JPH09312376A - Semiconductor device - Google Patents

Abstract

(57) [Abstract] [Object] For IGBT power modules and the like, the conventional package design is renewed to provide a small package,
We will make it thinner and make it easier to attach it to the mating device. SOLUTION: A heat dissipation fin 5 functioning as a heat sink for a power element is integrally formed on the bottom surface side of a book type resin package 1 which is a flat box case in which a power semiconductor element and a control circuit for the periphery thereof are incorporated. In addition to mounting, the plug-type input / output main terminal 14 and the control terminal 16 drawn out from the control circuit are collectively led out on one side of the package and installed in the mating device to the connector equipped on the mating side. The main terminal and control terminal are plugged in and connected.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IPM (Intelligent Power Module) and a PIM (Power) used for a power conversion device in the field of power electronics such as an inverter device.
Integrated Module: Power semiconductor device for power integrated module).

[0002]

2. Description of the Related Art Recent advances in power semiconductor devices used for power converters in the field of power electronics have been remarkable, and multiple power chips have been constructed in a single-phase or three-phase configuration due to the downsizing and weight reduction of the device and the simplification of the circuit configuration. An IPM in which a power module combined in one package and peripheral control circuits including a drive circuit of a power chip, a signal processing circuit, and a protection circuit are also incorporated in the same package,
Furthermore, PIM and the like in which the inverter section and the converter section are integrated and incorporated in the same package have been developed and commercialized.

FIGS. 7A and 7B show two IGBTs (Insulated-Gas) as an example of the above-mentioned power semiconductor device.
te Bipolar Transistor) and freewheeling diode (FWD) in the same package, showing the conventional configuration of a two-piece power module and its equivalent circuit. In the figure, 1 is an IGBT chip mounted on an insulating substrate. 2 is a metal base plate (copper base plate), and main terminals (screw terminals) 3 for input / output 3 and control terminals (faston terminals) 4 are provided on the upper surface of the package. The terminal symbols shown in FIG. 7A correspond to the terminal symbols attached to the equivalent circuit in FIG. 7B.

Further, when the semiconductor device having the above-mentioned structure is incorporated in a destination device such as an inverter, the metal base plate 2 is superposed on a heat radiation fin provided on the device side and screwed to fix the main terminal 3 and control. Terminal 4 and the main circuit on the device side,
Connect to the drive circuit.

[0005]

In the power semiconductor device described above, it is important to promote miniaturization, thinness, and weight reduction. For this reason, an insulating substrate for a power chip and a printed circuit board for a control circuit are required. Although it has been devised such that it is installed separately in the package in a two-story structure, or the external lead-out terminal is integrated with the outer case of the package, a small size is required to improve the structure based on the conventional structure. In addition to the above problems, there is a growing demand for power devices that can be used for a wide variety of applications and user-side concepts.
Manufacturers prepare various series products with different ratings and specifications, such as one, two, or six power modules, and IPM compatible with intelligentization according to the purpose of use. In order to have a wide variety of products, it takes a lot of time and effort to design and manufacture, and the cost of the products becomes high.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a semiconductor device improved in order to meet the above demands by renewing the conventional package design with a point of downsizing, thinning and standardization of products.

[0007]

In order to achieve the above object, according to the present invention, a package of a semiconductor device is constructed as follows. 1) According to the first aspect of the present invention, a heat radiation fin functioning as a heat sink for the power semiconductor element is attached to the bottom surface of a resin package, which is a flat box-shaped case incorporating the power semiconductor element and its control circuit, and one side surface of the package. The plug-type input / output main terminal and the control terminal drawn from the control circuit are collectively derived, and the main terminal,
It is configured to connect the control terminal to the connector of the other device in a plug-in manner.

Further, in the above construction, there is also a construction in which the lid of the resin package is also used as the printed circuit board of the control circuit and the circuit element is mounted on the back surface side thereof. The semiconductor device having such a configuration can be easily incorporated as a so-called book type thin package by plugging the main terminal and the control terminal into a connector installed on the side of the device to be used such as an inverter device. Moreover, each product has a compact structure in which a heat radiation fin is mounted on the package, and the heat generated by the power element can be effectively radiated to the outside of the system by self cooling or air cooling.

2) In the second invention, a power semiconductor element,
And a heat dissipation fin that functions as a heat sink for the power semiconductor element is provided on the bottom side of the resin package that is a box-shaped case incorporating the control circuit, and the lid that covers the upper surface of the package also serves as the printed circuit board of the control circuit. A circuit element is mounted on the back side, and main terminals for input / output are provided on the periphery of the upper surface of the package and control pin terminals drawn from the control circuit are provided on the upper surface of the lid.

According to this structure, since the upper lid of the package also serves as the printed circuit board of the control circuit, the package can be made thinner than the structure in which an independent printed circuit board is incorporated in the package by the two-story system. In addition, it can be easily wired and connected to the printed circuit board of the device to be used and mounted. 3) In the third invention, main terminals for input / output are led out on the upper surface of a resin package which is a box-shaped case containing one or two sets of power semiconductor elements, and auxiliary terminals are provided on one side of the package. It is constructed by combining a power section module provided with a connecting means, and a control section module which has a control circuit for a power semiconductor element built therein and which is connected to the auxiliary terminal by plug-in connection with the power section module.

Further, in the above-mentioned configuration, there is also a configuration in which the control section module is a single module that extends over a plurality of power section modules combined according to the application of the apparatus.
According to this configuration, the power section module containing one or two sets of power semiconductor elements and the control section module are standardized and serialized, so that
By combining the required number of power module and control module corresponding to the user's concept, you can easily construct an IPM for various applications such as single-phase, three-phase, or serial / parallel connection. Therefore, the versatility can be expanded.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below with reference to the drawings. In addition, in FIG.
The same reference numerals are attached to the same members corresponding to. [Embodiment 1] In FIGS. 1 and 2, the power semiconductor element is an IGBT.
2 shows an embodiment corresponding to claim 1 of the present invention in which the IPM which is In this embodiment, the resin package 1 is made as a so-called book type in a flat box-shaped case, and the heat radiating fins 5 made of aluminum are superposed on the metal base plate 2 on the bottom surface side of the resin package 1 and the screws 6 are provided. They are fastened together and attached together. In addition, 1a is an upper lid of the package 1. In addition, inside the resin package 1, as in the conventional configuration, an insulating substrate (for example, D with copper foil bonded to both sides of a ceramic substrate) is used.
A power semiconductor device (IGBT) 8 on a BC substrate 7),
A power unit 10 having a freewheeling diode (FWD) 9 mounted thereon and a control unit 13 including a drive circuit and a protection circuit for a power device formed by mounting a circuit device 12 on a printed circuit board 11 are incorporated in a two-story structure. There is.

Here, in the power section 10, the back-side copper foil of the insulating substrate 7 is soldered to the metal base plate 2 and the main terminals 14 for input / output drawn out from the circuit pattern on the substrate are plug type terminals. (Faston terminals) are arranged in a line on the side surface of the package 1 and are led out.
And the controller 13 are interconnected via an internal lead 15. In addition, the printed circuit board 11 of the control circuit unit 13
The control terminals 16 drawn out from are arranged side by side as the pin terminals as pin terminals and led out from the same side surface of the package 1. Although not shown, the inside of the package 1 is filled with a gel resin or the like to seal the semiconductor element.

The IGBT power module having such a structure is suitable for a small capacity module of about 10 to 30 A,
When incorporating it into the other device such as an inverter device,
As shown in FIG. 1 (b), the frame 1 provided in the other device
A connector (female connector) 18 is attached to the connector 7, and the main terminal 14 and the control terminal 16 are inserted into the connector 18 so that they are connected in a plug-in manner. In addition, the mounting posture of the package 1 at that time is such that the heat radiation fins 5 are directed to the sides of the package 1 and the heat transfer from the power semiconductor element is radiated into the ambient air by natural convection of air. Is good.

[Embodiment 2] FIG. 3 shows an application embodiment of the above-mentioned Embodiment 1 corresponding to claim 2 of the present invention. In this embodiment, the metal base plate 2 shown in FIG. 2 is omitted, and the insulating substrate 7 of the power unit 10 is directly bonded to the end surface of the radiation fin 5 mounted on the bottom surface side of the package 1.
Further, the lid body 1a attached to the upper surface of the resin package 1 also serves as a printed circuit board of the control section 13, and after forming a copper foil pattern on the back surface side of the lid body 1a, the circuit element of the control circuit is provided here. 10 is mounted to form the control unit 15. The control terminal 16 soldered to the copper foil pattern of the lid 1a and drawn out is arranged on the side surface of the package 1 side by side with the main terminal 14 as in the first embodiment. The lid 1
The lead piece formed in the copper foil pattern formed on the back surface side of a can be extended laterally from the lid 1a to form the control terminal 16.

According to this structure, the number of parts is smaller than in the first embodiment, and the package 1 is thin, so that the module can be made small and lightweight. [Embodiment 3] FIG. 4 shows an embodiment corresponding to claim 3 of the present invention, in which a radiating fin 5 is superposed on a metal base plate 2 on the bottom surface side of a resin package 1 serving as a box-shaped case. The power unit 10 similar to that of the above-described embodiment is mounted on the metal base plate 2 which is screwed. The lid 1a that covers the upper surface of the package 1 also serves as the printed circuit board of the control unit 13 as in the second embodiment, and the control unit 13 is configured by mounting the circuit element 12 on the back side thereof. There is. Further, the input / output main terminal 14 drawn out from the power section 10 is led out to the peripheral portion of the upper surface of the package 1 as a screw terminal, and the control terminal 16 drawn out from the control section 13 is led out to above the lid 1a as a pin terminal. ing.

When the power device having the above-mentioned structure is incorporated in the device to be used, the printed board 1 on the other side is connected as shown in the figure.
7, the upper surface of the package 1 is butted to the predetermined position, and then the main terminal 14 and the main circuit of the printed board 17 are screwed and connected, and the control terminal 16 is a connector (female connector) provided on the printed board 17. Plug in 18 to connect. According to this configuration, by using the lid 1a of the resin package 1 and mounting the control circuit on the back side thereof, as compared with the conventional configuration in which an independent printed board is incorporated in the package by the two-story method. The package can be made thinner, and it can be easily wired and connected to the printed circuit board of the device where it is used.

[Embodiment 4] FIGS. 5 (a) to 5 (c) show an embodiment corresponding to claim 4 of the present invention, in which power devices of various specifications required by the user are standardized and made into a series. Power unit module 1 with built-in power semiconductor element so that it can be easily realized by combining modules
9 and a control module 20 having a control circuit built-in are configured as independent modules, and both modules are connected in a plug-in manner to construct an IPM corresponding to various specifications.

Here, one or two IGBTs (in the illustrated example, one set of power unit modules) are incorporated in the resin package 1 of each power unit module 19, and the IGBTs are installed on the upper surface thereof. Main terminal for output (screw terminal)
14 have been derived. Further, one side surface of the package 1 is provided with a socket type auxiliary terminal 21 drawn from the collector, emitter and gate of the IGBT.

On the other hand, the control unit module 20 has a control circuit (power element drive circuit) 22 corresponding to the power unit module 1 in a one-to-one correspondence inside the resin package 20a, and the side surface of the package is provided. An auxiliary terminal (pin terminal) 23, which is plug-in connected to the auxiliary terminal 21 of the power module 19, protrudes, and the other end of the auxiliary terminal 23 and the control circuit 22 are provided on the upper surface of the package.
The control terminal 16 drawn out from is derived as a pin terminal. The control unit module 20 has a series of several types of modules having different specifications such as the type of the auxiliary terminal 23.

When an order is placed by the user, the required number of power unit modules 1 corresponding to the intended use and specifications are provided.
9 are arranged side by side as shown in the figure and connected, and each power unit module 20 is further combined with the control unit module 20 to construct a power module. As a result, by combining and assembling the power unit module 19 and the control unit module 20 which are manufactured as standard and series, various applications can be achieved.
We can also respond to order specifications. Also, by combining a plurality of power unit modules and connecting them in parallel, it is possible to easily realize a large capacity of the IPM.

[Embodiment 5] FIGS. 6 (a) and 6 (b) show an application embodiment of the above-mentioned Embodiment 4 corresponding to claim 5 of the present invention. In this embodiment, three sets of power unit modules 19 each of which constitutes a half-bridge circuit by connecting two IGBTs in series and one control unit module 20 which straddles each power unit module 19 are combined. An example in which an IPM of a three-phase full-bridge circuit is constructed by way of example, and each power module 19 has a main terminal 14 on the upper surface of the package 1 and a socket-shaped auxiliary terminal 21 on the side surface, as in the fourth embodiment. Has been derived. On the other hand, the control module 2
0 has a built-in control circuit 22 including a drive circuit, a protection circuit, etc. corresponding to three power unit modules 10, and each power unit module 1 is provided on the side surface of the package.
The auxiliary terminals 21 are individually plugged into the auxiliary terminals 21 and the upper surface of the package is provided with auxiliary terminals for three power unit modules and control terminals.

As can be seen from the cases of the above-described fourth and fifth embodiments, by appropriately combining the standardized one-piece or two-piece set of power section modules 19 and the separate type control section module 20, It is possible to easily construct an IPM that meets a wide variety of applications and specifications required by users.

[0024]

As described above, according to the structure of the present invention, the following effects can be obtained. 1) According to the configurations of claims 1 and 2, or claim 3, the semiconductor device can be made smaller, thinner and lighter than the conventional configuration. 2) Further, by adopting the configurations of claims 4 and 5,
The power unit module that standardizes the number of power elements into one set or two sets, and several kinds of control unit modules that have a built-in peripheral control circuit that matches the characteristics of the power device are selected as appropriate. By combining them, it is possible to construct a power device that meets a wide variety of specifications required by the user, and this can be expected to significantly reduce product costs.

[Brief description of drawings]

1A and 1B are configuration diagrams of a semiconductor device corresponding to a first embodiment of the present invention, in which FIG. 1A is an overall external perspective view, and FIG. 1B is an explanatory diagram showing a method of attaching the device to a counterpart device.

FIG. 2 is a cross-sectional view showing the internal structure of the semiconductor device in FIG.

FIG. 3 is a configuration cross-sectional view of a semiconductor device corresponding to Example 2 of the invention.

FIG. 4 is a configuration cross-sectional view of a semiconductor device corresponding to Example 3 of the invention.

5A and 5B are configuration diagrams of a semiconductor device corresponding to a fourth embodiment of the present invention, in which FIG. 5A is an external perspective view of an assembled state, FIG. 5B is a side view of a partial cross section, and FIG. 5C is an equivalent circuit diagram.

6A and 6B are configuration diagrams of a semiconductor device corresponding to Example 4 of the invention, in which FIG. 6A is an external perspective view of an assembled state, and FIG. 6B is an equivalent circuit diagram.

FIG. 7 is a conventional configuration diagram of a semiconductor device targeting a set of two IGBT power modules, (a) is an external perspective view, and (b) is an equivalent circuit diagram.

[Explanation of symbols]

 1 Resin Package 1a Lid 2 Metal Base Plate 5 Heat Dissipation Fin 7 Insulating Substrate 8 Power Semiconductor Element 10 Power Section 13 Control Section 14 Main Terminal 16 Control Terminal 18 Connector 19 Power Section Module 20 Control Section Module 21 Auxiliary Terminal 22 Control Circuit

Claims (5)

[Claims] 1. A heat dissipation fin functioning as a heat sink for a power semiconductor element is mounted on the bottom side of a resin package which is a flat box-shaped case incorporating a power semiconductor element and a control circuit for the power semiconductor element, and a plug type is provided on one side surface of the package. The input / output main terminal and the control terminal drawn out from the control circuit are collectively derived, and the main terminal and the control terminal are connected to the connector of the counterpart device in a plug-in manner. Semiconductor device. 2. The semiconductor device according to claim 1, wherein the lid of the resin package is also used as a printed circuit board of the control circuit, and a circuit element is mounted on the back side thereof. 3. A lid for mounting a radiation fin functioning as a heat sink for the power semiconductor element on the bottom side of a resin package, which is a box-shaped case incorporating the power semiconductor element and its control circuit, and covering the upper surface of the package. Is used as a printed circuit board of the control circuit, the circuit element is mounted on the back side, and the main terminals for input / output are led to the periphery on the top side of the package, and the control terminals pulled out from the control circuit are drawn to the top side of the lid. A semiconductor device characterized by the above. 4. A main terminal for input / output is led out on the upper surface of a resin package which is a box-shaped case containing one or two sets of power semiconductor elements, and auxiliary terminal connection means is provided on one side surface of the package. A semiconductor device comprising a power section module provided and a control section module which has a control circuit built-in and which is connected to the auxiliary terminal by plug-in connection with the power section module. 5. The semiconductor device according to claim 4, wherein the control unit module is a single module that extends over a plurality of power unit modules arranged side by side.