JPH09294000A - Electronic component mounting apparatus and method - Google Patents

Abstract

(57) Abstract: An electronic component mounting apparatus and method capable of reliably preventing erroneous mounting of electronic components. SOLUTION: The orientation of the electronic component 2 before being picked up is image-recognized, the recognized image data is compared with reference data, a difference is calculated, and the electronic component 2 of the electronic component 2 is calculated based on the calculated difference. Corrected the orientation and implemented it.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounting apparatus and method in a surface component mounting machine for automatically mounting electronic components on the surface of a printed wiring board or the like.

[0002]

2. Description of the Related Art Today, in the technology for mounting electronic parts such as resistors, capacitors, transistors, and ICs on the surface of a printed wiring board, automation is generally achieved. Further, among the electronic components handled by these surface mounters, there are many polar components, that is, polar components.
These polar parts are delivered with the same polarity when they are supplied to the mounter, and are picked up by the surface mounter to be mounted on the printed wiring board. However, the conventional surface mounter does not have a means for determining the polarity of delivered parts.

[0003]

As described above, the conventional surface mounter does not have the function of determining the polarity of the polar component and correcting the polarity to adjust the polarity. It was For this reason, there are problems as shown in the following (1) to (4). (1) When polar parts packaged with taping, trays, sticks, etc. are supplied (set) to the surface mounter with the wrong polarity due to work mistakes, etc., these polar parts are placed on the printed wiring board. Implemented in the wrong direction. (2) When a component manufacturer or the like delivers the polar component in the wrong direction, the polar component is mounted on the printed wiring board in the wrong direction unless artificially confirmed. (3) When a polar component having specifications with different polarities (package directions) is mounted by using the surface mounter, it is necessary to change the NC program. (4) Currently, in the electronic parts industry and the mounting industry, bulking of polar parts is being considered, but erroneous mounting has become a problem, which is an obstacle to bulking.

The present invention has been made in view of the above problems, and an object thereof is to provide an electronic component mounting apparatus and method capable of preventing erroneous mounting of electronic components.
Further, other objects will be clarified sequentially in the contents described below.

[0005]

In order to achieve the above object, the present invention is characterized by the following technical means as an electronic component mounting apparatus. That is, an electronic component can be picked up and transported to a predetermined position, and the electronic component transporting means can switch and adjust the direction of the electronic component, and the electronic component before or after being picked up by the electronic component transporting means. Image recognition means for recognizing the orientation of the electronic component by an image, calculation means for comparing the image data from the image recognition means with reference data to calculate a difference, and the electronic device based on the difference calculated by the calculation means. It is configured to include a correction unit that controls the component transfer unit and switches and corrects the direction of the electronic component.

Further, in order to achieve the above object, the present invention is characterized by taking the following technical means as an electronic component mounting method. That is, the orientation of the electronic component before being picked up by the electronic component carrying means or the direction of the electronic component after being picked up is image-recognized, and the difference is calculated by comparing the recognized image data with reference data, and the calculated. The orientation of the electronic component is switched and corrected based on the difference, and the electronic component is mounted.

According to the above configuration, the electronic component is image-recognized and the orientation of the electronic component is corrected and mounted based on the difference from the reference data. For example, the electronic component is mounted in the component mounter in the wrong orientation. Even if supplied, it will not be mounted in the wrong direction on the printed wiring board.

[0008]

1 and 2 show an example of a surface component mounting machine to which the present invention is applied. FIG. 1 is a perspective view showing the construction of a main part of the mounting machine, and FIG. 2 is a perspective view of the mounting machine. FIG. In FIGS. 1 and 2, reference numeral 1 is a carrier tape on which an electronic component 2 is releasably attached. That is, in the present embodiment, the electronic component 2 is conveyed to the pickup position and picked up while being attached to the carrier tape 1. However, the method of transporting the electronic component 2 to the pickup position may be another method.

Reference numeral 3 is a control unit (CPU) for controlling the operation of the entire surface mounter. Reference numeral 4 is a CCD camera for photographing the electronic component 2 on the carrier tape 1,
The image captured by the CCD camera 4 is subjected to data processing by the image recognition section 5 and input to the control section 3. Also CCD
Electronic components 2 on the carrier tape 1 are provided around the camera 4.
A lamp 6 for illuminating Reference numeral 7 is a monitor (CRT), which displays various mounting states and data information.

Reference numeral 8 is a biaxial (X, Y axis) drive section shown in FIG. The biaxial drive unit 8 is controlled by the control unit 3 to move the plate 9 in the XY directions. Further, the plate 9 is provided with a polarity correction section 10 and a pickup section 11 as an electronic component carrying means.

The polarity correction unit 10 includes a motor 12 mounted on a plate 9 and rotatable in two forward and reverse directions, and the motor 1.
2 and an output shaft (not shown) and a gear 13 that is integrally rotatable. The pickup unit 11 includes a cylinder 14 attached to the plate 9 and the cylinder 14
Has a vacuum suction nozzle 15 fixedly attached to the tip of the piston pin 14a, and a gear 16 that is integrally rotated and slid vertically with the piston pin 14a. Always meshed.

Reference numeral 17 is a printed wiring board on which the electronic component 2 is mounted, and is arranged on the stage 18 in a state of being positioned.

FIG. 3 is a flowchart showing an example of an operation processing procedure in the surface mounter of this embodiment. Therefore, next, the operation of the surface mounter described with reference to FIGS. 1 and 2 will be described with reference to FIG. First, when the electronic component 2 attached to the carrier tape 1 is conveyed to the image recognition position where the CCD camera 4 is set, the electronic component 2 is photographed by the CCD camera 4. Further, the image recognition unit 5 processes the data, and the image data is input to the control unit 3 (step S1). Then, the control unit 3 compares the image data with the reference data stored in advance, and determines whether or not the polarity of the electronic component 12 is in the correct direction (step S2). Note that the reference data is rewritten according to the electronic component handled.

An example of the determination method will be described here. The data 101 shown in FIG. 4 is the actual shape (direction) of the electronic component 2 photographed by the CCD camera 4, and the data 201 is in the control unit 3. The correct shape (orientation) of the electronic component 2 is stored in advance. In the example shown in FIG.
It is recognized that in the electronic component 2 obtained as the data 101, the electrode a is arranged on the right side and the electrodes b and c are arranged on the left side. On the other hand, in the reference data 201, the electrode a is arranged on the left side, and the electrodes b and c are arranged on the right side. Therefore, when the data 101 and the data 201 are compared by the arithmetic unit (not shown) of the control unit 3, the data 10
The difference between 1 and the data 201 is recognized, and the recognition data 101 is rotated and displaced by 180 degrees, and the polarity (direction)
Are determined to be different.

Next, the vacuum suction nozzle 15 picks up the electronic component 2. In the pickup of the electronic component 2, first, the vacuum suction nozzle 15 is arranged on the electronic component 2 of the carrier tape 1 by moving the plate 9. Then, the cylinder 14 is driven and the piston pin 1
4a is lowered. When the vacuum suction nozzle 5 is brought into contact with the electronic component 2, the vacuum suction nozzle 15 sucks the electronic component 2. After that, the cylinder 14 is driven,
The piston pin 14a moves up together with the electronic component 2, and the pickup is performed (steps S3 and S4).

Further, in step S2, the image data 101 and the reference data 201 are compared and calculated, and if it is determined that there is a difference between the image data 101 and the reference data 201, the process proceeds to step S5 and the polarity correction is performed. In the section 10, the motor 12 is rotated in a direction in which the difference can be made zero by an amount corresponding to the difference, and after the correction, the motor 12 is stopped again. Thereby, the orientation of the electronic component 2, that is, the polarity is corrected. Then, the process proceeds to step S6,
Components are mounted on the printed wiring board 17.

On the other hand, in step S2, when it is determined that there is no difference between the image data 101 and the reference data 201, that is, the polarities are matched, the process proceeds from step S2 to step S4, and thereafter. Then, the process proceeds to step S6 and component mounting is performed. In the component mounting of step S6, the electronic component 2 is placed on the electronic component 2 of the carrier tape 1 by the movement of the plate 9 while the electronic component 2 is vacuum-adsorbed and held by the vacuum adsorption nozzle 15. Then, the cylinder 14 is driven and the piston pin 14 a descends to mount the electronic component 2 on the printed wiring board 17.
After that, the operations of steps S1 to S6 are repeated.

Therefore, according to this embodiment, the electronic component 2 is image-recognized, and the orientation of the electronic component 2 is corrected and mounted based on the difference from the reference data.
The effect as shown in (5) is obtained. (1) Even if polar parts packaged with taping, trays, sticks, etc. are supplied (set) to the surface mounter by mistake due to work mistakes, etc. Can be implemented. (2) Even if the component manufacturer or the like delivers the polar component in the wrong direction, the component can be mounted in the correct direction. (3) Polarized parts having specifications with different polarities (package directions) can be mounted in the correct direction using the surface mounter without significantly changing the NC program. (4) It becomes easy to make polar parts into bulk. (5) It becomes possible to use the CCD camera 4 to inspect the polarity.

In the above embodiment, the structure in which the image of the electronic component 2 is recognized on the carrier tape 1 before being picked up, that is, before the pickup is disclosed, is picked up by the vacuum suction nozzle 15. It is also possible to recognize the image in the state after the start.
Further, the present invention can be applied to all polar parts regardless of the packaging style, that is, taping, stick, tray, bulk, and the like. It can also be applied to general surface mounters (high-speed / medium-speed chip mounters, odd-shaped chip mounters, etc.) and surface mount inspection machines.

[0020]

As described above, according to the present invention,
Image recognition is performed on electronic components, and the orientation of the electronic components is corrected based on the difference from the reference data before mounting, so even if the electronic components are supplied to the component mounter in the wrong orientation, the printed wiring board, etc. Will not be installed in the wrong direction,
Effects such as improved mounting accuracy can be expected.

[Brief description of drawings]

FIG. 1 is a perspective view of a main part configuration of a surface mounter to which the present invention is applied.

FIG. 2 is a block diagram of a main part configuration of a surface mounter to which the present invention is applied.

FIG. 3 is a flowchart showing an example of an operation processing procedure in a surface mounter to which the present invention is applied.

FIG. 4 is a diagram illustrating an example of polarity determination.

[Explanation of symbols]

 2 electronic components 3 control unit 4 CCD camera 5 image recognition unit 10 polarity correction unit 11 pickup unit 12 polarity correction motor 14 cylinder 15 suction nozzle (electronic component transportation means)

Claims (4)

[Claims] 1. An electronic component carrying means capable of picking up and carrying an electronic part to a predetermined position and capable of switching and adjusting the direction of the electronic part, and an electronic part before being picked up by the electronic part carrying means. Alternatively, an image recognition means for recognizing the orientation of the electronic component after pickup by an image, a calculation means for comparing the image data from the image recognition means with reference data to calculate a difference, and a difference calculated by the calculation means And a correction unit for controlling the electronic component transporting unit to switch and correct the direction of the electronic component. 2. The electronic component mounting apparatus according to claim 1, wherein the electronic component is a polar electronic component mounted on a surface of a printed wiring board. 3. An image of the orientation of the electronic component before being picked up by the electronic component carrying means or of the electronic component after being picked up is image-recognized, and the recognized image data is compared with reference data to calculate a difference, An electronic component mounting method, wherein the orientation of the electronic component is switched and corrected based on the calculated difference and the electronic component is mounted. 4. The electronic component mounting method according to claim 3, wherein the electronic component is a polar electronic component mounted on the surface of a printed wiring board.