JPH0936293A - Lead frame plating equipment - Google Patents

Abstract

(57) 【Abstract】 PROBLEM TO BE SOLVED: To easily position a plating jig on a base plate and to fix the plating jig easily and surely. SOLUTION: A plating solution chamber 5 is arranged in a main body frame 7, and a base plate 6 is supported by the main body frame 7. The plating jig 2 is placed on the base plate 6,
The plating jig 2 is positioned by inserting the positioning pin 9 on the base plate 6 side into the positioning opening 10 on the base plate 6 side. Both sides of the plating jig 2 are clamped and fixed by the clamps 8 on the base plate 6.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead frame plating apparatus having a plating jig, and more particularly to a lead frame plating apparatus that allows easy and accurate replacement of the plating jig.

[0002]

2. Description of the Related Art Among conventional IC lead frames,
Partial plating made of a noble metal such as gold or silver is applied to the pad portion on which the silicon chip is mounted and the tip of the lead for wire bonding. Such a lead frame plating apparatus will be described with reference to FIGS.

As shown in FIGS. 3 and 4, the lead frame plating apparatus includes a body frame 7 and a plating solution chamber 5 supported by the body frame 7, and a packing 12 is provided on the plating solution chamber 5. A base plate 6 made of glass epoxy, heat-resistant vinyl chloride, or the like is provided therethrough. Further, a lead frame (not shown) is provided on the base plate 6.
A glass epoxy plating jig 2 to which a silicon rubber mask rubber 1 for mounting is attached is fixed.

A jig mounting hole 3 is provided in the plating jig 2, and the plating jig 2 is fixed to the base plate 6 by inserting a screw 25 through the hole 3.

A jetting device 15 connected to the pressure feed pump 14 is provided in the plating solution chamber 5, and the jetting device 15 is provided with a jet nozzle 15a. Further, openings 16 are formed in the plating jig 2 and the mask rubber 1 at positions corresponding to the ejection nozzles 15a.

On the other hand, above the mask rubber 1, a press block 13 for pressing the lead frame with the mask rubber 1 is provided so as to be able to move up and down.

In the lead frame plating apparatus having such a structure, after the lead frame is placed on the mask rubber 1, the lead frame is pressed between the mask rubber 1 and the press block 13. At this time, the cathode installed in the press block is pressed against the lead frame. Next, the plating solution is ejected from the pressure feed pump 14
5, and the plating solution is ejected from the ejection nozzle 15a. The plating solution ejected from the ejection nozzle 15a is ejected to the lead frame through the openings 16 formed in the mask rubber 1 and the plating jig 2.

During this time, the lead frame and the ejection nozzle 15
Electricity flows between a and the lead frame is plated.

[0009]

By the way, when changing the type of the lead frame, it is necessary to remove the plating jig 2 having the mask rubber 1 from the base plate 6 and attach a new plating jig 2 to the base plate 6. However, since the plating jig 2 is fixed to the base plate 6 with the screw 25, when the plating jig 2 is replaced, it is necessary to loosen or tighten the screw 25. Will be required. Further, since positioning of the plating jig 2 with respect to the base plate 6 requires skill, the replacement work becomes more complicated.

The present invention has been made in consideration of the above points, and an object of the present invention is to provide a lead frame plating apparatus which can easily perform a plating jig replacement operation.

[0011]

SUMMARY OF THE INVENTION The present invention is directed to a main body frame, a plating solution chamber arranged in the main body frame, a plating jig to which a mask rubber for mounting a lead frame is attached, and a plating jig. And a positioning device for positioning the plating jig at a predetermined position on the base plate and a base plate located above the plating solution chamber and between the plating jig and the base plate, and fixing the plating jig to the base plate. A lead frame plating device.

According to the present invention, after the plating jig is placed on the base plate while positioning by the positioning device, the plating jig is fixed on the base plate by the fixing device.

[0013]

Embodiments of the present invention will be described below with reference to the drawings. 1 and 2 are views showing an embodiment of a lead frame plating apparatus according to the present invention.

As shown in FIGS. 1 and 2, the lead frame plating apparatus includes a steel body frame 7 and a heat-resistant PVC plating solution chamber 5 disposed in the body frame 7.
And the plating solution chamber 5 while being supported by the body frame 7.
And a base plate 6 made of stainless steel (SUS) located above.

On the base plate 6, a plating jig 2 to which a mask rubber 1 for mounting a lead frame (not shown) is attached is supported. The plating jig 2 is composed of a jig body 2a made of glass epoxy and a lining body 11 made of SUS or ceramic provided on the back surface of the jig body 2a. Of these, the backing 11 has heat resistance and enhances the rigidity of the plating jig 2 as a whole. The plating jig 2 is in contact with the upper end of the plating solution chamber 5 via the packing 12.

On the base plate 6, the plating jig 2 is attached.
Is provided with a pair of clamps 8 for pressing from both sides. Further, the base plate 6 is provided with a positioning pin 9, and the plating jig 2 is formed with a positioning opening 10 which engages with the positioning pin 9 and positions the plating jig 2 at a predetermined position on the base plate 6.

A jetting device 15 connected to the pressure feed pump 14 is provided in the plating solution chamber 5, and a jetting nozzle 15a is projectingly provided on the jetting device 15. Also plating jig 2
Further, the mask rubber 1 has an opening 16 formed at a position corresponding to the ejection nozzle 15a.

On the other hand, above the mask rubber 1, a press block 13 for pressing the lead frame with the mask rubber 1 is provided so as to be able to move up and down.

Next, the operation of the present embodiment having such a configuration will be described. First, the lead frame is placed on the mask rubber 1, and then the lead frame 1 is pressed between the mask rubber 1 and the press block 13. At this time, the cathode installed in the press block is pressed against the lead frame.

Next, the plating solution is pressure-fed from the pressure pump 14 to the ejection device 15, and the plating solution is ejected from the ejection nozzle 15a. The plating solution jetted from the jet nozzle 15 a is jetted to the lead frame through the openings 16 formed in the mask rubber 1 and the plating jig 2. During this time,
Electricity flows between the lead frame and the jet nozzle 15a, and a predetermined portion of the lead frame (a portion corresponding to the opening 16) is plated.

The plating solution jetted onto the lead frame is then stored in the plating solution chamber 5 and then discharged from the outlet 5a provided at the lower end of the plating solution chamber 5.

Next, when replacing the plating jig 2 having the mask rubber 1 corresponding to the type of lead frame, the clamp 8 is removed from the plating jig 2 and the plating jig 2 is removed from the base plate 6. Next, a new plating jig is placed on the base plate 6. In this case, by engaging the positioning pin 9 of the base plate 6 into the positioning opening 10 of the plating jig 2, the plating jig 2 is moved to the base plate 6
It can be positioned in a predetermined position above. Next, the clamp 8 is attached to the plating jig 2 to firmly fix the plating jig 2 on the base plate 6.

As described above, according to this embodiment, the positioning pin of the base plate 6 is connected to the positioning opening 1 of the plating jig 2.
By engaging within 0, the plating jig 2 can be easily and reliably positioned at a predetermined position on the base plate 6. Also, the plating jig 2 can be easily replaced by attaching or detaching the clamp 8 to or from the plating jig 2. Furthermore, since the base plate 6 is made of SUS and is supported by the steel main body frame 7, for example, as compared with the case where the base plate 6 is supported on the plating solution chamber 5 made of vinyl chloride, plating is performed. It is possible to improve the mounting accuracy of the jig 2. Further, since the mask jig 2 has the backing body 11 having excellent heat resistance and rigidity, the mask jig 2 does not deform due to temperature and aging.

[0024]

As described above, according to the present invention, the plating jig is placed on the base plate while being positioned by the positioning device, and then the plating jig is fixed on the base plate by the fixing device. In this way, the positioning and fixing action of the plating jig can be easily and easily performed on the base plate.

[Brief description of drawings]

FIG. 1 is a perspective view showing an embodiment of a lead frame plating apparatus according to the present invention.

FIG. 2 is a side sectional view showing an embodiment of a lead frame plating apparatus according to the present invention.

FIG. 3 is a perspective view showing an embodiment of a conventional lead frame plating apparatus.

FIG. 4 is a side sectional view showing an embodiment of a conventional lead frame plating apparatus.

[Explanation of symbols]

 1 Mask rubber 2 Plating jig 5 Plating liquid chamber 6 Base plate 7 Body frame 8 Clamp 9 Positioning pin 10 Positioning opening

Claims (3)

[Claims] 1. A body frame, a plating solution chamber arranged in the body frame, a plating jig to which a mask rubber for mounting a lead frame is attached, and a plating solution chamber on which the plating jig is mounted. A base plate located above the base plate, a positioning device provided between the plating jig and the base plate for positioning the plating jig at a predetermined position on the base plate, and a fixing device for fixing the plating jig to the base plate. This is a lead frame plating device. 2. The lead frame plating apparatus according to claim 1, wherein the base plate is supported by a main body frame. 3. The plating jig comprises a jig body made of glass epoxy and a lining made of SUS or ceramic provided on the back surface of the jig body. Lead frame plating equipment.