JPH09300221A - Manufacture of resinoid grinding wheel - Google Patents
Manufacture of resinoid grinding wheelInfo
- Publication number
- JPH09300221A JPH09300221A JP8125244A JP12524496A JPH09300221A JP H09300221 A JPH09300221 A JP H09300221A JP 8125244 A JP8125244 A JP 8125244A JP 12524496 A JP12524496 A JP 12524496A JP H09300221 A JPH09300221 A JP H09300221A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- abrasive grains
- epoxy resin
- thermosetting
- pressure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 229920005989 resin Polymers 0.000 claims abstract description 42
- 239000011347 resin Substances 0.000 claims abstract description 42
- 239000006061 abrasive grain Substances 0.000 claims abstract description 17
- -1 benzoxazine compound Chemical class 0.000 claims abstract description 15
- 239000000203 mixture Substances 0.000 claims abstract description 15
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 15
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 claims abstract description 12
- 238000000465 moulding Methods 0.000 claims abstract description 8
- 238000013007 heat curing Methods 0.000 claims description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 3
- 229910003460 diamond Inorganic materials 0.000 claims description 2
- 239000010432 diamond Substances 0.000 claims description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims 1
- 229910010271 silicon carbide Inorganic materials 0.000 claims 1
- 239000006227 byproduct Substances 0.000 abstract description 5
- 230000008961 swelling Effects 0.000 abstract description 4
- 239000003822 epoxy resin Substances 0.000 description 13
- 229920000647 polyepoxide Polymers 0.000 description 13
- 238000001723 curing Methods 0.000 description 11
- 150000001875 compounds Chemical class 0.000 description 8
- 239000005011 phenolic resin Substances 0.000 description 8
- 239000000047 product Substances 0.000 description 7
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 6
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 6
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 5
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 5
- BGDOLELXXPTPFX-UHFFFAOYSA-N 3,4-dihydro-2h-1,2-benzoxazine Chemical group C1=CC=C2ONCCC2=C1 BGDOLELXXPTPFX-UHFFFAOYSA-N 0.000 description 4
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 4
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 4
- 239000007822 coupling agent Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 125000002947 alkylene group Chemical group 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 3
- 238000009833 condensation Methods 0.000 description 3
- 230000005494 condensation Effects 0.000 description 3
- 238000009472 formulation Methods 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 125000000962 organic group Chemical group 0.000 description 3
- 150000003141 primary amines Chemical class 0.000 description 3
- 238000007142 ring opening reaction Methods 0.000 description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 2
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 2
- BAVYZALUXZFZLV-UHFFFAOYSA-N Methylamine Chemical compound NC BAVYZALUXZFZLV-UHFFFAOYSA-N 0.000 description 2
- 229910021529 ammonia Inorganic materials 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- PAFZNILMFXTMIY-UHFFFAOYSA-N cyclohexylamine Chemical compound NC1CCCCC1 PAFZNILMFXTMIY-UHFFFAOYSA-N 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000006260 foam Substances 0.000 description 2
- 125000002485 formyl group Chemical class [H]C(*)=O 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- 229920006337 unsaturated polyester resin Polymers 0.000 description 2
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical group CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 239000003082 abrasive agent Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 150000001448 anilines Chemical class 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- JYIZNFVTKLARKT-UHFFFAOYSA-N phenol;1,3,5-triazine-2,4,6-triamine Chemical compound OC1=CC=CC=C1.NC1=NC(N)=NC(N)=N1 JYIZNFVTKLARKT-UHFFFAOYSA-N 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 239000010695 polyglycol Substances 0.000 description 1
- 229920000151 polyglycol Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229920003987 resole Polymers 0.000 description 1
- 238000007151 ring opening polymerisation reaction Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 125000006839 xylylene group Chemical group 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、ベンゾオキサジン
化合物を含むレジノイド砥石の製造方法に関する。TECHNICAL FIELD The present invention relates to a method for producing a resinoid grindstone containing a benzoxazine compound.
【０００２】[0002]
【従来の技術】従来、例えばフェノール樹脂のような熱
硬化性樹脂を結合材とするレジノイド砥石は、砥粒と結
合材の混合物を所定の型に装填し圧縮成形したものを加
熱硬化させて製造される。フェノール樹脂は硬化時に縮
合水、アンモニア等の副生成物の発生があるため、樹脂
含有率の高い砥石を無圧状態で加熱硬化させた場合に
は、フェノール樹脂の硬化時に発生する縮合水、あるい
はアンモニア等の副生成物が砥石内に内在し、発泡して
しまうため、無圧状態で加熱硬化する製法を採用するこ
とができなかった。エポキシ樹脂、不飽和ポリエステル
樹脂やビスマレイミド樹脂を結合材とした砥石は、無圧
状態での製造は可能であるが、エポキシ樹脂、不飽和ポ
リエステル樹脂では樹脂硬化物の耐熱性が十分でなく、
ポリイミド樹脂は高価であるという問題点がある。2. Description of the Related Art Conventionally, a resinoid grindstone having a thermosetting resin such as a phenol resin as a binder is manufactured by loading a mixture of abrasive grains and a binder into a predetermined mold and compression-molding the mixture to heat-harden it. To be done. Phenolic resin generates condensation water, by-products such as ammonia during curing, so when a grindstone with a high resin content is heated and cured without pressure, condensation water generated during curing of the phenol resin, or Since a by-product such as ammonia is present inside the grindstone and foams, it is not possible to adopt a manufacturing method in which the product is heated and cured in a pressureless state. Epoxy resin, grindstone with unsaturated polyester resin or bismaleimide resin as a binder, can be manufactured in a pressureless state, but epoxy resin, unsaturated polyester resin is not sufficient heat resistance of the cured resin,
There is a problem that the polyimide resin is expensive.
【０００３】[0003]
【発明が解決しようとする課題】本発明は、かかる状況
に鑑みなされたものであって、樹脂含有率の高い砥石で
も常温あるいは比較的低い温度での短時間プレスにより
加圧成形後、硬化を無加圧状態で多数個同時に行うこと
ができるレジノイド砥石の製造方法を提供することを目
的とする。SUMMARY OF THE INVENTION The present invention has been made in view of such circumstances, and even a grindstone having a high resin content is cured by pressure molding at room temperature or at a relatively low temperature for a short time and then cured. It is an object of the present invention to provide a method for producing a resinoid grindstone that can be simultaneously performed in large numbers under no pressure.
【０００４】[0004]
【課題を解決するための手段】かかる目的は、本発明に
よれば、ベンゾオキサジン化合物を含む熱硬化性樹脂と
液状エポキシ樹脂と砥粒の混合物を所定の形状に成形
し、その後無加圧下で加熱硬化することにより達成され
る。According to the present invention, such a purpose is to form a mixture of a thermosetting resin containing a benzoxazine compound, a liquid epoxy resin and abrasive grains into a predetermined shape, and then, under no pressure. It is achieved by heat curing.
【０００５】[0005]
【発明の実施の形態】本発明で使用するベンゾオキサジ
ン化合物を含む熱硬化性樹脂は、フェノール性水酸基を
有する化合物、ホルマリン、１級アミンから下記の化学
式に従って合成することができる。この樹脂は、米国特
許５１５２９３９号に示されるように加熱により開環重
合反応を起こし、揮発分を発生させることなく優れた特
性を持つ架橋構造を形成する。BEST MODE FOR CARRYING OUT THE INVENTION The thermosetting resin containing a benzoxazine compound used in the present invention can be synthesized from a compound having a phenolic hydroxyl group, formalin and a primary amine according to the following chemical formula. As shown in U.S. Pat. No. 5,152,939, this resin undergoes a ring-opening polymerization reaction by heating to form a crosslinked structure having excellent properties without generating volatile components.
【０００６】[0006]
【化１】 フェノール性水酸基を有する化合物としては、ビスフェ
ノール化合物、ビフェノール化合物、トリスフェノール
化合物、テトラフェノール化合物、フェノールノボラッ
ク樹脂、レゾール樹脂、フェノール変性キシレン樹脂、
アルキルフェノール樹脂、メラミンフェノール樹脂、ポ
リブタジエン変性フェノール樹脂等のフェノール樹脂を
挙げることができる。ビスフェノール化合物としては、
ビスフェノールＡ、テトラフルオロビスフェノールＡ、
ビスフェノールＦ並びにそれらの位置異性体、ビスフェ
ノールＳ等を用いることができる。また、フェノール樹
脂を用いる場合、ヒドロベンゾオキサジン環を含む耐熱
性樹脂が、化２の式Ａで表される構造単位及び式Ｂで表
される構造単位を含み、Ａ／Ｂがモル比で１／０．２５
〜９であり、各構造単位は、直接にまたは有機の基を会
している場合、強度、耐熱性の点で優れた硬化物を得る
ことができる。Embedded image As the compound having a phenolic hydroxyl group, bisphenol compound, biphenol compound, trisphenol compound, tetraphenol compound, phenol novolac resin, resole resin, phenol-modified xylene resin,
Examples thereof include phenol resins such as alkylphenol resins, melamine phenol resins and polybutadiene modified phenol resins. As a bisphenol compound,
Bisphenol A, tetrafluorobisphenol A,
Bisphenol F and positional isomers thereof, bisphenol S and the like can be used. When a phenol resin is used, the heat-resistant resin containing a hydrobenzoxazine ring contains a structural unit represented by the formula A and a structural unit represented by the formula B, and A / B is 1 in a molar ratio. /0.25
And each structural unit directly or in the case of meeting an organic group, a cured product excellent in strength and heat resistance can be obtained.
【０００７】[0007]
【化２】 但し、Ｒは、メチル基、シクロヘキシル基、フェニル基
又は置換フェニル基であり、Ａ、Ｂの芳香族の水素は、
Ａのヒドロキシル基のオルト位の一つを除き、任意の置
換基で置換されてもよい。Embedded image However, R is a methyl group, a cyclohexyl group, a phenyl group or a substituted phenyl group, and the aromatic hydrogens of A and B are
It may be substituted with any substituent except one of the ortho positions of the hydroxyl group of A.
【０００８】各構造単位の数は、特に制限はないが、１
分子中に含まれる構造単位（Ａ）の数をｍ、構造単位
（Ｂ）の数をｎとするとき、ｍ≧１、ｎ≧１且つｍ＋ｎ
≧２であればよく、１０≧ｍ＋ｎ≧３であることが望ま
しい。各構造単位は、直接結合していてもよく、有機の
基を介して結合していてもよい。有機の基としては、ア
ルキレン基、キシリレン基等が挙げられ、アルキレン基
としては、例えば、炭素数５以上の直鎖アルキレン基板
等が挙げられる。１級アミンとしては、具体的にメチル
アミン、シクロヘキシルアミン、アニリン、置換アニリ
ンが挙げられる。脂肪族アミンを用いると、得られた熱
硬化性樹脂の硬化が速いが硬化物の耐熱性がやや劣り、
アニリンの様な芳香族アミンを用いると、得られた硬化
物の耐熱性はよいが硬化性は遅くなる。The number of each structural unit is not particularly limited, but 1
When the number of structural units (A) contained in the molecule is m and the number of structural units (B) is n, m ≧ 1, n ≧ 1 and m + n
It suffices that ≧ 2, and it is desirable that 10 ≧ m + n ≧ 3. Each structural unit may be directly bonded, or may be bonded via an organic group. Examples of the organic group include an alkylene group and a xylylene group, and examples of the alkylene group include a linear alkylene substrate having 5 or more carbon atoms. Specific examples of the primary amine include methylamine, cyclohexylamine, aniline, and substituted aniline. When an aliphatic amine is used, the resulting thermosetting resin cures quickly, but the heat resistance of the cured product is somewhat inferior,
When an aromatic amine such as aniline is used, the obtained cured product has good heat resistance but slows the curability.
【０００９】砥粒を表面コートする液状エポキシ樹脂と
しては、ビスフェノールＡ型エポキシ樹脂、ビスフェノ
ールＦ型エポキシ樹脂、フェノールノボラック型エポキ
シ樹脂、ポリグリコール型エポキシ樹脂、水添ビスフェ
ノールＡ型エポキシ樹脂等を用いることができる。これ
らエポキシ樹脂は、各液状エポキシ樹脂を任意の割合で
混合あるいは固形のエポキシ樹脂と混合溶解して用いる
こともできる。また、これら液状エポキシ樹脂には、必
要に応じてカップリング剤を適宜混合し使用することが
できる。カップリング剤としては、シラン系、チタネー
ト系、ジルコニウム系のものを添加して用いることがで
きる。カップリング剤は、エポキシ樹脂に対し、０．１
〜１０％の範囲で使用することが望ましい。０．１％以
下では、砥粒と樹脂との密着性向上に効果がなく、１０
％以上では硬化時に揮発源となるため問題がある。As the liquid epoxy resin for coating the surface of the abrasive grains, bisphenol A type epoxy resin, bisphenol F type epoxy resin, phenol novolac type epoxy resin, polyglycol type epoxy resin, hydrogenated bisphenol A type epoxy resin, etc. may be used. You can These epoxy resins may be used by mixing each liquid epoxy resin at an arbitrary ratio or by mixing and dissolving with a solid epoxy resin. In addition, a coupling agent can be appropriately mixed and used in these liquid epoxy resins, if necessary. A silane-based, titanate-based, or zirconium-based coupling agent can be added and used as the coupling agent. Coupling agent is 0.1 to epoxy resin.
It is desirable to use in the range of 10%. If it is less than 0.1%, it is not effective in improving the adhesion between the abrasive grains and the resin.
If it is more than%, there is a problem because it becomes a volatile source during curing.
【００１０】本発明における樹脂は、水酸基を有する化
合物と１級アミンとの混合物を７０℃以上に加熱したア
ルデヒド中に添加して、７０℃以上に加熱したアルデヒ
ド中に添加して、７０〜１１０℃、好ましくは、９０〜
１００℃で２０〜１２０分反応させ、その後１２０℃以
下の温度で減圧することにより合成することができる。
この際、ジヒドロベンゾオキサジン環並びにジヒドロベ
ンゾオキサジン環が、開環反応した後に生成するフェノ
ール性水酸基と反応性がある官能基を有する化合物、ジ
ヒドロベンゾオキサジン環の開環反応を促進及びジヒド
ロベンゾオキサジン環を有する化合物が開環反応した後
に生成するフェノール性水酸基と反応性がある官能基を
有する化合物との反応促進を促す触媒を併用することも
できる。ジヒドロベンゾオキサジン化合物を含む熱硬化
性樹脂は、本プロセスの特徴上、硬化時に揮発成分の発
生が無いことが求められる。本樹脂系では、理論上揮発
成分の発生はないが、合成時に発生する縮合水、使用す
る原料、溶剤等が残留するとこれが砥石硬化時にふくれ
の原因となるため、これらを出来る限り低減する必要が
ある。In the resin of the present invention, a mixture of a compound having a hydroxyl group and a primary amine is added to an aldehyde heated to 70 ° C. or higher, and then added to an aldehyde heated to 70 ° C. or higher to give 70 to 110. ℃, preferably 90 ~
It can be synthesized by reacting at 100 ° C. for 20 to 120 minutes and then reducing the pressure at a temperature of 120 ° C. or less.
At this time, the dihydrobenzoxazine ring and the dihydrobenzoxazine ring have a functional group reactive with the phenolic hydroxyl group formed after the ring-opening reaction, and promote the ring-opening reaction of the dihydrobenzoxazine ring and the dihydrobenzoxazine ring. It is also possible to use in combination a catalyst that promotes the reaction with the compound having a functional group reactive with the phenolic hydroxyl group formed after the ring-opening reaction of the compound having a. The thermosetting resin containing a dihydrobenzoxazine compound is required to be free from the generation of volatile components during curing because of the characteristics of this process. In this resin system, theoretically no volatile component is generated, but if condensation water generated during synthesis, raw materials used, solvent, etc. remain, this causes blistering during wheel hardening, so it is necessary to reduce these as much as possible. is there.
【００１１】本発明に用いる砥粒としては、Ａｌ2 Ｏ3
系、ＳｉＣ系、ＺｒＯ2 −Ａｌ2 Ｏ3 系等の一般砥粒の
他に、Ｃ−ＢＮ、ダイヤモンド等の超砥粒がある。ま
た、砥粒は、予め液状エポキシ樹脂と混練することによ
り、ベンゾオキサジン化合物を含む熱硬化性樹脂との密
着性を向上すると同時に成形体強度の保持に効果が現れ
る。また、砥粒は単独又は２種類以上を任意の割合で用
いることができる。また、ジヒドロベンゾオキサジン化
合物を含む熱硬化性樹脂の含有量については、１０〜６
０ｖｏｌ％用いることができるが、本効果が顕著に現れ
るのは、２０ｖｏｌ％以上の樹脂比率の高い領域であ
る。これら砥粒と樹脂組成物の混合物は、型くずれがし
ない程度に常温下加圧成形する。この後、１６０〜２５
０℃、好ましくは１８０〜２００℃の温度で硬化すこと
により、砥石を製造することができる。The abrasive grains used in the present invention include Al 2 O 3
In addition to general abrasives such as those of the system, SiC, ZrO 2 —Al 2 O 3 , etc., there are superabrasives such as C—BN and diamond. Further, the abrasive grains are kneaded with the liquid epoxy resin in advance to improve the adhesiveness with the thermosetting resin containing the benzoxazine compound, and at the same time, the effect of maintaining the strength of the molded body appears. The abrasive grains may be used alone or in any combination of two or more kinds. The content of the thermosetting resin containing the dihydrobenzoxazine compound is 10 to 6
Although it can be used in an amount of 0 vol%, the present effect is remarkably exhibited in a region having a high resin ratio of 20 vol% or more. The mixture of the abrasive grains and the resin composition is pressure-molded at room temperature so as not to lose its shape. After this, 160-25
A whetstone can be manufactured by hardening at a temperature of 0 ° C, preferably 180 to 200 ° C.
【００１２】本樹脂系は、硬化時に揮発性副生成分が発
生しないため、無圧状態の加熱硬化においてもふくれ等
の外観不良なく、成形前後で形状変化の少なく、均一で
緻密な成形品を製造することができる。また、樹脂硬化
物も同様に硬化時に揮発性副生成分が発生しないエポキ
シ樹脂に比べ優れた耐熱性を有している。本発明による
と、従来の熱硬化性樹脂、すなわちフェノール樹脂、エ
ポキシ樹脂では各々、縮合水等の発生により無加圧下で
の加熱硬化時に発泡すること、樹脂硬化物の耐熱性が十
分でないことから不可能であった、常温下で樹脂組成物
と砥粒とを加圧成形後、無圧下で加熱硬化する方法を製
造工程に採用することができる。砥石の硬化時間は数時
間に及ぶため、本方法を採用することにより、プレス１
台当たりの生産効率を大幅に向上することができる。Since this resin system does not generate volatile by-products during curing, even if it is heat-cured in a non-pressurized state, there is no appearance defect such as swelling, there is little change in shape before and after molding, and a uniform and dense molded product is obtained. It can be manufactured. Further, the cured resin also has excellent heat resistance as compared with the epoxy resin which does not generate a volatile by-product during curing. According to the present invention, the conventional thermosetting resin, that is, the phenol resin and the epoxy resin, respectively, foams at the time of heat curing under no pressure due to the generation of condensed water, and the heat resistance of the resin cured product is not sufficient. A method in which the resin composition and the abrasive grains are pressure-molded at room temperature and then heat-cured under no pressure, which has been impossible, can be adopted in the manufacturing process. Since the hardening time of the grindstone reaches several hours, the press 1
The production efficiency per unit can be greatly improved.
【００１３】[0013]
【実施例】以下に本発明の具体例を示すが、本発明はこ
れらに限定されるものではない。ジヒドロベンゾオキサ
ジン化合物を含む樹脂は、日立化成工業株式会社製ＨＲ
−１００１−１０、１００１−１５（試作品番）を使用
した。また、本樹脂の揮発分を変化させたサンプルも合
成しテストを行った。液状エポキシ樹脂は、芳香族系エ
ポキシ樹脂（エポキシ当量２００）を用いた。樹脂硬化
時の揮発分は、樹脂１０．０ｇをアルミカップに取り１
８０℃、１時間硬化後、硬化前後の重量差により算出し
た。砥石の配合については、以下の調合を用いた。 砥粒（溶融アルミナ質＃１２０） ７６重量部 液状エポキシ樹脂 ３重量部 樹脂（粉末状樹脂） ２１重量部 上記配合にて混合したものを金型内に装填し、所定の厚
みになるまでプレス成形した。成形後の組成（容積率）
については、下記の通りである。 砥粒（溶融アルミナ質＃１２０） ４５容積部 液状エポキシ樹脂 ４容積部 樹脂（粉末状樹脂） ３６容積部 その後、金型から脱型し、無圧状態で１８０℃、２時間
で加熱硬化した。砥石の外観観察を行うと共に、曲げ強
度の測定を行った。EXAMPLES Specific examples of the present invention are shown below, but the present invention is not limited thereto. Resin containing dihydrobenzoxazine compound is HR manufactured by Hitachi Chemical Co., Ltd.
-1001-10 and 1001-15 (prototype numbers) were used. In addition, a sample in which the volatile content of the resin was changed was also synthesized and tested. An aromatic epoxy resin (epoxy equivalent 200) was used as the liquid epoxy resin. Volatile components at the time of resin curing take 10.0 g of resin in an aluminum cup.
After curing at 80 ° C. for 1 hour, the weight difference before and after curing was calculated. The following formulations were used for the formulation of the grindstone. Abrasive grains (molten alumina material # 120) 76 parts by weight Liquid epoxy resin 3 parts by weight Resin (powdered resin) 21 parts by weight The mixture mixed in the above formulation is loaded into a mold and press-molded to a predetermined thickness. did. Composition after molding (volume ratio)
Is as follows. Abrasive grains (molten alumina material # 120) 45 parts by volume Liquid epoxy resin 4 parts by volume Resin (powdered resin) 36 parts by volume After that, the mold was released from the mold and heat-cured at 180 ° C. for 2 hours in a pressureless state. The appearance of the grindstone was observed and the bending strength was measured.
【００１４】[0014]
【表１】 [Table 1]
【００１５】[0015]
【発明の効果】以上説明したことから明らかな様に、本
樹脂で用いる樹脂系は硬化時に揮発する成分がないた
め、樹脂と砥粒を混合した後、室温におけるプレスで形
状を整えた後、圧力をかけないで加熱により硬化させた
場合、ふくれ等の外観不良の発生がなく、硬化前後の形
状変化がない成形品を得ることができる。As is clear from the above description, since the resin system used in the present resin has no components that volatilize during curing, after mixing the resin and the abrasive grains, after shaping the shape by pressing at room temperature, When cured by heating without applying pressure, a molded product can be obtained in which appearance defects such as swelling do not occur and the shape does not change before and after curing.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 長瀬 英雄 茨城県結城市大字鹿窪1772−１ 日立化成 工業株式会社下館工場内 (72)発明者 佐藤 愛彦 茨城県結城市大字鹿窪1772−１ 日立化成 工業株式会社下館工場内 (72)発明者 平井 康之 茨城県結城市大字鹿窪1772−１ 日立化成 工業株式会社下館工場内 (72)発明者 永田 晃 名古屋市西区則武新町三丁目１番36号 株 式会社ノリタケカンパニーリミテド内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Hideo Nagase 172-1 Kagoku, Yuki City, Ibaraki Prefecture Shimodate Factory, Hitachi Chemical Co., Ltd. Shimodate Factory Co., Ltd. (72) Inventor Yasuyuki Hirai 172-1 Kagoku, Yuki City, Ibaraki Hitachi Chemical Co., Ltd. Shimodate Factory (72) Inventor Akira Nagata 3-1, 36 Noritake Shinmachi, Nishi-ku, Nagoya Noritake Company Limited
Claims (4)
脂と液状エポキシ樹脂と砥粒の混合物を所定の形状に成
形し、その後無加圧下で加熱硬化することを特徴とする
レジノイド砥石の製造方法。1. A method for producing a resinoid grindstone, which comprises molding a mixture of a thermosetting resin containing a benzoxazine compound, a liquid epoxy resin and abrasive grains into a predetermined shape, and then heat-curing the mixture without pressure.
脂と予め液状エポキシ樹脂を表面にコートした砥粒を含
有する混合物を成形し、その後無加圧下で加熱硬化する
ことを特徴とするレジノイド砥石の製造方法。2. A resinoid grindstone characterized by comprising molding a mixture containing a thermosetting resin containing a benzoxazine compound and abrasive grains having a surface coated with a liquid epoxy resin in advance, and thereafter heat-curing it without applying pressure. Production method.
％以上であることを特徴とする請求項１又は２に記載の
レジノイド砥石の製造方法。3. A resinoid grindstone having a resin content of 10 vol.
% Or more, The method for producing a resinoid grindstone according to claim 1 or 2, wherein
Ｎ、又はダイヤモンドの群の中から選ばれたものである
ことを特徴とする請求項１乃至３のいずれかに記載のレ
ジノイド砥石の製造方法。4. The abrasive grains are alumina-based, silicon carbide, CB
The resinoid grindstone manufacturing method according to claim 1, wherein the resinoid grindstone is selected from the group consisting of N and diamond.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8125244A JPH09300221A (en) | 1996-05-21 | 1996-05-21 | Manufacture of resinoid grinding wheel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8125244A JPH09300221A (en) | 1996-05-21 | 1996-05-21 | Manufacture of resinoid grinding wheel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH09300221A true JPH09300221A (en) | 1997-11-25 |
Family
ID=14905351
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8125244A Pending JPH09300221A (en) | 1996-05-21 | 1996-05-21 | Manufacture of resinoid grinding wheel |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH09300221A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104526576A (en) * | 2014-12-04 | 2015-04-22 | 中国铁道科学研究院 | Composition used for manufacturing main track steel rail grinding wheel and preparation method and application thereof |
| JP2016074871A (en) * | 2014-03-04 | 2016-05-12 | 四国化成工業株式会社 | Bismaleimide resin composition and use of the same |
| CN113736132A (en) * | 2021-10-21 | 2021-12-03 | 东莞市鼎泰鑫电子有限公司 | Low-density epoxy foaming type grinding wheel and preparation method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5330095A (en) * | 1976-09-01 | 1978-03-20 | Toyoda Mach Works Ltd | Method of producing resinoid grinding wheel |
| JPH07188364A (en) * | 1993-12-27 | 1995-07-25 | Hitachi Chem Co Ltd | Thermosetting compound, its cured material and production of theremosetting compound |
-
1996
- 1996-05-21 JP JP8125244A patent/JPH09300221A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5330095A (en) * | 1976-09-01 | 1978-03-20 | Toyoda Mach Works Ltd | Method of producing resinoid grinding wheel |
| JPH07188364A (en) * | 1993-12-27 | 1995-07-25 | Hitachi Chem Co Ltd | Thermosetting compound, its cured material and production of theremosetting compound |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016074871A (en) * | 2014-03-04 | 2016-05-12 | 四国化成工業株式会社 | Bismaleimide resin composition and use of the same |
| CN104526576A (en) * | 2014-12-04 | 2015-04-22 | 中国铁道科学研究院 | Composition used for manufacturing main track steel rail grinding wheel and preparation method and application thereof |
| CN113736132A (en) * | 2021-10-21 | 2021-12-03 | 东莞市鼎泰鑫电子有限公司 | Low-density epoxy foaming type grinding wheel and preparation method thereof |
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