JPH0969683A - Method and apparatus for soldering metal parts - Google Patents

Abstract

(57) [Abstract] [PROBLEMS] Electromagnetic shield component soldering method that can be easily soldered even when other electronic components and the like are in close proximity, and can be soldered without warping the substrate while maintaining good commercial value. And getting the equipment. A soldering device (1) of the present invention has a pedestal (2) holding an electronic circuit board (P), a magnetic force line generation head (3) disposed above the pedestal (2), and the magnetic force line generation head (3) moved up and down. The electric motor 6 and the magnetic force line generation head 3
And an alternating current oscillating device 7 for supplying a current of a predetermined high frequency, and a high frequency current is passed through the magnetic force line generation head 3 to heat the electromagnetic shield component S to be soldered to the substrate P by high frequency induction. The method of soldering is adopted.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of soldering a metal component for mounting a magnetic metal component such as an electromagnetic shield component and a heat sink on an electronic circuit board by soldering, and an improvement of the apparatus.

[0002]

2. Description of the Related Art At present, soldering methods include (1) trowel type, (2) flow dip type, (3) reflow type, and (4) pulse heat type. An electronic circuit board (hereinafter simply referred to as "board") is a metal part such as an electromagnetic shield part and a heat sink (in the following description, an electromagnetic shield part is taken as an example of the metal part for description).
Also in the case of mounting by soldering, any one of the above methods is used.

[0003]

However, when the electromagnetic shield component is soldered to the substrate using these soldering methods, there are the following problems. That is, (1) trowel type When soldering with a hand or a robot using a trowel, a plurality of electromagnetic shield components to be soldered are arranged close to each other, or an electromagnetic shield to be soldered is used. If other parts are placed close to the shield parts, the soldering iron cannot be inserted between them and soldering is not possible. (2) Flow dip point soldering is used, so the electromagnetic shield In the case of parts, sufficient shielding effect cannot be obtained. (3) Reflow type heat may cause warpage of the board and stable soldering of electromagnetic shield parts cannot be expected. (4) Pulse heat type Thermal efficiency is not good. Therefore, it is not suitable for soldering electromagnetic shield components. Further, since the heating element is indirect, the heating element may turn red, and the electromagnetic shield component is burned and discolored, which lowers the commercial value.

Therefore, the present invention has an object to eliminate these problems, and can be easily soldered even when other electronic parts and the like are close to each other, and the board is not warped and is excellent. An object of the present invention is to obtain a soldering method for a metal component and a device therefor which can be soldered while maintaining good commercial value.

[0005]

Therefore, in the method for soldering a metal component of the present invention, a wiring circuit is formed in advance, and at least a key part of the wiring circuit is coated with the solder by mounting the metal component on the electronic circuit board. When soldering, a method of heating the metal component with heat generated by an eddy current, melting the solder by the heat of the heated metal component, and soldering the metal component to an electronic circuit board is adopted. , The above-mentioned subject was solved.

Further, a metal component soldering apparatus as one means for realizing the method for soldering a metal component is provided with a pedestal capable of holding an electronic circuit board in a predetermined positional relationship and arranged above the pedestal. The magnetic field line generating head, a driving device for moving the magnetic field line generating head up and down, and an alternating current oscillating device for supplying a current of a predetermined high frequency to the magnetic field line generating head solve the above problems.

Further, the magnetic field line generating head for soldering of the metal component as an example is composed of a block of a high magnetic permeability magnetic material having an outer shape along the outer shape of the metal component to be soldered. An induction coil is wound around the outer peripheral surface.

Therefore, according to the method and apparatus for soldering a metal component of the present invention, the metal component itself to be soldered by the high frequency magnetic flux from the magnetic field line generating head,
Alternatively, an eddy current is induced in the metal frame and heated by the induced eddy current, and the generated heat melts the solder of the board to which the metal component is to be soldered, and the metal component is well soldered to the board. can do.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, a soldering method for a metal component and an apparatus therefor according to the present invention will be described with reference to FIGS. FIG. 1 is a conceptual configuration diagram of a soldering apparatus for metal parts which is an embodiment of the present invention, and FIG. 2 shows a magnetic field line generation head which is one component of the soldering apparatus for metal parts shown in FIG. FIG. 3A is a side sectional view thereof, FIG. 3B is a bottom plan view thereof, and FIG. 3 shows a buffer and a thermocouple mounted on the end surface of the magnetic field line generating head shown in FIG. FIG. A is an enlarged side view of the same, and FIG. B is an enlarged plan view thereof. FIG. 4 shows various electromagnetic shield components to be soldered to an electronic circuit board, and FIG. A shows an electromagnetic shield component with a top plate. FIG. 5B is a side enlarged cross-sectional view of a window opening electromagnetic shield part, FIG. 5C is a side enlarged cross-sectional view of a frame-only electromagnetic shield part, and FIG. 5 is another embodiment of a magnetic field line generation head. Fig. A is a side sectional view of the same, and Fig. B is its bottom surface. A rear view, FIG. 6 is a side sectional view showing still another embodiment of the magnetic field lines generated head, and Figure 7
FIG. 3 is a perspective view of a metal frame mounted on the magnetic force line generation head according to the structure of the metal component to be soldered.

First, with reference to FIGS. 1 to 4, the structure and operation of a metal component soldering apparatus of the present invention (hereinafter simply abbreviated as “soldering apparatus”) will be described. The soldering device 1 is roughly divided into, for example, a pedestal 2 that holds a substrate P such as a double-sided mounting substrate, a magnetic force line generation head 3 disposed above the pedestal 2, and the magnetic force line generation head. Electric motor 6 which is a drive device for moving the 3 up and down
And an AC oscillating device 7 for supplying a current of a predetermined high frequency to the magnetic force line generating head 3.

On the upper surface of the pedestal 2, the height of the substrate P on which the electromagnetic shield component S is to be soldered is determined by a predetermined relationship between the electromagnetic shield component S to be soldered and the magnetic force line generating head 3. It is provided with a plurality of pins 201 that are short in position and a plurality of pins 202 that have a length that penetrates the substrate P that is positioned in the horizontal direction.

The magnetic field line generating head 3 basically has
For example, an induction coil 302 is formed on the outer peripheral surface of a block 301 made of a high magnetic permeability material such as ferrite. The outer shape of the block 301 is formed according to the outer structure of the electromagnetic shield component S to be soldered. For example, when the electromagnetic shield component Sa with a top plate shown in FIG. 4A is mounted on the board P and soldered, as shown in FIG.
The surface of the block 301 having a size corresponding to the top plate Sa1 and contacting the top plate Sa1 is formed into a square block 301 structure, and the induction coil 302 is wound around the block 301. The induction coil 302 is connected to the AC oscillator 7.
The AC oscillator 7 generates a high frequency current of, for example, several tens KHz. In the following description, the electromagnetic shield component S will be described by taking the electromagnetic shield component Sa with a top plate shown in FIG. 4A as the electromagnetic shield component S, but it will be simply referred to as “electromagnetic shield component Sa”.

Further, at least one suction port 3 is provided at the tip end of the block 301 of the magnetic force line generating head 3 on the receiving base 2 side.
03 is opened and the pipe 3 leading to this suction port 303
04 is led to the outside through the inside of the block 301. The other end of the pipe 304 is connected to a suction pump (not shown).

Further, as shown in FIGS. 1 and 3, for example, a buffer 4 made of a heat-resistant resin such as Teflon having a thickness of about 2 mm is provided on the tip end surface of the block 301 which comes into contact with the electromagnetic shield component Sa. Is fixed. One of the functions of the buffer 4 is to prevent the heat from the heated electromagnetic shield component Sa from heating the block 301 of the magnetic force line generation head 3 due to heat conduction (or heat dissipation), and another function. Is a constant pressure in order to correct the twist of the electromagnetic shield component Sa and the board P and to correct the dimensional variation, and to improve the heat conduction from the electromagnetic shield component Sa to the solder and the wiring of the board P as described later. It is applied to the electromagnetic shield component Sa, but at this time, it works so that uniform pressure is applied to the entire electromagnetic shield component Sa.

Further, the electromagnetic shield component Sa of the buffer 4
As shown in FIG. 3, a thermocouple 5 serving as a temperature sensor is fixed to the buffer 4 with an adhesive at a position where the thermocouple 5 is in contact with the output side of the thermocouple 5. It is connected to the controller 8 and outputs basic information for controlling to have a predetermined profile. A non-contact type temperature sensor can also be used as the temperature sensor.

The side of the block 301 opposite to the contact surface with the electromagnetic shield component Sa is formed to be larger than the main part of the magnetic field line generating head 3 so as to prevent heat generation in other parts. The electric motor 6 is connected to the back surface of the block 301 on the opposite side to move the magnetic force line generation head 3 up and down, and the magnetic force line generation head 3 applies a predetermined pressing force to the electromagnetic shield component Sa. This pressing force is controlled by a pressure sensor 9 mounted between the back surface of the block 301 and the electric motor 6. The output side of the pressure sensor 9 is connected to the controller 8. The electric motor 6 is driven by a drive device 10,
The drive device 10 is controlled by the output signal of the controller 8.

Next, a soldering method for soldering the electromagnetic shield component Sa to the substrate P using the soldering apparatus 1 will be described. First, a cream solder is supplied by a dispenser or the like to a predetermined portion of the wiring of the substrate P on which wiring is provided and electronic components forming an electronic circuit are placed and soldered,
Apply. The pedestal 2 for the substrate P prepared in advance in this way
The pin 202 is placed as a guide on the pin 201 serving as the reference surface of.

Next, the magnetic force line generating head 3 at the upper standby position is rotated left and right by the power of the electric motor 6 and the driving device 10, lowered and raised, and is made to stand by at a predetermined position of a stage (not shown) in advance. The electromagnetic shield component Sa to be soldered is suctioned through the suction port 303 and the pipe 304 at the tip of the block 301 by operating the suction pump of the magnetic force line generation head 3 and held by the pedestal. The substrate P is brought above a predetermined position on the surface of the substrate P, and the electric motor 6 is operated to lower it to place it on the predetermined position. Then, the electromagnetic shield component Sa placed by further using the power of the electric motor 6 is pressed against the substrate P with a predetermined pressing force for a predetermined time. This pressing force is detected by the pressure sensor 9, an output signal thereof is supplied to the controller 8, and a control signal is sent from the controller 8 to the drive device 10 based on this output signal, and during the predetermined time, Electromagnetic shield component Sa with a predetermined pressing force
Is pressed against the substrate P.

Placement of the electromagnetic shield component Sa on the substrate P,
Around the pressing, a high-frequency current is passed from the AC oscillator 7 to the induction coil 302. Then, a high-frequency magnetic flux is generated from the induction coil 302, and this high-frequency magnetic flux induces and generates an eddy current in the electromagnetic shield component Sa, and the electromagnetic shield component Sa itself serves as a heat generating element, so that the electromagnetic shield component Sa on the substrate P is removed. The wiring and cream solder at the soldering location are heated and melted. Therefore, the electromagnetic shield component Sa can be soldered to the predetermined place.

When the predetermined wiring and the cream solder reach a predetermined temperature, the thermocouple 5 is operated, the output signal thereof is supplied to the controller 8, and the control signal of the controller 8 causes the AC oscillator 7 to operate. The operation is stopped, and the supply of the high frequency current to the induction coil 302 is stopped. At the same time, a control signal is supplied from the controller 8 to the drive unit 10 to raise the magnetic force line generation head 3 to the upper position and stop it. Alternatively, it is rotated to the stage to attract the next electromagnetic shield component Sa. After that, by repeating this soldering operation, the electromagnetic shield components Sa can be soldered to the substrates P that are successively supplied.

In the above description, the magnetic shield component Sa is attracted by the magnetic force line generating head 3 and placed at a predetermined position on the substrate P. However, in the previous step, the substrate P coated with cream solder has been described. The electromagnetic shield component Sa may be placed in advance, and the magnetic field line generation head 3 may be provided with only the function of supplying a high frequency magnetic flux to the electromagnetic shield component Sa and the function of applying a pressing force.

By the way, in practice, the electromagnetic shield component S
When soldering to the substrate P, the wiring pattern at the corresponding portion is large and small because the place to be soldered is the ground, and there is also a difference in the thermal capacity of other electronic components soldered in the periphery. Yes, uniform heating can result in significantly different soldering times, as the case may be. Therefore, as shown in FIG. 5, in a place with a large heat capacity,
An L-shaped groove 305 is formed in the vertical direction, and the partial induction coil 30 is formed on the outer peripheral surface of the groove 305 and a part of the block 301.
By winding 2A and winding the induction coil 302 on the partial induction coil 302A, it is possible to partially increase the generation of eddy currents, and thus increase the heat generation amount of that portion.

If the difference in heat capacities is not too large,
In order to generate an eddy current also in the side plate Sa2 of the electromagnetic shield component Sa, the contact area of the electromagnetic shield component of the block 301 of the magnetic force line generation head 3 is smaller than that of the top plate Sa1 of the electromagnetic shield component Sa by, for example, 2 to each side. It can be adjusted by widening by 3 mm.

In the above description, the electromagnetic shield component S is mainly the electromagnetic shield component Sa with a top plate shown in FIG. 4A.
However, when soldering the window opening electromagnetic shield component Sb as shown in FIG. 7B, even if the magnetic field line generating head 3 is used, the width of the peripheral frame Sb2 forming the window Sb1 is reduced. By adjusting W, it is possible to control the amount of heat generated in the window opening electromagnetic shield component Sb, wiring, cream solder, etc. to a required amount of heat generation.

Further, as shown in FIG. 6C, the side plate Sc1
If only the frame constituted by only the frame is the electromagnetic shield component Sc, in the soldering method described so far, the electromagnetic shield component Sc only in the frame hardly generates heat. Therefore, when soldering the electromagnetic shield component Sc having such a structure, as shown in FIG. 6, only the frame of the block 301 of the magnetic field line generating head 3 is slightly smaller than the inner peripheral dimension of the electromagnetic shield component Sc. Then, a conductive metal frame 20 is attached to the tip portion, and only the frame is fitted inside the electromagnetic shield component Sc, and a high-frequency current is passed. If such a method is adopted, the metal frame 20 is heated, the side plate Sc1 in contact with the heated metal frame 20 is heated by heat conduction, and only the frame is soldered with the electromagnetic shield component Sc to the wiring of the substrate P. can do.

The metal frame 20 can control the amount of heat generated by partially narrowing or widening the width of the frame 21 part like the metal frame 20A shown in FIG. The side plate of the metal frame 20A may be omitted, but the side plate has a larger heat generation amount and is more efficient for soldering.

[0027]

As described above, according to the method for soldering a metal component and the apparatus therefor of the present invention, since the electromagnetic shield component itself which is heated by high frequency induction heating is used as a heating element, another electronic component is used. On a board where is already mounted, even in a narrow space where a soldering iron etc. does not enter,
It can be easily soldered. Further, the heat efficiency is better than the method of indirectly heating by pressing a heating element such as a soldering iron against the electromagnetic shield component.

In addition, in the indirect heating method, for example, the heating element may turn red like 550 ° C.,
The electromagnetic shield component may be burned and discolored to lower the commercial value, but according to the present invention, the heating temperature can be controlled, the discoloration does not occur, and the substrate is not warped. Furthermore, according to the soldering device of the present invention, even if the magnetic field line generating head with the metal frame attached is used to indirectly heat the buffer, the buffer attached to the tip of the block does not interfere with the electromagnetic shield component. Since the contact is improved and the heat conduction is efficiently performed, the electromagnetic shield component is efficiently heated.

[Brief description of drawings]

FIG. 1 is a conceptual configuration diagram of a soldering apparatus for metal parts that is an embodiment of the present invention.

2 shows a magnetic force line generation head which is one component of the soldering apparatus for metal parts shown in FIG. 1, FIG. 2A being a side sectional view thereof, and FIG.

3 shows a buffer and a thermocouple mounted on the end surface of the magnetic force line generation head shown in FIG. 2, FIG. 3A being an enlarged side view thereof, and FIG. 3B being an enlarged plan view thereof.

4A and 4B show various electromagnetic shield components to be soldered to an electronic circuit board. FIG. 4A is an enlarged cross-sectional side view of the electromagnetic shield component with the top plate, and FIG. 3B is an enlarged side face of the window opening electromagnetic shield component. A sectional view and the same figure C are enlarged side sectional views of an electromagnetic shield component having only a frame.

5A and 5B show another embodiment of the magnetic force line generation head, wherein FIG. 5A is a side sectional view thereof, and FIG. 5B is a bottom plan view thereof.

FIG. 6 is a side sectional view showing still another embodiment of the magnetic force line generation head.

FIG. 7 is a perspective view of a metal frame mounted on the magnetic force line generation head according to the structure of the metal component to be soldered.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Metal part soldering apparatus which is an embodiment of the present invention 2 Cradle 201 Pin 202 Pin 3 Magnetic field line generating head 301 Block 302 Induction coil 302A Partial induction coil 303 Suction port 304 Tube 305 Groove 4 Buffer 5 Thermocouple 6 Electric motor 7 AC oscillator 8 Controller 9 Pressure sensor 10 Drive device 20 Metal frame 20A Metal frame 21 Frame S Electromagnetic shield component P Electronic circuit board (board)

Claims (10)

[Claims] 1. When a metal component is soldered to an electronic circuit board in which a wiring circuit is formed in advance and at least a portion of the wiring circuit is covered with solder, the metal component is heated by heat generated by an eddy current. Then, the metal component is soldered to the electronic circuit board by melting the solder by the heat of the heated metal component, and the metal component soldering method. 2. A pedestal capable of holding an electronic circuit board in a predetermined positional relationship, a magnetic force line generation head disposed above the pedestal, a drive device for vertically moving the magnetic force line generation head, and the magnetic force line generation. A soldering device for metal parts, comprising: an alternating current oscillating device for supplying a current of a predetermined high frequency to a head. 3. A block of high-permeability magnetic material having an outer shape according to the outer shape of a metal part to be soldered, wherein an induction coil is wound around the outer peripheral surface of the block. Magnetic field line generation head for soldering metal parts. 4. A tip portion of the block for applying a high frequency is divided into a plurality of pieces, and an induction coil is wound around the outer peripheral surface of at least one of the divided blocks,
The magnetic field line generating head for soldering metal parts according to claim 3, further comprising an induction coil wound around the entire outer peripheral surface of the block. 5. When the drive unit is operated to lower the magnetic force line generation head to the lowest position, the magnetic line generating head tries to be soldered to the electronic circuit board at the lowest position for a predetermined time with a predetermined pressing force. The soldering device for a metal component according to claim 2, further comprising a pressing device that presses the metal component. 6. The soldering device for a metal component according to claim 3, wherein the pressing device includes a pressure sensor. 7. The soldering apparatus for a metal component according to claim 2, wherein a temperature sensor is attached to a tip end portion of the magnetic force line generation head on the cradle side. 8. The heat-resistant resin is coated on a portion of the tip of the magnetic force line generating head that comes into contact with a metal component to be soldered.
The soldering device for metal parts according to. 9. At least one suction port is formed in the tip of the magnetic force line generation head on the cradle side, and a pipe communicating with the suction port is formed in a block of the magnetic force line generation head. The soldering device for metal parts according to claim 2. 10. The soldering of a metal component according to claim 2, wherein a metal frame for indirectly heating the metal component is mounted according to the structure of the metal component to be soldered. apparatus.