JPH09207305A - Offset printing apparatus and image forming apparatus - Google Patents

Abstract

(57) 【Abstract】 PROBLEM TO BE SOLVED: In the printing process of one work, the takt time is long because there is one free run on both the intaglio and the work. An offset printing apparatus has a structure in which a first work surface plate 1, a plate surface plate 2, and a second work surface plate 3 are arranged in series in this order in the rotational movement direction of a blanket 11.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an offset printing machine and a method for forming a functional element pattern of an electronic device by offset printing, and further, an image forming apparatus manufactured by using this offset printing, mainly a flat type display. Regarding the device. The present invention also relates to a surface conduction electron-emitting device used in the image forming apparatus, an electron source using the electron emitting device, an image forming apparatus using the electron source, and a method for manufacturing the electron emitting device.

[0002]

2. Description of the Related Art Conventionally, offset printing has been widely used for printing graphics, mainly for printing patterns that are perceptible to human eyes. Further, in recent years, technological developments have been made for producing electrodes of recording thermal heads, color filters of liquid crystal display devices, and the like as applications to electronic devices.

FIG. 7 is a plan view showing a conventional flatbed proofing machine type offset printing apparatus. As shown in this figure, the conventional offset printing apparatus has a flat body frame 10
8 is provided. On the main body frame 108, an ink mixing table 101 on which ink 107 is spread by an ink roller 104, a plate surface plate 102 for fixing an intaglio plate 105, and a work plate for fixing a work 106 such as a glass substrate to be printed. The board 103 is fixedly arranged in a line in this order. Two rack gears 109 and 110 are arranged opposite to each other on both sides of the three surface plates arranged in a line.
On the rack gears 109 and 110, there are gears 111 and 11 having a blanket 113 of a cylindrical shape therebetween.
2 is engaged. The shafts at both ends of the blanket 113 are fixed by carriages 114 and 115, respectively. The carriages 114 and 115 are the main body frame 1
By moving forward and backward by the crank operation of the crank arm 116 from the lower part of 08, the blanket 113 sequentially rotationally slides on the ink kneading base 101, the intaglio plate 105, and the work 106. In addition, a rubber blanket rubber is attached to the surface of the blanket 113.

FIG. 8 is a diagram for explaining a printing process by the offset printing apparatus shown in FIG. In this figure, an ink mixing table 101, a plate surface plate 102, and a work surface plate 103 are arranged in a line from the left side in the drawing.
The ink roller 104, the blade 117, and the blanket 113 are arranged in a line from the left side in the drawing, and move integrally when printing with the blanket 113.
Further, the blade 117 is attached with its tip inclined to the right side in the drawing from the root.

Using such an apparatus, first, the ink roller 1 carrying the ink 107 on the ink mixing table 101 is carried out.
With 04, the ink 107 is transferred onto the intaglio plate 105 (see FIG. 8A). And the blade 117 is the intaglio 1
05 Ink 1 slid on the upper surface and transferred to the intaglio plate 105
Of the 07, the ink other than the ink filled in the recesses is scraped off (see FIG. 8B). Subsequently, the blanket 113 is contact-rotated on the intaglio plate 105, and receives the ink filled in the recesses of the intaglio plate 105 (see FIG. 8C). Finally, the blanket 113 is moved onto the work 106 and rotated in contact with the work, and as a result, the ink of the pattern of the intaglio 105 is transferred onto the glass substrate 106 (FIG. 8).
(D)). The printing process is completed as described above.

In addition to the offset printing apparatus shown in FIG. 7, printing can be performed by an apparatus that does not use an ink mixing stand. FIG. 9 is a diagram for explaining a printing process by an apparatus that does not use an ink mixing table. In this figure, the same members as those shown in FIG. 8 are designated by the same reference numerals. Further, in the apparatus of the conventional example, instead of the ink mixing stand and the ink roller, the blade 117 spreads the ink 1 on the intaglio 105.
Dispenser 11 for supplying 07 to a part of intaglio 105
6 and has the same configuration as the apparatus shown in FIG. 8 except for this. Also, the dispenser 116, the blade 117,
The blankets 113 are arranged side by side in a line from the left side in the drawing, and move together when printing with the blanket 113.

An example of a printing process using this printing apparatus will be described with reference to FIG.

First, as shown in FIG. 9A, the blade 1
By sliding 17 on the upper surface of the intaglio plate 105 in the left direction in the drawing, ink is filled in the recesses and excess ink on the surface of the intaglio plate 105 is wiped off. The ink with which the concave portion is filled is rotated by the blanket 117 in the left direction as viewed in the drawing, so that the blanket 11 is rotated and brought into contact with the intaglio plate 105.
Accepted by 3. Next, as shown in FIG. 9B, the blanket 113 moves up and moves to the right in the figure without contacting the intaglio 105. Further, as shown in FIG. 9C, the blanket 113 moves to the right as viewed in the drawing without raising the work 106 while keeping rising. Finally, FIG.
As shown in (d), the blanket 113 rotates in contact with the work 106 while moving to the left in the drawing, whereby the ink 107 having the pattern of the intaglio 105 is transferred onto the work 106. At this time, the ink 107 is supplied onto the intaglio plate 105 by the dispenser 116.

With this printing machine, a pattern can be printed on one work by the above-mentioned one step. The takt time of this process is [time required to receive ink] from the intaglio plate to the blanket, [time for blanket to run on the intaglio plate],
It is the sum of [the time the blanket runs on the work] and [the time required for the ink to transfer from the blanket to the work].

The printing ink 107 can be appropriately selected depending on the function of the pattern to be produced. That is, an ink mainly made of an organic Au metal called Au resinate paste is used for an electrode of a recording thermal head or the like, and in the case of a color filter, an ink in which pigments of R, G and B colors are dispersed or an organic dye is included. Ink and the like are used.

Conventionally, as a display technology for realizing a flat panel display device, a liquid crystal display device (LCD), a thin film transistor liquid crystal display device (TFT / LCD), a plasma display (PDP), a low speed electron beam fluorescent display tube (VF).
D), flat panel display technology such as multi-electron source flat CRT.

As an example of these display technologies, a light emitting element for emitting a phosphor using a multi electron source and a flat panel display using the same will be described.

Conventionally, there have been known two types of electron-emitting devices as electron sources, which mainly use a thermoelectron-emitting device and a cold cathode electron-emitting device. The cold cathode electron emission device includes a field emission type (hereinafter referred to as “FE type”), a metal / insulating layer / metal type (hereinafter referred to as “MIM type”), a surface conduction type electron emission device, and the like. WPDyk as an example of FE type
e & WWDoran, “Field Emission”, Advance in Elec
tron Physics, 8,89 (1956) or CASpindt, “Ph
ysical Properties of thin-film fieldemission catho
des with molybdenium cones ”J.Appl.Phys., 47,5248 (1
976) and the like are known.

In the MIM type, CAMead, “Operation of T
unnel-Emission Devices ”, J.Appl.Phys., 32,646 (196
1) and the like are known.

As an example of the surface conduction electron-emitting device type,
MIElinson, Radio Eng. ElectronPhys., 10,1290 (196
5) etc.

In the surface conduction electron-emitting device, electrons are emitted by passing a current through a thin film of a small area formed on a substrate in parallel with the film surface. As the surface conduction electron-emitting device, one using a SnO ₂ thin film by Erinson et al., One using an Au thin film [G. Dittmer: “Thin Solis
Films ", 9,317 (1972)], by In ₂ O ₃ / SnO ₂ thin films [M. Hartwell and CG Fonstad: IEEE Tran
s. ED Conf., 519 (1975)], by a carbon thin film [Hiraki Araki et al .: Vacuum, Vol. 26, No. 1, p. 22 (19).
83)] etc. have been reported.

As a typical device configuration of these surface conduction electron-emitting devices, the above-mentioned M. The Hartwell device configuration is schematically shown in FIG. In FIG. 10, reference numeral 201 indicates a substrate. Reference numeral 204 denotes a conductive thin film, which is a metal oxide thin film or the like formed by sputtering on an H-shaped pattern. Reference numeral 205 denotes an electron emitting portion formed by conducting an energization process called an energization forming described later on the conductive thin film 204. In addition, the device electrodes 202 and 20 in FIG.
The interval L of 3 is set to 0.5 to 1 mm, and W'is set to 0.1 mm.

Conventionally, in these surface conduction electron-emitting devices, the electron-emitting portion 205 has generally been formed by conducting a current-carrying process called current-flow forming in advance on the conductive thin film 204 before emitting electrons. That is, the energization forming means that a direct current voltage or a very slow rising voltage is applied across both ends of the conductive thin film 204 to locally break, deform or alter the conductive thin film 204 so that it has a high electrical resistance. State electron emission unit 20
5 is to be formed. In the electron emitting portion 205, a crack is generated in a part of the conductive thin film 204, and the potential is emitted from the vicinity of the crack. In the surface conduction electron-emitting device that has been subjected to the energization forming process, a voltage is applied to the conductive thin film 204, and a current is passed through the device to emit electrons.
It allows more electrons to be emitted.

Further, the applicant of the present invention has filed USP 5,066,8.
At 83, a technology of a novel surface conduction electron-emitting device in which fine particles for emitting electrons are dispersedly arranged between device electrodes is disclosed.

In this electron-emitting device, the electron-emitting position can be controlled precisely compared to the surface conduction electron-emitting device according to the conventional example described above, and the electron-emitting devices can be arranged with higher precision. A typical device structure of this surface conduction electron-emitting device is shown in FIG. In FIG. 11, reference numeral 301 is an insulating substrate, reference numerals 302 and 303 are a pair of element electrodes for obtaining electrical connection, reference numeral 304 is a thin film made of dispersed fine particle electron emitting materials, and reference numeral 305 is an electron emitting portion. Shows.

In this surface conduction electron-emitting device, the electrode interval L1 between the pair of electrodes 302 and 303 is 0.00.
The sheet resistance of the electron emission part of the thin film 304 is 1 × 10 ³ ohm / □ to 1 × 10 ⁹
Ohm / □ is suitable.

When the surface conduction electron-emitting device described above is used as an electron-emitting device, it must be placed in a vacuum container in order to fly an electron beam. A face plate is provided almost vertically above the present device in a vacuum container to form an electron emitting device, a voltage is applied between the device electrodes, and the phosphor is irradiated with an electron beam obtained from the electron emitting portion. Can be used as a light-emitting element or a flat-panel display device.

[0023]

However, the conventional offset printing apparatus shown in FIGS. 8 and 9 has the following problems.

That is, in the printing process of one work, the takt time was long because the ink was run once on both the intaglio and the work.

An object of the present invention is to provide an offset printing apparatus which can shorten the takt time in view of the above problems of the prior art.

[0026]

In order to achieve the above object, the present invention provides an offset printing apparatus having a blanket cylinder that rotates by contact on an intaglio plate to receive the ink of the pattern of the intaglio plate. For fixing the first work on which the patterned ink is printed
The work platen, the plate platen for fixing the intaglio plate, and the second work platen for fixing the second work on which the ink pattern received by the blanket cylinder is fixed, in this order. Are arranged in series with respect to the rotational movement direction of.

In such an offset printing apparatus, the first and second dispensers, which are arranged symmetrically with respect to the blanket cylinder and which supply ink to a part of the intaglio plate, and the ink on the intaglio plate, are arranged. It is provided with first and second blades that spread and wipe off other than ink filled in the concave pattern of the intaglio plate, and the first and second dispensers and the first and second blades are the blanket cylinder. It moves together.

Further, an image forming apparatus manufactured by using the element electrode of the electron-emitting device formed by the above offset printing apparatus also belongs to the present invention.

In the present invention constructed as described above, the blanket cylinder is contact-rotated on the intaglio plate to receive the ink pattern from the intaglio plate, and then the received ink pattern is transferred to the first work, and the ink is reprinted. Back on the intaglio to accept the pattern. During this time, the blanket cylinder runs idle on the first work. Then, the blanket cylinder contacts and rotates on the intaglio plate to receive the ink pattern from the intaglio plate, transfers the received ink pattern to the second work, and returns to the intaglio plate to receive the ink pattern again. Even during this time, the blanket cylinder runs idle on the first work. The pattern is printed on the two works in such one step.

This process time is [time required to receive ink] from the intaglio plate to the blanket x 2, [time required to transfer ink from the blanket to the work] x 2, [time the blanket runs on the work] ] × 2 total.

Therefore, the takt time required for printing one work is [time required for ink reception] + [time required for ink transfer] + [time for blanket to run idle on work].

That is, according to the printing apparatus of the present invention, the takt time of one work by the conventional printing apparatus is [time required to receive ink] + [time required to transfer ink + [blanket is empty on work]]. While the running time] + [the time the blanket runs idle on the intaglio] is increased by [the time the blanket runs idle on the intaglio], the tact time will be shortened.

The preferred embodiments of the present invention will be described below.

The offset printing used in the present invention is generally used for graphic printing in which ink is transferred onto paper. However, the offset printing has a feature that the transfer film thickness of the ink can be made thinner than the screen printing used for forming the thick film electronic circuit.

At present, in order to carry out high-definition printing, it is necessary to make the printing original plate finer and to maintain the ink transfer pattern in the printing process. However, the thinner the ink to be transferred, the higher the resolution. be able to. This is because the smaller the aspect ratio of the thickness of the ink to the pattern width is, the smaller the width of the pattern width due to dripping or blurring of the transferred ink can be. Therefore, the offset printing capable of reducing the transfer film thickness has the possibility of controlling the pattern thickening for high-definition printing.

Here, the sliding contact of the blanket rubber surface with the printing plate and the work surface in offset printing, and the acceptance of ink to the blanket and the transfer to the work will be described.

As the printing plate, a metal intaglio plate having a pattern etched by photolithographic etching on the surface of a metal plate is used.
The ink filled in the concave portions of the metal intaglio plate is received by the blanket which is in sliding contact, and the blanket is in sliding contact with the glass work, whereby the ink is transferred onto the glass work and a print pattern is formed. .

The heights of the metal intaglio and the glass work with respect to the sliding surface of the blanket have a mechanism capable of being adjusted. This mechanism makes it possible to adjust the printing pressure determined by the amount of blanket rubber pushed into the metal intaglio and the printing pressure determined by the amount pushed into the glass work. The plate pressure and printing pressure are appropriately determined in the actual printing process. The blanket sliding in this series of steps is performed by the meshing of gears fixed to both ends of the blanket cylinder, a printing plate, and rack gears arranged at both ends of the work stage.

[0039]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings.

(First Embodiment) FIG. 1 is a diagram for explaining a printing process of a first embodiment of an offset printing apparatus of the present invention. FIG. 2 is a timing chart of main constituent members in the first embodiment of the offset printing apparatus of the present invention.

The offset printing apparatus of this embodiment, as shown in FIG. 1, has a first work surface plate 1 for fixing a first work 4, a plate surface plate 2 for fixing an intaglio 5, and a second work. The second work surface plate 3 for fixing 6 is arranged and fixed in series in this order. Further, on the surface plates arranged side by side in this one row, the first dispenser 7, the first blade 9,
The blanket 11, the second blade 10, and the second dispenser 8 are arranged in this order from the first work 1 side, and move integrally when printing with the blanket 11.

The first dispenser 7 supplies the ink 12, which is spread on the intaglio plate 5 by the first blade 9, to a part of the intaglio plate 5. The second dispenser 8 is the second
The blade 10 supplies ink 12 that spreads on the intaglio plate 5 to a part of the intaglio plate 5.

The first blade 9 is attached so that its tip is tilted from the root toward the right in the drawing,
This is for sliding the upper surface of the intaglio plate 5 while advancing to the left as viewed in the drawing, and wiping off the ink 12 other than the ink filled in the recesses. The second blade 10 is attached so as to be tilted so that its tip is leftward from the root in the drawing,
This is for sliding the upper surface of the intaglio plate 5 while advancing to the right in the drawing, and wiping out the ink 12 other than the ink filled in the recesses.

The blanket 11 receives the ink filled in the concave portion of the intaglio plate 5 by rotating the upper surface of the intaglio plate 5 into contact with the upper surface of the first work piece 4 and the second work piece 5. The pattern ink of the intaglio plate 5 is transferred to the upper surfaces of the first work 4 and the second work 5.

In the timing chart shown in FIG.
“Blanket central axis position” refers to the position of the blanket central axis in the printing device in the printing process. Here, the arrows in the chart represent the traveling direction of the blanket corresponding to FIG. In the "blanket", the solid line part represents the state where the blanket is descending, and the dotted line part represents the state where it is rising. In the "first blade" and the "second blade", the solid line portion represents the state in which the blade is descending to spread the ink, and the dotted line portion represents the state in which it is rising. In the “first dispenser” and the “second dispenser”, the solid line portion represents a state where ink is supplied from the dispenser, and the dotted line portion represents a state where ink is not supplied. In the “first work replacement” and the “second work replacement”, the solid line portion represents a state in which the substrate which is the work is exchanged, and the dotted line portion represents a state in which the substrate is not exchanged.

The printing process of this embodiment will be described below with reference to FIGS. 1 and 2.

First, as shown in FIG. 1 (a), the first blade 9 slides on the upper surface of the intaglio plate 5 in the left direction as viewed in the drawing to fill the recesses with ink and wipe off the excess ink on the surface of the intaglio plate 5. Is done. The ink filled in the recesses is received by the blanket 1 as the blanket 11 rotates in contact with the intaglio plate 5 while moving to the left in the drawing.

Next, as shown in FIG. 1 (b), the blanket 11 advances to the left in the drawing, and the first work 4
The ink 12 having the pattern of the intaglio plate 5 is transferred onto the first glass substrate 4 by making a rotational contact with. At this time, the ink 1 is placed on the intaglio plate 5 by the second dispenser 8.
2 are supplied.

Subsequently, as shown in FIG. 1 (c), the blanket 11 moves up and moves to the right in the figure without contacting the first work 4.

Next, as shown in FIG. 1 (d), the first blade 9 slides on the upper surface of the intaglio 5 in the right direction in the drawing to fill the recess with ink and remove excess ink on the surface of the intaglio 5. Wiping is done. The ink filled in the recesses is received by the blanket 11 as the blanket 11 rotates in contact with the intaglio plate 5 while moving in the right direction in the drawing.

Next, as shown in FIG. 1 (e), the blanket 11 advances to the right in the drawing, and the first work 4 is moved.
The ink 107 of the pattern of the intaglio plate 5 is transferred onto the second glass substrate 6 by making a rotational contact with the second glass substrate 6. At this time, the ink 1 is placed on the intaglio plate 5 by the first dispenser 7.
2 are supplied.

Finally, as shown in FIG. 1 (f), the blanket 11 moves up and moves to the left in the figure without contacting the second work 6.

In this embodiment, two works can be printed by the above-mentioned one step. Therefore, the tact time for one work in this process is [time required to receive ink] from the intaglio plate to the blanket x 2, [time to transfer ink from the blanket to work x 2], [blanket on work] Is the time to run free] x 2 divided by 2.

That is, the takt time of one work is [time required for receiving ink] + [time required for ink transfer] + [time for blanket to run on work].
Therefore, the takt time of one work by the conventional printing device is [time required to receive ink] + [time required to transfer ink + [time blanket runs on work] + [blanket on intaglio] It was improved by [the time the blanket idles over the intaglio] compared to the time when the blanket runs.

(Second Embodiment) FIG. 3 is a diagram for explaining a printing process of a second embodiment of the offset printing apparatus of the present invention. FIG. 4 is a timing chart of main constituent members in the offset printing apparatus according to the second embodiment of the present invention.

Since the printing apparatus of this embodiment has the same configuration as that of the first embodiment, the same reference numerals as those in FIG. 1 are attached in FIG. Further, the description of the device configuration of the present embodiment is also largely left to the description of the first embodiment, and only the points different from the first embodiment will be described below.

In this embodiment, as shown in FIGS. 3 and 4, the rotary sliding direction of the blanket 11 is opposite to that of the intaglio 5 and the first work 4, and the rotary sliding direction of the blanket 11 is the intaglio plate. 5 is different from the first embodiment in which the first workpiece 4 and the first workpiece 4 have the same direction. Further, as the rotating and sliding direction of the blanket 11 is changed, the rising and falling timing of the blanket 11 is also changed as shown in FIG.

When printing was performed according to the timing chart shown in FIG. 3 using such a printing apparatus, the same favorable result as that of the first embodiment was obtained in which the takt time of one work could be shortened. .

(Third Embodiment) A method of manufacturing an image forming apparatus using an element electrode of an electron-emitting device formed by offset printing will be described below.

The device electrodes of the electron-emitting devices were printed and transferred onto the glass substrate by the printing method and the printing apparatus according to the above-mentioned embodiment. In this example, the ink is Pt made of an organic metal.
Uses a resinate pace. The ink transferred onto the glass substrate can be used as a device electrode made of Pt by drying at about 80 ° C. and baking at about 580 ° C. The thickness of the ink transfer on the glass substrate after printing and drying was as small as about 2 microns, and the width of the printed electrode pattern was very small.
Further, the thickness of the Pt electrode after firing could be formed as thin as about 400 Å. Here, as the pattern shape of the device electrodes, there is a device electrode interval in which the electron emitting material is arranged, and the dimension thereof is set to about 20 μm.

An electron source substrate can be manufactured by forming a wiring and a thin film of Pd particles on the device electrode formed as described above. This will be described below with reference to FIG. FIG. 5 is a schematic cross-sectional view showing one form of an image forming apparatus using element electrodes of electron-emitting devices formed by printing by the offset printing apparatus of the present invention.

In FIG. 5, reference numeral 401 indicates electron source substrates 402 and 403 made of soda lime glass, and reference numeral 404 indicates element electrodes formed by offset printing according to the present invention. Reference numerals 407, 408, and 409 denote printed wirings having a thickness of about 7 μm, which were obtained by screen-printing and firing Ag paste ink. The device electrodes 402, 403 and 404 are connected to the printed wirings 407, 408 and 409, respectively. Code 40
Reference numerals 5 and 406 denote thin films of Pd particles having a thickness of about 200 angstroms obtained by coating and baking an organometallic solution. The reverse etching method is a Cr thin film so as to be arranged on the device electrodes 402, 403 and 404 and the electrode intervals. Patterned by. Reference numerals 410, 411 and 412 are plated wirings, which are formed on the printed wirings 407, 408 and 409 by Cu plating having a thickness of about 50 microns and a width of 400 microns.

Reference numeral 415 denotes a glass substrate made of soda lime glass, which is opposed to the electron source substrate 401 by 5 mm. Reference numerals 416 and 417 denote phosphors, which are arranged on the substrate 415 and are arranged on the electron source substrate 401 facing the device electrodes 402, 403, and 40.
It is formed at a position corresponding to the electrode interval portion composed of four. The phosphors 416 and 417 are formed by mixing a photosensitive resin with a phosphor to form a slurry, coating and drying it, and then patterning it by a photolithography method. Reference numeral 41
8 is a metal back obtained by performing a filming process on the phosphors 416 and 417, depositing an Al thin film with a thickness of about 300 angstrom by vacuum deposition, and firing the film to eliminate the film layer. Indicates. The above-described phosphor and metal back formed on the glass substrate 415 is called a face plate.

Reference numeral 419 indicates a grid electrode arranged between the element substrate and the face plate. After placing the above in the vacuum envelope, the plated wirings 410, 411, 412
A voltage was applied between them to energize the thin films 405 and 406 to obtain electron emitting portions 413 and 414. After that, the metal back 418 is used as an anode electrode, and the electron extraction voltage is 3 k.
V is applied, and 1 is applied from the device electrodes 402 and 403 to the electron emission portion 413 through the plated wirings 410, 411 and 412.
When a voltage of 4V was applied, electrons were emitted. The emitted electrons were modulated by changing the voltage of the grid 419, and the amount of emitted electrons with which the phosphor 418 was irradiated could be adjusted. This allowed the phosphor 416 to emit light arbitrarily. Similarly, the device electrodes 403, 40
When a voltage of 14 V was applied from 4 to the electron emitting portion 414, electrons were emitted. This emitted electron is used as a grid 419.
The phosphor 417 is modulated by changing the voltage of
It was possible to adjust the amount of emitted electrons to be irradiated to the. This allowed the phosphor 417 to emit light arbitrarily.

In the present example, the configuration for two display pixels has been described, but the number of display pixels is not limited to this. Therefore, by forming the wirings and grids in a matrix and arranging and driving a large number of electron-emitting devices, it is possible to display an arbitrary image by a large number of display pixels.

(Fourth Embodiment) FIG. 6 is a top view showing a manufacturing process of an example of an element substrate formed by combining a surface conduction electron-emitting device formed by printing by an offset printing apparatus of the present invention and matrix wiring. It is a figure.

In this example, as shown in FIG. 6F, 3 × 3 electron-emitting devices were provided on a soda-lime glass substrate (not shown).
This is an example of an element substrate formed together with wiring in a matrix of nine pieces in total.

In FIG. 6F, reference numeral 501 indicates a lower layer printed wiring, reference numeral 502 indicates a printing pad arranged in parallel with the lower layer printed wiring 501, and the printing pad 502 indicates the lower layer printed wiring 50.
It is formed by firing the printed metal paste in the same step as 1. Reference numeral 503 denotes a strip-shaped insulating layer that is orthogonal to the lower layer printed wiring formed by firing the printing glass paste, and the insulating layer 503 has a contact hole 504 that is opened at the center of intersection with the printing pad 502. There is.
Reference numeral 505 indicates an upper layer printed wiring, and the upper layer printed wiring 505.
Is a lower layer of the plated wiring 506 and is not exposed in the drawing. The upper printed wiring 505 is a strip-shaped insulating layer 5.
03, is electrically connected to the printing pad 502 by the contact hole 504, and is formed by firing the printing metal paste. Reference numerals 507 and 508 denote element electrodes, and the element electrodes 507 and 508 are connected to the lower layer printed wiring 501 and the print pad 502, respectively.
It is formed by offset printing and firing of resinate paste ink. The device electrodes 507 and 508 have a shape with an electrode interval of 30 microns and an electrode width of 200 microns at the adjacent portions. Reference numeral 509 denotes a thin film made of Pd fine particles which is an electron emitting material, and the thin film 509 is the device electrode 50.
Wiring is formed at intervals of 7,508 and electrodes. Reference numeral 510
Indicates a thin film portion of this electrode gap portion, which is a portion to be an electron emitting portion described later. Reference numeral 506 denotes a plated wiring, which is a strip-shaped metal wiring having a thickness of about 100 μm formed on the upper layer printed wiring 505 by a plating method.

Hereinafter, the method for manufacturing the present element substrate will be described in order with reference to FIGS.

First, Pt element electrodes 507 and 508 having a thickness of 1000 angstrom were patterned by offset printing and baking of resinate paste ink on a well-cleaned substrate made of soda-lime glass (see FIG. 6A).

Next, Ag paste ink was screen-printed and fired to form a lower layer printed wiring 501 and a printing pad 502 having a width of 300 μm and a thickness of 7 μm. At this time, the wiring 501 and the print pad 502 are connected to the device electrode 5
07 and 508 are electrically connected to each other (see FIG. 6B).

Next, a glass paste ink was screen-printed to form an insulating layer 503 having a width of 500 microns and a thickness of about 20 microns and a contact hole 504 having an opening size of 100 microns square (see FIG. 6C).

Further, Ag paste ink was screen-printed on the insulating layer 503 and baked to form upper layer printed wiring 505 having a width of 300 μm and a thickness of 10 μm. At this time, the upper layer printed wiring 50 is contacted through the contact hole 504.
5 and the printing pad 502 are electrically connected. Further, by forming the plated wiring in the subsequent process, a sufficient step cover for the contact hole is realized (see FIG. 6D).

Next, after forming a Cr film on the portion where the thin film 509 is not desired to be arranged by a sputtering method, a Cr pattern is formed by a photolithographic etching method, and then an organic palladium solution (Kata Paste CCP423 of Okuno Chemical Industries Co., Ltd.) is formed.
0) is applied and baked to obtain a Pd fine particle film. Furthermore, C
The r pattern is reverse-etched to form a thin film 509 by patterning on the device electrodes 507 and 508 and the electrode gap portion (see FIG. 6E).

Next, a plating resist is formed by photolithography so that the upper layer printed wiring 505 is exposed,
The upper layer printed wiring 505 is energized and Cu electroplating is performed at a thickness of 100 μm on this portion. The element substrate is manufactured by removing the plating resist. At this time, the Cu plating film is sufficiently deposited and grown in the contact hole 504 in the contact hole 504 portion,
Sufficient electrical conduction was obtained between the print pad 502 and the upper layer printed wiring 505 (see FIG. 6 (f)).

This device substrate is arranged on a 40 cm square substrate in which 350 × 350 electron-emitting devices are arranged in a matrix, and a face plate having phosphors corresponding to R, G, and B, and a vacuum envelope. Placed inside. After that, after the electron-emitting device is energized, an arbitrary voltage signal of 14V is sequentially applied to the upper layer printed wiring of this element substrate and a potential of 0V is sequentially applied to the lower layer printed wiring, and the other lower layer printed wirings are scanned. The potential was 7V. When an anode voltage of 3 kV was applied to the metal back of the face plate, an arbitrary image could be displayed. At this time, there was no crosstalk between the fluorescent bright spots caused by the positional deviation between the electron-emitting device and the phosphor. Further, the wiring resistance of the plated wiring 506 can be reduced to about 0.5 ohm between both ends of the substrate, and the voltage drop and delay of the drive signal can be greatly improved.

In this step, the device electrodes 507 and 508 are prepared before printing and baking the printed wiring. However, since this element electrode has been subjected to the printing and firing step once, thermal damage to the element electrode did not occur in the same firing of the printed wiring. Further, the lower layer printed wiring 501 and the printing pad 502 are the same formation layer on the substrate, and the element electrodes 507 and 508 are formed on the substrate without steps to make contact with the element electrodes 507 and 508. Since it was connected to 502, there was no disconnection in the middle.

[0078]

According to the present invention, in an offset printing apparatus having a blanket cylinder that rotates by contact on an intaglio plate to receive the ink of the pattern of the intaglio plate, the first ink pattern received by the blanket cylinder is printed. A first work surface plate for fixing a work piece; a plate surface plate for fixing the intaglio plate; and a second work surface plate for fixing a second work piece on which the ink pattern received by the blanket cylinder is printed. By arranging the blanket cylinders in this order in series with respect to the rotational movement direction, it is possible to eliminate blank running of the blanket on the intaglio when printing on one work, and thus the printing takt time can be shortened. There is an effect that can be achieved.

Further, by using such an offset printing apparatus, there is an effect that an image forming apparatus can be manufactured well.

[Brief description of drawings]

FIG. 1 is a diagram for explaining a printing process of a first embodiment of an offset printing apparatus of the present invention.

FIG. 2 is a timing chart of main constituent members in the first embodiment of the offset printing apparatus of the present invention.

FIG. 3 is a diagram for explaining a printing process of a second embodiment of the offset printing apparatus of the present invention.

FIG. 4 is a timing chart of main constituent members in the second embodiment of the offset printing apparatus of the present invention.

FIG. 5 is a schematic cross-sectional view showing one form of an image forming apparatus using element electrodes of electron-emitting devices formed by printing by the offset printing apparatus of the present invention.

FIG. 6 is a top view showing a manufacturing process of an example of an element substrate formed by combining a surface conduction electron-emitting device formed by printing with an offset printing apparatus of the present invention and matrix wiring.

FIG. 7 is a plan view showing a conventional flatbed proofing machine type offset printing apparatus.

FIG. 8 is a diagram for explaining a printing process by the offset printing apparatus shown in FIG.

FIG. 9 is a diagram for explaining a printing process by an apparatus that does not use an ink mixing table.

FIG. 10 is a diagram schematically showing a configuration of a conventional example of a surface conduction electron-emitting device.

FIG. 11 is a diagram schematically showing the configuration of another conventional example of the surface conduction electron-emitting device.

[Explanation of symbols]

 1 1st work surface plate 2 Plate surface plate 3 2nd work surface plate 4 1st work 5 Intaglio 6 2nd work 7 1st dispenser 8 2nd dispenser 9 1st blade 10 2nd blade 11 Blanket 12 Ink 401 Electron source substrate 402, 403, 404, 507, 508 Element electrode 405, 406, 509 Thin film 407, 408, 409 Printed wiring 410, 411, 412, 506 Plated wiring 413, 414, 510 Electron emission part 415 Glass substrate 416, 417 Phosphor 418 Metal back 419 Grid electrode 501 Lower layer printed wiring 502 Printing pad 505 Upper layer printed wiring

Claims (3)

[Claims] 1. An offset printing apparatus having a blanket cylinder that rotates by contact on an intaglio plate to receive ink of the pattern of the intaglio plate, wherein a first work on which the pattern of ink received by the blanket cylinder is printed is fixed. The first work surface plate, the plate surface plate for fixing the intaglio plate, and the second work surface plate for fixing the second work on which the pattern of the ink received by the blanket cylinder are fixed, are arranged in this order. An offset printing apparatus, wherein the offset printing apparatus is arranged in series with respect to the rotational movement direction of the blanket cylinder. 2. A first and a second dispenser, which are arranged symmetrically with respect to the blanket cylinder, for supplying ink to a part of the intaglio plate, and a concave pattern of the intaglio plate for spreading the ink on the intaglio plate. The first and second blades for wiping off ink other than the ink filled in the first and second blades, and the first and second blades and the first and second blades move integrally with the blanket cylinder. The offset printing device according to claim 1. 3. An image forming apparatus manufactured by using the element electrode of an electron-emitting device, which is formed by the offset printing apparatus according to claim 1.