JPH097817A - Electronic part and its manufacturing method - Google Patents

Abstract

PURPOSE: To obtain the title electronic part easy to manufacture in high degree of freedom of designing electrode pattern. CONSTITUTION: A flexible sheet 1 provided on the surface of an inner electrode 2 is wound up to form a rectangular inductor chip 5. The inner electrode 2 is arranged between flexible film 1 to be spiral structured. The edge part of the inner electrode 2 is exposed in the surface of the chip 5 while one end of the inner electrode 2 is electrically connected to one outer electrode 11 provided on the right hand end of the chip 5. On the other hand, the other end of the inner electrode 2 is electrically connected to the other electrode 10 provided on the left hand end of the chip 5 through the intermediary of a leading out electrode 8 provided on an insulating film 7.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to electronic parts such as inductors, capacitors and resistors, and a method for manufacturing the same.

[0002]

2. Description of the Related Art Conventional electronic components are those in which a plurality of insulating sheets having internal electrodes provided on the surface are stacked and integrated, or an electrode is provided on the surface of an insulating substrate.

[0003]

In the former of the conventional techniques described above, there is a problem in that it is necessary to manufacture the insulating sheets with high precision in order to prevent the interlayer displacement of the insulating sheets, and there are many complicated operations. Had. Further, in the latter, there is a problem that the space in which the electrodes can be formed is limited and the degree of freedom in designing the electrode pattern is low.

Therefore, an object of the present invention is to make it easy to manufacture,
Another object is to provide an electronic component having a high degree of freedom in designing an electrode pattern.

[0005]

To achieve the above object, an electronic component according to a first aspect of the present invention comprises: (a) an insulator formed by winding an insulating flexible film in a spiral shape; And an internal electrode spirally arranged between the wound flexible films. Here, as the material of the internal electrodes, for example, a conductor is used when the electronic component is an inductor or a capacitor, and a resistor is used when the electronic component is a resistor.

An electronic component according to a second aspect of the invention is further characterized by further including an external electrode electrically connected to the internal electrode. A method of manufacturing an electronic component according to claim 3,
(C) a step of providing an internal electrode on an insulating flexible sheet, (d) a step of winding the flexible sheet having the internal electrode formed thereon to form a base material, and (e) cutting of a spiral pattern of the internal electrode. A step of cutting the base material so as to be exposed on the surface and cutting out a chip of a predetermined size.

Further, the method of manufacturing an electronic component according to a fourth aspect is characterized by further including a step of forming an external electrode electrically connected to the internal electrode exposed on the cut surface on a chip surface.

[0008]

In the electronic component according to the first aspect, the design of the electrode pattern can be easily changed by changing the number of windings and the width of the internal electrodes arranged between the flexible films. According to the method for manufacturing an electronic component of the second aspect, an electronic component having a structure in which the internal electrodes are spirally arranged between the spirally wound flexible films is manufactured with high productivity.

[0009]

Embodiments of an electronic component and a method of manufacturing the same according to the present invention will be described below with reference to the accompanying drawings.

[First Embodiment, FIGS. 1 to 4] In the first embodiment, the case of an inductor will be described. As shown in FIG. 1, a rectangular insulating flexible sheet 1 is prepared.
The flexible sheet 1 is made of a magnetic material such as ferrite. A on the entire upper surface of the flexible sheet 1
The internal electrode 2 is formed by a means such as printing or vapor deposition using a conductive material such as g, Pd, Ag-Pd. The material of the internal electrode 2 may be a high temperature superconductor made of oxide powder ceramics.

Next, as shown in FIG. 2, the flexible sheet 1 is wound in the longitudinal direction to form a long base material 3 having a rectangular cross section.
To form Next, when the flexible sheet 1 is an unfired green sheet, it is fired and hardened, and when the flexible sheet 1 is a fired sheet, it is hardened by means such as self-bonding or an adhesive. After that, the base material 3 is cut along the alternate long and short dash line 4, and the chips 5 of a predetermined size are cut out from the base material 3. The chip 5 cut out has the flexible film 1 wound in a spiral shape, and the internal electrode 2 is arranged between the wound flexible films 1. That is, the internal electrode 2 has a spiral structure,
As a result, inductance can be generated. As shown in FIG. 3, on the front and back surfaces that are the cut surfaces of the chip 5,
The edges of the internal electrodes 2 are exposed to form a spiral pattern. One end 2a of the internal electrode 2 is exposed on the right end surface of the chip 5, and the other end 2b is exposed.
Is exposed at the center of the chip 5.

Next, after providing the insulating film 7 on a predetermined portion of the surface of the chip 5, the extraction electrode 8 is formed by means of printing or the like so as to cross the internal electrode 2 via the insulating film 7. One end of the extraction electrode 8 is electrically connected to the end 2b of the internal electrode 2, and the other end of the extraction electrode 8 is exposed on the left end surface of the chip 5. Next, as shown in FIG. 4, the external electrodes 10 and 11 are sputtered on both ends of the chip 5,
It is formed by means such as vapor deposition and printing. The external electrode 10 is electrically connected to the end of the extraction electrode 8, and the external electrode 11 is electrically connected to the end 2 a of the internal electrode 2. If necessary, the entire chip 5 is covered with an insulating protective film, leaving the external electrodes 10 and 11.

In the inductor thus obtained with high productivity, the internal electrode 2 can be formed by changing the number of windings of the base material 3.
It is possible to easily change the strength of the inductance by changing the number of turns of. Alternatively, it is possible to change the conductor width of the internal electrode 2 by changing the cutting pitch dimension when cutting the chip 5 from the base material 3 and easily change the magnitude of the inductance.

[Second Embodiment, FIGS. 5 to 7] In the second embodiment, a case of a capacitor will be described. As shown in FIG. 5, an internal electrode sheet 24 made of a rectangular conductive material is prepared, and a dielectric film 23 is formed on the lower surface of the internal electrode sheet 24. The dielectric film 23 is, for example, a mixture of a dielectric powder such as barium titanate and a resin and has flexibility. Next, the internal electrode 22 is formed on the lower surface of the dielectric film 23 by printing or the like, leaving the left side edge portion. Further, the insulator film 21 is formed on the lower surface of the internal electrode 22. This insulator film 21 also has flexibility.

Next, as shown in FIG. 6, the laminated sheet having the above-described structure is wound in the longitudinal direction to form a long base material 25 having a quadrangular cross section and hardened. Thereafter, the base material 25 is cut along the alternate long and short dash line 26, and a chip 27 of a predetermined size is cut out from the base material 25. The chip 27 cut out has the dielectric film 23 and the insulating film 21 spirally wound. The internal electrodes 22 and 24 face each other with the dielectric film 23 in between and have a spiral structure, whereby a capacitance can be generated. As shown in FIG. 7, the internal electrodes 22 and 24 are formed on the front and back surfaces, which are cut surfaces of the chip 27, respectively.
The edges of the are exposed and form a spiral pattern. Then, one end 22a of the internal electrodes 22, 24,
24a is exposed on the outer peripheral surface of the chip 27.

Next, the end portions 22a of the internal electrodes 22, 24,
External electrodes 31 and 32 are formed on 24a by sputtering, vapor deposition, or the like. If necessary, the entire chip 27 is covered with an insulating protective film. In the capacitor thus obtained with high productivity, the internal electrodes 22, 24 are changed by changing the number of windings of the base material 25 or changing the cutting pitch dimension when cutting the chip 27 from the base material 25.
Since the facing area of the capacitor can be easily changed, the capacitance value of the capacitor can be easily changed.

[Third Embodiment, FIG. 8] In the inductor of the third embodiment, as shown in FIG. 8, a cylindrical magnetic core 45 made of a magnetic material such as ferrite and an internal electrode 43 are provided on the surface. The flexible sheet 42 made of an insulating material is provided. That is, the flexible sheet 42 is wound around the outer circumference of the cylindrical magnetic core 45 to be solidified, and the chip 41 having a circular cross section is formed.
Are formed. The internal electrode 43 has a spiral structure, which can generate an inductance. Then, an external electrode is provided on a predetermined portion of the chip 41 to obtain a product. The inductor having the above structure has the same effects as the inductor of the first embodiment.

[Fourth Embodiment, FIGS. 9 and 10] As shown in FIG. 9, the inductor of the fourth embodiment uses a flexible sheet 51 having an insulator portion 51a on the left side and a magnetic body portion 51b on the right side. It was done. However, the left and right sides are not particularly limited in material, and a plurality of materials may be wound in the seat. For example, those having different magnetic characteristics may be combined, or other materials may be used.

Internal electrodes 52 are formed on the entire upper surface of the flexible sheet 51. However, the internal electrodes do not necessarily have to be formed on the entire surface. It may be divided into left and right or divided into a plurality. In this case, it goes without saying that each of the divided internal electrodes is electrically connected to the external electrode via the extraction electrode.

After the flexible sheet 51 is wound in the longitudinal direction and solidified to form a long base material having a rectangular cross section,
The chip 55 shown in FIG. 10 is cut out by cutting at a predetermined cutting pitch dimension. The cut-out chip 55 has a magnetic body portion 51b arranged in the center and an insulator portion 51a arranged on the outer periphery thereof. The inductor having the above structure has the same effects as the inductor of the third embodiment.

[Other Embodiments] The electronic component and the method of manufacturing the same according to the present invention are not limited to the above-mentioned embodiments, but can be variously modified within the scope of the invention.
The electronic component may be a resistor or the like in addition to the inductor and the capacitor, or may be a composite component obtained by combining these. In the case of resistance, a resistor is used as the material of the internal electrodes.

Further, as shown in FIG. 11, as the flexible sheet, a plurality of types of sheets such as a magnetic sheet 56, an insulating sheet 57 and a high dielectric sheet 58 and an internal electrode 59 are used.
A chip may be formed by using a laminate of the above and winding and hardening it. Alternatively, a composite part may be manufactured by cutting out a product to which an inductor or a capacitor is joined in advance. For example, as shown in FIG. 12, four inductors 62, 63, 6 are arranged around the inductor 61.
A chip 60 in which 4, 65 are arranged and they are solidified with a bonding material 66 may be used. In addition, as shown in FIG. 13, six triangular inductors 71, 72, 73, 74, 7
A chip 70 may be formed by combining 5, 76 and arranging them in a circular shape and hardening them with a binder. Furthermore, FIG.
4, rectangular inductors 81 of the same size,
It may be a chip 80 in which 82 and 83 are stacked and integrated. In addition, a capacitor and a resistor may be stacked and integrated.

[0023]

As is apparent from the above description, according to the present invention, by adopting the structure in which the internal electrodes are spirally arranged between the spirally wound flexible films, The number of windings and the width can be easily changed, and an electronic component having a high degree of design freedom can be obtained. Also, individual electronic components can be combined to achieve high-density composite.

Further, after a flexible sheet having internal electrodes on the surface is wound to form a long base material, the base material is formed at a predetermined pitch so that the spiral pattern of the internal electrodes is exposed on the cut surface. By cutting, an electronic component having a structure in which the internal electrodes are disposed between the spirally wound flexible films can be manufactured with high productivity.

[Brief description of drawings]

FIG. 1 is a first electronic component and a manufacturing method thereof according to the present invention.
The perspective view showing an example.

FIG. 2 is a perspective view showing a manufacturing procedure following FIG. 1;

FIG. 3 is a perspective view showing a manufacturing procedure following FIG. 2;

FIG. 4 is a perspective view showing the external appearance of the electronic component of the first embodiment.

FIG. 5 is a second electronic component and a manufacturing method thereof according to the present invention.
The perspective view showing an example.

FIG. 6 is a perspective view showing a manufacturing procedure following that of FIG. 5;

FIG. 7 is a perspective view showing the outer appearance of an electronic component according to a second embodiment.

FIG. 8 is a perspective view showing a third embodiment of the electronic component according to the present invention.

FIG. 9 is a perspective view showing a flexible sheet used in a fourth embodiment of the electronic component according to the present invention.

FIG. 10 is a perspective view showing a fourth embodiment of the electronic component according to the present invention.

FIG. 11 is a perspective view showing a flexible sheet used in another embodiment.

FIG. 12 is a plan view showing another embodiment.

FIG. 13 is a plan view showing still another embodiment.

FIG. 14 is a perspective view showing still another embodiment.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Flexible sheet 2 ... Internal electrode 3 ... Base material 5 ... Chip 21 ... Insulator film 22 ... Internal electrode 23 ... Dielectric film 24 ... Internal electrode sheet 25 ... Base material 27, 41 ... Chip 42, 51 ... Flexible sheet 43 , 52 ... Internal electrodes 55, 60 ... Chips 61-65 ... Inductors 70 ... Chips 71-76 ... Inductors 80 ... Chips 81-83 ... Inductors

Claims (4)

[Claims] 1. An insulator formed by spirally winding an insulative flexible film, and an internal electrode spirally arranged between the wound flexible films. Electronic components to do. 2. The electronic component according to claim 1, further comprising an external electrode electrically connected to the internal electrode. 3. A step of forming an internal electrode on an insulating flexible sheet, a step of winding a flexible sheet having the internal electrode formed thereon to form a base material, and a spiral pattern of the internal electrode exposed on a cut surface. And a step of cutting the base material into chips of a predetermined size as described above. 4. The method of manufacturing an electronic component according to claim 3, further comprising a step of forming an external electrode electrically connected to the internal electrode exposed on the cut surface on a chip surface.