JPH09500496A - チップを有するリードフレームをプラスティックでカプセル封入するための装置 - Google Patents
チップを有するリードフレームをプラスティックでカプセル封入するための装置Info
- Publication number
- JPH09500496A JPH09500496A JP7528858A JP52885895A JPH09500496A JP H09500496 A JPH09500496 A JP H09500496A JP 7528858 A JP7528858 A JP 7528858A JP 52885895 A JP52885895 A JP 52885895A JP H09500496 A JPH09500496 A JP H09500496A
- Authority
- JP
- Japan
- Prior art keywords
- plunger
- head end
- mold
- groove
- mold cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/01—Manufacture or treatment
- H10W74/016—Manufacture or treatment using moulds
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W99/00—Subject matter not provided for in other groups of this subclass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
- B29C45/58—Details
- B29C45/586—Injection or transfer plungers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
- H10W70/63—Vias, e.g. via plugs
- H10W70/635—Through-vias
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
- H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1.閉じた位置でリードフレームを受け入れるための金型キャビティを 形成する相互に動くことができる金型の両半分と、カプセル封入材料を供給する ために金型キャビティに接続されたフィードランナーと、圧力下においてカプセ ル封入材料を運ぶためにこのフィードランナーに接続されたプランジャー・シリ ンダーとを含み、該プランジャーの頭端から離れて周縁溝を有し、周縁溝が少な くとも一つのフローチャネルで該頭端に接続されることを特徴とする、チップを 有するリードフレームをプラスティックでカプセル封入するための装置。 2.上記フローチャネルの断面が、ツバメの尾の形状であることを特徴 とする請求項1に記載の装置。 3.上記プランジャーの外壁がらせん状に走っている溝を有し、該溝の 深さが上記プランジャーの駆動側から目に見えるように増加することを特徴とす る請求項1または2に記載の装置。 4.上記プランジャーが溶接手段によって駆動部に接続されることを特 徴とする請求項1ないし3のいずれかに記載の装置。
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL9400768A NL9400768A (nl) | 1994-05-09 | 1994-05-09 | Inrichting voor het met kunststof omhullen van een leadframe met chips. |
| NL9400768 | 1994-05-09 | ||
| PCT/NL1995/000163 WO1995031004A1 (en) | 1994-05-09 | 1995-05-04 | Apparatus for encapsulating with plastic a lead frame with chips |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH09500496A true JPH09500496A (ja) | 1997-01-14 |
| JP2938190B2 JP2938190B2 (ja) | 1999-08-23 |
Family
ID=19864176
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7528858A Expired - Fee Related JP2938190B2 (ja) | 1994-05-09 | 1995-05-04 | チップを有するリードフレームをプラスティックでカプセル封入するための装置 |
Country Status (7)
| Country | Link |
|---|---|
| EP (1) | EP0708985B1 (ja) |
| JP (1) | JP2938190B2 (ja) |
| KR (1) | KR100426198B1 (ja) |
| DE (1) | DE69531584T2 (ja) |
| NL (1) | NL9400768A (ja) |
| TW (1) | TW261570B (ja) |
| WO (1) | WO1995031004A1 (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007533509A (ja) * | 2004-04-22 | 2007-11-22 | フィーコ ビー.ブイ. | プランジャ、封入デバイス、そしてプランジャ・ハウジングへのプランジャの嵌合をシールするための方法 |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL1004460C2 (nl) * | 1996-11-06 | 1998-05-08 | Fico Bv | Ejectorpen, vormdeel en mal voor het omhullen van electronische componenten alsmede een werkwijze voor het afdichten van een tussenruimte. |
| EP1030349B2 (de) † | 1999-01-07 | 2013-12-11 | Kulicke & Soffa Die Bonding GmbH | Verfahren und Vorrichtung zum Behandeln von auf einem Substrat angeordneten elektronischen Bauteilen, insbesondere von Halbleiterchips |
| JP5484209B2 (ja) * | 2010-06-15 | 2014-05-07 | パナソニック株式会社 | トランスファー成型方法とトランスファー成型装置 |
| CN116631927B (zh) * | 2023-07-19 | 2024-02-02 | 广州丰江微电子有限公司 | 带清洁功能的引线框架输送系统 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6341035A (ja) * | 1986-08-06 | 1988-02-22 | Mitsubishi Electric Corp | 半導体装置の樹脂封止成形装置 |
| NL9102108A (nl) * | 1991-12-17 | 1993-07-16 | Asm Fico Tooling | Schraapplunjer. |
-
1994
- 1994-05-09 NL NL9400768A patent/NL9400768A/nl not_active Application Discontinuation
-
1995
- 1995-05-04 DE DE69531584T patent/DE69531584T2/de not_active Expired - Lifetime
- 1995-05-04 KR KR1019960700054A patent/KR100426198B1/ko not_active Expired - Lifetime
- 1995-05-04 EP EP95916859A patent/EP0708985B1/en not_active Expired - Lifetime
- 1995-05-04 WO PCT/NL1995/000163 patent/WO1995031004A1/en not_active Ceased
- 1995-05-04 JP JP7528858A patent/JP2938190B2/ja not_active Expired - Fee Related
- 1995-05-09 TW TW084104598A patent/TW261570B/zh not_active IP Right Cessation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007533509A (ja) * | 2004-04-22 | 2007-11-22 | フィーコ ビー.ブイ. | プランジャ、封入デバイス、そしてプランジャ・ハウジングへのプランジャの嵌合をシールするための方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| HK1014079A1 (en) | 1999-09-17 |
| DE69531584T2 (de) | 2004-06-24 |
| EP0708985B1 (en) | 2003-08-27 |
| WO1995031004A1 (en) | 1995-11-16 |
| DE69531584D1 (de) | 2003-10-02 |
| NL9400768A (nl) | 1995-12-01 |
| TW261570B (en) | 1995-11-01 |
| EP0708985A1 (en) | 1996-05-01 |
| KR960704355A (ko) | 1996-08-31 |
| JP2938190B2 (ja) | 1999-08-23 |
| KR100426198B1 (ko) | 2004-06-11 |
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