JPH0923131A - Piezoelectric resonance components - Google Patents

Abstract

(57) An object of the present invention is to provide a piezoelectric resonance component utilizing a surface vibration mode, which is an inexpensive component capable of reducing the number of components, simplifying the entire structure and improving mechanical shock resistance. SOLUTION: Piezoelectric resonators 31 to 34 utilizing a surface vibration mode mainly of in-plane deformation are bonded via elastic adhesives 51 and 52, and the obtained laminated body 23 is elastic adhesive on a substrate 22. A ladder-type filter 21, which is joined via 53 and 54, and is configured by lead wires 55a to 55h having flexibility for electrical connection between each piezoelectric resonator and an electrode on the substrate 22.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a piezoelectric resonance component using a plane vibration mode mainly in-plane deformation, and for example, a piezoelectric resonance used in a piezoelectric oscillator, a ladder type filter, a dual mode piezoelectric filter, or the like. Regarding parts.

[0002]

2. Description of the Related Art Conventionally, in order to construct a piezoelectric oscillator and various filters, there have been proposed piezoelectric resonators or piezoelectric resonant components that utilize various vibration modes according to frequencies. For example, as a piezoelectric resonator used in a band of several hundred kHz, a piezoelectric resonator using a spreading vibration mode of a piezoelectric plate having a square planar shape is known. The piezoelectric resonator utilizing the spreading mode is configured by using a piezoelectric plate having a square planar shape that is polarized in the thickness direction. Resonant electrodes are formed on both main surfaces of the piezoelectric plate, and by applying an AC voltage from the resonant electrodes on both main surfaces, a piezoelectric plate having a square planar shape is expanded and excited in a vibration mode.

In the spreading vibration mode, the node of vibration is located at the center of both principal surfaces. Therefore, if the piezoelectric resonator is mechanically supported by using the peripheral portion of the piezoelectric plate, the resonance characteristics will be impaired. Therefore, conventionally, in the piezoelectric resonator using the expansion vibration mode, the piezoelectric resonator is supported by using a spring terminal that elastically contacts the main surface of the piezoelectric plate.

A ladder type filter will be described with reference to FIG. 1 as an example of a piezoelectric resonance component using the spreading mode as described above. In the structure shown in FIG. 1, four piezoelectric resonators 1 to 4 are used. Among them, the piezoelectric resonators 1 and 2 constitute a series resonator in the circuit configuration of the ladder type filter, while the piezoelectric resonators 3 and 4 constitute a parallel resonator. The piezoelectric resonators 1 to 4 are arranged as illustrated with the conductive elastic plates 5 to 7 and the metal terminals 9 and 10 interposed therebetween, and the opening 12a of the case 12 schematically shown below. It is stored inside.

Further, terminals 11 and the like are arranged outside the piezoelectric resonators 1 to 4. The portions of the elastic plates 5 to 7 and the terminals 9 to 11 that come into contact with the electrodes of the piezoelectric resonators 1 to 4 are the central portions of the main surfaces of the piezoelectric resonators 1 to 4. That is, for example, as schematically shown in the center of the metal terminal 11, an elastic contact portion 11a protruding toward the center of the resonance electrode 2a of the piezoelectric resonator 2 is formed in the center, and the elastic contact portion is formed. 11a has a spring property and is in contact with the center of the main surface, which is a node point of the piezoelectric resonator 2. Similarly for the resonance electrodes of the other piezoelectric resonators, each elastic plate 5 is placed at the center of the main surface.
Elastic contact portions such as 7 to 7 and metal terminals 9 and 10 are in contact with each other.

Although not shown in the figure, in a piezoelectric oscillator in which a single piezoelectric resonator utilizing a spreading mode is housed in a case, an elastic contact portion that contacts the centers of both main surfaces of the piezoelectric resonator. The piezoelectric terminal is supported by the spring terminal having the above.

[0007]

As described above, in the conventional piezoelectric resonance component using the piezoelectric resonator utilizing the spreading mode, since the node point of vibration is located at the center of the piezoelectric resonator, the spring terminal is It had to be mechanically supported and stored in a case or the like. Therefore, there are problems that the number of components for forming the piezoelectric resonance component is large and the assembling process is complicated.

Furthermore, since it is necessary to provide a protrusion as an elastic contact portion on the spring terminal, the thickness of the finally obtained piezoelectric resonance component (the dimension along the thickness direction of the piezoelectric plate) tends to be large, and the piezoelectric resonance component is likely to be large. Hindered the miniaturization of the. Further, since the spring terminal having the complicated shape as described above must be prepared, the cost of the spring terminal is high,
There is also a problem that the cost of the entire piezoelectric resonance component is high.

In addition, since the piezoelectric resonator is elastically sandwiched by the spring terminal, when the piezoelectric resonance component falls, the elastic contact portion of the spring terminal is displaced from the node point of vibration of the piezoelectric resonator, There is also a problem that the characteristics deteriorate. That is, it was not sufficient in terms of mechanical shock resistance.

The above-mentioned various problems are not limited to the piezoelectric resonance component using the spreading mode, but are also the same in the piezoelectric resonance component using the surface vibration mode mainly including in-plane deformation such as the width mode. there were.

An object of the present invention is a piezoelectric resonance component utilizing a surface vibration mode, which can be constructed with a small number of components, the overall structure can be simplified, and the mechanical shock resistance is excellent. An object is to provide an inexpensive piezoelectric resonance component.

[0012]

According to a broad aspect of the present invention, there is provided a piezoelectric resonator utilizing a surface vibration mode having in-plane deformation as a main component, and an electrode electrically connected to the piezoelectric resonator. And a substrate on which the piezoelectric resonator is mounted, and at least one of a node of the surface vibration mode of the piezoelectric resonator and a portion having a displacement as small as the node point,
An elastic adhesive arranged to fix the substrate,
A piezoelectric resonance component, further comprising: a flexible conductor bonded to the piezoelectric resonator and the substrate so as to electrically connect the piezoelectric resonator and an electrode on the substrate. To be done.

Further, preferably, the substrate is composed of a flat metal plate. In this case, the flat metal plate is provided with a terminal portion that extends to one side and is used for electrical connection with the outside. Thus, by forming the substrate with the metal plate having the terminal portion, the electrodes formed on the substrate and the substrate can be made of a single material. Further, by covering the metal plate, the piezoelectric resonator, and the like with an exterior resin in a region other than the tip end side of the terminal portion, the piezoelectric resonance component can be configured as a resin-coated electronic component with lead terminals.

Further, according to a specific aspect of the present invention, the elastic adhesive is composed of a conductive adhesive. That is, by forming the elastic adhesive with a conductive adhesive, not only the piezoelectric resonator and the substrate can be fixed, but also the adhesive can have an electrical connection function, thereby reducing the number of conductors used. It can be reduced.

Further, the above-mentioned piezoelectric resonance component can be used in various piezoelectric oscillators, piezoelectric filters and the like. In a specific aspect of the present invention, the piezoelectric resonator has a rectangular planar shape polarized in the thickness direction. Of the piezoelectric plate and a pair of resonance electrodes formed on both main surfaces of the piezoelectric plate.

In the present invention, at least one other piezoelectric resonator utilizing a surface vibration mode may be laminated on the piezoelectric resonator. That is, at least one portion of the node points of the surface vibration mode and at least one of the portions having the same small displacement as the node points, at least one other piezoelectric resonator is bonded onto the piezoelectric resonator using an elastic adhesive, You may comprise a laminated body.

In one specific aspect of the present invention, a ladder type filter having at least one series resonator and at least one parallel resonator is configured as the piezoelectric resonance component. Here, in order to form a series resonator and a parallel resonator, a piezoelectric resonator utilizing a plurality of surface vibration modes is provided. The plurality of piezoelectric resonators are bonded to each other through an elastic adhesive at at least one of a node point of vibration and a portion whose displacement is as small as the node point to form a laminated body.

Further, in this case, the laminated body is placed on the substrate, and the substrate is provided with an electrode electrically connected to the piezoelectric resonator of the laminated body. Further, at least one of the node point of the vibration of the piezoelectric resonator in the lowermost layer of the laminated body and the portion where the displacement is as small as the node point and the substrate are fixed with an elastic adhesive, and the laminated body is It is fixed on. A plurality of flexible conductors bonded to the piezoelectric resonator and the substrate are further provided so as to electrically connect the piezoelectric resonator in the stacked body and the electrodes on the substrate.

In the present invention, the term "plane vibration mode" broadly includes a plane vibration mode mainly composed of in-plane deformation. Such plane vibration modes include a spread mode of a square plate and a width mode of a rectangular plate. There are various modes mainly based on in-plane deformation such as a width expansion mode and a rectangular plate length mode which will be described later.

[0020]

According to the piezoelectric resonance component of the present invention, the piezoelectric resonator utilizing the surface vibration mode is fixed to the substrate by the elastic adhesive. Therefore, the piezoelectric resonator is supported without using a support structure having a complicated shape such as a spring terminal.

Moreover, the support by the elastic adhesive is carried out at at least one of the node point of the surface vibration mode of the piezoelectric resonator and the portion where the displacement is as small as the node point. That is, since it is supported in such a part and is supported by using an adhesive having elasticity, the characteristics of the piezoelectric resonator due to the support structure are not easily deteriorated.

The piezoelectric resonator and the electrode on the substrate are electrically connected by a flexible conductor. Since the conductor has flexibility, the electrical connection between the piezoelectric resonator and the electrode can be secured regardless of the vibration of the piezoelectric resonator.

In addition, since the elastic resonator is supported and fixed using the elastic adhesive and the flexible conductor is used as described above, the piezoelectric resonance component may drop or the piezoelectric resonance component may be dropped. Even if an external force is applied to the piezoelectric resonator, there is little risk that the electrical connection state between the piezoelectric resonator and the electrode on the substrate will be impaired or the supporting structure of the piezoelectric resonator will be destroyed.

Therefore, despite the use of the piezoelectric resonator utilizing the surface vibration mode, the number of parts can be reduced, the assembling work can be simplified and the size can be reduced in forming various piezoelectric resonance parts. It will be possible. In addition, it is possible to provide an inexpensive piezoelectric resonance component having excellent mechanical shock resistance.

Also in the ladder type filter of the present invention, the series resonator and the parallel resonator are composed of the specific piezoelectric resonator, and the plurality of piezoelectric resonators vibrate using the elastic adhesive. Of at least one of the node points and the portion of which displacement is as small as that of the node points are joined to form a laminated body. In addition, this laminate is on the substrate,
It is fixed by an elastic adhesive at least at one of the node point of the vibration of the piezoelectric resonator and the portion where the displacement is as small as the node point. Therefore, like the piezoelectric resonance component of the present invention, it is possible to reduce the number of components, simplify the assembly work, and reduce the size. In addition, a plurality of piezoelectric resonators are joined together via an elastic adhesive to form a laminated body,
Moreover, since the laminate is fixed to the substrate by the elastic adhesive, it is possible to provide a ladder type filter having excellent mechanical shock resistance.

[0026]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be clarified by describing embodiments with reference to the drawings.

First Embodiment A ladder type filter according to a first embodiment of the present invention will be described with reference to FIGS.

FIG. 2 is an exploded perspective view of the ladder type filter of this embodiment, and FIG. 3 is a sectional view of the ladder type filter. Referring to FIG. 3, the ladder type filter 21 is
It has a structure in which a laminated body 23 formed by laminating a plurality of piezoelectric resonators is placed on a rectangular plate-shaped substrate 22. In addition, the laminated body 2
A cap 24 having an opening downward so as to cover 3 is fixed to the substrate 22.

The cap 24 constitutes the case of the ladder type filter 21 together with the substrate 22. Cap 24
Can be made of a material having rigidity, for example, an appropriate material such as metal or synthetic resin. In order to electromagnetically shield the laminated body 23 forming the ladder filter, the cap 24 is preferably made of a conductive material such as metal. However, in order to prevent a short circuit between electrodes on the substrate 22 which will be described later, when the cap 24 is made of metal, the cap 24 is attached to the substrate 22 with an insulating adhesive.
It is desirable to fix the above or to form an insulating layer on the electrode at the junction between the electrode formed on the upper surface of the substrate 22 and the cap 24 described later.

Details of the substrate 22 and the laminate 23 will be described with reference to the exploded perspective view of FIG. The substrate 22 is composed of an insulating plate having a substantially rectangular planar shape, for example, a plate member made of insulating ceramics such as alumina or synthetic resin. On the pair of short side surfaces of the substrate 22, respectively,
Notches 22a to 22c and 22d to 22f are formed. The notches 22a to 22f are provided to facilitate and ensure electrical connection with the electrodes on the printed circuit board when the ladder type filter 21 using the electrodes described below is surface-mounted on the printed circuit board or the like. .

Electrodes 25 to 30b are formed on the upper surface of the substrate 22 by applying a conductive material by an appropriate method. The electrodes 25 to 27 are formed so as to reach the notches 22a to 22c described above, respectively. Similarly, the electrode 29 is formed in the cutout 22d, and the electrodes 30a and 30b are formed in the cutouts 22e and 22f. Further, the electrode 28 is formed on the upper surface of the substrate 22 so as not to reach the outer peripheral edge.

The laminated body 23 shown in FIG. 2 is formed by laminating the plurality of piezoelectric resonators 31 to 34 shown in FIG. The piezoelectric resonator 31 is configured by using a rectangular piezoelectric plate 35 made of a piezoelectric material such as lead zirconate titanate-based piezoelectric ceramics or a piezoelectric single crystal such as crystal. On the upper surface of the piezoelectric plate 35, a resonance electrode 36 is formed at the center of the upper surface of the piezoelectric plate 35. The resonance electrode 36 is electrically connected to a lead electrode 37 formed so as to reach a side edge formed by a side surface 35 a on one short side of the piezoelectric plate 35 and an upper surface. That is, the resonance electrode 36 and the extraction electrode 37 are formed in series as shown in the figure.

A resonance electrode 38 is formed on the lower surface of the piezoelectric plate 35, as shown in the right side of FIG. The resonance electrode 38 is formed in the central region so as to face the resonance electrode 36 with the piezoelectric plate 35 in between. Further, on the lower surface of the piezoelectric plate 35, the side surface 3 on the side opposite to the side surface 35 a is formed.
5b and the lower surface to reach the edge formed by the lower electrode 39
Are formed. The resonance electrode 38 is electrically connected to the extraction electrode 39.

The piezoelectric plate 35 is polarized so that the polarization axes are aligned in the thickness direction. The piezoelectric plate 35 has a rectangular planar shape with a long side length b and a short side length a.
The ratio b / a between the length b of the long side and the length a of the short side is

[0035]

[Equation 1]

It is selected to be within ± 10% with a value satisfying the condition as the center. Note that σ in equation (1)
Indicates the Poisson's ratio of the piezoelectric material forming the piezoelectric plate 35.

The inventor of the present application previously formed resonant electrodes on both main surfaces of a rectangular piezoelectric plate polarized in the thickness direction, and when an AC voltage was applied from both main surfaces, the ratio b / a was above. It has been found that the wide spread mode having a vibration mode between the wide mode and the wide mode is excited when the value is within ± 10% around the value satisfying the expression (1). The vibration in the width-spreading mode is a vibration mainly due to in-plane deformation of the main surface of the piezoelectric plate 35, and the node portion of the vibration includes the centers of the upper surface and the lower surface of the piezoelectric plate 35 and the short-side side surfaces 35a, 35b. Appear in the central area of. Details of such a width expansion mode are disclosed in, for example, Japanese Patent Laid-Open No. 147475/1995.

Above the piezoelectric resonator 31, the piezoelectric resonator 3 is provided.
2 is placed. The piezoelectric resonator 32 is configured by using a piezoelectric plate 40 having the same planar shape as the piezoelectric plate 35.
However, the thickness of the piezoelectric plate 40 is smaller than that of the piezoelectric plate 35. A resonance electrode 41 is formed on the entire upper surface of the piezoelectric plate 40. Similarly, a resonance electrode 42 is formed on the entire lower surface of the piezoelectric plate 40. Piezoelectric plate 4
0 is composed of, for example, a piezoelectric ceramic such as lead zirconate titanate-based ceramics or a piezoelectric single crystal such as quartz, and is polarized so that its polarization axes are aligned in the thickness direction.

Also in the piezoelectric plate 40, the ratio b / a is selected so as to be within a range of ± 10% centered on the value satisfying the above-mentioned formula (1). Therefore, the piezoelectric resonator 3
Also in No. 2, when an AC voltage is applied between the resonance electrodes 41 and 42, the piezoelectric resonator 32 is excited in the widening mode.

The piezoelectric resonator 33 has the same structure as the piezoelectric resonator 32. That is, the resonance electrode 44 is formed on the upper surface of the piezoelectric plate 43, and the resonance electrode 45 is formed on the entire lower surface. Further, the piezoelectric resonator 34 arranged at the uppermost portion has the same structure as the piezoelectric resonator 31. That is, the resonance electrode 47 and the extraction electrode 48 are formed on the upper surface of the piezoelectric plate 46, and the resonance electrode 49 and the extraction electrode 50 are formed on the lower surface.

As described above, among the four piezoelectric resonators constituting the laminated body 23, the piezoelectric resonator 31 and the piezoelectric resonator 34 are the same piezoelectric resonator, and the piezoelectric resonator 32 and the piezoelectric resonator 34 are the same. The child 33 and the same piezoelectric resonator are configured.

Returning to FIG. 3, the piezoelectric resonators 31 to 34 are adhered to each other by the elastic adhesives 51 and 52 to form the laminated body 23. In this case, the elastic adhesive 51 is
The piezoelectric resonators 31 to 34 are provided on the upper surface and the lower surface of the piezoelectric plate in the vicinity of the central region on the short side. On the other hand, the elastic adhesive 52 adheres the piezoelectric plates on both sides in the central region of the upper surface or the lower surface of each piezoelectric plate.

Further, the thickness of the elastic adhesives 51 and 52 is selected so as to have the void A for preventing the vibration of the upper and lower piezoelectric resonators. Therefore, the elastic adhesives 51, 5
2 is applied to the node of vibration of each of the piezoelectric resonators 31 to 34, the elastic adhesives 51 and 52 have elasticity, and the void A is formed. It is very unlikely that the resonance characteristics of the piezoelectric resonators 31 to 34 are deteriorated due to the bonding with the elastic adhesives 51 and 52.

Further, the laminated body 23 is made of the elastic adhesive 5
It is fixed to the substrate 22 by 3, 54. The elastic adhesives 53 and 54 are made of the same material as the elastic adhesives 51 and 52. The elastic adhesives 53 and 54 are used for the piezoelectric resonator 3
The piezoelectric resonator 31 and the substrate 22 in the node portion of the vibration 1
Is joined to. That is, the elastic adhesive 53 is applied near the center of the side edge of the piezoelectric plate 35 on the short side, and the elastic adhesive 54 is applied in the central region of the lower surface. Further, the thickness of the elastic adhesives 53, 54 is selected so as to form the space A between the piezoelectric resonator 31 and the substrate 22 so as not to hinder the vibration of the piezoelectric resonator 31.

Next, an electrical connection structure between the piezoelectric resonators 31 to 34 and the electrodes 25 to 30 on the substrate 22 will be described with reference to FIGS. 2 and 3. The lead electrode 37 (see FIG. 4) on the upper surface of the piezoelectric resonator 31 has a flexible lead wire 55a.
Is electrically connected to the electrode 27. The lead electrode 39 (see FIG. 4) on the lower surface side of the piezoelectric resonator 31 is electrically connected to the electrode 28 by the lead wire 55b.
The resonance electrode 41 of the piezoelectric resonator 32 is electrically connected to the electrode 26 by a lead wire 55c, and the resonance electrode 42 is electrically connected to the electrode 30b by a lead wire 55d.

Further, the resonance electrode 44 of the piezoelectric resonator 33 is electrically connected to the electrode 28 by the lead wire 55e. The resonance electrode 43 is connected to the electrode 30a by the lead wire 55f.
Is electrically connected to The lead electrode 48 of the piezoelectric resonator 34 is electrically connected to the electrode 25 by a lead wire 55g, and the lead electrode 50 is electrically connected to the electrode 28 by a lead wire 55h.

As the lead wires 55a to 55h described above, it is possible to use a flexible wire material made of an appropriate metal or alloy such as Cu. However, since the lead wires 55a to 55h need to have flexibility to some extent, the diameter of the lead wires 55a to 55h is 10 to 5 although it depends on the material.
Those having a size of about 0 μm are used.

As the elastic adhesives 51 to 54, those having sufficient elasticity are used so as not to disturb the vibration of the piezoelectric resonators 31 to 34. In this embodiment, JIS is used.
K6301 spring hardness test (A type) hardness 30, tensile strength measured by a test in which aluminum plates are bonded and stress is applied in the shear direction = 32 kgf
/ Cm ² of silicone adhesive is used. However, an adhesive containing a resin having rubber elasticity such as other synthetic rubber latex as a main component, or a rubber-modified epoxy adhesive may be used.

As described above, the piezoelectric resonators 31 to 34
Are electrically connected to the electrodes 25 to 30b formed on the substrate 22, and therefore the electrode 25 is used as an input end and the electrodes 27, 3
By connecting 0b as an output terminal and the electrodes 26 and 30a to the ground potential, it is possible to operate as a two-stage ladder type filter shown in FIG.

That is, since the ladder type filter 21 of the present embodiment has a structure in which the laminated body 23 is fixed on the substrate 22 and the laminated body 23 is flexed by the cap 24 as described above, the printed circuit board is provided. It is provided as a chip-type electronic component that can be surface-mounted on, for example. Moreover, each of the piezoelectric resonators 31 to 34 for forming the ladder type filter uses the widening mode, and the elastic adhesives 51 to
They are bonded to each other and to the substrate 22 via 54. Therefore, it is not necessary to prepare a spring terminal having a complicated shape. In addition, since a plurality of piezoelectric resonators 31 to 34 are used, they can be bonded to each other with an elastic adhesive, so that the assembly process can be simplified and the piezoelectric resonators can be stacked in the same direction. The size can be reduced.

The piezoelectric resonators 32 and 33 are made thinner than the piezoelectric resonators 31 and 34, and in the piezoelectric resonators 31 and 34, the resonance electrodes 36 and 47 are partially formed in the central region of the upper surface or the lower surface. The piezoelectric resonators 31 and 34 are formed in series, and the piezoelectric resonators 32 and 3 are formed in series.
This is because 3 constitutes a parallel resonator. That is,
This is because the capacitance of the series resonator needs to be smaller than that of the parallel resonator in order to obtain good filter characteristics in the ladder filter.

According to the concrete experimental results of the present inventor,
When trying to obtain a ladder type filter with a center frequency of 455 kHz, the dimensions of the piezoelectric resonators 31 and 34 are 4.0 ×
5.6 × thickness 0.3 mm, the piezoelectric resonators 32 and 33 are
It has been confirmed that the dimensions can be about 4.2 × 6.0 × 0.2 mm. Therefore, it can be seen that a considerably smaller ladder type filter can be provided.

Second Embodiment FIGS. 6 and 7 are views for explaining a ladder type filter according to a second embodiment of the present invention. FIG. 6 is an exploded perspective view for explaining the main part of the ladder type filter of the second embodiment, and FIG. 7 is a perspective view showing the appearance.

In this embodiment, the laminated body 23 used in the first embodiment is used. Therefore, the description of the structure of the stacked body 23 will be omitted by referring to the description given for the first embodiment. The present embodiment is different from the first embodiment in that a substrate 62 having a rectangular planar shape and lead terminals 63 to 65 are used in place of the substrate 22, and are configured as electronic components with lead terminals. It is in.

The substrate 62 is made of an insulating ceramic such as alumina or an appropriate insulating material such as synthetic resin. Electrodes 66 to 69 are provided on the upper surface of the substrate 62.
Are formed. Each of the electrodes 66 to 68 has a C
Lead terminals 63 to 65 made of metal such as u are fixed using solder or a conductive adhesive. Electrode 66-
68 corresponds to the electrodes 25 to 27 shown in FIG. 4, and the electrode 69 corresponds to the electrode 28. Further, in the present embodiment, the electrode 68 is formed so as to extend from the side to which the lead terminal 65 is joined to the short side edge on the opposite side of the substrate 62. Therefore, the electrode 3 shown in FIG.
It is formed so as to reach the region where 0b is provided. Therefore, the lead wires 55a used in the first embodiment
55h can be used to electrically connect the piezoelectric resonators 31 to 34 to the electrodes 66 to 69 in the same manner as in the first embodiment, whereby the lead terminal 63 is connected to the input end,
By using the lead terminal 65 as an output terminal and the lead terminal 64 as a terminal connected to the reference potential, it is possible to operate the ladder filter shown in FIG.

In this embodiment, the laminated body 23 is bonded onto the substrate 62 with an elastic adhesive. Since this elastic adhesive is similar to the elastic adhesives 53 and 54 used in the first embodiment, detailed description thereof will be omitted. That is, in FIG. 3, the laminated body 23 is bonded onto the substrate 62 using an elastic adhesive so that the cap 24 is removed. Therefore, also in the present embodiment, even if the piezoelectric resonator 31 is bonded to the substrate 62 using the elastic adhesive, the resonance characteristics of the piezoelectric resonator 31 are not easily deteriorated.

Furthermore, in the second embodiment, as shown in FIG. 7, a resin sheathing 70 is provided around the periphery. Resin exterior 70
Is formed of a thermosetting resin such as an epoxy resin, and is provided to protect the laminated body 23 from the outside. However, due to the resin sheath 70, the piezoelectric resonator 31
The vibrations of ~ 34 must not be disturbed. Therefore, similar to a known piezoelectric resonator provided with a resin sheath, wax such as paraffin wax that is scattered by heating is applied around the vibrating portion in a state where the laminated body 23 is bonded to the substrate 62, Furthermore, the circumference is covered with a thermosetting resin,
The resin sheath 70 can be formed by heating and curing. That is, when the above-mentioned thermosetting resin is heated and cured, the above-mentioned wax scatters, and a cavity is formed in the portion where the wax was present, thereby creating a space for not hindering the vibration of the piezoelectric resonators 31-34. Will be formed around.

As is apparent from the second embodiment, the ladder type filter of the present invention can also be provided as an electronic component with leads, which is provided with a resin sheath and has lead terminals.

Third Embodiment The third embodiment is an example applied to a piezoelectric oscillator constituted by using a piezoelectric resonator utilizing the width expansion mode.

FIG. 8 is an exploded perspective view of the piezoelectric oscillator according to this embodiment, and FIG. 9 is a perspective view showing its appearance. Piezoelectric oscillator 8
1, the substrate 82 having a substantially rectangular planar shape and the piezoelectric resonator 8
3 and a cap 84 are used.

The substrate 82 is made of an insulating ceramic such as alumina or an appropriate insulating material such as synthetic resin, and has cutouts 82a, 8 on one of its long sides.
2b has notches 82c and 82d formed on the other side surface.

Electrodes 85 and 86 are formed on the upper surface of the substrate 82. The electrode 85 is formed along one of the short side edges, and is formed so as to extend into the notches 82a and 82c. Similarly, the electrode 86 is formed along the other short side edge, and the cutout 8 is formed.
It is formed so as to reach 2b and 82d.

The piezoelectric resonator 83 has a resonance electrode 88 on the entire upper surface of a rectangular piezoelectric plate 87 and a resonance electrode 89 on the entire lower surface.
Has a structure formed by. The piezoelectric plate 87 is made of a piezoelectric ceramic such as lead zirconate titanate-based piezoelectric ceramic or a piezoelectric single crystal such as quartz, and is polarized so that its polarization axes are aligned in the thickness direction.
Further, in the piezoelectric plate 87, the ratio b / a is set so as to be within a range of ± 10% centered on the value satisfying the above-mentioned formula (1).
Is stipulated. Therefore, when an AC voltage is applied from the resonance electrodes 88 and 89, it is excited in the widening mode like the piezoelectric resonators used in the first and second embodiments.

Therefore, the node portion of the vibration of the piezoelectric resonator 83 exists in the center of the upper surface and the lower surface and in the vicinity of the central region of the short side surface. Therefore, in this embodiment, the elastic adhesive 90 is applied to the center of the upper surface of the substrate 82. The position of this elastic adhesive 90 is determined so as to come into contact with the center of the lower surface of the piezoelectric resonator 83. Also, the elastic adhesive 90
Elastic adhesives 91, 91 are applied to both sides of the same at a predetermined distance. The positions where the elastic adhesives 91, 91 are applied are the positions where the elastic adhesives 91, 91 come into contact with the vibration node portion at the center of the short side surface of the piezoelectric resonator 83.
That is, the positions of the elastic adhesives 91, 91 are selected so as to be bonded to the lower surface in the central region of the edge formed by the lower side surface of the piezoelectric resonator 83 and the lower surface.

In this embodiment, the piezoelectric resonator 83 is
It is bonded to the substrate 82 using the elastic adhesives 90 and 91. Therefore, as in the case of the first embodiment, the elastic adhesives 90 and 91 bond the substrate 82 and the piezoelectric resonator 83 by utilizing the node portion of the vibration of the piezoelectric resonator 83. Since the agents 90 and 91 have elasticity,
In addition, the thickness of the elastic adhesives 90 and 91 depends on the piezoelectric resonator 89.
The piezoelectric resonator 83 and the substrate 8 are provided with an air gap for preventing the vibration of the substrate.
Since it is formed so as to be formed between the piezoelectric resonator 83 and the piezoelectric element 83, the above-mentioned joining does not hinder the vibration of the piezoelectric resonator 83.

Further, the electrical connection between the piezoelectric resonator 83 and the electrodes 85 and 86 is made by using the flexible lead wires 92 and 93 schematically shown in FIG. That is, the resonance electrode 88 is joined to the electrode 85 by the lead wire 92, and the resonance electrode 89 is connected by the lead wire 93 to the electrode 86.
Is joined to. As the lead wires 92 and 93, the first
The same wire material as the lead wires 55a to 55h used in the above embodiment can be used.

Also in this embodiment, the resonance electrodes 88 and 89 of the piezoelectric resonator 83 and the electrodes 85 and 86 on the substrate 82 are electrically connected by using the flexible lead wires 92 and 93. Therefore, the vibration of the piezoelectric resonator 83 is not hindered by the electrical connection structure.

As shown in FIG. 9, the cap 84 is fixed to the substrate 82 so as to surround the piezoelectric resonator 83 (not shown in FIG. 9). Cap 84
Can be made of an appropriate material such as metal or synthetic resin, but it is desirable that the cap 84 be made of metal in order to electromagnetically shield the piezoelectric resonator 83. However, when the cap 84 is made of metal, a short circuit between the electrodes 85 and 86 becomes a problem. Therefore,
It is desirable to use an insulating adhesive or to form an insulating layer on either the cap 84 or the substrate 82 side at the joint between the cap 84 and the substrate 82. Alternatively, the cap 84 is made of metal,
Further, a material whose outer surface is coated with an insulating material may be used.

As is apparent from FIG. 9, the piezoelectric oscillator 81 according to the third embodiment is provided as a chip-type electronic component surface-mounted on a printed circuit board or the like as in the first embodiment. . That is, the electrodes 85 and 86 can be used for easy surface mounting on a printed circuit board.

Fourth Embodiment FIG. 10 is a perspective view for explaining a piezoelectric oscillator according to a fourth embodiment of the present invention.

The piezoelectric oscillator 101 of this embodiment is the same as the piezoelectric oscillator 81 of the third embodiment, except that it is constructed as an electronic component with leads. Therefore,
The same parts are designated by the same reference numerals, and the description thereof will be omitted.

In the piezoelectric oscillator 101, the rectangular substrate 102
Is used. The substrate 102 is similarly configured to the substrate 82 used in the third embodiment, except that no cutout is formed. The electrodes 85 and 86 are formed on the upper surface of the substrate 102.
To the lead terminals 103 and 104, respectively. The piezoelectric resonator 83 is bonded onto the substrate 102. The piezoelectric resonator 83 is the elastic adhesive 9 shown in FIG.
It is fixed on the substrate 102 by applying 0 and 91 to the substrate 102 and joining the piezoelectric resonator 83. Further, the resonance electrode 88 is electrically connected to the electrode 85 by the lead wire 92. Similarly, although not shown in FIG. 10, the resonance electrode on the lower surface side is electrically connected to the electrode 86 by a lead wire.

In the piezoelectric oscillator 101 of the present embodiment, the lead terminal 103,
Except for the tip side portion of 104, the remaining portion is the resin exterior 1
Covered by 05. In FIG. 10, the resin exterior 105
The outline of the part where is formed is shown by an imaginary line,
The resin sheath 105 is formed in the same manner as the resin sheath 70 used in the second embodiment. Thus, the piezoelectric oscillator of the present invention can be provided as an electronic component with leads.

Modification of Third Embodiment FIGS. 11 to 13 are exploded perspective views for explaining modifications of the piezoelectric oscillator of the third embodiment. 11 to 1
Each of the modified examples shown in FIG. 3 is different from the third embodiment in that the vibration mode used is different.

FIG. 11 shows a modification using a piezoelectric resonator 111 utilizing the spreading mode of a square plate. In the piezoelectric resonator 111, the resonance electrode 113 is formed on the entire upper surface of the piezoelectric plate 112 having a square planar shape and the resonance electrode 1 is formed on the entire lower surface.
14 is formed.

The piezoelectric plate 112 is made of a piezoelectric ceramic such as lead zirconate titanate-based piezoelectric ceramic or a piezoelectric single crystal such as quartz, and is polarized in the thickness direction. Therefore, when the alternating voltage is applied from the resonance electrodes 113 and 114, the square plate is excited in the spreading mode. In this case, the node point of vibration is located at the center of both main surfaces. Therefore, the elastic adhesive 90 is applied only to the central region on the upper surface of the substrate 82. Other structures are similar to those of the embodiment shown in FIG. Although not particularly shown in FIG. 11, the piezoelectric resonator 111
The electrodes 85 and 86 are electrically connected by a flexible lead wire (not shown), and a cap (not shown) is fixed to the substrate 82 so as to cover the piezoelectric resonator 111.

In another modification shown in FIG. 12, the piezoelectric resonator 111 has elastic adhesives 90, 115 to 118 on the substrate 82.
Are joined together. That is, the elastic adhesive 115
1 to 118 are adhered to the lower surface of the piezoelectric plate 112 in the vicinity of the center of the side edge of the piezoelectric plate 112 so that the elastic adhesive 1
15 to 118 are given. Therefore, in this modification, the piezoelectric resonator 111 can be more reliably fixed to the substrate 82 as compared with the case of the modification shown in FIG. In the piezoelectric resonator 111 of the spreading mode, the node point of vibration is only at the center of both principal surfaces, and therefore, FIG.
In the modified example shown in (1), the elastic adhesives 115 to 118 fix the piezoelectric resonator 111 to the substrate 82 at points other than the node points of vibration. However, in the spreading mode of the square plate, the central region of the side surface is a portion where the displacement is as small as the node point. Therefore, the elastic adhesives 115-1
Even if the piezoelectric plate 112 is fixed by using 18, the vibration of the spreading mode of the square plate is not so disturbed.

The other points are the same as those of the modification shown in FIG. FIG. 13 is an exploded perspective view for explaining still another modification of the third embodiment, in which a piezoelectric resonator 121 utilizing a surface vibration mode which is not yet known is used.

The piezoelectric resonator 121 has a rectangular plate-shaped piezoelectric plate 122 polarized in the thickness direction. Piezoelectric plate 122
In the present embodiment, is made of lead zirconate titanate-based piezoelectric ceramics having a Poisson's ratio σ = 0.324. However, the piezoelectric plate 122 may be made of other piezoelectric ceramics, quartz, or a piezoelectric single crystal such as LiTaO ₃ .

In the piezoelectric plate 122, when the length of the long side of the upper surface is b and the length of the short side is a, the ratio b / a is ± 10 with a value satisfying the following equation (2) as the center. It is within the range of%.

[0081]

[Equation 2]

Resonant electrodes 123 and 124 are formed on the entire upper surface and lower surface of the piezoelectric plate 122, respectively.
In the piezoelectric resonator 121, by applying an AC voltage from the resonance electrodes 123 and 124, the piezoelectric resonator 121 is excited in a specific width mode. That is, the above equation (2)
Since the piezoelectric plate 122 is formed so as to satisfy the above condition, the piezoelectric resonator 121 excites the width mode vibration such that the entire region connecting the centers of both side surfaces on the long side forms a vibration node portion. .

In this modification, since the piezoelectric resonator 121 is excited in the specific width mode, the elastic adhesive 126 is applied to the upper surface of the lower substrate 125 at the portion corresponding to the node portion of vibration. There is. Therefore, even if the piezoelectric resonator 121 is bonded to the substrate 125 via the elastic adhesive 126, the vibration of the piezoelectric resonator 121 is hardly disturbed.

On the upper surface of the substrate 125, the electrodes 127, 12
8 are formed. The electrode 127 is electrically connected to the resonance electrode 123 by a flexible lead wire (not shown), and the electrode 128 is connected by a flexible lead wire (not shown).
Electrically connected to 24. After the piezoelectric resonator 121 is fixed on the substrate 125, a cap (not shown) covers the piezoelectric resonator 121 and is fixed on the substrate 125.

Also in this modification, the elastic adhesive 126 is bonded to the vibration node portion of the piezoelectric resonator 121,
Since the gap corresponding to the thickness of the elastic adhesive 126 is formed between the piezoelectric resonator 121 and the upper surface of the substrate 125, and the elastic adhesive 126 itself has elasticity, the piezoelectric resonator 121 is formed by the fixing structure. There is no deterioration of the resonance characteristics of. In addition, since the resonance electrodes 123 and 124 are joined to the electrodes 127 and 128 by the flexible lead wire, the vibration of the piezoelectric resonator 121 is not hindered by the electrical connection structure during use.

As is apparent from the modified examples shown in FIGS. 11 to 13, the piezoelectric oscillator according to the present invention uses various vibration modes as long as the plane vibration mode mainly including in-plane deformation is used. A piezoelectric resonator can be constructed.

Fifth Embodiment FIG. 14 is an exploded perspective view for explaining a piezoelectric filter according to a fifth embodiment of the present invention.

In this embodiment, the piezoelectric filter element 132 is fixed on the substrate 131 via the elastic adhesive 133. The board 131 has notches 131a to 1 on one side surface.
31c has a notch 1 on the opposite side surface facing the side surface.
31d to 131f are formed. In addition, the substrate 131
Electrodes 134a to 134c are formed in parallel with each other on the upper surface of the. The electrode 134a has the notches 131a, 1
It is formed so as to reach the inside of 31d. Similarly, electrode 1
The electrode 34c is formed so as to reach the insides of the notches 131b and 131e, and the electrode 134c is formed so as to reach the insides of the notches 131c and 131f.

The piezoelectric resonator 132 is composed of a piezoelectric plate 135 having a square planar shape. Piezoelectric plate 135
Are made of piezoelectric single crystal such as piezoelectric ceramics or quartz, and a first resonance electrode 136 having a square planar shape is formed at the center of the upper surface. Further, a rectangular frame-shaped second resonance electrode 137 is formed along the outer peripheral edge of the upper surface. A resonance electrode 138 is formed on the entire lower surface of the piezoelectric plate 135.

Therefore, in the piezoelectric filter element 132, the resonance electrode 136 is the input end and the resonance electrode 137 is the output end,
By connecting the resonance electrode 138 on the back surface to the ground potential, it can be operated as a bandpass filter.

Also in this embodiment, the piezoelectric filter element 138 is fixed to the substrate 131 by the elastic adhesive 133 at the center of the lower surface. Therefore, since the piezoelectric filter element 132 is fixed to the substrate 131 at the node of vibration, the elastic adhesive 133 has elasticity, and the piezoelectric characteristics are not affected as described above without affecting the filter characteristics. The filter element 132 can be supported.

The first resonance electrode 136 is connected to the electrode 134a by a flexible lead wire (not shown).
The resonance electrode 137 is electrically connected to the electrode 134c by a flexible lead wire not shown, and the resonance electrode 132 on the back surface side is electrically connected to the electrode 134b by a flexible lead wire not shown. These lead wires can also be made of a flexible wire material such as Cu as in the first embodiment described above.

Although not shown in the drawing, in the state where the piezoelectric filter element 132 is fixed on the substrate 131, the cap surrounds the piezoelectric filter element 132 as in the first embodiment, and the substrate 131 is bent. Fixed to.

Sixth Embodiment FIG. 15 is an exploded perspective view for explaining a piezoelectric filter according to a sixth embodiment of the present invention.

The piezoelectric filter of the sixth embodiment corresponds to a modification of the piezoelectric filter of the fifth embodiment. The difference is that the piezoelectric filter element 141 is provided on the substrate 131 and the piezoelectric resonator 132 with the elastic adhesive 140 interposed therebetween.
Is laminated to form a laminated body including the piezoelectric filter element 132 and the piezoelectric filter element 141. Also,
Since the two piezoelectric filter elements 132 and 141 are used, the electrodes on the substrate 131 are also changed accordingly.

That is, the electrode 142 is formed on the substrate 131.
a to 142 g are formed. The electrode 142a is formed on the upper surface of the substrate 131 in the vicinity of the cutout 131a, and is formed so as to extend into the cutout 131a. Further, the electrode 142b is formed on the upper surface of the substrate 131 near the cutout 131b so as to reach the cutout 132b. Similarly, the electrodes 142c, 142e, 142
f and 142g are formed on the upper surface of the substrate 131 in the vicinity of the cutouts 131c to 131f, respectively, and are formed so as to reach the cutouts 131c to 131f, respectively. The electrode 142d is independently formed near the electrode 142c.

In this embodiment, the piezoelectric filter element 132 is fixed to the substrate 131 via the elastic adhesive 133, and the piezoelectric filter element 1 is fixed via the elastic adhesive 140.
A piezoelectric filter element 141 is fixed on 32. The elastic adhesives 133 and 140 join the piezoelectric filter elements 132 and 141 at the nodes of vibration of the piezoelectric filter elements 132 and 141, respectively. Therefore, the bonding structure does not deteriorate the characteristics of the piezoelectric filter elements 132 and 141.

The electrical connection between the piezoelectric filter elements 132, 141 and the electrodes 142a to 142g is made by a flexible lead wire (not shown). The piezoelectric filter element 141 is configured similarly to the piezoelectric filter element 132. That is, the piezoelectric plate 143 formed of a square plate has the resonance electrodes 144 and 145 on the upper surface and the resonance electrode 146 on the lower surface.

The resonance electrodes 136 and 144 are connected to the electrode 142d by lead wires (not shown). Also,
The resonance electrode 137 is electrically connected to the electrode 142c, and the resonance electrode 145 is electrically connected to the electrode 142a. Resonance electrode 138
And 146 are electrically connected to the electrode 142b by lead wires. Therefore, the electrode 142a is used as an input end, the electrode 142c is used as an output end, and the electrode 142b is connected to the ground potential to form a two-element type filter circuit in which the two piezoelectric filter elements 132 and 141 are directly connected. be able to. The electrode 142e
~ 142g shows dummy electrodes, but electrodes 142e ~ 1
42g is an electrode 142 on the substrate 131 side.
a to 142c, which makes it possible to electrically connect to the printed circuit board on either side of the pair of side surfaces of the board 131.

Seventh Embodiment FIG. 16 is an exploded perspective view for explaining the seventh embodiment of the present invention. In the seventh embodiment, a capacitor-embedded piezoelectric oscillator utilizing the width expansion mode is provided.

The substrate 151 is made of an insulating material such as alumina and is composed of a plate-shaped member having a substantially rectangular plan shape. A cutout 151a is formed on one short side surface of the substrate 151.
~ 151c has notches 151e to 151 on the opposite side surface.
g is formed. Further, electrodes 152a to 152c are formed in parallel on the upper surface of the substrate 151. Electrode 1
52a is extended in the direction which connects the notch 151a and the notch 151e, and these notches 151a and 151e.
It is formed to reach inside. Similarly, the electrode 152b
Are formed so as to connect the notches 151b and 151f and reach the inside of these notches 151b and 151f. Also for the electrode 152c, the notch 151c and the notch 1
It extends in the direction connecting with 51g, and is formed so as to reach the inside of these notches 151c, 151g.

At the center of the upper surface of the substrate 151, the elastic adhesive 1
53 is assigned. Further, the elastic adhesives 154 and 154 are applied at a predetermined distance from the elastic adhesive 153.

The elastic adhesive 1 is formed on the upper surface of the substrate 151.
A piezoelectric oscillator 155 with a built-in capacitor using the widening mode is fixed via 53 and 154. Piezoelectric oscillator 1
55 is configured by using the piezoelectric plate 156. In the piezoelectric plate 156, the ratio b / a is set so that the ratio b / a falls within a range of ± 10% centered on the value satisfying the above-mentioned formula (1).
Is chosen.

At the center of the upper surface of the piezoelectric plate 156, the resonance electrode 1
57 are formed. Further, a rectangular frame-shaped electrode 158 for taking out the capacitance is formed on the outer peripheral edge of the upper surface. An electrode 159 is formed on the entire lower surface of the piezoelectric plate 156. Therefore, in the piezoelectric oscillator 155, the resonance electrode 1
By applying an AC voltage to 57 and the electrode 159 on the back surface, the piezoelectric plate 156 can be excited in the widening mode, and the capacitor built-in piezoelectric oscillation in which the capacitance between the electrode 158 and the electrode 159 is loaded. Can be operated as a child.

The resonance electrode 157 is electrically connected to the electrode 152a by a lead wire not shown, the electrode 158 is electrically connected to the electrode 152b by a lead wire not shown, and the electrode 159 on the lower surface is electrically connected to the electrode 152c by a lead wire not shown. The piezoelectric oscillator 155 is excited in the widening mode, but the elastic adhesives 154 and 154 are used to fix the piezoelectric oscillator 155 to the substrate 151 when the piezoelectric plate 156 is used.
The piezoelectric plate 156 and the substrate 15 near the center of the short side surface of the
Join 1 and. Similarly, the elastic adhesive 153 is used for the piezoelectric plate 1.
The piezoelectric plate 156 and the substrate 151 are bonded at the center of the lower surface of 56. Therefore, since the elastic adhesives 153 and 154 bond the piezoelectric oscillator 155 at the node portion of the vibration of the widening mode, the piezoelectric oscillator 15 having the above-described bonding structure is bonded.
The deterioration of the characteristics of 5 is unlikely to occur.

Also in this embodiment, the piezoelectric oscillator 155 is used.
After fixing the substrate 151 to the substrate 151, a cap similar to that used in the first embodiment is fixed to the substrate 151 so as to cover the piezoelectric oscillator 155, thereby providing a chip-type capacitor-embedded piezoelectric oscillator. To be done.

When the structure shown in FIG. 16 and the structure shown in FIG. 14 are compared, they are almost the same except that the vibration mode of the piezoelectric resonator is different. That is, it is understood that the piezoelectric oscillator with a built-in capacitor and the piezoelectric filter using one element have the same electrode structure. Therefore, the capacitor built-in type piezoelectric oscillator of the present embodiment shown in FIG. 16 can be operated as a piezoelectric filter by directly connecting the electrode 152a to the input end, the electrode 152c to the output end, and the electrode 152b to the ground potential. . Conversely, FIG.
The structure shown in FIG. 4 can be used as it is as a capacitor-embedded piezoelectric oscillator.

Eighth Embodiment FIGS. 17 and 18 are an exploded perspective view and a perspective view for explaining a piezoelectric filter according to an eighth embodiment of the present invention.

In the present embodiment, the elongated rectangular plate-shaped substrate 1
A piezoelectric filter element 162 using the length mode is fixed on 61 via an elastic adhesive 163. Board 161
Is made of an insulating material such as alumina or synthetic resin. On one long side surface of the substrate 161,
Notches 161a to 161c are formed. Notches 161d, 161e, 161f are formed on the other side surface on the long side.

In the vicinity of the cutout 161a, the substrate 161 is formed.
An electrode 164a is formed on the upper surface of the
The a is formed so as to extend into the notch 161a. Similarly, an electrode 165a is formed near the cutout 161b, and the electrode 165a is formed so as to extend into the cutout 161b. Further, the electrode 165a has a cutout 16
It extends to the vicinity of 1a, and is formed so as to reach the inside of the cutout 161f. Furthermore, the notch 161c,
Electrodes 164 are formed on the upper surface of the substrate near 161d and 161e.
c, 164d, 164e are formed respectively.

On the other hand, the piezoelectric filter element 162 is composed of a long and narrow rectangular plate-shaped piezoelectric plate 166. Grooves 167 are formed on the upper surface of the piezoelectric plate 166 so as to extend in the length direction. The piezoelectric plate 166 is uniformly polarized in the thickness direction, and is made of lead zirconate titanate-based piezoelectric ceramics in this embodiment.

A groove 167 is formed on the upper surface of the piezoelectric plate 166.
On both sides of the first and second resonance electrodes 168a, 168a,
168b is formed. A resonance electrode 168c is formed on the entire lower surface of the piezoelectric plate 166. Therefore, the resonance electrode 168a is used as an input end or an output end, the resonance electrode 168b is used as an output end or an input end, and the resonance electrode 168c is connected to the ground potential to operate as a bandpass filter using the length mode. You can

Piezoelectric Filter Element 1 Using Length Mode
At 62, the vibration node is located at the center in the length direction. Therefore, in this embodiment, the elastic adhesive 163 is
A longitudinal center region of the lower surface of the piezoelectric filter element 162,
The piezoelectric filter element 16 is bonded to the substrate 161.
2 is bonded to the substrate 161 via the elastic adhesive 163.

Therefore, also in this embodiment, the piezoelectric filter element 16 having the fixed structure of the piezoelectric filter element 162 is used.
The deterioration of the attenuation amount-frequency characteristic of 2 is unlikely to occur. Piezoelectric filter element 162 and electrodes 164a to 164 on substrate 161
For the connection with e, the flexible lead wire 1 shown in FIG.
69a-169c.

That is, the resonance electrode 168a and the electrode 164a are electrically connected by the lead wire 169a. The resonance electrode 168b is electrically connected to the electrode 164c by the lead wire 169b. Further, the resonance electrode 168c is connected to the electrode 165 by the lead wire 169c.
a. Therefore, the electrode 164a is connected to the input end, the electrode 164c is connected to the output end, and the electrode 165 is connected.
By connecting a to the ground potential, it can be operated as a piezoelectric filter. The electrodes 164d and 164e shown in FIG. 17 are dummy electrodes, and by mounting the electrodes on dummy electrode lands on the printed circuit board with solder, the mounting strength of the piezoelectric filter of this embodiment can be increased.

Although not shown in FIG. 18,
On the substrate 161, a cap (not shown) is attached so as to cover the piezoelectric filter element 162, and the substrate 16
It is fixed on the upper surface of 1.

[0117] With reference to the ninth embodiment FIGS. 19 and 20 of, illustrating the ladder filter according to a ninth embodiment of the present invention.

In this embodiment, four piezoelectric resonators shown in the exploded perspective view of FIG. 19 are used. Referring to FIG.
Similar to the piezoelectric resonators 31 to 34 used in the first embodiment, the four piezoelectric resonators 181 to 184 are piezoelectric resonators that utilize the widening mode.

The piezoelectric resonator 181 has substantially the same structure as the piezoelectric resonator 31 shown in FIG. Therefore, the same portions will be denoted by the same reference numerals and the description thereof will be omitted. The piezoelectric resonator 181 is the piezoelectric resonator 31.
The difference is that an electrode 185 is formed on one side surface of the piezoelectric plate 35 so as to be electrically connected to the extraction electrode 37.

The piezoelectric resonator 182, which is laminated above the piezoelectric resonator 181, is constructed by using a rectangular piezoelectric plate 186. The piezoelectric plate 186 is the piezoelectric plate 4 shown in FIG.
It has the same configuration as 0. On the upper surface of the piezoelectric plate 186,
The resonance electrode 187 is formed. The resonance electrode 187 is
The piezoelectric plate 186 is formed so as not to reach one side edge 186a. Further, the resonance electrode 187 is connected to the extraction electrode 188 formed on the side surface. Further, on the lower surface of the piezoelectric plate 186, a resonance electrode is formed so as to face the resonance electrode 187 on the front and back sides. This piezoelectric plate 1
The resonance electrode formed on the lower surface of 86 is formed so as not to reach the side edge 186b. That is, the side edge 186 is not electrically connected to the extraction electrode 188.
It is formed so as to be separated from b by a gap region having a predetermined width. Further, the resonance electrode on the lower surface is connected to the extraction electrode formed on the side surface opposite to the side surface on which the extraction electrode 188 is formed.

The thickness of the piezoelectric plate 186 is smaller than the thickness of the piezoelectric plate 35 of the piezoelectric resonator 181. The piezoelectric resonator 183 has the same structure as the piezoelectric resonator 182. That is, it has a structure in which the resonance electrode 190 is formed on the upper surface of the rectangular piezoelectric plate 189 and the extraction electrode 191 connected to the resonance electrode 190 is formed on the side surface. In addition, the piezoelectric plate 18
The other resonance electrode is formed on the lower surface of 9, and the other resonance electrode is connected to the extraction electrode formed on the side surface opposite to the extraction electrode 191.

The piezoelectric resonator 184 has the same structure as the piezoelectric resonator 181. The piezoelectric resonators 181 to 184
Among them, the piezoelectric resonators 181 and 184 form a series resonator of a ladder type filter, and the piezoelectric resonators 182 and 183 form a parallel resonator.

At the time of manufacture, as shown in FIG. 19, the piezoelectric resonator 181 and the piezoelectric resonator 182 are made of the elastic adhesive 1
It is joined via 92 and 193. Elastic adhesive 192
Is the center of the upper surface of the piezoelectric resonator 181 and the piezoelectric resonator 18
The center of the lower surface of 2 is joined. Also, the elastic adhesive 1
93 and 193 connect the upper surface of the piezoelectric resonator 181 and the lower surface of the piezoelectric resonator 182 in the vicinity of the central region of the side surface on the short side of the piezoelectric resonators 181 and 182. That is, the elastic adhesives 192 and 193 bond the piezoelectric resonators 181 and 182 using the widening mode at the nodes of the respective vibrations. Similarly, the piezoelectric resonator 18
2 and the piezoelectric resonator 183 are elastic adhesives 194, 195.
Are joined through. Further, the piezoelectric resonator 183 and the piezoelectric resonator 184 are joined together via elastic adhesives 196 and 197.

Thus, the laminated body 19 shown in FIG. 20 is obtained.
8 are configured. The substrate 199 and the lowermost piezoelectric resonator 181 in the laminated body 198 are made of the elastic adhesive 192,
Similar to 193, the piezoelectric resonator 181 is joined by an elastic adhesive disposed at the vibration node portion. In addition, the thickness of this elastic adhesive is such that a predetermined gap is formed in the piezoelectric resonator 181.
And the substrate 199.
Therefore, as in the first embodiment, it is possible to obtain a structure in which a laminated body including a plurality of piezoelectric resonators is laminated and integrated on a substrate in a state where the vibration of each piezoelectric resonator is not hindered.

Further, the electrode 200a is formed on the substrate 199.
.About.200e are formed. Electrodes 200a to 200e
And the electrical connection between the piezoelectric resonators 181 to 184 are
It is performed in the same manner as in the first embodiment. That is, the first
By electrically connecting the four piezoelectric resonators in the same manner as in the above embodiment, the two-stage ladder type filter shown in FIG. 5 is also configured in this embodiment. However, in the ladder type filter of the present embodiment, unlike the first embodiment, electrical connection between the piezoelectric resonator and the electrodes on the substrate is not a flexible lead wire but a flat ribbon wire 201a.
~ 201d. Since the other points are the same as those of the first embodiment, detailed description thereof will be omitted.

As is clear from the ladder type filter of the present embodiment, the flexible conductor of the present invention is not limited to the flexible wire used in the first embodiment, but may be a flat conductor such as a ribbon wire. You may comprise with the metal material which has.

Further, as is apparent from the ladder type filter of this embodiment, each piezoelectric resonator 181 to 184 and the substrate 1 are
The electrical connection with the electrodes 200a to 200c on the electrode 99 is made by the electrodes 18 formed on the side surfaces of the piezoelectric resonators 181 to 184.
5, 188, 191 and so on, and therefore the ribbon wire 201a, which is a flat conductor as described above, can be used.
It is possible to reliably connect the piezoelectric resonators 181 to 184 to the electrodes 200a to 200c on the substrate by using 200d.

Tenth Embodiment FIGS. 21 and 22 are views for explaining a ladder type filter according to a tenth embodiment of the present invention.

In this embodiment, similarly to the embodiment shown in FIGS. 19 and 20, the end faces of the piezoelectric resonator are used to make electrical connection with the electrodes on the substrate. With reference to FIG. 21, in the present embodiment, four piezoelectric resonators 211 to 2 are used.
14 is used, and these are laminated to form a laminated body. Further, the piezoelectric resonators 211 to 214 are all piezoelectric resonators using the above-described widening mode, and therefore the piezoelectric plate used is the piezoelectric resonator of the piezoelectric resonator used in the first embodiment. Is configured similarly to.

In the piezoelectric resonator 211, a resonance electrode 216 is formed at the center of the upper surface of the piezoelectric plate 215. Resonance electrode 2
16 is electrically connected to a lead electrode 217 extended to one side surface of the piezoelectric plate 215. A resonance electrode is formed on the lower surface of the piezoelectric plate 215 at a position facing the resonance electrode 216, and the resonance electrode is formed on the bottom surface of the piezoelectric plate 215.
It is electrically connected to the extraction electrode 218 formed on the side surface of 15. That is, in the piezoelectric resonator 211, the extraction electrodes 217 and 218 are formed on the side surfaces in order to electrically connect the piezoelectric resonator 211 to the electrodes on the substrate described later.

Similarly, in the piezoelectric resonator 212, the piezoelectric plate 2
The resonance electrode 220 is formed on the upper surface of the piezoelectric element 19, and the resonance electrode 220 is electrically connected to the extraction electrode 221 formed on the side surface of the piezoelectric plate 219. Further, a resonance electrode is formed at a position facing the resonance electrode 220, and the resonance electrode is electrically connected to the extraction electrode 222 formed on the side surface of the piezoelectric plate 219.

The piezoelectric resonator 213 is constructed similarly to the piezoelectric resonator 212. The piezoelectric resonator 214 has the same structure as the piezoelectric resonator 211. Piezoelectric resonator 2
11 to 214 are bonded to each other via an elastic adhesive 223 to form a laminated body 230 shown in FIG. The elastic adhesive 223 is arranged so as to join the center of the upper surface of the lower piezoelectric resonator and the center of the lower surface of the piezoelectric resonator arranged above. Moreover, the elastic adhesive 223 is configured to have a predetermined thickness in order to form a space between the upper and lower piezoelectric resonators. With reference to FIG. 22, the laminated body 230 obtained as described above is bonded onto the substrate 231 via the elastic adhesive 232. Elastic adhesive 232
Are provided so as to contact the center of the lower surface of the piezoelectric resonator 211.

Therefore, the four piezoelectric resonators 211 to 214 are fixed on the substrate 231 via the elastic adhesives 232 and 223. However, as in the case of the first embodiment, the piezoelectric resonance is fixed by the fixing structure. There is no possibility that the characteristics of the children 211 to 214 deteriorate.

The feature of this embodiment is that the piezoelectric resonator 21 is
1-214 and the electrode 233a formed on the substrate 231
To 233c are electrically connected to the respective piezoelectric resonators 211 and 2-2.
Lead electrodes 217, 218 formed on the side surfaces of
221 and 222 and the flexible wiring board 234 shown on the right side in FIG. 22. The flexible wiring board 234 has a structure in which a flexible synthetic resin film such as polyimide is used as a base material and a predetermined wiring pattern 235 is formed on one surface of the board. The wiring pattern 235 is schematically shown in FIG. 22, but the extraction electrodes 217, 218, and the extraction electrodes 217, 218, so that the four piezoelectric resonators 211 to 214 form the two-stage ladder type filter shown in FIG. 221, 222 and the electrode 233
a to 233c are electrically connected.

The flexible wiring board 234 is connected to the lead electrodes 217, 218, 22 of the piezoelectric resonators 211 to 214.
The flexible wiring board 234 is also soldered to the electrodes 233a to 233c on the board 231. In this way, the flexible wiring board 2
34 is joined to the piezoelectric resonators 211 to 214 and the electrodes 233a to 233c on the substrate 231 by soldering, but since the flexible wiring substrate 234 itself has sufficient flexibility, the piezoelectric resonance is caused by the joining by the solder. It is very unlikely that the resonance characteristics of the children 211 to 214 will deteriorate.

As is clear from the embodiment shown in FIG. 22, the flexible conductor of the present invention forms a predetermined electric wiring pattern on a flexible base material like the flexible wiring board 234. It may be one.

Eleventh Embodiment FIGS. 23 and 24 are diagrams for explaining a ladder type filter according to an eleventh embodiment of the present invention.

As shown in FIG. 23, in this embodiment, 4
The piezoelectric resonators 241 to 244 are laminated to form a laminated body. Each of the piezoelectric resonators 241 to 244 is a piezoelectric resonator using the spreading mode of a square piezoelectric plate.

The piezoelectric resonator 241 is composed of a piezoelectric plate 245 having a square planar shape. The piezoelectric plate 245 is polarized in the thickness direction. A resonance electrode 246 is formed at the center of the upper surface of the piezoelectric plate 245. A lead electrode 247 is formed along one side edge so as to be electrically connected to the resonance electrode 246.

Although not shown in particular, a resonance electrode is formed on the lower surface of the piezoelectric plate 245 at a position facing the resonance electrode 246, and extends along the side edge on the side opposite to the extraction electrode 247. Thus, the extraction electrode is formed.

The piezoelectric resonator 242 is composed of a piezoelectric plate 248 which is thinner than the piezoelectric plate 245. A resonance electrode 249 is formed on the entire upper surface of the piezoelectric plate 248. Although not particularly shown, a resonance electrode is also formed on the entire lower surface. The piezoelectric resonator 243 is the piezoelectric resonator 24.
It is constructed in the same manner as 2. In addition, the piezoelectric resonator 244
Are configured similarly to the piezoelectric resonator 241.

The piezoelectric resonators 241 and 244 are piezoelectric resonators 242 and 24 as series resonators of the ladder type filter.
3 is used as a parallel resonator and is electrically connected as described later to form the two-stage ladder type filter shown in FIG.

Further, the piezoelectric resonators 241 to 244 are bonded to each other by an elastic adhesive 250 arranged so as to bond the centers of the main surfaces of the upper and lower piezoelectric resonators, respectively, and the laminated body 251 shown in FIG. Are configured. Laminate 251
Then, the electrode structure on the upper surface is not shown. Similar to the elastic adhesive used in the first embodiment, the elastic adhesive 250 is provided with a thickness so as to form a space between the upper and lower piezoelectric resonators so as not to prevent vibration, and itself. Has elasticity.

Further, in this embodiment, the piezoelectric resonator 2 described above is used.
A laminated body 251 constituted by laminating 41 to 244,
It is fixed on a terminal plate 253 made of a flat metal member via an elastic adhesive 256. The elastic adhesive 256 is provided so as to join the center of the lower surface of the piezoelectric resonator 241 and the terminal plate 253. Therefore, the laminated body 2 shown in FIG.
There is no fear that the vibration of the piezoelectric resonator 241 will be hindered when the terminal 51 is fixed to the terminal plate 253.

That is, in the present embodiment, the substrate of the present invention is the terminal plate 25 made of a metal plate having the terminal portion 253a.
3. In addition to the terminal board 253,
Terminal plates 252, 254, 255 are arranged side by side as shown in FIG. At the time of assembly, the terminal plates 252 to 255 arranged as shown in FIG. 23 are arranged, and the laminated body 251 is bonded onto the terminal plate 253 with the elastic adhesive 256.

The electrical connection between the piezoelectric resonators 241-244 and the terminal plates 252-255 is made by using lead wires 257a-257d as shown in FIG. That is, the extraction electrode 247 of the piezoelectric resonator 241
Are electrically connected to the terminal board 254 by lead wires 257a. The resonance electrode on the lower surface of the piezoelectric resonator 241 is electrically connected to the terminal plate 253 by a lead wire (not shown). Further, the resonance electrode 249 of the piezoelectric resonator 242
Are electrically connected to the terminal plate 252 by lead wires 257b. The resonance electrode on the lower surface of the piezoelectric resonator 242 is
It is electrically connected to the terminal board 252 by a lead wire (not shown).

A resonance electrode 249 on the upper surface of the piezoelectric resonator 243.
Are electrically connected to the terminal plate 253 by lead wires 257c. The resonance electrode on the lower surface of the piezoelectric resonator 243 is electrically connected to the terminal plate 252. Further, the resonance electrode 246 on the upper surface of the piezoelectric resonator 244 is connected to the lead wire 257d.
Are electrically connected to the terminal plate 255. The resonance electrode on the lower surface of the piezoelectric resonator 244 is electrically connected to the terminal plate 253 by a lead wire (not shown).

Therefore, by using the terminal plate 255 as an input end, the terminal plate 254 as an output end, and connecting the terminal plate 252 to the reference potential, it is possible to operate as the two-stage ladder filter shown in FIG. it can. The terminal plate 253 functions as a wiring portion that electrically connects the piezoelectric resonators.

In this embodiment, as described above, the terminal board 2
A ladder-type filter is configured as an electronic component with leads provided with 52 to 255. In fact, FIG.
, The terminal plates 252 to 255 are arranged, the laminated body 251 is fixed on the terminal plate 253, the electrical connection is performed, paraffin wax is applied to the surroundings, and thermosetting is further performed. A resin exterior 258 is formed by covering the periphery with a resin and heating and curing.
In this way, it is possible to provide a ladder type filter as an electronic component with lead terminals provided with the resin exterior 258.

Twelfth Embodiment In the eleventh embodiment, a substrate is constructed by using a terminal plate, and four piezoelectric resonators are laminated on it to construct a ladder type filter. In the present invention, it is possible to configure the piezoelectric oscillator by using the terminal plate as the substrate. Such an example will be described with reference to FIGS. 25 and 26.

In this embodiment, a terminal plate 261 made of a metal plate and a terminal plate 262 are used as the substrate.
In the terminal plate 261, the element mounting portion 261a is configured to have a certain area, and the element mounting portion 261 is formed.
A terminal portion 261b extending from a to one side is formed. The elastic adhesive 26 is provided at the center of the element mounting portion 261a.
3 is given. Using this elastic adhesive 263,
The piezoelectric resonator 264 arranged above is fixed. The piezoelectric resonator 264 has a structure in which a resonance electrode 266 is formed on the upper surface of a piezoelectric plate 265 having a square planar shape, and a resonance electrode (not shown) is formed on the entire lower surface. In addition, the piezoelectric plate 265
Is polarized in the thickness direction.

The center of the lower surface of the piezoelectric resonator 264 is fixed to the terminal plate 261 as a substrate by the elastic adhesive 263. Further, as shown in FIG. 26, the resonance electrode 266 is electrically connected to the terminal plate 262 by the lead wire 267a. Connected. The resonance electrode on the lower surface is electrically connected to the terminal plate 261 by a lead wire (not shown). At the time of manufacturing, as shown in FIG.
After fixing the piezoelectric resonator 264 on the wire 262 and finishing the electrical connection work by the lead wire, the periphery is covered with the resin sheath 26.
Cover with 8. This resin sheath 268 is the tenth
In the same manner as in the above embodiment, paraffin wax is applied to the periphery of the remaining portions of the terminal plates 261 and 262 excluding the terminal lead-out portions, and the periphery is further covered with a thermosetting resin.
It is formed by heating.

Modification of Twelfth Embodiment FIG. 27 shows a modification of the twelfth embodiment. In the present modification, a piezoelectric resonator 271 with a built-in capacitor that uses the width expansion mode is used instead of the piezoelectric resonator that uses the width expansion mode of a square plate. In the piezoelectric oscillator 271,
A piezoelectric plate 272 having a ratio b / a within a range of ± 10% around a value satisfying the expression (1) is used. On the upper surface of the piezoelectric plate 272, a resonance electrode 273 is formed in the center, and a rectangular frame-shaped electrode 274 is formed along the outer peripheral edge. Further, a resonance electrode 275 is formed on the entire lower surface of the piezoelectric plate 272.

In this modification, three terminal boards 276 are provided.
~ 278 is used. Terminal plate 277 arranged in the center
Has an element mounting portion 277a having a certain area, and a terminal lead-out portion 277b extending from the element mounting portion 277a to one side. In the center of the element mounting portion 277a,
Elastic adhesive 279 is applied. This elastic adhesive 279
As a result, the central area of the lower surface of the piezoelectric resonator 271 is adjusted to
7 fixed.

For electrical connection, the resonance electrode 273 is connected to the terminal plate 276 by a lead wire (not shown), the electrode 274 is connected to the terminal plate 278 by a lead wire (not shown), and the resonance electrode 2 on the lower surface is connected.
This is performed by joining 75 to the terminal plate 277 with a lead wire (not shown).

Thereafter, similarly to the twelfth embodiment, by providing a resin sheath on the periphery, it is possible to provide a capacitor-embedded piezoelectric oscillator utilizing the width-spreading mode as an electronic component with leads.

As is apparent from this modification, the capacitor built-in type piezoelectric oscillator and the filter (which can be used as a filter with the same structure as the piezoelectric oscillator 271) can also be formed by using a substrate made of a terminal plate. It can be configured as a leaded electronic component.

Further, in the modification shown in FIG. 27, the capacitor built-in type piezoelectric oscillator 271 utilizing the widening mode.
However, the piezoelectric oscillator with a built-in capacitor using the spreading mode of the square plate can be similarly configured as an electronic component with leads.
Such an example is shown in FIG.

That is, as shown in FIG. 28, in this modification, a piezoelectric oscillator 281 utilizing the width expansion mode of a square plate is used. This piezoelectric oscillator 281 uses a piezoelectric plate 282 having a square planar shape, except that
It is configured similarly to the piezoelectric resonator 271. Therefore, the corresponding portions will be denoted by the corresponding reference numerals, and the description thereof will be omitted. Also in this modification, the piezoelectric oscillator 281 is fixed on the terminal plate 277 using the elastic adhesive 283. However, in this modification, the elastic adhesive 283 is made of a material that has not only elasticity but also conductivity. An example of such an elastic adhesive having conductivity is an adhesive made of a conductive silicone resin. The elastic adhesive 283 not only fixes the resonance electrode 275 on the lower surface of the piezoelectric oscillator 281 to the terminal plate 277, but also the resonance electrode 275 and the terminal plate 277.
The electrical connection with is also fulfilled. Therefore, in the modification shown in FIG. 28, the number of flexible conductors required for electrical connection can be reduced by one compared with the case of the modification shown in FIG.

Thirteenth Embodiment FIG. 29 is an exploded perspective view for explaining a ladder type filter according to a thirteenth embodiment of the present invention.

In this embodiment, four piezoelectric resonators 301 to 304 using the width expansion mode are laminated to form a ladder type filter. Piezoelectric resonators 301 to 3
No. 04 uses the width expansion mode, and each is formed by using a piezoelectric plate whose ratio b / a is within a range of ± 10% around the value satisfying the above-mentioned formula (1).

The piezoelectric resonator 301 is a rectangular piezoelectric plate 305.
Has a structure in which a resonance electrode 306 is formed at the center of the upper surface of
Although not shown in particular, a resonance electrode is formed on the lower surface of the piezoelectric plate 305 so as to face the resonance electrode 306 on the front and back sides. Resonance electrode 306 has extraction electrodes 307a and 307b formed so as to reach the side edges on the short side, respectively.
It is connected to. The extraction electrode 307b is electrically connected to the metal wire 308 as a flexible conductor. In addition, the extraction electrode 307b and the metal wire 3
The insulating adhesive 309 is applied so as to cover the joint portion with 08.

The piezoelectric resonator 302 is composed of a piezoelectric plate 310 which is thinner than the piezoelectric plate 305. Piezoelectric plate 31
A resonance electrode 311 is formed on the entire upper surface of the 0.
A resonance electrode is formed on the entire lower surface. The resonance electrode 311 is a metal wire 31 as a flexible conductor.
2 are electrically connected. In addition, the insulating adhesive 31
3 is provided so as to cover the joint portion between the metal wire 312 and the resonance electrode 311.

The piezoelectric resonator 303 has the same structure as the piezoelectric resonator 302. However, here, the metal wire 314 connected to the resonance electrode 311 is connected to the piezoelectric resonator 3.
02 is pulled out to a position different from the metal wire 312 connected to 02.

The piezoelectric resonator 304 has the same structure as the piezoelectric resonator 301. However, the metal wire 315
Is a metal wire 308, 312, which is provided below
It is pulled out to a position different from 314.

The piezoelectric resonators 301 to 304 are made of the elastic adhesive 3 having conductivity at the center of the main surface of the piezoelectric resonator.
16,317,318 are joined to each other to form a laminated body. Since the elastic adhesives 316 to 138 are made of a conductive adhesive having elasticity such as conductive silicon, the upper and lower resonance electrodes to be joined via the elastic adhesives 316 to 318 are electrically connected. Connected. Similarly,
The resonance electrode (not shown) on the lower surface of the piezoelectric resonator 301 is
It is fixed to the upper surface of the substrate 320 by a conductive elastic adhesive 319 shown in a floating state, and the resonance electrode on the lower surface of the piezoelectric resonator 301 is electrically connected to the electrode 320a on the substrate 320. To be done.

The substrate 320 is made of insulating ceramics such as alumina or synthetic resin, and has the upper surface of the electrode 3
It has a structure in which electrodes 320b to 320g are formed in addition to 20a.

In the present embodiment, the piezoelectric resonators 301 to 301
When bonding the laminated body made of 304 onto the substrate 320, not only the elastic adhesive 319 but also elastic adhesives 321 and 322 having insulating properties are used. Elastic adhesive 321,
322 connects the lower surface of the piezoelectric resonator 301 to the substrate 320 in the vicinity of the center of the side surface on the short side of the piezoelectric resonator 301. That is, the piezoelectric resonator 301 is fixed to the substrate 320 at the vibration node portion.

Therefore, the substrate 32 is also used in this embodiment.
The characteristics of each piezoelectric resonator are not hindered when the laminated body including the piezoelectric resonators 301 to 304 is fixed on the surface of the piezoelectric resonator.

In this embodiment, the insulating rectangular frame-shaped spacer 323 made of synthetic resin or the like is fixed on the substrate 320 with an adhesive. This spacer 323 is
It is provided for insulation when the cap is metal. Further, although not particularly shown, a cap is fixed to the substrate 320 so as to cover the above-described laminated body including the piezoelectric resonators 301 to 304.

In this embodiment, the piezoelectric resonators 301 to 30 are used.
4 are electrically connected so as to form the ladder filter shown in FIG. This electrical connection connects the metal wires 308, 312, 314, 315 described above to the electrode 320.
Electrical connection between the piezoelectric resonators is also performed by bonding to b to 320d, and elastic adhesives 316 to 319 made of the elastic conductive adhesive described above are also used.

As described above, in this embodiment, since the elastic adhesives 316 to 319 also have an electrical connection function, the number of conductors having flexibility necessary for electrical connection of the piezoelectric resonators 301 to 304 is reduced. can do.

[Brief description of drawings]

FIG. 1 is a schematic exploded perspective view for explaining the structure of a conventional ladder type filter.

FIG. 2 is an exploded perspective view for explaining the chip-type ladder type filter according to the first embodiment of the present invention.

FIG. 3 is a sectional view of the ladder filter shown in FIG.

FIG. 4 is an exploded perspective view for explaining a substrate and a piezoelectric resonator used in the ladder filter according to the first embodiment.

FIG. 5 is a circuit diagram showing a circuit configuration of a ladder filter.

FIG. 6 is an exploded perspective view for explaining a ladder type filter according to a second embodiment.

FIG. 7 is a perspective view showing the external appearance of a ladder type filter according to a second embodiment.

FIG. 8 is an exploded perspective view for explaining a piezoelectric oscillator according to a third embodiment.

FIG. 9 is a perspective view showing a piezoelectric oscillator according to a third embodiment.

FIG. 10 is a perspective view for explaining a piezoelectric oscillator according to a fourth embodiment.

FIG. 11 is an exploded perspective view for explaining a piezoelectric oscillator according to a modified example of the third embodiment of the present invention.

FIG. 12 is a perspective view for explaining another modification of the piezoelectric oscillator according to the third embodiment.

FIG. 13 is an exploded perspective view for explaining still another modified example of the piezoelectric oscillator according to the third embodiment.

FIG. 14 is an exploded perspective view for explaining a piezoelectric filter according to a fifth embodiment of the present invention.

FIG. 15 is an exploded perspective view for explaining a piezoelectric filter according to a sixth embodiment of the present invention.

FIG. 16 is an exploded perspective view for explaining a piezoelectric oscillator with a built-in capacitor according to a seventh embodiment of the present invention.

FIG. 17 is an exploded perspective view for explaining a piezoelectric filter according to an eighth embodiment of the present invention.

FIG. 18 is a perspective view illustrating a piezoelectric filter according to an eighth embodiment.

FIG. 19 is an exploded perspective view for explaining a ladder type filter according to a ninth embodiment of the present invention.

FIG. 20 is a perspective view showing a main part of a ladder type filter according to a ninth embodiment.

FIG. 21 is an exploded perspective view for explaining a ladder type filter according to a tenth embodiment of the present invention.

FIG. 22 is an exploded perspective view for explaining a step of fixing a laminated body on a substrate in the ladder type filter of the tenth embodiment.

FIG. 23 is an exploded perspective view for explaining a ladder type filter according to an eleventh embodiment of the present invention.

FIG. 24 is a perspective view for explaining a ladder type filter according to an eleventh embodiment.

FIG. 25 is an exploded perspective view illustrating a piezoelectric oscillator configured as a leaded electronic component according to a twelfth embodiment of the invention.

FIG. 26 is a perspective view for explaining a piezoelectric oscillator according to a twelfth embodiment of the invention.

FIG. 27 is a modification of the twelfth embodiment of the present invention,
FIG. 4 is an exploded perspective view for explaining a piezoelectric oscillator with a built-in capacitor that uses a width expansion mode.

FIG. 28 is an exploded perspective view showing another modification of the twelfth embodiment of the present invention and illustrating a capacitor-embedded piezoelectric oscillator using a spreading mode.

FIG. 29 is an exploded perspective view for explaining a ladder type filter according to a thirteenth embodiment of the present invention.

[Explanation of symbols]

21 ... Ladder type filter 22 ... Substrate 23 ... Laminated bodies 25-29 ... Electrodes 31-34 ... Piezoelectric resonators 51-54 ... Elastic adhesives 55a-55h ... Lead wires as flexible conductors 62 ... Substrates 66-69 Electrode 82 ... Substrate 83 ... Piezoelectric Resonator 84 ... Cap 85, 86 ... Electrode 90, 91 ... Elastic adhesive 92, 93 ... Lead wire (flexible conductor) 101 ... Piezoelectric Oscillator 102 ... Substrate 111 ... Piezoelectric Resonance Child 112 ... Piezoelectric plate 115-118 ... Elastic adhesive 121 ... Piezoelectric resonator 125 ... Substrate 126 ... Elastic adhesive 127, 128 ... Electrode 131 ... Substrate 132 ... Piezoelectric resonator 133 ... Elastic adhesive 134a-134c ... Electrode 140 ... Elastic adhesive 141 ... Piezoelectric resonator 151 ... Substrate 152a to 152c ... Electrodes 153, 154 ... Elastic adhesive 155 ... Capacitor Storage type piezoelectric oscillator 161 ... Substrate 162 ... Piezoelectric filter element 163 ... Elastic adhesive 164a to 164e ... Electrodes 181 to 184 ... Piezoelectric resonator 192, 193, 194, 195, 196, 197 ... Elastic adhesive 198 ... Laminate 199 ... Substrate 200a-200e ... Electrodes 201a-201d ... Ribbon wire (conductor having flexibility) 211-214 ... Piezoelectric resonator 223 ... Elastic adhesive 230 ... Laminated body 231 ... Substrate 232 ... Elastic adhesive 233a-233c ... Electrode 234 ... Flexible substrate (conductor having flexibility) 241 to 244 ... Piezoelectric resonator 250 ... Elastic adhesive 251 ... Laminated body 253 ... Terminal board (board) 256 ... Elastic adhesive 261 ... Terminal board (board) 263 ... Elastic adhesive 264 ... Piezoelectric resonator 271 ... Capacitor built-in type piezoelectric oscillator 277 ... Terminal plate (board) 79 ... Elastic adhesive 281 ... Piezoelectric oscillator 283 ... Elastic adhesive having conductivity 301-304 ... Piezoelectric resonator 308, 312, 314, 315 ... Metal wire (conductor having flexibility) 316-319 ... Conductivity Elastic adhesive having 320 ... Substrate 320a to 320d ... Electrode

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[Procedure amendment]

[Submission date] October 17, 1995

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] 0166

[Correction method] Change

[Correction contents]

The piezoelectric resonators 301 to 304 are made of the elastic adhesive 3 having conductivity at the center of the main surface of the piezoelectric resonator.
16,317,318 are joined to each other to form a laminated body. Since the elastic adhesives 316 to 318 are made of a conductive adhesive having elasticity such as conductive silicon, the upper and lower resonance electrodes bonded via the elastic adhesives 316 to 318 are electrically connected. Connected. Similarly,
The resonance electrode (not shown) on the lower surface of the piezoelectric resonator 301 is
It is fixed to the upper surface of the substrate 320 by a conductive elastic adhesive 319 shown in a floating state, and the resonance electrode on the lower surface of the piezoelectric resonator 301 is electrically connected to the electrode 320a on the substrate 320. To be done.

Claims (6)

[Claims] 1. A piezoelectric resonator using a surface vibration mode mainly in-plane deformation, an electrode electrically connected to the piezoelectric resonator, and the piezoelectric resonator mounted on the piezoelectric resonator. A substrate, at least one of a node point of a surface vibration mode of the piezoelectric resonator and a portion having a displacement as small as the node point, and an elastic adhesive arranged to fix the substrate, A piezoelectric resonance component, further comprising a flexible conductor bonded to the piezoelectric resonator and the substrate so as to electrically connect the resonator and the electrode on the substrate. 2. The piezoelectric resonance component according to claim 1, wherein the substrate is formed of a flat metal plate having a terminal portion that is extended to one side and used for electrical connection with the outside. . 3. The piezoelectric resonance component according to claim 1, wherein the elastic adhesive is a conductive adhesive. 4. The piezoelectric resonator comprises a piezoelectric plate having a rectangular planar shape polarized in the thickness direction, and a pair of resonant electrodes formed on both main surfaces of the piezoelectric plate.
The piezoelectric resonant component according to claim 1. 5. At least one other piezoelectric resonator utilizing a surface vibration mode on the piezoelectric resonator, at least one of a node point of the surface vibration mode and a portion having a displacement as small as the node point. 2. The piezoelectric resonance component according to claim 1, wherein the laminated body is configured by being bonded via an elastic adhesive in. 6. A ladder type filter having a series resonator and a parallel resonator, comprising a piezoelectric resonator utilizing a plurality of surface vibration modes for forming a series resonator and a parallel resonator, A piezoelectric resonator is bonded and laminated via an elastic adhesive at at least one of a node point of vibration and at least one portion of which displacement is as small as the node point to form a laminated body, and the laminated body is formed on the laminated body. A substrate having an electrode that is placed and electrically connected to the piezoelectric resonator of the laminated body, a node point of vibration of the piezoelectric resonator of the lowermost layer of the laminated body, and a displacement of the same degree as the node point. At least one of the few parts, an elastic adhesive arranged to fix the substrate, and the piezoelectric resonator so as to electrically connect the piezoelectric resonator in the laminate and the electrode on the substrate. And bonded to the substrate And further comprising a conductor having a flexible ladder-type filter.