JPH0922841A - Component holder used for forming outer electrode of electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a component holder which is used for forming the outer electrodes of electronic components and with which the outer electrodes can be formed while a plurality of types of chip components which have different dimensions are selectively held. SOLUTION: The necessary number of holding holes 3a-3c which have different diameters corresponding to the respective three types of chip components having different dimensions are formed. Therefore, three types of the chip components having different dimensions can be selectively held by one component holder 1 to form outer electrodes. It is not necessary to prepare exclusive component holders for the respective component types and replace them to use them like with the prior art constitution.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component holder used when forming external electrodes on a chip-shaped electronic component.

[0002]

2. Description of the Related Art FIG. 5 shows a conventional component holder used for forming external electrodes. The component holder 31 includes a rectangular rigid plate 32 made of metal or the like and an elastic material 33 made of rubber or the like.

As shown in the cross section of FIG.
Includes a frame portion 32a having a rectangular outer shape and a thin portion 32b integrally formed inside the frame portion 32a, and a predetermined arrangement of through holes 32c having a diameter larger than a holding hole 33a described later in the thin portion 32b (FIG. In the example shown, there are a large number of 7 × 7 two-dimensional arrays.

The elastic member 33 is provided so as to cover the upper and lower surfaces of the thin portion 32b and the inside of the through hole 32, and
A holding hole 33 smaller than the through hole 32c at the center position of c
a is concentric. The thickness of the elastic material 33 on the upper and lower surfaces of the thin portion 32b matches the step between the frame portion 32a and the thin portion 32b, and the upper and lower surfaces of the elastic material 33 and the frame portion 32b.
It is flush with the upper and lower surfaces of a. Further, the size (cross-sectional shape) of the holding hole 33a is slightly smaller than the cross-sectional shape of the chip component to be held, and the cylindrical or quadrangular column-shaped chip component pushed in the holding hole 33a in the longitudinal direction has a hole inner wall. Is held elastically by.

Now, a method of forming external electrodes which is carried out by using the above-mentioned component holder 31 will be described with reference to FIG.

First, as shown in FIG. 7A, the elastic material 3
The chip component C is pushed into each holding hole 33a from one surface side of No. 3, the chip component C is moved in the holding hole 33a, and one end of the chip component C is projected from the other surface side of the elastic material 33. A guide plate 41 and a push pin 42 as shown in FIG. The guide plate 41 is formed with a temporary holding hole 41a having a taper, and the chip component C is inserted into the temporary holding hole 41a at another position in the longitudinal direction. The chip component C held in the temporary holding hole 41a is pushed into the holding hole 33a of the component holder 31 by the push pin 42 descending from above.

Next, as shown in FIG. 7B, the component holder 31 is lowered toward the base plate 43 on which the electrode paste P is applied with a constant thickness, or toward the component holder 31. The base plate 43 is raised, and the protruding ends of all the chip components C are pressed against the base plate 43 to attach the electrode paste P to the protruding ends.

Next, as shown in FIG. 7C, the component holder 31 is raised from the pressing position or the base plate 43 is lowered to show the chip component C after the paste is attached together with the component holder 31. Put into a heating furnace (omitted) and attach paste P '
Is dried.

After that, the chip component C after the paste is dried
Of the elastic member 3 by moving the other end of the elastic member 3 in the holding hole 33a.
3 is projected from one surface side, and the same paste attachment and paste drying as described above are performed, and then the chip component C is extracted from the holding hole 33a of the component holder 31.

[0010]

In the conventional component holder described above, the size of the holding hole is set in accordance with the size of the chip component so that one type of chip component can be held by the number of holes. That is, since one component holder can basically hold only one type of chip component, in order to perform external electrode formation for a chip component having a different size from this, a size corresponding to the chip component is required. It is necessary to separately provide a component holder having the holding hole of No. 3, and it is necessary to replace the component holder for each target chip component.

The present invention has been made in view of the above problems, and an object of the present invention is to selectively hold a plurality of types of chip components having different sizes to form an external electrode.
An object is to provide a component holder used for forming external electrodes of electronic components.

[0012]

In order to achieve the above object, the invention of claim 1 forms an external electrode of an electronic component, which is provided with a large number of holding holes capable of elastically holding a chip component in a predetermined direction. The component holder used is characterized in that holding holes of different sizes corresponding to a plurality of types of chip components having different sizes are formed in a predetermined number on the same surface.

According to a second aspect of the invention, in the component holder according to the first aspect, the holding holes are arranged in the same pattern.
It is characterized by:

[0014]

According to the first aspect of the present invention, since holding holes of different sizes corresponding to a plurality of types of chip parts having different sizes are formed on the same surface in a predetermined number, the size of one part holder is different. It is possible to selectively hold a plurality of types of chip components.

According to the second aspect of the present invention, since the arrangement patterns of the holding holes are made to coincide with each other, one pushing jig is shared to push the components into the holding holes and move the components within the holding holes. You can Other functions are similar to those of the invention of claim 1.

[0016]

【Example】

[First Embodiment] FIG. 1 is a top view of a component holder showing a first embodiment of the present invention, and FIG. 2 is an enlarged sectional view taken along the line AA. The component holder 1 of the present embodiment is composed of a rectangular rigid plate 2 made of metal or the like and an elastic material 3 made of rubber or the like.

The rigid plate 2 includes a frame portion 2a having a rectangular outer shape and a thin portion 2b integrally formed inside the frame portion 2a, and the thin portion 2b has first to third holding holes 3a to 3a to be described later. The first to third through holes 2c to 2e each having a diameter larger than that of
There are 49 2 × 7 two-dimensional arrays.

The elastic member 3 is provided so as to cover the upper and lower surfaces of the thin portion 2b and the inside of each through hole, and the first to third members are provided.
First to third holding holes 3a to 3c, which are smaller than the respective through holes, are concentrically provided at the center positions of the respective through holes 2c to 2e. The thickness of the elastic material 3 on the upper and lower surfaces of the thin portion 2b matches the step between the frame portion 2a and the thin portion 2b, and the upper and lower surfaces of the elastic material 3 and the upper and lower surfaces of the frame portion 2a are flush with each other. is there. Also, the size (cross-sectional shape) of the first to third holding holes 3a to 3c
Is slightly smaller than the cross-sectional shape of the chip components C1 to C3 to be held, and the columnar or quadrangular prismatic chip components C1 to C3 pushed in the respective holding holes 3a to 3c in the longitudinal direction are elastically moved by the hole inner wall. Retained.

The first holding hole 3a (first through hole 2c)
Center spacing Xa in the X direction, center spacing Xb in the X direction of the second holding holes 3b (second through holes 2d), and third holding hole 3c.
The center interval Xc of the (third through hole 2e) in the X direction is Xa =
Xb = Xc, and the center distance Ya of the first holding hole 3a (first through hole 2c) in the Y direction and the second holding hole 3b.
The Y-direction center distance Yb of the (second through hole 2d) and the Y-direction center distance Yc of the third holding hole 3c (third through hole 2e) have a relationship of Ya = Yb = Yc. Further, the center intervals Xa, Xb, Xc in the X direction and the center intervals Ya in the Y direction,
Yb and Yc are Xa = Ya, Xb = Yb, Xc =, respectively.
It has a relationship of Yc.

When the external electrode is formed on the chip component C1, the corresponding first holding hole 3a is formed, and when the external electrode is formed on the chip component C2, the corresponding second holding hole 3a is formed.
When the holding holes 3b further form external electrodes on the chip component C3, the corresponding third holding holes 3c are selectively used.

When the chip parts are pushed into the holding holes, the pushing jig having seven pushing pins is arranged at the same center interval as the center interval in the X direction or the center interval in the Y direction. Using a guide plate with 7 temporary holding holes,
The chip components held in the temporary holding holes of the guide plate are pushed into the holding holes in units of rows in the X direction or the Y direction. A similar pressing jig is also used when moving the chip component after the paste is dried in the holding hole. The procedure for attaching the paste to the end of the chip component and drying the paste is the same as the conventional procedure, and therefore the description thereof is omitted here.

According to the component holder 1 of this embodiment, the holding holes 3a to 3c of different sizes corresponding to the three types of chip components C1 to C3 having different sizes are formed on the same surface in a predetermined number. Therefore, it is possible to selectively hold three types of chip components C1 to C3 having different sizes by one component holder 1 to form an external electrode, and to provide a dedicated component holder for each component type as in the conventional case. There is no need to prepare and use it while exchanging it.

Further, since the holding holes 3a to 3c are arranged in the same arrangement pattern, one pushing jig can be shared to push the components into the holding holes and move the components within the holding holes. There is no need to prepare a pushing jig for each pattern and use it while exchanging it.

In the above embodiment, the X-direction center distance and the Y-direction center distance in each holding hole are made equal, but the center distance in either X or Y direction may be made equal. For example, one pushing jig can be shared to push and move parts. Further, although the case where the chip component is pushed into the holding hole in the longitudinal direction is illustrated, the chip component may be pushed and held in another direction.

[Second Embodiment] FIG. 3 is a partial top view of a component holder showing a second embodiment of the present invention. The component holder 11 of this embodiment is a strip-shaped elastic body 1 made of rubber or the like.
An array in which seven first to third holding holes 12a to 12c corresponding to the respective chip components C1 to C3 shown in FIG. 2 are arranged at equal intervals in the Y direction and arranged at equal intervals in the X direction. Have.

Similar to the first embodiment, the center spacing Ya of the first holding holes 12a in the Y direction, the center spacing Yb of the second holding holes 12b in the Y direction, and the center spacing of the third holding holes 12c in the Y direction. Yc has a relation of Ya = Yb = Yc, and the center interval Xa of the first holding hole 12a in the X direction and the second holding hole 12b.
The center interval Xb in the X direction and the center interval Xc in the X direction of the third holding holes 12c have a relationship of Xa = Xb = Xc. Further, the center intervals Ya, Yb, Yc in the Y direction and the center intervals Xa, Xb, Xc in the X direction are Xa = Ya, X, respectively.
There is a relationship of b = Yb and Xc = Yc.

Also in the component holder 11 of this embodiment, one component holder 11 has three kinds of chip components C1 to C1 having different sizes.
External electrodes can be formed by selectively holding C3, and the same effect as that of the first embodiment can be obtained.

In the above embodiment, the center distance in the X direction and the center distance in the Y direction in each holding hole are made equal, but the center distance in any one of the X and Y directions may be the same. For example, one pushing jig can be shared to push and move parts. Further, although the case where the chip component is pushed into the holding hole in the longitudinal direction is illustrated, the chip component may be pushed and held in another direction.

[Third Embodiment] FIG. 4 is a partial top view of a component holder showing a third embodiment of the present invention. The component holder 21 of the present embodiment includes a thin strip-shaped rigid plate 22 made of metal or the like and an elastic body 23 made of rubber or the like.

The rigid plate 22 has flexibility by itself, and has elongated holes (not shown) into which the elastic body 23 can be fitted, at equal intervals in the X direction.

The elastic body 23 has a groove (not shown) which can be engaged with the opening edge of the elongated hole, and is fitted into each elongated hole of the rigid plate 22 by the groove engagement. Further, the first to third parts corresponding to the respective chip components C1 to C3 shown in FIG.
Seven holding holes 23a to 23c are provided at equal intervals in the Y direction.

Similar to the first embodiment, the center spacing Ya of the first holding holes 23a in the Y direction, the center spacing Yb of the second holding holes 23b in the Y direction, and the center spacing of the third holding holes 23c in the Y direction. Yc has a relation of Ya = Yb = Yc, and the center interval Xa of the first holding hole 23a in the X direction and the second holding hole 23b.
The center distance Xb in the X direction and the center distance Xc in the X direction of the third holding holes 23c have a relationship of Xa = Xb = Xc. Further, the center intervals Ya, Yb, Yc in the Y direction and the center intervals Xa, Xb, Xc in the X direction are Xa = Ya, X, respectively.
There is a relationship of b = Yb and Xc = Yc.

Also in the component holder 21 of this embodiment, one component holder 21 has three types of chip components C1 to C3 having different sizes.
External electrodes can be formed by selectively holding C3, and the same effect as that of the first embodiment can be obtained.

In the above embodiment, the center distance in the X direction and the center distance in the Y direction in each holding hole are made equal, but the center distance in any one of the X and Y directions may be the same. For example, one pushing jig can be shared to push and move parts. Further, although the case where the chip component is pushed into the holding hole in the longitudinal direction is illustrated, the chip component may be pushed and held in another direction.

[0035]

As described in detail above, according to the first aspect of the present invention, one component holder can selectively hold a plurality of types of chip components having different sizes to form the external electrodes. There is no need to prepare a dedicated component holder for each component type and use it while exchanging it as in the conventional case.

According to the second aspect of the invention, one pushing jig can be shared to push the components into the holding holes and move the components within the holding holes. Moreover, there is no need to use it while exchanging it. Other effects are the same as those of the first aspect.

[Brief description of drawings]

FIG. 1 is a top view of a component holder showing a first embodiment of the present invention.

FIG. 2 is an enlarged sectional view taken along line AA of FIG. 1;

FIG. 3 is a partial top view of a component holder showing a second embodiment of the present invention.

FIG. 4 is a partial top view of a component holder showing a third embodiment of the present invention.

FIG. 5 is a perspective view of a conventional component holder.

6 is a sectional view of the component holder shown in FIG.

FIG. 7 is a diagram showing a method of forming external electrodes using a component holder.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Component holder, 2 ... Rigid plate, 2a ... Frame part, 2b ... Thin part, 2c, 2d, 2e ... Through hole, 3 ... Elastic material, 3a, 3
b, 3c ... Retaining holes, C1, C2, C3 ... Chip parts, 1
DESCRIPTION OF SYMBOLS 1 ... Component holder, 12 ... Elastic plate, 12a, 12b, 12
c ... holding hole, 21 ... component holder, 22 ... rigid plate, 23 ...
Elastic body, 23a, 23b, 23c ... Holding hole.

Claims (2)

[Claims] 1. A component holder used for forming an external electrode of an electronic component, which is provided with a large number of holding holes capable of elastically retaining a chip component in a predetermined direction, and is compatible with a plurality of types of chip components having different sizes. A component holder used for forming external electrodes of an electronic component, characterized in that a predetermined number of holding holes of different sizes are formed on the same surface. 2. The component holder used for forming an external electrode of an electronic component according to claim 1, wherein the arrangement patterns of the holding holes are matched.