JPH0955111A - Method for manufacturing substrate used in planar light source device - Google Patents
Method for manufacturing substrate used in planar light source deviceInfo
- Publication number
- JPH0955111A JPH0955111A JP7229657A JP22965795A JPH0955111A JP H0955111 A JPH0955111 A JP H0955111A JP 7229657 A JP7229657 A JP 7229657A JP 22965795 A JP22965795 A JP 22965795A JP H0955111 A JPH0955111 A JP H0955111A
- Authority
- JP
- Japan
- Prior art keywords
- transparent resin
- film
- resin substrate
- light
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Liquid Crystal (AREA)
- Planar Illumination Modules (AREA)
- Laminated Bodies (AREA)
Abstract
(57)【要約】
【課題】 従来の面状光源装置に備わる透明樹脂基板の
裏面に白色または乳白色インクによる散乱パターンの印
刷方法は、生産効率が悪く、かつ溶剤による環境汚染が
危惧されたので、このような問題のない新規の散乱パタ
ーンを備える面状光源装置に用いる基板の製造方法を提
供する。
【解決手段】 透明樹脂基板の土台となる透明樹脂基材
上に、光散乱物質を均一に散在させたフィルムを載置
し、該フィルムの上方よりエンボス加工を行い、フィル
ムに凹凸形状による光散乱パターンを施し、かつ、フィ
ルムと透明樹脂基材を溶着させ、透明樹脂基板を一体的
に形成する。
(57) Abstract: A conventional method for printing a scattering pattern with a white or milky white ink on the back surface of a transparent resin substrate provided in a planar light source device has poor production efficiency, and there is a fear of environmental pollution due to a solvent. Provided is a method for manufacturing a substrate used in a planar light source device having a novel scattering pattern without such a problem. A film on which a light-scattering substance is evenly dispersed is placed on a transparent resin base material that is a base of a transparent resin substrate, and embossing is performed from above the film to scatter light due to unevenness on the film. A transparent resin substrate is integrally formed by patterning and welding the film and the transparent resin substrate.
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、看板や各種表示装
置等の背面照明に用いる薄型の面状光源装置、特に液晶
表示装置の背面照明手段に用いる基板の製造方法に関す
るものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thin planar light source device used for back lighting of signboards and various display devices, and more particularly to a method of manufacturing a substrate used for back lighting means of a liquid crystal display device.
【０００２】[0002]
【従来の技術】従来、薄型の面状光源装置としては、サ
イドライト方式（導光板方式）が知られている。サイド
ライト方式の面状光源装置の一例として、その構造は、
図１２、図１３に示されるように、アクリル等の透光性
の高い材料による略断面矩形状の透明樹脂基板４１の裏
面４２には、白色または乳白色インクにより、一端側か
ら他端側に行くにつれてその密度が変化するように、通
常スクリーン印刷方式により印刷された散乱パターン４
３が施されている。さらに、該散乱パターン４３の後方
には、反射板４４が配置されている。また、透明樹脂基
板４１の表面４５には、拡散板４６が配置されている。2. Description of the Related Art Conventionally, a side light system (light guide plate system) has been known as a thin planar light source device. As an example of a side light type planar light source device, the structure is
As shown in FIGS. 12 and 13, the back surface 42 of the transparent resin substrate 41 having a substantially rectangular cross section made of a highly translucent material such as acrylic goes from one end side to the other end side with white or milky white ink. Scattering pattern 4 normally printed by a screen printing method so that its density changes as
3 is given. Further, a reflecting plate 44 is arranged behind the scattering pattern 43. Further, a diffusion plate 46 is arranged on the surface 45 of the transparent resin substrate 41.
【０００３】透明樹脂基板４１の端面４７には、直線状
光源である蛍光管４８が透明樹脂基板４１の端面４７と
ほぼ当接するように配置されており、その外周面でかつ
前記端部４７を向いた面以外の部分は、銀等を蒸着した
反射フィルム４９で覆われている。蛍光管４８が置かれ
ている側とは反対側の透明樹脂基板４１の端面には、反
射テープ等の反射材５０が付加されている。（例えば、
特開昭６３−９２１０５号公開）A fluorescent tube 48, which is a linear light source, is arranged on the end surface 47 of the transparent resin substrate 41 so as to substantially contact the end surface 47 of the transparent resin substrate 41, and the end portion 47 is formed on the outer peripheral surface thereof. The part other than the facing surface is covered with a reflective film 49 formed by depositing silver or the like. A reflective material 50 such as a reflective tape is added to the end surface of the transparent resin substrate 41 on the side opposite to the side where the fluorescent tubes 48 are placed. (For example,
(Japanese Patent Laid-Open No. 63-92105)
【０００４】図１４は、このように構成されたサイドラ
イト方式の面状光源装置における光線の挙動を説明する
ための模式的な断面図である。これを説明すると、蛍光
管４８からの発光光線は、反射フィルム４９により反射
されるので、その多くが透明樹脂基板４１の端面４７に
到達し、透明樹脂基板４１の内部に進入する。この光線
の内、透明樹脂基板４１の裏面４２に印刷されている散
乱パターン４３に当たった光線５１だけが散乱され、そ
のまま反射して透明樹脂基板４１の表面に達する光線５
２及び裏面に抜けて反射板４４に当たって反射し、透明
樹脂基板４１の表面４５に向かう光線５３の２つは、符
号５４で示すように、拡散板４６を透過して画面に放射
される。FIG. 14 is a schematic cross-sectional view for explaining the behavior of light rays in the side light type planar light source device having such a configuration. Explaining this, since the light emitted from the fluorescent tube 48 is reflected by the reflective film 49, most of it reaches the end face 47 of the transparent resin substrate 41 and enters the inside of the transparent resin substrate 41. Of these rays, only the ray 51 that hits the scattering pattern 43 printed on the back surface 42 of the transparent resin substrate 41 is scattered and reflected as it is to reach the surface of the transparent resin substrate 41.
Two of the light rays 53 passing through the second and rear surfaces, hitting the reflecting plate 44, being reflected, and traveling toward the front surface 45 of the transparent resin substrate 41 are transmitted through the diffuser plate 46 and emitted to the screen, as indicated by reference numeral 54.
【０００５】透明樹脂基板４１の裏面４２の散乱パター
ン４３に当たらなかった光線５５及び透明樹脂基板４１
の表面側４５に当たった光線５６は散乱パターン４３に
到達するまでそのまま内部で全反射を繰り返して進む。
出射光が全画面上で均一な発光強度になるよう散乱パタ
ーンに密度分布を与えていることにより、比較的高輝度
でしかも均一な面状光源が実現可能となっている。The light ray 55 not hitting the scattering pattern 43 on the back surface 42 of the transparent resin substrate 41 and the transparent resin substrate 41
The light ray 56 that hits the front surface side 45 of the above continues to undergo total internal reflection as it is until it reaches the scattering pattern 43.
By providing a density distribution to the scattering pattern so that the emitted light has a uniform emission intensity on the entire screen, it is possible to realize a uniform planar light source with relatively high brightness.
【０００６】[0006]
【発明が解決ようとする課題】ところで、面状光源装置
に用いられた透明樹脂基板４１の裏面に配置される散乱
パターン４３の白色または乳白色インクによる印刷方法
は、上述したように、通常スクリーン印刷方式による。
このスクリーン印刷方式は、印刷工程における、インク
を付着した後の乾燥工程で長い時間を必要とするため、
生産性が極めて低いという欠点があった。また、使用す
る溶剤による環境の汚染問題も危惧される。By the way, the printing method of the scattering pattern 43 arranged on the back surface of the transparent resin substrate 41 used in the planar light source device with the white or milky white ink is, as described above, the normal screen printing. It depends on the method.
This screen printing method requires a long time in the drying process after the ink is attached in the printing process.
It had the drawback of extremely low productivity. In addition, there is a fear of environmental pollution caused by the solvent used.
【０００７】そこで、本発明は、散乱パターン製造工程
における生産性の向上と、かつ環境の汚染問題のない新
規の散乱パターンを形成した面状光源装置に用いる基板
の製造方法を提供することを目的とする。Therefore, an object of the present invention is to provide a method for manufacturing a substrate used for a planar light source device having a novel scattering pattern which has improved productivity in the scattering pattern manufacturing process and has no environmental pollution problem. And
【０００８】[0008]
【課題を解決するための手段】上記目的を達成するため
に、請求項１では、透明樹脂基材の上に、光散乱物質を
包含した熱可塑性樹脂層を含有または坦持したフィルム
を載置し、しかる後一側から他側に向かって密度が増加
するように配置される光散乱パターンに対応する突起を
配置した型を加熱、圧接後、冷却することにより、フィ
ルムの光散乱物質を含む熱可塑性樹脂層のうち、光散乱
パターンに対応した部分のみを選択的に該透明樹脂基材
に密着させて、透明樹脂基板を構成することを特徴とす
る面状光源装置に用いる基板の製造方法である。In order to achieve the above object, in claim 1, a film containing or carrying a thermoplastic resin layer containing a light scattering substance is placed on a transparent resin substrate. After that, the mold having the projections corresponding to the light-scattering pattern arranged so that the density increases from one side to the other side is heated, pressure-contacted, and then cooled to contain the light-scattering substance of the film. Of the thermoplastic resin layer, only a portion corresponding to the light scattering pattern is selectively brought into close contact with the transparent resin base material to form a transparent resin substrate, and a method for manufacturing a substrate used in a planar light source device. Is.
【０００９】請求項２では、前記フィルムが耐熱性を有
したフィルム基材とし、しかもフィルム基材は光散乱物
質を含有または坦持したものであり、前記透明樹脂基材
上に、該フィルムを載置し、しかる後前記光散乱パター
ンに対応する突起を配置した型を加熱、圧接後、冷却す
ることにより、フィルムの光散乱物質を含む熱可塑性樹
脂のうち、光散乱パターンに対応した密着部分のみを選
択的に該透明樹脂基材に密着させた後、該フィルム基材
を剥離させ、前記密着部分のみを透明樹脂基材上に残す
ことにより透明樹脂基板を構成することを特徴とする面
状光源装置に用いる基板の製造方法である。According to a second aspect of the present invention, the film is a heat-resistant film base material, and the film base material contains or carries a light scattering substance. The film is formed on the transparent resin base material. By placing, then heating the mold in which the projections corresponding to the light scattering pattern are arranged, pressing and then cooling, the thermoplastic resin containing the light scattering substance of the film, the adhesion portion corresponding to the light scattering pattern A surface characterized by constituting a transparent resin substrate by selectively adhering only the transparent resin substrate to the transparent resin substrate, peeling off the film substrate, and leaving only the adhered portion on the transparent resin substrate. It is a method of manufacturing a substrate used for a strip light source device.
【００１０】[0010]
【発明の実施の形態】まず、本発明方法によって製造さ
れた基板が用いられる面状光源装置の構造を添付図面に
基づいて説明する。図１、図２において、上方が面状光
源装置の裏面であり、下方が表面である。１は、断面略
矩形のアクリル樹脂等の透光性の高い材料よりなる２層
の透明樹脂基板である。透明樹脂基板１を形成する２層
のうち１層は、表面側（図面下方）のアクリル樹脂製の
透明樹脂基材２であり、もう１層は、裏面側（図面上
方）に位置するアクリル樹脂製のフィルム３である。DESCRIPTION OF THE PREFERRED EMBODIMENTS First, the structure of a planar light source device using a substrate manufactured by the method of the present invention will be described with reference to the accompanying drawings. 1 and 2, the upper side is the back surface of the planar light source device, and the lower side is the front surface. Reference numeral 1 is a two-layer transparent resin substrate made of a highly transparent material such as an acrylic resin having a substantially rectangular cross section. One of the two layers forming the transparent resin substrate 1 is a transparent resin base material 2 made of acrylic resin on the front surface side (the lower side of the drawing), and the other layer is an acrylic resin positioned on the rear surface side (the upper side of the drawing). It is the film 3 made from.
【００１１】フィルム３は、厚さが１００μｍであり、
フィルム３の全表面と内部に渡って光散乱物質４として
ＴｉＯ2 を含有している。フィルム３には、画面上で均
一の発光強度とするために密度を変えた光散乱パターン
が施されている。その光散乱パターンは、面状光源装置
裏面から観察すると、例えば、図１に示すように、大き
さの異なる凹部、例えば円が、柱形状凹部をフィルムに
多数、光源から遠ざかる方向に径が大きくなるように形
成する。The film 3 has a thickness of 100 μm,
The film 3 contains TiO 2 as a light scattering substance 4 over the entire surface and inside thereof. The film 3 is provided with a light-scattering pattern whose density is changed in order to obtain a uniform emission intensity on the screen. When the light scattering pattern is observed from the back surface of the planar light source device, for example, as shown in FIG. 1, recesses having different sizes, for example, circles, have a large number of pillar-shaped recesses in the film, and have a large diameter in a direction away from the light source. To be formed.
【００１２】さらに、透明樹脂基板１を形成する透明樹
脂基材２の外方（開放側面）には、画面全体を覆うよう
に拡散板５が、フィルム３の外方（開放側面）には、反
射板６が装置裏面を覆うように設置されている。透明樹
脂基板１の端面７にほぼ当接するように直線状光源であ
る蛍光管８が置かれている。該蛍光管８の外周でかつ透
明樹脂基板１の位置する面以外の外周面は、アルミニウ
ム、銀等を蒸着した反射フィルム９で覆われ、該反射フ
ィルム９は透明樹脂基板１の表裏それぞれに接着されて
いる。蛍光管８が置かれている以外の装置の側面には、
反射テープ等の反射材１０が備えられている。Further, on the outside (open side) of the transparent resin substrate 2 forming the transparent resin substrate 1, a diffusion plate 5 is provided so as to cover the entire screen, and on the outside (open side) of the film 3, The reflector 6 is installed so as to cover the back surface of the device. A fluorescent tube 8 which is a linear light source is placed so as to substantially contact the end surface 7 of the transparent resin substrate 1. The outer peripheral surface of the fluorescent tube 8 other than the surface on which the transparent resin substrate 1 is located is covered with a reflective film 9 vapor-deposited with aluminum, silver or the like, and the reflective film 9 is adhered to each of the front and back surfaces of the transparent resin substrate 1. Has been done. On the side of the device except where the fluorescent tube 8 is placed,
A reflective material 10 such as a reflective tape is provided.
【００１３】図４に基づいて、第１の実施の形態とし
て、図１、図２で説明した面状光源装置に用いる透明樹
脂基板１の製造方法を説明する。図４に示すように、ア
クリル樹脂製の断面略矩形状の透明樹脂基材２上に、光
散乱物質４としてＴｉＯ2 を略均一に含有した厚さ１０
０μｍのアクリル樹脂製フィルム３を置く。そして、フ
ィルム３上方から、光散乱パターンを形成させるための
凹凸形状を有する型１１を型温１８０℃程度で加熱、加
圧し、加圧を続けながら型１１を冷却し、アクリル樹脂
が冷却したところで型１１を剥離する（エンボス加
工）。このようにして図３に示される透明樹脂基板１は
製造される。A method of manufacturing the transparent resin substrate 1 used in the planar light source device described with reference to FIGS. 1 and 2 will be described as a first embodiment with reference to FIG. As shown in FIG. 4, a transparent resin substrate 2 made of an acrylic resin and having a substantially rectangular cross-section has a thickness 10 in which TiO 2 as a light scattering substance 4 is substantially uniformly contained.
A 0 μm acrylic resin film 3 is placed. Then, from above the film 3, a mold 11 having a concavo-convex shape for forming a light-scattering pattern is heated and pressed at a mold temperature of about 180 ° C., the mold 11 is cooled while continuing the pressurization, and the acrylic resin is cooled. The mold 11 is peeled off (embossing). In this way, the transparent resin substrate 1 shown in FIG. 3 is manufactured.
【００１４】上述したエンボス加工によりフィルム３に
は凹凸形状の光散乱パターンが形成されているので、透
明樹脂基板１を形成する透明樹脂基材２とフィルム３の
境界面には、型１１の押圧によってフィルム３において
境界面に対して凸部となった密接部分１２のみが溶着し
ている。本実施例においては、画面の正面から観察した
光散乱パターンの凹凸形状を、従来例の図１２で示した
印刷により施す散乱パターンと同様の円形状としたの
で、透明樹脂基材２に溶着しているフィルム３の密接部
分１２は、従来の散乱パターンと同様円形状に、透明樹
脂基材２との境界面に溶着している。したがって、透明
樹脂基板１内に到達した発行光線は、従来例で示した図
１４の発光光線と略同様の挙動を示す。なお、溶着して
いない部分のフィルム３は除去してもよい。しかし、こ
の場合反射板６は不可欠となる。Since the uneven light-scattering pattern is formed on the film 3 by the embossing described above, the die 11 is pressed against the boundary surface between the transparent resin substrate 2 forming the transparent resin substrate 1 and the film 3. Therefore, only the close contact portion 12 which is a convex portion with respect to the boundary surface in the film 3 is welded. In this example, since the uneven shape of the light scattering pattern observed from the front of the screen was a circular shape similar to the scattering pattern applied by printing shown in FIG. 12 of the conventional example, it was welded to the transparent resin substrate 2. The close contact portion 12 of the film 3 having a circular shape is welded to the boundary surface with the transparent resin substrate 2 in a circular shape similar to the conventional scattering pattern. Therefore, the emitted light ray that has reached the inside of the transparent resin substrate 1 exhibits substantially the same behavior as the emitted light ray of FIG. 14 shown in the conventional example. In addition, you may remove the film 3 of the part which is not welded. However, in this case, the reflection plate 6 is indispensable.
【００１５】次に、本発明方法によって製造された基板
が用いられる面状光源装置の作用を説明する。蛍光管８
からの発光光線は、反射フィルム１１で覆われる透明樹
脂基板１の端面７以外の蛍光管８の外周面では反射さ
れ、発光された光線ほぼ全てが、端面７に到達し透明樹
脂基板１内に進入する。光散乱パターンを形成するフィ
ルム３に到達した発光光線は、表面側に拡散され、透明
樹脂基板１の表面へ向い、進入角度の大きい光線は、拡
散板５を透過して表面に放射され、それ以外は裏面方向
に反射する。フィルム３を透過した発光光線は、後方に
位置する反射板６により、やはり表面方向に反射する。Next, the operation of the planar light source device using the substrate manufactured by the method of the present invention will be described. Fluorescent tube 8
The reflected light is reflected by the outer peripheral surface of the fluorescent tube 8 other than the end surface 7 of the transparent resin substrate 1 covered with the reflection film 11, and almost all the emitted light reaches the end surface 7 and enters the transparent resin substrate 1. enter in. The emitted light rays that have reached the film 3 forming the light scattering pattern are diffused to the surface side and directed toward the surface of the transparent resin substrate 1, and the light rays having a large entrance angle are transmitted through the diffusion plate 5 and are emitted to the surface. Others are reflected in the back surface direction. The emitted light transmitted through the film 3 is also reflected in the surface direction by the reflecting plate 6 located at the rear.
【００１６】また、表面に放射される進入角度に達しな
い発光光線も、反射板６および拡散板５にあたり反射を
繰り返すうちに、透明樹脂基板１の表面への進入角度が
変化するので表面に放射される。なお、フィルム３に施
された光散乱パターンの形状は、光源から遠ざかる（図
２の右側）ほど透明樹脂基板１に接する面積が多くなる
ので、光は光源から遠ざかるほど多く散乱され放射され
るため、光源の位置に左右されることなく全画面上で均
一な発光強度となる。Further, the emitted light rays which do not reach the entrance angle radiated to the surface are also radiated to the surface because the entrance angle to the surface of the transparent resin substrate 1 changes while repeating reflection on the reflection plate 6 and the diffusion plate 5. To be done. The shape of the light-scattering pattern applied to the film 3 is such that the farther from the light source (on the right side in FIG. 2), the larger the area in contact with the transparent resin substrate 1, and the more light is scattered and emitted as the distance from the light source increases. The light emission intensity is uniform on the entire screen regardless of the position of the light source.
【００１７】次に、本発明の第２の実施の形態について
説明する。面状光源装置と、面状光源装置に用いられる
基板の構成は、図５、図６に示されるが、前掲の第１の
実施例と略同様である。第１の実施例との相違点は、面
状光源装置内に備えられる透明樹脂基板２１の構造にあ
る。Next, a second embodiment of the present invention will be described. The structures of the planar light source device and the substrate used for the planar light source device are shown in FIGS. 5 and 6, but are substantially the same as those of the above-described first embodiment. The difference from the first embodiment is the structure of the transparent resin substrate 21 provided in the planar light source device.
【００１８】図７に基づいて面状光源装置に用いられる
透明樹脂基板２１の製造方法を説明する。アクリル樹脂
製の断面略矩形の透明樹脂基材２２上に、厚さ１００μ
ｍの透明アクリル樹脂製のフィルム基材２３を置く。こ
こで、該フィルム基材２３の片側一面には、光散乱物質
２４としてＴｉＯ2 を含有したアクリル樹脂系塗料を塗
布することにより、光散乱薄膜２５を形成しているの
で、透明樹脂基材２２と対向するように配置する。さら
に、フィルム基材２３上方から、光散乱パターンを形成
させるための凹凸形状を有する型２６を型温１８０℃程
度で加熱、加圧し、加圧を続けながら型２６を冷却し、
アクリル樹脂が冷却したところで型２６を剥離する（エ
ンボス加工）。このようにして、図６に示される透明樹
脂基板２１が製造される。A method of manufacturing the transparent resin substrate 21 used in the planar light source device will be described with reference to FIG. On a transparent resin base material 22 made of acrylic resin and having a substantially rectangular cross section, a thickness of 100 μm
A transparent resin film base material 23 of m is placed. Since the light-scattering thin film 25 is formed on one surface of the film substrate 23 by applying an acrylic resin-based coating material containing TiO 2 as the light-scattering substance 24, the transparent resin substrate 22 is formed. It is placed so as to face with. Furthermore, from above the film base material 23, a mold 26 having an uneven shape for forming a light scattering pattern is heated and pressed at a mold temperature of about 180 ° C., and the mold 26 is cooled while continuing to press,
When the acrylic resin has cooled, the mold 26 is peeled off (embossing). In this way, the transparent resin substrate 21 shown in FIG. 6 is manufactured.
【００１９】第２の実施の形態として説明した透明樹脂
基板２１を、図５に示すように面状光源装置に用いる
と、第１の実施の形態においての説明と同様に、エンボ
ス加工により、フィルム基材２３に光散乱パターンが施
されるのと同時に、透明樹脂基材２２とフィルム基材２
３の境界面に、フィルム基材２３に対して凸部となった
密接部分２７が溶着しているので、発光光線の挙動は、
従来と略同様である。なお、溶着していない部分のフィ
ルム基材２３は除去してもよい。この場合、反射板６は
不可欠である。When the transparent resin substrate 21 described as the second embodiment is used in a planar light source device as shown in FIG. 5, a film is formed by embossing similarly to the description in the first embodiment. At the same time as the light scattering pattern is applied to the base material 23, the transparent resin base material 22 and the film base material 2
On the boundary surface of No. 3, since the close contact portion 27 which is a convex portion with respect to the film base material 23 is welded, the behavior of the emitted light beam is
It is almost the same as the conventional one. The film base material 23 in the non-welded portion may be removed. In this case, the reflector 6 is indispensable.
【００２０】第３の実施の形態として、面状光源装置
と、面状光源装置に用いられる基板の別の構成は、図
８、図９に示される。前記実施例との相違点は、第３の
実施例も同様に、面状光源装置内に備えられる図９に示
す透明樹脂基板３１の構造である。As a third embodiment, another constitution of the planar light source device and the substrate used for the planar light source device is shown in FIGS. The difference from the above-described embodiment is the structure of the transparent resin substrate 31 shown in FIG. 9 provided in the planar light source device similarly to the third embodiment.
【００２１】図１０に基づいて図９に示される面状光源
装置に用いる透明樹脂基板３１の製造方法を説明する。
アクリル樹脂製の断面略矩形の透明樹脂基材３２上に、
厚さ１００μｍのＰＥＴ樹脂製のフィルム基材３３を載
置する。ここで、該フィルム基材３３の片側一面には、
光散乱物質３４としてＴｉＯ2 を含有したアクリル樹脂
系塗料を塗布することにより、光散乱薄膜３５が形成さ
れているので、透明樹脂基材３２の一面にわたって光散
乱物質３４が配置される。さらにフィルム基材３３上方
から、光散乱パターンを形成させるための凹凸形状を有
する型３６を型温１８０℃程度で加圧し、加圧を続けな
がら型３６を冷却し、樹脂が十分冷却したところで型３
６を剥離する。フィルム基材３３が型押しされ型３６の
凸部に当接したフィルム３３の片面に形成された光散乱
薄膜３５の溶接部分３７が透明樹脂基材３２に溶着する
ことになる。さらに、溶着していない部分のフィルム基
材３３を剥離すると、透明樹脂基材３２上に光散乱薄膜
３５の溶接部分３７のみが残留した、透明樹脂基板３１
が製造される。A method of manufacturing the transparent resin substrate 31 used in the planar light source device shown in FIG. 9 will be described with reference to FIG.
On a transparent resin base material 32 made of acrylic resin and having a substantially rectangular cross section,
A film base material 33 made of PET resin having a thickness of 100 μm is placed. Here, on one side of the film substrate 33,
Since the light-scattering thin film 35 is formed by applying an acrylic resin-based paint containing TiO 2 as the light-scattering substance 34, the light-scattering substance 34 is arranged over one surface of the transparent resin substrate 32. Further, from above the film substrate 33, a mold 36 having a concavo-convex shape for forming a light scattering pattern is pressed at a mold temperature of about 180 ° C., the mold 36 is cooled while continuing to press, and the mold is cooled when the resin is sufficiently cooled. Three
6 is peeled off. The welded portion 37 of the light-scattering thin film 35 formed on one surface of the film 33, which is pressed against the convex portion of the mold 36 by pressing the film substrate 33, is welded to the transparent resin substrate 32. Further, when the film base material 33 in the unwelded portion is peeled off, only the welded portion 37 of the light scattering thin film 35 remains on the transparent resin base material 32.
Is manufactured.
【００２２】この透明樹脂基材３２に溶着した光散乱薄
膜３５の溶接部分３７は、型３６の凸部に対応している
ので、前掲の実施の形態同様に、面状光源装置内におけ
る発光光線は、従来例で示した図１４の発光光線と同様
の挙動を示す。Since the welded portion 37 of the light-scattering thin film 35 welded to the transparent resin substrate 32 corresponds to the convex portion of the mold 36, the emitted light beam in the planar light source device is the same as in the above-mentioned embodiment. Shows the same behavior as the emitted light beam of FIG. 14 shown in the conventional example.
【００２３】また、熱加圧成形により、フィルム基材３
３と光散乱物質３４を含有したアクリル樹脂系塗料を塗
布して形成される光散乱薄膜３５との溶着が良く、フィ
ルム基材３３剥離の際に、光散乱薄膜３５も一緒に剥離
する等の支承が起こる場合は、透明樹脂基板３１上に位
置させるフィルム基材３３の構成を図１１に示すよう
に、フィルム基材３３と光散乱物質３４を含有したアク
リル樹脂系塗料を塗布してなる光散乱薄膜３５との間
に、密着を防止するための剥離層３８を設けてもよい。
なお、この場合は、第１の実施の形態の構造となる。The film base material 3 is formed by hot pressing.
3 and the light-scattering thin film 35 formed by applying the acrylic resin-based coating material containing the light-scattering substance 34 are well welded, and when the film substrate 33 is peeled off, the light-scattering thin film 35 is also peeled off. When the support occurs, as shown in FIG. 11, the structure of the film base material 33 to be positioned on the transparent resin substrate 31 is formed by applying an acrylic resin-based paint containing the film base material 33 and the light scattering material 34 to the light. A peeling layer 38 for preventing adhesion may be provided between the thin film 35 and the scattering thin film 35.
In this case, the structure of the first embodiment is used.
【００２４】前掲の３通りの実施の形態で示した本発明
方法により製造された各基板を面状光源装置に用いて評
価を行った結果、発光面上での明るさ及びその均一性と
もに従来の白色または乳白色のインクを印刷した散乱パ
ターンを有する面状光源装置とほぼ同一の結果を得るこ
とができた。As a result of evaluating each substrate manufactured by the method of the present invention shown in the above-mentioned three embodiments in a planar light source device, it was found that both the brightness on the light emitting surface and the uniformity thereof were conventionally. It was possible to obtain almost the same results as those of the planar light source device having the scattering pattern printed with the white or milky white ink.
【００２５】本発明を実施するに際して用いる透明樹脂
基材は、光学特性、成形加工性の点から特に優れている
アクリル樹脂とした。しかし、勿論これに限定されるも
のではなく、これに換えて、塩化ビニール樹脂、ポリカ
ーボネート樹脂、オレフィン系樹脂、スチレン系樹脂等
の各種熱可塑性の透明樹脂等が使用可能である。またＣ
Ｒ−３９等の熱硬化性透明樹脂や各種ガラス材料等の無
機透明材料等も適用可能である。また、本発明に係るフ
ィルム基材も同様に、各種樹脂材料が適用可能である。
材料選定の基準としては、加熱、加圧した場合の材料の
破断がないことである。温度特性、強度を考慮して、フ
ィルム基材として用いる各種樹脂材料の材質、厚みを適
宜選択できる。The transparent resin substrate used for carrying out the present invention is an acrylic resin which is particularly excellent in terms of optical characteristics and moldability. However, of course, the present invention is not limited to this, and instead of this, various thermoplastic transparent resins such as vinyl chloride resin, polycarbonate resin, olefin resin, and styrene resin can be used. Also C
Thermosetting transparent resins such as R-39 and inorganic transparent materials such as various glass materials are also applicable. Similarly, various resin materials can be applied to the film substrate according to the present invention.
The criterion for material selection is that there is no breakage of the material when heated and pressed. In consideration of temperature characteristics and strength, the material and thickness of various resin materials used as the film substrate can be appropriately selected.
【００２６】さらに本発明に係る光散乱物質として、実
施例ではＴｉＯ2 を使用するが、これに換えて、ＳｉＯ
2 、ＣａＣＯ3 、Ａｌ2 Ｏ3 、ＢａＳＯ4 、ＺｎＯ、ガ
ラス微粉末等の無機系の光散乱材やまたは有機系の光散
乱材であって、しかも液状樹脂媒体に溶解または化学変
化をしない物質を選択することができる。またこれらを
単体で使用してもよいし、２種以上を混合して使用して
もよい。光散乱物質を包含するための熱可塑性樹脂につ
いても、透明樹脂であれば特に限定されるものでなく、
透明樹脂基材用材料で例示した材料を使用可能である
が、透明樹脂基材と同一または類似の熱的特性を有する
材料を選択することが望ましい。Further, as the light-scattering material according to the present invention, TiO 2 is used in the embodiment, but instead of this, SiO 2 is used.
Inorganic light-scattering material such as 2 , CaCO 3 , Al 2 O 3 , BaSO 4 , ZnO, and glass fine powder, or an organic light-scattering material, which is not dissolved or chemically changed in a liquid resin medium Can be selected. These may be used alone or in combination of two or more. The thermoplastic resin for including the light scattering material is not particularly limited as long as it is a transparent resin,
Although the materials exemplified as the material for the transparent resin substrate can be used, it is desirable to select a material having the same or similar thermal characteristics as the transparent resin substrate.
【００２７】本発明を実施する際の透明樹脂基板の形状
は、実施の形態では断面が略矩形のいわゆる平板を使用
したが、これに限定されるものではなく、断面が三角
形、台形、多角形、曲線、その他の形状の板状体につい
ても適用が可能である。The shape of the transparent resin substrate when carrying out the present invention is a so-called flat plate having a substantially rectangular cross section in the embodiments, but the shape is not limited to this, and the cross section is triangular, trapezoidal, or polygonal. It can also be applied to plate-shaped bodies having curved lines and other shapes.
【００２８】[0028]
【発明の効果】以上詳述した通り、本発明の面状光源装
置に用いる基板の製造方法では、面状光源装置内で発光
光線を散乱させるための散乱パターンを、従来の白色ま
たは乳白色インクで印刷するのではなく、光散乱物質を
含有したフィルムにエンボス加工により凹凸形状を付与
するものとした。したがって、光散乱パターン製造工程
において、低い生産性の原因となっていたインクを乾燥
させる工程を削除できる。これにより、高い生産性を得
ることになった。また、インクを使用しないことから、
溶剤による環境汚染への危惧もなくなる。As described in detail above, in the method of manufacturing a substrate used in the planar light source device of the present invention, a scattering pattern for scattering emitted light rays in the planar light source device is formed by a conventional white or milky white ink. Rather than printing, the film containing the light-scattering substance is embossed to give an uneven shape. Therefore, in the light-scattering pattern manufacturing process, the process of drying the ink, which causes low productivity, can be eliminated. As a result, high productivity was obtained. Also, since no ink is used,
There is no fear of environmental pollution caused by solvents.
【００２９】そして、透明樹脂基材上に、光散乱物質を
内包したフィルムを載置し、エンボス加工を行うことに
より、フィルムに光散乱パターンとしての凹凸形状を施
すだけでなく、透明樹脂基材側に突出した光散乱パター
ンに対応した凸部のみが、透明樹脂基材と溶着すること
により、透明樹脂基板を一体的に形成することができ
る。故に、フィルムに光散乱パターンを形成する工程
と、透明樹脂基材とフィルムを密着させる工程が、エン
ボス加工を行うことにより、１工程として行えるので生
産効率が良い。Then, a film containing a light-scattering substance is placed on the transparent resin substrate, and embossing is performed so that not only the film is provided with an uneven shape as a light-scattering pattern, but also a transparent resin substrate. Only the convex portion corresponding to the light scattering pattern protruding to the side is welded to the transparent resin base material, so that the transparent resin substrate can be integrally formed. Therefore, the step of forming the light-scattering pattern on the film and the step of bringing the film into close contact with the transparent resin substrate can be performed as one step by performing embossing, so that the production efficiency is good.
【００３０】また、図１〜図４で述べた第１の実施の形
態においては、本発明の製造方法により製造された透明
樹脂基板１の裏面に備わる光散乱パターンを形成したフ
ィルム３が装置裏面全体を覆い、フィルム３内に均一に
散在する光散乱物質４により光が散乱されるため、面状
光源装置裏面に備わる反射板６を削除することが可能で
ある。これにより、構成部材の削減を図ることができ、
生産効率が向上する。In the first embodiment described with reference to FIGS. 1 to 4, the film 3 having the light scattering pattern formed on the back surface of the transparent resin substrate 1 manufactured by the manufacturing method of the present invention is the back surface of the device. Since the light is scattered by the light-scattering substance 4 which covers the whole and is uniformly scattered in the film 3, it is possible to eliminate the reflection plate 6 provided on the back surface of the planar light source device. This makes it possible to reduce the number of components,
Production efficiency is improved.
【図１】第１の実施の形態により説明される本発明の製
造方法により製造された透明樹脂基板１を用いた面状光
源装置を裏面より見た斜視図である。FIG. 1 is a perspective view of a planar light source device using a transparent resin substrate 1 manufactured by a manufacturing method of the present invention described in a first embodiment, viewed from the back side.
【図２】図１の面状光源装置の構造を示す断面図であ
る。FIG. 2 is a cross-sectional view showing the structure of the planar light source device of FIG.
【図３】図１の面状光源装置に用いる透明樹脂基板１の
断面図である。3 is a sectional view of a transparent resin substrate 1 used in the planar light source device of FIG.
【図４】図３の透明樹脂基板１の製造過程を示す断面図
である。FIG. 4 is a cross-sectional view showing a manufacturing process of the transparent resin substrate 1 of FIG.
【図５】第２の実施の形態により説明される本発明の製
造方法により製造された透明樹脂基板２１を用いた面状
光源装置の構造を示す断面図である。FIG. 5 is a cross-sectional view showing the structure of a planar light source device using a transparent resin substrate 21 manufactured by the manufacturing method of the present invention described in the second embodiment.
【図６】図５の面状光源装置に用いる透明樹脂基板２１
の断面図である。6 is a transparent resin substrate 21 used in the planar light source device of FIG.
FIG.
【図７】図７の透明樹脂基板２１の製造過程を示す断面
図である。FIG. 7 is a cross-sectional view showing the manufacturing process of the transparent resin substrate 21 of FIG.
【図８】第３の実施の形態により説明される本発明の製
造方法により製造された透明樹脂基板３１を用いた面状
光源装置の構造を示す断面図である。FIG. 8 is a cross-sectional view showing the structure of a planar light source device using a transparent resin substrate 31 manufactured by the manufacturing method of the present invention described in the third embodiment.
【図９】図８の面状光源装置に用いる透明樹脂基板３１
の断面図である。9 is a transparent resin substrate 31 used in the planar light source device of FIG.
FIG.
【図１０】図９の透明樹脂基板３１の製造過程を示す断
面図である。10 is a cross-sectional view showing the manufacturing process of the transparent resin substrate 31 of FIG.
【図１１】第３の実施の形態により説明される透明樹脂
基板３１を製造するための部材である、剥離層３７を設
けたフィルム基材３３の断面図である。FIG. 11 is a cross-sectional view of a film base material 33 provided with a release layer 37, which is a member for manufacturing the transparent resin substrate 31 described in the third embodiment.
【図１２】従来の面状光源装置を裏面より見た斜視図で
ある。FIG. 12 is a perspective view of a conventional planar light source device as viewed from the back side.
【図１３】従来の面状光源装置の構造を示す断面図であ
る。FIG. 13 is a sectional view showing a structure of a conventional planar light source device.
【図１４】面状光源装置における光線の挙動を説明する
ための模式的な断面図である。FIG. 14 is a schematic cross-sectional view for explaining the behavior of light rays in the planar light source device.
１ 透明樹脂基板 ２ 透明樹脂基材 ３ フィルム ４ 光散乱物質 ２１ 透明樹脂基板 ２２ 透明樹脂基材 ２３ フィルム基材 ２４ 光散乱物質 ２５ 光散乱薄膜 ３１ 透明樹脂基板 ３２ 透明樹脂基材 ３３ フィルム基材 ３４ 光散乱物質 ３５ 光散乱薄膜 1 Transparent Resin Substrate 2 Transparent Resin Substrate 3 Film 4 Light Scattering Substance 21 Transparent Resin Substrate 22 Transparent Resin Substrate 23 Film Substrate 24 Light Scattering Substance 25 Light Scattering Thin Film 31 Transparent Resin Substrate 32 Transparent Resin Substrate 33 Film Substrate 34 Light scattering material 35 Light scattering thin film
Claims (2)
または坦持したフィルムを載置し、しかる後一側から他
側に向かって密度が増加するように配置される光散乱パ
ターンに対応する突起を配置した型を加熱、圧接後、冷
却することにより、フィルムの光散乱物質を含む熱可塑
性樹脂層のうち、光散乱パターンに対応した部分のみを
選択的に該透明樹脂基材に密着させて、透明樹脂基板を
構成することを特徴とする面状光源装置に用いる基板の
製造方法。1. A light-scattering pattern in which a film containing or carrying a light-scattering substance is placed on a transparent resin substrate, and then the density is increased from one side to the other side. Of the thermoplastic resin layer containing the light-scattering substance of the film by heating, press-contacting the mold having the projections corresponding thereto, and selectively only the part corresponding to the light-scattering pattern of the transparent resin substrate. A method for manufacturing a substrate used in a planar light source device, comprising: forming a transparent resin substrate in close contact with a substrate.
基材とし、しかもフィルム基材は光散乱物質を含有また
は坦持したものであり、前記透明樹脂基材上に、該フィ
ルムを載置し、しかる後前記光散乱パターンに対応する
突起を配置した型を加熱、圧接後、冷却することによ
り、フィルムの光散乱物質を含む熱可塑性樹脂層のう
ち、光散乱パターンに対応した密着部分のみを選択的に
該透明樹脂基材に密着させた後、該フィルム基材を剥離
させ、該密着部分のみを透明樹脂基材上に残すことによ
り前記透明樹脂基板を構成することを特徴とする請求項
１に記載の面状光源装置に用いる基板の製造方法。2. The film is a heat-resistant film base material, and the film base material contains or carries a light-scattering substance, and the film is placed on the transparent resin base material. After that, by heating the mold in which the projections corresponding to the light scattering pattern are arranged, after pressure contact, and cooling, only the adhesion portion corresponding to the light scattering pattern of the thermoplastic resin layer containing the light scattering substance of the film is cooled. The transparent resin substrate is formed by selectively adhering the transparent resin substrate to the transparent resin substrate, peeling the film substrate, and leaving only the adhered portion on the transparent resin substrate. 1. A method of manufacturing a substrate used in the planar light source device according to 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22965795A JP3673928B2 (en) | 1995-08-15 | 1995-08-15 | Manufacturing method of substrate used in planar light source device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22965795A JP3673928B2 (en) | 1995-08-15 | 1995-08-15 | Manufacturing method of substrate used in planar light source device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0955111A true JPH0955111A (en) | 1997-02-25 |
| JP3673928B2 JP3673928B2 (en) | 2005-07-20 |
Family
ID=16895647
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22965795A Expired - Fee Related JP3673928B2 (en) | 1995-08-15 | 1995-08-15 | Manufacturing method of substrate used in planar light source device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3673928B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011512630A (en) * | 2008-02-22 | 2011-04-21 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング | Optical device and manufacturing method |
| WO2014017400A1 (en) * | 2012-07-27 | 2014-01-30 | 阪本 順 | Light guide plate, light source device, light guide plate manufacturing device, and method for manufacturing light guide plate |
-
1995
- 1995-08-15 JP JP22965795A patent/JP3673928B2/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011512630A (en) * | 2008-02-22 | 2011-04-21 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング | Optical device and manufacturing method |
| WO2014017400A1 (en) * | 2012-07-27 | 2014-01-30 | 阪本 順 | Light guide plate, light source device, light guide plate manufacturing device, and method for manufacturing light guide plate |
| CN104508357A (en) * | 2012-07-27 | 2015-04-08 | 阪本顺 | Light guide plate, light source device, light guide plate manufacturing device, and method for manufacturing light guide plate |
| US9880340B2 (en) | 2012-07-27 | 2018-01-30 | Jun Sakamoto | Light guide plate, light source device, light guide plate manufacturing apparatus, and method for manufacturing light guide plate |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3673928B2 (en) | 2005-07-20 |
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