JPH09219316A - Wire wheel component and manufacturing method thereof - Google Patents

Abstract

(57) Abstract: An EE type or an EI type coil block is made of a multilayer board having a coil pattern formed of a copper foil or a copper plate.
Regarding the wire wheel component with the mold core attached and its manufacturing method,
We aim to streamline the manufacturing process by reducing the thickness and size of the wire wheel components, improving reliability. SOLUTION: In a wire wheel component constituted by leading out a terminal portion of a coil pattern 31 to one or both of side end faces of the coil block 22 which are not covered with the core 21, the coil component is covered with the core 21 of the coil block 22. On both sides of the lower surface portion which is not formed, the protruding portions 23 formed by the dummy substrate 33 protruding downward from the lower surface of the core 21 are provided, and the terminal portion 45 is provided.
Is characterized in that the electrode 24 is formed by strip-shaped metal plating in the thickness direction of the multilayer substrate including the projecting portion 23 of the portion where is drawn out.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wire ring component such as a transformer and a choke coil which is mounted on a printed wiring board by surface mounting or the like, and a method for manufacturing the same, and in particular, a coil pattern made of copper foil is formed on a laminated substrate. The present invention relates to a small wire wheel component having a coil block and a method for manufacturing the same.

[0002]

2. Description of the Related Art Conventionally, electronic circuit devices using printed wiring boards have been widely put into practical use in response to demands for downsizing, thinning, and cost reduction. In addition, various printed wiring boards have been developed in order to achieve high density, high functionality, and high reliability, and the progress is remarkable. As this printed wiring board, for example, a paper-based copper-clad laminate, a glass-based copper-clad laminate, an aluminum-based copper-clad laminate, a ceramic-based printed board, etc. are used. The stretched laminated board is often used mainly in digital circuits of OA equipment. Therefore, the current flowing through the wiring is a minute current as a digital signal, and further thinning and high density of the copper foil are being studied.

As a component mounted on a printed wiring board,
In addition to active and passive elements such as semiconductor parts, resistors and capacitors, there is a demand for miniaturization and thinning of wire ring parts such as transformers, choke coils and inductors. As the conventional most general structure of this coil component, as shown in a sectional view in FIG. 6, a conductive wire is wound around a resin bopin 1 to form a winding wire 2, and a core 3 is fitted from above and below. It is a plug-in type. The bobbin 1 is provided with a wiring lead terminal 4 to which the lead wire of the winding 2 is connected.

Recently, there has also been used a wire wheel component using a coil block in which a coil pattern is formed on a glass base material or the like with a copper foil and laminated to form a multilayer substrate. As with the printed wiring board, this coil block can be produced in a large number to improve productivity, and a bobbinless wire wheel component can be obtained to rationalize the manufacturing process. In this coil component, the coil block 6 is inserted into the ferrite core 5 as shown in FIG.
A pin-shaped pin terminal 7 is solder-connected to the side edge of the sheet, which is a very thin wire ring component called a sheet transformer.
This is an effective shape for a low-profile electronic circuit device. Also, instead of the above-mentioned pin terminal 7, there is also one in which a metallized electrode 8 is provided on the side end surface of the coil block 6 as shown in FIG.

Details of the wire wheel component will be described with reference to FIGS. FIG. 7A is a perspective view showing a completed state of assembly, and FIG. 7B is a perspective view of an intermediate stage of assembly (the pin terminal 7 is omitted). As shown in a cross-sectional view in FIG. 9, the coil block 6 is formed by forming a coil pattern 10 made of copper foil as shown in FIG. 10 on both sides of a base substrate 9 made of, for example, a glass base material by an etching method. The patterns 10 are connected to each other by through holes 11 which are plated as necessary, and a plurality of the base substrates 9 are formed by an insulating sheet adhesive 12 made of the same material as the base substrate 9, for example. It is formed by laminating and press-bonding sheets. Reference numeral 16 is a fitting hole for the pin terminal 7.

A hollow portion 13 is provided at the center of the coil block 6, and the central leg 14 of the EE type core 5 is inserted into the hollow portion 13, and the outer legs 15 on both sides of the central leg 14 are provided on the coil block 6. They are united with each other on the outside and integrated with the coil block 6. The side edges or side end surfaces of the coil block 6 which are not covered with the core 5 are shown in FIG.
As shown in FIG. 8A and the perspective view of FIG.
1 and the terminal portion of the coil pattern 10 formed in FIG.
1, a plurality of pin terminals 7 or metallized electrodes 8 for mounting the connection to the printed wiring board 17 shown in FIG. 12 are provided and configured as a coil component. In this prior art example, the core 5 uses the EE type, but it goes without saying that an EI type core can also be used.

[0007]

However, the wire loop component using the coil block 6 made of the copper foil or the copper clad laminated plate such as the conventional glass substrate described above is surface-mounted on the printed wiring board 17 by the solder 18. In this case, as shown in FIG. 11, in the case of the coil component in which the terminal electrode is the pin terminal 7, the coil block 6 must be provided with a terminal fitting hole and the pin terminal 7 must be fitted and fixed. Since the work is complicated, and the number of connecting points increases and the current passes through different materials, there is a problem in circuit characteristics such as conduction loss when used under a relatively large current (5 A or more). Further, since the pin terminal 7 is inserted, the fitting hole has a certain hole diameter from the viewpoint of strength, and it is necessary to provide a certain distance from the side end of the coil block 6 to the inner side. It had the drawback of increasing the size.

Further, when the terminal electrode is the metallized electrode 8, as shown in FIG. 12, the printed wiring board 17 to be mounted must be provided with a hole 19 into which the core 5 is dropped. There are problems that the circuit pattern design is restricted and the printed wiring board 17 is enlarged. The present invention provides a wire wheel component and a method for manufacturing the same that can solve these problems while being a surface mount type.

[0009]

The coil component according to the present invention comprises a multilayer board having a coil pattern formed of a copper plate or copper foil, a coil block having a hollow portion in the center thereof, and both sides of the coil block. The coil of the coil block on one or both of the EE-type or EI-type core provided between the hollow portion and both sides thereof and the side end surface of the coil block which is not covered by the core. In the wire wheel component configured so that the terminal portion of the pattern is led out, on both sides of the lower surface portion of the coil block which is not covered by the core, protruding portions by a dummy substrate protruding below the lower surface of the core are provided. A strip-shaped metal-plated electrode is formed in the thickness direction of the multilayer substrate that is provided and includes the protruding portion of the portion where the terminal portion of the coil pattern is led out. Those which are.

In the method for manufacturing a wire wheel component according to the present invention, a collective coil pattern having a plurality of identical coil patterns formed of a copper plate or copper foil, and a collective coil pattern of the same type or a different type from the collective coil pattern are provided. Each of the coil patterns of the unit coil block is formed by stacking the substrates through the substrate and stacking the dummy substrates to form a multi-piece coil block assembly substrate and dividing the coil block assembly substrate into unit coil blocks. A terminal forming hole is provided by router processing or the like so that the terminal portion of the coil pattern is exposed on the side end surface, and the strip-shaped metal is formed in the thickness direction including the terminal portion of each coil pattern exposed on the side end surface of the terminal forming hole. After forming the metallized electrode by plating, by router processing etc., the approximate center of each coil pattern of the coil block assembly substrate In order to form a hollow portion into which the central leg of the core is inserted, and to scrape off the dummy substrate while leaving the protruding portion for mounting the wiring substrate, the coil block aggregate substrate is formed into a unit coil block by router processing or the like. The divided portions are cut into a single coil block, and an EE type or EI type core is attached and fixed to the coil block.

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described based on the embodiments shown in FIGS. FIG. 1 shows the entire structure of a wire wheel component and the structure of a coil block according to the present invention.
FIG. 1A is a perspective view of a wire wheel component, FIG. 1B is a perspective view of an intermediate stage of assembly, and FIG. 1C is a perspective view of a coil block viewed from below. In this embodiment, the EI type cores 21a, 21 are
b is fixed by sandwiching it from both sides of the coil block 22 according to the present invention.
The protrusions 23 are provided on both sides of the surface on the lower surface side into which the mold core 21a is inserted, the surface facing the core 21a. The protrusion 23 is made thicker than the thickness of the portion of the core 21a that contacts the lower surface of the coil block 22, and the lower surface of the protrusion 23 is the core 21a in the state of the coil component shown in FIG.
It is designed to stick out from the bottom surface of the.

On both side surfaces of the coil block 22 which are not covered by the core 21a, terminal portions connected to a plurality of coil patterns of the same type or different types laminated in the coil block 22 and a printed wiring. Board 1
A metallized electrode 24 is provided as a fixed terminal for connecting to 7. In addition, 25 is a central leg of the core 21a, 26 is a hollow portion of the coil block 22 into which the central leg 25 is inserted, 2
Reference numeral 7 denotes a solder connection portion of the printed wiring board 17 to the circuit pattern 28. As shown in FIGS. 2A and 3, the coil block 22 is formed by stacking a coil pattern 31 formed of a copper plate on a substrate 32 such as a glass base material and adhering and fixing the coil pattern 31, or by insulating the substrate 32 with an insulating material. The sheet-like adhesive is laminated and pressure-bonded. At this time, the dummy substrates 33 for forming the protrusions 23 shown in FIG.
After forming the coil block before processing shown in (b), the core 2
The surface that contacts the upper surface of 1a, that is, the portion shown by the chain line in FIG. 3 is scraped off by a router or the like so that the protruding portion 23 is formed. The depth of this scraped-off portion is made deeper than the thickness of the core 21a so that the lower surface of the projecting portion 23 projects from the lower surface of the core 21a. The dummy substrate 33 may be made of the same material as the substrate 32 or a different material.

In the above example, a copper plate is used for the coil pattern 31 of the coil block 22. However, as shown in the conventional example, a coil pattern of copper foil is formed on a base substrate such as a glass base material. Of course, the present invention can also be applied to the coil block 6 in which the base substrates are laminated with an insulating sheet adhesive between them. FIG.
The EI in the coil block 22 configured in this way.
FIG. 4A is a side sectional view and FIG. 4B is a perspective view showing a state in which the cores 21a and 21b of the mold are mounted to form a coil component and surface-mounted on the printed wiring board 17. is there. As shown in FIG. 4, the protrusion 21 formed by the dummy substrate 33 causes the core 21a to move to the printed wiring board 1.
Since it can be mounted in a state of being lifted above 7, there is no need to provide the holes 19 as in the conventional example, and there is no restriction to use a special one for the mounting wiring board. In addition, since the circuit pattern can be directly connected to the circuit pattern through the internal coil pattern 31 and the metallized metallized electrode 24, the number of connection points can be reduced and conduction loss can be reduced.

Next, an example of the manufacturing process of the wire wheel component of the present invention will be described. As shown in FIG. 5A, a collective coil pattern 41 in which a plurality of the same coil patterns 31 are formed is manufactured by etching a copper plate in advance or pressing with a die. The collective coil pattern 41 is provided with a connecting portion 42 so that the coil patterns 31 are not separated. Next, a required number of insulating sheet adhesives to serve as the substrate 32 are sandwiched between the same or different kinds of aggregate coil patterns 41, and a predetermined number of sheets are laminated. Figure 2 (a)
Alternatively, as shown in FIG. 3, the dummy substrate 33 is laminated on the lower surface side in contact with the printed wiring board 17 by a thickness corresponding to the height of the protruding portion 23.

A coil block aggregate substrate (not shown) is obtained by aligning the plurality of aggregate coil patterns 41 with the substrate 32 and the dummy substrate 33, pressurizing them, and integrating them. At the time of this integration, since the space between the aggregate coil patterns 41 is surely filled with the sheet-like adhesive, the amount, material and the like are taken into consideration. For example, it may be necessary to increase the resin content of the sheet-like adhesive to fill the step difference of the pattern or to supply only the resin component in advance by another method. Further, in the above-described embodiment, an example in which a copper plate is used as the coil pattern 22 has been described. However, a substrate on which a coil pattern of copper foil is printed is sandwiched with a sheet adhesive, and a dummy substrate 33 is laminated to form a coil block assembly substrate. May be manufactured as.

Next, the coil block aggregate substrate is processed by a router or the like as shown in FIG. 5 (b). First, the terminal forming hole 44 is provided so that the terminal portion 45 of the coil pattern 31 is exposed at the side end surface thereof when cut into the unit coil block 22 surrounded by the division lines 46 and 47 indicated by chain lines. Next, the metallized electrode 24, which includes the terminal portion 45 of the coil pattern exposed on the side end surface of the coil block assembly substrate 43 and is band-shaped metal-plated in the thickness direction thereof.
(Shown in FIG. 4). At this time, the solder connection portion 27 to the circuit pattern 28 is provided on the mounting surface of the printed wiring board 17 of the protrusion 23, and the printed wiring is used as the L-shaped or U-shaped metallized electrode 24 including this portion. The mounting on the substrate 17 may be ensured.

Next, a hollow portion 26 (FIG. 5) into which the central leg 25 of the core 21a is inserted is formed substantially in the center of each coil pattern 31.
(Indicated by a chain line in (b)). Further, the coil block aggregate substrate 43 is manufactured by scraping off the protrusions 23 of the dummy substrate 33 which are mounted on the printed wiring board 17. Next, the coil block aggregate substrate 43 is cut by dividing lines 46 and 47 by router processing or the like to form a single coil block 22, and then the EI type core 21 is mounted so that the metallized electrode 24 is exposed on the side surface. It is fixed and used as a wheel part.

[0018]

As described above, in the wire ring component of the present invention, the protrusions of the laminated substrate are formed on the lower surface of the coil block so that the lower surface of the EE or EI type core is lifted above the printed wiring board surface. Therefore, it is possible to obtain a surface-mounting type wire ring component that does not impose restrictions on the printed wiring board. In addition, the terminal part of the coil pattern is led out to the end surface of the coil block, and the metallized electrode including this terminal part and plated in the thickness direction of the coil block can be directly soldered to this metallized electrode, so it is thin. A relatively large current (5A or more)
Reduces conduction loss when used underneath and downsizes
It is possible to reduce the thickness at the same time. In addition, the formation of the protrusions of the coil block described above is performed before the dummy substrate is stacked together with the stacking of the collective coil pattern and the substrate when the multi-cavity collective substrate is manufactured, before being divided into individual coil blocks. Since the dummy substrate is partially scraped off, the automation of the manufacturing process is promoted and the cost can be reduced.

[Brief description of drawings]

FIG. 1 is a structural diagram of a wire wheel component according to the present invention.

FIG. 2 is a perspective view illustrating a configuration of a coil block according to the present invention.

FIG. 3 is a side view illustrating a configuration of a coil block according to the present invention.

FIG. 4 is a side sectional view and a perspective view showing a state in which the wire wheel component according to the present invention is mounted on a printed wiring board.

FIG. 5 is a plan view of a collective coil pattern and a coil block collective substrate of the wire wheel component of the present invention.

FIG. 6 is a structural diagram showing an example of a conventional wire wheel component.

FIG. 7 is a structural diagram showing an example of a wire wheel component using a conventional coil block.

FIG. 8 is a structural diagram showing another example of a wire wheel component using a conventional coil block.

FIG. 9 is a cross-sectional view illustrating the structure of a conventional coil block.

FIG. 10 is a top view showing an example of a coil pattern.

FIG. 11 is a side view showing a state where a coil component using a conventional coil block is mounted on a printed wiring board.

FIG. 12 is a side view showing a state in which another coil component using a conventional coil block is mounted on a printed wiring board.

[Explanation of symbols]

 1 bobbin 2 winding 3 core 4 lead terminal 5 EE type core 6,22 coil block 7 pin terminal 8,24 metallized electrode 9 base substrate 10 coil pattern with copper foil 11 through hole 12 insulating sheet adhesive 13,26 Hollow part 14,25 Central leg 15 Outer leg 16 Terminal insertion hole 17 Printed wiring board 21 EI type core 23 Projection part 27 Solder connection part 28 Circuit pattern 31 Coil pattern with copper plate 32 Board 33 Dummy board 41 Collected coil pattern 42 Collected coil pattern Connecting part 43 Coil block assembly substrate 44 Terminal forming hole 45 Terminal part 46, 47 Dividing line

Claims (2)

[Claims] 1. A coil block comprising a multilayer board having a coil pattern formed of a copper plate or a copper foil and having a hollow portion in the center thereof, and the hollow portion and both sides thereof so as to be sandwiched from both sides of the coil block. It is configured such that the terminal portion of the coil pattern of the coil block is led out to one or both of the EE type or EI type core provided between the core block and the side end surface of the coil block which is not covered by the core. In the wire ring component, on both sides of the lower surface portion of the coil block which is not covered by the core, protrusions by dummy substrates protruding below the lower surface of the core are provided, and the terminal portion of the coil pattern is led out. A wire wheel component, wherein strip-shaped metal-plated electrodes are formed in the thickness direction of the multilayer substrate including the projecting portions in the formed portions. 2. An aggregate coil pattern having a plurality of coil patterns and an aggregate coil pattern of the same type or different type as the aggregate coil pattern are laminated, and
When a dummy substrate is laminated to create a multi-piece coil block aggregate substrate and the coil block aggregate substrate is divided into unit coil blocks, the terminal portions of the coil patterns of the unit coil block are arranged on the side end faces thereof. A terminal forming hole is formed by router processing or the like so as to be exposed, and a metallized electrode including a terminal portion of each of the coil patterns exposed on a side end surface of the terminal forming hole and having a strip-shaped metal plating in a thickness direction thereof is formed. After that, by router processing etc., a hollow part for inserting the central leg of the core is provided at approximately the center part of each coil pattern of the coil block assembly board, and the projection part for mounting the wiring board of the dummy board is left and scraped off. , The coil block aggregate substrate is cut by a router process or the like so as to cut a divided portion for forming a unit coil block, and a single coil is formed. A method for manufacturing a wire wheel component, which comprises forming a block and mounting and fixing an EE type or EI type core on the coil block.