JPH09214005A - Thermoelectric transducer - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a thermoelectric transducer which can realize a long operational life by suppressing a thermal deformation in a thermoelectric element. SOLUTION: The thermoelectric transducer comprises heat exchanges 1 and 2 of each a nearly planar plate, a plurality of thermoelectric elements 3 which are arranged in a side-by-side positional relation on the respective heat exchanges 1 and 2 through insulators 9 therebetween and which comprise at least one pair of P type and N type semiconductors 4 and 5 of each a nearly rectangular shape, connecting members 6 for connecting the thermoelectric elements in such a manner that the thermoelectric element 3 as the P type semiconductor and the thermoelectric element 3 as the N type semiconductor are alternately arranged. Each connecting member 6 is disposed between the adjacent thermoelectric elements 3 so that the member comes into contact with end sides of the thermoelectric elements 3.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thermoelectric converter for converting electricity into heat or heat into electricity.

[0002]

2. Description of the Related Art Conventionally, there is a thermoelectric converter that converts electricity into heat using the Peltier effect and heat into electricity using the Seebeck effect. As shown in FIG. 6 and FIG. 7, this thermoelectric conversion device includes heat exchangers 1 and 2 in a substantially flat plate shape arranged so as to face each other, and a grid pattern between the heat exchangers 1 and 2. The thermoelectric element 3 formed of a plurality of P-type semiconductors 4 and N-type semiconductors 5 arranged in parallel with each other, and the P-type semiconductors 4 and the N-type semiconductors 5 of the thermoelectric element 3 are alternately arranged in series. Thermoelectric element
And a plurality of substantially flat plate-shaped connecting bodies 7 which are arranged on the end faces of 3 and are attached to the heat exchangers 1 and 2. Aluminum is often used as a material for the heat exchangers 1 and 2 in order to improve heat conduction. Also, thermoelectric element 3
P-type semiconductor 4 and N-type semiconductor 5 of
It is a heavy metal substantially rectangular parallelepiped formed by sintering and the like, and the P-type semiconductor 4 and the N-type semiconductor 5 and the connection body 7 are connected by solder 8 or the like, and the connection body 7 is heat-exchanged. Bowl 1,2
It is attached by an insulator 9 made of an insulating material such as an adhesive.
Then, by passing a current through the thermoelectric element 3, electricity can be converted into heat.

[0003]

In this thermoelectric conversion device, a heat quantity proportional to the current flowing through the thermoelectric element is obtained by the Peltier effect, and one of them can radiate heat and the other can absorb heat by the heat exchanger. However, since the thermoelectric element is made of heavy metal, it is vulnerable to heat and impact from the outside, and when the thermoelectric element etc. rises to an abnormal temperature for some reason, a large thermal deformation etc. occurs due to the difference in thermal expansion between different materials and the wire breakage occurs. May occur. That is, since the thermoelectric element is connected by the substantially flat plate-shaped connecting member disposed on the end surface as described above,
When the connecting member is deformed, it is easily deformed and deteriorated.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a thermoelectric conversion device capable of suppressing the deformation of a thermoelectric element due to heat and extending the life thereof. Is.

[0005]

In order to solve the above problems, a thermoelectric conversion device according to a first aspect of the present invention is arranged such that a heat exchanger having a substantially flat plate shape and a heat exchanger arranged in parallel on the heat exchanger via an insulator. A plurality of thermoelectric elements formed of at least a pair of substantially rectangular parallelepiped P-type semiconductors and N-type semiconductors, and the P-type semiconductor thermoelectric elements and the N-type semiconductor thermoelectric elements are alternately provided. A thermoelectric conversion device comprising a connecting member connected so as to be arranged in series, wherein the connecting member is arranged between the thermoelectric elements to be connected.

Further, the thermoelectric conversion device according to claim 2 is
A reinforcing member having an insulating property is provided between the adjacent thermoelectric elements according to claim 1.

The thermoelectric converter according to claim 3 is
The connecting member according to claim 1 or 2 is formed by only solder.

Further, the thermoelectric conversion device according to claim 4 is
The thermoelectric elements according to claims 1 to 3 are formed in a thin plate shape so that the thickness in the connecting direction for connecting with the connecting member is thin.

The thermoelectric converter according to claim 5 is
The thermoelectric element according to claims 1 to 4 is provided with a fin-shaped heat dissipation member.

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION A first embodiment of a thermoelectric converter according to the present invention will be described below with reference to FIG. This figure is a cross-sectional view of a thermoelectric converter, which is formed of a high temperature side heat exchanger 1, a low temperature side heat exchanger 2, a P-type semiconductor 4 and an N-type semiconductor 5. Multiple thermoelectric elements
3 and the connecting member 6 are the main constituent members. The members having the same basic functions as those described in the conventional embodiment are designated by the same reference numerals.

The high temperature side heat exchanger 1 includes a thermoelectric element 3 which will be described later.
It radiates the heat generated at one end to the outside, and is formed of a material having good heat conduction such as aluminum in a substantially flat plate shape having an outer surface 1a and an inner surface 1b. This outer surface 1a is
Contact with gases or solids that want to transfer heat. The low temperature side heat exchanger 2 absorbs heat from the outside as the other end of the thermoelectric element 3 described later is cooled.
Similarly to the above, the material is formed into a substantially flat plate shape having an outer surface 2a and an inner surface 2b from a material having good heat conduction such as aluminum. The outer surface 2a also comes into contact with a gas, a solid, or the like that wants to absorb heat. The low-temperature side heat exchanger 2 and the high-temperature side heat exchanger 1 have inner surfaces 2b, 1b facing each other substantially parallel to each other, and have a space for accommodating a thermoelectric element 3 and a connecting member 6 described later. Is arranged.

The thermoelectric element 3 converts electricity into heat, and is formed of a heavy metal P-type semiconductor 4 or N-type semiconductor 5 into a substantially rectangular parallelepiped shape. This thermoelectric element 3 is composed of a plurality of P-type semiconductors 4
Although not shown, the thermoelectric elements 3 and the thermoelectric elements 3 formed of the N-type semiconductor 5 are arranged in parallel in a grid pattern between the high temperature side heat exchanger 1 and the low temperature side heat exchanger 2 so as to be alternately located. Along with
Each thermoelectric element 3 has a connecting member 6 whose ends 3a and 3b will be described later.
Are linked by

The connecting member 6 electrically connects the thermoelectric elements 3 to each other, and includes a connecting body 7 formed of a conductive material such as copper in a substantially rectangular parallelepiped shape, and a solder connecting the connecting body 7 and the thermoelectric element 3 together. 8 and. As shown in FIG. 1, the connecting member 6 is formed by connecting the side surfaces of the ends 3a and 3b of each thermoelectric element 3 to the P-type semiconductor
And N-type semiconductors 5 are connected so that they are alternately arranged in series. That is, the side surface of the end portion 3a of the thermoelectric element 3 formed of the P-type semiconductor 4 and the thermoelectric element 3 formed of the N-type semiconductor 5
The side surface of the thermoelectric element 3 adjacent to the side surface of the end portion 3a of the thermoelectric element 3 connected by the connecting member 6 is formed of the P-type semiconductor 4.
Thermoelectric element formed by the side surface of the end 3b of 3 and the N-type semiconductor 5
The side surface of the end 3b of 3 is connected by a connecting member 6. Solder 8
It is interposed between the connecting body 7 and the side surface of the thermoelectric element 3.

Reference numeral 9 denotes an insulator, which is made of an insulating material such as an adhesive or grease, and is used to connect the inner surface 1a of the high temperature side heat exchanger 1 and the end 3a of the thermoelectric element 3 and the low temperature side heat exchanger 2 to each other. Inward 2a
And the end 3b of the thermoelectric element 3 are connected. In addition, the high temperature side heat exchanger 1 and the low temperature side heat exchanger 2 are arranged with a predetermined interval.
It is fastened with screws or the like (not shown) so as to interpose 3 and the connecting member 6 and the like.

In this device, when a current flows from the thermoelectric element 3 formed of the P-type semiconductor 4 toward the thermoelectric element 3 formed of the N-type semiconductor 5, its end 3a generates heat,
Thermoelectric element 3 formed of N-type semiconductor 5 to P-type semiconductor 4
At the place where the current flows toward the thermoelectric element 3 formed in (3), the end portion 3b is cooled. Therefore, the heat generated at the end portion 3a is transmitted to the high temperature side heat exchanger 1 through the insulator 9 and radiated from the outer surface 1a, and at the same time, the low temperature side heat exchanger.
Heat is absorbed from the outer surface 2b of 2 and is transferred to the end portion 3b of the thermoelectric element 3 via the insulator 9.

Further, since the connecting member 6 is disposed between the thermoelectric elements 3, the contact area between the thermoelectric element 3 and the connecting member 6 is small. The element 3 is less likely to be received, the deformation of the thermoelectric element 3 is suppressed and is less likely to deteriorate, and the thickness in the direction perpendicular to the heat exchangers 1 and 2 can be reduced, so that the thermoelectric conversion device is compact. Can be realized.

Next, a second embodiment of the present invention will be described with reference to FIG. This is the one in which the deformation of the thermoelectric element is further suppressed in the first embodiment.

Reference numeral 11 is a reinforcing member, which is made of an insulating material having rigidity such as a ceramic resin and is arranged so as to fill the gap between the adjacent thermoelectric elements 3.

Since this member has the reinforcing member 11 between the adjacent thermoelectric elements 3, the strength can be increased without changing the electrical properties, and therefore the thermoelectric element is less likely to be deformed and has a longer life. be able to.

Next, a third embodiment of the present invention will be described with reference to FIG. This is different from the first embodiment in the structure of the connecting member.

The connecting member 6 is formed only of the solder 8 and connects the respective end portions 3a and 3b of the thermoelectric element 3 to each other.

In this device, since the connecting member 6 is formed only by the solder 8, the number of parts is small and the cost can be reduced, and when the thermoelectric element 3 rises to an abnormal temperature, the connecting member 6 made of the solder 8 is formed. Since it melts, the stress on the thermoelectric element 3 is weakened, and the life of the thermoelectric element 3 can be further extended.

Next, a fourth embodiment of the present invention will be described with reference to FIG. This structure does not require the high temperature side heat exchanger 1.

The thermoelectric element 3 is formed in a thin plate shape so as to have a small thickness in the connecting direction in which the connecting members 6a and 6b are connected.

The connecting member 6a is one end 3a of the thermoelectric element 3.
Are formed of solder 8 and are arranged between the thermoelectric elements 3 to be connected and their side surfaces are connected. The connecting member 6b connects the other end 3b of the thermoelectric element 3 and has a connecting body 7 and a solder 8. Connection body 7
Is a substantially flat plate, is connected by solder 8 so as to connect the end faces of the respective end portions 3b, and is arranged between the low temperature side heat exchanger 2 and the thermoelectric element 3.

In this device, since the thermoelectric element 3 is formed in a thin plate shape, the surface area of the thermoelectric element 3 increases, so that heat dissipation from the thermoelectric element 3 is promoted and This can be eliminated, and as a result, the thermal stress due to the high temperature side heat exchanger 1 can be eliminated and the life can be further extended.

Next, a fifth embodiment of the present invention will be described with reference to FIG. This is one that further promotes heat dissipation in the fourth embodiment.

Reference numeral 12 denotes a heat radiating member, which is made of a material having good heat conduction such as aluminum and is formed into a fin shape.
It is attached to one end 3a.

This is a thermoelectric element 3 by the heat dissipation member 12.
Since the heat radiation of is further promoted, the life can be further extended.

Although the thermoelectric converter of the present invention has been described as one that converts electricity into heat by utilizing the Peltier effect, it can also be used by converting heat into electricity by utilizing the Seebeck effect. . Further, although the embodiment in which the connecting member is attached to the side surface or the end surface of the thermoelectric element has been described, the deformation of the thermoelectric element is suppressed as long as it is attached to at least one side surface of the thermoelectric element. It is possible to make it longer and to make it compact. further,
Although the high temperature side heat exchanger is omitted in the fourth and fifth embodiments, the thermoelectric element may be formed in a thin plate shape and the high temperature side heat exchanger may be provided.

[0031]

Since the thermoelectric conversion device according to the first aspect is arranged between the thermoelectric elements that connect the connecting members, the contact area between the thermoelectric elements and the connecting members is small, so that the connecting members are deformed. Even so, the thermoelectric element is less susceptible to the influence, is less likely to be deformed and is not deteriorated, and the thickness in the direction perpendicular to the heat exchanger can be reduced, so that the size can be reduced.

Further, the thermoelectric conversion device according to claim 2 is
In addition to the effects of the first aspect, since the thermoelectric element has the reinforcing member between the adjacent thermoelectric elements, the thermoelectric element is not easily deformed, so that the life can be extended.

The thermoelectric converter according to claim 3 is
In addition to the effect of claim 1 or 2, since the connecting member is formed only by solder, the cost can be reduced.

The thermoelectric converter according to claim 4 is
In addition to the effect according to any one of claims 1 to 3, since the thermoelectric element is formed in a thin plate shape, the surface area of the thermoelectric element increases, so that heat dissipation from the thermoelectric element is promoted and the heat exchanger on the heat dissipation side. Can be eliminated, and as a result, the thermal stress due to the heat exchanger can be eliminated and the life can be further extended.

Further, in the thermoelectric conversion device according to the fifth aspect, in addition to the effect according to any one of the first to fourth aspects, the heat dissipation of the thermoelectric element is further promoted by the heat dissipation member, so that the life is further extended. You can

[Brief description of drawings]

FIG. 1 is a cross-sectional view of a thermoelectric conversion device showing a first embodiment of the present invention.

FIG. 2 is a sectional view of a thermoelectric conversion device showing a second embodiment of the present invention.

FIG. 3 is a sectional view of a thermoelectric conversion device showing a third embodiment of the present invention.

FIG. 4 is a sectional view of a thermoelectric conversion device showing a fourth embodiment of the present invention.

FIG. 5 is a sectional view of a thermoelectric conversion device showing a fifth embodiment of the present invention.

FIG. 6 is a perspective view of a thermoelectric conversion device showing a conventional embodiment of the present invention.

FIG. 7 is a cross-sectional view of the thermoelectric conversion device.

[Explanation of symbols]

 1 High temperature side heat exchanger 2 Low temperature side heat exchanger 3 Thermoelectric element 4 P-type semiconductor 5 N-type semiconductor 6 Connecting member 7 Connecting body 8 Solder 9 Insulator 11 Reinforcing member 12 Heat radiating member

Claims (5)

[Claims] 1. A substantially flat plate heat exchanger and at least one pair of substantially rectangular parallelepiped P-type semiconductors and N-type semiconductors, which are arranged in parallel on the heat exchanger via an insulator. A thermoelectric conversion device comprising: a plurality of thermoelectric elements to be formed; and a connecting member that connects so that the P-type semiconductor thermoelectric elements and the N-type semiconductor thermoelectric elements are alternately arranged in series. A thermoelectric conversion device, wherein a connecting member is arranged between thermoelectric elements to be connected. 2. The thermoelectric conversion device according to claim 1, wherein a reinforcing member having an insulating property is provided between the adjacent thermoelectric elements. 3. The thermoelectric conversion device according to claim 1, wherein the connecting member is formed of only solder. 4. The thermoelectric conversion device according to claim 1, wherein the thermoelectric element is formed in a thin plate shape so that the thickness in the connecting direction for connecting with the connecting member is thin. 5. The thermoelectric conversion device according to claim 1, wherein the thermoelectric element is provided with a fin-shaped heat dissipation member.