JPH09504877A - 標本ホルダーを有する研磨装置 - Google Patents
標本ホルダーを有する研磨装置Info
- Publication number
- JPH09504877A JPH09504877A JP8507079A JP50707996A JPH09504877A JP H09504877 A JPH09504877 A JP H09504877A JP 8507079 A JP8507079 A JP 8507079A JP 50707996 A JP50707996 A JP 50707996A JP H09504877 A JPH09504877 A JP H09504877A
- Authority
- JP
- Japan
- Prior art keywords
- specimen
- polishing
- orifice
- sample
- central body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 50
- 239000000463 material Substances 0.000 claims description 13
- 239000011347 resin Substances 0.000 abstract description 17
- 229920005989 resin Polymers 0.000 abstract description 17
- 238000005088 metallography Methods 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 8
- 238000005260 corrosion Methods 0.000 description 7
- 230000007797 corrosion Effects 0.000 description 7
- 239000000126 substance Substances 0.000 description 6
- 229910003460 diamond Inorganic materials 0.000 description 4
- 239000010432 diamond Substances 0.000 description 4
- 238000004458 analytical method Methods 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000002699 waste material Substances 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000012857 radioactive material Substances 0.000 description 2
- 241000251468 Actinopterygii Species 0.000 description 1
- 229910052778 Plutonium Inorganic materials 0.000 description 1
- 239000002775 capsule Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- OYEHPCDNVJXUIW-UHFFFAOYSA-N plutonium atom Chemical compound [Pu] OYEHPCDNVJXUIW-UHFFFAOYSA-N 0.000 description 1
- 230000002285 radioactive effect Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
- G01N1/32—Polishing; Etching
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Sampling And Sample Adjustment (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1. 研磨テーブル(3)と、少くとも1つのオリフィス(11)を設けられ る支持円板(9)を有する研磨ヘッド(5)とを具備し、ほぼ平坦な面を各々が 有する材料の標本(2)を研磨する装置において,前記円板のオリフィス(11 )に少くとも部分的に収容可能で前記標本を所定の位置に維持する標本ホルダー (15)をも具備し,該標本ホルダーが、 − 該標本を保持して位置決めする装置(21,23,25,27,29)を持 つ下側部分(17a)と、該円板オリフィス内の該標本の深さの読みを調節する 装置(31)を挿入されるベース(19)を持つ上側部分(17b)とを有する 中央本体(17)と, − 該中央本体(17)のまわりに設置され、肩(16c)を外部に設けられる 摺動ジャケット(16)とを備え,該肩が、該中央本体のベースのものにほぼ等 しい外周を有するストップリング(16b)と、前記円板オリフィスの周囲に対 して調節される小さい周囲の心出しリング(16a)とに該ジャケットを細分す ることを特徴とする研磨装置。 2. 請求の範囲第1項に記載の研磨装置において,前記標本を保持して位置 決めする前記装置が、該標本をその上に設置する平坦なサポート(25)と、前 記中央本体と一体の固定ジョー(21)と、該固定ジョーに対して平行に配置さ れて、該標本を所定の位置に維持可能な万力を一緒に形成する可動ジョー(23 )と、該可動ジョーを該固定ジョーに対して移動する少くとも1本の締付けねじ (29)とを有することを特徴とする研磨装置。 3. 請求の範囲第1項または第2項に記載の研磨装置において,前記標本の 深さの読みを調節する前記装置が、相互に対して規則正しく配置されて前記スト ップリングに当接する少くとも3本のねじを有することを特徴とする研磨装置。 4. 請求の範囲第2項または第3項に記載の研磨装置において,前記サポー トが、横方向のV形ノッチ(27)を有し,前記標本が、該ノッチ内に設置され 、その平坦面が、該ノッチに対して反対に方向づけられることを特徴とする研磨 装置。 5. 請求の範囲第2項から第4項のいづれか1つの項に記載の研磨装置にお いて,前記保持して位置決めする装置のジョーの少くとも1つが、前記標本をそ の中に固定する軸方向のV形ノッチを有し,該標本の平坦面が、該ノッチの方向 に対して垂直の方向に方向づけられることを特徴とする研磨装置。 6. 請求の範囲第3項から第5項のいづれか1つの項に記載の研磨装置にお いて,前記標本ホルダーが、前記サポートに対して平行な前記標本の平坦面の位 置決めを保証するために前記中央本体の下側部分のまわりに装着可能なカバー( 33)を有することを特徴とする研磨装置。
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR94/10079 | 1994-08-17 | ||
| FR9410079A FR2723704B1 (fr) | 1994-08-17 | 1994-08-17 | Dispositif de polissage avec porte-echantillons |
| PCT/FR1995/001085 WO1996005497A1 (fr) | 1994-08-17 | 1995-08-16 | Dispositif de polissage avec porte-echantillons |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH09504877A true JPH09504877A (ja) | 1997-05-13 |
| JP3523264B2 JP3523264B2 (ja) | 2004-04-26 |
Family
ID=9466345
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP50707996A Expired - Lifetime JP3523264B2 (ja) | 1994-08-17 | 1995-08-16 | 標本ホルダーを有する研磨装置 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US5735992A (ja) |
| EP (1) | EP0723653B1 (ja) |
| JP (1) | JP3523264B2 (ja) |
| CA (1) | CA2174442C (ja) |
| DE (1) | DE69528630T2 (ja) |
| ES (1) | ES2184807T3 (ja) |
| FR (1) | FR2723704B1 (ja) |
| WO (1) | WO1996005497A1 (ja) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019152517A (ja) * | 2018-03-02 | 2019-09-12 | 三菱重工業株式会社 | 皮膜のヤング率分布算出方法及び試料ホルダ |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE20204088U1 (de) | 2002-03-13 | 2002-06-06 | Müller, Heinrich, 57635 Wölmersen | Oberflächenbearbeitungsvorrichtung für Probekörper |
| JP2004354333A (ja) * | 2003-05-30 | 2004-12-16 | Teruaki Ito | 検体仕分けシステム |
| KR101134416B1 (ko) | 2009-12-23 | 2012-04-09 | 강원대학교산학협력단 | 내마모성 및 편리성이 향상된 시편 제조 장치 |
| DE102013003611A1 (de) | 2013-03-01 | 2014-09-04 | GM Global Technology Operations LLC (n. d. Gesetzen des Staates Delaware) | Vorrichtung zur Zielpräparation |
| CN103940649B (zh) * | 2014-04-03 | 2016-04-27 | 北京工业大学 | 带有预磨厚度控制装置的试样预磨机 |
| CN105299047A (zh) * | 2015-11-16 | 2016-02-03 | 耒阳新达微科技有限公司 | 一种新型轴承加工设备 |
| CN106018021B (zh) * | 2016-05-16 | 2018-10-30 | 安徽理工大学 | 一种用于不同尺寸岩石试样的制取装置及方法 |
| CN106737085B (zh) * | 2016-12-14 | 2018-09-11 | 上海奥龙星迪检测设备有限公司 | 磨抛机 |
| US11397139B2 (en) | 2017-02-27 | 2022-07-26 | Leco Corporation | Metallographic grinder and components thereof |
| CN107081669B (zh) * | 2017-05-22 | 2019-05-24 | 山东鲁发橡塑制品集团有限公司 | 一种塑胶件抛光装置 |
| FR3070609B1 (fr) * | 2017-09-01 | 2019-09-13 | Sncf Mobilites | Module de stockage d'une eprouvette micrographique |
| US11491611B2 (en) * | 2018-08-14 | 2022-11-08 | Illinois Tool Works Inc. | Splash guards for grinder/polisher machines and grinder/polisher machines having splash guards |
| DE102018126749B4 (de) | 2018-10-26 | 2026-04-23 | Deutsches Zentrum für Luft- und Raumfahrt e.V. | Probenhaltervorrichtung für eine Schleifeinrichtung und Verfahren zum Herstellen einer mikroskopisch planen Ebene an einer Probe |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3549439A (en) * | 1967-09-15 | 1970-12-22 | North American Rockwell | Chemical lapping method |
| US4534536A (en) * | 1984-06-08 | 1985-08-13 | Buehler Ltd. | Apparatus for mounting samples for polishing |
| US4600469A (en) * | 1984-12-21 | 1986-07-15 | Honeywell Inc. | Method for polishing detector material |
| DE9010700U1 (de) * | 1990-07-18 | 1990-09-27 | ANT Nachrichtentechnik GmbH, 7150 Backnang | Haltevorrichtung für Proben, von denen ein Schliff angefertigt werden soll |
| US5534106A (en) * | 1994-07-26 | 1996-07-09 | Kabushiki Kaisha Toshiba | Apparatus for processing semiconductor wafers |
-
1994
- 1994-08-17 FR FR9410079A patent/FR2723704B1/fr not_active Expired - Lifetime
-
1995
- 1995-08-16 EP EP95927787A patent/EP0723653B1/fr not_active Expired - Lifetime
- 1995-08-16 CA CA002174442A patent/CA2174442C/en not_active Expired - Fee Related
- 1995-08-16 ES ES95927787T patent/ES2184807T3/es not_active Expired - Lifetime
- 1995-08-16 JP JP50707996A patent/JP3523264B2/ja not_active Expired - Lifetime
- 1995-08-16 US US08/628,636 patent/US5735992A/en not_active Expired - Lifetime
- 1995-08-16 WO PCT/FR1995/001085 patent/WO1996005497A1/fr not_active Ceased
- 1995-08-16 DE DE69528630T patent/DE69528630T2/de not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2019152517A (ja) * | 2018-03-02 | 2019-09-12 | 三菱重工業株式会社 | 皮膜のヤング率分布算出方法及び試料ホルダ |
Also Published As
| Publication number | Publication date |
|---|---|
| EP0723653B1 (fr) | 2002-10-23 |
| FR2723704B1 (fr) | 1996-09-20 |
| JP3523264B2 (ja) | 2004-04-26 |
| US5735992A (en) | 1998-04-07 |
| ES2184807T3 (es) | 2003-04-16 |
| WO1996005497A1 (fr) | 1996-02-22 |
| CA2174442C (en) | 2005-07-26 |
| FR2723704A1 (fr) | 1996-02-23 |
| DE69528630D1 (de) | 2002-11-28 |
| DE69528630T2 (de) | 2003-07-10 |
| CA2174442A1 (en) | 1996-02-22 |
| EP0723653A1 (fr) | 1996-07-31 |
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