JPH09325831A - Module heat dissipation structure - Google Patents

Abstract

(57) Abstract: The present invention relates to a heat dissipation structure of a module of an electronic device, and aims to realize a heat dissipation structure having a high cooling effect corresponding to high functionality, high speed, and high density of an electronic circuit. It is an issue. According to the present invention, a heat dissipation plate (2) having a size matching the shape of a printed circuit board (1) is formed on the printed circuit board (1) by contacting a heat generating component (6) at a predetermined distance from the surface of the printed circuit board (1). To do. By this means, the number of heat radiating parts can be reduced, and therefore physical protection of the mounted parts of the printed circuit board 1 and efficient heat radiating of the heat generating parts 6 of the printed circuit board 1 with a simple structure and easy parts replacement. Provide a heat dissipation structure for a module that enables it.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat dissipation structure for a module of an electronic device, and more particularly to the realization of a heat dissipation structure having a high cooling effect by conducting heat of a heat generating part to the heat dissipation part to perform air cooling.

[0002]

2. Description of the Related Art In the conventional heat dissipation structure of a module shown in FIG. 13, in order to maintain the reliability of a heat-generating component 55 such as a semiconductor by radiating or cooling, a plurality of heat-generating components 55 are small and one heat-radiating object is used. Heat dissipation component 51 and heat generation component 55
The heat connecting component 53 that conducts the heat of the component to the heat radiating component 51 is fixed, and the cooling component 52 such as a fan and the cooling component 5
The heat-dissipating structure for collectively cooling a plurality of modules has been configured by the electrical connection parts 54 that supply power to the two. However, since a plurality of parts are used, the space becomes large or the work such as the replacement of the parts mounted on the module becomes complicated. Furthermore, it is difficult to uniformly supply a constant cooling air flow due to the non-uniform parts arrangement and the cooling effect. There is a problem that it is not easy to ensure uniformity.

[0003]

As described above, since the conventional heat dissipation structure of the module is a structure in which a large number of parts are used due to the individual correspondence of the parts, it is possible to improve the function and speed of the electronic circuit.
The problem is to solve the problem that the high density makes the space and manufacturing work bulky, and the maintainability of parts replacement and the uniformity of the cooling effect tend to deteriorate.

[0004]

In order to solve the above problems, the present invention provides a heat sink 2 having a size matching the shape of the printed circuit board 1 with a predetermined distance from the surface of the printed circuit board 1. The printed circuit board 1 in contact with the heat-generating component 6
Configured to. By this means, the number of heat radiating parts is reduced, so that the parts can be easily replaced with a simple structure, and the heat radiating parts 6 of the printed circuit board 1 can be efficiently radiated and the mounted parts of the printed circuit board 1 can be physically protected. (EN) Provided is a heat dissipation structure of a module which can be combined with.

[0005]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS First, in the first aspect of the present invention, as shown in FIG. 1, a heat sink 2 having a size matching the shape of the printed circuit board 1 is provided on the surface of the printed circuit board 1. The printed circuit board 1 was constructed by contacting the heat-generating component 6 at a predetermined interval. By this means, the number of a plurality of heat dissipation components can be reduced, so that the heat dissipation of the components mounted on the printed circuit board 1 is easy and the physical protection of the components mounted on the printed circuit board 1 can be achieved with a simple structure and easy component replacement. Obtain the action that can.

Next, in a second aspect of the present invention,
As shown in FIG. 2, a concave portion 3 and a convex portion 4 are provided on the surface of the heat dissipation plate 2 corresponding to the height of the heat generating component 6 of the printed circuit board 1, and the concave portion 3 and the convex portion 4 are referred to as the heat generating component 6. Contacted and configured. By this means, a plurality of heat-generating components 6 having different heights are provided.
Since the heat-dissipating components can be integrated into one, the cost can be reduced.

[0007] In a third aspect of the present invention,
As shown in FIG. 3, a bent portion 5 is formed on the end surface of the heat dissipation plate 2.
Is provided to form a duct structure in module units. By this means, the heat dissipation area of the heat dissipation plate 2 is expanded and a duct is further formed, so that the cooling fan can increase the efficiency of cooling.

Further, in the fourth aspect of the present invention, as shown in FIG. 4, the heat radiation plate 2 has a structure in which the heat shield portion 7 is arranged between the heat generating components 6 adjacent to each other.
By this means, it is possible to avoid the heat interference of the heat-generating components 6 adjacent to each other, so that the heat radiation area required for each heat-generating component 6 can be divided and used from the whole.

Next, in a fifth aspect of the present invention,
As shown in FIG. 5, a handle 8 was attached to the heat dissipation plate 2. By this means, the parts of the module withdrawing means are secured, so that the tool of the module withdrawing means can be eliminated.

[0010] In a sixth aspect of the present invention,
As shown in FIG. 6, a rectifying plate 9 was provided inside the heat dissipation plate 2. By this means, it becomes possible to control the direction of the cooling air or the amount of the cooling air, so that the cooling air can be efficiently flowed.

Next, in a seventh aspect of the present invention,
As shown in FIG. 7, a fan 10 was provided inside the heat dissipation plate 2. By this means, it is possible to intensively cool a specific heat-generating component 11, so that a heat-dissipating structure having a high cooling effect can be obtained.

Next, in an eighth aspect of the present invention,
As shown in FIG. 8, the fan 10 has a rotation controller 12 that varies the air volume depending on the ambient temperature of the heat-generating component 11. By this means, the air volume for cooling corresponding to the heat generation state of the heat-generating component 11 can be obtained, so that the heat dissipation structure with high cooling efficiency can be obtained.

In a ninth aspect of the present invention,
As shown in FIG. 9, the heat sensing unit 14 of the rotation control unit 12
Was directly contacted with the surface of the heat-generating component 11. By this means, it is possible to obtain the air volume for cooling that accurately corresponds to the heat generation state of the heat-generating component 11, and therefore, the heat dissipation structure with high cooling efficiency can be obtained.

Further, in the tenth aspect of the present invention, as shown in FIG. 10, the rotation control section 12 is built in the fan 10. By this means, the wiring between the rotation control unit 12 and the fan 10 can be reduced, so that there is an effect that a heat dissipation structure with high cooling efficiency corresponding to the heat generation condition can be formed with a simple structure.

Next, in the eleventh aspect of the present invention, as shown in FIG. 11, the rotation control section 12 is fixed to the heat generating component 11 and the heat radiating plate 13 for transmitting the heat of the heat generating component 11 to the outside. Built and configured. By this means, the heat dissipation plate 13 which conducts the heat of the heat generating component 11 to the outside expands the heat radiation area and senses the temperature of the heat generating component 11, so the cooling effect that corresponds more accurately to the heat generation condition of the heat generating component 11 is high. Obtain the action that can be achieved by the heat dissipation structure.

According to a twelfth aspect of the present invention, as shown in FIG. 12, the rotation control section 12 is formed on the heat dissipation plate 13 side to which the heat dissipation plate 13 and the fan 10 are fixed,
The heat sensing unit 14 is arranged on the heat dissipation plate 13 and the fan 10.
By this means, the heat generating component 11 including the heat sensing unit 14
Since the concentrated cooling mechanism is integrated, it is possible to obtain the effect of providing a heat dissipation structure in which it becomes easy to control an appropriate air volume according to the heat generation state of the heat generating component 11.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A preferred embodiment of the present invention will be described below with reference to the drawings.

The reference numerals used in the drawings of the embodiments of the present invention shown in FIGS. 1 to 12 will be collectively described below.
Reference numeral 1 is a printed circuit board which is a main component of the module. Reference numeral 2 is a heat radiating plate for radiating heat from the heat generating component 6 mounted on the printed circuit board 1. Reference numeral 3 is a recess formed in the heat dissipation plate 2. Reference numeral 4 is a convex portion formed on the heat dissipation plate 2. Reference numeral 5 is a bent portion that forms a duct structure on the heat dissipation plate 2. Reference numeral 6 is a heat-generating component mounted on the printed circuit board 1. Reference numeral 7 is a heat shielding portion for shielding the heat formed on the heat dissipation plate 2. Reference numeral 8 is a handle for removing the module. 9 is a heat sink 2
It is a straightening vane for controlling the amount of airflow formed in or in controlling the wind direction. Reference numeral 10 is a fan for cooling the heat-generating component 11 mounted on the printed circuit board 1 and having a high heat generation amount. Reference numeral 11 denotes a heat-generating component such as a microprocessor mounted on the printed circuit board 1, which generates a large amount of heat. A rotation control unit 12 controls the air volume of the fan 10. Reference numeral 13 is a heat dissipation plate for promoting heat dissipation of the heat generating component 11. Reference numeral 14 is a heat detector associated with the rotation controller 12.

FIG. 1 is a structural perspective view of the principle of the present invention and a cross-sectional view of a main part. In the figure, the heat dissipation plate 2 made of, for example, a copper plate having a size matched to the shape of the printed circuit board 1 has a height corresponding to that of the heat-generating component 6 itself requiring heat radiation or a heat-radiating component raised to a predetermined height. The printed circuit board 1 is formed with a predetermined distance from the surface. Then, the heat-radiating plate 6 itself requiring heat radiation or the heat-generating component 6 raised by the heat-radiating component is brought into contact with the back surface of the heat-radiating plate 2 through a heat conductor such as a heat-conducting sheet to perform heat-conducting means. As a result, the heat-generating component 6 itself requiring heat radiation and the heat-generating component 6 raised by the heat-dissipating component are collectively dissipated, so that the number of a plurality of heat-dissipating components can be reduced, the parts can be easily replaced, and the printed circuit can be easily replaced. It is possible to have both a physical protection structure for the components mounted on the plate 1 and an efficient heat dissipation structure.

FIG. 2 is a perspective view showing the structure of a second embodiment of the present invention and a cross-sectional view of the main part. In the figure, the heat dissipation plate 2
Corresponding to the height of the heat-generating component 6 of the printed circuit board 1 by drawing or the like on the surface of the component, a concave portion 3 is formed in a portion where the component height is low, and a convex portion 4 is formed in a component where the component height is high. The heat dissipation plate 2 and the heat generating component 6 were brought into contact with each other. This allows
Since the heat dissipation plates of the plurality of heat-generating components 6 having different heights are integrated, the number of components is reduced and the cost can be reduced. Also in heat dissipation, the concave portion 3 and the convex portion 4 can be used as means for expanding the area of heat dissipation.

FIG. 3 is a perspective view showing the structure of a third embodiment of the present invention. In the figure, a bent portion 5 is provided on the end surface of the heat dissipation plate 2 to form a duct structure in module units. As a result, the duct is formed so that the cooling air flows smoothly during cooling by the cooling fan or the like, and the heat dissipation area of the heat dissipation plate 2 is enlarged, so that the cooling efficiency can be increased.

FIG. 4 is a perspective view showing the structure of a fourth embodiment of the present invention. In the figure, the heat shield 7 such as a hole is arranged between the heat generating components 6 adjacent to the heat dissipation plate 2. As a result, it is possible to block the heat conduction by the heat radiating plates of the heat generating components 6 adjacent to each other, so that the heat interference between the adjacent heat generating components 6 can be avoided and the heat radiation area required for each heat generating component 6 can be reduced from the whole. Can be divided and used.

FIG. 5 is a perspective view of the structure of a fifth embodiment of the present invention. In the figure, a handle 8 is attached to the heat dissipation plate 2. As a result, since the handle 8 for pulling out the module is attached to the heat dissipation plate 2, it is possible to eliminate the need for a tool as a means for pulling out the module. Further, the handle 8 can be used as a means for expanding the heat radiation area.

FIG. 6 is a perspective view showing the structure of a sixth embodiment of the present invention. In the figure, a rectifying plate 9 is provided inside the heat radiating plate 2. As a result, the flow direction of the cooling air or the amount of the cooling air can be controlled by the straightening vane 9, so that the cooling air can efficiently flow.

FIG. 7 is a structural perspective view of the seventh embodiment of the present invention. In the figure, a fan 10 is provided inside the heat dissipation plate 2 to blow cooling air to a specific heat generating component 11. As a result, since the heat-generating component 11 can be intensively cooled, a heat-dissipating structure having a high cooling efficiency that can meet the cooling condition of the heat-generating component 11 having a high heat generation amount such as a microprocessor can be obtained.

FIG. 8 is a perspective view of the structure of the eighth embodiment of the present invention. In the figure, the fan 10 is provided with a rotation control unit 12 that varies the air volume according to the ambient temperature of a heat-generating component 11 such as a microprocessor. Rotation control unit 1
Reference numeral 2 is a temperature switch that opens and closes at a predetermined temperature, for example, is used as the heat sensing unit 14, controls the voltage supplied to the hall motor, and has a circuit for driving the motor coil TA7247.
It is decided to have it by combining the motor drive IC and the fan driven by the hall motor. This allows
Since the rotation control unit 12 that changes the air flow rate according to the ambient temperature of the heat-generating component 11 is provided, a heat dissipation structure with high cooling efficiency that corresponds to the situation of the ambient temperature of the heat-generating component 11 can be provided.

FIG. 9 is a perspective view of the structure of a ninth embodiment of the present invention. In the figure, the heat sensing unit 14 of the rotation control unit 12, for example, a temperature switch, is configured to directly contact the surface of the heat-generating component 11. As a result, the heat sensing unit 14 of the rotation control unit 12 is brought into direct contact with the heat-generating component 11, so that a heat-dissipating structure with high cooling efficiency that accurately corresponds to the heat-generating condition of the heat-generating component 11 can be obtained.

FIG. 10 is a structural perspective view of a tenth embodiment of the present invention. In the figure, the rotation control unit 12 is built in the fan 10. With this, the wiring between the rotation control unit 12 and the fan 10 can be reduced, so that a simple heat dissipation structure with a small number of parts and wiring can be obtained.

FIG. 11 is a perspective view of the structure of an eleventh embodiment of the present invention. In the figure, the rotation control unit 12 is built in a heat radiating plate 13 fixed to the heat generating component 11 for conducting the heat of the heat generating component 11 to the outside. As a result, since the rotation control unit 12 is built in the heat dissipation plate 13 that conducts the heat of the heat generating component 11 fixed to the heat generating component 11, the wiring between the rotation control unit 12 and the heat sensing unit 14 and the component quantity. With a structure having less heat generation, a heat dissipation structure with high cooling efficiency that accurately corresponds to the heat generation state of the heat generating component 11 can be obtained.

FIG. 12 is a perspective view showing the structure of a twelfth embodiment of the present invention. In the figure, the rotation control unit 12 is placed on the side of the heat dissipation plate 13 where the heat dissipation plate 13 and the fan 10 are fixed, and the heat sensing unit 14 is arranged on the fan 10 and the heat dissipation plate 13. As a result, the fan 10 is integrated with the heat dissipation plate 13 that fixes the rotation control unit 12 that changes the rotation of the fan 10 to the heat-generating component 11 and that conducts heat to the outside.
The centralized cooling mechanism for the heat-generating component 11 is integrated to form the wiring between the rotation control unit 12, the heat-sensing unit 14, and the fan 10 and the structure in which the number of components is small, and the two heat-sensing units 14 generate heat-generating components. It is possible to control the air volume of the cooling air that appropriately corresponds to the ambient temperature and the surface temperature of 11.

[0031]

The effects of the present invention described above will be described in the order of claims.

According to a heat dissipation structure of a module having the structure of claim 1, a heat dissipation plate having a size matched to the shape of the printed circuit board is contacted with a heat generating component with a predetermined distance from the surface of the printed circuit board. Configured on a printed circuit board. As a result, it is possible to collectively radiate the heat-generating components that require heat radiation and to physically protect the components mounted on the printed circuit board. Can dissipate heat.

In the heat dissipation structure of the module having the structure according to the second aspect of the present invention, the concave portion and / or the convex portion corresponding to the height of the heat-generating component of the printed circuit board is contacted with the heat-generating component on the surface of the heat-radiating plate. Arranged and configured. As a result, even if there is a difference in the height of the heat-generating components of the printed circuit board that require heat dissipation, heat can be dissipated by the entire integrated heat dissipation plate. Therefore, in addition to the effect of claim 1, It can be expanded and the cooling efficiency can be improved.

In the heat dissipation structure of the module having the structure according to the third aspect, a bent structure is provided on the end surface of the heat dissipation plate to provide a duct structure for each module. With this, since a duct having a high cooling effect is formed, in addition to the effects according to the first and second aspects, it is possible to increase the heat dissipation area of the heat dissipation plate and adjust the air flow to enhance the cooling efficiency.

The heat dissipation structure of the module having the structure according to the fourth aspect is such that a heat shield such as a hole is arranged between the heat dissipation plate and a heat generating component adjacent to each other. As a result, mutual interference of heat can be avoided.
In addition to the effects described, the heat radiation area required for each heat-generating component can be divided from the whole and used, and a heat-radiating structure with uniform cooling efficiency corresponding to the thermal characteristics of the heat-generating component can be obtained.

In the heat dissipation structure of the module having the structure according to the fifth aspect, a handle is attached to the heat dissipation plate to serve as means for removing the module. This eliminates the need for a tool as a module withdrawing means. Therefore, in addition to the effects of the first to fourth aspects, the heat dissipation area can be further expanded, and a duct without wasteful voids can be formed in the duct structure.

In the heat dissipation structure of the module having the structure of claim 6, a rectifying plate is provided inside the heat dissipation plate. With this, since the wind direction of the cooling air or the air volume of the cooling air can be controlled, the wind direction or the air volume can be controlled in addition to the effects of the first to fifth aspects, so that a heat dissipation structure having a high cooling effect can be obtained.

In the heat dissipation structure of the module having the structure according to the seventh aspect, the fan is provided inside the heat dissipation plate. As a result, it is possible to intensively cool a specific heat-generating component. Therefore, in addition to the effects according to claims 1 to 6, since the heat-generating component having a high heat generation amount is intensively cooled, the cooling effect is high. A heat dissipation structure can be created.

According to another aspect of the heat dissipation structure of the module having the structure of the present invention, a fan provided inside the heat dissipation plate has a rotation control unit in which an air volume varies depending on an ambient temperature of a heat generating component such as a microprocessor. did. This makes it possible to supply cooling air corresponding to the ambient temperature of a heat-generating component having a high heat generation amount such as a microprocessor.
In addition to the effects described above, a heat dissipation structure with high cooling efficiency can be provided corresponding to the heat generation status of heat generating components.

According to a ninth aspect of the heat dissipation structure of the module, the heat sensing section of the rotation control section is in direct contact with the surface of the heat generating component. With this, it is possible to supply the cooling air corresponding to the surface temperature condition of the heat generating component.
In addition to the effects described above, a heat dissipation structure with high cooling efficiency that accurately corresponds to the surface temperature condition of the heat generating component can be provided.

According to a tenth aspect of the present invention, there is provided a heat dissipation structure for a module, in which a fan provided inside the heat dissipation plate has a built-in rotation control section for changing the rotation according to the temperature of the heat-generating component. As a result, since the rotation control unit is built in the fan, a simple heat dissipation structure can be achieved in which wiring between the fan and the rotation control unit is reduced in addition to the effect described in claim 8.

In the heat dissipation structure of the module having the structure according to the eleventh aspect, the rotation control section is built in the heat dissipation plate which is fixed to the heat generation part and conducts the heat of the heat generation part to the outside. With this,
Since the heat generated in the heat-generating components such as the microprocessor is conducted and diffused in the heat dissipation plate and the rotation control unit is built in, the heat dissipation area is expanded, and in addition to the effect of claim 9, the expansion of the heat dissipation area also improves the cooling efficiency. A high heat dissipation structure is possible.

According to a twelfth aspect of the present invention, there is provided a heat dissipation structure for a module, in which a fan provided inside the heat dissipation plate and a heat dissipation plate that conducts heat of a heat generating component such as a microprocessor to the outside are fixed to each other. The heat sensing part was built in and was arranged in the fan and the heat sink. As a result, the two air detectors can supply the cooling air that appropriately corresponds to the ambient temperature and the surface temperature. Therefore, in addition to the effect described in claim 9, a concentrated cooling mechanism for the heat-generating components is integrated. A simple and highly efficient cooling structure can be achieved.

In this specification, the heat dissipation structure for forced air cooling is described, but even in the case of natural air cooling, the same effect can be obtained by using the constituent means of the present invention.

[Brief description of drawings]

FIG. 1 is a principle view of the present invention, in which (a) is a structural perspective view and (b) is a cross-sectional view of a main part.

FIG. 2 is a diagram of a second embodiment of the present invention, in which (a) is a structural perspective view and (b) is a cross-sectional view of essential parts.

FIG. 3 is a structural perspective view of a third embodiment of the present invention.

FIG. 4 is a structural perspective view of a fourth embodiment of the present invention.

FIG. 5 is a structural perspective view of a fifth embodiment of the present invention.

FIG. 6 is a structural perspective view of a sixth embodiment of the present invention.

FIG. 7 is a structural perspective view of a seventh embodiment of the present invention.

FIG. 8 is a perspective view of the structure of claim 8 of the present invention.

FIG. 9 is a structural perspective view of a ninth embodiment of the present invention.

FIG. 10 is a structural perspective view of a tenth embodiment of the present invention.

FIG. 11 is a structural perspective view of an eleventh embodiment of the present invention.

FIG. 12 is a structural perspective view of a twelfth embodiment of the present invention.

FIG. 13 is a structural perspective view of a conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Printed circuit board 2, 13 Heat sink 3 Recessed portion 4 Convex portion 5 Bent portion 6, 11 Heat generating component 7 Heat shield portion 8 Handle 9 Rectifier plate 10 Fan 12 Rotation control portion 14 Heat sensing portion

Claims (12)

[Claims] 1. An electric circuit and an electronic circuit, which are constituent units of an electronic device, are formed on an insulating plate to form a predetermined function,
In a heat dissipation structure of a module that conducts heat of a heat-generating component to a heat-dissipating component to cool it by air, a heat-dissipating plate (2) having a size matching the shape of the printed circuit board (1) is attached to the surface of the printed circuit board (1). A heat radiation structure for a module, characterized in that the printed circuit board (1) is in contact with a heat generating component (6) at a predetermined distance from the printed circuit board (1). 2. The recess (3) and / or the protrusion (4) according to claim 1, corresponding to the height of the heat-generating component (6) of the printed circuit board (1) on the surface of the heat sink (2). A heat dissipation structure for a module, which is characterized in that 3. The heat dissipation structure for a module according to claim 1, wherein a bent part (5) is provided on an end surface of the heat dissipation plate (2) to provide a duct structure for each module. 4. The heat radiating plate (2) according to any one of claims 1 to 3, wherein the heat generating component (6) is adjacent to the heat radiating plate (2).
A heat dissipation structure for a module, characterized in that a heat shield (7) is arranged. 5. A heat dissipation structure for a module according to claim 1, wherein a handle (8) is attached to the heat dissipation plate (2). 6. The heat dissipation structure for a module according to claim 1, wherein a rectifying plate (9) is provided inside the heat dissipation plate (2). 7. The heat dissipation structure for a module according to claim 1, wherein a fan (10) is provided inside the heat dissipation plate (2). 8. The heat dissipation structure for a module according to claim 7, wherein the fan (10) has a rotation control section (12) for varying the air volume according to the ambient temperature of the heat generating component (11). 9. The rotation control unit (12) according to claim 8.
A heat dissipation structure for a module, characterized in that the heat sensing part (14) of (1) is directly contacted with the surface of the heat generating component (11). 10. The rotation controller (1) according to claim 8,
A heat dissipation structure for a module, characterized in that 2) is built in a fan (10). 11. The rotation controller (1) according to claim 9,
2) A heat dissipation structure for a module, characterized in that it is built in a heat dissipation plate (13) fixed to a heat generating component (11). 12. The rotation controller (1) according to claim 9,
2) is built in the heat sink (13) fixed to the heat-generating component (11) and the heat sink (13) side fixed to the fan (10),
A heat dissipation structure for a module, characterized in that a heat sensing part (14) is arranged on a heat dissipation plate (13) and a fan (10).