が抑えられること、さらに、Asソース材3の
上面には遮蔽板4が常に自重により圧力を加えているた
め、蒸発によって脆くなったAsソース材3の表面形状が
押しつぶされるような形で整形されて不規則な形状変化
が抑えられることによる。
As shown in FIG. 1A, the shielding plate 4 is placed on the As source material 3. Since the diameter of the shielding plate 3 is slightly smaller than the inner diameter of the crucible 1, the shielding plate 3 has a function of a dropping pig, and the As source material 3 is brought into contact with the upper surface of the As source material 3 by its own weight so that the As source material 3 is inside the crucible 1. The As source material 3 is always confined and pressure is applied from above. In this state, the crucible 1 by the heater 2
When heated, the temperature of the As source material 3 rises and evaporates in the solid state and is injected to the outside through the holes 5 provided in the shielding plate 4. As source material 3 gradually shrinks as the consumption of As increases due to evaporation, as shown in Figs. 1 (b) and (c), it is clear from comparison with Figs. 5 (b) and (c). Thus, irregular changes in shape are suppressed. This is As source material 3
Is confined in the crucible 1 while being always in contact with the shield plate 4, the heat of the inner wall of the crucible 1 is directly transferred to the As source material 3 through the shield plate 4, and the surface temperature is made more uniform. As a result, the local change in the amount of evaporation on the surface of the As source material 3 is suppressed, and further, since the shielding plate 4 constantly applies pressure to the upper surface of the As source material 3 by its own weight, it becomes brittle due to evaporation. This is because the surface shape of the As source material 3 is shaped so as to be crushed and irregular shape changes are suppressed.

【0014】図3は上記分子線源を用いたときのAs分子
線強度の時間依存性を示したものである。横軸は図6と
同様に分子線源の使用開始からの時間を週単位で示して
いる。As分子線強度の変化量はほぼ1%の範囲に納まっ
ており、図6に見られるような不規則な変化や漸増現象
は見られない。これは、前述のように遮蔽板4によって
Asソース材3の表面温度が均一となり、かつ形状変化が
抑えられてその表面積が一定したことによる。
FIG. 3 shows the time dependence of the As molecular beam intensity when the above molecular beam source is used. The horizontal axis indicates the time from the start of use of the molecular beam source in units of weeks, as in FIG. The amount of change in As molecular beam intensity is within the range of about 1%, and neither the irregular change nor the gradual increase phenomenon as shown in FIG. 6 is seen. This is due to the shielding plate 4 as described above.
This is because the surface temperature of the As source material 3 is uniform, the change in shape is suppressed, and the surface area is constant.

【0015】上記実施例では遮蔽板に孔を設けている
が、遮蔽板とルツボの間のすき間から充分なソース蒸発
量が得られるならば穴を設けなくともよい。また、上記
実施例において遮蔽板をTaで作製したが、これに限らず
MoやW等の耐熱性に優れた高融点金属を用いることがで
きる。遮蔽板の重量についてもソース材の容量や重量、
ルツボの内容積等に応じて異なった値を用いることがで
きる。ソース材に対して加える圧力をより大きくする上
で遮蔽板の自重のみでは足りない場合には遮蔽板の上に
重りを乗せるようにしてもよい。また、上記実施例では
ソース材としてAsを用いた場合について述べたが、As以
外の昇華性物質、例えば、Cr等をソース材として用いた
場合にも同様な構造の遮蔽板を用いることによって分子
線強度を安定させることができる。
In the above embodiment, the shield plate is provided with holes, but the hole may not be provided if a sufficient amount of source evaporation can be obtained from the gap between the shield plate and the crucible. Further, although the shielding plate is made of Ta in the above embodiment, the present invention is not limited to this.
A refractory metal having excellent heat resistance such as Mo or W can be used. Regarding the weight of the shielding plate, the volume and weight of the source material,
Different values can be used depending on the inner volume of the crucible and the like. When the pressure applied to the source material is further increased and the weight of the shielding plate is not sufficient, a weight may be placed on the shielding plate. Further, in the above-mentioned examples, the case where As is used as the source material is described, but when a sublimable substance other than As, for example, Cr or the like is used as the source material, by using a shielding plate having a similar structure, The line strength can be stabilized.

【0016】[0016]

【発明の効果】以上述べたように、本発明によればソー
ス材の温度分布や形状の不規則な変化を抑えることがで
きるので安定した分子線強度を得ることができ、半導体
薄膜結晶の品質の向上を図る上で有益である。
As described above, according to the present invention, it is possible to suppress irregular changes in the temperature distribution and shape of the source material, so that a stable molecular beam intensity can be obtained and the quality of the semiconductor thin film crystal can be improved. It is useful for improving

【図面の簡単な説明】[Brief description of drawings]

【図1】 本発明の実施例に係る分子線源の要部断面図
であり、(a) はAsソース蒸発前の状態を示す図、(b) 、
(c) はAsソースの蒸発が進んだ状態を示す図
FIG. 1 is a cross-sectional view of a main part of a molecular beam source according to an embodiment of the present invention, in which (a) is a view showing a state before As source evaporation, (b),
(c) is a diagram showing the state of evaporation of As source

【図2】 遮蔽板の平面図FIG. 2 is a plan view of the shield plate.

【図3】 本実施例におけるAs分子線強度の時間依存性
を示す図
FIG. 3 is a diagram showing the time dependence of As molecular beam intensity in this example.

【図4】 MBE装置の要部断面図FIG. 4 is a sectional view of an essential part of the MBE device.

【図5】 従来例における分子線源の要部断面図であ
り、(a) はAsソース蒸発前の状態を示す図、(b) 、(c)
はAsソースの蒸発が進んだ状態を示す図
FIG. 5 is a cross-sectional view of a main part of a molecular beam source in a conventional example, (a) is a diagram showing a state before As source evaporation, (b), (c)
Is a diagram showing the state of evaporation of As source

【図6】 従来例におけるAs分子線強度の時間依存性を
示す図
FIG. 6 is a diagram showing the time dependence of As molecular beam intensity in a conventional example.

【符号の説明】[Explanation of symbols]

1 ルツボ 3 Asソース材 2 ヒータ 4 遮蔽板 5 孔 7 半導体基板 6 真空容器 8 分子線源 1 Crucible 3 As Source Material 2 Heater 4 Shielding Plate 5 Hole 7 Semiconductor Substrate 6 Vacuum Container 8 Molecular Beam Source

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 ソース材を収納するルツボと、該ソース
材を覆うようにルツボ内に挿入された遮蔽板とを備え、
ソース材から発生させた分子線を遮蔽板を介して外部へ
射出するようにした分子線源であって、 該遮蔽板はソース材が変形したときそれに応じてルツボ
内で移動可能となっていることを特徴とする分子線源。
1. A crucible for containing a source material, and a shield plate inserted into the crucible so as to cover the source material,
A molecular beam source configured to emit a molecular beam generated from a source material to the outside through a shield plate, the shield plate being movable in the crucible according to the deformation of the source material. A molecular beam source characterized in that
【請求項2】 該遮蔽板は少なくとも一つの穴を有し、
ルツボ内において自重によりソース材の上面に接してい
ることを特徴とする請求項1記載の分子線源。
2. The shield plate has at least one hole,
The molecular beam source according to claim 1, wherein the molecular beam source is in contact with the upper surface of the source material by its own weight in the crucible.
JP16741395A 1995-07-03 1995-07-03 Molecular beam source Withdrawn JPH0920587A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16741395A JPH0920587A (en) 1995-07-03 1995-07-03 Molecular beam source

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16741395A JPH0920587A (en) 1995-07-03 1995-07-03 Molecular beam source

Publications (1)

Publication Number Publication Date
JPH0920587A true JPH0920587A (en) 1997-01-21

Family

ID=15849243

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16741395A Withdrawn JPH0920587A (en) 1995-07-03 1995-07-03 Molecular beam source

Country Status (1)

Country Link
JP (1) JPH0920587A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6478876B1 (en) * 1999-05-26 2002-11-12 Masaji Asamoto Apparatus for coating a body by using ion plating
KR100951493B1 (en) * 2001-06-26 2010-04-07 쵸슈 산교 가부시키가이샤 A morecular beam epitaxy effusion cell for use in vacuum thin film deposition and a method therefor

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6478876B1 (en) * 1999-05-26 2002-11-12 Masaji Asamoto Apparatus for coating a body by using ion plating
KR100951493B1 (en) * 2001-06-26 2010-04-07 쵸슈 산교 가부시키가이샤 A morecular beam epitaxy effusion cell for use in vacuum thin film deposition and a method therefor

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