JPH09314023A - Seal structure and spin processing device using this seal structure - Google Patents

Abstract

(57) An object of the present invention is to provide a spin processing apparatus capable of surely sealing a gap between a rotary table and a processing container. Kind Code: A1 In a spin processing apparatus for rotating and processing a semiconductor wafer, a rotating shaft provided rotatably and a rotating table provided on an upper end of the rotating shaft and holding the semiconductor wafer on an upper surface side. And a lower cup 75 as a processing container having a through hole 75a through which the rotary shaft is inserted and the rotary table is provided therein, and the rotary table around the through hole of the process container. -An annular groove 85 provided opposite the lower surface of the bull and containing a liquid therein.
And an annular wall 85 vertically extending from the rotary table and inserted into the annular groove.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a seal structure for sealing a gap between a fixed member and a rotary member, and a spin processing apparatus using the seal structure.

[0002]

2. Description of the Related Art For example, in the manufacturing process of a semiconductor device or a liquid crystal display device, a film forming process or a photo process for forming a circuit pattern on a semiconductor wafer or a rectangular glass substrate as a work. There is. In these processes, the work and cleaning of the above work are repeated.

In order to wash the above work, this work
A so-called spin processing apparatus is used in which a cleaning liquid is sprayed onto the above-mentioned work while holding the work on a rotating table and rotating the rotating table at a high speed.

The rotating table is provided in the processing container to prevent the cleaning liquid scattered from the work from scattering around. A rotary shaft is provided on the lower surface of the rotary table. The rotary shaft is projected outward from a through hole formed at the bottom of the processing container, and the projected portion is rotatably supported by a bearing. There is.

A driven pulley is provided at a lower end portion of the rotary shaft projecting from the processing container. The driven pulley and the drive motor are provided.
A belt is stretched between the drive pulley fitted to the rotary shaft of the rotor. Therefore, when the drive motor operates, the rotary table is rotationally driven by the rotary shaft.

By the way, according to the spin processing apparatus having such a configuration, since the rotating shaft is passed through the through hole formed in the processing container, a gap is formed between the through hole and the processing container. Is inevitable.

Therefore, the cleaning liquid for cleaning the work in the cleaning container may be scattered to the outside through the gap between the through hole and the rotary shaft, and the cleaning liquid permeates into the bearing supporting the rotary shaft. This bearing may be damaged early. In particular, when a cleaning liquid having a high acidity is used, it is necessary to reliably prevent the cleaning liquid from scattering to the outside of the processing container.

Further, when the rotary table rotates in the processing container, the rotation may generate an air flow, and the air flow may cause outside air to flow into the processing container from the gap.
Then, the dust contained in the outside air may adhere to the cleaned work.

[0009]

As described above, when the work is held on the rotary table and is subjected to, for example, a cleaning process in the processing container, the rotary shaft for rotating the rotary table and the rotary shaft for rotating the rotary table are provided. The cleaning liquid is splashed to the outside through the gap between the through hole formed in the processing container through which the rotary shaft is inserted, or conversely, the outside air flows into the processing container through the above through hole, and the dust contained in the outside air becomes a work. There was something like sticking to.

The present invention has been made based on the above circumstances, and an object thereof is to provide a seal structure capable of reliably sealing between a fixed member and a rotating member. .

Another object of the present invention is to form a rotary table, which is rotatably driven and is arranged in the processing container, and a processing shaft into which a rotary shaft for rotating the rotary table is inserted. An object of the present invention is to provide a spin processing device capable of surely sealing the gap between the through hole and the through hole.

[0012]

According to the invention of claim 1, in a seal structure for sealing a gap between a fixed member and a rotary member, the fixed member is provided along the circumferential direction of the rotary member. It is characterized by comprising an annular groove for containing a liquid therein, and an annular wall provided on the outer periphery of the rotating member and inserted into the annular groove.

According to a second aspect of the present invention, in a spin processing apparatus for processing a work by rotating the work, a rotation shaft provided rotatably, and the work provided on the upper surface of the rotation shaft at the upper end thereof. A rotation table to be held, a processing container in which a through hole for inserting the rotation shaft is formed, and the rotation table is provided inside, and the rotation table is provided around the through hole of the processing container. It is characterized by comprising an annular groove facing the lower surface of the bull and having a liquid contained therein, and an annular wall vertically extending from the rotary table and inserted into the annular groove.

According to a third aspect of the present invention, in the second aspect of the present invention, the annular groove is formed by a first peripheral wall and a second peripheral wall that is shorter than the first peripheral wall. The liquid supplied to the annular groove is overflowed from the first peripheral wall to the processing container.

According to the first aspect of the present invention, the annular wall provided on the rotating member is immersed in the liquid in the annular groove provided on the fixed member, so that the annular wall separates the rotating member and the fixed member. The space is sealed over the entire length of the rotary member in the circumferential direction.

According to the second aspect of the present invention, the gap between the rotation table of the spin processing apparatus and the through hole, which is formed in the processing container and into which the rotation shaft is inserted, is formed in the annular groove provided in the processing container. Sealing is performed by inserting an annular wall provided on the rotary table.

According to the third aspect of the present invention, by causing the liquid supplied to the annular groove to overflow into the processing container, the dust floating on the liquid surface of the annular groove is discharged from the processing container to the outside together with the liquid. it can.

[0018]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of the present invention will be described below with reference to FIGS. The spin cleaning apparatus of the present invention shown in FIG. 2 has a main body base 1. A cylindrical support 2 is provided in the main body base 1 so as to penetrate therethrough in the vertical direction. The support 2 is also provided with a cylindrical rotary body 3 rotatably supported in the middle by a pair of upper and lower bearings 4.

The lower end of the rotating shaft 3 protrudes from the support 2, and a driven pulley 5 is fitted to the lower end. A step motor 6 is provided near the driven pulley 5. A drive pulley 7 is fitted on the rotary shaft 6a of the step motor 6, and a belt 8 is stretched between the drive pulley 7 and the driven pulley 5. Therefore, if the step motor 6 operates, the rotation shaft 3
Is driven to rotate.

A rotary table 9 is detachably attached to the upper end of the rotary shaft 3 by a screw 9a. On the rotary table 9, four holding members 11 are rotatably provided at intervals of 90 degrees in the circumferential direction via bushes 12. The holding member 11 has a cylindrical portion 13 as shown in FIG. The cylindrical part 13 has an upper end closed and an open lower end. A support shaft 14 is vertically suspended from the cylindrical portion 13 with its lower end protruding. The support shaft 14 is rotatably supported by the bush 12.

A support pin 16 is provided on the upper surface of the cylindrical portion 13.
Further, a reverse taper-shaped lock pin 17 which is taller than the support pin 16 is provided upright. The support pin 16 has its shaft center substantially aligned with that of the support shaft 14, and the lock pin 1
7 is provided eccentrically with respect to the axis.

As shown in FIGS. 1 to 3, a semiconductor wafer 21 as a work is held by the four holding members 11 having the above structure. That is, the semiconductor wafer 21 is provided so that the peripheral portion of the back surface thereof is supported by the support pins 16. With the semiconductor wafer 21 supported by the support pins 16, the holding member 11 is biased in the rotational direction by a spring 54 described later.

As a result, the lock pin 17 provided on the holding member 11 is eccentrically rotated from the position shown by the chain line in FIG. 3 to the position shown by the solid line, and comes into contact with the outer peripheral surface of the semiconductor wafer 21. Will be held without moving in the radial direction.

A through hole 25 is formed in the central portion of the rotary table 9 as shown in FIG. A conical lower nozzle body 26 is provided in the through hole 25 portion. The lower nozzle body 26 includes a central portion 26a which is fitted into the through hole 25 in a non-contact state, and an umbrella portion 26b which is screwed onto the outer peripheral surface of the central portion 26a and has a larger diameter than the through hole 25. Become.

An annular first seal wall 20a is projectingly provided on the periphery of the through hole 25a of the rotary table 9, and the lower surface of the umbrella portion 26b is provided with the first seal wall. An annular second seal wall 20b is vertically provided on the outer peripheral surface of 20a so as to be opposed to the outer peripheral surface.

Since the umbrella portion 26b of the lower nozzle body 26 covers the upper end surface of the rotary shaft 3, the cleaning liquid for cleaning the semiconductor wafer 21 is prevented from entering the rotary shaft 3.

The umbrella portion 26b of the lower nozzle body 26 covers the upper surface of the rotary table 9, and the umbrella portion 26b is detachably screwed to the center portion 26a. Therefore, by removing the umbrella portion 26b from the central portion 26a, the screw 9a attached to the upper end of the rotary shaft 3 of the rotary table 9 can be exposed. Thereby, the rotary table 9 can be removed from the rotary shaft 3 by loosening the screw 9a.

A step portion is formed on each of the outer peripheral surface of the central portion 26a and the inner peripheral surface of the umbrella portion 26b, and liquid tightness is secured between the central portion 26a and the umbrella portion 26b between these step portions. Packing 26c for interposing is provided. In addition, a nozzle hole 27 opened at the upper surface of the central portion 26a of the lower nozzle body 26 is formed so as to penetrate in the vertical direction.

A bracket 31 is fitted to the lower end of the central portion 26a of the lower nozzle body 26. The bracket 31 is rotatably supported by a bearing 29 in the upper portion of the rotary shaft 3.

The bracket 3 inside the rotary shaft 3
Below 1 is the bearing 29 and another bearing 32 shown in FIG.
A housing 33 having upper and lower end portions rotatably supported by is inserted. The housing 33 and the bracket 31 are integrally combined to form a fixed shaft. The lower end of the housing 33 projects from the rotary shaft 3 and is attached to the lower surface side of the base body 1 as a mounting plate 1a.
It is fixed to.

The housing 33 has a first through hole 34 into which the support shaft 28 is inserted and a second through hole 36 into which a supply tube 35 having one end connected to the nozzle hole 27 is inserted. Has been drilled. An upper end of the support shaft 28 inserted through the first through hole 34 is connected and fixed to a central portion 26a of the lower nozzle body 26, and a lower end thereof is in the housing 3.
It is fixed to 3. Thereby, the lower nozzle body 26 is integrated with the housing 33. That is,
Even when the rotary table 9 and the rotary shaft 3 are driven to rotate, the lower nozzle body 26 and the housing 33 do not rotate.

The other end of the supply tube 35 communicates with a cleaning liquid supply section (not shown). Therefore, the cleaning liquid from the supply tube 35 can be sprayed from the nozzle hole 27 toward the center of the lower surface of the semiconductor wafer 21 held by the holding member 11. That is, the back surface of the semiconductor wafer 21 can be cleaned.

An upper nozzle body 38 is arranged on the upper surface side of the semiconductor wafer 21. The cleaning liquid is sprayed from the upper nozzle body 38 toward the central portion of the upper surface of the semiconductor wafer 21. Thereby, the semiconductor wafer 2
The upper surface of 1 is cleaned.

On the lower surface side of the rotary table 9 and on the outer peripheral surface of the upper portion of the rotary shaft 3, there is provided a cylindrical lock cylinder 41 rotatably by a pair of upper and lower bearings 40. As shown in FIGS. 1 and 3, a flange 42 is provided on the upper end of the lock cylinder 41, and four arms 39 are radially outwardly provided on the flange 42 at intervals of 90 degrees in the circumferential direction. And a slide groove 36 is formed at the tip of each arm 39 along the radial direction. A top 37 having a fitting hole 37a is slidably provided in each slide groove 36.

A locking pin 43 is detachably fitted into the fitting hole 37a of the top 37. The locking pin 43 is provided so as to project from one end of the lever 44. The other end of the lever 44 is connected and fixed to a lower end portion of the support shaft 14 of the holding member 11 that projects toward the lower surface of the rotary table 9.

Therefore, when the lock cylinder 41 is rotated in the clockwise direction shown by the arrow in FIG. 3 and the lever 44 is rotated via the top 37 and the locking pin 43, the lever 44 is connected to the lever 44. The holding member 11 can be rotated via the supported shaft 14.

As a result, the lock pin 17 rotates eccentrically, so that the semiconductor wafer 21 supported by the support pin 16 is rotated.
The lock pins 17 are brought into contact with the outer peripheral surface of the semiconductor wafer 21 to lock the support state of the semiconductor wafer 21. That is, the lock pin 17 prevents the semiconductor wafer 21 supported by the support pin 16 from moving in the radial direction.

By rotating the lock cylinder 41 counterclockwise, the locked state of the semiconductor wafer 21 by the lock pin 17 can be released. The lock mechanism 17 locks and unlocks the semiconductor wafer 21 by the lock pin 17, that is, the rotation of the lock cylinder 41 is performed by the unlocking mechanism 51. As shown in FIGS. 4 and 5, the release mechanism 51 includes a first locking piece 52 provided on the outer peripheral surface of the rotary shaft 3 and a second locking piece 52 provided on the outer peripheral surface of the lock cylinder 41.
Locking piece 53 of.

A spring 54 is stretched between the first locking piece 52 and the second locking piece 53. The spring 54 urges the lock cylinder 41 toward the first locking piece 52 via the second locking piece 53. That is, the lock cylinder 41
Is biased counterclockwise as indicated by the arrow in FIG. Therefore, since the spring 54 rotates the lock cylinder 41,
Rotation table 9 via locking pin 43 and lever 44
The holding member 11 provided at the position is rotated to bring the lock pin 17 into a locked state in which the lock pin 17 contacts the outer peripheral surface of the semiconductor wafer 21.

To release the locked state of the semiconductor wafer 21 by the lock pin 17, as shown in FIGS. 4 and 5, the first cylinder 61 constituting the releasing mechanism 51 arranged near the step motor 6 is used. , Second cylinder 62.

That is, as shown in FIG. 4, the first cylinder 61 is provided on the main body base 1 via the first substrate 62. The first cylinder 62 is provided on the first substrate 62.
A first movable body 64 is slidably supported by a first linear guide 63 on the side of the first movable body 64. The first movable body 64 is connected to the rod 61a of the first cylinder 61. As a result, the first movable body 64 is driven to reciprocate along the first linear guide 63 by the operation of the first cylinder 61.

A pair of holding rollers 65 are provided at a predetermined interval at the tip of the upper surface of the first movable body 64. When the first movable body 64 is driven in the forward direction, the holding rollers 65 hold the first locking piece 52 of the rotary shaft 3 stopped at a predetermined rotation angle as shown by the chain line in FIG. To do. Thereby, the first movable body 64 prevents the rotation shaft 3 from rotating.

The second cylinder 62 is attached to the main body base 1 via a second substrate 66. Second
A second movable body 68 is slidably provided on the substrate 66 by a second linear guide 67 on the side of the second cylinder 62. A pressing roller 69 is rotatably provided at the top end of the second movable body 68. Therefore, the pressing roller 69 is driven forward and backward by the second cylinder 62.

The rotation shaft 3 stops at a predetermined rotation angle,
When the second cylinder 62 is actuated and the second movable body 68 is driven in the forward direction while the first locking piece 52 is sandwiched by the pair of sandwiching rollers 65, 5
A pressing roller 69 provided at the tip of the second locking piece 5 provided on the lock cylinder 41 as shown by a chain line in FIG.
Press 3.

As a result, the lock cylinder 41 is rotated against the urging force of the spring 54, so that the locking pin 4
The holding member 11 is rotated in the opposite direction to that at the time of locking through the lever 3 and the lever 44. Therefore, the lock pin 1
7 rotates eccentrically to release the locked state of the semiconductor wafer 21.

As shown in FIG. 2, a dog 71 is provided on the outer peripheral surface of the lower end portion of the rotary shaft 3, and the dog 71 is detected by a microphotosensor 72. The rotation angle of the rotary shaft 3 by the step motor 6 is controlled by the detection signal of the micro photo sensor 72. That is, when the locked state of the semiconductor wafer 21 is released, the first and second cylinders 61 and 62 of the release mechanism 51
The rotation angle of the rotary shaft 3 is controlled so that the tongue piece 52 and the second tongue piece 53 are located at predetermined positions.

On the upper surface side of the main body base 1, there is formed a through hole 75a into which the upper portion of the rotary shaft 3 is loosely inserted, and the lower cup 75 in which the rotary shaft 3 is housed, and the holding member 11.
Covering the peripheral portion of the upper surface side of the semiconductor wafer 21 held by
An upper cup 76 having an opening 76a on the upper surface is provided. The upper cup 76 is provided so as to be vertically movable, and a rod 77 of a vertical drive cylinder (not shown) is connected thereto.
By operating this cylinder, the upper cup 76 is driven up and down. The lower cup 75 and the upper cup 76 form a processing container.

When the upper cup 76 is lowered to the position shown by the chain line in FIG. 1, the upper portion of the holding member 11 projects from the upper opening. Therefore, an unprocessed semiconductor wafer 21 can be supplied to the holding member 11 by a robot (not shown), and the semiconductor wafer 21 that has been dried can be taken out. Furthermore, the lower cup 75
A discharge pipe 78 is connected to the. The discharge pipe 78 discharges the cleaning liquid and atmosphere inside the lower cup 75.

As shown in FIG. 1, a ring-shaped facing member 81 facing the peripheral portion of the lower surface of the rotary table 9 is provided in the peripheral portion of the through hole 75a of the lower cup 75. An annular groove 83 is formed around the upper surface of the facing member 81 by an inner peripheral wall 82a as a first wall body and an outer peripheral wall 82b as a second wall body that is shorter than the inner peripheral wall 82a.
Are formed. A liquid L supply pipe 84 is connected to the bottom of the annular groove 83, and the liquid L is supplied to the annular groove 83.
Is supplied.

Since the outer peripheral wall 82b forming the annular groove 83 is shorter than the inner peripheral wall 82a, the liquid L supplied to the annular groove 83 overflows to the outside to form a processing container. It is adapted to be dropped into 75 and discharged from a discharge pipe 78.

A seal wall 85 is provided around the lower surface of the rotary table 9 so as to enter the annular groove 83 over the entire circumference. When the seal wall 85 is inserted into the annular groove 83 containing the liquid L, the lower surface side and the outer peripheral side of the rotary table 9 are hermetically shut off from each other.

As a result, outside air containing dust is prevented from flowing into the lower cup 75 from the through hole 75a portion of the lower cup 75, and the cleaning liquid scattered in the upper and lower cups 75, 76 is prevented from flowing into the lower cup. The dust from the outside that is prevented from flowing out through the through hole 75a of 75 and is blocked by the liquid L in the annular groove 83 is the liquid L.
Is discharged from the overlying cup 76, so that the semiconductor wafer 21 is not damaged.

When the cleaning liquid is a liquid having a high acidity, the cups 75 and 76 and the rotary table 9 are made of a material having acid resistance, for example, fluororesin, so that they are not corroded. , When the cleaning liquid flows out from the lower cup 75 and adheres to other parts made of metal,
The parts may be corroded, and if the parts enter the movable part such as the bearing part, the movable part may be damaged early. However, since the above-mentioned seal structure prevents the cleaning liquid from flowing out from the inside of the lower cup 75, such an inconvenience does not occur.

Housing 3 provided in the rotating shaft 3
3 is provided with a supply pipe 91 for an inert gas such as nitrogen. The supply pipe 91 communicates with the first space 92a on the upper surface side of the bracket 31 and the lower surface side of the lower nozzle body 26. A communication hole 93 that communicates with the second space 92b between the outer peripheral surface and the inner peripheral surface of the rotary shaft 3 is formed in the peripheral wall of the bracket 31.

Therefore, from the supply pipe 91 to the first
The inert gas supplied to the space 92a of the
3 to the second space portion 92b, and the second space portion 9b
2a flows out along the lower surface side of the lower nozzle body 26.
That is, since the second space 92b has a positive pressure due to the inert gas, the cleaning liquid is prevented from flowing into the second space 92b by the pressure.

As shown in FIG. 1, a first suction hole 95a connected to a suction pump (not shown) is formed in the peripheral wall of the support 2 which rotatably supports the rotary shaft 3. A second suction hole 95b is formed in a portion of the peripheral wall of the rotary shaft 3 facing the first suction hole 95a. further,
A third suction hole 95c is formed in a portion of the peripheral wall of the rotary shaft 3 facing the lock cylinder 41.

Therefore, by the suction force of the suction pump connected to the first suction hole 95a, the bearing 4 rotatably supporting the rotary shaft 3 on the support body 2 and the rotary shaft 3 on the housing 33 are rotated. Freely supported bearings 29, 32
And the dust generated by the bearing 40 that rotatably supports the lock cylinder 41 on the rotary shaft 3 is prevented, so that the dust generated by each of the bearings is prevented from scattering around. Has become.

Next, the case where the semiconductor wafer 21 is cleaned by the spin cleaning device having the above-mentioned structure will be described.
First, the semiconductor wafer 21 is held by the four holding members 11 provided upright on the upper surface of the rotary table 9. That is,
The semiconductor wafer 21 is held on the rotary table 9 by supporting the peripheral portion of the lower surface of the semiconductor wafer 21 with the support pins 16 and bringing the lock pins 17 into contact with the outer peripheral surface. Since the lock pin 17 has a reverse taper shape, it not only holds the semiconductor wafer 21 in the radial direction, but also reliably prevents the semiconductor wafer 21 from floating from the support pin 16.

After the semiconductor wafer 21 is held on the rotary table 9, the step motor 6 is operated to rotate the rotary table 9 and the rotary table 9 at high speed. At the same time, the cleaning liquid is supplied from the upper nozzle body 38 to the semiconductor wafer 2
1 and the lower nozzle body 2
The cleaning liquid is sprayed from the nozzle holes 27 of No. 6 toward the lower surface of the semiconductor wafer 21. By supplying the cleaning liquid to the central portion between the upper surface and the lower surface of the semiconductor wafer 21 rotated at high speed,
The upper and lower surfaces of this semiconductor wafer 21 are cleaned.

A cleaning liquid is supplied to the lower surface of the semiconductor wafer 21 from a nozzle hole 27 formed in the lower nozzle body 26. The lower nozzle body 26 is attached to a bracket 31 that forms a fixed shaft and is attached to the upper end side of the rotary shaft 3.
That is, it is provided so as to project to the upper surface side of the rotary table 9.

Therefore, the cleaning liquid sprayed from the nozzle holes 27 of the lower nozzle body 26 toward the lower surface of the semiconductor wafer 21 cleans the lower surface of the semiconductor wafer 21 without being blocked by the rotating table 9 rotating at a high speed. Therefore, not only the lower surface of the semiconductor wafer 21 can be cleaned efficiently and reliably, but also the cleaning liquid does not collide with the rotary table 9 and scatter.

The lower nozzle body 26 is divided into a central portion 26a and an umbrella portion 26b, and the umbrella portion 26b covers the upper end surface of the rotary shaft 3. Therefore, the cleaning liquid sprayed and dropped on the lower surface of the semiconductor wafer 21 has a second space between the rotary shaft 3 and the bracket 31 rotatably supported in the upper end of the rotary shaft 3 by the umbrella portion 26b. It is prevented from flowing into 92b.

Moreover, the through hole 25a of the rotary table 9 is provided.
A first seal wall 20a is projectingly provided on the peripheral portion of the above, and a second seal wall 20b facing the first seal wall 20a is vertically provided on a lower surface of the umbrella portion 26b. Therefore, the cleaning liquid can also be supplied to the second space portion 92b by these seal walls.
Intrude into.

The inert gas supplied to the first space 92a from the supply pipe 91 provided in the housing 33 flows into the second space 92b through the communication hole 93 formed in the bracket 31, It flows out from the open end of its upper end. Therefore, the second space 92b has a positive pressure due to the inert gas, and the pressure also prevents the cleaning liquid from flowing into the second space 92b.

As described above, if the cleaning liquid is prevented from flowing into the second space 92b, the bearing 29 or the like which rotatably supports the rotary shaft 3 may be corroded early by the cleaning liquid. Disappear. In particular, when the cleaning solution has a high acidity, it is very effective for preventing premature corrosion.

On the other hand, when the size of the semiconductor wafer 21 held by the holding member 11 of the rotary table 9 is changed,
The rotation table 9 is replaced with the rotation table 9 provided with the holding member 11 at an interval capable of supporting the semiconductor wafer 21 to be changed.

When replacing the rotary table 9, first, the umbrella portion 26b of the lower nozzle body 26 is removed from the central portion 26a. The central portion 26a has a smaller diameter than the through hole 40 formed in the central portion of the rotary table 9. Therefore, even if the umbrella portion 26b of the lower nozzle body 26 covers the screw 9a that fixes the rotary table 9 to the rotary shaft 3,
The screw 9a can be exposed by removing the umbrella portion 26b from the central portion 26a. Thereby,
The rotary table 9 can be removed from the rotary shaft 3 by loosening the screw 9a.

When the rotary table 9 is removed, a new rotary table 9 corresponding to the size change may be attached to the rotary shaft 3 in the reverse order of the removal. Even if the rotary table 9 is replaced with a different size, the distance A from the center of the rotary shaft 3 to the locking pin 43 provided at one end of the lever 44 shown in FIG. The length of the lever 44 is set so that the ratio from the distance B to the center of rotation of the holding member 11 is constant.

As a result, the angle at which the holding member 11 is rotated in the lock direction by the spring 54 via the lock cylinder 41 and the angle at which it is rotated in the release direction by the release mechanism 51 can be made constant.

A shield is provided around the lower surface of the rotary table 9.
A seal wall 85 is provided, and the seal wall 85 is accommodated in the annular groove 83 in which the liquid L is accommodated. Therefore, the peripheral portion of the lower surface of the rotary table 9 is hermetically sealed, and the outside air including dust is prevented from flowing into the lower cup 75 from the through hole 75a formed in the lower cup 75. The cleaned semiconductor wafer 21 is not contaminated. On the contrary, it is possible to prevent the cleaning liquid scattered in the lower cup 75 from flowing out from the lower surface side of the rotary table 9 through the through hole 75a to the outside. Therefore, the cleaning liquid is a highly acidic chemical. It is effective in some cases.

The spin cleaning apparatus can dry the cleaning liquid attached to the semiconductor wafer 21 by rotating the cleaned semiconductor wafer 21 at a high speed. At the time of the drying process, since the peripheral portion of the lower surface of the rotary table 9 is sealed as described above, the outside air is prevented from flowing into the lower cup 75 even at the time of drying.
Therefore, it is possible to prevent dust contained in the outside air from adhering to the semiconductor wafer 21 even during the drying process.

FIG. 6 shows a second embodiment of the present invention.
In this embodiment, when the rotating shaft 103 is inserted into the through hole 102 formed in the center of the bottom portion of the lower cup 101, the outer peripheral surface of the rotating shaft 103 and the inner peripheral surface of the through hole 102 are sealed. -The structure is designed so that That is, the inner peripheral wall 104 as the first wall body is provided around the through hole 102.
An outer peripheral wall 105, which is a second wall body that is shorter than the inner peripheral wall 104, is annularly projected at predetermined intervals in the radial direction. Thereby, the annular groove 106 is formed.

The upper end of the rotary shaft 103 has a rotary table.
The rotary table 103 is connected to the central portion of the lower surface of the table 107 and is driven by rotating the rotary shaft 103.
The semiconductor wafer 108 held on the upper surface of 7 is also rotated integrally.

A liquid L supply pipe 10 is provided in the annular groove 106.
9 is connected, and the liquid L is supplied from the supply pipe 109 to the annular groove 106. The liquid L supplied to the annular groove 106 overflows from the short outer peripheral wall 105 to the lower cup 101, and is discharged from a discharge pipe 111 connected to the bottom of the lower cup 101.

An annular wall 112 is provided on the outer peripheral surface of the portion of the rotary shaft 103 protruding into the lower cup 101. The lower end of the annular wall 112 is immersed in the liquid L in the annular groove 106. Therefore, the through hole 10
There is a seal between the rotary shaft 103 and the rotary shaft 103.

According to this structure, the lower cup 1
01 through hole 102 and the rotary shaft 103 are hermetically sealed, so that outside air is passed through the through hole 102 to the lower cup 101.
Invasion into the inside of the through hole 1 is prevented, and the cleaning liquid scattered on the lower cup 101 after cleaning the semiconductor wafer 108 is the through hole 1
Outflow from 02 is also blocked.

That is, the seal structure of the present invention may be provided on the lower cup 75 and the rotary table 9 as shown in the first embodiment, or as shown in the second embodiment. As described above, the lower cup 101 and the rotating shaft 103 may be directly provided.

In each of the above embodiments, the case where the seal structure of the present invention is applied to the spin cleaning processing apparatus has been described. However, in the case where the semiconductor wafer spin-cleaned by the spin cleaning processing apparatus is dried. However, it goes without saying that the present invention can be effectively used. further,
The application of the present invention is not limited to the spin processing device,
Any structure can be applied as long as the gap between the fixed member and the rotating member needs to be sealed.

[0079]

As described above, according to the first aspect of the invention, the rotary member is provided with the annular wall, and the annular wall is accommodated in the annular groove provided in the fixed member and containing the liquid. . Therefore, due to the annular wall, the gap between the rotating member and the fixed member is sealed over the entire length of the rotating member in the circumferential direction.
Therefore, it is possible to prevent dust or liquid from flowing through the gap.

According to the second aspect of the present invention, the liquid is accommodated in the processing container through a gap formed between the rotation table of the spin processing device and the through hole formed in the processing container and through which the rotation shaft is inserted. An annular groove is provided, and the annular wall provided on the rotary table is inserted into the annular groove to seal.

Therefore, the gap between the rotary table and the rotary shaft can be reliably sealed, so that the cleaning liquid scattered in the processing container is prevented from flowing out of the processing container through the gap. Moreover, it is possible to prevent outside air containing dust from flowing into the processing container through the gap.

According to the invention of claim 3, in the invention of claim 2, since the liquid supplied to the annular groove is allowed to overflow into the processing container, the harmful cleaning liquid trapped by the liquid or It is possible to reliably discharge dust and the like in the outside air from the processing container to the outside.

[Brief description of drawings]

FIG. 1 is an enlarged cross-sectional view of a main part showing a first embodiment of the present invention.

FIG. 2 is an overall configuration diagram of a spin cleaning processing apparatus.

FIG. 3 is an explanatory view of a work holding structure.

FIG. 4 is a side view of the release mechanism.

FIG. 5 is a plan view of the release mechanism.

FIG. 6 is an explanatory view of a seal structure showing a second embodiment of the present invention.

[Explanation of symbols]

 3 ... Rotating shaft 9 ... Rotating table (rotating member) 21 ... Semiconductor wafer (work) 75 ... Lower cup (processing container) 76 ... Upper cup (processing container) 75a ... Through hole 82a ... Inner peripheral wall (first) Wall body) 82b ... Outer peripheral wall (second wall body) 83 ... Annular groove 84 ... Supply pipe 85 ... Annular wall

Claims (3)

[Claims] 1. A seal structure for sealing a gap between a fixed member and a rotating member, wherein an annular groove is provided in the fixed member along a circumferential direction of the rotating member and contains a liquid therein. A seal structure, comprising: an annular wall provided on the outer periphery of the rotating member and inserted into the annular groove. 2. A spin processing apparatus for processing a work by rotating the work, wherein the work is provided with a rotation shaft provided rotatably and a rotation shaft provided on an upper end of the rotation shaft and holding the work on an upper surface side. And a processing container having a through hole through which the rotary shaft is inserted and the rotary table is provided therein, and a peripheral portion of the through hole of the processing container facing a lower surface of the rotary table. A spin processing apparatus comprising: an annular groove that is provided in the inside of which the liquid is contained, and an annular wall that is hung from the rotation table and that is inserted into the annular groove. 3. The annular groove is formed by a first peripheral wall and a second peripheral wall which is shorter than the outer peripheral wall, and liquid supplied to the annular groove is supplied from the second peripheral wall. The spin processing apparatus according to claim 2, wherein the spin processing apparatus is overflowed to the processing container.