JPH0975810A - Paste applicator - Google Patents

Abstract

(57) Abstract: A paste film for an electrode having a uniform and desired shape is efficiently provided in the inner hole of an electronic component. A paste coating device having a holding means capable of holding a component to be coated with paste and rotating and vertically moving the same, and a nozzle for discharging paste having a means capable of vertical movement and forward / backward movement. A soft member is attached to cover the tip of the nozzle, and a paste flow hole is provided in the nozzle and the soft member.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a paste applicator for evenly applying a conductive paste for an electrode to the inner surface of an electronic component having a cylindrical inner hole surface.

Conventionally, a coating apparatus as shown in FIG. 1 has been used to coat a conductive paste for an electrode on an inner hole provided inside an electronic component. In such a paste application device, the electronic component 21 is held by the holding unit 28 that can rotate and move up and down. On the other hand, the dispenser body 27 has a nozzle 24 having a discharge hole at the tip 22.
It is possible to freely move forward and backward and to move up and down. When applying the paste, first, the nozzle 2
The tip 22 of the No. 4 is located near the deepest part of the inner hole 23 of the electronic component 21. Next, under a set condition, the conductive paste pressure-feeding unit 30 discharges a fixed amount of the conductive paste from the tip 22 of the nozzle 24. Next, the nozzle 24 is pulled out from the inner hole 23 of the electronic component 21, the nozzle 24 is removed from the dispenser body 27, and the swab-shaped pad 20 shown in FIG. 2 is attached to the dispenser body 27 instead.

Next, as shown in FIG. 2, the mounted swab-shaped pad 20 is again inserted into the inner hole 23 of the electronic component 21 by the operation of the dispenser body 27. On the other hand, the electronic component 21 is rotated in the axial direction and moved up and down while being held by the holding portion 28, the pad 20 is pressed against the inner hole surface 23 thereof, and the electrode paste previously ejected is applied to the inner wall. Is widely applied to form a paste film. Then, the dispenser moving part 29 is gradually retracted, and the electronic component 21
The paste is applied to the entire inner hole surface of the.

However, such a conventional method is not only poor in working efficiency, but also cannot form a uniform conductive paste in the inner hole of the component, resulting in unevenness. Therefore, by repeating the application, the homogeneity of the electrode after firing is ensured. Further, with such a coating method, the electrode film cannot be provided only on a part of the inner hole of the component.

[0005]

SUMMARY OF THE INVENTION As described above, according to the conventional technique, it is impossible to uniformly and efficiently provide the conductive paste film having a desired thickness and shape in the inner hole of the electronic component. The present invention eliminates the drawbacks of such a conventional device, and can form a uniform electrode paste film on the inner hole surface of a cylindrical electronic component, which greatly improves the workability of electrode film formation. Be improved.

The present invention is a holding means capable of holding a component to be coated with paste and rotating and moving it up and down,
In addition, a soft nozzle is provided which has a nozzle for discharging paste having a means capable of moving up and down and moving forward and backward, and a discharge hole for discharging paste is provided near the tip of the nozzle, and an outflow hole through which the paste flows out. Provided is a paste coating device which is covered with a member. The device of the present invention is characterized in that a soft member having a paste outflow hole is attached to the tip of the nozzle.

[0007]

DISCLOSURE OF THE INVENTION The present invention is a cylindrical pad which seals the tip of the nozzle of a dispenser capable of discharging a certain amount of conductive paste, and which is made of a soft material such as synthetic resin. And one or more paste discharge holes are provided in one direction of the nozzle portion covered with the pad, and the paste outflow hole is also provided in the pad. Then, while discharging a certain amount of the conductive paste from the discharge hole and the outflow hole, by the front and rear, vertical movement of the dispenser body and axial rotation and vertical movement of the electronic component
A uniform paste film is formed on the inner surface of an electronic component to obtain an excellent electrode film. In addition, a partial electrode film can be formed on the inner hole surface of the electronic component by stopping the rotation of the electronic component and controlling the forward / backward movement of the dispenser body.

[0008]

BEST MODE FOR CARRYING OUT THE INVENTION Next, the present invention will be described in more detail by way of specific examples with reference to the drawings. FIG. 1 is a schematic side view of the device of the present invention, and FIG. 3 is an enlarged view of a nozzle portion of the device of the present invention. In FIG. 1, the electronic component 21 has a cylindrical inner hole 23 inside and is held by a holding portion 28. The holding portion 28 holds the electronic component 21 without fail, and can rotate and vertically move the electronic component 21 by known means. On the other hand, a nozzle 24 is attached to the dispenser body 27. The nozzle 24 can be moved forward / backward and vertically by the operation of the dispenser moving unit 29. As shown in detail in FIG. 3, the tip end 22 of the nozzle 24 is sealed, and a plurality of discharge holes 26 are provided on the side surface of the tip portion. This discharge hole has a diameter of 0.3-0.8 mm
It is preferable to provide at least one, usually 2-3. A cylindrical pad 25 made of a flexible material is attached to the tip of the nozzle 24. Such a cylindrical pad is preferably made of a material such as silicon rubber, fluororubber, butyl rubber or the like. The pad 25 has on the side surface thereof a paste outflow hole 32 corresponding to the ejection hole 26 of the nozzle 24. Therefore, the pad mounting portion at the tip of the nozzle 24 is provided with one or a plurality of conductive paste flow holes that penetrate the nozzle and the pad in one direction. In addition, these discharge holes and outflow holes may coincide with each other and may penetrate therethrough, or may be displaced in position or different in number.

Next, a method of applying a paste using the apparatus of the present invention will be described. The cylindrical electronic component 21 is held by the holding portion 28, while the nozzle 24 is positioned near the tip of the inner hole 23 of the electronic component 21. Then, a certain amount of the conductive paste is discharged through the discharge holes 26 and the outflow holes 32 under the conditions set by the paste pressure feeding unit 30.
Then, by rotating the electronic component 21 in the axial direction and moving it up and down, the cylindrical pad 25 is formed on the inner hole surface.
Are contacted with each other to apply a paste which is a raw material of the electrode film.
Then, the dispenser moving part 29 is operated to gradually retract the nozzle 24, and the paste coating film for the electrode is formed on the entire inner surface of the electronic component 21. FIG. 4 is a half sectional view of the electronic component 21 on which the paste coating film 31 is formed in this manner. Any conventionally known paste may be used.

FIG. 5 is a half sectional view showing a specific example of another electronic component in which the coating film 31 for the electrode is partially applied to the inner hole 23 of the electronic component 21, and the apparatus of FIG. Apply using. That is, the electronic component 21 is attached to the holder 28, and the nozzle 2 attached to the dispenser body 27 is attached.
A resin-made cylindrical pad 25 made of, for example, a fluorine-based resin is attached to the tip portion of 4. Initially, the nozzle 24 is located near the tip of the inner hole 23 of the electronic component 21, and a certain amount of the conductive paste is discharged from the discharge hole 26 and the outflow hole 32 according to the conditions set by the paste pumping unit 30. Next, the holding part 28 of the electronic component rotates the electronic component in the axial direction and moves up and down, the pad 25 comes into contact with the inner hole surface of the electronic component 21, and the coating film 31 for the electrode is formed. Further, after a certain period of time, the rotation of the holding unit 28 is stopped, the dispenser moving unit 29 is operated, and the nozzle 24 is gradually retracted, so that a partial paste coating film 31 shown in FIG. 5 is formed.

According to the paste coating apparatus of the present invention, a fixed amount of the conductive paste is discharged from the paste discharge hole at the tip of the nozzle, and the flat portion of the pad on which the nozzle is mounted becomes a roller, so that the electronic component A uniform paste coating film is formed between the pore surface and the surface. In addition, by setting the conditions of rotation of the electronic parts, vertical movement part, front and rear of the dispenser body, and vertical movement part, it is possible to easily form the electrode film on the entire inner surface of the inner hole or only the necessary part. Is greatly improved.

[0012]

According to the apparatus of the present invention, it is possible to efficiently provide a uniform electrode paste film having a desired shape in the inner hole of an electronic component. In addition, the electrode paste is not wasted.

[Brief description of drawings]

FIG. 1 is a schematic side view showing a specific example of a coating apparatus of the present invention.

FIG. 2 is a schematic view showing a conventional paste application method.

FIG. 3 is a sectional view showing a nozzle portion of the device of the present invention.

FIG. 4 is a half cross-sectional view of an electronic component coated with paste by the device of the present invention.

FIG. 5 is a half cross-sectional view of an electronic component in which a paste film is formed in a part of an inner hole by the device of the present invention.

[Explanation of symbols]

 20 Cotton swab pad 21 Electronic component 22 Nozzle tip 23 Inner hole 24 Nozzle 25 Cylindrical pad 26 Discharge hole 27 Dispenser body 28 Holding part 29 Dispenser moving part 30 Paste pressure feeding part 31 Coating film 32 Outflow hole

Claims (3)

[Claims] 1. A holding means capable of holding a component to be coated with paste and rotating and moving it up and down, and a paste discharging nozzle having a means capable of moving up and down and moving forward and backward, A paste applicator in which a discharge hole for discharging the paste is provided near the tip of the nozzle and is covered with a soft member having an outflow hole through which the paste flows out. 2. The paste coating apparatus according to claim 1, wherein a discharge hole is provided on the side surface of the tip of the nozzle. 3. The paste applying apparatus according to claim 1, wherein the soft member is silicone rubber, fluororubber or butyl rubber.