JPH09321352A - Thermoelectric module - Google Patents

Abstract

(57) 【Abstract】 PROBLEM TO BE SOLVED: It is easy to manufacture and good performance can be obtained. SOLUTION: The thermoelectric element 1 and a metal pattern plate 3 made of a conductive metal plate and having bonding electrodes 30 arranged in a predetermined pattern connected to adjacent bonding electrodes by bridges 31 and 32. The P-type thermoelectric element and the N-type thermoelectric element are joined to the joining electrode and alternately arranged between the two metal pattern plates. At least one of the metal pattern plates is filled with an insulating resin in the gap between the bonding electrodes or fixed on a ceramic substrate,
The bridge which is unnecessary in the circuit configuration is cut off while holding the bonding electrode by the insulating resin or the substrate.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thermoelectric module in which a plurality of thermoelectric elements are thermally connected in parallel and a manufacturing method thereof.

[0002]

2. Description of the Related Art In a thermoelectric module, a plurality of thermoelectric elements (Peltier elements) are arranged side by side between a pair of electrode plates, and the thermoelectric elements are joined to a joining electrode provided on each electrode plate. Are electrically connected in series and P-type thermoelectric elements and N-type thermoelectric elements are alternately connected, and these thermoelectric elements are connected and arranged so as to be thermally parallel, and one of the electrode plates is energized when energized. The endothermic side,
The other electrode plate acts as the heat radiation side.

For this reason, it is necessary to provide the electrode plate with bonding electrodes connected in a pattern capable of forming a circuit for the above-described electrical connection. The bonding electrodes in the pattern here are required. The arrangement of is divided into pieces. At this time, there is no problem if the electrode plate can be formed as a bonding electrode print pattern on the substrate, but this cannot exhibit the performance as a thermoelectric module, and it is actually manufactured from a copper plate or the like. An electrode plate is formed by arranging a large number of small bonding electrodes at predetermined positions with a gap and bonding them to a substrate.

[0004]

Therefore, it takes a lot of time to dispose each bonding electrode at a predetermined position, and the cost required for manufacturing the electrode plate having the bonding electrode is high.
It was difficult to improve the mounting density in terms of the positioning accuracy of the bonding electrodes. The present invention has been made in view of the above points, and an object of the present invention is to provide a thermoelectric module that can be easily manufactured and can obtain good performance.

[0005]

The thermoelectric module according to the present invention is composed of a conductive metal plate provided with a large number of bonding electrodes to which thermoelectric elements are bonded, and the bonding electrodes arranged in a required pattern are adjacent to each other. And a thermoelectric element, the P-type thermoelectric element and the N-type thermoelectric element are joined to the joining electrode and are alternately arranged between the two metal pattern plates. At least one of the metal pattern plates is characterized in that the gap between the bonding electrodes is filled with an insulating resin, and the bridges unnecessary for the circuit configuration are cut off while the bonding electrodes are held by the insulating resin. are doing.

The thermoelectric module according to the present invention is made of a conductive metal plate having a large number of bonding electrodes to which thermoelectric elements are bonded, and the bonding electrodes arranged in a required pattern are connected by adjacent bonding electrodes. A metal pattern plate and a thermoelectric element, and the P-type thermoelectric element and the N-type thermoelectric element are joined to the joining electrodes alternately between the two metal pattern plates, and at least one of the metal pattern plates is a ceramic. The bridge fixed on the substrate and unnecessary for the circuit configuration is characterized by being cut off while holding the bonding electrode by the ceramic substrate.

Further, the thermoelectric module according to the present invention is
The thermoelectric element is composed of a conductive metal plate having a large number of bonding electrodes to which the thermoelectric element is bonded, and a metal pattern plate in which the bonding electrodes arranged in a required pattern are connected to adjacent bonding electrodes by a bridge. The P-type thermoelectric element and the N-type thermoelectric element are joined to the joining electrode and alternately arranged between the two metal pattern plates, and one metal pattern plate is filled with an insulating resin in the space between the joining electrodes. The other metal pattern plate is fixed on the ceramic substrate, and the bridge unnecessary for the circuit configuration is cut off while holding the bonding electrode by the insulating resin or the ceramic substrate. There is.

In any of the thermoelectric modules, the P-type thermoelectric element and the N-type thermoelectric element are arranged in a row in a direction intersecting with the electrical connection direction of the mutual bonding electrodes of the metal pattern plates. It is preferable that rows of P-type thermoelectric elements and rows of N-type thermoelectric elements are alternately arranged. The thermoelectric elements on each row are preferably cut out from a rod-shaped thermoelectric element material.

It is also preferable that the total number of rows of the P-type thermoelectric element and the N-type thermoelectric element is odd, and in particular, if the rows of the P-type thermoelectric element are located at both ends of the alternating row having the odd total number, the cost is increased. Will be advantageous. Then, the thermoelectric elements in both rows of the alternate row may be joined to the joining electrodes provided at double the intervals of the other rows.

The bridge in the metal pattern plate is composed of an electrical connection bridge and a mechanical connection dedicated bridge to be cut, and a plurality of bridge rows in which a plurality of mechanical connection dedicated bridges in the metal pattern plate are linearly arranged. It is also preferable that the plurality of bridges for electrical connection are arranged parallel to each other and arranged in an array crossing the bridges.

It is also preferable that one metal pattern plate and the other metal pattern plate have a mirror image relationship.
The P-type or N-type thermoelectric element joined to the joining electrode located at the end of the bridge row of the plurality of electrical connection bridges,
The N-type or P-type thermoelectric element is preferably connected to the N-type or P-type thermoelectric element by an electrical connection bridge that extends in a different direction from the electrical connection bridge in the bridge array and has a different length.

As the thermoelectric element, an element body made of Bi-Te-Sb-Se and an Ni layer and a Mo layer provided on the joint surface to be joined to the joint electrode can be preferably used. In this case, it is preferable that the Ni layer has a thickness of 1 μm or more and the Mo layer has a thickness of 1 μm or less. A layer made of a material selected from Sn, Bi, Ag, and Au may be further laminated on the bonding surface. A copper layer may be provided on the bonding surface to be bonded to the bonding electrode of the thermoelectric element.

It is also preferable to provide a seal frame for sealing the thermoelectric element arrangement portion between both metal pattern plates. In this case, it is advisable to integrally provide each metal pattern plate with an outer peripheral electrode that surrounds the arrangement pattern portion of the bonding electrodes, and to join both ends of the cylindrical sealing frame to the outer peripheral electrode. It is advisable to provide a plating layer on the surface.

The seal frame for sealing the thermoelectric element arrangement portion between the two metal pattern plates may be provided in the resin portion provided on the metal pattern plates. The terminal portion provided on the metal pattern plate is preferably located on the outer peripheral side of the seal frame. It is also possible to fix the metal pattern plates on both sides of the ceramic substrate and arrange the thermoelectric elements between the both metal pattern plates and the metal pattern plates facing each other. In this case, the metal pattern plate facing the metal pattern plate on the ceramic substrate may be one in which the gap between the bonding electrodes is filled with an insulating resin, and at this time, the resin portion is provided with a seal frame, It is also possible to adopt a configuration in which the resin substrate holds the ceramic substrate.

The heat radiating member or the heat absorbing member may be integrally formed with the resin portion made of the filled resin, or the ceramic substrate may be the heat radiating member or the heat absorbing member.

[0016]

BEST MODE FOR CARRYING OUT THE INVENTION An example of an embodiment of the present invention will be described. The thermoelectric module M shown in FIGS.
A large number of thermoelectric elements 1 which are Peltier elements are arranged between a pair of electrode plates 2 and 2, and a P-type thermoelectric element 1 and an N-type thermoelectric element 1 are provided on opposing surfaces of the electrode plates 2 and 2, respectively. By alternately connecting the electrodes 30,
All the thermoelectric elements 1 are electrically connected in series and thermally in parallel, and both ends of the series circuit composed of the bonding electrode 30 in the electrode plate 2 and the thermoelectric element 1 face each other. It is formed on the surface and is connected to the lead wires 38, 38 through the terminal portions 36, 36 for external connection. A cylindrical seal frame 4 is also arranged between the two electrode plates 2 and 2, and both ends of the electrode plate 2 are
The arrangement space of the thermoelectric elements 1 is sealed by the seal frame 4 and the electrode plates 2 and 2 which are joined to the above-mentioned 2 and surround the arrangement portion of all the thermoelectric elements 1.

Here, the thermoelectric elements 1 are arranged in a grid pattern as is clear from FIG. 1, but in the row (vertical direction) in FIG. 1, as shown in FIG. Type thermoelectric elements 1 and N type thermoelectric elements 1 are alternately arranged, and in the row (horizontal direction) in FIG. 1, as shown in FIG. 3, only N type thermoelectric elements 1 or P type thermoelectric elements are provided. The arrangement is determined so that only 1 is lined up.

The arrangement of the P-type thermoelectric element 1 and the N-type thermoelectric element 1 is made in this way, as described below, rather than individually joining each thermoelectric element 1 to the joining electrode 30. After the rod-shaped P-type thermoelectric element material and the N-type thermoelectric element material are attached so as to straddle the plurality of bonding electrodes 30, respectively, the rod-shaped thermoelectric element material is cut and separated into the thermoelectric elements 1 on each bonding electrode 30. Because it is.

The thermoelectric module M will be described according to its manufacturing procedure. First, the electrode plate 2 will be described. In the electrode plate 2 used here, the metal pattern plate 3 having the bonding electrode 30 is provided on the ceramic substrate 20.
What is bonded to the surface of. 4 to 7 show the metal pattern plate 3 before being joined to the ceramic substrate 20.
Is shown. The bonding electrodes 30 are connected to each other by a bridge 32 dedicated to mechanical connection in each row (lateral direction),
Every other column (vertical direction) is connected by the electrical connection bridges 31, and in adjacent rows, the positions of the electrical connection bridges 31 are shifted to have a substantially lattice-like pattern. All the junction electrodes 30 are integrally connected by these bridges 31 and 32. Note that, due to the electrical connection pattern of the thermoelectric element 1, the bonding electrodes
Are thinned out, and an electrical connection bridge 31 extends in the lateral direction.

Here, the above-mentioned both bridges 31 and 32 are shown in FIG.
As shown in FIG. 3, the thickness is less than half of the thickness of the bonding electrode 30 portion, and the bridge 32 dedicated for mechanical connection is used.
Is provided on the surface side of the bonding electrode 30 to which the thermoelectric element 1 is bonded, the electrical connection bridge 31 is provided on the back surface side, and the surface of the bonding electrode 30 and the bridge 3 dedicated to mechanical connection are provided.
The two surfaces are flush with each other, and the back surface of the bonding electrode 30 and the back surface of the electrical connection bridge 31 are flush with each other. Further, the bridge 32 dedicated to mechanical connection has a small thickness as described above, and in addition to having a hole 33 or a groove, its cross-sectional area is reduced.

The electrical connection bridge 31 is for alternately connecting the P-type thermoelectric element 1 and the N-type thermoelectric element 1, while the mechanical connection dedicated bridge 32 is provided.
Is for maintaining the position of each bonding electrode 30 in a state before being bonded to the substrate 20 and is not involved in the electrical connection between the thermoelectric elements 1, and is bonded to the substrate 20. It is unnecessary after the positions of the respective bonding electrodes 30 are kept by the substrate 20, and therefore the bridge 32 dedicated to mechanical connection is cut off after the metal pattern plate 3 is bonded to the substrate 20. Is.

Further, the metal pattern plate 3 is integrally provided with an outer peripheral electrode 35 surrounding all the junction electrodes 30 integrally connected by the electrical connection bridge 31 and the mechanical connection dedicated bridge 32, and the outside of the outer peripheral electrode 35. Further, the external connection terminal portion 36 and the sensor connection terminal portion 37 are integrally provided. And the bonding electrodes 30, 30 located at the left and right ends of every other row.
The outer peripheral electrode 35 and the outer peripheral electrode 35 are connected by a narrow mechanical connection dedicated bridge 32, and the joint electrode 30 at one corner is connected to the terminal portion 36 via the electrical connecting bridge 31 and the outer peripheral electrode 35. There is.

The joining electrodes 30 are laterally connected to each other by the bridge 32 exclusively for mechanical connection as described above. It is divided into a plurality of blocks without being connected by the special connection dedicated bridge 32. This is to prevent the warp by absorbing the thermal stress at the time of joining to the substrate 20, similarly to the case where the hole 33 is provided in the mechanical connection bridge 32 to reduce the cross-sectional area. In addition, the metal pattern plate 3 made of a conductive metal plate such as copper or a copper alloy is formed of one sheet in order to make the heights of all the bonding electrodes 30 uniform so that the thermoelectric elements 1 can be bonded without a gap. The metal plate is etched as shown in the figure, and both bridges 31 and 32 are also formed by half etching from the front and back of the metal plate, but other processing methods, for example, in a softened state by heating. It may be formed by press working, punching, or heating and pressurizing the front and back punching patterns in a deoxidized state to integrate them. In any case, Ni plating for preventing oxidation and Sn, Au plating for improving solder wettability are preferably provided.

The metal pattern plate 3 is shown in FIG.
As shown in FIG. 3, the electrode plate 2 is formed by being bonded and fixed to the surface of a ceramic substrate 20 having an insulating property such as alumina and beryllia and having a good thermal conductivity. At this time, the back surface of each bonding electrode 30 and the bridge 31 for electrical connection
Of the outer peripheral electrode 35, the rear surfaces of the outer peripheral electrodes 35, and the rear surfaces of the terminal portions 36 and 37 are contact-bonded to the substrate 20, and
2 is in a state of floating from the surface of the substrate 20.

When the substrate 20 is alumina and the metal pattern plate 3 is a copper plate, a joining method by forming a eutectic crystal called a DBC method can be preferably used for the above joining. Since the metal pattern plate 3 has a high temperature of 1000 ° C. or higher at the time of joining, the hardness is lowered and the thermoelectric element 1 is softly supported, so that an effect of stress relaxation on the thermoelectric element 1 can be expected. is there. By the way, since it is usually used with a strain of about 1%, the stress of copper at this time has been reduced to nearly 1/2 of that before refining. This is practically indicated by a material with a Young's modulus of 1/2. Is almost equal to. Since the temperature is as described above, the difference in the coefficient of thermal expansion between the metal pattern plate 3 and the substrate 20 causes the substrate 20 to warp after the joining. This warp is reduced. The connection between the metal pattern plate 3 and the substrate 20 is D
The method is not limited to the BC method and may be joined by brazing or the like.

Next, the bonding electrode 3 of one electrode plate 2
At 0, the rod-shaped P-type thermoelectric element material 1a and the rod-shaped N-type thermoelectric element material 1b are joined. At this time, each row of the bonding electrodes 30 is shown in FIG.
As shown in 0, both thermoelectric element materials 1a and 1b are alternately joined. Soldering is suitable for joining, and for this reason, it is preferable to form electrodes on the joining surfaces of the thermoelectric element materials 1a and 1b by plating or vapor deposition.

As shown in FIG. 11, the thermoelectric element materials 1a and 1b have a width X which is the same as or slightly smaller than the width Y of the bonding electrode 30. This is for avoiding performance deterioration by ensuring that the amount of heat generated in the thermoelectric element 1 can be released to the substrate 20 side through the bonding electrode 30,
This is because if the width X of the thermoelectric element 1 is larger than the width of the bonding electrode Y, thermal fatigue occurs in the portion of the thermoelectric element 1 that is not in contact with the bonding electrode 30 and element destruction occurs.

The thermoelectric element material 1a and the thermoelectric element material 1b do not have to have the same width. Since the material characteristics of the P-type thermoelectric element 1 and the N-type thermoelectric element 1 cannot be perfectly matched, changing the widths of both thermoelectric element materials 1a and 1b is effective for obtaining the most efficient state. It is a policy. The heights of both thermoelectric element materials 1a and 1b may be different. In this case, the height can be changed by changing the height of the bonding electrode 30 depending on the row.

Thermoelectric element materials 1a and 1b on one substrate 20
When the joint mounting is completed, then the rod-shaped thermoelectric element material 1
Cut a and 1b. This cutting is performed using a grindstone (dicing saw) 15 as shown in FIGS. 12 and 13, for example. In the embodiment shown here, the arrangement pattern of the bonding electrodes 30 is determined so that the cut portions of the thermoelectric element materials 1a and 1b are arranged in a straight line, and all the thermoelectric element materials 1a and 1b are collected together. Since the thermoelectric elements 1 are left individually separated on each of the bonding electrodes 30 by cutting in a straight line, the cutting is easy, and as shown in the drawing, a plurality of grindstones 15 are used. The time required for the cutting work can be shortened by collectively cutting the necessary portions. Cutting the rod-shaped thermoelectric element materials 1a and 1b after joining them also makes it possible to align the cleavage planes of the thermoelectric elements 1 and reduce variations in durability.

Further, here, when cutting the thermoelectric element materials 1a and 1b, as is apparent from FIG. 13, the mechanical connection bridge 32 is also cut at the same time.
That is, the thermoelectric element materials 1a and 1b are cut by cutting the bridge 32 for mechanical connection located below the cutting point. Mechanical connection dedicated bridge 32
Is in a state of being floated from the substrate 20, and the peripheral electrode 35 and the electrical connection bridge 31 are so thin that they are closer to the substrate 20 side. The above cutting can be performed without inviting the peripheral electrodes 35 or cutting the electric connection bridges 31 on both ends of the row.

In the rows at both ends, the bonding electrodes 30 are thinned out as described above, and in the other rows, the bonding electrodes 30 are thinned.
The bridge 31 for electrical connection in which the portion where is located is thin
The thermoelectric element 1 remains only on the bonding electrode 30 and the portion above the electrical connection bridge 31 of the thermoelectric element material 1a is removed by the above cutting.

FIG. 14 shows a state after the cutting work is performed in this manner, and FIG. 15 shows a cutout portion hatched. In the left-right direction of the bonding electrode 30 in the drawing, it is completely separated only by connecting the bonding electrodes 30 in the central portion of the row at one end with the bridge 31 for electrical connection, and is also separated from the outer peripheral electrode 35. The connection is made only by the electrical connection bridge 31 for connection with the terminal portion 36. At the time of the above cutting, the terminal portion 36 and the terminal portion 37 are separated from each other and the outer peripheral electrode 35 and the terminal portion 37 are separated from each other. Further, the electrical connection bridge 31 provided in the terminal portions 36, 37, that is, the thin portion close to the back surface side of the metal pattern plate 3, has the terminal portion 36, which is formed to have substantially the same thickness as the bonding electrode 30 portion. It is provided to form a passage portion of the grindstone 15 in 37, and for this purpose, it is provided in the same arrangement as the mechanical connection dedicated bridge 32 connecting the bonding electrode 30. Therefore, it also serves as a guideline for cutting lines.

After joining the thermoelectric element materials 1a and 1b, only the thermoelectric element materials 1a and 1b may be cut first, and then the mechanical connection bridge 32 may be cut. In this case, it is possible to use cutting members suitable for cutting the thermoelectric element materials 1a and 1b and the bridge 32 for mechanical connection, respectively, and by using cutting members having different widths.
And the width of the bonding electrode 1 can be set to preferable values.

Metal pattern plate 3 of electrode plate 2
It is also possible to cut the bridge 32 dedicated to mechanical connection in advance in advance, and then to join and cut the thermoelectric element materials 1a and 1b. Also in this case, the thermoelectric element materials 1a and 1b can be cut without applying the cutting load of the mechanical connection bridge 32, and the thermoelectric element materials 1a and 1b can be cut accurately. Of course, from the standpoint of cutting work, it is most preferable to simultaneously cut the mechanical connection bridge 32 when cutting the thermoelectric element materials 1a and 1b.

The arrangement of the bonding electrodes 30 and the electrical connection pattern by the electrical connection bridge 31 are determined so that the cutting line becomes a straight line, but the circuit pattern has various settings as described later. It is not necessary that the cutting line be straight, as well as possible. However, making the cutting lines straight is the best in terms of cutting workability, and it is also easy to cut multiple cutting lines at the same time to reduce the time required for cutting. You will be able to respond. Instead of the grindstone 15, a laser or a high-pressure water jet may be used for cutting.

Regarding the other electrode plate 2, the same metal pattern plate 3 of the electrode plate 2 is bonded to the substrate 20, and the bridge 32 dedicated for mechanical connection is used.
Disconnect. FIG. 16 shows the electrode plate 2 after this cutting. The cut location is the same as the location where the one electrode plate 3 was cut. When the cutting is completed, as shown in FIG. 17, the rectangular tubular seal frame 4 is joined and attached to one electrode plate 2, and then the other electrode plate 2 is covered to cover the other electrode plate 2. The joining electrode 30 on the side and the thermoelectric element 1 and the seal frame 4 and the other electrode plate 2 are joined. The seal frame 4 is for sealing the arrangement portion of the thermoelectric element 1 as described above, and the outer peripheral electrodes 35 whose both open edges are closed loops in the metal pattern plates 3 and 3 of the electrode plates 2 and 2, respectively.
By mechanically and electrically joining the parts, the arrangement space of all the thermoelectric elements 1 is sealed together with the electrode plates 2 and 2. Since the outer peripheral electrode 35 that is a closed loop is joined and the terminal portion 36 is pulled out through the outer peripheral electrode 35, the power supply path to the thermoelectric element 1 can be secured while maintaining the sealed state. It is a thing. Peripheral electrode 3
In the case of arranging the inner side of the outer peripheral electrode 5, a groove is provided in the same portion of the seal frame 4 for the remaining portion of the mechanical connection bridge 32 extending inward from the outer peripheral electrode 35 to avoid this.

Here, the seal frame 4 and the outer peripheral electrode 35 are joined to each other in advance by using copper, nickel, tin at the opening edge portions at both ends to be joined to the outer peripheral electrode 35 in the non-metallic seal frame 4 as shown in FIG. A metal film 44 such as is formed by plating or thermal spraying, and then soldered to the outer peripheral electrode 48.
It is joined by brazing. This is for avoiding the use of an adhesive that easily allows the entry of moisture in the long term and improving the moisture resistance. Since each outer peripheral electrode 35 is connected to the terminal portion 36, the metal films 44 are individually provided on the opening edges at both ends so as not to be electrically connected. In addition, the seal frame 4 has a cross-sectional shape as shown in FIGS. 18 and 19 having a portion that directly contacts the electrode plate 2 inside the outer peripheral electrode 35, thereby regulating the distance between the electrode plates 2 and 2. Is preferable. In this case, since it is possible to see the soldered or brazed portion, it is easy to determine the quality. Metal film 4
It is preferable to use the adhesive agent 49 in combination for preventing moisture invasion from a portion where 4 is not provided or from cracks during solder fatigue. The seal frame 4 here is the electrode plate 2,
It also bears the load in the opposite direction of 2.

The joining electrode 30 on the other electrode plate 2 side and the thermoelectric element 1 are joined at the same time as the joining of the seal frame 4 and the other electrode plate 2, which is also preferable in the following point. Will be things. That is, when the distance between the electrode plates 2 and 2 is regulated by the seal frame 4, the height variation of the thermoelectric element 1 is adjusted by the thickness of the solder for soldering, and the load applied to the electrode plate 2 is sealed. This is because the rigidity of the frame 4 and the rigidity of the thermoelectric element 1 are shared, and the load applied to the thermoelectric element 1 can be reduced.

In the thermoelectric module thus constructed, all the thermoelectric elements 1 are electrically connected in series by the joining electrodes 30 on the metal pattern plates 3 of both electrode plates 2 and 2 and the electrical connection bridge 31. Further, a set of the P-type thermoelectric element 1 and the N-type thermoelectric element 1 is thermally connected in parallel, and the terminal portion 36 on one electrode plate 2 side and the terminal portion on the other electrode plate 2 side are connected. 36 to the power source.

Here, the thermoelectric element 1 is composed of the top row and the bottom row.
The thinned state is that both electrode plates 2, 2
This is to allow the same metal pattern plate 3 to be used in the same manner, and at the same time to avoid continuous connection between the P-type thermoelectric elements 1 or between the N-type thermoelectric elements 1. At the center of the row at one end, however, the two P-type thermoelectric elements 1 and 1 are continuously connected. Continuation of such thermoelectric elements 1 of the same type causes a slight decrease in efficiency. However, the reason for doing so is that the bonding electrodes 30 and the thermoelectric elements 1 have the same number of rows as described above. In order to enable the metal pattern plate 3 of FIG. 2 to be used for both electrode plates 2 and 2 and to allow the metal pattern plate 3 to be divided into two blocks on the left and right sides for the above-mentioned thermal stress relaxation. is there. From the point of impact load, it may be possible not to perform thinning at all.

The number of rows of the bonding electrodes 30 and the thermoelectric elements 1 is odd because the P-type thermoelectric elements 1 are arranged in the rows at both ends. When the P-type thermoelectric element 1 and the N-type thermoelectric element 1 are compared, the P-type thermoelectric element 1 has better characteristics and is easier to manage, and the cost is lower. Therefore, the N-type thermoelectric element material 1b is
It can be reduced by one less than the die thermoelectric element material 1a, and even though the rod-shaped thermoelectric element material 1a is used in the rows at both ends as described above, there are many cutout portions because the thermoelectric element 1 is thinned out and arranged. In view of this, the P-type ones are arranged in the rows at both ends.

As the electrode plate 2, in addition to the one having the ceramic-based substrate 20, the one shown in FIGS. 20 and 21 in which the gap between the bonding electrodes 30 is filled with the insulating resin 25 having good thermal characteristics is shown in FIG. It can be used as 2. The electrode plate 2 of this type, which can be obtained by injection molding or casting, has a back surface which is flush with the back surface of the bonding electrode 30 or has a concave surface so that the back surface of the bonding electrode 30 can directly radiate or absorb heat. Since it can be brought into contact with the heat-dissipating material, the heat-dissipating property is better than that of a ceramic material. On the front side of the metal pattern plate 3, the insulating resin 25 may be slightly higher than the surface of the bonding electrode 30. It is possible to prevent a short circuit with another electrode during soldering. 20 and 2
When using the electrode plate 2 shown in FIG. 1, the bridge 32 for mechanical connection between the rod-shaped thermoelectric element materials 1a and 1b and the metal pattern plate 3 is cut by cutting the insulating resin 25 at the same time.

The metal pattern plate 3 of the above type
Then, it is preferable that the ratio of the insulating resin 25 to the metal pattern plate 3 is substantially the same on the front and back sides from the viewpoint of preventing warpage, and it has a chemical bonding property with the metal pattern plate 3 and thermal expansion. A material having a coefficient similar to that of the metal pattern plate 3 is preferable. This is because the permeation of water vapor can be prevented and a gap is less likely to occur. Further, it is preferable that the material has a Young's modulus sufficiently lower than that of the metal pattern plate 3. To satisfy these conditions, if the metal pattern plate 3 is copper or a copper alloy, it is preferable to add an epoxy resin, especially SiO ₂ .
And it goes without saying that a thermoelectric module M using two electrode plates 2 shown in FIGS. 20 and 21 may be used.

Bonding electrode 3 of two electrode plates 2 and 2
22 and 23 show examples of circuit patterns for connecting the thermoelectric elements 1 and 1 by 0 and 30. FIG. 22A shows a circuit pattern when the above metal pattern plate 3 is used. As is apparent from the drawing, various patterns can be configured including the arrangement of the terminal portion 36. A pattern as shown in FIG. 24 is also possible. The connection by the two lines in FIG. 24 shows the connection by one electrode plate 2, and the connection by the one line shows the connection by the other electrode plate 2.

The bonding of the thermoelectric element 1 containing Bi-Te-Sb-Se as the main component to the bonding electrode 30 is performed by soldering as described above. The bonding surface on the thermoelectric element 1 side is shown in FIG. It is preferable to provide the Mo layer 17 and the Ni layer 18 as barrier layers to form the electrode 11 in terms of preventing diffusion. Further, in the structure shown in FIG. 25, Sn,
A layer made of a material selected from Bi, Ag, and Au, for example, a Sn + Bi layer 19 is provided. This layer 19 is N
This is to prevent oxidation of the i layer 18 and improve solderability. The Ni layer 18 has a thickness of 1 μm or more, and the Mo layer 17
Is preferably thinner than this. For example Mo
Layer 17 is 0.2 μm, Ni layer 18 is 2 μm, Sn + Bi
The layer 19 has a thickness of 2 μm. Instead of the Sn + Bi layer 19, a copper layer may be provided on the Sn + Bi layer 19.

The bonding electrodes 30 are used as the thermoelectric element materials 1a and 1b.
I used the entire length of the row of
As shown in, a plurality of thermoelectric element materials 1a,
1b may be used. Thermoelectric element materials 1a, 1b
Since the material having a short length can be used as the material, the material utilization efficiency of the thermoelectric element materials 1a and 1b is increased, and the thermoelectric element materials 1a and 1b due to the warp of the electrode plate 2 after being bonded to the bonding electrode 30 Can reduce the stress.

A plurality of electrical connection bridges 31 for connecting the bonding electrodes 30 and the outer peripheral electrodes 35 on the metal pattern plate 3 may be provided. Different bonding electrodes 30
Are connected to the outer peripheral electrode 35 by the bridge 31 for electrical connection. Of course, in the end, the other electrical connection bridges 31 are cut off so that only one of the junction electrodes 31 is connected to the outer peripheral electrode 35 by any one of the electrical connection bridges 31, Depending on which electrical connection bridge 31 is left, even if the same metal pattern plate 3 is used, one having a different number of mounted thermoelectric elements 1, that is, one having a different performance of the thermoelectric module can be selected and obtained.

However, if the number of connection points between the bonding electrode 30 and the outer peripheral electrode 35 by the electrical connection bridge 35 increases, a warp is likely to occur at the time of bonding to the substrate 20, so that FIGS. Shown metal pattern plate 3
In some cases, some bonding electrodes 30 to outer peripheral electrodes 35
The extension piece is extended toward, and depending on which extension piece is connected to the outer peripheral electrode 35, the joint electrode 30 (the joint electrode 30 that is one end of the circuit pattern) connected to the terminal portion 36 through the outer peripheral electrode 35 is selected. I am able to do it.

The thermoelectric module M as described above is shown in FIG.
Alternatively, as shown in FIG. 28, the heat absorbing member 5 is attached to the outer surface of the electrode plate 2 on one side, and the heat radiating member 6 is attached to the outer surface of the electrode plate 2 on the other side for practical use. At this time, for thermal coupling between the electrode plate 2 and the heat absorbing member 5 or the heat radiating member 6, the thermoelectric module M is sandwiched between the heat absorbing member 5 and the heat radiating member 6 to apply a required load to the heat coupling surface. Although it is added, it is preferable to apply the load by a spring 7 such as a coil spring or a disc spring as shown in the figure. 7 in the figure
0 is a screw connecting the heat absorbing member 5 and the heat radiating member 6,
The spring 7 is arranged between the head of the screw 70 and the member 5 into which the screw 70 is inserted. The screws 70 and 71 are made of a material having a low thermal conductivity.

FIG. 29 shows a specific heat absorbing member 5 and heat radiating member 6. The heat dissipation member 6 has a large number of heat dissipation fins 60. In the figure, 71 is a screw for connecting both members 5 and 6 and also for mounting this block. The area of the contact surfaces of the heat absorbing member 5 and the heat radiating member 6 with the thermoelectric module M is made smaller than the surface area of the thermoelectric module M, but this is to reduce heat leakage.

The heat absorbing member 5 and the heat radiating member 6 are made of aluminum or its alloy, which has a high thermal conductivity and is easy to process, and its surface is provided with an alumite layer for corrosion prevention and insulation. . It may be formed of aluminum containing carbon fiber or a copper alloy. The surface of the heat absorbing member 5 is a screw 7 to serve as a mounting surface for a member to be cooled.
The heads of 0 and 71 do not protrude from this surface.

Of the above two types of electrode plates 2, the substrate 2
In the case where the metal pattern plate 3 is joined to the 0 surface,
It is possible to easily deal with the thermoelectric module M being configured in multiple stages. In the one shown in FIG. 30, the metal pattern plates 3 bonded to the upper and lower surfaces of the substrate 20 are used as the central electrode plate 2, and the upper and lower surfaces of the electrode plate 2 are bonded and cut with the thermoelectric element materials 1a and 1b. Then, the other two electrode plates 2 and 2 are stacked above and below the central electrode plate 2. Thermoelectric element materials 1a, 1
The bonding of b is performed on the bonding electrodes 30 of the metal pattern plates 3 of the upper and lower electrode plates 2, and the thermoelectric element materials 1a,
After cutting 1b, metal pattern plates 3,
It goes without saying that the central electrode plate 2 to which 3 is bonded may be interposed between them. Since the number of thermoelectric elements 1 on the heat absorption side is reduced, the same metal as that shown in FIGS. 4 to 7 which is bonded to the lower surface of the central substrate 20 and the upper surface of the lower substrate 20 is used here as well. Metal pattern plate 3 that is about half the size of pattern plate 3
Are bonded to the lower surface of the upper substrate 20 and the upper surface of the central substrate 20. In the multi-stage structure shown in FIG. 31, the upper and lower electrode plates 2 are composed of the metal pattern plate 3 and the insulating resin 25, and the sealing frame 4 is integrally formed of the insulating resin 25. Shows. Since the separate seal frame 4 is unnecessary, the number of parts can be reduced. Of course, this structure can be applied to a non-multistage structure as long as one of the two electrode plates 2 and 2 includes the insulating resin 25 and the metal pattern plate 3.

Further, as shown in FIG. 32, in a multi-stage structure, the central electrode plate 2 may be sandwiched between the upper and lower electrode plates 2 and 2 which are integrally provided with seal frames 4 and 4, respectively. Whether the metal pattern plate 3 provided with the bonding electrodes 30 is bonded to the substrate 20 or the gap between the metal pattern plates 3 is filled with the insulating resin 25 is used as the electrode plate 2, the substrate 20 or The insulating resin 25 and the heat absorbing / radiating members 5, 6 may be integrated so that the electrode plate 2 also serves as the heat absorbing / radiating members 5, 6. That is, the metal pattern plate 3 is bonded to the heat absorbing member 5 and the heat radiating member 6. The number of parts can be reduced.

[0054]

As described above, the thermoelectric module according to the present invention is composed of a conductive metal plate having a large number of bonding electrodes to which thermoelectric elements are bonded, and the bonding electrodes adjacent to each other are arranged in a predetermined pattern. A metal pattern plate connected by a bridge to the thermoelectric element and a P-type thermoelectric element and an N element between the two metal pattern plates.
Type thermoelectric elements are joined to the joining electrodes and arranged alternately, and at least one of the metal pattern plates is filled with an insulating resin in the space between the joining electrodes, which is unnecessary in the circuit configuration. The bridge is cut while holding the bonding electrode with an insulating resin, or at least one of the metal pattern plates is fixed on the ceramic substrate. Or the metal pattern plate on one side is filled with insulating resin in the space between the bonding electrodes, and the metal pattern plate on the other side is fixed on the ceramic substrate, which is unnecessary for the circuit configuration. Since the bridge is cut while holding the bonding electrodes with insulating resin or ceramic substrate, each bonding electrode is Since it can be held by a substrate or an insulating resin in a state of being connected by a wire, and after holding it, the circuit required for cutting off unnecessary bridges is configured, so that the positioning accuracy of each bonding electrode can be made high. At the same time, it does not require positioning work for fixing to the board or filling the insulating resin, and the mounting density can be improved, and the thickness (height) of the bonding electrode can be secured at the same time. Since the height of each bonding electrode can be made uniform, a high-performance one can be obtained.

The P-type thermoelectric element and the N-type thermoelectric element are arranged in a row in a direction intersecting with the electrical connection direction of the mutual bonding electrodes of the metal pattern plates.
If the rows of the P-type thermoelectric elements and the rows of the N-type thermoelectric elements are alternately arranged in these rows, the arrangement of the P-type thermoelectric elements and the N-type thermoelectric elements becomes simple. If the thermoelectric elements on each row are each cut out from a rod-shaped thermoelectric element material, the risk of erroneous placement can be further eliminated.

When the total number of rows of P-type thermoelectric elements and N-type thermoelectric elements is odd, especially when the rows of P-type thermoelectric elements are located at both ends of an alternating row having an odd total number, N-type Since the P-type thermoelectric element is lower in cost than the thermoelectric element, it is advantageous in cost. Then, the thermoelectric elements in both rows of the alternate row may be joined to the joining electrodes provided at double the intervals of the other rows. It becomes easy to avoid connection between P-types or between N-types.

The bridge in the metal pattern plate is constituted by the bridge for electrical connection and the bridge for exclusive use of mechanical connection to be cut off, and a bridge row in which a plurality of bridges for exclusive use of mechanical connection in the metal pattern plate are linearly arranged. When a plurality of bridges for electrical connection are lined up in an array that intersects with the bridges,
Since the bridge dedicated to the mechanical connection to be excised is clarified, it is possible to surely configure the circuit by excision.

The fact that one metal pattern plate and the other metal pattern plate are in a mirror image relationship makes it possible to use the same metal pattern plate, so that the cost can be reduced. The P-type or N-type thermoelectric element joined to the joining electrode located at the end of the bridge row of the plurality of electrical connection bridges extends in a direction different from that of the electrical connection bridge in the bridge row and has a length. It is preferable to connect to the N-type or P-type thermoelectric element by different electrical connection bridges. It is easy to avoid connecting P-type or N-type thermoelectric elements.

As the thermoelectric element, an element body made of Bi-Te-Sb-Se and a Ni layer and a Mo layer provided on the joint surface to be joined to the joint electrode are used. When the thickness is 1 μm or more and the Mo layer has a thickness of 1 μm or less, favorable results can be obtained in terms of preventing diffusion. If a layer made of a material selected from Sn, Bi, Ag, and Au is further laminated on the bonding surface, or if a copper layer is provided on the bonding surface bonded to the bonding electrode of the thermoelectric element, the bonding electrode The joining can be performed reliably and easily.

It is also preferable to provide a seal frame for sealing the thermoelectric element arrangement portion between both metal pattern plates from the viewpoint of improving durability. In this case, if each metal pattern plate is integrally provided with an outer peripheral electrode that surrounds the arrayed pattern portion of the bonding electrodes, and both ends of the cylindrical seal frame are bonded to the outer peripheral electrodes, a preferable seal can be obtained, and the seal frame If the plating layers are provided on both end faces to be joined to the outer peripheral electrode, the seal frame can be fixed by joining by soldering or the like.

The seal frame for sealing the thermoelectric element arrangement portion between both metal pattern plates may be provided in the resin portion provided on the metal pattern plates. Since it is not necessary to provide a separate seal frame, the number of parts can be reduced. By locating the terminal portion provided on the metal pattern plate on the outer peripheral side of the seal frame, the connection with the power source becomes easy.

Further, since it is possible to fix the metal pattern plates on both sides of the ceramic substrate and to dispose the thermoelectric elements between the metal pattern plates and the metal pattern plates respectively facing them, the multi-stage module can be arranged. Can also be easily obtained. In this case, the metal pattern plate facing the metal pattern plate on the ceramic substrate may be one in which the gap between the bonding electrodes is filled with an insulating resin, and at this time, the resin portion is provided with a seal frame, It is also possible to adopt a configuration in which the resin substrate holds the ceramic substrate.

A heat dissipation member or a heat absorbing member may be integrally formed of a resin portion made of filled resin, or the ceramic substrate may be a heat dissipation member or a heat absorbing member.

[Brief description of drawings]

FIG. 1 is a cutaway plan view showing an example of an embodiment of the present invention.

FIG. 2 is a vertical sectional view of the above.

FIG. 3 is a transverse sectional view of the above.

FIG. 4 is a plan view of a metal pattern plate used in the above.

FIG. 5 is a perspective view of a metal pattern plate used in the above.

FIG. 6 is a rear view of the metal pattern plate used in the above.

FIG. 7 is a perspective view showing the back side of the metal pattern plate used in the above.

FIG. 8 shows a cross section of a metal pattern plate used in the above, wherein (a) is a horizontal cross-sectional view and (b) is a vertical cross-sectional view.

FIG. 9 is a perspective view showing a state before processing of the electrode plate used in the above.

FIG. 10 is a perspective view after joining the thermoelectric element materials of the electrode plate used in the above.

FIG. 11 is a cross-sectional view of the above-mentioned bonding electrode and a thermoelectric element material.

FIG. 12 is a perspective view showing cutting of the above thermoelectric element material.

FIG. 13 is a cross-sectional view showing cutting of the thermoelectric element material of the above.

FIG. 14 is a perspective view showing a state after cutting the thermoelectric element material of the same.

FIG. 15 is a plan view showing a cut portion of the thermoelectric element material of the above.

FIG. 16 is a perspective view of the other electrode plate.

FIG. 17 is a perspective view showing a mounting state of the above seal frame.

FIG. 18 is a perspective view showing the same seal frame as above, and FIG. 18 (b) is a sectional view.

FIG. 19 is an enlarged cross-sectional view showing a fixed portion of the above seal frame.

FIG. 20 is a perspective view of another electrode plate.

FIG. 21 is a perspective view showing the back side of the above electrode plate.

22A to 22F are explanatory diagrams of examples of circuit patterns.

23A to 23F are explanatory diagrams of circuit pattern examples.

FIG. 24 is an explanatory diagram of another circuit pattern.

FIG. 25 is a cross-sectional view of the above thermoelectric element material.

FIG. 26 is a perspective view showing another example of joining the thermoelectric element material to the electrode plate.

FIG. 27 is a cross-sectional view showing a mounting example of a heat absorbing member and a heat radiating member.

FIG. 28 is a cross-sectional view showing another mounting example of the heat absorbing member and the heat radiating member.

FIG. 29 is a cross-sectional view showing another mounting example of the heat absorbing member and the heat radiating member.

FIG. 30 is an exploded perspective view of a multi-stage module.

FIG. 31 is a cross-sectional view of another example of the above.

FIG. 32 is a cross-sectional view of another example of the same.

[Explanation of symbols]

 M Thermoelectric Module 1 Thermoelectric Element 2 Electrode Plate 3 Metal Pattern Plate 20 Substrate 30 Bonding Electrode 31 Bridge for Electrical Connection 32 Bridge for Mechanical Connection

─────────────────────────────────────────────────── ───

[Procedure amendment]

[Submission date] June 3, 1996

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] Claim 14

[Correction method] Change

[Correction contents]

[Procedure amendment 2]

[Document name to be amended] Statement

[Correction target item name] 0016

[Correction method] Change

[Correction contents]

[0016]

BEST MODE FOR CARRYING OUT THE INVENTION An example of an embodiment of the present invention will be described . The thermoelectric module M shown in FIGS .
A large number of thermoelectric elements 1 which are Peltier elements are arranged between a pair of electrode plates 2 and 2, and a P-type thermoelectric element 1 and an N-type thermoelectric element 1 are provided on opposing surfaces of the electrode plates 2 and 2, respectively. By alternately connecting the electrodes 30,
All the thermoelectric elements 1 are electrically connected in series and thermally in parallel, and both ends of the series circuit composed of the bonding electrode 30 in the electrode plate 2 and the thermoelectric element 1 face each other. It is formed on the surface and is connected to the lead wires 38, 38 through the terminal portions 36, 36 for external connection. A cylindrical seal frame 4 is also arranged between the two electrode plates 2 and 2, and both ends of the electrode plate 2 are
The arrangement space of the thermoelectric elements 1 is sealed by the seal frame 4 and the electrode plates 2 and 2 which are joined to the above-mentioned 2 and surround the arrangement portion of all the thermoelectric elements 1.

[Procedure 3]

[Document name to be amended] Statement

[Correction target item name] 0036

[Correction method] Change

[Correction contents]

Regarding the other electrode plate 2, the same metal pattern plate 3 of the electrode plate 2 is bonded to the substrate 20, and the bridge 32 dedicated for mechanical connection is used.
Disconnect. FIG. 16 shows the electrode plate 2 after this cutting. The cut location is the same as the location where the one electrode plate 2 was cut. When the cutting is completed, as shown in FIG. 17, the rectangular tubular seal frame 4 is joined and attached to one electrode plate 2, and then the other electrode plate 2 is covered to cover the other electrode plate 2. The joining electrode 30 on the side and the thermoelectric element 1 and the seal frame 4 and the other electrode plate 2 are joined. The seal frame 4 is for sealing the arrangement portion of the thermoelectric element 1 as described above, and the outer peripheral electrodes 35 whose both open edges are closed loops in the metal pattern plates 3 and 3 of the electrode plates 2 and 2, respectively.
By mechanically and electrically joining the parts, the arrangement space of all the thermoelectric elements 1 is sealed together with the electrode plates 2 and 2. Since the outer peripheral electrode 35 that is a closed loop is joined and the terminal portion 36 is pulled out through the outer peripheral electrode 35, the power supply path to the thermoelectric element 1 can be secured while maintaining the sealed state. It is a thing. Peripheral electrode 3
In the case of arranging the inner side of the outer peripheral electrode 5, a groove is provided in the same portion of the seal frame 4 for the remaining portion of the mechanical connection bridge 32 extending inward from the outer peripheral electrode 35 to avoid this.

[Procedure amendment 4]

[Document name to be amended] Statement

[Correction target item name] 0052

[Correction method] Change

[Correction contents]

Of the above two types of electrode plates 2, the substrate 2
In the case where the metal pattern plate 3 is joined to the 0 surface,
It is possible to easily deal with the thermoelectric module M being configured in multiple stages. In the structure shown in FIG. 30, the metal pattern plates 3 bonded to the upper and lower surfaces of the substrate 20 are used as the central electrode plate 2, and the thermoelectric element materials 1a and 1b are bonded to the upper and lower surfaces of the electrode plate 2 and cut. Then, the other two electrode plates 2 and 2 are stacked above and below the central electrode plate 2. Thermoelectric element materials 1a, 1
The bonding of b is performed on the bonding electrodes 30 of the metal pattern plates 3 of the upper and lower electrode plates 2, and the thermoelectric element materials 1a,
After cutting 1b, metal pattern plates 3,
It goes without saying that the central electrode plate 2 to which 3 is bonded may be interposed between them. Since the number of thermoelectric elements 1 on the heat absorption side is reduced, the same metal as that shown in FIGS. 4 to 7 which is bonded to the lower surface of the central substrate 20 and the upper surface of the lower substrate 20 is used here as well. Metal pattern plate 3 that is about half the size of pattern plate 3
Are bonded to the lower surface of the upper substrate 20 and the upper surface of the central substrate 20. In the multi-stage structure shown in FIG. 31, the upper and lower electrode plates 2 are composed of the metal pattern plate 3 and the insulating resin 25, and the sealing frame 4 is integrally formed of the insulating resin 25. Shows. Since the separate seal frame 4 is unnecessary, the number of parts can be reduced. Of course, this structure can be applied to a non-multistage structure as long as one of the two electrode plates 2 and 2 includes the insulating resin 25 and the metal pattern plate 3. ─────────────────────────────────────────────────── ───

[Procedure amendment]

[Submission date] August 5, 1996

[Procedure amendment 1]

[Document name to be amended] Statement

[Name of item to be corrected] Claim 12

[Correction method] Change

[Correction contents]

[Procedure amendment 2]

[Document name to be amended] Statement

[Correction target item name] 0012

[Correction method] Change

[Correction contents]

Bi-Te-Sb-Se is the main thermoelectric element.
It is possible to preferably use the element main body as a component, and the Ni layer and the Mo layer provided on the bonding surface to be bonded to the bonding electrode. In this case, the Ni layer has a thickness of 1 μm.
As described above, the Mo layer preferably has a thickness of 1 μm or less. A layer made of a material selected from Sn, Bi, Ag, and Au may be further laminated on the bonding surface. A copper layer may be provided on the bonding surface to be bonded to the bonding electrode of the thermoelectric element.

[Procedure 3]

[Document name to be amended] Statement

[Correction target item name] 0059

[Correction method] Change

[Correction contents]

Bi-Te-Sb-Se is the main thermoelectric element.
When an element body as a component and a Ni layer and a Mo layer provided on the bonding surface to be bonded to the bonding electrode are used, the Ni layer has a thickness of 1 μm or more, and the Mo layer has a thickness of 1 μm or more. When it is 1 μm or less, preferable results can be obtained in terms of preventing diffusion. Sn, Bi, Ag, Au
If a layer made of a material selected from the above is further laminated on the bonding surface, or if a copper layer is provided on the bonding surface to be bonded to the bonding electrode of the thermoelectric element, bonding with the bonding electrode can be performed reliably and easily. It will be something that can be done.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Yuri Sakai, 1048, Kadoma, Kadoma, Osaka Prefecture, Matsushita Electric Works Co., Ltd. (72) Inventor, Katsuyoshi Shimoda, 1048, Kadoma, Kadoma, Osaka Prefecture, Matsuda Electric Co., Ltd. 72) Inventor Komatsu Lighting, 1048, Kadoma, Kadoma City, Osaka Prefecture, Matsushita Electric Works Co., Ltd. (72) Inventor, Shinya Murase, 1048, Kadoma City, Kadoma City, Matsushita Electric Works, Ltd. (72) Inventor, Hiroyuki Inoue Osaka Prefecture Matsuda Electric Works Co., Ltd. 1048 Kadoma, Kadoma-shi (72) Inventor Masayuki Sagawa Matsuda Electric Works Co., Ltd. 1048, Kadoma, Kadoma-shi, Osaka Prefecture

Claims (25)

[Claims] 1. A metal pattern plate comprising a conductive metal plate provided with a large number of bonding electrodes to which thermoelectric elements are bonded, and bonding electrodes arranged in a required pattern are connected to adjacent bonding electrodes by a bridge. A thermoelectric element, and a P-type thermoelectric element and an N-type thermoelectric element are joined to a joining electrode alternately between two metal pattern plates, and at least one of the metal pattern plates has a space between the joining electrodes. The thermoelectric module is characterized in that the insulating resin is filled in, and unnecessary bridges in the circuit configuration are cut off while holding the bonding electrode by the insulating resin. 2. A metal pattern plate comprising a conductive metal plate provided with a large number of bonding electrodes to which thermoelectric elements are bonded, wherein the bonding electrodes arranged in a required pattern are connected by adjacent bonding electrodes, and a thermoelectric element. Consists of
The P-type thermoelectric element and the N-type thermoelectric element are joined to the joining electrode and alternately arranged between the two metal pattern plates, and at least one of the metal pattern plates is fixed on the ceramic substrate. The thermoelectric module characterized in that unnecessary bridges are cut off while holding the bonding electrodes by the ceramic substrate. 3. A metal pattern plate comprising a conductive metal plate provided with a large number of bonding electrodes to which thermoelectric elements are bonded, and bonding electrodes arranged in a required pattern are connected to adjacent bonding electrodes by a bridge. The thermoelectric element and the P-type thermoelectric element and the N-type thermoelectric element are bonded alternately to the bonding electrodes between the two metal pattern plates, and one metal pattern plate is provided in the space between the bonding electrodes. It is filled with insulating resin, the other metal pattern plate is fixed on the ceramic substrate, and the bridge unnecessary for the circuit configuration is cut off while holding the bonding electrode by the insulating resin or the ceramic substrate. Characteristic thermoelectric module. 4. The P-type thermoelectric element and the N-type thermoelectric element each form a row in a direction intersecting with an electrical connection direction of a bonding electrode of a metal pattern plate of each other, and these rows are of the P-type thermoelectric element. The rows and the rows of N-type thermoelectric elements are alternately arranged.
The thermoelectric module described. 5. The thermoelectric module according to claim 4, wherein the thermoelectric elements on each row are each cut out from a rod-shaped thermoelectric element material. 6. The thermoelectric module according to claim 4, wherein the total number of rows of P-type thermoelectric elements and N-type thermoelectric elements is an odd number. 7. The thermoelectric module according to claim 4, 5 or 6, wherein the rows of P-type thermoelectric elements are located at opposite ends of an alternating row having an odd total number. 8. The thermoelectric element according to claim 4, 5 or 6 or 7, characterized in that the thermoelectric elements on both ends of the alternate row are joined to the joining electrodes provided at double the intervals of the other rows. module. 9. The bridge in the metal pattern plate is composed of an electrical connection bridge and a mechanical connection dedicated bridge to be cut off, and a plurality of bridges in which a plurality of mechanical connection dedicated bridges are arranged in a straight line are parallel to each other. The thermoelectric module according to claim 1, 2 or 3, wherein a plurality of bridges for electrical connection are lined up in an array that intersects with the bridges. 10. The thermoelectric module according to claim 1, wherein one metal pattern plate and the other metal pattern plate are in a mirror image relationship. 11. A P-type or N-type thermoelectric element joined to a joining electrode located at an end of a bridge row of a plurality of electrical connection bridges has a direction different from that of the electrical connection bridges in the bridge row. 10. The thermoelectric module according to claim 9, wherein the thermoelectric module is connected to the N-type or P-type thermoelectric element by a bridge for electrical connection that extends in the same direction and has a different length. 12. The thermoelectric element comprises an element body made of Bi-Te-Sb-Se, and a Ni layer and a Mo layer provided on a joint surface to be joined to a joint electrode. The thermoelectric module according to any one of 11. 13. The thermoelectric module according to claim 12, wherein the Ni layer has a thickness of 1 μm or more, and the Mo layer has a thickness of 1 μm or less. 14. The thermoelectric module according to claim 13, wherein a layer made of a material selected from Sn, Bi, Ag, and Au is laminated on the joint surface. 15. The thermoelectric element is provided with a copper layer on a joint surface to be joined to the joint electrode.
The thermoelectric module according to any one of 1. 16. The thermoelectric module according to claim 1, further comprising a seal frame that seals a thermoelectric element arrangement portion between both metal pattern plates. 17. The metal pattern plate is integrally provided with an outer peripheral electrode surrounding an array pattern portion of the joint electrodes, and both ends of the cylindrical seal frame are joined to the outer peripheral electrodes. 16. The thermoelectric module according to item 16. 18. The sealing frame has a plating layer on both end faces joined to the outer peripheral electrode.
The thermoelectric module described. 19. The thermoelectric module according to claim 1, wherein the resin portion provided on the metal pattern plate has a seal frame for sealing the thermoelectric element arrangement portion between both metal pattern plates. 20. The thermoelectric module according to claim 16, wherein the terminal portion provided on the metal pattern plate is located on the outer peripheral side of the seal frame. 21. Metal pattern plates are fixed to both surfaces of a ceramic substrate, and thermoelectric elements are respectively arranged between these metal pattern plates and the metal pattern plates facing each other. The thermoelectric module according to claim 2 or 3. 22. The thermoelectric module according to claim 21, wherein the metal pattern plate facing the metal pattern plate on the ceramic substrate is one in which a gap between the bonding electrodes is filled with an insulating resin. 23. The thermoelectric module according to claim 22, wherein the resin portion is provided with a seal frame, and the ceramic substrate is sandwiched between the resin portions. 24. The thermoelectric module according to claim 1, wherein the heat radiation member or the heat absorption member is integrally formed of a resin portion made of filled resin. 25. The thermoelectric module according to claim 2, wherein the ceramic substrate is a heat radiating member or a heat absorbing member.