JPH093303A - Phenolic resin composition, prepreg produced using same and laminate - Google Patents
Phenolic resin composition, prepreg produced using same and laminateInfo
- Publication number
- JPH093303A JPH093303A JP15163495A JP15163495A JPH093303A JP H093303 A JPH093303 A JP H093303A JP 15163495 A JP15163495 A JP 15163495A JP 15163495 A JP15163495 A JP 15163495A JP H093303 A JPH093303 A JP H093303A
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- flame retardant
- phenol resin
- prepreg
- phosphorus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 60
- 239000005011 phenolic resin Substances 0.000 title claims abstract description 57
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 title claims abstract description 9
- 229920001568 phenolic resin Polymers 0.000 title claims abstract description 9
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims abstract description 36
- 239000003063 flame retardant Substances 0.000 claims abstract description 34
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract description 33
- 239000011574 phosphorus Substances 0.000 claims abstract description 33
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 29
- -1 phosphorus compound Chemical class 0.000 claims abstract description 28
- 229920005989 resin Polymers 0.000 claims abstract description 23
- 239000011347 resin Substances 0.000 claims abstract description 23
- 239000007787 solid Substances 0.000 claims abstract description 14
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 claims abstract description 13
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 claims abstract description 13
- 229910052794 bromium Inorganic materials 0.000 claims abstract description 13
- 150000001875 compounds Chemical class 0.000 claims abstract description 12
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229920000877 Melamine resin Polymers 0.000 claims abstract description 10
- 150000001451 organic peroxides Chemical class 0.000 claims abstract description 8
- 229920001807 Urea-formaldehyde Polymers 0.000 claims abstract description 6
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 6
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 6
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims abstract description 6
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 claims abstract description 4
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N 1,4-Benzenediol Natural products OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 claims description 14
- 239000011342 resin composition Substances 0.000 claims description 13
- 238000007348 radical reaction Methods 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 4
- 239000004640 Melamine resin Substances 0.000 claims description 2
- 125000000687 hydroquinonyl group Chemical group C1(O)=C(C=C(O)C=C1)* 0.000 claims description 2
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 claims 1
- 239000004615 ingredient Substances 0.000 abstract 1
- 238000012986 modification Methods 0.000 abstract 1
- 230000004048 modification Effects 0.000 abstract 1
- 229910017464 nitrogen compound Inorganic materials 0.000 abstract 1
- 150000002830 nitrogen compounds Chemical class 0.000 abstract 1
- 238000005470 impregnation Methods 0.000 description 23
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 13
- 239000007795 chemical reaction product Substances 0.000 description 7
- 238000002485 combustion reaction Methods 0.000 description 7
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 7
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 235000010678 Paulownia tomentosa Nutrition 0.000 description 4
- 240000002834 Paulownia tomentosa Species 0.000 description 4
- 238000009472 formulation Methods 0.000 description 4
- 239000002655 kraft paper Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000123 paper Substances 0.000 description 4
- 150000003254 radicals Chemical class 0.000 description 4
- 229920003987 resole Polymers 0.000 description 4
- GWQOYRSARAWVTC-UHFFFAOYSA-N 1,4-bis(2-tert-butylperoxypropan-2-yl)benzene Chemical compound CC(C)(C)OOC(C)(C)C1=CC=C(C(C)(C)OOC(C)(C)C)C=C1 GWQOYRSARAWVTC-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- ZJRAAAWYHORFHN-UHFFFAOYSA-N 2-[[2,6-dibromo-4-[2-[3,5-dibromo-4-(oxiran-2-ylmethoxy)phenyl]propan-2-yl]phenoxy]methyl]oxirane Chemical compound C=1C(Br)=C(OCC2OC2)C(Br)=CC=1C(C)(C)C(C=C1Br)=CC(Br)=C1OCC1CO1 ZJRAAAWYHORFHN-UHFFFAOYSA-N 0.000 description 2
- LIAWCKFOFPPVGF-UHFFFAOYSA-N 2-ethyladamantane Chemical compound C1C(C2)CC3CC1C(CC)C2C3 LIAWCKFOFPPVGF-UHFFFAOYSA-N 0.000 description 2
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 229920000137 polyphosphoric acid Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 239000011134 resol-type phenolic resin Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- 239000002383 tung oil Substances 0.000 description 2
- CCNDOQHYOIISTA-UHFFFAOYSA-N 1,2-bis(2-tert-butylperoxypropan-2-yl)benzene Chemical compound CC(C)(C)OOC(C)(C)C1=CC=CC=C1C(C)(C)OOC(C)(C)C CCNDOQHYOIISTA-UHFFFAOYSA-N 0.000 description 1
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- IKEHOXWJQXIQAG-UHFFFAOYSA-N 2-tert-butyl-4-methylphenol Chemical compound CC1=CC=C(O)C(C(C)(C)C)=C1 IKEHOXWJQXIQAG-UHFFFAOYSA-N 0.000 description 1
- FRIBMENBGGCKPD-UHFFFAOYSA-N 3-(2,3-dimethoxyphenyl)prop-2-enal Chemical compound COC1=CC=CC(C=CC=O)=C1OC FRIBMENBGGCKPD-UHFFFAOYSA-N 0.000 description 1
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
- PRWJPWSKLXYEPD-UHFFFAOYSA-N 4-[4,4-bis(5-tert-butyl-4-hydroxy-2-methylphenyl)butan-2-yl]-2-tert-butyl-5-methylphenol Chemical compound C=1C(C(C)(C)C)=C(O)C=C(C)C=1C(C)CC(C=1C(=CC(O)=C(C=1)C(C)(C)C)C)C1=CC(C(C)(C)C)=C(O)C=C1C PRWJPWSKLXYEPD-UHFFFAOYSA-N 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- 239000004255 Butylated hydroxyanisole Substances 0.000 description 1
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- YSMRWXYRXBRSND-UHFFFAOYSA-N TOTP Chemical compound CC1=CC=CC=C1OP(=O)(OC=1C(=CC=CC=1)C)OC1=CC=CC=C1C YSMRWXYRXBRSND-UHFFFAOYSA-N 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 239000012752 auxiliary agent Substances 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- 230000008033 biological extinction Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- CZBZUDVBLSSABA-UHFFFAOYSA-N butylated hydroxyanisole Chemical compound COC1=CC=C(O)C(C(C)(C)C)=C1.COC1=CC=C(O)C=C1C(C)(C)C CZBZUDVBLSSABA-UHFFFAOYSA-N 0.000 description 1
- 229940043253 butylated hydroxyanisole Drugs 0.000 description 1
- 235000019282 butylated hydroxyanisole Nutrition 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000002683 reaction inhibitor Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- JIYXDFNAPHIAFH-UHFFFAOYSA-N tert-butyl 3-tert-butylperoxycarbonylbenzoate Chemical compound CC(C)(C)OOC(=O)C1=CC=CC(C(=O)OC(C)(C)C)=C1 JIYXDFNAPHIAFH-UHFFFAOYSA-N 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明はフェノール樹脂組成物、
そのフェノール樹脂組成物を用いたプリプレグ、及び積
層板に関し、一例をあげれば、電気機器・電子機器、産
業機器等に搭載される紙基材積層板に有用なものであ
る。The present invention relates to a phenol resin composition,
Regarding the prepreg and the laminated board using the phenolic resin composition, for example, they are useful for a paper base laminated board to be mounted on electric equipment / electronic equipment, industrial equipment and the like.
【0002】[0002]
【従来の技術】電子機器等に搭載される紙基材フェノー
ル樹脂積層板に難燃性を付与するために、ブロム系難燃
剤を汎用している。近年、上記難燃性の難燃性水準とし
て、例えば、UL試験法においては、最大燃焼時間が3
0秒以下のV−1のレベルから最大燃焼時間が10秒以
下のV−0のレベルへの向上が求められているがこれを
実現するために、ブロム系難燃剤をフェノール樹脂組成
物中のブロム成分の含有量が樹脂固形分に対し、10重
量%以上添加している。しかし、このブロム系難燃剤の
使用は、公害上の問題から、使用量の削減が求められて
いる。ブロム系難燃剤の使用量を削減するために、代わ
りの難燃剤としてリン系難燃剤が検討されているが、リ
ン系難燃剤は含有量を増加すると難燃性は向上するもの
耐熱性、特に半田耐熱性が劣化する問題がある。従っ
て、耐熱性が共に良好で、且つ、難燃性の優れた、リン
系難燃剤を含有するフェノール樹脂組成物が求められて
いる。Brominated flame retardants are commonly used to impart flame retardancy to paper-based phenolic resin laminates mounted in electronic devices and the like. In recent years, as the flame retardancy level of the flame retardancy, for example, in the UL test method, the maximum combustion time is 3
It is required to improve the level of V-1 of 0 seconds or less to the level of V-0 of maximum burning time of 10 seconds or less. In order to realize this, a brominated flame retardant is added to the phenol resin composition. The content of the bromine component is 10% by weight or more based on the resin solid content. However, the use of the brominated flame retardant is required to reduce the amount of use because of pollution problems. In order to reduce the amount of brominated flame retardants used, phosphorus-based flame retardants have been studied as an alternative flame retardant, but phosphorus-based flame retardants have improved flame retardancy as the content increases, but heat resistance, especially There is a problem that solder heat resistance deteriorates. Therefore, there is a demand for a phenolic resin composition containing a phosphorus-based flame retardant, which has both good heat resistance and excellent flame retardancy.
【0003】[0003]
【発明が解決しようとする課題】本発明は上記の事実に
鑑みてなされたもので、その目的とするところは、ブロ
ム系難燃剤の使用量を削減し、且つ、耐熱性の水準を維
持しつつ、難燃性の優れた、リン系難燃剤を含有するフ
ェノール樹脂組成物、このフェノール樹脂組成物を用い
たプリプレグ、及び積層板を提供することにある。SUMMARY OF THE INVENTION The present invention has been made in view of the above facts, and an object thereof is to reduce the amount of brominated flame retardant used and to maintain the heat resistance level. At the same time, it is to provide a phenol resin composition containing a phosphorus-based flame retardant having excellent flame retardancy, a prepreg using the phenol resin composition, and a laminate.
【0004】[0004]
【課題を解決するための手段】本発明の請求項1に係る
フェノール樹脂組成物は、リン系難燃剤とブロム系難燃
剤を含有するフェノール樹脂組成物であって、上記組成
物中に、メラミン樹脂、ユリア樹脂、ウレタン樹脂の単
独、変性物、これら樹脂含有化合物、及び、ジシアンジ
アミド、アニリンからなる群から選ばれた少なくとも1
種以上の窒素含有化合物、有機過酸化物、ラジカル反応
停止剤のうち少なくとも1種以上のラジカルトラップ
剤、並びに、下記構造式〔1〕で表されるシアヌレート
化合物を成分として含有し、且つ、上記樹脂組成物中の
ブロム成分の含有量が樹脂固形分に対し、1〜8重量%
であることを特徴とする。The phenol resin composition according to claim 1 of the present invention is a phenol resin composition containing a phosphorus flame retardant and a bromine flame retardant, wherein the composition contains melamine. At least one selected from the group consisting of a resin, a urea resin, a urethane resin alone, a modified product thereof, a resin-containing compound thereof, and dicyandiamide and aniline.
One or more nitrogen-containing compounds, organic peroxides, at least one or more radical trapping agents among radical reaction terminators, and a cyanurate compound represented by the following structural formula [1] as components, and The content of the bromine component in the resin composition is 1 to 8% by weight based on the resin solid content.
It is characterized by being.
【0005】[0005]
【化2】 Embedded image
【0006】〔式中R1 , R2 , R3 はアルキル基を示
す。〕 本発明の請求項2に係るフェノール樹脂組成物は、請求
項1記載のフェノール樹脂組成物において、上記ラジカ
ル反応停止剤がハイドロキノンであることを特徴とす
る。[In the formula, R 1, R 2 and R 3 represent an alkyl group. The phenol resin composition according to claim 2 of the present invention is characterized in that, in the phenol resin composition according to claim 1, the radical reaction terminator is hydroquinone.
【0007】本発明の請求項3に係るプリプレグは、請
求項1又は請求項2記載のフェノール樹脂組成物を基材
に含浸し、この含浸したフェノール樹脂組成物の樹脂が
半硬化した状態にあることを特徴とする。In the prepreg according to claim 3 of the present invention, a substrate is impregnated with the phenol resin composition according to claim 1 or 2, and the resin of the impregnated phenol resin composition is in a semi-cured state. It is characterized by
【0008】本発明の請求項4に係る積層板は、請求項
3記載のプリプレグを用いて、樹脂が完全に硬化した状
態にあることを特徴とする。The laminated plate according to a fourth aspect of the present invention is characterized in that the resin is completely cured by using the prepreg according to the third aspect.
【0009】以下、本発明を詳細に説明する。本発明の
フェノール樹脂組成物を構成するフェノール樹脂として
は、各種のものが使用でき、フェノール樹脂の単独、変
性物、混合物等が用いられる。Hereinafter, the present invention will be described in detail. As the phenol resin constituting the phenol resin composition of the present invention, various ones can be used, and a phenol resin alone, a modified product or a mixture thereof can be used.
【0010】本発明のフェノール樹脂組成物の構成材料
として、リン系難燃剤とブロム系難燃剤を含有する。上
記リン系難燃剤は、例えば、トリフェニルホスフェイ
ト、トリクレジルホスフェイト、キシレニルジフェニル
ホスフェイト、クレジルジフェニルホスフェイト、及
び、これらの誘導体が挙げられる。このリン系化合物の
リン成分の含有量は、得られる積層板の樹脂組成物の固
形量と基材の構成比率等によって適宜決定されるが、例
えば、積層板中の樹脂組成物の固形量が略50重量%の
場合、上記樹脂組成物の固形量に対し、リン成分の含有
量が0.5〜3重量%が好ましく、なかでも2重量%程
度が適している。上記リン系化合物のリン成分の含有量
が少ないと難燃性が劣り、多すぎると耐熱性が低下す
る。As a constituent material of the phenol resin composition of the present invention, a phosphorus flame retardant and a bromine flame retardant are contained. Examples of the phosphorus-based flame retardant include triphenyl phosphate, tricresyl phosphate, xylenyl diphenyl phosphate, cresyl diphenyl phosphate, and derivatives thereof. The content of the phosphorus component of the phosphorus-based compound is appropriately determined by the solid content of the resin composition of the resulting laminate and the composition ratio of the base material, for example, the solid content of the resin composition in the laminate is When the amount is about 50% by weight, the content of the phosphorus component is preferably 0.5 to 3% by weight, and about 2% by weight is suitable for the solid amount of the resin composition. If the content of the phosphorus component in the phosphorus-based compound is small, the flame retardancy is poor, and if it is too large, the heat resistance is reduced.
【0011】上記ブロム系難燃剤は、例えば、テトラブ
ロムビスフェノールA、テトラブロムビスフェノールA
ジグリシジルエーテル、2−2−プロパン−ビス〔4−
(3−ポリブロモフェニルオキシ−2−ヒドロキシプロ
ピル)オキシ−3,5−ジブロモフェノール等が挙げら
れる。上記ブロム系難燃剤の含有量はフェノール樹脂組
成物中のブロム成分の含有量が樹脂固形分に対し、1〜
8重量%である。上記ブロム成分の含有量がが少ないと
難燃性が劣り、多すぎると使用量の削減の効果がない。Examples of the brominated flame retardant include tetrabromobisphenol A and tetrabromobisphenol A.
Diglycidyl ether, 2-2-propane-bis [4-
(3-Polybromophenyloxy-2-hydroxypropyl) oxy-3,5-dibromophenol and the like can be mentioned. The content of the brominated flame retardant is such that the content of the brominated component in the phenol resin composition is 1 to the resin solid content.
8% by weight. If the content of the above-mentioned brom component is small, the flame retardancy is poor, and if it is too large, the effect of reducing the amount used is not achieved.
【0012】本発明のフェノール樹脂組成物は、特徴的
な構成材料として、窒素含有化合物、ラジカルトラップ
剤、及び、前記構造式〔1〕で表されるシアヌレート化
合物を成分として含有する。上記窒素含有化合物、ラジ
カルトラップ剤、及び、シアヌレート化合物は難燃補助
剤として機能するものであり、これら三成分を含有して
いると、リン含有化合物の含有量が少量でも高水準の難
燃性を付与し、また、リン含有化合物の含有量が少量の
ため、耐熱性の水準を低下させることがない。The phenol resin composition of the present invention contains, as its characteristic constituent materials, a nitrogen-containing compound, a radical trapping agent, and a cyanurate compound represented by the above structural formula [1] as components. The nitrogen-containing compound, the radical trapping agent, and the cyanurate compound function as a flame retardant auxiliary agent, and when these three components are contained, even if the content of the phosphorus-containing compound is small, the flame retardancy is high. Further, since the content of the phosphorus-containing compound is small, the level of heat resistance is not lowered.
【0013】本発明のフェノール樹脂組成物は、上記窒
素含有化合物として、メラミン樹脂、ユリア樹脂、ウレ
タン樹脂の樹脂の単独、変性物、これらの樹脂含有化合
物、及び、ジシアンジアミド、アニリンからなる群から
選ばれた少なくとも1種以上を含有する。上記窒素含有
化合物は難燃補助剤として機能するものである。In the phenol resin composition of the present invention, the nitrogen-containing compound is selected from the group consisting of melamine resin, urea resin, urethane resin alone and modified, these resin-containing compounds, and dicyandiamide and aniline. At least one selected from the above is included. The nitrogen-containing compound functions as a flame retardant aid.
【0014】本発明のフェノール樹脂組成物は、ラジカ
ルトラップ剤として、有機過酸化物、ラジカル反応停止
剤のうち少なくとも1種以上を含有する。上記有機過酸
化物としては、例えば、ベンゾイルパーオキサイド、キ
ュメンヒドロパーオキサイド、ジクミルパーオキサイ
ド、1,4−ビス(t−ブチルパーオキシイソプロピ
ル)ベンゼン、1,3−ビス(t−ブチルパーオキシイ
ソプロピル)ベンゼン、ジ−t−ブチルパーオキシイソ
フタレート、2,5−ジメチル−2,5−ジベンゾイル
パーオキシヘキサン等が挙げられる。上記ラジカル反応
停止剤としては、例えば、ハイドロキノン、2,6−ジ
−t−ブチル−p−クレゾール、ブチル化ヒドロキシア
ニゾール、2,t−ジ−t−ブチル−4−エチルフェノ
ール、2,2'-メチレン−ビス−(4−メチル−6−t
−ブチルフェノール)、1,1,3−トリス−(2−メ
チル−4−ヒドロキシ−5−t−ブチルフェニル)ブタ
ン等が挙げられる。なかでも、ハイドロキノンを単独、
又は併用すると、積層板を作製するまでの工程におい
て、フェノール樹脂作製の際に残存するホルムアルデヒ
ドと反応し、可燃物を低減したり、架橋密度を上げて積
層板が熱分解するのを抑える効果が高いので好ましい。The phenol resin composition of the present invention contains, as a radical trapping agent, at least one of organic peroxides and radical reaction terminators. Examples of the organic peroxide include benzoyl peroxide, cumene hydroperoxide, dicumyl peroxide, 1,4-bis (t-butylperoxyisopropyl) benzene, 1,3-bis (t-butylperoxy). Isopropyl) benzene, di-t-butylperoxyisophthalate, 2,5-dimethyl-2,5-dibenzoylperoxyhexane and the like can be mentioned. Examples of the radical reaction terminator include hydroquinone, 2,6-di-t-butyl-p-cresol, butylated hydroxyanisole, 2, t-di-t-butyl-4-ethylphenol, and 2,2. '-Methylene-bis- (4-methyl-6-t
-Butylphenol), 1,1,3-tris- (2-methyl-4-hydroxy-5-t-butylphenyl) butane, and the like. Among them, hydroquinone alone,
Alternatively, when used in combination, in the steps up to the production of the laminated plate, it reacts with the formaldehyde remaining during the production of the phenol resin to reduce combustibles or increase the crosslink density to suppress the thermal decomposition of the laminated plate. It is preferable because it is expensive.
【0015】上記有機過酸化物、ラジカル反応停止剤の
うち1種以上をリン系難燃剤と共に含有すると、リン系
難燃剤によるポリリン酸の生成による酸素の遮断作用と
共に、リン系難燃剤との相乗効果で燃焼反応を停止する
働きをする。一般的に、難燃剤の機能は、燃焼の際、ガ
ス等を発生して酸素を遮断する機能と燃焼反応を停止す
る機能によると推定される。リン系難燃剤はポリリン酸
の生成による酸素の遮断機能は有するが、燃焼反応を停
止する機能がほとんどないため、リン系難燃剤で難燃性
を高めるためには、リン系難燃剤の含有量を増量する必
要があった。しかし、本発明のフェノール樹脂組成物に
おいては、有機過酸化物、ラジカル反応停止剤のうち少
なくとも1種をリン系難燃剤と共に含有することで、燃
焼反応を停止する機能を有することができ、その結果、
リン系難燃剤を増量することなく、難燃性を向上するこ
とができると共に、耐熱性を良好に維持できる。When one or more of the above organic peroxides and radical reaction terminators are contained together with the phosphorus-based flame retardant, the phosphorus-based flame retardant serves to block oxygen by the formation of polyphosphoric acid and synergize with the phosphorus-based flame retardant. It has the effect of stopping the combustion reaction. Generally, the function of the flame retardant is presumed to be due to the function of generating gas or the like to block oxygen during combustion and the function of stopping the combustion reaction. Although the phosphorus-based flame retardant has a function of blocking oxygen by the generation of polyphosphoric acid, it has almost no function of stopping the combustion reaction. Had to increase. However, in the phenol resin composition of the present invention, by containing at least one of the organic peroxide and the radical reaction terminator together with the phosphorus-based flame retardant, it is possible to have a function of stopping the combustion reaction. result,
The flame retardancy can be improved and the heat resistance can be favorably maintained without increasing the amount of the phosphorus-based flame retardant.
【0016】上記シアヌレート化合物は、前記構造式
〔1〕で表されるものである。式中のR1 、R2 、R3
はアルキル基を示し、全てが同一のアルキル基でも、異
なったアルキル基でもよい。上記シアヌレート化合物を
含有すると難燃性のみならず、耐熱性が向上する。上記
シアヌレート化合物の含有量は樹脂組成物の固形量に対
し、1〜10重量%が好ましく、なかでも3〜5重量%
程度が適している。The cyanurate compound is represented by the above structural formula [1]. R 1 , R 2 , R 3 in the formula
Represents an alkyl group, and all may be the same alkyl group or different alkyl groups. When the above cyanurate compound is contained, not only flame retardancy but also heat resistance is improved. The content of the cyanurate compound is preferably 1 to 10% by weight, more preferably 3 to 5% by weight, based on the solid amount of the resin composition.
The degree is suitable.
【0017】本発明のフェノール樹脂組成物は、上記成
分を含有するので、リン系化合物の含有量が少量でも高
水準の難燃性を付与する。リン系化合物の含有量が少量
ですむため、耐熱性の低下を防止する点からも有効であ
る。また、シアヌレート化合物は耐熱性の向上に効果を
有する。Since the phenol resin composition of the present invention contains the above-mentioned components, it imparts a high level of flame retardancy even if the content of the phosphorus compound is small. Since the content of the phosphorus-based compound is small, it is also effective from the viewpoint of preventing deterioration of heat resistance. Further, the cyanurate compound has an effect of improving heat resistance.
【0018】上記フェノール樹脂組成物は、必要に応じ
てアンチモン等の他種の難燃剤を併用してもよい。さら
に、無機、有機の充填剤、溶剤及びその他水等の添加物
を適宜に配合してもよい。The above-mentioned phenol resin composition may be optionally combined with other flame retardants such as antimony. Further, an inorganic or organic filler, a solvent, and other additives such as water may be appropriately blended.
【0019】上記フェノール樹脂組成物を用いてプリプ
レグを製造するにあたって、基材は、例えば、クラフト
紙、リンター紙、その他クラフト紙又はリンター紙に無
機物又は有機物を混入した紙基材が挙げられる。上述の
フェノール樹脂組成物をこれらの基材に含浸し、樹脂を
半硬化してプリプレグを得る。高度の電気特性を有する
積層板の場合、樹脂を多量に含有させる必要性から、含
浸する際に、上記フェノール樹脂組成物、又は、フェノ
ール樹脂組成物と別の樹脂組成物を用い一次含浸処理を
行い、次いで上記フェノール樹脂組成物を用いて二次含
浸処理を行うことが有効である。通常においては、上記
一次含浸用の樹脂組成物は溶剤又は水等で希釈された粘
度の低いものが用いられる。In the production of a prepreg using the above-mentioned phenol resin composition, examples of the substrate include kraft paper, linter paper, and other kraft paper or linter paper mixed with an inorganic or organic material. These substrates are impregnated with the above-mentioned phenol resin composition and the resin is semi-cured to obtain a prepreg. In the case of a laminated board having a high degree of electrical characteristics, since it is necessary to contain a large amount of resin, when impregnated, a primary impregnation treatment using the above-mentioned phenol resin composition or a resin composition different from the phenol resin composition. It is effective to carry out a secondary impregnation treatment using the above-mentioned phenol resin composition. In general, the resin composition for primary impregnation used has a low viscosity diluted with a solvent or water.
【0020】本発明の積層板は、上述の製造方法で得ら
れたプリプレグ数枚と、必要により銅、アルミニウム、
ニッケル等の金属箔を重ね合わせ、加熱加圧すると、基
材中の樹脂が完全に硬化し、作製される。上記フェノー
ル樹脂組成物を用いるので、半田耐熱性等の耐熱性が良
好で、難燃性の向上した積層板が得られる。上記積層板
はブロム系難燃剤の使用量が削減されているので、公害
防止の点からも優れる。The laminated plate of the present invention comprises several prepregs obtained by the above-mentioned manufacturing method, and if necessary, copper, aluminum,
When metal foils such as nickel are superposed and heated and pressed, the resin in the base material is completely cured and is produced. Since the above-mentioned phenol resin composition is used, a laminate having good heat resistance such as solder heat resistance and improved flame retardancy can be obtained. Since the amount of the brominated flame retardant used is reduced, the above laminated plate is also excellent in terms of pollution prevention.
【0021】[0021]
実施例1 一次含浸用の樹脂組成物、及び一次含浸は次の様に行っ
た。フェノール100重量部(以下部と記す)、37重
量%(以下単に%と記す)のホルマリン70部を反応さ
せてレゾール型フェノール反応生成物Aを得た。また、
メラミン100部、ホルマリン(固形分37%)100
部を反応させてメラミン反応生成物Bを得た。このレゾ
ール型フェノール反応生成物A50部とメラミン反応生
成物B50部の混合物を、水とメタノールを1対1で混
合したメタノール水溶液で希釈し、固形分15%の一次
含浸用の樹脂組成物を得た。基材に重量126g/m2
のクラフト紙を用い、このクラフト紙に上記一次含浸用
の樹脂組成物を一次含浸した。その後、135℃の乾燥
機で30秒乾燥し、樹脂が半硬化した状態である一次プ
リプレグAを得た。この一次プリプレグAは、一次ワニ
スAの樹脂含有量がクラフト紙に対して15%であっ
た。Example 1 The resin composition for primary impregnation and the primary impregnation were performed as follows. Resol type phenol reaction product A was obtained by reacting 100 parts by weight of phenol (hereinafter referred to as “part”) and 70 parts of 37% by weight (hereinafter referred to as “%”) formalin. Also,
Melamine 100 parts, formalin (solid content 37%) 100
Parts were reacted to obtain a melamine reaction product B. A mixture of 50 parts of this resol type phenol reaction product A and 50 parts of melamine reaction product B was diluted with an aqueous methanol solution in which water and methanol were mixed in a ratio of 1: 1 to obtain a resin composition for primary impregnation with a solid content of 15%. It was Weight of base material 126g / m 2
This kraft paper was first impregnated with the above resin composition for primary impregnation. Then, it was dried for 30 seconds in a dryer at 135 ° C. to obtain a primary prepreg A in which the resin was semi-cured. In this primary prepreg A, the resin content of the primary varnish A was 15% based on the kraft paper.
【0022】二次含浸に用いたフェノール樹脂組成物の
調製は次の様に行った。フェノール100部、37%の
ホルマリン80部、桐油30部を反応させ、桐油変性レ
ゾール型フェノール樹脂を作製した。この桐油変性レゾ
ール型フェノール樹脂100部に、ブロム系難燃剤とし
てテトラブロムビスフェノールAジグリシジルエーテル
を10部、リン系難燃剤としてトリフェニルホスフェイ
トを10部、窒素含有化合物として上記メラミン反応生
成物Bを15部、前記構造式〔1〕中のR1 、R2 、R
3 がエチレン(−CH2 CH2 −)で表されるシアヌレ
ート化合物を1部、ラジカル反応停止剤としてハイドロ
キノンを5部混合し、フェノール樹脂組成物を作製し
た。The phenol resin composition used for the secondary impregnation was prepared as follows. 100 parts of phenol, 80 parts of 37% formalin and 30 parts of tung oil were reacted to produce a tung oil-modified resol type phenol resin. To 100 parts of this tung oil-modified resol type phenolic resin, 10 parts of tetrabromobisphenol A diglycidyl ether as a bromine flame retardant, 10 parts of triphenyl phosphate as a phosphorus flame retardant, and the above melamine reaction product B as a nitrogen-containing compound. 15 parts of R 1 , R 2 and R in the structural formula [1]
3 is ethylene (-CH 2 CH 2 -) 1 parts cyanurate compound represented by hydroquinone were mixed 5 parts of a radical reaction inhibitor, to produce a phenolic resin composition.
【0023】二次含浸処理は次の様に行った。上記一次
プリプレグAに上記フェノール樹脂組成物を含浸し、1
55℃の乾燥機で100秒間処理し、樹脂が半硬化した
状態であるプリプレグBを製造した。このプリプレグB
中における、樹脂の含有量は50%であった。The secondary impregnation treatment was performed as follows. The primary prepreg A is impregnated with the phenol resin composition, and 1
The resultant was treated with a drier at 55 ° C. for 100 seconds to produce prepreg B in which the resin was in a semi-cured state. This prepreg B
The content of the resin therein was 50%.
【0024】次に、プリプレグBを8枚重ね、最上層に
厚さ0.035mmの銅箔を接着剤を介して配設し、こ
れを圧力100kg/cm2 、温度160℃で60分間
成形し、樹脂が完全に硬化した厚さ1.6mmの積層板
を得た。Next, eight prepregs B were stacked, a copper foil having a thickness of 0.035 mm was arranged on the uppermost layer through an adhesive, and this was molded at a pressure of 100 kg / cm 2 and a temperature of 160 ° C. for 60 minutes. Thus, a 1.6 mm thick laminated plate in which the resin was completely cured was obtained.
【0025】なお、上記一次含浸及び二次含浸の両方の
樹脂組成物の固形量に対し、上記リン系難燃剤のリン成
分の含有量は1重量%であり、上記ブロム系難燃剤のブ
ロム成分の含有量は7重量%であり、上記シアヌレート
化合物は1重量%であった。The phosphorus content of the phosphorus flame retardant is 1% by weight based on the solid amount of the resin composition of both the primary impregnation and the secondary impregnation, and the bromine component of the bromine flame retardant is 1% by weight. Was 7% by weight, and the cyanurate compound was 1% by weight.
【0026】実施例2 二次含浸に用いたフェノール樹脂組成物の配合におい
て、ハイドロキノンを1部とした以外は実施例1と同様
にして、一次プリプレグA及びプリプレグBの作製を行
い、積層板を得た。Example 2 A primary prepreg A and a prepreg B were prepared in the same manner as in Example 1 except that 1 part of hydroquinone was added in the formulation of the phenol resin composition used for the secondary impregnation, and the laminated plate was prepared. Obtained.
【0027】実施例3 二次含浸に用いたフェノール樹脂組成物の配合におい
て、ハイドロキノンを10部とした以外は実施例1と同
様にして、一次プリプレグA及びプリプレグBの作製を
行い、積層板を得た。Example 3 A primary prepreg A and a prepreg B were prepared in the same manner as in Example 1 except that 10 parts of hydroquinone was used in the compounding of the phenol resin composition used for the secondary impregnation, and the laminated plate was prepared. Obtained.
【0028】実施例4 二次含浸に用いたフェノール樹脂組成物の配合におい
て、ハイドロキノンに代わり有機過酸化物として1,4
−ビス(t−ブチルパーオキシイソプロピル)ベンゼン
(日本油脂株式会社製:パーブチルP)を0.5部とし
た以外は実施例1と同様にして、一次プリプレグA及び
プリプレグBの作製を行い、積層板を得た。Example 4 In the formulation of the phenol resin composition used for the secondary impregnation, 1,4 as an organic peroxide was used instead of hydroquinone.
-Preparation and lamination of primary prepreg A and prepreg B were carried out in the same manner as in Example 1 except that bis (t-butylperoxyisopropyl) benzene (Perbutyl P manufactured by NOF CORPORATION) was changed to 0.5 part. I got a plate.
【0029】実施例5 二次含浸に用いたフェノール樹脂組成物の配合におい
て、1,4−ビス(t−ブチルパーオキシイソプロピ
ル)ベンゼン(日本油脂株式会社製:パーブチルP)を
1部とした以外は実施例4と同様にして、一次プリプレ
グA及びプリプレグBの作製を行い、積層板を得た。Example 5 In the formulation of the phenolic resin composition used for the secondary impregnation, 1,4-bis (t-butylperoxyisopropyl) benzene (Perbutyl P manufactured by NOF Corporation) was used as 1 part. A primary prepreg A and a prepreg B were produced in the same manner as in Example 4 to obtain a laminated plate.
【0030】実施例6 二次含浸に用いたフェノール樹脂組成物の配合におい
て、1,4−ビス(t−ブチルパーオキシイソプロピ
ル)ベンゼン(日本油脂株式会社製:パーブチルP)を
2部とした以外は実施例4と同様にして、一次プリプレ
グA及びプリプレグBの作製を行い、積層板を得た。Example 6 In the formulation of the phenol resin composition used for the secondary impregnation, 2 parts of 1,4-bis (t-butylperoxyisopropyl) benzene (produced by NOF CORPORATION, perbutyl P) were used. A primary prepreg A and a prepreg B were produced in the same manner as in Example 4 to obtain a laminated plate.
【0031】実施例7 二次含浸に用いたフェノール樹脂組成物の窒素含有化合
物として上記メラミン反応生成物Bを15部とアニリン
0.2部を用いた以外は実施例1と同様にして、一次プ
リプレグA及びプリプレグBの作製を行い、積層板を得
た。Example 7 A primary resin was prepared in the same manner as in Example 1 except that 15 parts of the melamine reaction product B and 0.2 part of aniline were used as the nitrogen-containing compound of the phenol resin composition used for the secondary impregnation. A prepreg A and a prepreg B were produced to obtain a laminated board.
【0032】実施例8 ユリア100部、ホルマリン(固形分37%)100部
を反応させてユリア樹脂Cを得た。二次含浸に用いたフ
ェノール樹脂組成物の窒素含有化合物として上記ユリア
樹脂Cを15部用いた以外は実施例1と同様に、一次プ
リプレグA及びプリプレグBの作製を行い、積層板を得
た。Example 8 Urea resin C was obtained by reacting 100 parts of urea with 100 parts of formalin (37% solid content). A primary prepreg A and a prepreg B were produced in the same manner as in Example 1 except that 15 parts of the above urea resin C was used as the nitrogen-containing compound of the phenol resin composition used for the secondary impregnation to obtain a laminated plate.
【0033】実施例9 メチレンビスパラフェニレンジイソシアネート(MD
I:三井東圧化学株式会社製)100部とビスフェノー
ルA100部を反応させてウレタン樹脂Dを得た。二次
含浸に用いたフェノール樹脂組成物の窒素含有化合物と
して上記ウレタン樹脂Dを15部用いた以外は実施例1
と同様に、一次プリプレグA及びプリプレグBの作製を
行い、積層板を得た。Example 9 Methylenebisparaphenylene diisocyanate (MD
I: manufactured by Mitsui Toatsu Chemicals, Inc.) 100 parts and bisphenol A 100 parts were reacted to obtain urethane resin D. Example 1 except that 15 parts of the urethane resin D was used as the nitrogen-containing compound of the phenol resin composition used for the secondary impregnation.
A primary prepreg A and a prepreg B were prepared in the same manner as in 1. to obtain a laminated plate.
【0034】実施例10 二次含浸に用いたフェノール樹脂組成物のリン系難燃剤
としてクレジルジフェニルホスフェイトを20部用いた
以外は実施例1と同様にして、一次プリプレグA及びプ
リプレグBの作製を行い、積層板を得た。なお、上記一
次含浸及び二次含浸の両方の樹脂組成物の固形量に対
し、上記リン系化合物のリン成分の含有量は2重量%で
あった。Example 10 Preparation of primary prepreg A and prepreg B was carried out in the same manner as in Example 1 except that 20 parts of cresyl diphenyl phosphate was used as the phosphorus-based flame retardant of the phenol resin composition used for the secondary impregnation. Then, a laminated plate was obtained. In addition, the content of the phosphorus component of the phosphorus compound was 2% by weight based on the solid amount of the resin composition in both the primary impregnation and the secondary impregnation.
【0035】比較例1 二次含浸に用いたフェノール樹脂組成物の調製は次の様
に行った。フェノール100部、37%のホルマリン8
0部、桐油30部を反応させ、桐油変性レゾール型フェ
ノール樹脂を作製した。この桐油変性レゾール型フェノ
ール樹脂100部に、ブロム系難燃剤としてテトラブロ
ムビスフェノールAジグリシジルエーテルを10部、リ
ン系難燃剤としてトリフェニルホスフェイトを10部、
窒素含有化合物として上記メラミン反応生成物Bを15
部混合し、フェノール樹脂組成物を作製した。このフェ
ノール樹脂組成物を用いた以外は実施例1と同様にし
て、一次プリプレグA及びプリプレグBの作製を行い、
積層板を得た。Comparative Example 1 The phenol resin composition used for secondary impregnation was prepared as follows. Phenol 100 parts, 37% formalin 8
0 part and 30 parts of tung oil were reacted to prepare a tung oil-modified resol type phenol resin. To 100 parts of this tung oil-modified resol type phenolic resin, 10 parts of tetrabromobisphenol A diglycidyl ether as a bromine flame retardant and 10 parts of triphenyl phosphate as a phosphorus flame retardant,
The melamine reaction product B as a nitrogen-containing compound
Parts were mixed to prepare a phenol resin composition. A primary prepreg A and a prepreg B were produced in the same manner as in Example 1 except that this phenol resin composition was used.
A laminated board was obtained.
【0036】得られた実施例1〜10、及び比較例1の
積層板の難燃性、及び耐熱性を評価した。難燃性は、U
L試験法に基づいて消炎時間を10個測定し、平均値と
最大値を求めた。耐熱性は半田耐熱性とオーブン耐熱性
を測定した。上記半田耐熱性は260℃の半田にフロー
トし、ふくれ発生までの時間を測定した。上記オーブン
耐熱性は所定の雰囲気温度のオーブンに30分放置した
後、外観を目視で観察し、ふくれが発生したものを不合
格、ふくれがないものを合格とし、合格する限界温度を
求めた。The flame retardancy and heat resistance of the obtained laminated plates of Examples 1 to 10 and Comparative Example 1 were evaluated. Flame retardance is U
Ten extinction times were measured based on the L test method, and an average value and a maximum value were obtained. For heat resistance, solder heat resistance and oven heat resistance were measured. The solder heat resistance was measured by floating the solder at 260 ° C. and measuring the time until the occurrence of blistering. Regarding the above-mentioned oven heat resistance, after leaving it in an oven having a predetermined atmosphere temperature for 30 minutes, the appearance was visually observed, and those with blisters were rejected, those without blisters were accepted, and the limit temperature at which they passed was determined.
【0037】結果は表1に示したとおり、実施例1〜1
0はいずれも難燃性の水準として最大燃焼時間が10秒
以下の高難燃性を達成し、且つ、耐熱性も良好であっ
た。比較例1は難燃性が劣っていた。The results are shown in Table 1, Examples 1 to 1
In all 0, the flame retardancy was high and the maximum combustion time was 10 seconds or less, and the heat resistance was good. Comparative Example 1 was inferior in flame retardancy.
【0038】[0038]
【表1】 [Table 1]
【0039】[0039]
【発明の効果】本発明の請求項1又は請求項2記載のフ
ェノール樹脂組成物を用いると、ブロム系難燃剤の使用
量を削減しても、耐熱性が良好で、難燃性の向上した積
層板が得られる。When the phenol resin composition according to claim 1 or 2 of the present invention is used, the heat resistance is good and the flame retardancy is improved even if the amount of the bromine flame retardant used is reduced. A laminate is obtained.
【0040】本発明の請求項3に係るプリプレグは上記
フェノール樹脂組成物を用いるので、このプリプレグを
用いるた積層板は、耐熱性が良好で、難燃性が向上す
る。Since the prepreg according to claim 3 of the present invention uses the above-mentioned phenol resin composition, the laminated board using this prepreg has good heat resistance and improved flame retardancy.
【0041】本発明の請求項4に係る積層板は上記プリ
プレグを用いるので、ブロム系難燃剤の使用量が削減で
き、且つ、耐熱性が良好で、難燃性が優れる。Since the laminated board according to claim 4 of the present invention uses the prepreg, the amount of the brominated flame retardant used can be reduced, and the heat resistance is excellent and the flame retardancy is excellent.
Claims (4)
るフェノール樹脂組成物であって、上記組成物中に、メ
ラミン樹脂、ユリア樹脂、ウレタン樹脂の単独、変性
物、これら樹脂含有化合物、及び、ジシアンジアミド、
アニリンからなる群から選ばれた少なくとも1種以上の
窒素含有化合物、有機過酸化物、ラジカル反応停止剤の
うち少なくとも1種以上のラジカルトラップ剤、並び
に、下記構造式〔1〕で表されるシアヌレート化合物を
成分として含有し、且つ、上記樹脂組成物中のブロム成
分の含有量が樹脂固形分に対し、1〜8重量%であるこ
とを特徴とするフェノール樹脂組成物。 【化1】 〔式中R1 , R2 , R3 はアルキル基を示す。〕1. A phenolic resin composition containing a phosphorus-based flame retardant and a bromine-based flame retardant, wherein a melamine resin, a urea resin, a urethane resin alone or a modified product thereof, a resin-containing compound thereof, And dicyandiamide,
At least one nitrogen-containing compound selected from the group consisting of aniline, at least one radical trapping agent among organic peroxides and radical reaction terminators, and cyanurate represented by the following structural formula [1] A phenol resin composition comprising a compound as a component, and the content of the bromine component in the resin composition is 1 to 8% by weight based on the resin solid content. Embedded image [In the formula, R 1, R 2 and R 3 represent an alkyl group. ]
ンであることを特徴とする請求項1記載のフェノール樹
脂組成物。2. The phenolic resin composition according to claim 1, wherein the radical reaction terminator is hydroquinone.
樹脂組成物を基材に含浸し、この含浸したフェノール樹
脂組成物の樹脂が半硬化した状態にあることを特徴とす
るプリプレグ。3. A prepreg characterized in that a substrate is impregnated with the phenol resin composition according to claim 1 or 2, and the resin of the impregnated phenol resin composition is in a semi-cured state.
脂が完全に硬化した状態にあることを特徴とする積層
板。4. A laminate comprising the prepreg according to claim 3 and a resin in a completely cured state.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15163495A JPH093303A (en) | 1995-06-19 | 1995-06-19 | Phenolic resin composition, prepreg produced using same and laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15163495A JPH093303A (en) | 1995-06-19 | 1995-06-19 | Phenolic resin composition, prepreg produced using same and laminate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH093303A true JPH093303A (en) | 1997-01-07 |
Family
ID=15522839
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15163495A Withdrawn JPH093303A (en) | 1995-06-19 | 1995-06-19 | Phenolic resin composition, prepreg produced using same and laminate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH093303A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100451482B1 (en) * | 2002-04-24 | 2004-10-11 | 우진물산 주식회사 | Floors made from phenol composite resin |
-
1995
- 1995-06-19 JP JP15163495A patent/JPH093303A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100451482B1 (en) * | 2002-04-24 | 2004-10-11 | 우진물산 주식회사 | Floors made from phenol composite resin |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20020903 |