JPH0922853A - Method of forming outer electrode of electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To avoid the inclinations of chip electronic components and form outer electrodes satisfactorily by a method wherein, when the chip components are pushed into the holding holes of a component holder, a pushing speed in an initial stage is smaller than a pushing speed afterwards. SOLUTION: In order to push chip components into the holding holes 3a of the elastic unit 3 of a component holder 1, a guide plate is transferred to a position above the component holder and a motor shaft 31 is turned 360 deg.. The chip component which is held by the temporary holding hole of the guide plate is pushed into the holding hole 3a by a pushing pin 21 descending from the above. At that time, in accordance with the shape of a driving cam 32, the pushing speed is gradually increased since the start of pushing till the finish of pushing as shown in (b) and the speed in an initial stage is substantially smaller than the speed afterwards. Even if there is a discrepancy between the center axis of the chip component and the center axis of the holding hole 3a, a counter force which is applied to the chip component when it touches the elastic unit 3 is suppressed to be very low to avoid the inclination of the chip component.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for forming an external electrode of an electronic component, which method forms an external electrode on a chip component.

[0002]

2. Description of the Related Art FIG. 3 shows a component holder used for forming external electrodes. The component holder 1 includes a plate-shaped rigid body 2 made of metal or the like and an elastic body 3 made of rubber or the like.
It is composed of As shown in FIG.
The rigid body 2 includes a rectangular frame portion 2a and a thin portion 2b integrally formed inside the frame portion 2a. The thin portion 2b has a through hole 2c having a diameter larger than that of a holding hole 3a described later. It has a predetermined arrangement. On the other hand, the elastic body 3 is provided so as to cover the upper and lower surfaces of the thin portion 2b and the inside of the through hole, and the holding hole 3a having a diameter smaller than that of the through hole 2c is provided at the center position of the through hole 2c.
Have concentrically. The thickness of the elastic body 3 on the upper and lower surfaces of the thin portion 2b matches the step between the frame portion 2a and the thin portion 2b, and the upper and lower surfaces of the elastic body 3 and the upper and lower surfaces of the frame portion 2a are flush with each other. is there. Also, the inner diameter of the holding hole 3a is smaller than the cross-sectional shape of the chip component to be held, and the cylindrical or quadrangular column-shaped chip component pushed into the holding hole 3a in the longitudinal direction is elastically held by the inner wall of the hole. .

Here, an external electrode forming method which is carried out by using the above component holder 1 will be described. First, the chip component is pushed into each holding hole 3a from one surface side of the elastic body 3, the chip component is moved in the holding hole 3a, and one end of the chip component is projected from the other surface side of the elastic body 3. Next, the projecting ends of all the chip components held by the component holder 1 are simultaneously pressed against the adjusting base to adjust the projecting amount. Next, the paste application roller or the paste application table is pressed against the protruding end of the chip component after adjusting the protruding amount to attach the electrode paste to the protruding end. Next, the chip component after the paste is attached is placed in a heating furnace together with the component holder 1 to dry the attached paste. After that, the chip component after the paste is dried is moved in the holding hole 3a so that the opposite end portion is projected from one surface side of the elastic body 3, and the same protrusion amount adjustment, paste attachment and paste drying as described above are performed. After that, the chip component is extracted from the holding hole 3a of the component holder 1.

Generally, a guide plate 11 and a push pin 21 as shown in FIG. 5A are used to push the component into the holding hole 3a. A temporary holding hole 11a having a taper is formed in the guide plate 11, and the chip component C is inserted in the longitudinal direction in the temporary holding hole 11a at another position. The chip component C held in the temporary holding hole 11a of the guide plate 11 is pushed into the holding hole 3a of the component holder 1 by the pushing pin 21 descending from above, and moves inside the holding hole 3a to move one end thereof. Is projected from the other surface side of the elastic body 3. By the way, the chip part C holds the holding hole 3a.
The pushing pin 21 similar to the above is also used when the end portion on the opposite side is moved from the inside to project from the one surface side of the elastic body 3.

[0005]

The speed of the push-in pin 21 during the above-described component pushing operation is constant until the pushing is completed, and is set to a relatively high value in order to shorten the cycle. Even if there is a slight axial misalignment between the holding part 3a and the holding hole 3a, the chip part C is tilted by the reaction force at the time when the chip part C contacts the elastic body 3, that is, at the start of pushing, and the chip remains in the tilted state. The component C is pushed into the holding hole 3a and projects in the same state (see FIG. 5B). It is difficult to properly adjust the amount of protrusion and to attach the paste described above to the chip component C that protrudes in an inclined state, and it is not possible to satisfactorily perform the desired external electrode formation.

The present invention has been made in view of the above problems, and an object of the present invention is to prevent external components from being inclined when a chip component is pushed into a holding hole and to form an external electrode satisfactorily. An object is to provide an electrode forming method.

[0007]

In order to achieve the above object, the invention of claim 1 uses a component holder provided with a plurality of retaining holes capable of elastically retaining a chip component in a predetermined direction.
In the external electrode forming method of the electronic component, in which the electrode paste is attached to the protruding portion of the chip component that is pressed into the holding hole and held, the initial speed of the component pushing when pushing the chip component into the holding hole is The feature is that it is set smaller than the pushing speed of.

According to a second aspect of the present invention, a component holder provided with a large number of holding holes capable of elastically holding the chip component in a predetermined direction is used, and an electrode is provided on a protruding portion of the chip component which is pressed and held in the holding holes. In a method of forming an external electrode for an electronic component, which comprises applying a paste to form an external electrode, the component pushing operation at the time of pushing the chip component into the holding hole is performed intermittently in a plurality of times.

[0009]

According to the invention of claim 1, the initial speed of pushing the chip component into the holding hole is set to be smaller than the pushing speed thereafter, so that there is a misalignment between the chip component and the holding hole. Even in such a case, the reaction force that the chip component receives at the start of pushing can be suppressed to be small and the inclination can be prevented.

According to the second aspect of the present invention, since the component pushing operation when pushing the chip component into the holding hole is intermittently performed in a plurality of times, the pushing is started due to the axial misalignment between the chip component and the holding hole. Even if the chip component is tilted at this point, it can be corrected by the elastic force of the holding hole at time intervals when the pushing operation is stopped.

[0011]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1A shows a component pushing device suitable for carrying out the present invention. In the figure, 21 is a push pin,
22 is a pin guide, 23 is a return spring, 31 is a motor, 31a is a motor shaft, 32 is a drive cam, and 33 is a motor control circuit.

The push-in pin 21 is for pushing the chip component into the holding hole 3a of the component holder 1 (see FIGS. 3 and 4), and is arranged in the pin guide 22 so as to be movable up and down. Being energized. The drive cam 32 is for applying a pushing-down force to the push pin 21, one end of which is connected to the motor shaft 31 a, and the side surface of the drive cam 32 is in contact with the spherical upper end of the push pin 21. The motor control circuit 33 controls the operation of the motor 31 so that each time the component is pushed, the rotation amount required for pushing the component is obtained by the motor shaft 31a.

The chip component C is placed in the holding hole 3a of the component holder 1.
When pushing in, the guide plate 11
(See FIG. 5) is moved above the component holder 1 and the motor shaft 31 is rotated once. Temporary holding hole 1 of the guide plate 11
The chip component C held by 1a is held in the holding hole 3a of the component holder 1 by the push pin 21 descending from above.
Be pushed into.

In the above-described component pushing device, the operating characteristics shown in FIG. 1B can be obtained depending on the shape of the drive cam 32. As can be seen from the figure, the component pushing speed when pushing the chip component C into the holding hole 3a gradually increases from the start of pushing to the end of pushing, and the initial speed of pushing the component is higher than the pushing speed thereafter. Is extremely small.

That is, in this embodiment, the initial speed of pushing the chip component C into the holding hole 3a is set to be smaller than the subsequent pushing speed, so that the chip component C and the holding hole 3a have axes. Even if there is a misalignment, the reaction force received when the chip component C comes into contact with the elastic body 3 can be suppressed to be small and the inclination thereof can be prevented. Further, since the pushing speed is gradually increased from the start of pushing to the end of pushing, it is possible to smoothly move the chip component C in the holding hole 3a and suppress an increase in the time required for pushing the component.

FIG. 2A shows another component pushing device suitable for carrying out the present invention. In the figure, 21 is a push pin, 22 is a pin guide, 23 is a return spring, 41
Is a pneumatic or hydraulic cylinder, 41a is a cylinder shaft, 42 is a fluid pressure control circuit, and 43 is a fluid source such as an air compressor or a hydraulic pump.

The push-in pin 21 is for pushing the chip component into the holding hole 3a of the component holder 1 (see FIGS. 3 and 4) and is arranged in the pin guide 22 so as to be movable up and down. Being energized. The cylinder 41 is for applying a downward force to the push pin 21, and the cylinder shaft 41 a is in contact with one end of the push pin 21. Each time the fluid pressure control circuit 42 pushes in the component, the downward stroke required for pushing in the component is
The operation of the cylinder 41 is controlled so as to obtain 1a.

The chip component C is placed in the holding hole 3a of the component holder 1.
When pushing in, the guide plate 11
(See FIG. 5) is moved above the component holder 1 and the cylinder shaft 41a is lowered. The chip component C held in the temporary holding hole 11a of the guide plate 11 is pushed into the holding hole 3a of the component holder 1 by the push pin 21 descending from above.

In the above-described component pushing device, the fluid pressure control circuit 42 can obtain the operating characteristics as shown in FIG. 2 (b). As can be seen from the figure, the pushing operation when pushing the chip component C into the holding hole 3a is divided into four times with a pause time of three times, and the pushing of the component based on the equally divided stroke is the pause time. It is carried out intermittently at a constant speed via.

That is, in the present embodiment, since the component pushing operation when pushing the chip component C into the holding hole 3a is performed intermittently in four steps, the axial center between the chip component C and the holding hole 3a is performed. Even if the chip component C is tilted at the start of pushing due to the shift, this can be corrected by the elastic force of the holding hole 3a at a time interval during which the pushing operation is stopped.

In the embodiment shown in FIG. 1, the parts pushing speed is gradually increased. However, two kinds of speeds, low speed and high speed, are prepared and these can be used by switching during the parts pressing process. You may

In the embodiment shown in FIG. 2, the component pushing-in operation is divided into four times and carried out intermittently, but it is sufficient if the component pushing-in operation is divided into at least two times.

Furthermore, in each of the above embodiments, the chip component is pushed and held in the holding hole of the component holder in the longitudinal direction, but the present invention is also applicable to the case where the chip component is pushed and held in another direction. Can have the same effect.

[0024]

As described above in detail, according to the invention of claim 1, even when the chip component and the holding hole are misaligned with each other, the reaction force received by the chip component at the start of pushing is suppressed to be small. The inclination can be prevented, and the external electrodes can be favorably formed in a state where the chip component has no inclination.

According to the second aspect of the present invention, when the chip component is pushed into the holding hole, the component pushing operation is performed intermittently in a plurality of times, so that the axial misalignment between the chip component and the holding hole may occur. Even if the tip part is tilted at the start of pushing, correct it by the elastic force of the holding hole at the time interval when the pushing operation is stopped, and perform good external electrode formation in the state where the tip part is not tilted. You can

[Brief description of drawings]

FIG. 1 is a diagram showing a component pushing device suitable for implementing the present invention and its operation characteristics.

FIG. 2 is a diagram showing another component pushing device suitable for implementing the present invention and its operation characteristics.

FIG. 3 is a perspective view of a component holder.

FIG. 4 is a sectional view of the component holder shown in FIG.

FIG. 5 is a diagram showing an operation of pushing a component into a holding hole.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Component holder, 2 ... Rigid body, 2a ... Frame part, 2b ... Thin part, 2c ... Through hole, 3 ... Elastic body, 3a ... Holding hole, C ... Chip component, 11 ... Guide plate, 11a ... Temporary holding Hole,
21 ... Push-in pin, 22 ... Pin guide, 23 ... Return spring, 31 ... Motor, 31a ... Motor shaft, 32 ... Drive cam, 33 ... Motor control circuit, 41 ... Cylinder, 41a ...
Cylinder shaft, 42 ... Fluid pressure control circuit, 43 ... Fluid source.

Claims (2)

[Claims] 1. A component holder having a large number of holding holes capable of elastically holding a chip component in a predetermined direction is used, and an electrode paste is attached to a protruding portion of the chip component which is pressed into the holding holes and held. In the method of forming an external electrode of an electronic component for forming an external electrode, the initial speed of pushing the chip component into the holding hole is set to be smaller than the subsequent pushing speed. Method. 2. A component holder provided with a large number of holding holes capable of elastically holding a chip component in a predetermined orientation is used, and an electrode paste is attached to a protruding portion of the chip component which is pressed into the holding holes and held. A method of forming an external electrode of an electronic component for forming an external electrode, wherein the component pushing operation when pushing the chip component into the holding hole is intermittently carried out in plural times. .