JPH09244553A - 光電子集積パッケージ - Google Patents

光電子集積パッケージ

Info

Publication number
JPH09244553A
JPH09244553A JP9063942A JP6394297A JPH09244553A JP H09244553 A JPH09244553 A JP H09244553A JP 9063942 A JP9063942 A JP 9063942A JP 6394297 A JP6394297 A JP 6394297A JP H09244553 A JPH09244553 A JP H09244553A
Authority
JP
Japan
Prior art keywords
light emitting
mounting
substrate
pads
main surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9063942A
Other languages
English (en)
Japanese (ja)
Other versions
JPH09244553A5 (2
Inventor
S Levy Michael
マイケル・エス・レビー
John W Stafford
ジョン・ダブリュ・スタッフォード
Fred V Richard
フレッド・ブイ・リチャード
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motorola Solutions Inc
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of JPH09244553A publication Critical patent/JPH09244553A/ja
Publication of JPH09244553A5 publication Critical patent/JPH09244553A5/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/35—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being liquid crystals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/127—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed characterised by arrangements for sealing or adhesion
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Electroluminescent Light Sources (AREA)
  • Led Device Packages (AREA)
JP9063942A 1996-03-04 1997-03-04 光電子集積パッケージ Pending JPH09244553A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US610506 1990-11-08
US08/610,506 US5739800A (en) 1996-03-04 1996-03-04 Integrated electro-optical package with LED display chip and substrate with drivers and central opening

Publications (2)

Publication Number Publication Date
JPH09244553A true JPH09244553A (ja) 1997-09-19
JPH09244553A5 JPH09244553A5 (2) 2005-01-06

Family

ID=24445293

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9063942A Pending JPH09244553A (ja) 1996-03-04 1997-03-04 光電子集積パッケージ

Country Status (5)

Country Link
US (1) US5739800A (2)
JP (1) JPH09244553A (2)
KR (1) KR100455969B1 (2)
FR (1) FR2745677A1 (2)
TW (1) TW351007B (2)

Cited By (4)

* Cited by examiner, † Cited by third party
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JP2002261335A (ja) * 2000-07-18 2002-09-13 Sony Corp 画像表示装置及び画像表示装置の製造方法
JP2003022031A (ja) * 2001-05-29 2003-01-24 Lg Philips Lcd Co Ltd 平板型表示装置の結合構造および当該結合構造を有する平板型表示装置
JP2020515068A (ja) * 2017-03-21 2020-05-21 ルミレッズ ホールディング ベーフェー 平坦なキャリア上へのｌｅｄ素子の取り付け
JP2023503801A (ja) * 2019-12-02 2023-02-01 メタ プラットフォームズ テクノロジーズ， リミテッド ライアビリティ カンパニー コリメータアセンブリをｌｅｄアレイと位置合わせすること

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US5818404A (en) * 1996-03-04 1998-10-06 Motorola, Inc. Integrated electro-optical package
US5708280A (en) * 1996-06-21 1998-01-13 Motorola Integrated electro-optical package and method of fabrication
US5831832A (en) * 1997-08-11 1998-11-03 Motorola, Inc. Molded plastic ball grid array package
US6476783B2 (en) 1998-02-17 2002-11-05 Sarnoff Corporation Contrast enhancement for an electronic display device by using a black matrix and lens array on outer surface of display
US6897855B1 (en) * 1998-02-17 2005-05-24 Sarnoff Corporation Tiled electronic display structure
US6059173A (en) * 1998-03-05 2000-05-09 International Business Machines Corporation Micro grid array solder interconnection structure for second level packaging joining a module and printed circuit board
DE19861162A1 (de) * 1998-11-06 2000-06-29 Harting Elektrooptische Bauteile Gmbh & Co Kg Verfahren zur Herstellung einer Leiterplatte sowie Leiterplatte
US6498592B1 (en) 1999-02-16 2002-12-24 Sarnoff Corp. Display tile structure using organic light emitting materials
US6439731B1 (en) * 1999-04-05 2002-08-27 Honeywell International, Inc. Flat panel liquid crystal display
EP1076357A1 (de) * 1999-08-11 2001-02-14 SiMoTec GmbH Montagevorrichtung zur Herstellung microsystemtechnischer Produkte
JP2001092381A (ja) * 1999-09-27 2001-04-06 Nec Corp 有機ｅｌディスプレイおよびその製造方法
JP4461616B2 (ja) 2000-12-14 2010-05-12 ソニー株式会社 素子の転写方法、素子保持基板の形成方法、及び素子保持基板
JP4649745B2 (ja) 2001-02-01 2011-03-16 ソニー株式会社 発光素子の転写方法
WO2002084631A1 (en) * 2001-04-11 2002-10-24 Sony Corporation Element transfer method, element arrangmenet method using the same, and image display apparatus production method
US6573660B2 (en) * 2001-04-30 2003-06-03 Intel Corporation Driving emissive displays
JP3659407B2 (ja) * 2001-08-03 2005-06-15 ソニー株式会社 発光装置
US7855708B2 (en) * 2001-09-05 2010-12-21 Honeywell International Inc. LED backlight luminance sensing for LCDs
JP2003077940A (ja) * 2001-09-06 2003-03-14 Sony Corp 素子の転写方法及びこれを用いた素子の配列方法、画像表示装置の製造方法
JP2003255850A (ja) * 2002-03-05 2003-09-10 Pioneer Electronic Corp 表示パネル基板及び表示装置
JP4259979B2 (ja) 2003-10-22 2009-04-30 新光電気工業株式会社 光透過性カバー及びこれを備えたデバイス並びにそれらの製造方法
EP1999800A1 (en) * 2006-03-21 2008-12-10 Koninklijke Philips Electronics N.V. Light emitting diode module and method for the manufacturing of such an led module
TWI363432B (en) * 2007-02-26 2012-05-01 Everlight Electronics Co Ltd A structure of a light emitting diode and a method to assemble thereof
US8138027B2 (en) 2008-03-07 2012-03-20 Stats Chippac, Ltd. Optical semiconductor device having pre-molded leadframe with window and method therefor
WO2010088553A2 (en) * 2009-01-30 2010-08-05 Ndsu Research Foundation Infra-extensible led array controller for light emission and/or light sensing
US8456586B2 (en) 2009-06-11 2013-06-04 Apple Inc. Portable computer display structures
TWI423483B (zh) * 2009-09-28 2014-01-11 Silicon Base Dev Inc 光二極體封裝結構
US8408780B2 (en) * 2009-11-03 2013-04-02 Apple Inc. Portable computer housing with integral display
US8743309B2 (en) 2009-11-10 2014-06-03 Apple Inc. Methods for fabricating display structures
US9143668B2 (en) 2010-10-29 2015-09-22 Apple Inc. Camera lens structures and display structures for electronic devices
US8467177B2 (en) 2010-10-29 2013-06-18 Apple Inc. Displays with polarizer windows and opaque masking layers for electronic devices
US9899329B2 (en) 2010-11-23 2018-02-20 X-Celeprint Limited Interconnection structures and methods for transfer-printed integrated circuit elements with improved interconnection alignment tolerance
US8889485B2 (en) 2011-06-08 2014-11-18 Semprius, Inc. Methods for surface attachment of flipped active componenets
US8710630B2 (en) * 2011-07-11 2014-04-29 Taiwan Semiconductor Manufacturing Company, Ltd. Mechanisms for marking the orientation of a sawed die
US9638950B2 (en) 2014-05-15 2017-05-02 Apple Inc. Display with opaque border resistant to electrostatic discharge
US9799719B2 (en) 2014-09-25 2017-10-24 X-Celeprint Limited Active-matrix touchscreen
TWI681508B (zh) 2016-02-25 2020-01-01 愛爾蘭商艾克斯瑟樂普林特有限公司 有效率地微轉印微型裝置於大尺寸基板上
US10395966B2 (en) 2016-11-15 2019-08-27 X-Celeprint Limited Micro-transfer-printable flip-chip structures and methods
WO2018091459A1 (en) 2016-11-15 2018-05-24 X-Celeprint Limited Micro-transfer-printable flip-chip structures and methods
US10600671B2 (en) 2016-11-15 2020-03-24 X-Celeprint Limited Micro-transfer-printable flip-chip structures and methods
US11024608B2 (en) 2017-03-28 2021-06-01 X Display Company Technology Limited Structures and methods for electrical connection of micro-devices and substrates
CN109064913B (zh) * 2017-07-19 2022-05-20 广州超维光电科技有限责任公司 基于类舞台结构的内嵌集成式行单元
JP2020008813A (ja) * 2018-07-12 2020-01-16 富士通コンポーネント株式会社 光モジュール
US11164934B2 (en) 2019-03-12 2021-11-02 X Display Company Technology Limited Tiled displays with black-matrix support screens
US11094870B2 (en) 2019-03-12 2021-08-17 X Display Company Technology Limited Surface-mountable pixel packages and pixel engines
US11838432B2 (en) 2019-12-03 2023-12-05 Apple Inc. Handheld electronic device
US11637919B2 (en) 2019-12-03 2023-04-25 Apple Inc. Handheld electronic device
WO2021164855A1 (de) * 2020-02-18 2021-08-26 Ev Group E. Thallner Gmbh Verfahren und vorrichtung zur übertragung von bauteilen
US12003657B2 (en) 2021-03-02 2024-06-04 Apple Inc. Handheld electronic device
TWI811810B (zh) * 2021-10-13 2023-08-11 錼創顯示科技股份有限公司 微型發光二極體顯示面板
US12267449B2 (en) 2022-03-03 2025-04-01 Apple Inc. Handheld electronic device
CN118248819A (zh) * 2024-04-02 2024-06-25 上海显耀显示科技有限公司 显示面板的封装结构以及光波导结构

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GB2062928B (en) * 1979-09-19 1983-05-25 Sharp Kk Electrode terminal assembly on a multilayer type liquid crystal panel
JPH0752779B2 (ja) * 1987-12-09 1995-06-05 日立電線株式会社 発光ダイオードアレイ
JPH03241392A (ja) * 1990-02-20 1991-10-28 Casio Comput Co Ltd 表示パネルの実装構造
JPH05152605A (ja) * 1991-11-28 1993-06-18 Nec Corp アレイ状光素子及びその実装基板
US5482896A (en) * 1993-11-18 1996-01-09 Eastman Kodak Company Light emitting device comprising an organic LED array on an ultra thin substrate and process for forming same
US5612549A (en) * 1994-03-24 1997-03-18 Motorola Integrated electro-optical package
US5432358A (en) * 1994-03-24 1995-07-11 Motorola, Inc. Integrated electro-optical package
US5467215A (en) * 1994-12-21 1995-11-14 Motorola Integrated electro-optic package for reflective spatial light modulators
US5621225A (en) * 1996-01-18 1997-04-15 Motorola Light emitting diode display package

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002261335A (ja) * 2000-07-18 2002-09-13 Sony Corp 画像表示装置及び画像表示装置の製造方法
US7880184B2 (en) 2000-07-18 2011-02-01 Sony Corporation Image display unit
JP2003022031A (ja) * 2001-05-29 2003-01-24 Lg Philips Lcd Co Ltd 平板型表示装置の結合構造および当該結合構造を有する平板型表示装置
JP2020515068A (ja) * 2017-03-21 2020-05-21 ルミレッズ ホールディング ベーフェー 平坦なキャリア上へのｌｅｄ素子の取り付け
JP2023503801A (ja) * 2019-12-02 2023-02-01 メタ プラットフォームズ テクノロジーズ， リミテッド ライアビリティ カンパニー コリメータアセンブリをｌｅｄアレイと位置合わせすること

Also Published As

Publication number Publication date
US5739800A (en) 1998-04-14
KR100455969B1 (ko) 2004-12-17
FR2745677A1 (fr) 1997-09-05
KR970067059A (ko) 1997-10-13
TW351007B (en) 1999-01-21

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