JPH09504613A - メタル絶縁半導体(mis)センサを用いた流体の検出 - Google Patents
メタル絶縁半導体(mis)センサを用いた流体の検出Info
- Publication number
- JPH09504613A JPH09504613A JP7513289A JP51328995A JPH09504613A JP H09504613 A JPH09504613 A JP H09504613A JP 7513289 A JP7513289 A JP 7513289A JP 51328995 A JP51328995 A JP 51328995A JP H09504613 A JPH09504613 A JP H09504613A
- Authority
- JP
- Japan
- Prior art keywords
- sensor
- electrode
- alloy
- fluid
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000012530 fluid Substances 0.000 title claims description 47
- 239000004065 semiconductor Substances 0.000 title claims description 30
- 238000001514 detection method Methods 0.000 title description 9
- 239000007789 gas Substances 0.000 claims abstract description 72
- 229910002091 carbon monoxide Inorganic materials 0.000 claims abstract description 22
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 21
- 229910001252 Pd alloy Inorganic materials 0.000 claims abstract description 19
- 229910000881 Cu alloy Inorganic materials 0.000 claims abstract description 11
- 230000035945 sensitivity Effects 0.000 claims description 37
- 239000000203 mixture Substances 0.000 claims description 26
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 24
- 238000000034 method Methods 0.000 claims description 22
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 claims description 21
- 239000001257 hydrogen Substances 0.000 claims description 19
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 19
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 claims description 16
- 239000010949 copper Substances 0.000 claims description 16
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 13
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 12
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 11
- 239000005977 Ethylene Substances 0.000 claims description 11
- 239000011651 chromium Substances 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- 229910001316 Ag alloy Inorganic materials 0.000 claims description 8
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 8
- 229910000599 Cr alloy Inorganic materials 0.000 claims description 8
- 229910052697 platinum Inorganic materials 0.000 claims description 8
- 150000002431 hydrogen Chemical class 0.000 claims description 7
- 229910045601 alloy Inorganic materials 0.000 claims description 5
- 239000000956 alloy Substances 0.000 claims description 5
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 4
- 229910001128 Sn alloy Inorganic materials 0.000 claims description 4
- 239000004332 silver Substances 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 230000002452 interceptive effect Effects 0.000 claims description 3
- 229910052763 palladium Inorganic materials 0.000 claims description 3
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 claims description 2
- FHMDYDAXYDRBGZ-UHFFFAOYSA-N platinum tin Chemical compound [Sn].[Pt] FHMDYDAXYDRBGZ-UHFFFAOYSA-N 0.000 claims description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 4
- 229910001260 Pt alloy Inorganic materials 0.000 claims 4
- 229910052804 chromium Inorganic materials 0.000 claims 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 230000005611 electricity Effects 0.000 abstract 1
- 230000008859 change Effects 0.000 description 9
- 239000003921 oil Substances 0.000 description 9
- 230000008569 process Effects 0.000 description 9
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 8
- 238000004458 analytical method Methods 0.000 description 8
- 239000000446 fuel Substances 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- 238000012360 testing method Methods 0.000 description 7
- 239000002480 mineral oil Substances 0.000 description 6
- 230000004044 response Effects 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 230000006870 function Effects 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000004377 microelectronic Methods 0.000 description 5
- 235000010446 mineral oil Nutrition 0.000 description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 238000004817 gas chromatography Methods 0.000 description 4
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000001311 chemical methods and process Methods 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000007613 environmental effect Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000012544 monitoring process Methods 0.000 description 3
- MWUXSHHQAYIFBG-UHFFFAOYSA-N nitrogen oxide Inorganic materials O=[N] MWUXSHHQAYIFBG-UHFFFAOYSA-N 0.000 description 3
- 239000000523 sample Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 239000002699 waste material Substances 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 229910002092 carbon dioxide Inorganic materials 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 239000007772 electrode material Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000005669 field effect Effects 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- 150000002430 hydrocarbons Chemical class 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 230000007257 malfunction Effects 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 238000005457 optimization Methods 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 241000894007 species Species 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 102100021943 C-C motif chemokine 2 Human genes 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical compound S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 1
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 101000897480 Homo sapiens C-C motif chemokine 2 Proteins 0.000 description 1
- 238000004566 IR spectroscopy Methods 0.000 description 1
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 description 1
- 241001676573 Minium Species 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 102100027330 Phosphoribosylaminoimidazole carboxylase Human genes 0.000 description 1
- 229910000812 Ra alloy Inorganic materials 0.000 description 1
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- 229910001080 W alloy Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 238000003915 air pollution Methods 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 150000001345 alkine derivatives Chemical class 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 239000013626 chemical specie Substances 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 238000009838 combustion analysis Methods 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000005206 flow analysis Methods 0.000 description 1
- 239000002737 fuel gas Substances 0.000 description 1
- 238000004868 gas analysis Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910000037 hydrogen sulfide Inorganic materials 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004949 mass spectrometry Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 230000008447 perception Effects 0.000 description 1
- 108010035774 phosphoribosylaminoimidazole carboxylase Proteins 0.000 description 1
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical compound OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 description 1
- 238000004445 quantitative analysis Methods 0.000 description 1
- 238000010223 real-time analysis Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 239000000052 vinegar Substances 0.000 description 1
- 235000021419 vinegar Nutrition 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
- G01N33/26—Oils; Viscous liquids; Paints; Inks
- G01N33/28—Oils, i.e. hydrocarbon liquids
- G01N33/2835—Specific substances contained in the oils or fuels
- G01N33/2841—Gas in oils, e.g. hydrogen in insulating oils
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
- G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
- G01N27/04—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance
- G01N27/12—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating resistance of a solid body in dependence upon absorption of a fluid; of a solid body in dependence upon reaction with a fluid, for detecting components in the fluid
- G01N27/129—Diode type sensors, e.g. gas sensitive Schottky diodes
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Analytical Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Pathology (AREA)
- Immunology (AREA)
- General Health & Medical Sciences (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Biochemistry (AREA)
- Medicinal Chemistry (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Food Science & Technology (AREA)
- General Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electrochemistry (AREA)
- Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
- Investigating Or Analyzing Non-Biological Materials By The Use Of Chemical Means (AREA)
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1.流体中の成分を検出するメタル絶縁半導体ダイオード・センサであって、こ のセンサが、パラジウムと銅の合金を含む電極を有するメタル絶縁半導体ダイオ ードセンサ。 2.銅に対するパラジウムの原子比が、1Pd:3Cuと3Pd:1Cuの間に ある請求項1記載のメタル絶縁半導体ダイオード・センサ。 3.メタル絶縁半導体ダイオード・センサを用いて流体中の少なくとも1つの成 分を検出する方法であって、この少なくとも1つの成分が、一酸化炭素、水素、 アセチレン、エチレン及びこれらの混合物からなるグループから選択される方法 において、 請求項1に記載されたセンサを提供する工程と、 上記流体に電極を接触させる工程と、及び 上記流体中の少なくとも1つの成分に対する上記電極の感度を測定する工程 と、 を有する方法。 4.メタル絶縁半導体ダイオード・センサを用いて流体中のアセチレンを検出す る方法において、 プラチナ、プラチナと錫の合金、パラジウムと銀の合金、パラジウムと銅の 合金、パラジウムとクロムの合金、ニッケルとクロムの合金、クロム、及びそれ らの混合物からなるグループから選択された成分を含む電極を有する上記センサ を提供する工程と、 上記流体に上記電極を接触させる工程と、及び 上記アセチレン対する上記電極の感度を測定する工程と、 を有する方法。 5.アセチレンを検出するメタル絶縁半導体ダイオード・センサであって、この センサが、プラチナと錫の合金、パラジウムとクロムの合金、ニッケルとクロム の合金、クロム、及びそれらの混合物からなるグループから選択された成分を含 む電極を有するメタル絶縁半導体ダイオード・センサ。 6.混合物内の少なくとも2つの選ばれた流体を検出して分析する装置であって 、 この装置が少なくとも2つのメタル絶縁半導体ダイオード・センサのアレイを有 し、これらの少なくとも2つのセンサが、 少なくとも第1の流体に対して混合物内でより高い感度を持つと共に少なく とも第2の流体に対して混合物内でより低い感度を持つ第1の電極を備えた第1 のメタル絶縁半導体ダイオード・センサと、及び 少なくとも第2の流体に対して混合物内でより高い感度を持つと共に少なく とも第1の流体に対して混合物内でより低い感度を持つ第2の電極を備えた第2 のメタル絶縁半導体ダイオード・センサと、 を含む装置。 7.上記第1の電極が、少なくとも上記第1の流体の濃度に比例する動作機能を 有し、対応するフラット・バンド電圧を生成し、及び、上記第2の電極が、少な くとも上記第2の流体の濃度に比例する動作機能を有し、対応するフラット・バ ンド電圧を生成する請求項6記載の装置。 8.更に、各センサのフラット・バンド電極の大きさを決定する回路を有する請 求項7記載の装置。 9.更に、少なくとも上記第1の流体の濃度を計算するプロセッサを有する請求 項8記載の装置。 10.電気変圧器の障害を示す装置であって、この装置が、少なくとも第1、第2 及び第3のメタル絶縁半導体ダイオード・センサのアレイを有し、上記第1のセ ンサがプラチナを含む電極を有し、上記第2のセンサがパラジウムと銅との合金 を含む電極を有し、及び上記第3のセンサがパラジウムと銀との合金を含む電極 を有する装置。 11.更に、上記センサの少なくとも1つが感じる障害ガスの濃度の存在に応じて 各センサのフラット・バンド電極の大きさを決定する回路を有する請求項10記載 の装置。 12.更に、上記障害ガスの濃度を計算するプロセッサを有する請求項11記載の装 置。 13.流体を含む電気変圧器の障害を示す装置であって、この障害が変圧器の流体 内のガスの濃度により示される装置において、この装置が、(i)一酸化炭素に 対して主に感度を有する電極を備えた第1のメタル絶縁半導体ダイオード・セン サと、(ii)水素に対して主に感度を有する電極を備えた第2のメタル絶縁半導体 ダイオード・センサと、及び(iii)エチレンとアセチレンに対して主に感度を有 する電極を備えた第3のメタル絶縁半導体ダイオードセンサと、を含むアレイを 有し、これらの第1、第2及び第3のセンサの各電極が他の電極と異なる成分を 有する装置。 14.上記第1のセンサの電極が、Pd/Cu合金、Pd/Ag合金及びNi/C r合金から成るグループから選択される請求項13記載の装置。 15.上記第2のセンサの電極が、Pt、Pd/Ag合金、Pd/Ni合金、Pd /Cr合金及びPd/Cu合金から成るグループから選択される請求項13記載の 装置。 16.上記第3のセンサの電極が、pt、pt/Sn合金、Pd/Ag合金、Pd /Cu合金、Cr、Pd/Cr合金及びNi/Cr合金から成るグループから選 択される請求項13記載の装置。 17.更に、ガスの濃度に応じて各センサのフラット・バンド電極の大きさを決定 する回路を有する請求項13記載の装置。 18.更に、ガスの濃度を計算するプロセッサを有する請求項17記載の装置。 19.更に、ガスの濃度を送信するインジケータを有する請求項18記載の装置。
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US147,002 | 1993-11-02 | ||
| US08/147,002 US5417821A (en) | 1993-11-02 | 1993-11-02 | Detection of fluids with metal-insulator-semiconductor sensors |
| US08/147,002 | 1993-11-02 | ||
| PCT/US1994/012316 WO1995012811A1 (en) | 1993-11-02 | 1994-10-27 | Detection of fluids with metal-insulator-semiconductor sensors |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH09504613A true JPH09504613A (ja) | 1997-05-06 |
| JP3115896B2 JP3115896B2 (ja) | 2000-12-11 |
Family
ID=22519959
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP07513289A Expired - Fee Related JP3115896B2 (ja) | 1993-11-02 | 1994-10-27 | メタル絶縁半導体(mis)センサを用いた流体の検出 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US5417821A (ja) |
| EP (1) | EP0729574A1 (ja) |
| JP (1) | JP3115896B2 (ja) |
| AU (1) | AU8126794A (ja) |
| CA (1) | CA2174760C (ja) |
| WO (1) | WO1995012811A1 (ja) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001281213A (ja) * | 2000-03-31 | 2001-10-10 | Figaro Eng Inc | ガスセンサ |
| JP2004198418A (ja) * | 2002-12-13 | 2004-07-15 | General Electric Co <Ge> | 油入高電圧電気機器において溶解炭化水素ガスを検出するためのセンサデバイス |
| WO2012165182A1 (ja) * | 2011-05-27 | 2012-12-06 | 株式会社 エヌ・ティ・ティ・ドコモ | 生体ガス検知装置及び生体ガス検知方法 |
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| US5693545A (en) * | 1996-02-28 | 1997-12-02 | Motorola, Inc. | Method for forming a semiconductor sensor FET device |
| US5708735A (en) * | 1996-03-29 | 1998-01-13 | Benson; David K. | Fiber optic device for sensing the presence of a gas |
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| US6127268A (en) * | 1997-06-11 | 2000-10-03 | Micronas Intermetall Gmbh | Process for fabricating a semiconductor device with a patterned metal layer |
| DE19724595A1 (de) * | 1997-06-11 | 1998-12-17 | Micronas Semiconductor Holding | Verfahren zum Herstellen einer Halbleiteranordnung mit strukturierter Metallisierung |
| US6298710B1 (en) | 1998-02-20 | 2001-10-09 | Ford Global Technologies, Inc. | Combustible gas diode sensor |
| US6324899B1 (en) | 1998-04-02 | 2001-12-04 | Reliance Electric Technologies, Llc | Bearing-sensor integration for a lubrication analysis system |
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| US6286363B1 (en) * | 1998-04-02 | 2001-09-11 | Reliance Electric Technologies, Llc | Integrated multi-element lubrication sensor and health lubricant assessment system |
| US6196057B1 (en) | 1998-04-02 | 2001-03-06 | Reliance Electric Technologies, Llc | Integrated multi-element lubrication sensor and lubricant health assessment |
| US6546785B1 (en) | 1998-04-02 | 2003-04-15 | Rockwell Automation Technologies, Inc. | System and method for dynamic lubrication adjustment for a lubrication analysis system |
| US6029500A (en) * | 1998-05-19 | 2000-02-29 | Advanced Technology Materials, Inc. | Piezoelectric quartz crystal hydrogen sensor, and hydrogen sensing method utilizing same |
| US6079252A (en) * | 1998-05-20 | 2000-06-27 | Advanced Technology Materials, Inc. | Leak detection device, and fluid vessel assembly comprising same |
| US6156578A (en) * | 1998-06-01 | 2000-12-05 | Advanced Technology Materials, Inc. | Quartz crystal microbalance system for detecting concentration of a selected gas component in a multicomponent gas stream |
| US6041643A (en) * | 1998-07-27 | 2000-03-28 | General Electric Company | Gas sensor with protective gate, method of forming the sensor, and method of sensing |
| US6155100A (en) * | 1998-07-27 | 2000-12-05 | General Electric Company | Gas sensor with protective gate, method of forming the sensor, and method of sensing |
| US6289716B1 (en) | 1998-08-19 | 2001-09-18 | Electric Power Research Institute, Inc. | Method for on-line assessment and indication of transformer conditions |
| US6596236B2 (en) | 1999-01-15 | 2003-07-22 | Advanced Technology Materials, Inc. | Micro-machined thin film sensor arrays for the detection of H2 containing gases, and method of making and using the same |
| US6295861B1 (en) | 1999-01-28 | 2001-10-02 | Advanced Technology Materials, Inc. | Quartz crystal microbalance sensors and semiconductor manufacturing process systems comprising same |
| US6494617B1 (en) | 1999-04-30 | 2002-12-17 | General Electric Company | Status detection apparatus and method for fluid-filled electrical equipment |
| WO2001036941A1 (en) * | 1999-11-18 | 2001-05-25 | Advanced Technology Materials, Inc. | Optical hydrogen detector |
| US7274082B2 (en) * | 2000-01-19 | 2007-09-25 | Adrena, Inc. | Chemical sensor using chemically induced electron-hole production at a schottky barrier |
| US6903433B1 (en) * | 2000-01-19 | 2005-06-07 | Adrena, Inc. | Chemical sensor using chemically induced electron-hole production at a schottky barrier |
| EP1269177A2 (en) * | 2000-03-17 | 2003-01-02 | Wayne State University | Mis hydrogen sensors |
| US6956274B2 (en) * | 2002-01-11 | 2005-10-18 | Analog Devices, Inc. | TiW platinum interconnect and method of making the same |
| US7264778B2 (en) * | 2003-03-12 | 2007-09-04 | Sandia Corporation | Carbon monoxide sensor and method of use thereof |
| US7581434B1 (en) | 2003-09-25 | 2009-09-01 | Rockwell Automation Technologies, Inc. | Intelligent fluid sensor for machinery diagnostics, prognostics, and control |
| US7053425B2 (en) * | 2003-11-12 | 2006-05-30 | General Electric Company | Gas sensor device |
| WO2009116346A1 (ja) * | 2008-03-19 | 2009-09-24 | 日鉱金属株式会社 | 基材上にバリア兼シード層が形成された電子部材 |
| US20110124113A1 (en) | 2009-11-25 | 2011-05-26 | Abdul-Majeed Azad | Methods and devices for detecting unsaturated compounds |
| US20120227466A1 (en) * | 2011-03-11 | 2012-09-13 | James William Medlin | Methods for detection of acetylene on bimetallic sensors |
| US9146226B1 (en) | 2011-05-26 | 2015-09-29 | The University Of Toledo | Methods and devices for detecting unsaturated compounds |
| US9562292B2 (en) | 2014-05-05 | 2017-02-07 | The United States Of America, As Represented By The Secretary Of Commerce | Photoactive article, process for making, and use of same |
| CN110945353B (zh) * | 2017-06-13 | 2023-04-07 | 通用电气公司 | 用阻抗式气体感测器的溶解气体分析 |
| WO2019077630A1 (en) * | 2017-10-16 | 2019-04-25 | Indian Institute Of Science | METHODS OF MANUFACTURING NANOCAPTER AND NETWORK OF NANOCAPTERS |
| CN119666931A (zh) * | 2024-12-09 | 2025-03-21 | 国网安徽省电力有限公司电力科学研究院 | 一种低浓度氢探测mis型薄膜传感器及其制备方法 |
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-
1993
- 1993-11-02 US US08/147,002 patent/US5417821A/en not_active Expired - Lifetime
-
1994
- 1994-10-27 EP EP95900444A patent/EP0729574A1/en not_active Withdrawn
- 1994-10-27 WO PCT/US1994/012316 patent/WO1995012811A1/en not_active Ceased
- 1994-10-27 AU AU81267/94A patent/AU8126794A/en not_active Abandoned
- 1994-10-27 CA CA002174760A patent/CA2174760C/en not_active Expired - Lifetime
- 1994-10-27 JP JP07513289A patent/JP3115896B2/ja not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001281213A (ja) * | 2000-03-31 | 2001-10-10 | Figaro Eng Inc | ガスセンサ |
| JP2004198418A (ja) * | 2002-12-13 | 2004-07-15 | General Electric Co <Ge> | 油入高電圧電気機器において溶解炭化水素ガスを検出するためのセンサデバイス |
| WO2012165182A1 (ja) * | 2011-05-27 | 2012-12-06 | 株式会社 エヌ・ティ・ティ・ドコモ | 生体ガス検知装置及び生体ガス検知方法 |
| JPWO2012165182A1 (ja) * | 2011-05-27 | 2015-02-23 | 株式会社Nttドコモ | 生体ガス検知装置及び生体ガス検知方法 |
| US9410912B2 (en) | 2011-05-27 | 2016-08-09 | Ntt Docomo, Inc. | Biological gas detection apparatus and biological gas detection method |
Also Published As
| Publication number | Publication date |
|---|---|
| CA2174760A1 (en) | 1995-05-11 |
| EP0729574A4 (en) | 1996-06-11 |
| CA2174760C (en) | 1999-07-13 |
| JP3115896B2 (ja) | 2000-12-11 |
| AU8126794A (en) | 1995-05-23 |
| EP0729574A1 (en) | 1996-09-04 |
| WO1995012811A1 (en) | 1995-05-11 |
| US5417821A (en) | 1995-05-23 |
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