JPH09269351A - Circuit board continuity inspection device - Google Patents

Abstract

(57) Abstract: An object of the present invention is to provide a circuit board continuity inspection device capable of accurately and efficiently conducting a continuity inspection even in the case of a circuit board having a narrow chip. SOLUTION: A plurality of first terminal portions 2 connected to an electronic component are formed on one main surface 1a, and second terminals corresponding to each of the first terminal portions 2 are formed on the other main surface 1b. Part 3
The circuit board 1 on which is formed is an inspection target. Then, a first electrode portion 17 having a conductive elastic member 18 that is disposed so as to face one main surface 1a of the circuit board 1 and that is brought into contact with and separated from the first terminal portion 2 collectively, Circuit board 1
Of the second terminal portion 3 which is arranged to face the other main surface 1b of the
Second electrode part 1 having terminal pins 13 corresponding to each of the
2 and a continuity inspection means 21 for detecting a continuity state between the first electrode portion 17 and the second electrode portion 18.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention has a plurality of first terminal portions formed on one main surface to be connected to an electronic component, and a second main surface corresponding to each of the first terminal portions. The present invention relates to a circuit board inspection device that detects a conduction state of a circuit board on which a terminal portion is formed.

[0002]

2. Description of the Related Art In various printed wiring boards, high-density mounting has been promoted due to rapid development of surface mounting technology. Thus, although the miniaturization of IC packages and the like are being promoted, it is difficult to achieve higher-density mounting than at present. On the other hand, in recent years, so-called bare chip mounting, in which an IC chip is taken out of an IC package and directly mounted on a printed wiring board, has been studied.

As a method of mounting this bare chip, for example, a ball grid array (Ball Gri) is used.
d Array; hereinafter abbreviated as BGA. ) And a chip size package (Chip Size Pac
cage; hereinafter abbreviated as CSP. ), Such as an array of narrow-pitch terminals (spherical solder) on the back side of the circuit board.
A multi-pin type with is used. The CSP is
BGA means a terminal chip with a narrow pitch of 1.0 mm or less.

In the BGA method and the CSP method, a circuit board is arranged on the surface of the IC chip facing the printed board, and a first terminal portion connected to the terminal portion of the IC chip is provided on one main surface of the circuit board. A plurality of second terminal portions corresponding to each of the first terminal portions are formed on the other main surface of the plurality of opposed and opposite main surfaces. Then, spherical solder bumps formed of solder are formed on the second terminal portion, and solder bumps are also formed on the electrode pads of the wiring circuit pattern of the printed circuit board. It is to be melted and solidified.

In the BGA method and the CSP method, since the terminal portion of the IC chip is pulled out to the outside through the circuit board, it is possible to relatively freely determine the formation position of the connection terminal with the outside.

[0006]

By the way, in the case of a package product, a so-called probe test for release / short circuit on a wafer is often performed, and a continuity test is repeated after cutting into chips and sealing in a package. Various devices have been developed as a continuity inspection device after being sealed in this package, as described below. On the other hand, in the case of the bare chip mounting, such a continuity inspection device is performed. I have not been forgotten.

First, as a continuity inspection device for packaged products, a pair of needle-shaped probes (pin probes) are brought into contact with each of the inspection points of the printed wiring board to short-circuit between terminals of electronic parts or , There is a thing to inspect for disconnection.

However, such an inspection apparatus has a low inspection speed and is unsuitable for the current high-conductivity inspection in which mass production of printed wiring boards is strongly required. Therefore,
Although it is possible to increase the speed by automatically controlling the movement of the pair of pin probes, even if one of the inspection points is accurately contacted due to a slight inclination of the circuit board to be inspected, the other inspection point There has been a problem that relative positioning is not performed accurately because they do not contact accurately.

Further, there is a method in which a plurality of pin probes are arranged at positions corresponding to lands of a wiring circuit pattern on a printed circuit board to inspect for short circuit or disconnection between terminals of an electronic component.

However, in this inspection apparatus, it is said that the terminal chips are not suitable for those having a narrow pitch because of the dimensional restrictions of the arrangement of the pin probes. In addition, since this inspection device has a dent on the land portion, it is difficult to apply it in the case of bare chip mounting. Moreover, as the number of pin probes increases, the above-mentioned problem of relative positioning becomes more serious, which also affects the automatic control of bare chip mounting.

Further, in the case of a semiconductor mounting board having a large number of wiring circuit patterns on the same printed board, about 100 m
Since there are nearly 10,000 inspection points in a m × 100 mm square circuit board, in any of the above-mentioned devices, a pin probe is brought into contact with an accurate position for each of these inspection points, There are many practical problems in routing and wiring of signal cables to be connected.

From the above, semiconductor manufacturers are
In the case of chip mounting, it was difficult to guarantee the same level of reliability as packaged products before shipping them to users.

Therefore, it is an object of the present invention to provide a circuit board continuity inspection apparatus capable of accurately and efficiently conducting a continuity test even in the case of a circuit board having a narrow chip.

[0014]

In order to solve the above-mentioned problems, a method of manufacturing a printed wiring board according to the present invention is provided with a plurality of first terminal portions connected to electronic parts on one main surface. At the same time, the circuit board having the second terminal portions corresponding to the respective first terminal portions formed on the other main surface is arranged as an inspection target so as to face one main surface of the circuit board, The first electrode portion having a conductive elastic member that is brought into contact with and separated from the terminal portion at a time and the other main surface of the circuit board are arranged so as to face each other and correspond to the individual second terminal portions. It is characterized in that it is provided with a second electrode portion having a terminal pin, and a continuity inspection means for detecting a conduction state between the first electrode portion and the second electrode portion.

Further, it is characterized in that a positioning means is provided for relatively moving the circuit board and at least the second electrode portion to position the second electrode portion with respect to the circuit board.

Further, the conductive elastic member of the first electrode portion has an area corresponding to a plurality of circuit boards.

In the circuit board continuity inspection device of the present invention, a plurality of first terminal portions connected to electronic components are formed on one main surface, and the other main surface corresponds to each of the first terminal portions. Second
The above-mentioned circuit board on which the terminal part of
The terminal pin of the second electrode portion is brought into contact with each of the second terminal portions of the circuit board, and the first electrode portion is brought into contact with the first terminal portion of the circuit board all together.

If there is no electrical connection between the first terminal portion and the second terminal portion of the circuit board in the above contact state, there will be a disconnection. Therefore, this disconnection point is specified by the continuity inspection means.

On the other hand, the first electrode portion is separated from the circuit board with the second electrode portion kept in contact with each of the second terminal portions. In the contact state by the second electrode portion,
If the second electrode portions are electrically connected to each other, the circuit board has a short circuit portion. Therefore, this short-circuited portion is specified by the continuity inspection means.

The circuit board and at least the second electrode portion are moved relative to each other, and the positioning means for positioning the second electrode portion with respect to the circuit board is provided, whereby the circuit board is efficiently provided. The continuity check will be performed.

Further, since the conductive elastic member of the first electrode portion has the area corresponding to the plurality of circuit boards, the continuity test of the plurality of circuit boards can be simultaneously performed.

[0022]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Specific embodiments of the present invention will be described in detail below with reference to the drawings.

The circuit board inspection apparatus according to the present invention is an apparatus for inspecting the continuity of a circuit board such as a so-called BGA or CSP. In the present embodiment, a CSP having a narrower pitch of 1.0 mm or less than the terminal chips from the BGA will be described below.

First, as shown in FIG. 1, a circuit board to be inspected has a plurality of electrode pads 2 which are first terminal portions connected to IC chips, which are electronic components, on one main surface 1a. The circuit board 1 has a ball grid 3 which is a second terminal portion corresponding to each of the first terminal portions formed on the other main surface 1b. In this circuit board 1, the electrode pads 2 of the circuit board 1 and the ball grids 3 of the circuit board 1 correspond to each other through the through holes 4 in a so-called one-to-one correspondence.

In the CSP method, the circuit board 1 is arranged on the side of the IC chip facing the printed board, and spherical solder bumps formed by solder are formed on the ball grid 3 and the wiring of the printed board is formed. Solder bumps are also formed on the pads of the circuit pattern, and these solder bumps are melted and solidified.

Then, the circuit board 1 to be inspected.
When conducting a continuity inspection by a circuit board continuity inspection device, as shown in FIG. 2, a plurality of circuit boards 1 are arranged vertically and horizontally (hereinafter, the plurality of circuit boards will be referred to as "1").
A ". ) Will be the continuity test.

The size of one circuit board shown in FIG. 1 is about 5 to 10 mm × 5 to 10 mm, and the distance between the ball grids 3 on the back side of the circuit board 1 is 0.5 mm.
Is a constant interval. The size of the plurality of circuit boards 1A shown in FIG. 2 is about 100 mm × 100 mm.

Then, as shown in FIGS. 3 and 4, the circuit board continuity inspection apparatus according to the present embodiment then comprises positioning means 5 for moving and positioning the plurality of circuit boards 1A at predetermined positions. A continuity inspection device 10 includes a detection head unit 11 that sandwiches the plurality of circuit boards 1A from above and below to detect continuity, and a continuity inspection unit 21 connected to the detection head unit 11.

First, the positioning means 5 is a base 7 for supporting a plurality of circuit boards 1A, and a Y-direction movement for moving the plurality of circuit boards 1A provided on the base 7 in the Y-direction (longitudinal direction). The member 8, the X-direction moving member 9 that moves the plurality of circuit boards 1A in the X-direction (lateral direction), and the drive motor that moves the Y-direction moving member 8 and the X-direction moving member 9 in the X-direction and the Y-direction, respectively. It is composed of M1 and M2, the rotary plate 20, and the like.

An X-direction moving member 9 and a Y-direction moving member 8 are provided above the base 7 via rail members (not shown), and movably support a plurality of circuit boards 1A. The inspection head unit 11 is arranged at the center of the inspection head unit 11.

The Y-direction moving member 8 is formed with a holding member 8a for holding in a U-shaped cross section, and is capable of moving in the Y-direction while holding the plurality of circuit boards 1A. In addition, the Y-direction moving member 8 has a Y-direction moving member 9
The direction moving member 8 is connected together and can be moved in the X direction (lateral direction) via a rail member (not shown).

Although not specifically shown, the base 7 is provided with a CCD camera for catching the positions of the positioning marks provided on the plurality of circuit boards 1A, and the positioning marks and the CCD camera perform positioning. A positioning detection device for detecting the position is provided. Then, the positioning means 5 is connected to each of the illustrated automatic control units, and repeats the positioning according to the program of the automatic control unit as shown in the flowchart of FIG.

In addition to the Y-direction moving member 8 and the X-direction moving member 9, the positioning means 5 is provided with a Z-direction moving member for moving the plurality of circuit boards 1A in the Z direction (height direction). Is optional.

Further, inside the base 7, a rotary plate 20 for rotating a lower cylinder 16 described later is provided. The rotating plate 20 is provided with a plurality of pin probes 13 corresponding to the positions of the ball grids 3 of the plurality of circuit boards 1 by rotating the lower cylinder 16 in the rotating direction (reference numeral, θ). The two electrode portions 12 are brought into accurate contact with each other.

The positioning means 5 detects the positioning marks provided on the plurality of circuit boards 1A by the CCD camera, finely adjusts them in the X, Y and θ directions, and repeats the positioning. The repeatability in this case is 0.1 mm or less.

Next, as shown in FIG. 4, the inspection head unit 11 is for sandwiching the plurality of circuit boards 1A from above and below and inspecting the conductive state of the plurality of circuit boards 1A. The pad 2 includes a first electrode portion 17 that is brought into contact with and separated from the pad 2 collectively, and a second electrode portion that corresponds to each of the ball grids 3 of the circuit board 1.

First, the second electrode portion 12 is arranged below the plurality of circuit boards 1A.
And a fixing member 15 for arranging the pin probes 13 at positions corresponding to the ball grids 3 of the plurality of circuit boards 1A.
And a lower cylinder 16 for vertically moving the fixing member 15 so that the fixing member 15 can be brought into contact with and separated from the fixed cylinder 15.

In this embodiment, each pin probe 13 is provided in a number corresponding to the number of ball grids 3 on one circuit board 1 of the plurality of circuit boards 1A, and as described above. Are arranged at positions corresponding to the ball grids 3 of the plurality of circuit boards 1A. That is, the second electrode portion 12 is directed toward the ball grid 3 of the circuit board 1 so that the front end side is bundled by the contact fixing member 15 and the rear end side is connected to the continuity inspection means 21 via the connector 14. It is connected to the. When a large number of pin probes 13 are bundled in this way, the surface facing the circuit board 1 becomes the contact surface 13a.

On the other hand, the first electrode portion 17 is disposed above the plurality of circuit boards 1A, and has a conductive elastic member 18.
And an upper cylinder 19 for moving the conductive elastic member 18 up and down so that the elastic member 18 can be contacted and separated.

The conductive elastic member 18 is a so-called all-short-circuit member that can be collectively brought into contact with and separated from the electrode pads 2 of the plurality of circuit boards 1A. That is, the conductive elastic member 18 has conductivity in all directions, and does not have a direction in which conductivity is present or not depending on the direction.

In this embodiment, the conductive elastic member 18 is made of a conductive non-woven cloth formed by hardening nickel-plated fine fibers or a rubber formed by mixing nickel. , But is not necessarily limited to these.

That is, the conductive elastic member 18 surely makes contact with the plurality of electrode pads 2 of the circuit board 1 at the same time, prevents the plurality of electrode pads 2 from being damaged, and It is provided for the purpose of preventing a strong pressure from being applied to the circuit board 1 when the circuit board 1 is sandwiched together with the second electrode portion 12. In addition, the conductive elastic member 18 has conductivity in all directions, not a direction in which conductivity is present and a direction in which there is no conductivity depending on the direction. Therefore, the member is not limited to the above members as long as these objects can be achieved.

The conductive elastic member 18 is formed to have a contact surface 17a wider than the contact surface 13a of the second electrode portion 12. This is due to this conductive elastic member 18
This is for reliably sandwiching the plurality of circuit boards 1A together with the second electrode portion 12 from above and below and inspecting the conduction state of the plurality of circuit boards 1A.

The inspection head portion 11 having such a structure is
It is a GA type, a CSP type, or a unit type that can be replaced according to the distance between the ball grids 3 of the circuit board 1. That is, the second electrode unit 12 and the first electrode unit 17 can be adapted to each type as long as they are exchanged in accordance with the various specifications described above and the program of the automatic control unit is converted.

By the way, in the present embodiment, the plurality of circuit boards 1A are moved to the position of the inspection head portion 11 by the positioning means 5. this is,
Although it is possible to move the inspection head unit 11 while fixing a plurality of circuit boards 1A,
Moving the inspection head unit 11 may cause routing and disconnection of the signal cables connected to the large number of pin probes 13. Therefore, a plurality of circuit boards 1A
I am trying to move the side of. However, it goes without saying that it is also possible to provide a moving means for moving the second electrode portion 12 and the first electrode portion 17 to the position of the circuit board 1 for inspection.

Further, the above-mentioned rotating member 20 is not provided above the plurality of circuit boards 1A on which the first electrode portions 17 are arranged, but this is because the first electrode portions 17 have a wide contact. This is because the surface 17a is brought into contact with the electrode pads 2 of the circuit board 1 all at once, so that even if a deviation occurs in the rotation direction (θ), such deviation can be absorbed.

Therefore, by the Y-direction moving member 8 and the X-direction moving member 9 of the positioning means 5, the second electrode portion 1 is
When the plurality of circuit boards 1A are moved to a predetermined position where 2 and the first electrode portion 17 face each other, an error in the rotation direction (θ) occurs in the position of each of the plurality of circuit boards 1A with respect to each circuit board 1. Even if the rotating plate 20 is rotated, the second electrode portion 1 can be accurately positioned with respect to each circuit board 1.
The directionality of 2 can be adjusted.

Further, it is preferable that the second electrode portion 12 is brought into contact with each ball grid 3 of the circuit board 1 earlier than the first electrode portion 17. The first electrode portion 17 collectively contacts the electrode pads 2 of the plurality of circuit boards 1A, and has a contact surface 17a wider than the contact surface 13a of the second electrode portion 12. Therefore, by driving the upper cylinder 19 and lowering the first electrode portion 17, all the electrode pads 2 can be reliably brought into contact with all the electrode pads 2 collectively.

As described above, when the plurality of circuit boards 1A are sandwiched by the second electrode portion 12 and the first electrode portion 17 from above and below, even if the circuit board 1 has a slight inclination, for example, it is accurate. Relative positioning is performed.

Next, a case of actually inspecting the conduction state of the circuit board to be inspected by using the circuit board continuity inspection device of the present embodiment will be described with reference to the flowchart of FIG.

First, a plurality of circuit boards 1A to be inspected are
The plurality of circuit boards 1A are set by the holding member 7a of the positioning means 5 in the continuity inspection device 10 of the present embodiment (step 31).

Next, the Y-direction moving member 8, the X-direction moving member 9 and the rotary plate 20 of the positioning means 5 are rotated to move the plurality of circuit boards 1A to the predetermined position of the inspection head unit 11 (step 32). ). At this time, the CCD camera catches the positions of the positioning marks provided on the plurality of circuit boards 1A, and the positioning is repeated by adjusting them by the automatic control unit.

Here, since the automatic control unit is also connected to the rotary plate 20, by rotating the rotary plate 20, a plurality of pins arranged corresponding to the positions of the ball grid 3 of the circuit board 1 are arranged. It is possible to make accurate contact with the second electrode portion 12 composed of a probe.

Next, the second electrode portion 12 is brought into contact with the plurality of ball grids 3 and the first electrode portion 17 is brought into contact with the electrode pad 2 which is the first terminal portion of the circuit board 1 all together. (Step 33).

Then, in the state where the circuit board 1 is sandwiched in the vertical direction in this way, the conduction state of the target circuit board 1 is inspected by the conduction inspection means 21. That is, when the conductive elastic member 18 of the first electrode portion and the plurality of pin probes 13 of the second electrode portion 12 are in contact with each circuit board 1, the electrode pad 2 and the ball grid 3 of the circuit board 1 are in contact with each other. If there is no continuity between them, this circuit board 1 has a disconnection. Therefore, the disconnection point is specified by the continuity inspection means 21.

Next, with the second electrode portion 12 kept in contact with each of the ball grids 3, the first electrode portion 1
7 is separated from the plurality of circuit boards 1A (step 3
4). When only the second electrode portion 12 is in contact with the plurality of pin probes 12 on the circuit board 1, the pin probes 1
When the two are electrically connected, the circuit board 1 has a short-circuited portion. Therefore, the short circuit portion is identified by the continuity inspection means 21.

After the target circuit board 1 is tested for continuity in this way, the positioning means 5 is moved in the Y direction in step 32 in order to test the continuity of the other circuit boards 1 of the plurality of circuit boards 1A. The movement of the member 8 and the X-direction moving member 9 is started (step 35).

By repeating the above, all the conductive states of the respective circuit boards 1 of the plurality of circuit boards 1A supported by the positioning means 5 are inspected, and the inspection is completed (step 36).

After the completion of such inspection, the product is shipped to the user or the like. However, since the circuit board continuity inspection apparatus of the present embodiment performs an accurate continuity inspection, some products are guaranteed in quality. Will be shipped.

As described above, in the present embodiment, the first electrode portion 1 which can be collectively brought into contact with and separated from the electrode pad 2 on the circuit board 1.
The circuit board 1 is sandwiched by 7 and the second electrode portion 12 which can be brought into contact with and separated from the ball grid 3 of the circuit board 1. Therefore, if the second electrode portion 12 is accurately brought into contact with the ball grid 3 of the circuit board 1, the first electrode portion 17
Since it is a so-called all-short-circuiting member, relative positioning does not pose a problem like the continuity inspection device in the case of conventional package products, and even automatic control accurately contacts each inspection point. Can be made.

Next, an application example of the embodiment will be described.

In this applied example, as shown in FIG. 5, the conductive elastic member 31 of the first electrode portion 30 is formed of a plurality of circuit boards 1.
It has an area corresponding to two circuit boards 1 of A.

On the other hand, the second electrode portion 32 is provided with a number of pin probes 33 corresponding to the number of the ball grids 3 of the two circuit boards 1 and the ball grids 3 of the plurality of circuit boards 1A. It is arranged in the position corresponding to. The conductive elastic member 31 has a contact surface 31a wider than the contact surface 33a of the pin probe 33, as in the case of the above-described embodiment.

Therefore, the first electrode portion 30 and the second electrode portion 32 sandwich a plurality of circuit boards 1A from above and below, and at the same time, the two circuit boards (1, 1) are electrically connected at the same time. Can be inspected.

The second electrode portion 32 and the first electrode portion 3
It is needless to say that 0 is provided so that two or more circuit boards 1A (1, 1 ...) Can be inspected for electrical continuity at the same time. Also, in this embodiment, the plurality of circuit boards 1A may be moved to a predetermined position and positioned by the positioning means 5,
Further, a moving means for moving the second electrode portion 32 and the first electrode portion 30 side may be provided.

[0066]

The circuit board continuity inspection apparatus of the present invention includes a first electrode portion having a conductive elastic member that is brought into contact with and separated from the first terminal portion of the circuit board at a time, and the circuit board. A second electrode portion having a terminal pin corresponding to each of the second terminal portions of the second terminal portion, the terminal pin of the second electrode portion is accurately attached to each of the second terminal portions of the circuit board. The first electrode portion is collectively brought into contact with the first terminal portion of the circuit board, and the continuity test is performed.

Therefore, the problem that relative positioning is difficult as in the case of the conventional device is solved, and it is possible to accurately and efficiently conduct the continuity inspection of the circuit board even if the circuit board has a narrow pitch. is there.

Further, since the circuit board continuity inspection apparatus of the present invention has a simple structure as compared with the inspection apparatus for semiconductors and liquid crystals that perform similar inspection, it can be manufactured at a low cost. Significant cost reduction can be achieved.

[Brief description of drawings]

FIG. 1 is a perspective view showing a circuit board to be inspected,
(A) is a state viewed from the top side, and (b) is a state viewed from the bottom side.

FIG. 2 is a perspective view showing a state in which a plurality of the circuit boards are vertically and horizontally arranged and set in a continuity inspection device.

FIG. 3 is a perspective view of a circuit board continuity inspection device according to an embodiment of the present invention.

FIG. 4 is an enlarged sectional view showing an inspection head portion of the circuit board continuity inspection device.

FIG. 5 is an enlarged cross-sectional view showing another example of the inspection head unit.

FIG. 6 is a flowchart showing the operation of the circuit board continuity inspection device.

[Explanation of symbols]

1 circuit board, 1a one main surface of the board, 1b other main surface of the board, 1A plural circuit boards, 2 first terminal parts (electrode pads), 3 second terminal parts (ball grid), 5 positioning Means, 10 circuit board continuity inspection device, 11 inspection head portion, 12, 32 second electrode portion,
13a, 33a Contact surface of second electrode part, 17, 30
First electrode part, 18, 31 Conductive elastic member, 17
a, 31a, contact surface of conductive elastic member, 21 continuity inspection means

Claims (3)

[Claims] 1. A first surface connected to an electronic component on one main surface
A plurality of terminal portions are formed, and the first main surface is formed on the other main surface.
The circuit board on which the second terminal portion corresponding to each of the terminal portions is formed is arranged to face one of the main surfaces of the circuit board and contacts the first terminal portion collectively. A first electrode portion having a conductive elastic member that is separated from each other; and a second electrode portion that is arranged to face the other main surface of the circuit board and has terminal pins corresponding to each of the second terminal portions. A circuit board continuity inspecting device comprising: a continuity inspecting means for detecting an electrical continuity between the first electrode portion and the second electrode portion. 2. A positioning means for moving the circuit board and at least the second electrode portion relative to each other to position the second electrode portion with respect to the circuit board. 1. The circuit board continuity inspection device according to 1. 3. The circuit board continuity inspection device according to claim 1, wherein the conductive elastic member of the first electrode portion has an area corresponding to a plurality of circuit boards.