JPH0924616A - Method for manufacturing liquid jet recording head - Google Patents

Abstract

(57) [Abstract] [Purpose] To realize a method for manufacturing a liquid jet recording head in which a substrate is not likely to be damaged or broken and burrs and flashes do not occur. [Structure] Removable first to third solid layers 11 to 13 are formed on a substrate 1 in advance. Then, the cavity 14
a contact portion 16a that abuts the second solid layer 12 projecting in
One mold 14 having the first projecting member 16 having the above and the second projecting member 17 having the abutting portion 17a that comes into contact with the third solid layer 13, and the other mold 15 having the cavity 15a.
Using a split type transfer molding die, the substrate 1 is inserted into the cavity 15a of the other die 15 and clamped, and a resin material is injected and cured to integrally form a resin layer on the substrate 1. . Here, the contact portion is
Rectangular peripheral portion and concave portions 16b and 17 surrounded by the peripheral portion
b, the contact portion is dimensioned to fit into the second and third solid layers when the mold is clamped.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a liquid jet recording head used in a liquid jet recording apparatus for ejecting recording droplets such as ink to form an image on a recording medium such as recording paper. is there.

[0002]

2. Description of the Related Art Conventionally, as shown in FIGS. 15 and 16, a liquid jet recording head of this type has an electrothermal converter 102a.
And a substrate 101 having an electrode 102c electrically connected thereto via an electric wiring 102b, and a resin layer 103 integrally formed on a portion of the substrate 101 excluding the electrode 102c and the electric connection portion 101a in the vicinity thereof. Is equipped with
The resin layer 103 is provided with a common liquid chamber 104 communicated with the outside through a supply port 107 and a discharge port 106 communicated with the common liquid chamber 104 through a liquid flow path 105. It is manufactured by the manufacturing methods such as (a) and (b) described below.

(A) A negative dry film or a negative type dry film is formed on the substrate 101 on which the electrothermal converter 102a and the electrode 102c electrically connected to the electrothermal converter 102a through the electric wiring 102b are patterned by using a process similar to the semiconductor manufacturing process. After laminating a resist or a positive type dry film or a resist, it is exposed through a negative type or positive type photomask having a pattern of the common liquid chamber 104 and the liquid flow path 105. In the case of a negative type, an unexposed portion, In the case of a positive type, the exposed portion is washed out with a developing solution to sequentially form a first solid layer for forming the liquid flow path 105 and a second solid layer for forming the common liquid chamber 104. After that, a resin material is poured into a portion of the substrate 101 excluding the electrical connection portion 101a and cured to integrally form a resin layer 103 having the first and second solid layers as cores. Then, the portion to be the discharge port surface 108 is cut to open the discharge port 106, and then the first and second solid layers are removed with a removing liquid (Japanese Patent Laid-Open Publication No. 6-68242).
No. 1-15497).

(B) By the same steps as in (a) above,
As shown in FIG. 17, the liquid flow paths 10 are sequentially formed on the substrate 101.
First solid layer 111 and common liquid chamber 1 for forming
The second solid layer 112 for forming 04 is formed. After that, the solid layer 11 is formed by transfer molding using a transfer molding die having a protrusion 114 for forming the supply port 107 in the cavity 113a in a portion of the substrate 101 excluding the electrical connection portion 101a.
The resin layer 103 having 1,112 as a core is integrally formed,
Then, the portion to be the ejection port surface 108 is cut to eject the ejection port 10.
After opening 6, the solid layers 111 and 112 are removed with a removing liquid.

[0005]

However, among the above-mentioned conventional techniques, the method (a) cannot manufacture the common liquid chamber or the like deeply, and in addition, the process is complicated and the mass productivity is poor. High cost. On the other hand, (b) has excellent mass productivity,
Although the manufacturing cost can be reduced, there are unsolved problems as described below.

Protrusion 1 provided in cavity 113a
Since the front end surface 114a of 14 is a flat surface, when the pressing force of the front end surface 114a with respect to the second solid layer 112 is small, the gap ΔL is reduced by the resin pressure in the cavity 113a, as shown in FIG. Then, the resin flows out into the gap ΔL to generate burrs 103a or flash.

On the contrary, as shown in FIG. 17B, the second
When the tip of the protrusion 114 is pressed into the solid layer by a pressing force of ΔL ₁ , a large pressing force is applied to the substrate 101, which may damage or damage the substrate 101.

The present invention has been made in view of the above-mentioned unsolved problems of the prior art, and manufactures a liquid jet recording head in which there is no possibility of damaging or damaging a substrate and burrs or flashes do not occur. The purpose is to realize the method.

[0009]

In order to achieve the above object, a method of manufacturing a liquid jet recording head according to the present invention comprises forming a removable solid layer on a substrate and then forming a substrate on which the solid layer is formed. The resin layer is integrally molded on the substrate by inserting the resin material into the cavity of a split-type molding die having a cavity for forming the resin layer and clamping the resin material and then curing the resin material. After that, the mold is opened to take out the substrate integrally molded with the resin layer, and the solid layer is removed to form a hollow portion in the resin layer. It is characterized in that it is provided with an abutting portion that digs into the solid layer at the time of doing, and the abutting portion has an uneven surface.

Further, the uneven surface may be composed of a concave portion formed in the central portion and a peripheral portion surrounding the concave portion, or a plurality of convex portions arranged at intervals from each other and their gaps. Instead of the surface, an inclined surface inclined with respect to the substrate surface can be used.

Further, it is effective that the hollow portion is the common liquid chamber and the liquid flow path communicating with the common liquid chamber.

Before forming the removable solid layer on the substrate, it is preferable to dispose the discharge energy generating element at a portion corresponding to the liquid flow path on the substrate.

[0013]

When the substrate on which the solid layer is formed is inserted into the cavity of the split-type molding die having the cavity for forming the resin layer and the mold is clamped, the mold of the molding die is inserted into the solid layer. Since the shape of the contact portion is an uneven surface, the solid layer is deformed and enters the concave portion of the uneven surface during mold clamping.
As a result, the pressing force applied to the substrate is reduced, and the occurrence of burrs and flashes can be prevented without damaging the substrate.

[0014]

Embodiments of the present invention will be described with reference to the drawings.

(First Embodiment) In this embodiment, as shown in FIGS. 1 and 6, an electrothermal converter 2a which is a discharge energy generating element and an electrode 2c electrically connected to the electrothermal converter 2a via an electric wiring 2b. And a substrate 1 having electrodes 2c on the substrate 1
And a resin layer 3 integrally formed in a region excluding the electric connection portion 1a in the vicinity thereof, and the resin layer 3 is connected to the common liquid chamber 4 and the common liquid chamber 4 which are communicated with the outside through the supply port 7. The present invention is to manufacture a liquid jet recording head having an ejection port 6 communicated with each other through a flow path 5, and has steps to be described below.

As shown in FIGS. 2A and 2B, a substrate 1 made of a silicon wafer or the like is prepared, and the substrate 1
An electrothermal converter 2a made of HfB ₂ which is a discharge energy generating element, an electric wire 2b made of Al electrically connected to the electrothermal converter 2a, and an end portion of the electric wire 2b at a portion corresponding to the upper liquid flow path 5. The electrode 2c electrically connected to is disposed by a process similar to the semiconductor manufacturing process.

In this step, although not shown, in order to improve durability, an electric insulating film made of SiO ₂ , a protective film made of Ta, and Au are formed on the upper surfaces of the electrothermal converter 2a, the electric wiring 2b and the electrode 2c. Various functional layers such as an electrode oxidation prevention film are provided.

For the sake of convenience of explanation, a two-piece arrangement in which the electrothermal converters 2a are arranged so as to face each other has been illustrated, but in reality, a plurality of liquid jet recording heads are collectively processed on the substrate 1, Separated into a single liquid jet recording head with a dicing saw in a process described later.

After the above steps, a photosensitive positive resist is spin-coated on the substrate 1 to have a predetermined thickness (for example, 30 μm), and a pattern of the liquid flow path 5, the common liquid chamber 4 and the electrical connection portion 1 a is formed. After exposure through a photomask, development is performed, and the removable first as shown in FIG.
The solid layer 11 is formed.

After the above steps, the first solid layer 11
A non-photosensitive plating resist is applied to the upper surface of a portion corresponding to the common liquid chamber 7 by a screen printing method.
(D), the second solid layer 12 is formed, and the plating resist is similarly applied above the electrical connection portion 1a where the resin layer is not formed to form the third solid layer 13. Incidentally, the second solid layer 12 after the plating resist is dried.
The thickness of the third solid layer 13 is 100 ± 20 μm.

After the above steps, as shown in FIG. 3, a first protruding member 16 for forming a supply port 7 having an abutting portion 16a that abuts the second solid layer 12 protruding in the cavity 14a, and One mold 1 including a second protruding member 17 having an abutting portion 17a abutting on the third solid layer 13
4 and a substrate on which the first to third solid layers 11 to 13 are formed by using a split type transfer molding die comprising a die 15 having a cavity 15a having a size capable of inserting the substrate 1 in a substantially horizontal state. 1 to the first to third solid layers 1
The other mold 1 with 1 to 13 facing one mold 14
5, and then the mold is closed.

Here, as shown in FIG. 4, the contact portion 16a of the first projecting member 16 that contacts the second solid layer 12 is surrounded by a rectangular peripheral portion having a width of 0.1 mm and the peripheral portion. Depth 50
It has a recess 16 b of μm, and the tip end surface of each of the contact portions 16 a is set to have a size of about 30 μm from the surface of the second solid layer 12. For other configurations, a gate that communicates with the cavity as in the known transfer mold,
It has an air vent, a runner, a tablet port, and an ejector pin.

The contact portion 17a of the second projecting member 17 may be the same as the contact portion 16a of the first projecting member 16 and will not be described.

The cavity 15a of the other mold 15 may be provided with a rubber lining having a thickness of about 50 μm to protect the substrate 1.

After the above steps, the closed transfer molding dies 14 and 15 are set on the clamp plate of the molding machine and clamped with a clamping force of about 150 kg / cm ² G to raise the mold temperature to about 120 ° C. After adjusting, insert the epoxy resin tablet preheated to about 80 ° C by the high frequency preheating device into the tablet pot and then 40kg.
Of the liquid jet recording head in which the resin layer 3 is integrally formed on the substrate 1 by injecting into the space in the cavity at a transfer pressure of about / cm ² G and opening the mold after a holding time of about 8 minutes. Take out the intermediate product E.

After the above steps, the intermediate product E is subjected to a heat treatment called post cure at about 120 ° C. for 2 hours.
The resin layer 3 is completely cured under the condition of time.

After the above steps, the intermediate product E is cut with a dicing saw into a single liquid jet recording head as shown in FIG. 5 to form the ejection port surface 8, and then the substrate 1, the resin layer 3 and Electrothermal converter 2a, electric wiring 2b,
1 and 6 using a 2% NaOH aqueous solution capable of removing the solid layers 11 to 13 without damaging the electrodes 2c and the like, and also using ultrasonic cleaning to remove the solid layers 11 to 13 respectively.
A liquid jet recording head as shown in FIG.

In the above steps of this embodiment, the mold temperature is not limited to 120.degree.
The temperature may be any temperature of about 0 to 180 ° C., but the heat resistance of the substrate 1 and each of the solid layers 11 to 13 or the optimum molding temperature range depending on the type of resin, and further the moldability (resin flow property, mold releasability) , Suppression of voids, burrs, flashes, etc.) and the like.

Generally, the higher the molding temperature is, the shorter the curing time is, and the higher the transfer pressure is, the more the shape stability is improved and the generation of voids is eliminated. However, by keeping the temperature at a low temperature for a long time, burr or flash is generated. Can be prevented.

Further, the post-curing of the above steps in this embodiment does not necessarily have to be carried out continuously with the transfer molding step of the resin layer, and may be carried out at any time until the completion of the liquid jet recording head.

According to the present embodiment, burrs and flashes do not occur between the solid layers 11 to 13 and the contact portions 16a and 17a of the one mold 14, and a test of 100 shots or more is performed. Good results have been obtained.

When the liquid jet recording head manufactured according to this embodiment was assembled in an ink jet recording apparatus and an ejection performance test and a printing durability test were conducted, the ejection frequency performance was insufficient due to insufficient ink supply due to burrs or the like, or burrs or the like. No ink ejection or the like due to clogging of the ink nozzles due to dropout of the ink or invasion into the liquid flow path did not occur.

In the present embodiment, as an example of the uneven surface which is the shape of the contact portion, the contact portion 16a of the protruding member 16 contacting the second solid layer 12 and the second protruding member contacting the third solid layer 13 are provided. As shown in FIG. 4, the contact portion 17a of the contact member 17 has a rectangular peripheral portion and a recess 16b surrounded by the peripheral portion. Can be an example. In each modification, the same parts as those in the first embodiment are designated by the same reference numerals, and the description thereof will be omitted. Only different parts will be described.

In the first modified example shown in FIG. 7, the depth of the recess 26b of the projecting member 26 is set to the first projecting member 16 of the first embodiment.
Deeper than the concave portion 16b of the
This prevents the bottom surface of the concave portion 26b and the surface of the second solid layer 12 from coming into contact with each other when the is embedded in the second solid layer 12.

The second modification shown in FIG. 8 is constructed such that the projecting member 36 is slidably guided by a guide hole 14b provided in one of the molds 14 and can be moved back and forth in the cavity. The contact portion 36a is composed of a peripheral portion surrounding the hemispherical recess 36b.

According to this modification, since the protrusion amount of the protrusion member 36 with respect to the second solid layer 12 can be changed, it is possible to cope with the case where the thickness of the second solid layer 12 is different.

In the third modification shown in FIG. 9, the contact portion 46a of the projecting member 46 is an inclined surface inclined with respect to the surface of the substrate 1.

In this modification, since the contact portion 46a is inclined with respect to the surface of the substrate 1, the pressing force applied to the substrate 1 when the tip portion of the second solid layer 12 is inserted into the second solid layer 12 is small. Get smaller.

The fourth modification shown in FIG. 10 is a protruding member 56.
The abutting portion 56a is composed of a plurality of convex portions and gap portions 56b arranged on the tip end surface thereof at intervals.

In this embodiment, a part of the deformed solid layer enters the gaps 56b, so that the pressing force applied to the substrate 1 by the mold clamping force at the time of mold clamping is reduced.

(Second Embodiment) In this embodiment, as shown in FIG. 11, an electrothermal converter 62a, an electric wire 62b, and an electrode 62c similar to those in the first embodiment are provided on one surface. The substrate 61, a first resin layer 63A having a liquid flow path 65 integrally formed on one surface of the substrate 61 and a discharge port surface 68 opening to a discharge port 66 communicating with the liquid flow channel 65, and the other of the substrate 61 Is provided with a second resin layer 63B having a common liquid chamber 64 communicated with the outside by a supply port 67, and the first resin layer 63
A and the second resin layer 63B have a communication hole 6 penetrating the substrate 61.
The present invention is to manufacture a liquid jet recording head communicated by means of 9 and has steps 1 to 3 described below.

According to the process of the first embodiment, TaN
_An electrothermal converter 62a made of 2, an electric wire 62b made of Al, and an electrode 62c are formed on one surface of the substrate 61.

After the above steps, a dummy glass substrate is attached to one surface of the substrate 61 with a rubber adhesive, and then abrasive grains (# 1200) are applied from the other surface of the substrate 61.
The ultrasonic wave jig of 30 kHz is brought into contact with the cooling water in which the No.) is dispersed to form the communication hole 69 penetrating the substrate 61, and then the adhesive is dissolved with a heated chlorine-based organic solvent to form the above-mentioned The dummy glass substrate is peeled off, finally washed with pure water and then dried.

After the above steps, the dummy resist 73a is injected into the communication hole 69 and hardened, and then the substrate 6
The first solid layer 71 for forming the liquid flow path 65 is formed on the part of the one surface corresponding to the electrothermal converter 62a according to the steps of and of the first embodiment, and then the substrate 6 is formed.
The common liquid chamber 6 is provided at the portion corresponding to the communication hole 69 on the other surface of 1.
4 to form a second solid layer 72 (FIG. 12).
reference).

After the above steps, as shown in FIG. 12, the second protruding member 77 for forming the discharge port 66 having the contact portion 77a that contacts the first solid layer 71 protruding into the cavity 74a is formed. One mold 74 provided and the substrate 1
The other die 75 having a first projecting member 76 for forming a supply port having a cavity 75a having a size capable of inserting a cavity and having a contact portion 76a for contacting the second solid layer 72 projecting into the cavity. Using a casting mold of a split type, the substrate 61 on which the first and second solid layers 71 and 72 are formed is the cavity of the other mold 75 with the first solid layer 71 facing one mold 74. Insert into 75a and clamp.

By performing this mold clamping, the contact portion 77a of the second projecting member 77 is recessed into the first solid layer 71, and the contact portion 76a of the first projecting member 76 is recessed into the second solid layer 72. It becomes a state.

After the above steps, the closed casting mold is set in the vacuum chamber, and a room temperature curing type epoxy resin used by mixing the main agent and the curing agent under reduced pressure is injected into the cavity.

After the above steps, after leaving at room temperature for 12 hours to cure, the mold is opened, the intermediate product is taken out, and cut into a single liquid jet recording head with a dicing saw, and By removing the first and second solid layers 71, 72 according to the process, a liquid jet recording head as shown in FIG. 11 is obtained.

The abutting portion 77a of the second projecting member 77 of the one die 74 used in the present embodiment has a conical shape with a tip angle of 150 degrees, and the abutting portion 77a of the other die 75 of the first projecting member 76 is contacted. The contact portion 76a has a shape in which the central portion projects like a roof.

In the present embodiment, as in the first embodiment, it was possible to prevent the occurrence of burrs without damaging the substrate during mold clamping.

(Third Embodiment) In this embodiment, as shown in FIG. 13, a first resin layer 83A having a liquid flow path 85 integrally formed on one surface of a glass substrate 81, and a substrate 81
A second resin layer 83B having a common liquid chamber 84 communicated with the outside by a supply port 87 integrally formed on the other surface of the liquid flow path 85 through a communication hole 89 penetrating the substrate 81. The electric pressure conversion element 8 is connected to the common liquid chamber 84 and is provided on the outer surface of the first resin layer 83A on the liquid flow path 85.
It is for manufacturing a liquid jet recording head to which No. 2 is attached, and has steps 1 to 3 described below.

After forming a communication hole 89 penetrating the substrate 81 in the glass substrate 81, a dummy resist 93a is injected into the communication hole 89 and cured in accordance with the process of the second embodiment, and then, The liquid flow path 8 is formed on one surface of the substrate 81.
5 is formed, and then a second solid layer 92 for forming the common liquid chamber 84 is formed on the other surface of the substrate 81. In this step, the second solid layer 92 is formed. A recess 92a is formed in the center of the layer 92 (see FIG. 1).
4).

After the above steps, as shown in FIG. 14, the cavity 9 for forming the first resin layer 83A is formed.
4a, and a cavity 95a for forming the second resin layer 83B.
Using a transfer molding die composed of the other die 95 provided with a protruding member 96 having an abutting portion 96a abutting against the second solid layer 92 protruding inward, the first and second solid layers 9 are formed.
The substrate 81 on which 1, 92 are formed is inserted into the cavity 95a of the other mold 95 with the first solid layer 91 facing the one mold 94 and clamped.

In the present embodiment, the contact portion 96a may be a flat surface that is horizontal with respect to the moving direction of the mold when the mold is clamped.

By performing this mold clamping, the contacting portion 96a of the projecting member covers the concave portion 92a of the second solid layer 92 and is set in the vicinity of the peripheral edge of the concave portion 92a of the second solid layer 92. .

After the above steps, a thermosetting liquid epoxy resin is injected into the cavity and the temperature is set to 130 ° C. for 10 hours.
Hold for minutes to cure to give an intermediate product.

After the above steps, the mold is opened, the intermediate product is taken out, and cut into a single liquid jet recording head with a dicing saw to form the ejection face 88 (see FIG. 13) to form the ejection port. A liquid jet recording head is obtained by opening 86 and then attaching an electric pressure conversion element to the outer surface of the first resin layer 83A above the liquid flow path 85.

The present invention is not limited to the above-mentioned embodiments, but is also effective when an injection molding method or a compression molding method is used.

The resin material used may be liquid or B-staged solid depending on the molding method, such as thermosetting type, room temperature curing type, visible light curing type, and ultraviolet curing type. Can be used. Specific examples include diallyl phthalate resin, silicone resin, phenol resin, acrylic resin, diglycol dialkyl carbonate resin, unsaturated polyester resin, polyurethane resin, polyimide resin, urea resin, and the like.
It is desirable to select it in consideration of the ink resistance, the adhesion to the substrate, the ease of handling the material, the entanglement with the solid layer and the removing agent, and the like.

In the present invention, recording is performed by forming flying droplets by utilizing thermal energy, particularly in the liquid jet recording system.
In the so-called ink jet recording type recording head and recording apparatus, it is possible to obtain excellent effects.

Regarding its typical structure and principle, see, for example, US Pat. Nos. 4,723,129 and 4740.
No. 796, and the present invention is preferably performed using these basic principles. This recording method can be applied to both so-called on-demand type and continuous type.

This recording method will be briefly described. A drive circuit discharges an electrothermal converter, which is a discharge energy generating element, arranged in correspondence with a sheet holding a recording liquid (ink) or a liquid flow path. A signal is supplied, that is, nucleate boiling phenomenon is exceeded in the recording liquid (ink) corresponding to the recording information,
By applying at least one drive signal to provide a rapid temperature rise that results in a film boiling phenomenon,
Thermal energy is generated, causing film boiling on the heat-acting surface of the recording head. In this way, bubbles can be formed one-to-one corresponding to the drive signal applied from the recording liquid (ink) to the electrothermal converter, which is particularly effective for the on-demand recording method. The recording liquid (ink) is ejected through an ejection port by the growth and contraction of the bubble to form at least one droplet. It is more preferable to make this drive signal into a pulse shape, because the bubble growth and contraction are immediately and appropriately performed, so that the ejection of the recording liquid (ink) with particularly excellent responsiveness can be achieved. As this pulse-shaped drive signal, US Pat.
Those described in US Pat. Nos. 4,633,359 and 4,345,262 are suitable. In addition, U.S. Pat.
If the conditions described in the specification No. 124 are adopted, more excellent recording can be performed.

The structure of the recording head is a combination of a discharge port, a liquid flow path, and an electrothermal converter as disclosed in the above-mentioned specifications (straight liquid flow path or right-angled liquid flow path).
In addition to the above, the present invention is also effective for those having a configuration in which the heat acting portion is arranged in the bending region as disclosed in US Pat. No. 4,558,333 and US Pat. No. 4,459,600. .

In addition, Japanese Patent Application Laid-Open No. 59-123670 discloses a structure in which a common slit is used as a discharge port of the electrothermal converter for a plurality of electrothermal converters, and a pressure wave of thermal energy is absorbed. The present invention is also effective for a device having a structure based on Japanese Patent Application Laid-Open No. 59-138461 which discloses a structure in which an opening corresponds to a discharge portion.

Further, as a recording head in which the present invention is effectively used, there is a full line type recording head having a length corresponding to the maximum width of a recording medium which can be recorded by the recording apparatus. The full line head may be a full line configuration by combining a plurality of recording heads as disclosed in the above specification, or may be a single full line recording head formed integrally.

In addition, by being mounted on the apparatus main body, it can be electrically connected to the apparatus main body and can be supplied with ink from the apparatus main body by a replaceable chip type recording head or the recording head itself. The present invention is also effective when a cartridge-type recording head that is specially provided is used.

Further, it is preferable to add recovery means or preliminary auxiliary means to the recording head because the recording apparatus can be made more stable. Specifically, for the recording head, a capping unit, a cleaning unit, a pressurizing or suction unit, a preheating unit using an electrothermal converter or another heating element, or a combination thereof, It is also effective to add a preliminary ejection mode means for performing ejection that is different from printing in order to perform stable printing.

Furthermore, the recording mode of the recording apparatus is not limited to the mode in which only the mainstream color such as black is recorded, and either the recording head may be integrally formed or a combination of plural recording heads may be used. However, the present invention is also extremely effective for an apparatus provided with at least one of a multicolor of different colors or a full color by color mixing.

In the present invention, the most effective one for each of the above-mentioned inks is to execute the above-mentioned film boiling method.

In addition, as the form of the ink jet recording apparatus of the present invention, in addition to the one used as an image output terminal of information processing equipment such as a computer, a copying apparatus combined with a reader or the like, and a facsimile apparatus having a transmission / reception function. It may take the form of.

In the embodiment of the present invention described above,
Although the ink is described as a liquid, it is an ink that solidifies at or below room temperature and softens or becomes a liquid at room temperature, or a temperature range of 30 that is generally used in ink jet for temperature adjustment. Over 70 ℃
It may be softened or liquid in the following temperature range. That is, the ink may be in a liquid state when the use recording signal is applied. In addition, the temperature rise due to thermal energy can be positively prevented by using it as energy for changing the state of the ink from a solid state to a liquid state, or the ink that solidifies in a standing state to prevent evaporation of the ink can be used. In any case, thermal energy such as one in which ink is liquefied and ejected as an ink liquid by application in accordance with a recording signal of thermal energy, or one which already starts to solidify when reaching a recording medium, etc. The use of an ink that liquefies for the first time is also applicable to the present invention. In such a case, the ink is disclosed in JP-A-54-5.
No. 6,847, or Japanese Patent Application Laid-Open No. 60-71260, in which the porous sheet is opposed to the electrothermal converter while being held as a liquid or solid substance in the concave portion or through hole of the porous sheet. It may be. In the present invention, the most effective one for each of the above-mentioned inks is to execute the above-mentioned film boiling method.

[0072]

Since the present invention is configured as described above, the following effects can be obtained.

When the mold is clamped, the removable solid layer is interposed between the substrate and the contact portion of the mold, and the solid layer is deformed when the contact portion is embedded in the solid layer. Then, since it enters the concave portion of the uneven surface, the pressing force applied to the substrate is reduced. As a result, it is possible to prevent the occurrence of burrs and flashes without damaging the substrate, and thus it is possible to manufacture a high-quality liquid jet recording head.

[Brief description of drawings]

FIG. 1 is a schematic perspective view showing an example of a liquid jet recording head manufactured according to the present invention.

FIG. 2 is a schematic cross-sectional view showing a step of forming a removable solid layer on a substrate according to the first embodiment of the present invention.

FIG. 3 is a schematic cross-sectional view of a transfer molding die showing a state in which the mold is opened after transfer molding in the first embodiment of the present invention.

FIG. 4 is a schematic sectional view of a main part of a transfer molding die according to the first embodiment.

FIG. 5 is a schematic cross-sectional view of the liquid jet recording head showing a step of the first embodiment and before removing the solid layer.

FIG. 6 is a schematic cross-sectional view of a liquid jet recording head manufactured according to the first embodiment.

FIG. 7 is an explanatory diagram showing a first modification of the first embodiment.

FIG. 8 is an explanatory diagram showing a second modification of the first embodiment.

FIG. 9 is an explanatory diagram showing a third modification of the first embodiment.

FIG. 10 is an explanatory diagram showing a fourth modification of the first embodiment.

FIG. 11 is a schematic cross-sectional view of a liquid jet recording head manufactured according to the second embodiment of the present invention.

FIG. 12 is a schematic partial cross-sectional view of a mold that has been clamped, showing one step in the second embodiment.

FIG. 13 is a schematic sectional view of a liquid jet recording head manufactured according to a third embodiment of the invention.

FIG. 14 is a schematic partial cross-sectional view of a mold that has been clamped, showing one step in the third embodiment.

FIG. 15 is a schematic perspective view showing an example of a conventional liquid jet recording head.

FIG. 16 is a schematic cross-sectional view of a liquid jet recording head manufactured by a conventional method for manufacturing a liquid jet recording head.

FIG. 17 is an explanatory diagram showing a state in which a resin layer is formed in a mold that has been clamped in a conventional method for manufacturing a liquid jet recording head.

[Explanation of symbols]

1, 61, 81 Substrate 1a Electrical connection part 2a Electrothermal converter 2b Electrical wiring 2c Electrode 3 Resin layer 4, 64, 84 Common liquid chamber 5, 65, 85 Liquid flow path 6, 66, 86 Discharge port 7, 67, 87 Supply port 8, 68, 88 Discharge port surface 11, 71, 91 First solid layer 12, 72, 92 Second solid layer 13, 73, 93 Third solid layer 14, 74, 94 One mold 14a, 15a, 74a, 94a Cavity 15, 75, 95 Other mold 16,76 1st protrusion member 16a, 17a, 26a, 36a, 46a, 56a, 7
6a, 77a, 96a abutting portion 16b, 17b, 26b, 36b, 92a concave portion 17,77 second protruding member 26, 36, 46, 56, 96 protruding member 56b gap portion 97 step portion

Claims (8)

[Claims] 1. A removable solid layer is formed on a substrate, and then the substrate on which the solid layer is formed is inserted into the cavity of a split mold having a cavity for forming a resin layer. After the mold is clamped, a resin material is injected into the cavity and cured to integrally mold the resin layer on the substrate, and then the mold is opened to take out the substrate integrally molded with the resin layer and remove the solid layer. In the method for manufacturing a liquid jet recording head in which a hollow portion is formed in the resin layer, the molding die has an abutting portion which is fitted into the solid layer when the die is clamped, and the shape of the abutting portion is formed. A method for manufacturing a liquid jet recording head, characterized in that 2. The method for manufacturing a liquid jet recording head according to claim 1, wherein the uneven surface is composed of a concave portion formed in a central portion and a peripheral portion surrounding the concave portion. 3. The method for manufacturing a liquid jet recording head according to claim 1, wherein the uneven surface is composed of a plurality of convex portions and gap portions which are arranged at intervals. 4. The method of manufacturing a liquid jet recording head according to claim 1, wherein the uneven surface is an inclined surface that is inclined with respect to the substrate surface. 5. The method for manufacturing a liquid jet recording head according to claim 1, wherein the resin layer is transfer molded. 6. The method of manufacturing a liquid jet recording head according to claim 1, wherein the hollow portion is a common liquid chamber and a liquid flow path communicating with the common liquid chamber. 7. The ejection energy generating element is arranged at a portion corresponding to the liquid flow path on the substrate before the removable solid layer is formed on the substrate. Liquid jet recording head manufacturing method. 8. The method for manufacturing a liquid jet recording head according to claim 7, wherein the ejection energy generating element is an electrothermal converter.