JPH09330971A - Substrate treating device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate treating device which can freely change the positional relation between an interface and a treating unit. SOLUTION: A substrate treating device 100 is provided with an exposure treating unit STP, an interface IFB, and a treating unit 101. The transporting path R1 of the treating unit 101 is extended along the boundary between the unit 101 and the interface IFB. A substrate W coated with a resist by means of the unit 101 is delivered to a substrate transferring robot 20 from a substrate transporting device TR1 through an opening P1. The interface IFB delivers the received substrate W to the unit STP and, after the substrate W is exposed, and the exposed substrate W to the substrate transporting device TR1 of the unit 101. The exposed substrate W is subjected to development at the unit 101.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a series of processes (for example, a resist coating process) for a thin substrate (hereinafter, referred to as a "substrate") such as a semiconductor substrate or a liquid crystal glass substrate.
The present invention relates to a substrate processing apparatus that performs exposure processing, development processing, etc.).

[0002]

2. Description of the Related Art As is well known, various surface treatments such as resist coating, exposure and development are performed on the above substrate. Generally, these processes are performed by a substrate processing apparatus including a processing unit that performs a process such as a resist coating process and a developing process, an exposure processing unit that performs an exposure process, and an interface that connects the two units. .

FIG. 13 is a plan view showing the structure of a conventional substrate processing apparatus 200. The substrate processing apparatus 200 includes an exposure processing unit STP, an interface IF2,
And a processing unit 201. In FIG. 13, an XYZ orthogonal coordinate system is attached for ease of explanation.

The exposure processing unit STP is a unit for performing exposure processing on a substrate on which a resist has been applied, and integrally forms an exposure machine and a robot for carrying in and out the substrate.

The processing unit 201 is a unit for performing pre- and post-exposure processing. In the processing unit 201, resist coating processing, developing processing, heat treatment and the like are performed.
The processing unit 201 includes a processing unit row 230 and a processing unit row 24.
It has 0 and an indexer ID. Indexer ID
Is a processing device that carries out and carries in a substrate, includes a substrate transfer device 225, and has a carrier 220 capable of accommodating the substrates in multiple stages mounted detachably. The substrate transfer device 225 is movable not only in the Y-axis direction in the drawing but also in the Z-axis direction. It has a function of receiving the processed substrate from the substrate transport device TR and storing the processed substrate in the carrier 220.

The processing section array 230 includes a heat treatment section 210 and edge exposure apparatuses EEW1 and EEW2. The heat treatment section 210 includes a hot plate for heating the substrate and a cool plate for cooling the substrate. Further, at a position facing the processing unit row 230 across the transport path R2,
The processing unit row 240 is formed, and the processing unit row 240 is formed.
Is a spin coater (rotary resist coating device) SC1,
SC2 and spin developer (rotary developing device) SD1,
And SD2. The substrate transfer device TR is movable in the X-axis direction along the transfer path R2, and
It is also possible to move and rotate in the Z-axis direction, and the substrate is transferred between the processing units provided in the processing unit row 230 and the processing unit row 240, respectively.

The board paid out from the indexer ID is:
A resist coating process is performed in the spin coater SC1 or SC2, an edge exposure process is performed in the edge exposure device EEW1 or EEW2, and a heating process and a cooling process are performed in the heat treatment section 210. The transfer between the processing units is performed by the substrate transfer device TR, and the substrate after the resist coating process is also transferred by the substrate transfer device TR and transferred to the interface IF2 through the opening P2.

[0008] The interface IF2 includes a substrate transport device 270, a buffer unit 260, a substrate loading unit 255,
And a substrate unloading section 250. Substrate transfer device 270
Has a configuration similar to that of the substrate transport apparatus TR of the processing unit 201, is movable in the Y-axis direction, and is also capable of moving and rotating in the Z-axis direction. When a substrate coated with resist is passed to interface IF2,
The substrate transfer device 270 receives the substrate and the substrate loading unit 2
55. The substrate placed on the substrate loading section 255 is loaded by the loading / unloading robot of the exposure processing unit STP, and then subjected to exposure processing.

The substrate after the exposure processing is again placed on the substrate carrying-out section 250 by the carrying-in / out robot. Then, the substrate placed on the substrate unloading section 250 receives the substrate transfer device 270.
By the processing unit 2 through the opening P2
01 is transferred to the substrate transport device TR.

The substrate subjected to the exposure processing returned to the processing unit 201 is carried into the spin developer SD1 or SD2 by the substrate transport apparatus TR and subjected to the development processing, and then returned to the indexer ID again by the substrate transport apparatus TR. .

As described above, a series of processing in the substrate processing apparatus 200 is completed, and the developed substrate is stored in the carrier 220 and carried out of the apparatus.

[0012]

Generally, the substrate processing apparatus 200 as described above is installed and used in a clean room of a factory, etc., but other apparatuses and devices (for example, It is also necessary to install an automatic transportation vehicle for transporting the substrate, and in order to avoid interference with those devices and improve workability, the relative positional relationship between the exposure processing unit STP, the interface IF2 and the processing unit 201. Sometimes you want to change the.

However, the substrate processing apparatus 20 described above
0, the substrate transfer device TR and the substrate transfer device 270
It is necessary for and to transfer the substrate through the opening P2. The position where the opening P2 is provided is the processing unit 2
The end of the transfer path R2 of 01 (the side opposite to the indexer ID) and the side surface of the interface IF2 (the surface parallel to the Y-axis) are limited to the positions where the substrate transfer device 270 can move, and thus the interface. It is difficult to greatly change the positional relationship between the IF 2 and the processing unit 201.

In view of the above problems, it is an object of the present invention to provide a substrate processing apparatus capable of freely changing the positional relationship between the interface and the processing unit.

[0015]

In order to solve the above problems, the invention of claim 1 provides a substrate processing apparatus for performing a series of processing on a substrate, comprising: (a) a plurality of processing units for processing the substrate; A first processing unit having a transfer unit that moves on a predetermined transfer path to transfer the substrate between the plurality of processing units; and (b) is disposed at a predetermined interval from the first processing unit, A second processing unit that performs a predetermined process on the substrate; and (c) the space formed between the first processing unit and the second processing unit so as to contact the transport path of the transport unit. And an interface unit for transferring the substrate between the first processing unit and the second processing unit, the transfer path of the transfer unit along the boundary between the first processing unit and the interface unit. Is stretching.

According to a second aspect of the present invention, in the substrate processing apparatus according to the first aspect of the invention, the interface unit includes (c-1) a substrate storing section for storing a plurality of substrates, and (c-1)
-2) A first substrate transfer mechanism that transfers the substrate to and from the transfer unit and transfers the substrate to and from the substrate storage unit; and (c-3) transfers the substrate to and from the second processing unit. And a second substrate carrying mechanism for carrying in and carrying out the substrate to and from the substrate housing section.

[0017]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described in detail below with reference to the drawings.

A. Overall Structure of Substrate Processing Apparatus: FIG. 1 is a plan view of a substrate processing apparatus 100 according to the present invention. In FIG. 1, an XYZ orthogonal coordinate system is attached for ease of explanation.
The substrate processing apparatus 100 includes an exposure processing unit STP.
, An interface IFB, and a processing unit 101. As will be described later, in the substrate processing apparatus 100 according to the present invention, the transport path R1 extends along the boundary between the processing unit 101 and the interface IFB.

A-1. Configuration of processing unit: The processing unit 101 includes an indexer ID for loading and unloading the substrate W,
Processing unit row 120, processing unit row 130, and substrate transfer device T
It has R1 and TR2.

The indexer ID is the substrate transfer device 15,
And a substrate delivery table 16. Indexer I
D includes four carriers 10 capable of storing substrates W in multiple stages.
Is detachably mounted. Note that the number of carriers 10 is not limited to four, and one or more carriers 10 may be placed. In addition, the carrier 10 containing the unprocessed substrate
Is transferred to the indexer ID from the automatic transfer apparatus AGV that travels in the X-axis direction near the substrate processing apparatus 100. Conversely, the carrier 10 storing the processed substrate is automatically transferred to the automatic transfer apparatus A.
The GV takes out the indexer ID and transports it.

The substrate transfer device 15 is movable in the X-axis direction (width direction of the processing unit 101) and is also capable of moving and rotating in the Z-axis direction (vertical direction).
The substrate transfer device 15 takes out the substrate W from the carrier 10 placed on the indexer ID, transports the substrate W in the X-axis direction, and places the substrate W on the substrate transfer table 16. When the processed substrate W is placed on the substrate delivery table 16, the substrate transfer device 15 takes out the substrate W and stores it in the carrier 10.

The processing unit 101 has two processing unit rows and two transport paths, and among these, the processing unit row 1
20 is a spin coater SC for applying a resist to the substrate W.
1, SC2 and spin developer SD for development processing
1 and SD2, the processing unit array 130 includes edge exposure apparatuses EE1 and EE2 that perform an edge exposure process, and a heat treatment unit 105.
It is provided with. The transport path R1 is provided facing the side surface of the processing unit 101, and extends along the boundary between the processing unit 101 and the interface IFB. The transport path R2 is provided between the processing unit row 120 and the processing unit row 130. Two transport paths R1 and R
Substrate transfer devices TR1 and TR2 are arranged at 2, respectively.

FIG. 2 is a diagram for explaining the operation of the substrate transfer device TR1. The substrate transfer device TR1 includes a male screw of a ball screw (not shown) provided in the transport path R1, a motor for rotating the male screw, and a guide rail.
The transport path R1 is configured to be movable in the Y-axis direction in FIG. Further, the main body portion T1 of the substrate transfer device TR1 can be rotated and vertically moved by a rotation mechanism and a drive mechanism provided below the main body portion T1. An arm support member T2 is installed on the upper surface of the main body T1, and the arm support member T2 can be moved back and forth by a drive mechanism provided in the main body T1. Further, an arm T3 is fixedly attached to the tip of the arm support member T2. The arm T3 is a substantially arc-shaped member having a diameter larger than that of the substrate W and extending along the outer periphery of the substrate, and three substrate supporting members T3a are provided on the inner diameter side thereof so as to project.

When the substrate transfer device TR1 takes out the substrate W placed at the substrate placement position WP, FIG.
, The arm support member T2 moves forward to move the arm T
3 reaches a position where the substrate W can be received. And FIG.
As shown in (b), the substrate W is placed on the substrate supporting member T3a of the arm T3 by raising the main body portion T1, and then the arm supporting member T2 is retracted to complete the substrate take-out work. On the contrary, the substrate transfer device TR
When the substrate W is mounted on the substrate mounting position WP by the apparatus 1, the arm T3 on which the substrate W is mounted advances to a position above the substrate mounting position WP, and then the main body portion T1 descends to move the substrate W onto the substrate W. It is placed on the pin WPa provided at the placement position WP. Then, the substrate mounting work is completed by retracting the arm T3. The substrate transfer device TR2 provided on the transfer path R2 is also configured similarly to the substrate transfer device TR1 and performs the same operation.

Returning to FIG. 1, the thermal processing section 105 of the processing section array 130 will be described. In FIG. 3, the heat treatment unit 105 is set to Y
It is sectional drawing cut | disconnected and seen by Z plane. As shown, the heat treatment unit 105 includes a hot plate HP for heating the substrate,
Cool plate CP for cooling the substrate and substrate transfer section I
It has a laminated structure of FW. In FIG. 3,
Although the laminated structure is formed in three rows, it is not limited to three rows, and it is sufficient if one or more rows are formed. Further, the laminated structure itself is not limited to the form as shown in FIG. 3, and for example, a part of the upper three hot plates HP may be replaced with a spare cool plate CP.

FIG. 4 is a sectional view of the processing unit 101 as seen along the line VV. However, this drawing illustrates a case where the substrate transfer devices TR1 and TR2 exist on the line VV. As shown in the figure, the substrate entrance to the hot plate HP is provided only on the side of the transport path R1, whereas the cool plate CP and the substrate delivery unit IFW are provided.
Are provided on both sides of the transport path R1 and the transport path R2. By doing so, the heat of the hot plate HP is not released to the transport path R2,
Spin developers SD1 and SD facing the transport path R2
2 and the spin coaters SC1 and SC2 perform a thermally stable process. Also, spin developers SD1 and S
Since the arm of the substrate transfer device TR2 that accesses the D2 and the spin coaters SC1 and SC2 does not directly contact the heated substrate W, a thermally stable process is performed in the rotation processing unit.

Substrate transfer device TR1 and substrate transfer device TR2
The transfer of the substrate W is performed through the cool plate CP and the substrate transfer unit IFW. That is, as will be described later, when the substrate transport device TR1 transfers the substrate W to the substrate transport device TR2, the substrate transport device TR1 once places the substrate W on the cool plate CP, and then the substrate W is transported to the substrate transport device TR2. To receive. On the contrary, when the substrate transfer apparatus TR2 transfers the substrate W to the substrate transfer apparatus TR1, the substrate transfer apparatus TR2 places the substrate W on the substrate transfer section IFW, and then the substrate transfer apparatus TR1 receives the substrate W. Here, the substrate W is placed and received on the cool plate CP and the substrate transfer part IFW by the operation as shown in FIG.

A-2. Interface Structure: As shown in FIG. 1, the interface IFB is provided in contact with the side surface in the longitudinal direction of the transfer path R1 of the substrate transfer apparatus TR1. The substrate W on which the resist coating has been completed in the processing unit 101 is transferred to the interface IFB by the substrate transfer device TR1.

FIG. 5 is a side view of the interface IFB as seen from the exposure processing unit STP side. The interface IFB includes a substrate transfer robot (first substrate transfer mechanism) 20 and a substrate transfer robot (second substrate transfer mechanism).
21, a buffer unit (substrate storage unit) 25, a substrate loading table 31, a substrate unloading table 32, and table tables 26 and 27. In addition, FIG. 6 is a perspective view illustrating a state around the buffer unit 25.

The substrate transfer robot 20 has a main body portion 20.
b is movable in the Z-axis direction (vertical direction) by a motor 20e and a male screw 20d, and is rotatable by a motor 20c. That is, the main body 20
The support shaft 20g of b is screwed to the male screw 20d, and the male screw 20d connected to the motor 20e rotates in the forward or reverse direction, whereby the main body portion 20b moves up and down. In addition, the motor 20 connected to the main body 20b
With the rotation of c in the forward and reverse directions, the main body portion 20b rotates.

The arm 20a is provided on the upper surface of the main body 20b.
And a substrate support pin 20f (see FIG. 6). Then, by the drive mechanism built in the main body portion 20b, the front-back movement of the arm 20a and the substrate support pin 20f are performed.
It is configured to be able to move up and down. Therefore, the arm 20a can move up and down and rotate as the body 20b moves up and down, and can also move back and forth by the drive mechanism of the body 20b.

The substrate W for which the resist coating process has been completed in the processing unit 101 is transferred from the substrate transfer device TR1 to the substrate transfer robot 20 of the interface IFB,
Conversely, the substrate W after the exposure processing is transferred to the substrate transfer robot 2
From 0, it is transferred to the substrate transport device TR1. Note that an opening P1 for this operation is provided on the connection portion between the interface IFB and the processing unit 101 on the side of the substrate transfer robot 20.

FIG. 7 is a diagram for explaining the transfer of the substrate W between the substrate transfer device TR1 and the substrate transfer robot 20. When the substrate W is transferred from the substrate transfer device TR1 to the substrate transfer robot 20, as shown in FIG. 7A, the arm T3 of the substrate transfer device TR1 moves forward to move the arm T3.
The substrate W on which the substrate 3 is mounted is positioned above the substrate transfer robot 20. Next, as shown in FIG. 7B, the substrate support pins 20f of the substrate transfer robot 20 move up and the substrate W is placed on the substrate support pins 20f. afterwards,
As the arm T3 retracts and the substrate support pin 20f descends, the substrate W is transferred to the arm 2 of the substrate transfer robot 20.
0a will be placed.

From the substrate transfer robot 20 to the substrate transfer device T
When the substrate W is transferred to R1, it is performed in the reverse process to the above. That is, the arm 20a of the substrate transfer robot 20
After the substrate W placed on the substrate W is lifted by the rise of the substrate support pins 20f, the arm T3 of the substrate transfer device TR1 advances to a position below the substrate W. And
By lowering the substrate support pin 20f, the arm T
The substrate W is placed on the substrate 3.

Returning to FIG. 6, the transfer of the substrate W in the interface IFB before and after the exposure process will be described. The substrate W before exposure processing (after resist coating) is transferred from the substrate transfer robot 20 to the substrate transfer robot 21, and the substrate W after exposure processing is transferred from the substrate transfer robot 21 to the substrate transfer robot 20. Passed. These deliveries are
This is performed via the buffer unit 25. The buffer unit 25
A plurality of storage shelves 25a that support the peripheral edge of the substrate W are stacked and configured (see FIG. 6).

FIG. 8 is a diagram for explaining the transfer of the substrate W between the buffer unit 25 and the substrate transfer robot 20.
When the substrate W is transferred from the substrate transfer robot 20 to the buffer unit 25, the arm 20a of the substrate transfer robot 20 is inserted into a predetermined storage rack 25a and then slightly lowered.
At this time, the substrate W is in a state in which its peripheral end is supported by the storage rack 25a. Then, after that, the arm 20a retracts to complete the storage in the buffer unit 25. When the substrate transfer robot 20 takes out the substrate W from the buffer unit 25, contrary to the above, the arm 20a is inserted below the intended storage shelf 25a, and then the substrate W is slightly raised to the arm 20a. Placed. Then, by retracting the arm 20a, the work of taking out the substrate W from the buffer unit 25 is completed.

Next, the substrate transfer robot 21 will be described. The substrate transfer robot 21 is a robot that transfers the substrate W between the buffer unit 25 and the substrate loading table 31 or the substrate unloading table 32. The difference between the substrate transfer robot 21 and the substrate transfer robot 20 is that the substrate transfer robot 21 can be moved in the horizontal direction (Y-axis direction) by a motor 21e, a male screw 21c, and a guide rail 21d. The main part 21b is not provided with a substrate support pin that moves up and down, and the other points are the same as those of the substrate transfer robot 20. That is, the lower end of the vertical movement mechanism 21f of the substrate transfer robot 21 has the male screw 21c.
And is slidably fitted to the guide rail 21d. Then, the motor 21e connected to the male screw 21c rotates in the forward or reverse direction, whereby the substrate transfer robot 21 moves forward or backward in the Y-axis direction. Further, an arm 21a which can be moved back and forth by a driving mechanism inside the main body 21b of the substrate transfer robot 21 is provided on an upper surface of the main body 21b.

The substrate W is transferred between the substrate transfer robot 21 and the buffer unit 25 by the substrate transfer robot 20.
This is the same as the transfer of the substrate W between the buffer section 25 and the buffer section 25 (see FIG. 8). Further, pins 31a and 32a are provided on the substrate loading table 31 and the substrate unloading table 32, respectively. The placement of the substrate W on the substrate loading table 31 and the removal of the substrate W from the substrate unloading table 32 are performed by these pins. Pin 31
a, 32a. That is, the substrate loading table 3
When the substrate W is placed on the substrate 1, the arm 21 a moves above the substrate loading table 31 and then descends so that the substrate W moves to the pin 31.
It is placed on a. Then, the mounting is completed by the retreat of the arm 21a. The substrate W placed on the pins 31a is taken into the exposure processing unit STP and subjected to exposure processing.

The substrate W after the exposure processing is placed on the pins 32a of the substrate unloading table 32. Then, the substrate unloading table 3
When the substrate W is taken out from the substrate 2, the arm 21a moves below the substrate W placed on the pins 32a, and then moves upward, so that the substrate W is placed on the arm 21a. Then, the arm 21a retreats and the removal of the substrate W is completed.

The interface IFB is provided with table bases 26 and 27. This table stand 2
Carriers 26a and 27a containing one or a plurality of substrates can be mounted on the substrates 6 and 27, respectively.
If you want to test the substrate W for exposure,
When it is desired to perform a special process other than the process performed by the processing unit 101 before and after the exposure process, the substrate W is set to the carrier 26.
a and 27a and placed on the table bases 26 and 27. This mounting operation is performed by the interface IFB.
The opening is performed by an operator opening a door 35 (see FIG. 1) provided in the first embodiment. The substrates W stored in the carriers 26 a and 27 a placed on the table bases 26 and 27 are taken out by the substrate transfer robot 21 and loaded into the substrate loading base 31, and then subjected to the exposure processing. Also, the substrate unloading table 3
The substrate W after the exposure processing that has been carried out to the substrate 2 is taken out by the substrate transfer robot 21, and the carrier 26a or 27
The substrate W is stored at the original position where the substrate W was stored.

A-3. Structure of exposure processing unit: The exposure processing unit STP is a device that performs exposure processing on the substrate W on which the resist has been applied.
It is arranged on the opposite side of the processing unit 101 with the sandwiched therebetween. The exposure processing unit STP includes an exposure device and a robot for loading and unloading the substrate. The robot is equipped with a board loading table 31 of the interface IFB.
The substrate W placed on the substrate is loaded and set in the exposure device, or the exposed substrate W is unloaded to the substrate unloading table 32.

Further, the exposure processing unit STP is provided with a maintenance door 51, and an operator opens the maintenance door 51 to perform maintenance work on the robot or the like.

B. Substrate Processing Procedure: The substrate processing apparatus 100 according to the present invention has been described above. The substrate W processing procedure in the substrate processing apparatus 100 will be briefly described with reference to FIG.

As described above, the substrate processing apparatus 100 is
The substrate W is an apparatus that performs resist coating processing, exposure processing, and development processing on the substrate W.
The GV carries the indexer ID from outside the device. At this time, the plurality of substrates W are stored in the carrier 10 and carried in. The loaded substrate W is transferred to the substrate transfer device 1
The wafers 5 are taken out one by one from the carrier 10, transported to the substrate delivery table 16, and placed on the substrate delivery table 16.

Next, the substrate W placed on the substrate transfer table 16 is taken out by the substrate transfer device TR1, transferred to the heat treatment section 105, and inserted into the hot plate HP. Substrate W after heat treatment on hot plate HP
Is inserted into the cool plate CP by the substrate transfer device TR1 and a cooling process is performed. Then, the substrate W after the cooling process is taken out by the substrate transfer device TR2 and is transferred to perform the resist coating process, and the spin coater SC1.
Or it is carried into SC2.

The substrate W for which the resist coating process has been completed is carried out and carried by the substrate carrying device TR2, and the heat treatment section 1 is carried out.
05 is transferred to the substrate transfer device TR1 through the substrate transfer part IFW provided in 05, and after the same heat treatment process as described above, the substrate transfer device TR2 again causes the edge exposure device E to move.
The wafer is carried into E1 or EE2 and subjected to edge exposure processing. The substrate W for which the edge exposure processing has been completed is carried out and transported by the substrate transport device TR2, and the substrate transport device TR is transferred via the substrate transfer part IFW provided in the thermal processing section 105.
1 and after undergoing the same heat treatment process as above, this time, the cool plate CP is moved by the substrate transfer device TR1.
It is taken out from, transported, and passed to the substrate transfer robot 20 of the interface IFB through the opening P1.

The substrate transfer robot 20 that has received the resist-coated substrate W stores the substrate W in the storage rack 25 a of the buffer unit 25. The substrate W stored in the buffer unit 25 is taken out by the substrate transfer robot 21,
It is transported to the substrate loading table 31 and placed there. The substrate W placed on the substrate loading table 31 has the exposure processing unit STP.
And is exposed to light, and then placed on the substrate unloading table 32 of the interface IFB. The substrate W placed on the substrate unloading table 32 is transferred to the substrate transfer robot 2
1 is stored again in the buffer unit 25. afterwards,
The substrate W is taken out of the buffer section 25 by the substrate transfer robot 20 and transferred to the substrate transfer device TR1 of the processing unit 101 through the opening P1.

In the above, when both the processing unit 101 and the exposure processing unit STP are performing processing smoothly, the buffer section 25 functions only as a delivery table, but the buffer section 25 has a plurality of storage shelves 25a.
6 (see FIG. 6), the exposure processing time by the exposure processing unit STP becomes longer or shorter, and the loading / unloading timing of the substrate W to / from the exposure processing unit STP and the loading / unloading timing of the substrate W to / from the processing unit 101 are provided. Even if the above are different from each other, temporarily storing the plurality of substrates W in the plurality of storage shelves 25a does not cause a disadvantage such as delaying the processing of one unit. That is,
For example, when the processing of the exposure processing unit STP is delayed, the resist-coated substrate W is temporarily transferred to the buffer unit 2
If plural sheets are stored in 5, it is not necessary to interrupt the processing of the processing unit 101. Also, the interface IFB
Since the two substrate transfer robots are provided via the buffer unit 25, the substrate W can be smoothly and rapidly moved between the exposure processing unit STP and the processing unit 101.

Returning to FIG. 1, the exposed substrate W transferred to the substrate transfer device TR1 is transferred to the heat treatment section 105, transferred to the substrate transfer device TR2 via the cool plate CP, and then the spin developer. It is carried into SD1 or SD2 and subjected to development processing.

The substrate W after the development processing is transferred to the substrate transfer device TR.
2 is carried out and conveyed, and is transferred to the substrate transfer device TR1 through the substrate transfer part IFW provided in the heat treatment part 105, and after the heat treatment part 105 is heated and cooled, the substrate transfer device TR1 transfers the substrate. It is transported to the table 16 and placed on the substrate delivery table 16.

The processed substrate W placed on the substrate transfer table 16 is taken out by the substrate transfer device 15 and stored in the carrier 10. The carrier 10 in which the processed substrate W is stored is eventually carried out of the apparatus by the automatic carrier AGV.

Although a series of processes are performed as described above, the substrate processing apparatus 100 according to the present invention is not limited to the above process steps. For example, in the above, the substrate W is transferred from the substrate transfer device 15 to the substrate transfer device TR1 via the substrate transfer table 16, but the substrate transfer device 15 directly transfers the substrate W to the substrate transfer device TR.
Alternatively, the substrate W may be delivered to or from the substrate transport device TR2.

Further, as shown in FIG. 9, the interface IFB is provided with the substrate transfer table 28 and the opening P
1 may be provided at the side of the substrate transfer table 28, and the substrate W is transferred between the substrate transfer device TR1 and the substrate transfer robot 20 via the substrate transfer table 28. In addition,
In this case, the substrate W can be transferred without providing the substrate support pins 20f on the main body portion 20b of the substrate transfer robot 20.

The structure of the substrate processing apparatus 100 according to the present invention and the substrate processing procedure thereof have been described above. In the substrate processing apparatus 100, the transport path R1 extends along the boundary between the processing unit 101 and the interface IFB. Therefore, the interface IFB is connected to the transport path R1.
Can be installed at any position in the longitudinal direction, and the relative positional relationship between the interface IFB and the processing unit 101 can be freely changed. Further, in the substrate processing apparatus 100 according to the present invention, since the processing unit 101 has a rectangular shape, the installation space of the entire apparatus can be made compact as compared with the conventional substrate processing apparatus 200 (see FIG. 13).

[0055]

[Modification] The embodiment of the present invention has been described above, but the present invention is not limited to the above-mentioned example. For example, the arrangement of the substrate processing apparatus according to the present invention is as follows. May be.

FIG. 10 and FIG. 11 are plan views showing another positional relationship between the interface IFB and the processing unit 101. In the arrangement shown in FIG. 10, the interface IFB and the exposure processing unit STP are displaced from the processing unit 101 in the positive Y-axis direction (leftward in the drawing) as compared with the arrangement of the embodiment shown in FIG. There is. With this configuration, there is no concern that the opening / closing of the maintenance door 51 of the exposure processing unit STP and the movement of the automatic transport device AGV interfere with each other. Therefore, this arrangement is suitable when the exposure processing unit STP is frequently maintained and inspected.

Further, the arrangement shown in FIG. 11 shows a case where an exposure processing unit STP of the type in which the maintenance door 51 is provided on the left side of the drawing is used. In this case, the interface IFB may be used in a form symmetrical with the form shown in FIG. 1 in the figure. Even in this case, there is no concern that the opening / closing of the maintenance door 51 of the exposure processing unit STP and the movement of the automatic transport device AGV interfere with each other.

Note that the relative positional relationship between the interface IFB and the processing unit 101 can be other than the above-described form, and the substrate W is transferred between the substrate transfer apparatus TR1 and the substrate transfer robot 20. The positional relationship may be such that the opening P1 is provided on the side surface along the longitudinal direction of the transport path R1.

Further, in the above embodiment, the processing unit 101 is provided with the two processing unit rows 120 and 130 and the two transport paths R1 and R2, but the transport path is provided facing the side surface of the processing unit. Any processing unit as described above can be applied to the substrate processing apparatus according to the present invention.
FIG. 12 is a plan view showing a substrate processing apparatus 300 incorporating a processing unit 301 of another form. The processing unit 301 includes an indexer ID, a processing section column 320,
And a transport path R1 along which the substrate transport device TR1 travels. In this processing unit 301, the substrate transfer device TR1 is used for the substrate W between the processing units included in the processing unit row 320.
And the transfer of the substrate W to and from the substrate transfer robot 20. Also in such a substrate processing apparatus 300, since the transport path R1 extends along the boundary between the processing unit 101 and the interface IFB, the interface IFB can be installed at any position in the longitudinal direction of the transport path R1. IFB and processing unit 1
The relative positional relationship with 01 can be freely changed.

Further, the interface IFB in this embodiment is provided with the buffer section 25 and the two substrate transfer robots 20 and 21, but the form of the interface is not limited to the above. For example, one substrate transfer is carried out. Interface IF2 with device (see Figure 13)
It may be.

[0061]

As described above, according to the first aspect of the present invention, the processing unit having a plurality of processing units and the transfer unit moving on the transfer path and the interface unit are transferred along the boundary. Since the transport path of the section extends, the interface unit can be installed at any position in the longitudinal direction of the transport path, and as a result, the relative positional relationship between the interface unit and the processing unit can be freely changed, and other devices can be installed. It is possible to improve workability by avoiding interference with the equipment. Further, it is possible to make the installation space of the entire device compact.

According to the second aspect of the present invention, since the interface unit is provided with the substrate storage section and the two substrate transfer mechanisms, the transfer of the substrate in the interface can be performed smoothly and at high speed. The processing efficiency of the entire device is improved.

[Brief description of drawings]

FIG. 1 is a plan view of a substrate processing apparatus according to the present invention.

FIG. 2 is a diagram for explaining the operation of the substrate transfer device.

FIG. 3 is a cross-sectional view of the heat treatment section of FIG. 1 taken along the YZ plane.

FIG. 4 is a cross-sectional view of the processing unit of FIG. 1 taken along line VV.

5 is a side view of the interface of FIG. 1 viewed from the exposure processing unit side.

FIG. 6 is a perspective view illustrating a state around a buffer unit in FIG.

FIG. 7 is a diagram for explaining the transfer of substrates between the substrate transfer device and the substrate transfer robot.

FIG. 8 is a substrate W between the buffer unit and the substrate transfer robot.
It is a figure explaining delivery of.

9 is a plan view showing another embodiment of the substrate processing apparatus of FIG.

FIG. 10 is a plan view showing another positional relationship between the interface and the processing unit.

FIG. 11 is a plan view showing another positional relationship between the interface and the processing unit.

FIG. 12 is a plan view showing a substrate processing apparatus in which another type of processing unit is incorporated.

FIG. 13 is a plan view showing a configuration of a conventional substrate processing apparatus.

[Explanation of symbols]

 101 processing unit 20, 21 substrate transfer robot 25 buffer unit IFB interface STP exposure processing unit R1 transfer path TR1 substrate transfer device

Claims (2)

[Claims] 1. A substrate processing apparatus for performing a series of processing on a substrate, comprising: (a) a plurality of processing units for processing the substrate and a predetermined transport path for transporting the substrate between the plurality of processing units. A first processing unit having a moving transfer unit; (b) a second processing unit which is arranged at a predetermined distance from the first processing unit and performs a predetermined processing on the substrate; ) The first processing unit and the second processing unit are arranged at the interval formed between the first processing unit and the second processing unit so as to be in contact with the transport path of the transport unit, and An interface unit for transferring a substrate between the substrate processing apparatus and the substrate processing apparatus, wherein a transfer path of the transfer unit extends along a boundary between the first processing unit and the interface unit. 2. The substrate processing apparatus according to claim 1, wherein the interface unit includes: (c-1) a substrate storage unit that stores a plurality of substrates; and (c-2) the transfer unit transfers the substrates. A first substrate transfer mechanism for loading and unloading the substrate to and from the substrate storage unit; and (c-3) transferring the substrate to and from the second processing unit, and loading and unloading the substrate to and from the substrate storage unit. Do the second
The substrate processing apparatus according to claim 1.