JPH09295342A - Method and device for heating thermoplastic resin molded product - Google Patents
Method and device for heating thermoplastic resin molded productInfo
- Publication number
- JPH09295342A JPH09295342A JP13572596A JP13572596A JPH09295342A JP H09295342 A JPH09295342 A JP H09295342A JP 13572596 A JP13572596 A JP 13572596A JP 13572596 A JP13572596 A JP 13572596A JP H09295342 A JPH09295342 A JP H09295342A
- Authority
- JP
- Japan
- Prior art keywords
- thermoplastic resin
- resin molded
- heating
- heated
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Treatments Of Macromolecular Shaped Articles (AREA)
- Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
- Blow-Moulding Or Thermoforming Of Plastics Or The Like (AREA)
Abstract
(57)【要約】
【課題】 熱可塑性樹脂成形品のマイクロ波誘電加熱を
量産に適するようにする。
【解決手段】 多数の熱可塑性樹脂成形品5を自転させ
て連続的に移送しながら、その被加熱部分5cに側方よ
り近赤外線を照射して、被加熱部分5cを当該熱可塑性
樹脂のガラス転移点以上、再結晶化温度未満の温度に加
熱する。その後熱可塑性樹脂成形品5の送られる経路5
xに対して串形に配列された、空洞共振器10a、10
b内にマイクロ波を伝送し、被加熱部分5cを、各空洞
共振器10a、10bにつき1つの高電界域36のみを
通過させて誘電加熱する。
(57) Abstract: To make microwave dielectric heating of a thermoplastic resin molded product suitable for mass production. SOLUTION: While heating and continuously transferring a large number of thermoplastic resin molded articles 5, the heated portion 5c is laterally irradiated with near-infrared rays, and the heated portion 5c is made of glass of the thermoplastic resin. The temperature is higher than the transition point and lower than the recrystallization temperature. After that, the path 5 through which the thermoplastic resin molded product 5 is sent
The cavity resonators 10a and 10 arranged in a skewed pattern with respect to x.
Microwaves are transmitted into b, and the heated portion 5c is dielectrically heated by passing only one high electric field region 36 for each of the cavity resonators 10a and 10b.
Description
【0001】[0001]
【発明の属する技術分野】本発明は、ブロー成形や延伸
ブロー成形等によって形成されるプラスチックボトル形
成用のプリフォーム等の熱可塑性樹脂成形品のマイクロ
波誘電加熱方法および装置、並びに赤外線輻射加熱方法
に関する。TECHNICAL FIELD The present invention relates to a microwave dielectric heating method and apparatus for a thermoplastic resin molded article such as a preform for forming a plastic bottle formed by blow molding or stretch blow molding, and an infrared radiation heating method. Regarding
【0002】[0002]
【従来の技術】特公平6−22874号公報には、空洞
共振器内に共振状態で存在するマイクロ波定在波の高電
界域および低電界域を高分子樹脂成形品を繰り返し通過
させて、高分子樹脂成形品をマイクロ波誘電加熱する方
法が提案されている。すなわち図9に示すように、矢印
B方向にマイクロ波を伝送して、高電界域101および
低電界域102が交互に存在するようにした空洞共振器
100の内部を通って、高分子樹脂成形品の被加熱部分
103を矢印A方向に通過させてマイクロ波誘電加熱す
る。しかしながら本発明者の経験によれば、この方法で
は、同時に2個以上の被加熱部分103が空洞共振器1
00を通過するようにすると、満足な加熱を行なうこと
ができないことが判明した。従ってこの方法は、比較的
長い空洞共振器100で1個づつのみしか加熱できない
ので、量産に不適当である。In Japanese Patent Publication No. 6-22874, a polymer resin molded article is repeatedly passed through a high electric field region and a low electric field region of a microwave standing wave existing in a resonance state in a cavity resonator, A method of microwave dielectric heating a polymer resin molded article has been proposed. That is, as shown in FIG. 9, a microwave is transmitted in the direction of the arrow B to pass through the inside of the cavity resonator 100 in which the high electric field region 101 and the low electric field region 102 are alternately present, and the polymer resin molding is performed. The heated portion 103 of the article is passed in the direction of arrow A for microwave dielectric heating. However, according to the experience of the present inventor, in this method, two or more heated portions 103 are simultaneously formed in the cavity resonator 1.
It has been found that satisfactory heating cannot be achieved by passing through 00. Therefore, this method is not suitable for mass production, because the cavity resonator 100 having a relatively long length can heat only one by one.
【0003】その理由は次のように考えられる。図9の
空洞共振器100の受端105が特性インピーダンスで
閉じていれば、入射するエネルギーは全部受短105で
吸収され反射波はない。受端105のインピーダンスが
特性インピーダンスと異なれば、受端105で入射エネ
ルギーの一部あるいは全部が反射されて反射波を生ず
る。この場合、空洞共振器100内の電界は入射波と反
射波を合成したものとなり、この合成波を定在波とよ
ぶ。定在波は図10に示すように(空洞共振器が入射端
104を除いて実質的に閉鎖している場合)、一定の場
所に波の腹と節があって、その間で電界強度が正弦的に
分布し、その位置で時間的に変化するだけで少しも進行
しない波のことをいう。空洞共振器100の底部に被加
熱部分103を通過させるためのスリット(図3の35
に対応する)が形成されている場合は、図11に示すよ
うに、特に長さ方向中央ほどマイクロ波の漏れが多く、
電界強度が小さくなる。そのため空洞共振器100の中
央部では、通過する被加熱部分103が1個の場合でも
加熱効率が低くなる。この状態で空洞共振器100の中
に誘電体である被加熱部分103が1個入ってきた時、
インピーダンスの整合をとると図12に示すように、被
加熱部分103の吸収率が大きいため、反射マイクロ波
電力が小さくなると共に、透過マイクロ波電力も小さく
なる。従って複数の被加熱部分103が空洞共振器10
0を矢印A方向に通過する場合、入射側の被加熱部分1
03によってマイクロ波電力の殆どが吸収され、それよ
り下流にある被加熱部分103に向う透過マイクロ波電
力が小さくなり、加熱効率が更に低下する。The reason is considered as follows. If the receiving end 105 of the cavity resonator 100 of FIG. 9 is closed by the characteristic impedance, all the incident energy is absorbed by the receiving short 105 and there is no reflected wave. If the impedance of the receiving end 105 is different from the characteristic impedance, part or all of the incident energy is reflected by the receiving end 105 to generate a reflected wave. In this case, the electric field in the cavity resonator 100 is a combination of the incident wave and the reflected wave, and this combined wave is called a standing wave. As shown in FIG. 10 (when the cavity resonator is substantially closed except the entrance end 104), the standing wave has an antinode and a node of the wave at a certain position, and the electric field strength is sinusoidal between them. It is a wave that is distributed over time and changes at that position with time but does not progress at all. A slit (35 in FIG. 3) for allowing the heated portion 103 to pass through the bottom of the cavity resonator 100.
11) is formed, as shown in FIG. 11, there is more microwave leakage especially in the center in the length direction,
The electric field strength decreases. Therefore, in the central portion of the cavity resonator 100, the heating efficiency is low even if only one heated portion 103 passes through. In this state, when one heated portion 103, which is a dielectric, enters the cavity resonator 100,
When impedance matching is performed, as shown in FIG. 12, since the absorptance of the heated portion 103 is large, the reflected microwave power becomes small and the transmitted microwave power also becomes small. Therefore, the plurality of heated portions 103 are
When passing 0 in the direction of arrow A, the heated portion 1 on the incident side
Most of the microwave power is absorbed by 03, the transmitted microwave power to the heated portion 103 located downstream thereof is reduced, and the heating efficiency is further reduced.
【0004】[0004]
【発明が解決しようとする課題】本発明は、量産に適し
た、熱可塑性樹脂成形品のマイクロ波誘電加熱方法およ
び装置を提供することを目的とする。さらに本発明は、
熱可塑性樹脂成形品の被加熱部分を結晶化させるため、
被加熱部分をその再結晶化温度を越える温度に均一に急
速に加熱する方法を提供することを目的とする。SUMMARY OF THE INVENTION It is an object of the present invention to provide a microwave dielectric heating method and apparatus for thermoplastic resin molded articles, which is suitable for mass production. Further, the present invention is
In order to crystallize the heated part of the thermoplastic resin molded product,
It is an object of the present invention to provide a method for uniformly and rapidly heating a heated portion to a temperature exceeding its recrystallization temperature.
【0005】[0005]
【課題を解決するための手段】請求項1に係る熱可塑性
樹脂成形品の加熱方法は、多数の熱可塑性樹脂成形品を
マイクロ波により連続的に誘電加熱する方法であって、
熱可塑性樹脂成形品の送られる経路に対して串形に配列
された、1個もしくは複数の空洞共振器内にマイクロ波
を伝送し、熱可塑性樹脂成形品の被加熱部分を、各空洞
共振器につき1つの高電界域のみを通過させることを特
徴とする。請求項2に係る熱可塑性樹脂成形品の加熱方
法は、熱可塑性樹脂成形品を自転させながら、その被加
熱部分に側方より近赤外線を照射して、被加熱部分を当
該熱可塑性樹脂のガラス転移点以上、再結晶化温度未満
の温度に加熱した後に、請求項1記載の誘電加熱を行な
うものである。請求項3に係る熱可塑性樹脂成形品の加
熱方法は、請求項1記載の誘電加熱を行なった後に、熱
可塑性樹脂成形品を自転させながら、その被加熱部分に
側方より近赤外線を照射して、被加熱部分を熱可塑性樹
脂の再結晶化温度を越える温度に加熱するものである。
請求項4に係る熱可塑性樹脂成形品の加熱方法は、熱可
塑性樹脂成形品を自転させながら、その被加熱部分に側
方より近赤外線を照射して、被加熱部分を当該熱可塑性
樹脂のガラス転移点以上、再結晶化温度未満の温度に加
熱し、次に請求項1記載の誘電加熱により再結晶化温度
近傍の温度に加熱し、次いで熱可塑性樹脂成形品を自転
させながら、その被加熱部分に側方より近赤外線を照射
して、被加熱部分を当該熱可塑性樹脂の再結晶化温度を
越える温度に加熱するものである。A method for heating a thermoplastic resin molded article according to claim 1 is a method for continuously dielectrically heating a large number of thermoplastic resin molded articles by microwaves,
Microwaves are transmitted into one or a plurality of cavity resonators arranged in a skewed pattern with respect to the route through which the thermoplastic resin molded article is sent, and the heated portion of the thermoplastic resin molded article is transferred to each cavity resonator. It is characterized by allowing only one high electric field region to pass therethrough. The method for heating a thermoplastic resin molded article according to claim 2, wherein while rotating the thermoplastic resin molded article, a portion to be heated is irradiated with near-infrared rays from the side, and the portion to be heated is glass of the thermoplastic resin. The dielectric heating according to claim 1 is performed after heating to a temperature equal to or higher than the transition point and lower than the recrystallization temperature. A method for heating a thermoplastic resin molded article according to a third aspect is that, after performing the dielectric heating according to the first aspect, while irradiating the thermoplastic resin molded article, a portion to be heated is irradiated with near infrared rays from the side. Then, the heated portion is heated to a temperature exceeding the recrystallization temperature of the thermoplastic resin.
A method for heating a thermoplastic resin molded article according to claim 4, wherein while rotating the thermoplastic resin molded article, a portion to be heated is irradiated with near-infrared rays from a side, and the portion to be heated is glass of the thermoplastic resin. Heating to a temperature above the transition point and below the recrystallization temperature, then to a temperature near the recrystallization temperature by dielectric heating according to claim 1, and then heating the thermoplastic resin molding while rotating it. The part is irradiated with near infrared rays from the side to heat the part to be heated to a temperature exceeding the recrystallization temperature of the thermoplastic resin.
【0006】請求項5に係る熱可塑性樹脂成形品の加熱
装置は、多数の熱可塑性樹脂成形品をマイクロ波により
連続的に誘電加熱する装置であって、該装置は、熱可塑
性樹脂成形品の送られる経路に対して串形に配列され
た、1個もしくは複数のマイクロ波空洞共振器;空洞共
振器の該経路に沿う部分に1つの高電界域のみを形成す
る装置、および熱可塑性樹脂成形品を該経路に沿って移
送する装置を備えることを特徴とする。A heating device for a thermoplastic resin molded product according to a fifth aspect is a device for continuously dielectrically heating a large number of thermoplastic resin molded products by microwaves, the device comprising: One or more microwave cavity resonators arranged in a skewed pattern with respect to a route to be sent; a device for forming only one high electric field region in a portion of the cavity resonator along the route, and thermoplastic resin molding It is characterized by comprising a device for transferring an item along the path.
【0007】[0007]
【発明の実施の形態】プリフォーム(ポリエチレンテレ
フタレート系ポリエステル樹脂よりなる)の口頚部を加
熱により結晶化(白化)して、硬化し、耐熱性等を向上
させる方法と装置の例について説明する。図1は上記装
置の説明用平面図であって、1は架台、2は駆動スプロ
ケット、3は案内スプロケット、4は駆動スプロケット
2および案内スプロケット3と係合して、矢印方向に一
定速度で移動し、かつプリフォーム5を移送する移動チ
エーンである。6および7はそれぞれ、プリフォーム5
の送入部および送出部である。案内スプロケット3の送
入部6側に移動チエーン4に沿って、その外側に第1の
赤外線前加熱装置8aと第2の赤外線前加熱装置8bが
配設されている。また第1の赤外線前加熱装置8aおよ
び第2の赤外線前加熱装置8bにそれぞれ対向して、移
動チエーン4に沿って、その外側に第3の赤外線前加熱
装置8cおよび第4の赤外線前加熱装置8dが配設され
ている。駆動スプロケット2の送出部7側近傍に移動チ
エーン4に沿って、その外側に赤外線後加熱装置9が配
設されている。第4の赤外線前加熱装置8dに近接し
て、その下流側に空洞共振器セット10が配設されてい
る。空洞共振器セット10は、導波管12およびアイソ
レータ13を介してマイクロ波発振器14に接続する。
アイソレータ13は、反射波を吸収体11に回避して発
振器14を保護する。吸収体11は、空洞共振器セット
10からの反射波を吸収する水負荷である。BEST MODE FOR CARRYING OUT THE INVENTION An example of a method and an apparatus for improving the heat resistance etc. by crystallizing (whitening) the mouth and neck of a preform (made of a polyethylene terephthalate type polyester resin) by heating and hardening it will be described. FIG. 1 is a plan view for explaining the above-mentioned device, in which 1 is a pedestal, 2 is a drive sprocket, 3 is a guide sprocket, 4 is a drive sprocket 2 and a guide sprocket 3 and move in a direction indicated by an arrow at a constant speed. And a moving chain for transferring the preform 5. 6 and 7 are preform 5 respectively
And the sending section and the sending section. A first infrared preheating device 8a and a second infrared preheating device 8b are provided outside the guide sprocket 3 along the moving chain 4 on the feeding portion 6 side. Further, the third infrared preheating device 8c and the fourth infrared preheating device 8c are provided outside the first infrared preheating device 8a and the second infrared preheating device 8b along the moving chain 4, respectively. 8d is provided. An infrared post-heating device 9 is arranged outside the drive sprocket 2 along the moving chain 4 in the vicinity of the delivery portion 7 side. The cavity resonator set 10 is disposed on the downstream side of and close to the fourth infrared preheating device 8d. The cavity resonator set 10 is connected to the microwave oscillator 14 via the waveguide 12 and the isolator 13.
The isolator 13 protects the oscillator 14 by avoiding the reflected wave in the absorber 11. The absorber 11 is a water load that absorbs the reflected wave from the cavity resonator set 10.
【0008】図2に示すように、移動チエーン4の各リ
ンク・ピン15は上方に鉛直に延びており、その上方部
15aに、玉軸受16を介してスリーブ17が外挿され
ている。スリーブ17にスプロケット18が周設されて
いる。19および20はそれぞれ、移動チエーン4の直
線経路に沿って平行に設けられた内側固定チエーンおよ
び外側固定チエーンであり、スプロケット18に係合し
ており、移動チエーンの移動に伴ってスリーブ17が回
転するようになっている。なお21および22はそれぞ
れ、移動チエーン4の側部案内部材および下部案内部材
であり、23は移動チエーン4の下部に着設されたコロ
である。下部案内部材22は、移動チエーン4の全経路
に沿って配設されており、プリフォーム5が常に同じ高
さで移動することができるように、その上面22aは全
長に亘り定レベルに位置する。As shown in FIG. 2, each link pin 15 of the movable chain 4 extends vertically upward, and a sleeve 17 is externally fitted to an upper portion 15a thereof via a ball bearing 16. A sprocket 18 is provided around the sleeve 17. Reference numerals 19 and 20 respectively denote an inner fixed chain and an outer fixed chain, which are provided in parallel along the straight path of the moving chain 4 and engage with the sprocket 18, and the sleeve 17 rotates as the moving chain moves. It is supposed to do. Reference numerals 21 and 22 are a side guide member and a lower guide member of the movable chain 4, respectively, and 23 is a roller attached to the lower portion of the movable chain 4. The lower guide member 22 is arranged along the entire path of the moving chain 4, and its upper surface 22a is located at a constant level over the entire length so that the preform 5 can always move at the same height. .
【0009】スリーブ17の鍔部17aの上に鉛直方向
に延びる円筒状のプリフォーム保持具24が着設されて
いる。プリフォーム保持具24は金属、例えばアルミニ
ュウムよりなっている。プリフォーム5の底部は受台1
7bとばね17cによって支持され、プリフォーム5の
鍔部5aは、プリフォーム保持具24の上部細径部24
aの端面より2〜3mm上方に浮いている。赤外線前加
熱装置8a、8b、8c、8dおよび赤外線後加熱装置
9には、プリフォーム5の鍔部5aおよびねじ部5bを
含む口頚部5cに対向する位置に、プリフォーム5の移
動方向(長手方向)に延びる断面U字形の赤外線反射鏡
26が設けられている。赤外線反射鏡26の内部には上
下2本のセットよりなる近赤外線ランプ25が、口頚部
5cに集光可能の位置に長手方向に配設されている。2
7は赤外線遮蔽板であり、28はプリフォーム保持具2
4のガイド板である。A cylindrical preform holder 24 extending in the vertical direction is mounted on the collar portion 17a of the sleeve 17. The preform holder 24 is made of metal such as aluminum. The bottom of the preform 5 is the pedestal 1
7b and the spring 17c, the collar portion 5a of the preform 5 has an upper thin portion 24 of the preform holder 24.
It floats 2 to 3 mm above the end face of a. The infrared pre-heating devices 8a, 8b, 8c, 8d and the infrared post-heating device 9 have a moving direction (longitudinal direction) of the preform 5 at a position facing the collar portion 5a of the preform 5 including the collar portion 5a and the screw portion 5b. The infrared reflecting mirror 26 having a U-shaped cross section extending in the (direction) is provided. Inside the infrared reflecting mirror 26, a near-infrared lamp 25 consisting of a set of upper and lower two is arranged in the longitudinal direction at a position where it can be focused on the mouth / neck portion 5c. Two
7 is an infrared shielding plate, 28 is a preform holder 2
4 is a guide plate.
【0010】図3、図4および図5に示すように、空洞
共振器セット10は、2個の空洞共振器10aおよび1
0bが一体になったもので、全体として金属板(好まし
くは電気伝導度が高いアルミニュウムや銅等よりなる)
で包囲された、均一な内面高さHの密閉箱(後記のスロ
ット30a、31aおよびスリット35を除いて密閉さ
れた)よりなっている。空洞共振器10aおよび空洞共
振器10bは、ロッド32を起点とし、端壁33に垂直
に延びる隔壁29によって隔離されており、かつ両者は
同じサイズであり、そのサイズは内部にそれぞれ1個の
高電界域36が形成されるように定められている。2個
の独立した高電界域36の中心Oを、移動するプリフォ
ーム5の軸線の軌跡5x(つまりリンク・ピン15の軸
線の軌跡)が通るように、プリフォーム5の通る経路は
定められる。この場合プリフォームの軸線の軌跡5xと
空洞共振器の端壁33の内面間の距離が(1/4)・λ
(λは空洞共振器内のマイクロ波の波長:図10参照)
になる。空洞共振器の端壁33が短絡板(密閉板)なの
で、端壁33での電界は0になり、高電界域36の中心
Oの端壁33の内面からの距離は、(1/4)・λにな
るからである。隔壁29、空洞共振器10aの入口側壁
部30および空洞共振器10bの出口側壁部31は、プ
リフォーム5の移動方向、すなわち移動チエーン4に垂
直になっており、これら各々にはそれぞれ方形のスロッ
ト29a、30aおよび31aが形成されている。スロ
ット29a、30aおよび31aは、中心線(例えば図
4の31a1)が、移動するプリフォーム5の軸線の軌
跡5xを通るように、同じサイズで形成されている。ス
ロット29a、30aおよび31aは、高さhおよび幅
wがそれぞれ、プリフォーム5の口頚部5cの高さおよ
び最大直径より若干大きく定められている。空洞共振器
10aおよび10bには、発振器14より矢印B方向に
マイクロ波が伝送される。スロット29a、30aおよ
び31aの底部を結んで、空洞共振器セット10の底部
34に矢印B方向に直角にスリット35が形成されい
て、プリフォーム5の口頚部5cが入口側壁部30から
出口側壁部31に向って通り抜けることができるように
なっている。このように空洞共振器10a、10bは、
プリフォーム5の移動経路に対して串形に配列してい
る。すなわち空洞共振器10a、10bに対するマイク
ロ波の伝送方向(矢印B方向)は、上記移動経路に対し
て直角になっている。As shown in FIGS. 3, 4 and 5, the cavity resonator set 10 includes two cavity resonators 10a and 10a.
0b is integrated, and is a metal plate as a whole (preferably made of aluminum or copper having high electric conductivity)
It is composed of a closed box (closed except for the slots 30a and 31a and the slit 35 described later) which has a uniform inner surface height H and is surrounded by. The cavity resonator 10a and the cavity resonator 10b are separated by a partition wall 29 starting from the rod 32 and extending perpendicularly to the end wall 33, and both are of the same size. It is determined that the electric field region 36 is formed. The path of the preform 5 is determined so that the locus 5x of the axis line of the moving preform 5 (that is, the locus of the axis line of the link pin 15) passes through the center O of the two independent high electric field regions 36. In this case, the distance between the trajectory 5x of the axis of the preform and the inner surface of the end wall 33 of the cavity resonator is (1/4) · λ.
(Λ is the wavelength of the microwave in the cavity resonator: see Fig. 10)
become. Since the end wall 33 of the cavity resonator is a short-circuit plate (sealing plate), the electric field at the end wall 33 becomes 0, and the distance of the center O of the high electric field region 36 from the inner surface of the end wall 33 is (1/4).・ Because it becomes λ. The partition wall 29, the inlet side wall portion 30 of the cavity resonator 10a and the outlet side wall portion 31 of the cavity resonator 10b are perpendicular to the moving direction of the preform 5, that is, the moving chain 4, and each of them has a rectangular slot. 29a, 30a and 31a are formed. The slots 29a, 30a and 31a are formed in the same size so that the center line (for example, 31a1 in FIG. 4) passes through the locus 5x of the axis line of the moving preform 5. The heights h and widths w of the slots 29a, 30a and 31a are set to be slightly larger than the height and the maximum diameter of the mouth / neck portion 5c of the preform 5, respectively. Microwaves are transmitted from the oscillator 14 to the cavity resonators 10a and 10b in the direction of arrow B. A slit 35 is formed in the bottom portion 34 of the cavity resonator set 10 by connecting the bottom portions of the slots 29a, 30a, and 31a at right angles to the arrow B direction, and the mouth / neck portion 5c of the preform 5 is changed from the inlet sidewall portion 30 to the outlet sidewall portion. You can pass through to 31. Thus, the cavity resonators 10a and 10b are
The preforms 5 are arranged in a skewed pattern with respect to the moving path. That is, the transmission direction of microwaves (direction of arrow B) to the cavity resonators 10a and 10b is perpendicular to the movement path.
【0011】入口側壁部30は内側斜め方向に延びる傾
斜部38に接続する。入口側壁部31も内側斜め方向に
延びる傾斜部39に接続する。隔壁29の長さ、並びに
傾斜部38の内面および傾斜部39の内面とロッド32
の中心との距離は、空洞共振器10aの端壁33aの側
壁部30内面と隔壁29間の距離s、あるいは空洞共振
器10bの端壁33bの側壁部31内面と隔壁29間の
距離sにほぼ等しい。また入口側壁部30および出口側
壁部31の長さは、距離sとほぼ等しいか、あるいはそ
れより若干大きい。距離sは、λ/2以上で、かつλ以
下の適宜の大きさに定められる。高さHは約s/2であ
るのが好ましい。なおマイクロ波の自由空間における波
長をλ0とすると、λは、λ0を{1−(λ0/s)2x1
/4}の平方根で割った値に等しい。但しs≠λ0/
2。傾斜部38および39は、内面幅が距離sに等しい
基部37に接続する。40は、基部37を導波管12に
接続するためのフランジ部である。41および42は、
空洞共振器10aおよび10bのインピーダンスを調節
するためのスタブチューナである。The inlet side wall portion 30 is connected to a slant portion 38 extending obliquely inward. The inlet side wall portion 31 is also connected to the inclined portion 39 extending obliquely inward. The length of the partition wall 29, the inner surface of the inclined portion 38 and the inner surface of the inclined portion 39, and the rod 32.
The distance from the center of the cavity is the distance s between the inner wall of the side wall 30 of the end wall 33a of the cavity resonator 10a and the partition 29, or the distance s between the inner wall of the side wall 31 of the end wall 33b of the cavity resonator 10b and the partition 29. Almost equal. Further, the lengths of the inlet side wall portion 30 and the outlet side wall portion 31 are substantially equal to or slightly larger than the distance s. The distance s is set to an appropriate size of λ / 2 or more and λ or less. The height H is preferably about s / 2. Assuming that the wavelength of the microwave in the free space is λ0, λ is expressed by {1- (λ0 / s) 2 x1
Equal to the value divided by the square root of / 4}. However, s ≠ λ0 /
2. The ramps 38 and 39 connect to the base 37 whose inner surface width is equal to the distance s. 40 is a flange portion for connecting the base portion 37 to the waveguide 12. 41 and 42 are
It is a stub tuner for adjusting the impedance of the cavity resonators 10a and 10b.
【0012】以上の装置により、プリフォーム5の口頚
部5cの結晶化は次のようにして行なわれる。作業開始
前に、近赤外線ランプ25を点燈し、マイクロ波発振器
14をONにして、空洞共振器10a、10bにマイク
ロ波を矢印B方向に(図1、図3)伝送すると、空洞共
振器10a、10b内にマイクロ波定在波が共振状態で
存在するようになり、かつプリフォーム5が通過するス
リット35に対応する空洞共振器内の部分に高電界域3
6が形成される。駆動スプロケット2を駆動して、移動
チエーン4を矢印方向に移動させる。以上の準備が終わ
った後、送入部6において、挿入装置(図示されない)
より各プリフォーム保持具24に、プリフォーム5を次
々と図2に示すように挿入する。プリフォーム5の口頚
部5cは自転しながら赤外線前加熱装置8a、8b、8
cおよび8dを通過して近赤外線を照射され、赤外線前
加熱装置8dを出る時点で、ポリエチレンテレフタレー
ト系ポリエステルのガラス転移点(Tgとよぶ:75〜
80℃)以上、再結晶化温度(Tcとよぶ:155〜1
60℃)未満の温度に加熱される。好ましくはTgとT
g+50℃の間の温度、より好ましくはTgとTg+3
0℃の間の温度に加熱される。With the above apparatus, the mouth / neck portion 5c of the preform 5 is crystallized as follows. Before starting the work, the near-infrared lamp 25 is turned on, the microwave oscillator 14 is turned on, and the microwave is transmitted to the cavity resonators 10a and 10b in the direction of arrow B (FIGS. 1 and 3). The microwave standing wave is present in the resonators 10a and 10b in a resonance state, and the high electric field region 3 is formed in the cavity resonator corresponding to the slit 35 through which the preform 5 passes.
6 are formed. The drive sprocket 2 is driven to move the moving chain 4 in the arrow direction. After the above preparation is completed, an insertion device (not shown) is provided at the feeding unit 6.
Then, the preforms 5 are inserted into the preform holders 24 one after another as shown in FIG. The mouth / neck portion 5c of the preform 5 rotates while rotating infrared preheating devices 8a, 8b, 8
The glass transition point of the polyethylene terephthalate-based polyester (called Tg: 75-
80 ° C or higher, recrystallization temperature (called Tc: 155-1
It is heated to a temperature below 60 ° C. Preferably Tg and T
temperature between g + 50 ° C., more preferably Tg and Tg + 3
Heated to a temperature between 0 ° C.
【0013】このように口頚部5cを前加熱するのは、
ガラス転移点以上の温度になると樹脂が急速に誘電加熱
されて昇温するためである。その理由は次のように考え
られる。樹脂がガラス転移点以上の温度になると、その
高分子鎖間の結合が弱まって高分子鎖が運動し易くな
る。この状態で樹脂をマイクロ波の電界の中に入れる
と、分極作用による高分子鎖の運動が激しくなり、その
際の高分子鎖間の摩擦力による発熱等によって誘電加熱
が促進される。直ちに口頚部5cは自転しながら空洞共
振器10a、10bを通過する。この際、各空洞共振器
では1つの高電界域36のみを通過してマイクロ波誘電
加熱される。このように1個の高電界域に複数の口頚部
5c(熱可塑性樹脂成形品の被加熱部分)がマイクロ波
の伝送方向(矢印B方向)に直角方向に入った場合、そ
れぞれの口頚部5cにマイクロ波電力が均等に分割され
て吸収される。そのため段落番号0002および000
3で説明したような、1個の被加熱部分のみが満足に加
熱され、他の被加熱部分は満足に加熱されないというよ
うなことは起こらない。空洞共振器10a、10bにお
いてプリフォーム5の口頚部5cを誘電加熱する場合、
口頚部5cの高さ方向の温度分布は、図4の顎部5aの
挿入深さfにより変化し、後述の実施例の場合では、挿
入深さfが4mmの時に良好な結果が得られた。空洞共
振器のスリット35はかなりの高電界になり、プリフォ
ーム保持具24と接触すると放電することがあるので、
スリット35の端面を誘電損失の少ない電気絶縁体で被
覆することが好ましい。The preheating of the mouth / neck portion 5c is as follows.
This is because when the temperature reaches the glass transition point or higher, the resin is rapidly dielectrically heated to raise the temperature. The reason is considered as follows. When the temperature of the resin is equal to or higher than the glass transition point, the bond between the polymer chains is weakened, and the polymer chains easily move. When the resin is placed in an electric field of microwaves in this state, the motion of the polymer chains due to the polarization action becomes vigorous, and the dielectric heating is promoted by heat generation due to the frictional force between the polymer chains at that time. Immediately, the mouth / neck portion 5c passes through the cavity resonators 10a and 10b while rotating on its axis. At this time, in each cavity resonator, microwave induction heating is performed by passing only one high electric field region 36. In this way, when a plurality of mouth / neck portions 5c (heated portions of the thermoplastic resin molded product) enter the high electric field region in a direction perpendicular to the microwave transmission direction (arrow B direction), each mouth / neck portion 5c The microwave power is evenly divided and absorbed. Therefore, paragraph numbers 0002 and 000
It does not occur that only one heated portion is satisfactorily heated and the other heated portions are not satisfactorily heated, as described in 3. When the mouth-neck portion 5c of the preform 5 is dielectrically heated in the cavity resonators 10a and 10b,
The temperature distribution in the height direction of the mouth / neck portion 5c changes depending on the insertion depth f of the jaw portion 5a in FIG. 4, and in the case of the example described later, good results were obtained when the insertion depth f was 4 mm. . Since the slit 35 of the cavity resonator has a considerably high electric field and may be discharged when it comes into contact with the preform holder 24,
It is preferable to cover the end surface of the slit 35 with an electric insulator having a small dielectric loss.
【0014】空洞共振器10bを出た時点で、口頚部5
cはポリエチレンテレフタレート系ポリエステルの再結
晶化温度Tc(155〜160℃)近傍の温度に加熱さ
れている。好ましくはTc−10℃とTc+10℃の間
の温度に加熱される。その後直ちに口頚部5cは、自転
しながら赤外線後加熱装置9を通過して、全体が均一に
再結晶化温度を越えて加熱され、好ましくはTc+5℃
とTc+40℃の間の温度に加熱されて、再結晶化(白
化)が開始する。プリフォーム5は赤外線後加熱装置9
を出ると直ちに送出部7において、送出装置(図示され
ない)によってプリフォーム保持具24から取り出さ
れ、次工程の装置へ送られる。次工程までに口頚部5c
は若干自然放冷されて、再結晶化が熟すると同時に、金
型により口頚部5cの内径と高さを所定の値にするため
の整形が行なわれた後、急冷される。At the time of leaving the cavity resonator 10b, the mouth and neck 5
c is heated to a temperature near the recrystallization temperature Tc (155 to 160 ° C.) of the polyethylene terephthalate polyester. It is preferably heated to a temperature between Tc-10 ° C and Tc + 10 ° C. Immediately after that, the mouth / neck portion 5c passes through the infrared post-heating device 9 while rotating, and the whole is heated uniformly above the recrystallization temperature, preferably Tc + 5 ° C.
And Tc + 40 ° C., the recrystallization (whitening) begins. The preform 5 is an infrared post-heating device 9
Immediately after exiting the sheet, the sheet is taken out from the preform holder 24 by a delivery device (not shown) in the delivery section 7 and sent to the device for the next step. By the next process, mouth and neck 5c
Is allowed to cool slightly, and recrystallization is matured. At the same time, the metal mold is shaped to adjust the inner diameter and height of the mouth / neck portion 5c to predetermined values, and then rapidly cooled.
【0015】近赤外線ランプ(4kw)加熱とマイクロ
波(出力2.7kw)加熱における、プリフォーム口頚
部の初期温度に対する温度上昇速度の関係を図6に示
す。近赤外線ランプ加熱の場合は、初期温度が低い時は
温度上昇速度が高いが(ただし厚み方向の温度差が大き
い)、マイクロ波加熱の場合は初期温度が、ガラス転移
点以上で高くなる程温度上昇速度は高くなる。このよう
に加熱効率を高くするための、近赤外線ランプ出力やマ
イクロ波加熱出力および加熱時間等の設定を図6から行
なうことができる。FIG. 6 shows the relationship between the temperature rising rate and the initial temperature of the neck portion of the preform in the near infrared lamp (4 kw) heating and the microwave (output 2.7 kw) heating. In the case of near-infrared lamp heating, the rate of temperature rise is high when the initial temperature is low (however, the temperature difference in the thickness direction is large), but in the case of microwave heating, the higher the initial temperature above the glass transition point, the higher the temperature. The rate of climb will be higher. In this way, it is possible to set the near infrared lamp output, the microwave heating output, the heating time, and the like from FIG. 6 to increase the heating efficiency.
【0016】[0016]
【実施例】赤外線前加熱装置8a、8b、8c、8dお
よび赤外線後加熱装置9の各々に、1本2kw、長さ3
00mmの近赤外線ランプ25を1セット(2本)配設
した。マイクロ波発振器14として、マイクロ波周波数
が2,450MHz、定格出力5kWのものを使用した
(加熱時の出力は2.7kw)。空洞共振器10a、1
0bは、距離s(図3)が110mm、高さHが55m
m、スロット(31a等の)の高さhが40mm、幅w
が38mmのものを使用した。ポリエチレンテレフタレ
ート系ポリエステルよりなるプリフォーム5の口頚部5
cの高さは23mm、ねじ部5bのねじ山部の直径は2
7mmであった。移動チエーン4のリンク・ピン15の
中心間隔、従ってプリフォーム5間の中心間隔を65m
mにし、移動チエーン4の移動速度を4.1m/分にし
た。この時の加熱速度は約63本/分である。以上の条
件でプリフォームの口頚部5cを加熱した所、赤外線前
加熱時間20秒後に120℃、マイクロ波加熱時間3秒
後に165℃、赤外線後加熱時間5秒後に180℃にな
って、口頚部5cの満足な結晶化が行なわれた。EXAMPLE Each of the infrared pre-heating devices 8a, 8b, 8c, 8d and the infrared post-heating device 9 has a length of 2 kw and a length of 3
One set (two) of near-infrared lamps 25 of 00 mm was arranged. As the microwave oscillator 14, one having a microwave frequency of 2,450 MHz and a rated output of 5 kW was used (the output during heating was 2.7 kW). Cavity resonators 10a, 1
0b has a distance s (FIG. 3) of 110 mm and a height H of 55 m.
m, height h of slot (31a etc.) is 40 mm, width w
Of 38 mm was used. Mouth neck 5 of preform 5 made of polyethylene terephthalate polyester
The height of c is 23 mm, and the diameter of the thread portion of the thread portion 5b is 2
7 mm. The center distance between the link pins 15 of the movable chain 4, and thus the center distance between the preforms 5 is 65 m.
and the moving speed of the moving chain 4 was set to 4.1 m / min. The heating rate at this time is about 63 pieces / minute. When the mouth and neck 5c of the preform was heated under the above conditions, the infrared preheating time was 20 seconds, 120 ° C, the microwave heating time was 3 seconds, 165 ° C, and the infrared postheating time was 5 seconds, 180 ° C. A satisfactory crystallization of 5c has taken place.
【0017】比較のため、空洞共振器10a、10bが
ある位置に、図9に示すタイプの空洞共振器100(長
さrが400mm、幅pが113mm、高さ60mm)
をプリフォーム5の移動方向(矢印A方向)が長さ方向
になるように配設した。アイソレータ13と空洞共振器
100の間に3本のスタブチューナ(インピーダンス整
合器)を入れ、マイクロ波を矢印B方向に伝送した。こ
れ以外は、前記と同様の条件で加熱を行なったが、空洞
共振器100を出た後の口頚部5cの温度は130℃
で、後加熱後も結晶化は行なわれなかった。For comparison, the cavity resonators 100 of the type shown in FIG. 9 (the length r is 400 mm, the width p is 113 mm, and the height 60 mm) are provided at the positions where the cavity resonators 10a and 10b are located.
Was arranged such that the moving direction of the preform 5 (direction of arrow A) was the length direction. Three stub tuners (impedance matching devices) were inserted between the isolator 13 and the cavity resonator 100, and microwaves were transmitted in the arrow B direction. Except for this, heating was performed under the same conditions as above, but the temperature of the mouth / neck 5c after leaving the cavity resonator 100 was 130 ° C.
Therefore, crystallization was not performed even after the post heating.
【0018】本発明は以上の実施例によって制約される
ものでなく、例えば図7に示すようなY字形の空洞共振
器セット50および51を向い合わせて組み立てたもの
の中をプリフォーム5の口頚部5cを通過させてもよ
い。図7において、50a、50bは空洞共振器セット
50の空洞共振器であり、51a、51bは空洞共振器
セット51の空洞共振器であり、何れも図3に示す空洞
共振器10aと同様の構造をしており、同様のスロット
およびスリットを有している。52が口頚部5cが通過
するスリットが形成された部分である。マイクロ波は矢
印B方向に伝送される。また図8に示すようにI字形の
空洞共振器60、61を、熱可塑性樹脂成形品が送られ
る経路に対して串形に近接して配列したものでもよい。
62、63はスリットであり、マイクロ波は矢印B方向
に伝送される。生産速度(毎分当たりの加熱本数)が小
さい場合は、空洞共振器は1個でもよい。この場合は空
洞共振器セット10のロッド32と傾斜部39の基部3
7側端部の間に隔壁53を設け、マイクロ波が空洞共振
器10bに伝送されるのを遮断すればよい。あるいは図
8の空洞共振器60または61の1個のみを用いてもよ
い。誘電加熱の時、熱可塑性樹脂成形品は自転しなくて
もよい。The present invention is not limited to the above-described embodiment. For example, the mouth-neck portion of the preform 5 is assembled in a Y-shaped cavity resonator set 50 and 51 as shown in FIG. 5c may be passed. In FIG. 7, 50a and 50b are cavity resonators of the cavity resonator set 50, 51a and 51b are cavity resonators of the cavity resonator set 51, both of which have the same structure as the cavity resonator 10a shown in FIG. And has similar slots and slits. Reference numeral 52 is a portion formed with a slit through which the mouth / neck portion 5c passes. The microwave is transmitted in the direction of arrow B. Further, as shown in FIG. 8, the I-shaped cavity resonators 60 and 61 may be arranged in a skewer-like arrangement with respect to the path along which the thermoplastic resin molded product is fed.
Reference numerals 62 and 63 are slits, and microwaves are transmitted in the direction of arrow B. If the production rate (the number of heatings per minute) is small, only one cavity resonator may be used. In this case, the rod 32 of the cavity resonator set 10 and the base 3 of the inclined portion 39
A partition wall 53 may be provided between the end portions on the seventh side to block microwaves from being transmitted to the cavity resonator 10b. Alternatively, only one of the cavity resonators 60 or 61 in FIG. 8 may be used. During dielectric heating, the thermoplastic resin molded article does not have to rotate.
【0019】[0019]
【発明の効果】請求項1、請求項2および請求項5に係
る発明は、熱可塑性樹脂成形品を量産的にマイクロ波誘
電加熱できるという効果を奏する。請求項3に係る発明
は、熱可塑性樹脂成形品の被加熱部分を均一に結晶化さ
せることができるという効果を奏する。請求項4に係る
発明は、熱可塑性樹脂成形品の被加熱部分を均一に、か
つ急速に結晶化させることができるという効果を奏す
る。EFFECTS OF THE INVENTION The inventions according to claims 1, 2 and 5 have the effect that the thermoplastic resin molding can be microwave-dielectrically heated in a mass-produced manner. The invention according to claim 3 has an effect that the heated portion of the thermoplastic resin molded article can be uniformly crystallized. The invention according to claim 4 has an effect that the heated portion of the thermoplastic resin molded product can be uniformly and rapidly crystallized.
【図1】本発明の方法を実施するための装置の例の説明
用平面図である。1 is a schematic plan view of an example of an apparatus for carrying out the method of the present invention.
【図2】図1のII−II線に沿う縦断面図である。FIG. 2 is a vertical sectional view taken along the line II-II in FIG.
【図3】図1に示される空洞共振器セットの拡大平面図
である。3 is an enlarged plan view of the cavity resonator set shown in FIG. 1. FIG.
【図4】図3の空洞共振器セットの、IV−IV線から
見た側面図である。FIG. 4 is a side view of the cavity resonator set of FIG. 3, taken along line IV-IV.
【図5】図3の空洞共振器の、V−V線から見た正面図
である。FIG. 5 is a front view of the cavity resonator of FIG. 3 as seen from the line VV.
【図6】近赤外線加熱とマイクロ波加熱における、被加
熱部分の初期温度と温度上昇速度との関係の例を示す線
図である。FIG. 6 is a diagram showing an example of a relationship between an initial temperature of a heated portion and a temperature rising rate in near-infrared heating and microwave heating.
【図7】本発明の実施に用いられる空洞共振器セットの
他の例の平面図である。FIG. 7 is a plan view of another example of the cavity resonator set used for implementing the present invention.
【図8】本発明の実施に用いられる空洞共振器セットの
更に他の例の平面図である。FIG. 8 is a plan view of still another example of the cavity resonator set used for implementing the present invention.
【図9】従来の空洞共振器の説明用平面図である。FIG. 9 is a plan view for explaining a conventional cavity resonator.
【図10】図9の空洞共振器が、マイクロ波入射部を除
いて、実質的に密閉状態にある場合の、定在波を示す線
図である。10 is a diagram showing a standing wave when the cavity resonator of FIG. 9 is in a substantially hermetically sealed state except for a microwave incident part.
【図11】図9の空洞共振器の底部にスリットがある場
合で、被加熱部分(誘電体)が入っていない時の電界強
度分布を示す線図である。FIG. 11 is a diagram showing an electric field strength distribution when the bottom portion of the cavity resonator shown in FIG. 9 has a slit and no heated portion (dielectric body) is included.
【図12】図9の空洞共振器の底部にスリットがある場
合に、被加熱部分(誘電体)が1個入った時の電界強度
分布を示す線図である。FIG. 12 is a diagram showing an electric field intensity distribution when one heated portion (dielectric material) is included in a case where a slit is provided at the bottom of the cavity resonator shown in FIG. 9.
1 移動チエーン(移送する装置) 5 プリフォーム(熱可塑性樹脂成形品) 5c 口頚部(被加熱部分) 5x プリフォームの軸線の軌跡(熱可塑性樹脂成形
品が送られる経路) 8a 赤外線前加熱装置(ガラス転移点以上の温度ま
で加熱する装置) 8b 赤外線前加熱装置(ガラス転移点以上の温度ま
で加熱する装置) 8c 赤外線前加熱装置(ガラス転移点以上の温度ま
で加熱する装置) 8d 赤外線前加熱装置(ガラス転移点以上の温度ま
で加熱する装置) 9 赤外線後加熱装置(再結晶化温度を越えて加熱
する装置) 10a 空洞共振器 10b 空洞共振器 12 導波管(高電界を形成する装置) 14 マイクロ波発振器(マイクロ波電界を発生する
装置) 18 スプロケット(熱可塑性樹脂成形品を自転させ
る装置) 19 内側固定チエーン(熱可塑性樹脂成形品を自転
させる装置) 20 外側固定チエーン(熱可塑性樹脂成形品を自転
させる装置) 25 近赤外線ランプ 35 スリット(熱可塑性樹脂成形品が送られる経
路) 36 高電界域 50a 空洞共振器 50b 空洞共振器 51a 空洞共振器 51b 空洞共振器 52 スリット(熱可塑性樹脂成形品が送られる経
路) 60 空洞共振器 61 空洞共振器 62 スリット(熱可塑性樹脂成形品が送られる経
路) 63 スリット(熱可塑性樹脂成形品が送られる経
路)1 Moving Chain (Transfer Device) 5 Preform (Thermoplastic Resin Molded Product) 5c Mouth and Neck (Head to be Heated) 5x Preform Axis Trajectory (Route to which the Thermoplastic Resin Molded Product Is Sent) 8a Infrared Preheating Device ( 8b Infrared preheating device (device heating to glass transition temperature or higher) 8c Infrared preheating device (device heating to glass transition temperature or higher) 8d Infrared preheating device (Device for heating to a temperature above the glass transition point) 9 Infrared post-heating device (device for heating above recrystallization temperature) 10a Cavity resonator 10b Cavity resonator 12 Waveguide (device for forming high electric field) 14 Microwave oscillator (device for generating microwave electric field) 18 Sprocket (device for rotating thermoplastic resin molded product) 19 Internal fixed chain (Device for rotating thermoplastic resin molded product) 20 Outside fixed chain (Device for rotating thermoplastic resin molded product) 25 Near infrared lamp 35 Slit (Route to which thermoplastic resin molded product is sent) 36 High electric field region 50a Cavity resonance Device 50b Cavity resonator 51a Cavity resonator 51b Cavity resonator 52 Slit (path through which thermoplastic resin molded product is sent) 60 Cavity resonator 61 Cavity resonator 62 Slit (path through which thermoplastic resin molded product is sent) 63 Slit ( (Route through which the thermoplastic resin molded product is sent)
Claims (5)
により連続的に誘電加熱する方法において、熱可塑性樹
脂成形品の送られる経路に対して串形に配列された、1
個もしくは複数の空洞共振器内にマイクロ波を伝送し、
熱可塑性樹脂成形品の被加熱部分を、各空洞共振器につ
き1つの高電界域のみを通過させることを特徴とする熱
可塑性樹脂成形品の加熱方法。1. A method for continuously dielectrically heating a large number of thermoplastic resin molded articles by microwaves, wherein the thermoplastic resin molded articles are arranged in a skewed pattern with respect to a route to which the thermoplastic resin molded articles are fed.
Transmitting microwaves in one or more cavity resonators,
A method for heating a thermoplastic resin molded article, which comprises allowing a heated portion of the thermoplastic resin molded article to pass through only one high electric field region for each cavity.
その被加熱部分に側方より近赤外線を照射して、被加熱
部分を当該熱可塑性樹脂のガラス転移点以上、再結晶化
温度未満の温度に加熱した後に、請求項1記載の誘電加
熱を行なう熱可塑性樹脂成形品の加熱方法。2. While rotating the thermoplastic resin molded article,
2. Near-infrared rays are radiated from the side to the heated portion to heat the heated portion to a temperature not lower than the glass transition point of the thermoplastic resin and lower than the recrystallization temperature, and then the dielectric heating according to claim 1. Method for heating thermoplastic resin molded product.
に、熱可塑性樹脂成形品を自転させながら、その被加熱
部分に側方より近赤外線を照射して、被加熱部分を熱可
塑性樹脂の再結晶化温度を越える温度に加熱する熱可塑
性樹脂成形品の加熱方法。3. After performing the dielectric heating according to claim 1, while rotating the thermoplastic resin molded article, the portion to be heated is irradiated with near infrared rays from the side, and the portion to be heated is made of the thermoplastic resin. A method for heating a thermoplastic resin molded article, which comprises heating to a temperature exceeding the recrystallization temperature.
その被加熱部分に側方より近赤外線を照射して、被加熱
部分を当該熱可塑性樹脂のガラス転移点以上、再結晶化
温度未満の温度に加熱し、次に請求項1記載の誘電加熱
により再結晶化温度近傍の温度に加熱し、次いで熱可塑
性樹脂成形品を自転させながら、その被加熱部分に側方
より近赤外線を照射して、被加熱部分を当該熱可塑性樹
脂の再結晶化温度を越える温度に加熱する熱可塑性樹脂
成形品の加熱方法。4. While rotating the thermoplastic resin molded article,
The portion to be heated is irradiated with near infrared rays from the side to heat the portion to be heated to a temperature not lower than the glass transition point of the thermoplastic resin and lower than the recrystallization temperature, and then by dielectric heating according to claim 1. While heating the thermoplastic resin molded article to a temperature near the recrystallization temperature, while irradiating the thermoplastic resin molded article, the heated portion is irradiated with near infrared rays from the side, and the heated portion is recrystallized at the thermoplastic resin temperature. A method for heating a thermoplastic resin molded article, which comprises heating to a temperature exceeding 100 ° C.
により連続的に誘電加熱する装置において、該装置は、
熱可塑性樹脂成形品の送られる経路に対して串形に配列
された、1個もしくは複数のマイクロ波空洞共振器;空
洞共振器の該経路に沿う部分に1つの高電界域のみを形
成する装置、および熱可塑性樹脂成形品を該経路に沿っ
て移送する装置を備えることを特徴とする熱可塑性樹脂
成形品の加熱装置。5. An apparatus for continuously dielectrically heating a large number of thermoplastic resin molded articles by microwaves, said apparatus comprising:
One or a plurality of microwave cavity resonators arranged in a skewed pattern with respect to a path through which the thermoplastic resin molded article is sent; a device for forming only one high electric field region in a portion of the cavity resonator along the path. And a device for transferring the thermoplastic resin molded product along the path, a heating device for the thermoplastic resin molded product.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13572596A JP3758233B2 (en) | 1996-05-07 | 1996-05-07 | Heating method and apparatus for thermoplastic resin molded article |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13572596A JP3758233B2 (en) | 1996-05-07 | 1996-05-07 | Heating method and apparatus for thermoplastic resin molded article |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH09295342A true JPH09295342A (en) | 1997-11-18 |
| JP3758233B2 JP3758233B2 (en) | 2006-03-22 |
Family
ID=15158431
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13572596A Expired - Fee Related JP3758233B2 (en) | 1996-05-07 | 1996-05-07 | Heating method and apparatus for thermoplastic resin molded article |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3758233B2 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11235751A (en) * | 1998-02-20 | 1999-08-31 | Ueno Hiroshi | Method for crystallizing plastic molded body |
| EP2100712A3 (en) * | 2008-03-13 | 2009-10-28 | Krones AG | Device for heating containers |
| WO2010063686A3 (en) * | 2008-12-04 | 2010-08-12 | Krones Ag | Device for heating plastic containers |
| EP2210728A3 (en) * | 2006-05-11 | 2012-08-22 | Krones AG | Heating device for plastic blanks |
| CN107791419A (en) * | 2017-11-24 | 2018-03-13 | 江苏爱德福乳胶制品有限公司 | A kind of equipment and production technology that latex bed mattress is produced using high-frequency vulcanization |
| JP2018538171A (en) * | 2015-12-22 | 2018-12-27 | エムケイエス インストゥルメンツ, インコーポレイテッド | Method and apparatus for processing dielectric materials using microwave energy |
-
1996
- 1996-05-07 JP JP13572596A patent/JP3758233B2/en not_active Expired - Fee Related
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11235751A (en) * | 1998-02-20 | 1999-08-31 | Ueno Hiroshi | Method for crystallizing plastic molded body |
| EP2210728A3 (en) * | 2006-05-11 | 2012-08-22 | Krones AG | Heating device for plastic blanks |
| EP2258535A3 (en) * | 2006-05-11 | 2012-08-22 | Krones AG | Heating device for plastic blanks |
| EP2100712A3 (en) * | 2008-03-13 | 2009-10-28 | Krones AG | Device for heating containers |
| US9073253B2 (en) | 2008-03-13 | 2015-07-07 | Krones, Ag | Apparatus and method for heating containers |
| WO2010063686A3 (en) * | 2008-12-04 | 2010-08-12 | Krones Ag | Device for heating plastic containers |
| CN102239041A (en) * | 2008-12-04 | 2011-11-09 | 克朗斯股份公司 | Device for heating plastic containers and resonator therefor |
| JP2018538171A (en) * | 2015-12-22 | 2018-12-27 | エムケイエス インストゥルメンツ, インコーポレイテッド | Method and apparatus for processing dielectric materials using microwave energy |
| US10940635B2 (en) | 2015-12-22 | 2021-03-09 | Mks Instruments, Inc. | Method and apparatus for processing dielectric materials using microwave energy |
| CN107791419A (en) * | 2017-11-24 | 2018-03-13 | 江苏爱德福乳胶制品有限公司 | A kind of equipment and production technology that latex bed mattress is produced using high-frequency vulcanization |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3758233B2 (en) | 2006-03-22 |
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