JPH0936530A - Apparatus and method for manufacturing electronic component with bump - Google Patents

Abstract

(57) [Summary] [Object] An object of the present invention is to provide a manufacturing apparatus and a manufacturing method of an electronic component with bumps capable of mounting solder balls for forming bumps on a plurality of works with good workability. [Structure] Four substrates 3 are mounted on a carrier, and the substrates 3 are conveyed on a line by the carrier. Electrodes 20 on which solder balls are mounted are formed on the substrate 3 in a matrix. The head part 52 has four blocks A,
The blocks A to D are divided into blocks B to C, and the blocks A to D each have a suction hole 54 for vacuum-sucking a solder ball mounted on each substrate 3.
Are opened in a matrix. Head part 5
By moving 2 to four positions a, b, c, d, four blocks A, B, C, D provide four substrates 3
Solder balls are continuously mounted on.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus and method for manufacturing bumped electronic components in which solder balls are mounted on electrodes of a work to form bumps.

[0002]

2. Description of the Related Art As a method of manufacturing a bumped electronic component by forming bumps (protruding electrodes) on electrodes of a work, a method using solder balls is known. In this method, solder balls are vacuum-sucked in a large number of suction holes formed on the lower surface of the head, transferred and mounted on the electrodes of the work, and then the work is heated in a heating furnace to melt and solidify the solder balls to generate bumps. To do. This method is extremely advantageous in terms of work efficiency because a large number of bumps can be collectively formed on the electrodes of the work to manufacture the bumped electronic component.

[0003]

By the way, the work pieces are generally extremely small, and therefore, a plurality of work pieces are often mounted on a carrier and transported through the manufacturing line. However, the conventional head can only vacuum-adsorb the solder balls for one work, so that FIG.
As described with reference to Fig., The solder balls must be repeatedly reciprocated between the solder ball supply unit and the carrier to mount the solder balls for each work, so that the overall takt time becomes long and the work efficiency is increased. There was a problem that it did not improve.

Therefore, an object of the present invention is to provide an apparatus and method for manufacturing an electronic component with bumps capable of mounting solder balls on a plurality of works with good work efficiency.

[0005]

To this end, the present invention provides a solder ball supply section, a work positioning section for positioning a plurality of works, and a solder ball provided in the solder ball supply section on the bottom surface. With a bump provided with a head that is vacuum-sucked to a large number of suction holes that are picked up in the workpiece and picked up and transferred to the work, and a moving means that moves the head horizontally relative to a positioning portion of the work. In an electronic component manufacturing apparatus, the head is divided into a plurality of blocks respectively corresponding to a plurality of works, and each block is provided with vacuum suction means independent of each other.

Further, the head vacuum suctions and picks up the solder balls provided in the solder ball supply section; the step of moving the head over the plurality of works positioned in the positioning section; The head is horizontally moved relative to each work so that each block is located right above each work, and the vacuum suction state of the solder balls is released for each block corresponding to each work. A method of manufacturing an electronic component with bumps is constituted by a step of mounting solder balls on each work.

[0007]

According to the above construction, the head collectively picks up solder balls for a plurality of works in the solder ball supply section, moves them above the carrier, and moves horizontally relative to each work. However, since solder balls are sequentially mounted on each work, the overall takt time can be greatly shortened.

[0008]

Embodiments of the present invention will now be described with reference to the drawings. FIG. 1 is a manufacturing process diagram of an electronic component with bumps according to an embodiment of the present invention, FIG. 2 is a plan view of a manufacturing apparatus for the electronic component with bumps, FIG. 3 is a side view of the same, and FIG. FIG. 5 is a perspective view, FIG. 5 is a sectional view of the head, and FIG. 6 is a block diagram of the control system. FIG. 7 is a cross-sectional view of a main part of the solder ball while applying flux to the lower surface, FIG. 8 is a cross-sectional view of a main part of the solder ball being mounted on an electrode of a substrate, and FIG. 9 is a cross-sectional view of the head and the first light source. Front view, FIG. 10 is a front view of the head, a light emitting unit, and a light receiving unit.

First, with reference to FIG. 1, a brief description will be given of the whole manufacturing process of the electronic component with bumps. In FIG. 1 (a), 3
Is a substrate as a work. As shown in FIG. 1B, the electrodes 20 are formed on the upper and lower surfaces of the substrate, and the electrode 2
A through hole 3a for electrically connecting 0s is formed.

Next, the chip C is mounted on the upper surface of the substrate 3 (FIG. 1C), and the electrode on the upper surface of the chip C and the electrode 20 on the upper surface of the substrate 3 are connected by the wire W (FIG. 1D). . Next, a mold body M that protects the chip C and the wire W is formed of synthetic resin (FIG. 1E). Next, the substrate 3 is turned upside down to mount the solder balls 5 on the upper surface of the electrode 20 (see FIG. 1).
(F)). Next, the substrate 3 is sent to a heating furnace and heated to melt and solidify the solder balls 5 to form bumps 5 '(FIG. 1 (g)).

Through the above steps, the bumped electronic component is completed.
Next, the steps of FIGS. 1F and 1G, that is, the step of mounting the solder balls 5 on the bump electrodes 20 and forming the bumps 5 ′ will be described in detail with reference to the drawings.

In FIG. 2, reference numeral 3 denotes the substrate shown in FIG. 1 (e), and a mold body M for molding the chip C is formed on the lower surface thereof. Four substrates 3 are mounted on the carrier 10.

In FIG. 2, reference numeral 1 is a table, and two guide rails 2 are arranged in the center of the upper surface of the table. The carrier 10 is conveyed along the guide rail 2 and is clamped by the guide rail 2 to be positioned at a predetermined position. In this embodiment, the carrier 1 with the guide rail 2 is used.
The transport direction of 0 is the X direction, and the direction orthogonal to this is the Y direction. A solder ball supply unit 4 is provided at a corner of the table 1. As shown in FIG. 3, the solder ball supply unit 4 is composed of a box, and a large amount of solder balls 5 are stored in the box. On the side of the guide rail 2,
A recovery unit 19 for the solder balls 5 is provided. The recovery unit 19 is composed of a box.

2 and 3, a flux coating section 6 is provided at the other corner of the table 1.
The flux applying section 6 includes a dish-shaped container 7 and a smooth head 8.
It has. Flux 9 is shallowly stored in the container 7. The smoothing head 8 is mounted on the table 1 so as to be slidable in the X direction, and includes a base plate 15 installed above the container 7. Two cylinders 16 are installed on the base plate 15, and a squeegee 18 a, 1
8b is bound. As the rod 17 of the cylinder 16 projects and retracts, the squeegees 18a and 18b move up and down.

In FIG. 2, 13 is a feed screw, which is driven by a motor 14 to rotate. A nut (not shown) that is screwed into the feed screw 13 is provided on the lower surface of the side portion of the base plate 15. When the motor 14 is driven to rotate the feed screw 13, the smoothing head 8 is horizontally moved in the X direction. Moving. In this case, the squeegee 18a or 18b shown in FIG. 3 selectively lands on the flux 9 and slides to smooth the upper surface of the flux 9.

Next, the head as the solder ball transfer means and its moving means will be described. 2 and 4,
In FIG. 5, the head 50 includes a box-shaped head body 51 and a head portion 52. The head portion 52 is divided into a plurality of blocks A, B, C, D by a partition wall 53, and suction holes 54 for vacuum-sucking the solder balls 5 are formed in a matrix on the lower surface of each block A to D. Many holes have been opened. In this embodiment, four square blocks A to D are partitioned by a partition wall 53 having a cross shape in plan view.

Each of the blocks A to D has a suction space T independent of each other, and each suction space T is a tube 55.
Through the vacuum pump 62 and the blower 63 (which will be described later with reference to FIG. 6). An optical sensor 56 for detecting the presence or absence of the solder ball 5 vacuum-sucked in the suction hole 54 is provided above each suction space T. By operating the vacuum pump 62,
The suction space T is evacuated, and the solder balls 5
Are vacuum-adsorbed. Further, by operating the blower 63 to blow air into the suction space T, the holding state by vacuum suction is released, and the solder ball 5 falls from the suction hole 54. A camera 11 for board recognition is integrally provided on the side surface of the head 50 (FIG. 2).

In FIG. 2, a long frame 24 is installed above the table 1. A feed screw 25 and a guide rail 26 are arranged in parallel on the frame 24. 27 is a motor for rotating the feed screw 25. A nut 28 that is screwed into the feed screw 25 is coupled to the head 50. Therefore, when the motor 27 drives and the feed screw 25 rotates, the nut 28 horizontally moves in the X direction along the feed screw 25, and the head 50 also moves in the guide rail 26.
Move horizontally in the X direction.

Both ends of the frame 24 are slidably installed on the guide rails 29 and 30. The guide rails 29 and 30 are orthogonal to the guide rail 26. Further, a feed screw 31 is arranged in parallel with the guide rail 29. A nut (not shown) with which the feed screw 31 is screwed is provided on the lower surface of the frame 24.
Therefore, when the motor 32 is driven and the feed screw 31 rotates, the frame 24 and the head 50 connected to the frame 24 are rotated.
Moves horizontally in the Y direction along the guide rails 29 and 30.

As described above, the feed screws 25 and 31, the guide rails 26, 29 and 30, the motors 27 and 32, etc.
A moving means for horizontally moving the head 50 in the X direction and the Y direction is configured, whereby the head 50 freely moves between the solder ball supply section 4, the recovery section 19, and the carrier 10 positioned on the guide rail 2. Moving.

Next, the inspection means will be described. In FIG. 2, reference numeral 40 denotes a long first light source. The first light source 40 is installed between the solder ball supplying section 4 and the flux applying section 6 and emits light from below toward the lower surface of the head 50 (see FIG. 9). An optical sensor 56 is built in the head 50. Therefore, when the solder balls 5 are vacuum-sucked by all the suction holes 54,
The suction holes 54 are completely shielded by the solder balls 5 and light does not enter the optical sensor 56. However, when the solder balls 5 are not vacuum-sucked to any of the suction holes 54, the first light source 40 emits light. The generated light passes through the suction hole 54 and enters the optical sensor 56. This reveals that the solder ball 5 has been picked up incorrectly. That is, the first
The light source 40 and the optical sensor 56 are inspection means for inspecting whether or not the solder balls 5 are correctly vacuum-sucked in all the suction holes 54, that is, whether or not there is a pickup error.

In FIG. 2, a second light source 42 is installed between the flux applying section 6 and the guide rail 2. Similarly to the first light source 40, the second light source 42 emits light toward the lower surface of the head 50, and whether or not the solder balls 5 are correctly vacuum-sucked in all the suction holes 54, that is, the solder balls 5 Inspect for drop (see FIG. 9).

The reason for installing the second light source 42 is as follows. That is, the head 50 is moved up and down above the container 7 to cause the solder balls 5 vacuum-adsorbed on the lower surface thereof to land on the flux 9 and to attach the flux 9 to the lower surface (see FIGS. 7A and 7B). )), Flux 9
Has a large viscosity, so when the solder balls 5 are immersed in the flux 9, the solder balls 5 will stick to the suction holes 5 due to the viscosity.
May fall from 4. When the head 50 from which the solder balls 5 have fallen off in this way is moved above the substrate 3 and the solder balls 5 are mounted on the substrate 3, the substrate 3 is
Will be a defective product. Therefore, during the movement of the head 50 to the substrate 3, the second light source 42 and the optical sensor 56 inspect whether or not the solder balls 5 are properly vacuum-sucked in all the suction holes 54. That is, the second light source 42 and the optical sensor 56 are connected to the solder ball 5
Is an inspection means for inspecting whether or not the

In FIG. 2, a light emitting portion 43 and a light receiving portion 44 are provided between the guide rail 2 and the solder ball supplying portion 4. As shown in FIG. 10, light is horizontally emitted from the light emitting unit 43 toward the light receiving unit 44. After mounting the solder balls 5 on the substrate 3, the head 50 moves between the light emitting portion 43 and the light receiving portion 44 in the direction orthogonal to the optical path and returns onto the solder ball supplying portion 4. At that time, Head 50
If the solder balls 5 remain attached to the lower surface of the light, the light is blocked and the light receiving portion 44 does not receive the light. Further, all the solder balls 5 are mounted on the substrate 3, and the solder balls 5 are mounted on the lower surface of the head 50.
If no residual adheres, the light emitted from the light emitting portion 43 is received by the light receiving portion 44. As a result, it is determined whether or not the solder balls 5 remain attached to the lower surface of the head 50 and are held, that is, the head 50 has all the solder balls 5.
It is inspected whether or not is mounted on the substrate 3 for mounting error.

Next, the control system will be described with reference to FIG. The tube 55 connected to each suction space T of each block A to D has a vacuum pump 62 through valves 60 and 61.
Is connected to the blower 63. Each valve 60, 61 is controlled by a valve drive circuit 64. In addition, the optical sensor 56
The light receiving section 44 is connected to the detection circuit 65. Reference numeral 66 is a control unit for controlling the whole, and is a valve drive circuit 64,
A motor drive circuit 67 and a position detector 68 connected to the camera 11 are connected. The motor drive circuit 67 controls the motors 14, 27 and 32. As is clear from FIG. 6, the suction spaces T of the blocks A to D are provided with independent piping systems such as the tube 55 and the valves 60 and 61, so that the suction / suction release control can be performed independently of each other. Done.

This bumper-equipped electronic component manufacturing apparatus is configured as described above. Next, the operation for mounting the solder balls shown in FIG. 1F will be described. In FIG. 2, the head 50 moves above the solder ball supply portion 4 (arrow A). Then, the head 50 moves up and down to
The plurality of solder balls 5 are collectively vacuum-sucked and picked up by the suction holes 54 on the lower surfaces of all the blocks A to D. The description of the mechanism for causing the head 50 to move up and down is omitted.

In FIG. 2, the head 50 then moves to the left (above the first light source 40) (arrow B), and as described with reference to FIG. To inspect. If there is a pick-up error, the head 50 returns to above the solder ball supply unit 4 (arrow C), performs the vertical movement again there to pick up the solder ball 5, and moves to the left again (arrow D). Then, it passes above the first light source 40 and is again inspected for a pickup error.

When there is no pick-up error and the solder balls 5 are correctly vacuum-sucked and held in all the suction holes 54, the head 50 moves above the container 7, where the head 50 moves up and down. The flux 9 is attached to the lower surface of the solder ball 5, which is vacuum-adsorbed on the lower surface.
7 (a) and 7 (b) show the operation.

Next, referring to FIG. 2, the head 50 moves from above the container 7 to above the second light source 42 (arrow E), and as described with reference to FIG. To inspect. If it is found that one or more solder balls 5 are falling from the lower surface of the head 50, the head 50 moves above the collecting portion 19,
All the solder balls 5 which are vacuum-adsorbed on the lower surface thereof are dropped onto the recovery unit 19. The head 50 that has dropped all the solder balls 5 moves above the solder ball supply unit 4 and repeats the above-described operation.

Now, in FIG. 2, when it is detected by the second light source 42 and the optical sensor 56 that the solder balls 5 have not fallen, the head 50 moves above the substrate 3 (arrow F), The solder balls 5 are mounted on the substrate 3.
Next, referring to FIG. 4, the four substrates 3 on the carrier 10 are
The mounting operation of the solder ball 5 with respect to will be described. In FIG. 4, a, b, c, and d indicate the position of the head portion 52 with respect to the carrier 10 when the solder balls 5 are mounted by the four blocks A to D. That is, the head portion 52
To the position a, the solder ball 5 of block A
Are mounted on the electrodes 20 of the substrate 3. Similarly, the head portion 5
By setting 2 to the b position, the c position, and the d position, the solder balls 5 of the block B, the block C, and the block D are attached to the substrate 3
To be mounted on. In this case, the head portion 52 horizontally moves on the carrier 10 in the X direction and the Y direction as indicated by the arrow. Of course, this movement is performed by driving the motors 27 and 32 (FIG. 2).

When the solder balls 5 of the block A are mounted on the substrate 3 at the position a, for example, in FIG. 6, the valve 60 on the side of the vacuum pump 62 connected to the block A is closed and the valve on the side of the blower 63 is closed. By opening 61 and blowing air into the suction space T of the block A, the vacuum suction state of the solder ball 5 which has been vacuum-sucked in the suction hole 54 of the block A is released. At this time, the states of the valves 60 and 61 of the other blocks B to D remain the same (the valve 60 on the vacuum pump 62 side is open, the valve 61 on the blower 63 side is closed), and the blocks B to D of the solder balls 5 are the same. Hold the vacuum suction state. Similarly, when mounting the solder balls 5 of the other blocks B to D on the substrate 3, the valves 60 and 61 are opened and closed as in the case of the block A. As described above, the present apparatus is provided with the solder ball supply unit 4
In the above, the solder balls 5 are collectively vacuum-sucked on the four blocks A to D at the same time, and then the solder balls 5 are mounted on the four substrates 3 one after another. Note that FIG. 8 shows a state in which the solder balls 5 are mounted on the electrodes 20 of the substrate 3.

FIG. 11 is a time chart of the solder ball mounting operation. FIG. 11 (a) is a time chart of the conventional solder ball mounting operation, and FIG. 11 (b) is the solder ball of the present embodiment described above. It is a time chart of mounting operation.
In the conventional method shown in FIG. 11 (a), a series of operations of “board recognition”, “pickup of solder balls”, “flux adhesion”, and “mounting of solder balls on the board” are performed on the four boards 3 on the carrier 10. Since it was repeated one by one individually, the overall takt time became long and the work efficiency was not improved.

On the other hand, in the present embodiment, as shown in FIG. 11B, after the first substrate is recognized, all (4
After the solder balls are picked up and the flux is attached to the first substrate 3 and the solder balls 5 are mounted on the first substrate 3, the second to fourth substrates 3 are mounted. 11 only recognizes the board and mounts the solder balls 5, and mounts the solder balls 5 one after another.
The takt time can be greatly shortened as compared with the conventional method shown in (a).

When the solder balls are mounted on the four substrates 3 as described above, the head 50 moves to the front of the light emitting portion 43 and the light receiving portion 44 (arrow G in FIG. 2), and then the solder balls. To the supply section 4 of (No. a). At this time,
As described with reference to FIG. 10, it is inspected whether or not the solder ball 5 remains adhered and held on the lower surface of the head 50. Here, if it is detected that the solder balls 5 remain attached, it is because the solder balls 5 have been improperly mounted on the substrate 3, that is, due to a mismounting, and the head 50 is disposed in the recovery unit 19. Move upwards and solder 5
Is dropped into the collecting unit 19 and collected. Solder balls 5
When the solder ball 5 is dropped from the head 50 to the recovery unit 19, the valve 60 shown in FIG. 6 is closed and the valve 61 is opened to release the suction state of the solder ball 5. The board 3 is defective because the solder balls 5 are missing, and is removed to the outside of the line. Next, the head 50 moves above the solder ball supply portion 4 (arrow A), and the above-described operation is repeated. Also, the board 3 on which the solder balls 5 are correctly mounted is
It is conveyed toward the next process along the guide rail 2.

FIG. 12 is a perspective view of a carrier according to another embodiment of the present invention. This carrier 70 is a multi-chambered substrate, and after forming bumps on the electrodes 20 and cutting along the chain lines, four substrates 3'are obtained. By positioning the carrier 70 on the guide rail 2 instead of the carrier 10, the solder balls 5 are mounted on the electrodes 20 as in the above-described embodiment.

As described above, according to this bumper-equipped electronic component manufacturing apparatus, the head picks up the solder balls in the supply portion, attaches the flux to the solder balls, and mounts them on a plurality of substrates. Can be automatically and continuously performed. In addition, the presence or absence of a solder ball pickup error, a drop in the middle, or a mounting error on the board is detected each time during each process, and if any of these errors is made, a recovery operation is promptly performed. be able to.

[0037]

According to the present invention, all the steps from picking up the solder balls in the solder ball supply portion to mounting them on a plurality of works can be performed with good workability, and the takt time is increased. Can be shortened to the width.

[Brief description of drawings]

FIG. 1 is a manufacturing process diagram of an electronic component with bumps according to an embodiment of the present invention.

FIG. 2 is a plan view of an apparatus for manufacturing electronic components with bumps according to an embodiment of the present invention.

FIG. 3 is a side view of an apparatus for manufacturing electronic components with bumps according to an embodiment of the present invention.

FIG. 4 is a perspective view of a head and a carrier of an electronic component manufacturing apparatus with bumps according to an embodiment of the present invention.

FIG. 5 is a sectional view of a head of a bumper-equipped electronic component manufacturing apparatus according to an embodiment of the present invention.

FIG. 6 is a block diagram of a control system of an apparatus for manufacturing electronic components with bumps according to an embodiment of the present invention.

FIG. 7 is a cross-sectional view of a main portion of the solder ball of the manufacturing apparatus for the electronic component with bumps according to the embodiment of the present invention during applying the flux to the lower surface of the solder ball.

FIG. 8 is a cross-sectional view of a main part of the apparatus for manufacturing an electronic component with bumps according to an embodiment of the present invention during mounting a solder ball on an electrode of a substrate.

FIG. 9 is a front view of a head and a first light source of a bumper-equipped electronic component manufacturing apparatus according to an embodiment of the present invention.

FIG. 10 is a front view of a head, a light emitting portion, and a light receiving portion of a bumped electronic component manufacturing apparatus according to an embodiment of the present invention.

11A is a time chart of a conventional solder ball mounting operation, and FIG. 11B is a time chart of a solder ball mounting operation according to an embodiment of the present invention.

FIG. 12 is a perspective view of a carrier according to another embodiment of the present invention.

[Explanation of reference numerals] 2 guide rails (workpiece positioning portion) 3, 3'substrate (workpiece) 4 solder ball supply portion 5 solder ball 6 flux applying portion 7 container 8 smoothing head 9 flux 10, 70 carrier 11 guide rail 13 feed screw 14 motors 18a, 18b squeegee 19 recovery part 25 feed screw 27 motor 28 nut 31 feed screw 32 motor 40 first light source 42 second light source 43 light emitting part 44 light receiving part 50 head 54 suction hole 55 tube 60, 61 Valve 62 Vacuum pump 63 Blower A, B, C, D Block T Suction space

Claims (3)

[Claims] 1. A solder ball supply part, a work positioning part for positioning a plurality of works, and a vacuum in an adsorption hole having a large number of solder balls provided in the solder ball supply part on its lower surface. An apparatus for manufacturing an electronic component with bumps, comprising: a head for adsorbing, picking up, transferring and mounting on the work, and a moving means for horizontally moving the head relative to a positioning portion of the work. Is divided into a plurality of blocks respectively corresponding to a plurality of works, and each block is provided with a vacuum suction means independent from each other, an apparatus for manufacturing electronic components with bumps. 2. A head, which is divided into a plurality of blocks respectively corresponding to a plurality of works, and in which each block is provided with a vacuum suction means independent from each other, vacuum sucks a solder ball provided in a solder ball supply portion. And picking up the heads, moving the heads above the plurality of works positioned in the positioning part, and moving the heads so that the plurality of blocks are located right above the respective works. A step of moving the solder balls relative to the work, releasing the vacuum suction state of the solder balls for each block corresponding to each work, and mounting the solder balls on each work. For manufacturing electronic components with electronic components. 3. A step of forming electrodes for forming bumps on a work, and a head which is divided into a plurality of blocks respectively corresponding to the plurality of works and each block is provided with independent vacuum suction means is soldered. A step of vacuum-sucking and picking up a solder ball provided in a ball supply part; a step of moving this head above a plurality of works positioned in a positioning part; and a plurality of blocks for each work. The head is moved horizontally relative to each work so that it is located right above, and the vacuum suction state of the solder balls is released for each block corresponding to each work, and the solder balls are attached to each work. The process of mounting
A method for manufacturing a bumped electronic component, comprising: