JPH09214194A - Electronic component mounting equipment - Google Patents

Abstract

[PROBLEMS] To provide an electronic component mounting apparatus capable of accurately locating a position of a coating portion for coating a solder for fixing an electronic component to a wiring board. SOLUTION: A coating portion for coating solder on a component mounting position of a wiring board is driven horizontally and vertically by electric motors 7, 16 and 61 to move toward and away from the component mounting position. Then, when the applicator is relatively rotated about its central axis and relatively moved in the horizontal direction at a rotation angle difference of 90 °, the center position in each moving direction of the needle attached to the applicator is calculated. A position calculation unit 70 is provided which obtains position data of the eccentricity amount and the phase with respect to the central axis of the application unit of the needle based on the calculated data. The operation of the electric motors 7, 16, 61 is controlled by the control unit 75 so as to be positioned.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus for mounting electronic components such as semiconductor devices on a wiring board.

[0002]

2. Description of the Related Art An electronic component mounting apparatus is used for automatically mounting electronic devices such as semiconductor devices such as IC and LSI, diodes, capacitors, and resistors on a wiring board. This electronic component mounting device is equipped with a mounting portion for mounting these electronic components on a wiring board and a coating portion for applying a coating material such as an adhesive or cream solder to the wiring board in advance prior to mounting. There is.

The electronic component mounting apparatus has a guide rail for guiding the wiring board and positioning it at a predetermined position, and a component stage for holding a plurality of electronic components mounted on the wiring board. The working unit (working means) such as the coating unit and the mounting unit is attached to the mounting head that horizontally moves in the XY biaxial directions above the guide rail.

The specific movement of the working unit with respect to the wiring board is such that the working unit is moved upward to the working position when the working unit moves to the loading position or the coating position, that is, the working position, as the mounting head moves. When it becomes, it is moved down so that it approaches the wiring board. Then, for example, in the coating section, move the needle tip to the coating position,
The coating material of the container is dropped and applied from this needle. In addition, reflow soldering is achieved by pressing an electronic component against the dropped coating material.

Since it is necessary to mount electronic components on the wiring board with high precision, it is also required that the adhered substance by the coating section is accurately coated on a predetermined coating position. Therefore, the center position of the needle must be accurately positioned, and if the center position is not secured, it will cause poor coating position accuracy.

[0006] Here, when the filled coated material is used up, the replenishment is generally performed by replacing the container itself in view of the structural reason of the device and work efficiency. Since the container and the needle are integrally connected, the needle tip must be positioned every time the container is replaced. Further, just as there are various sizes of containers for accommodating the adherends, the needles also have various sizes, and of course accurate positioning is required regardless of the size. Further, in the case of a so-called twin needle in which the coating material is applied to two places at the same time by two needles, positioning is more difficult.

In order to solve such a problem and always position the center position of the needle with high accuracy even when the container is replaced or the needle size is changed, an attachment (holding means) conventionally adapted to the shape and size of the needle has been conventionally used. ) Was used to hold near the tip of the needle.

[0008]

However, in the technique using the attachment, not only is the structure of the device complicated and the cost increased because the attachment can be replaced, but it also suits each time the needle size is changed. It is necessary to replace it with a different attachment, which complicates the work.

For accurate positioning of the center position, electronic parts are mounted on the wiring board with high precision by a suction bit corresponding to a needle (hereinafter, the needle and the suction bit are collectively referred to as "working rod"). It is also a problem common to the mounting parts.

Therefore, an object of the present invention is to hold the position of a work rod attached to a working means such as a mounting portion for mounting an electronic component on a wiring board or a coating means for applying a coating material on the wiring board by a holding means. It is to provide a technique capable of highly accurate positioning without using it.

The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

[0012]

SUMMARY OF THE INVENTION Among the inventions disclosed in the present application, typical ones will be outlined as follows.

That is, the electronic component mounting apparatus of the present invention is
A mounting head on which a working means such as a mounting means for mounting an electronic component on a wiring board or a coating means for applying a coating material on a component mounting position on the wiring board is mounted, and the working means is driven horizontally and vertically. And a drive means for moving the component toward and away from a plurality of component mounting positions on the wiring board. Then, when the working means is relatively rotated about its central axis and relatively moved in the horizontal direction at a rotation angle difference of 90 °, the center positions in the respective moving directions of the work rods attached to the working means are calculated. A position calculating means for determining position data of the eccentricity amount and the phase of the work rod with respect to the central axis of the working means based on the calculated data is provided, and the tip of the work rod at the time of work is determined from the position data by the position calculating means. The drive means is operationally controlled by the control means so as to be located at the working position.

Further, a mounting head for mounting electronic parts on a wiring board and a working means such as a coating means for applying a coating material at a component mounting position on the wiring board, and a working head for horizontal and vertical directions. And driving means for driving it to move toward and away from a plurality of component mounting positions on the wiring board. Then, when the working means is relatively rotated around its central axis and relatively moved in the horizontal direction at a rotation angle difference of 90 °, the center positions of the working rods attached to the working means in the respective moving directions are calculated. At the same time, the working means is moved upward to calculate the tip position of the work rod, and based on the calculated data, the eccentric amount and phase of the work rod with respect to the central axis of the work means, and the tip position of the work rod in total 3 Position calculating means for obtaining one position data is provided, and the driving means is operation-controlled by the control means so that the tip of the work rod is positioned at the working position during the work based on the position data by the position calculating means.

In these electronic component mounting apparatuses, when the central axis of the working means is known, the position calculating means uses the central position of the working rod and the central axis of the working means in the two detected relative movement directions. When the eccentricity amount and the phase are calculated and the central axis of the working means is unknown, the central position of the working rod in the detected four relative movement directions and the central axis of the working means defined by the central position are used. The position calculating means calculates the amount of eccentricity and the phase.

Further, in these electronic component mounting apparatuses, when two work rods are attached to the working means, the working means can be rotated about its central axis by the rotating means, and the first means in the position calculating means. Relative movement of
It is performed in a moving direction that is perpendicular to the line connecting the two work rods.

According to such an electronic component mounting apparatus, since the eccentricity amount and phase of the work rod body, or in addition to this, the tip position is calculated and the drive means is controlled in operation, the work rod body mounting device is controlled. It is possible to position the tip with high accuracy.

[0018]

Embodiments of the present invention will be described below in detail with reference to the drawings.

FIG. 1 is a plan view showing an electronic component mounting apparatus according to an embodiment of the present invention, and FIG. 2 is a front view of FIG.

This electronic component mounting apparatus has two horizontal supporting members 1 and 2 arranged in parallel, and each horizontal supporting member 1 and 2 has guide rails 3 and 4 as shown in FIG.
Is attached. The crossbars 5 extending in the direction perpendicular to the horizontal support members 1 and 2 are attached to the guide rails 3 and 4 at both ends thereof, and guided by the guide rails 3 and 4 to extend along the horizontal support members 1 and 2. It is movable in the Y direction. A mounting head 6 is mounted on the crossbar 5 so as to be movable in a direction along the crossbar 5, that is, in the X direction.

In order to drive the crossbar 5 in the Y direction,
A ball screw 8 driven by an electric motor (driving means) 7 is rotatably attached to one of the horizontal support members 2, and the ball screw 8 is screwed to one end of the crossbar 5. The crossbar 5 is provided with an interlocking shaft 10 parallel to the crossbar 5.
The pinion gears 11 and 12 fixed to both ends of the gear mesh with the rack gears 13 and 14 fixed to the horizontal support members 1 and 2. Therefore, when the ball screw 8 is driven by the electric motor 7, the crossbar 5 moves the horizontal support member 1,
It moves in the Y direction while maintaining a predetermined squareness with respect to 2.

As shown in FIG. 2, the crossbar 5 is provided with a ball screw 15 screwed to the mounting head 6. The ball screw 15 is an electric motor (driving means) 1
6 drives the mounting head 6 to move in the X direction.

Below the horizontal support members 1 and 2, there are provided two guide members 21 and 22 extending in parallel to each other in a direction perpendicular to the horizontal support members 1 and 2. The guide members 21 and 22 form a conveyer for conveying the wiring board 20, convey the wiring board 20 in the X direction, and support it at a predetermined position.

A plurality of component stages 23 for holding electronic components W are provided on both sides of the conveyor formed by the guide members 21 and 22. In order to mount the electronic component on each component stage 23 on the wiring board 20, the mounting head 6 carries and mounts the electronic component W 2
A mounting portion (working means) 24 of the table and a dispenser, that is, a coating portion (working means) 25 for applying a coating material such as cream solder or an adhesive to the mounting position prior to mounting are provided.

As shown in FIG. 2, the coating section 25 has a needle (working rod) 26 for coating a coating material such as cream solder or adhesive, and the mounting section 24 also called a mounter slides vertically. It has a movable suction bit (working rod) 27.

In order to mount the electronic component W at a predetermined position on the wiring board 20, first, the application part 25 is moved to the solder application position (working position) with the needle 26 raised, and in this state, the needle 26 is moved. 26 is moved down to drop the coated material at the coating position. Then, the optional component stage 23
The electronic component W is sucked and mounted on the wiring board 20 at a predetermined position. When the electronic component W is sucked, the suction bit 27 is moved downward toward a predetermined component stage 23 to suck the electronic component W, and then the position of the coated material applied while moving the suction bit 27 upward, that is, the mounting position of the electronic component W. Move to (working position). At this position, the suction bit 27 is moved down to release the suction, so that the electronic component W is transferred to the wiring board 2
It is adhesively fixed at a predetermined position of 0.

FIG. 3 is an enlarged view of the coating section 25. A support base 30 is fixed to the main body section 6a which is slidably mounted along the crossbar 5. This support 30
A pair of guide rails 32 extending in the vertical direction is attached to the guide rail 32, and a lower slider 33 and an upper slider 34 are attached to the guide rail 32 slidably in the vertical direction. A compression coil spring 35 is provided between the bracket 35a fixed to the support base 30 and the lower slider 33 to urge the lower slider 33 upward with a spring force. A lower holder 36 is fixed to the lower slider 33. A retainer 39 having an annular portion is fixed to the upper slider 34, and a cylindrical upper holder 42 to which an annular driven gear 43 is fixed is rotatably assembled inside the retainer 39.

Syringe or container 4 containing the adherend
A needle 26 for discharging the coating material is attached to the tip portion of the small diameter 4 and is loaded in the holders 36 and 42 with the needle 26 facing downward. In the loaded state,
A pressure cap 46 that fits into an opening provided at the base end of the container 44 is fastened, and compressed into the container 44 via a pipe 47 for supplying pressurized air connected to the pressure cap 46. A pulse of air is supplied to discharge a predetermined amount of cream solder or adhesive from the needle 26.

A tie rod 49 fastened to a lower slider 33 extending downward from the retainer 39 is attached, and if the distance between the upper holder 42 and the lower holder 36 separated from each other is adjusted, the lengths are different. It is designed to support multiple types of containers.

In order to rotate the coating section 25 around its central axis, a drive gear shaft (not shown) is attached to the support base 30 and extends vertically and has a gear formed over its entire length. It is adapted to mesh with the driven gear 43 at any position in the direction. An electric motor (rotating means) 54 for rotating the drive gear shaft is attached to the support base 30. Therefore, when the electric motor 54 is driven, it is fastened to the upper holder 42 via the drive gear shaft and the driven gear 43. The coating unit 25 rotates. The support table 30 is provided with a sensor 57 for detecting the rotation angle of a drive gear (not shown), and the rotation angle of the coating unit 25 is detected by detecting the rotation angle of the drive gear.

An electric motor (driving means) 61 is fixed to the upper end of the support base 30 in order to drive the coating section 25 in the vertical direction. An upper holder 42 is connected to a timing belt driven by the electric motor 61 via a connecting member (not shown), and the coating unit 2 is moved by the upper holder 42 that is vertically moved according to the rotation direction of the timing belt.
5 is driven vertically. Although not shown, the mounting portion 24 is also provided with an electric motor that drives the mounting portion 24 in the vertical direction by a similar mechanism.

As shown in FIGS. 1 and 2, a position calculating section (position calculating means) 70 is installed in the vicinity of the component stage 23 of one horizontal support member 1.

As shown in detail in FIG. 4, the position calculating section 70 includes a detecting section 71 formed of a photoelectric switch, and a calculating section 72 for calculating predetermined position data based on the detection data of the detecting section 71. It is configured. The detection portion 71 is provided with a detection groove 71a through which the needle 26 and the suction bit 27 pass, and the detection portion 71 is provided on one inner wall of the detection groove 71a and is provided at a position opposite to the other inner wall. The light receiving unit 74 is irradiated with the beam L. Therefore, if the beam L blinks by the needle 26 (or the suction bit) passing through the detection groove 71a,
The center position in the moving direction is detected by the timing. Further, as shown in FIG. 5, if the center of the needle 26 is aligned with the center of the beam L and is raised, the beam L, which has been blocked until then, is received.
The tip position is detected by the timing.

The mounting position of the position calculating section 70 is not limited to the position shown in the figure, and can be set freely. Further, although the case where the position of the needle is detected is shown in FIGS. 4 and 5, the suction bit 27
Is similarly detected.

Such an electronic component detecting device is controlled by the control unit 75 shown in the block diagram of FIG. That is, the control unit 75 includes a position calculation unit 70 that calculates the positions of the needle and the suction bit, a RAM 76 and a ROM 77 that store predetermined processing / control procedures, component data, and the like.
Further, since the operation of the needle and the suction bit is controlled by the data of the position calculation unit 70, the RAM 76, and the ROM 77, the electric motors 16 and 7 for driving them in the X direction and the Y direction, that is, the horizontal direction, and the electric motor for driving them in the vertical direction. Motor 61, electric motor 5 rotating around the central axis
4 is electrically connected. Then, the tips of the needle 26 and the suction bit 27 are accurately positioned at the working position by the procedure described later.

Next, a procedure for applying the adherend to a predetermined position on the wiring board 20 by the applying section 25 of the electronic component mounting apparatus will be described.

The position of the needle 26 is detected before applying the adherend to a predetermined position on the wiring board 20. In addition,
The position is not detected every time the work is performed, but is performed when the position of the needle 26 changes, such as when the container 44 is replaced, or when necessary. This detection process is executed according to the flow shown in FIG.

That is, under the condition that the electric motor 61 is raised, the electric motors 7 and 16 move the crossbar 5 in the Y-axis direction and the mounting head 6 in the X-axis direction.
Is moved to the vicinity of the detection unit 71 including the photoelectric switch shown in FIG. 4 (S ₁ ).

After the electric motor 61 is driven to lower the coating portion 25 to a height where the tip of the needle 26 crosses the beam L of the photoelectric switch (S ₂ ), the needle 26 is passed through the detection groove 71a and the tip thereof is passed. Moves the coating part 25 in the horizontal direction so that the beam crosses the beam L of the photoelectric switch (S
₃ ). When the electric motors 7, 16 are servomotors, the needle 26 moves at this time based on the correlation between the blinking of the photoelectric switch and the encoder pulse of the electric motors 7, 16 moving in the coating section 25. The needle center position in the direction is calculated (S ₄ ). FIG. 8 shows the state at this time. FIG. 8 conceptually shows a moving state as viewed from above (or below). A large circle is the application portion 25, a cross is the central axis C of the application portion, and a small circle is the needle. 26 are shown respectively. FIG.
As shown in (a), when the reference line G drawn along the moving direction through the central axis C of the coating unit 25 is virtually regarded as the x-axis, it is detected by such movement. The center position of the needle 26 corresponds to the value of the x coordinate. In addition,
Other types of control motors such as stepping motors may be used as the electric motors 7 and 16 including the electric motors 54 and 61. In the case of the stepping motor, the correlation between the blinking of the photoelectric switch and the driving pulse is recognized. To be done.

When the above-mentioned movement is completed and the center position is obtained, the electric motor 54 is driven to move the coating portion 90 °.
Rotate about the central axis (S ₅ ). And needle 2
The coating part 25 is moved horizontally so that the tip of 6 crosses the beam L of the photoelectric switch (S ₆ ), and the needle center position in the moving direction in this case is similarly obtained (S ₇ ).
As shown in FIG. 8B, the center position obtained by this operation corresponds to the y-coordinate value.

In this embodiment, since the central axis C of the coating portion 25 is known (S ₈ ), the mutual rotation angle difference is 9
From the calculated data of the center position in two directions at 0 °, (x,
y) is confirmed, and as shown in FIG. 8C, the position data of the eccentricity r and the phase θ with respect to the central axis C is finally calculated by the calculation unit 7.
It is calculated by 2 (S ₉ ).

When the central axis C of the coating unit 25 is unknown (S ₈ ), the coating unit 25 is further rotated twice by 90 °, and the needle center position in the moving direction in each is calculated by the same procedure ( see FIG. 9 (a) ~ (d) ) (S 10).
As a result, as shown in FIG. 9E, the central axis C of the needle 26 is obtained from the intersection obtained by connecting the opposing central positions of the central positions of the needle 26 in the four movement directions. Position data of the eccentricity r and the phase θ with respect to C is calculated.

Next, as shown in FIG. 5, the needle 26
Is aligned with the center of the beam L of the photoelectric switch (S ₁₁ ), and the electric motor 61 is driven to raise the coating section 25 (S ₁₂ ). Then, the beam L that has been blocked until then is received by the light receiving unit 74, and the tip position p of the needle 26 is calculated from the correlation with the encoder pulse of the electric motor 61 at that time (S ₁₃ ). However, when the length of the needle 26 of the replaced container 44 is the same as that up to then, this tip position calculation process can be omitted.

In this way, the eccentricity r of the needle 26,
When the phase θ and the tip position p are calculated, the control unit 75 operates the operation programs of the electric motors 7, 16, 61 stored in the RAM 76 according to these values, that is, the X / Y operation of the coating unit 25. · correcting the Z-axis direction of the data (S _14).

After the above process is completed, the control unit 75 drives the electric motors 7 and 16 to move the coating unit 25 to the target coating position, and the electric motor 61 is driven to move it downward. . After the downward movement, the compressed air is supplied in a pulse form from the air pressure source into the container 44, and a predetermined amount of the adhered substance is applied to the surface to be coated of the wiring board 20 (S ₁₅ ).
At this time, as described above, the operation control of the electric motors 7, 16, 61 is performed according to the position data of the position calculation unit 70, and the tip of the needle 26 is accurately positioned. Accurately and the coating material is dripped. After the application is completed, the electric motor 61 is driven to move to the upper limit position.

When the solder is applied, a predetermined electronic component W is then conveyed and fixed to that portion, and the mounting portion 24 that performs this operation also has the suction bit 27 of the suction bit 27 as in the case of the needle 26. The position data is calculated, and the tip of the position data is accurately positioned.

That is, according to the flow shown in FIG. 7, the mounting portion 24 is moved to the vicinity of the photoelectric switch and lowered to a height where the tip of the suction bit 27 crosses the beam L so that the tip of the suction bit 27 crosses the beam L. Then, the mounting portion 24 is moved in the horizontal direction, and the center position of the suction bit 27 in the moving direction is calculated. Then, the mounting portion 24 is rotated about the central axis by 90 °, the center position in this moving direction is obtained, and the position data of the eccentricity r and the phase θ with respect to the central axis C of the mounting portion 24 are calculated.

Next, the mounting portion 24 is raised by aligning the center of the suction bit 27 with the center of the beam L, and its tip position p.
Is calculated.

Then, the control section 75 corrects the data in the X, Y, and Z axis directions for operating the mounting section 24 in accordance with the obtained eccentricity r, phase θ, and tip position p, and the mounting head 6 is shown in FIG. The mounting head 6 is moved to any one of the plurality of component stages 23 shown in the figure, and the mounting head 6 is moved until the mounting portion 24 on the suction bit side which has been positioned is directly above the specific component stage 23. Then, the electronic component W held on the component stage 23 is adsorbed, conveyed to the position of the solder already applied, the adsorption is released there, and the electronic component W is fixed to the wiring board 20.

As described above, since the tip of the suction bit 27 is accurately positioned when the component is mounted, the electronic component W is accurately fixed to the mounting position.

When an electronic component having a lead that is fixed to a socket portion provided on the wiring board 20 is mounted on the wiring board 20 and no solder or adhesive is used, the coating portion 25 is used. Without operating
Mounting work is performed only by the suction bit 27.

Here, the coating section 25 of the type having two needles 26a and 26b may be used.
Positioning in this case is performed as shown in FIG.

That is, the first movement is to move the two needles 26
This is performed in a moving direction that is perpendicular to the line connecting a and 26b (FIG. 10A). As a result, the two needles 26a,
The value of the x coordinate common to 26b is obtained. Therefore, in the flowchart shown in FIG. 7, before the coating section movement for the first center position calculated (S _3), the beam L the two needles 26a when crossed, 26b are overlapped, the apparent width The operation of driving the electric motor 54 to rotate the coating unit 25 is performed so that

Next, the coating section 25 is rotated about 90 ° about the central axis to move the coating section 25 in the horizontal direction so that the tips of the needles 26a and 26b cross the beam L of the photoelectric switch. By this movement, as shown in FIG. 10B, the value of the y coordinate corresponding to each needle 26a, 26b is obtained, and the needle 26a is obtained from (x, y ₁ ) and (x, y ₂ ).
Eccentricity r ₁ and phase θ ₁ , eccentricity r _{2 of} needle 26 _b
And the phase θ ₂ are calculated (FIG. 10C).

Although the invention made by the inventor has been specifically described based on the embodiment, the invention is not limited to the embodiment and can be variously modified without departing from the gist of the invention. Needless to say,

For example, in the present embodiment, the working rods such as the needles 26, 26a, 26b and the suction bit 27 are positioned by rotating the working means such as the coating section 25 and the mounting section 24 by 90 ° about the central axis. In addition, the working means is moved, but as shown in FIG.
The side of the detection unit 71 that detects the position may be rotated, or further, the side of the detection unit 71 may be moved. That is, the working means may be relatively rotated around its central axis and may be relatively moved.

In addition, the operation center position of the mounting head 6 and the actual center position of the mounting portion 24 and the coating portion 25 may not necessarily be concentric depending on the device. Therefore, the electronic component W is sucked onto the suction bit 27 at the time of product shipment, maintenance, etc.
The position data such as the amount of eccentricity and the phase is calculated by the same procedure as the above-described procedure for positioning the needle 26 through the beam L, and the deviation between the two is calculated, and the controller 75 is corrected to cancel the deviation. In addition, the above-described two center positions are completely coincident with each other, and it is possible to secure extremely good coating accuracy and mounting accuracy.

Further, the coating section 25 shown in the figure is adapted to move in the X-axis direction with respect to the crossbar 5 which moves in the Y-axis direction along the horizontal support members 1 and 2, and at any position in the plane direction. However, the application part 25 may be attached to the guide member so that it moves only in the linear direction.

The number of the mounting portions 24 attached to the mounting head 6 is not limited to two and can be any number.

[0060]

The effects obtained by the typical inventions among the inventions disclosed in the present application will be briefly described as follows.

(1). According to the electronic component mounting apparatus of the present invention,
Since the eccentricity amount and phase of the working rod body, or in addition to this, the tip position is calculated and the operation of the drive means is controlled by this, the tip of the working rod body can be positioned with high accuracy.

(2) As a result, it is possible to improve the mounting quality in the electronic component mounting apparatus without using a holding means for positioning the center position.

(3) Further, since it is not necessary to use the holding means, it is possible to prevent the apparatus structure from becoming complicated, and it is possible to eliminate the complexity of the work involved in exchanging the holding means.

[Brief description of drawings]

FIG. 1 is a plan view showing a schematic structure of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a front view of FIG.

FIG. 3 is an enlarged side view showing a coating section of the electronic component mounting apparatus shown in FIGS. 1 and 2.

FIG. 4 is a schematic diagram showing a position calculation unit of the electronic component mounting apparatus shown in FIGS. 1 and 2.

5A and 5B are explanatory diagrams showing a needle tip position detection operation in the position calculation unit of FIG.

6 is a block diagram showing a control mechanism of the electronic component mounting apparatus shown in FIGS. 1 and 2. FIG.

7 is a flowchart showing an execution procedure by the control mechanism of FIG.

FIG. 8 is an explanatory diagram showing a position data calculation mechanism by the position calculation unit when the central axis of the coating unit is known, and (a) and (b) show (c) the needle center position detection content in the moving direction. Indicates position data of the eccentricity amount and the phase obtained thereby.

FIG. 9 is an explanatory diagram showing a position data calculation mechanism by the position calculation unit when the central axis of the coating unit is unknown, in which (a) to (d) show the needle center position detection content in the moving direction, (e). Indicates position data of the eccentricity amount and the phase obtained thereby.

FIG. 10 is an explanatory view showing a position data calculation mechanism by a position calculation unit of a coating unit to which two needles are attached, and (a) and (b) show needle center position detection contents in the moving direction, ) Indicates position data of the eccentricity amount and the phase obtained thereby.

FIG. 11 is a perspective view showing the rotating operation of the rotatable detection unit.

[Explanation of symbols]

 1, 2 Horizontal support members 3, 4 Guide rails 5 Crossbar 6 Mounting head 6a Main body 7 Electric motor (driving means) 8 Ball screw 10 Interlocking shaft 11, 12 Pinion gear 13, 14 Rack gear 15 Ball screw 16 Electric motor (driving means) ) 20 wiring board 21 guide member 22 conveyor 23 parts stage 24 mounting section (working means) 25 coating section (working means) 26, 26a, 26b needle (working rod) 27 suction bit (working rod) 30 support 32 guide Rail 33 Lower slider 34 Upper slider 35 Compression coil spring 35a Bracket 36 Lower holder 39 Retainer 42 Upper holder 43 Driven gear 44 Container 46 Pressure cap 47 Piping 49 Tie rod 54 Electric motor (rotating means) 57 Sensor 61 Electric motor (drive) 70) Position calculation unit (position detection unit) 71 Detection unit 71a Detection groove 72 Calculation unit 73 Light emitting unit 74 Light receiving unit 75 Control unit (control means) 76 RAM 77 ROM C Central axis G Reference line L Beam W Electronic component

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Yoshikazu Maehara 6-5 Hososhima-cho, Hamamatsu-shi, Shizuoka 2nd floor of Hayashi Kyosai Building Technocapa Mechatronics Center Co., Ltd.

Claims (4)

[Claims] 1. A mounting head having mounting means for mounting an electronic component on a wiring board and a coating means for coating a coating material at a component mounting position on the wiring board. Driving means for driving in the up and down direction to move the working means toward and away from a plurality of component mounting positions on the wiring board, and for rotating the working means relative to its central axis relative to the horizontal direction at a rotation angle difference of 90 °. When moved, the center position in each moving direction of the work rod attached to this working means is calculated, and the eccentricity and phase of the work rod with respect to the central axis of the working means are calculated based on the calculated data. From the position calculating means for obtaining the position data and the position data by the position calculating means, the driving hand is moved so that the tip of the working rod is located at the working position during working. An electronic component mounting apparatus characterized by a control means controls the operation of. 2. A mounting head on which a working means such as a mounting means for mounting an electronic component on a wiring board or a coating means for applying a coating material on a component mounting position of the wiring board is mounted, and the working means is arranged in a horizontal direction. Driving means for driving in the up and down direction to move the working means toward and away from a plurality of component mounting positions on the wiring board, and for rotating the working means relative to its central axis relative to the horizontal direction at a rotation angle difference of 90 °. When moved, the center position in each moving direction of the work rod attached to this work means is calculated, and the work means is moved up to calculate the tip position of the work rod, and this calculated data is used. Position calculating means for obtaining a total of three position data based on the eccentric amount and phase of the working rod with respect to the central axis of the working means, and the tip position of the working rod. From the position data by the serial position calculating means, the electronic component mounting apparatus characterized by a control means controlling the operation of said driving means such that the tip of the working rod is positioned in the working position during operation. 3. The electronic component mounting apparatus according to claim 1, wherein when the central axis of the working means is known, the detected 2
The eccentricity amount and the phase are calculated by the position calculating means by the central position of the working rod and the central axis of the working means in one relative movement direction, and when the central axis of the working means is unknown, it is detected. Four
An electronic component mounting apparatus characterized in that the eccentricity amount and the phase are calculated by the position calculating means by the center position of the work rod in one relative movement direction and the center axis of the working means defined by the center position. . 4. The electronic component mounting apparatus according to claim 1, 2 or 3, wherein the working means is rotatable about a central axis thereof by a rotating means, and two working rods are attached to the working means. The electronic component mounting apparatus is characterized in that the first relative movement in the position calculating means is performed in a movement direction that is perpendicular to a line connecting the two work rods.