JPH097901A - Solid electrolytic capacitor and its manufacturing method - Google Patents
Solid electrolytic capacitor and its manufacturing methodInfo
- Publication number
- JPH097901A JPH097901A JP15028595A JP15028595A JPH097901A JP H097901 A JPH097901 A JP H097901A JP 15028595 A JP15028595 A JP 15028595A JP 15028595 A JP15028595 A JP 15028595A JP H097901 A JPH097901 A JP H097901A
- Authority
- JP
- Japan
- Prior art keywords
- capacitor element
- sealing member
- case
- lead terminal
- capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003990 capacitor Substances 0.000 title claims abstract description 69
- 239000007787 solid Substances 0.000 title claims description 20
- 238000004519 manufacturing process Methods 0.000 title description 2
- 238000007789 sealing Methods 0.000 claims abstract description 40
- 239000003822 epoxy resin Substances 0.000 claims abstract description 18
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 18
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical group CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 claims description 21
- 150000003839 salts Chemical class 0.000 claims description 21
- 239000003792 electrolyte Substances 0.000 claims description 8
- 239000002001 electrolyte material Substances 0.000 claims description 6
- 238000005452 bending Methods 0.000 claims description 4
- 239000007784 solid electrolyte Substances 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 claims 2
- 238000000034 method Methods 0.000 abstract description 4
- 239000004033 plastic Substances 0.000 abstract description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 13
- 229910052782 aluminium Inorganic materials 0.000 description 13
- 239000011888 foil Substances 0.000 description 9
- 230000015572 biosynthetic process Effects 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 230000007547 defect Effects 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000005470 impregnation Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000010294 electrolyte impregnation Methods 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- PCCVSPMFGIFTHU-UHFFFAOYSA-N tetracyanoquinodimethane Chemical compound N#CC(C#N)=C1C=CC(=C(C#N)C#N)C=C1 PCCVSPMFGIFTHU-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、固体電解コンデンサに
関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solid electrolytic capacitor.
【0002】[0002]
【従来の技術】有機半導体の一種であるTCNQ錯塩を
電解質として用いた固体電解コンデンサは、特公昭62
−52939号公報等に開示されている。ここでTCN
Qとは、7,7,8,8−テトラシアノキノジメタンを
意味する。2. Description of the Related Art A solid electrolytic capacitor using a TCNQ complex salt, which is a type of organic semiconductor, as an electrolyte is disclosed in Japanese Patent Publication No.
It is disclosed in Japanese Patent Publication No. 52939. Where TCN
Q means 7,7,8,8-tetracyanoquinodimethane.
【0003】斯かる固体電解コンデンサは、従来、以下
に示すような工程を経て製造されていた。Conventionally, such a solid electrolytic capacitor has been manufactured through the following steps.
【0004】すなわち、まず図5に示すように、陽極用
エッチドアルミニウム箔1の表面に化成処理を施して誘
電体皮膜を形成し、該陽極箔1を陰極箔2及びセパレ−
タ紙3と共に巻回してコンデンサ素子7を形成する。な
お、図5において4は巻き止めテープ、51、52は陽
極及び陰極のリード端子、61、62はリード端子の根
元部分を構成するリードボスである。一方で、TCNQ
錯塩の粉末を有底筒状のアルミニウムケ−ス内に適量詰
め、これを加熱してTCNQ錯塩を融解液化させる。そ
して、前記コンデンサ素子を前記アルミニウムケ−スの
開口部から融解液化したTCNQ錯塩中に挿入浸漬し、
コンデンサ素子内部に電解質としてのTCNQ錯塩を含
浸させ、直ちに急冷してTCNQ錯塩を固化させる。最
後に図6に示すように、前記アルミニウムケ−ス90の
開口部をエポキシ樹脂8にて封止する。That is, first, as shown in FIG. 5, a surface of an etched aluminum foil 1 for an anode is subjected to a chemical conversion treatment to form a dielectric film, and the anode foil 1 is connected to a cathode foil 2 and a separator.
The capacitor element 7 is formed by winding together with the paper 3. In FIG. 5, 4 is a winding tape, 51 and 52 are lead terminals for the anode and the cathode, and 61 and 62 are lead bosses that form the roots of the lead terminals. On the other hand, TCNQ
An appropriate amount of complex salt powder is packed in a cylindrical aluminum case having a bottom, and this is heated to melt and liquefy the TCNQ complex salt. Then, the capacitor element is inserted and immersed in the melted and liquefied TCNQ complex salt through the opening of the aluminum case,
The inside of the capacitor element is impregnated with TCNQ complex salt as an electrolyte and immediately cooled to solidify the TCNQ complex salt. Finally, as shown in FIG. 6, the opening of the aluminum case 90 is sealed with an epoxy resin 8.
【0005】[0005]
【発明が解決しようとする課題】上記従来技術による固
体電解コンデンサは、ケ−スの開口部をエポキシ樹脂に
て封止したものであるため、温度特性、高温負荷特性、
耐湿特性等に優れ、高信頼性で、かつ耐環境性にも優れ
ているが、以下に示すような欠点がある。The solid electrolytic capacitor according to the prior art described above has a case in which the opening of the case is sealed with an epoxy resin, so that the temperature characteristics, high temperature load characteristics,
It has excellent moisture resistance, high reliability, and environmental resistance, but it has the following drawbacks.
【0006】すなわち、融解液化したTCNQ錯塩中に
コンデンサ素子を浸漬した後、TCNQ錯塩を冷却固化
する過程において、コンデンサ素子がアルミニウムケ−
ス内で動き、ケース開口部におけるリ−ド端子の位置が
ずれることがある。That is, in the process of immersing the capacitor element in the melted and liquefied TCNQ complex salt and then cooling and solidifying the TCNQ complex salt, the capacitor element is formed into an aluminum case.
The position of the lead terminal at the opening of the case may shift due to movement within the space.
【0007】上述のような問題点は、そのまま製品とし
ての寸法不良につながるばかりでなく、特に、表面実装
用としてエポキシ樹脂の硬化後にリ−ド端子の成形等の
加工を行う場合には、前記寸法誤差を相対的に吸収でき
るような寸法設計が必要になり、表面実装用としては大
型になるし、製品のコストアップにもなる。The above-mentioned problems not only lead to dimensional defects as a product as they are, but especially when processing such as molding of lead terminals after curing of epoxy resin for surface mounting is carried out. It is necessary to design the dimensions so that the dimensional error can be relatively absorbed, and the size becomes large for surface mounting, and the cost of the product also increases.
【0008】一方、電解液型のコンデンサにおいて慣用
されているゴム封口法を上記固体電解コンデンサの封口
法として単純に転用すると、以下のような問題が発生す
る。On the other hand, if the rubber sealing method commonly used in electrolytic solution type capacitors is simply used as the sealing method for the solid electrolytic capacitor, the following problems occur.
【0009】すなわち、コンデンサ素子のリード端子部
に封口用ゴムを装着してからTCNQ錯塩を含浸させる
場合、含浸工程における加熱によりゴムが膨張、変質し
てアルミニウムケースに入らなくなる虞れがあり、この
問題を回避するためには耐熱性に優れたゴムが必要とな
ってコスト高となる。That is, when the TCNQ complex salt is impregnated after the sealing rubber is attached to the lead terminals of the capacitor element, there is a risk that the rubber expands and deteriorates due to the heating in the impregnation step and does not enter the aluminum case. In order to avoid the problem, rubber with excellent heat resistance is required, resulting in high cost.
【0010】また、コンデンサ素子にTCNQ錯塩を含
浸させた後で封口用ゴムを装着する場合には、アルミニ
ウムケースの開口部からゴムを挿入すると同時に、該ゴ
ムにコンデンサ素子のリード端子を貫通させねばなら
ず、作業性が悪いばかりでなく、不完全な装着による外
観不良が発生する。Further, when the sealing rubber is mounted after the capacitor element is impregnated with the TCNQ complex salt, the rubber must be inserted from the opening of the aluminum case and the lead terminal of the capacitor element must be penetrated through the rubber. As a result, not only is workability poor, but defective appearance occurs due to incomplete mounting.
【0011】さらに、前記ゴム封口の固体電解コンデン
サをプラスチック製の座板上等に載置し、リード端子を
折り曲げて表面実装用のチップ部品とする場合には、リ
ード端子の折り曲げ加工に伴う機械的ストレスがリード
ボス部や電極箔、さらにはその周辺の固体電解質にも伝
わり、リード端子と電極箔との接合部や固体電解質にク
ラックが生じて電極箔の誘電体被膜が損傷し、漏れ電流
不良が発生する。Further, when the solid electrolytic capacitor having the rubber seal is placed on a plastic seat plate and the like, and the lead terminal is bent to be a chip component for surface mounting, a machine for bending the lead terminal is used. Stress is transmitted to the lead boss and electrode foil, and also to the solid electrolyte around it, causing cracks in the joint between the lead terminal and electrode foil and in the solid electrolyte, damaging the dielectric film of the electrode foil and causing leakage current failure. Occurs.
【0012】本発明は、固体電解コンデンサに関する上
述のような問題点を解決するものである。The present invention solves the above-mentioned problems associated with solid electrolytic capacitors.
【0013】[0013]
【課題を解決するための手段】本発明による固体電解コ
ンデンサは、第1のケース内で融解液化させたTCNQ
錯塩等の電解質材料の中へ巻回型のコンデンサ素子を挿
入浸漬することにより該コンデンサ素子の内部に前記電
解質材料を含浸させ、前記コンデンサ素子を前記第1の
ケ−スから引き抜くと共に該コンデンサ素子内部の前記
電解質材料を冷却固化させ、前記コンデンサ素子のリー
ド端子の根元部分にゴム製のケース封口用部材を装着
し、前記封口部材付コンデンサ素子を第2のケ−ス内に
収納すると共に該第2のケースの開口端部を前記封口部
材にて密封し、前記封口部材の上面にエポキシ樹脂層を
形成し、前記リード端子の先端部を表面実装用の形状に
折り曲げ成形したものである。A solid electrolytic capacitor according to the present invention has a TCNQ melted and liquefied in a first case.
A wound type capacitor element is inserted and immersed in an electrolyte material such as a complex salt to impregnate the inside of the capacitor element with the electrolyte material, and the capacitor element is pulled out from the first case and the capacitor element is also removed. The electrolyte material inside is cooled and solidified, a rubber case-sealing member is attached to the root portion of the lead terminal of the capacitor element, and the capacitor element with the sealing member is housed in the second case. The opening end of the second case is sealed with the sealing member, an epoxy resin layer is formed on the upper surface of the sealing member, and the tip end of the lead terminal is bent and formed into a shape for surface mounting.
【0014】[0014]
【作用】本発明によれば、電解質材料を含浸させたコン
デンサ素子を第1のケ−スから引き抜いた後、該コンデ
ンサ素子のリード端子の根元部分にゴム製のケース封用
部材を装着して該封口部材付コンデンサ素子第2のケー
ス内に収納することにより、リ−ド端子の位置ずれに起
因する諸問題が解決される。According to the present invention, after the capacitor element impregnated with the electrolyte material is pulled out from the first case, a rubber case sealing member is attached to the root portion of the lead terminal of the capacitor element. By accommodating the capacitor element with the sealing member in the second case, various problems caused by the positional deviation of the lead terminals can be solved.
【0015】また、ゴム製封口部材の上面に形成された
エポキシ樹脂層は、リード端子の根元部分を補強してリ
ード端子折り曲げ時の機械的ストレスを吸収し、該スト
レスに起因するコンデンサ素子の損傷や漏れ電流不良の
発生を抑制する。Further, the epoxy resin layer formed on the upper surface of the rubber sealing member reinforces the root portion of the lead terminal to absorb mechanical stress when the lead terminal is bent and damages the capacitor element due to the stress. And the occurrence of leakage current defects are suppressed.
【0016】[0016]
【実施例】以下、本発明の実施例について説明する。Embodiments of the present invention will be described below.
【0017】本発明実施例による固体電解コンデンサの
製造方法においては、まず図5に示すように、陽極用エ
ッチドアルミニウム箔1の表面に化成処理を施して誘電
体皮膜を形成し、該陽極箔1を陰極箔2及びセパレ−タ
紙3とともに巻回してコンデンサ素子7を形成する。一
方で、TCNQ錯塩の粉末を有底筒状の第1アルミニウ
ムケ−ス内に適量詰め、これを加熱してTCNQ錯塩を
融解液化させる。In the method of manufacturing a solid electrolytic capacitor according to the embodiment of the present invention, first, as shown in FIG. 5, the surface of the etched aluminum foil 1 for anode is subjected to chemical conversion treatment to form a dielectric film, and the anode foil is formed. 1 is wound together with the cathode foil 2 and the separator paper 3 to form the capacitor element 7. On the other hand, an appropriate amount of TCNQ complex salt powder is packed in a cylindrical first aluminum case having a bottom, and this is heated to melt and liquefy the TCNQ complex salt.
【0018】そして、図2に示すように、前記コンデン
サ素子7を前記第1アルミニウムケ−ス91の開口部か
ら融解液化したTCNQ錯塩中に挿入浸漬し、コンデン
サ素子の内部に電解質としてのTCNQ錯塩を含浸させ
た後、直ちにコンデンサ素子を第1アルミニウムケ−ス
から引き抜き、TCNQ錯塩を冷却固化させる。Then, as shown in FIG. 2, the capacitor element 7 is inserted and immersed in the melted and liquefied TCNQ complex salt through the opening of the first aluminum case 91, and the TCNQ complex salt as an electrolyte is placed inside the capacitor element. Immediately after the impregnation with, the capacitor element is immediately pulled out from the first aluminum case, and the TCNQ complex salt is cooled and solidified.
【0019】その後、図1に示すように、コンデンサ素
子7のリ−ド端子51、52をゴム製のケース封口用部
材10の孔に挿入貫通させて、該封口部材10を前記リ
ード端子51、52の根元部分にあるリードボス部6
1、62に装着固定し、該封口部材付コンデンサ素子を
完成品用の第2アルミニウムケ−ス92内に収納し、該
第2アルミニウムケ−スの開口部付近の側面をカ−ルし
て前記封口部材10を締め付けることにより該ケ−スの
開口部を密封した後、前記封口部材の上面に軟化した状
態のエポキシ樹脂を注入し、加熱硬化させてエポキシ樹
脂層11を形成する。Thereafter, as shown in FIG. 1, the lead terminals 51 and 52 of the capacitor element 7 are inserted and penetrated into the holes of the rubber case sealing member 10, and the sealing member 10 is connected to the lead terminals 51 and 52. Lead boss 6 at the root of 52
1 and 62, the capacitor element with a sealing member is housed in the second aluminum case 92 for a finished product, and the side surface near the opening of the second aluminum case is curled. After the opening of the case is sealed by tightening the sealing member 10, an epoxy resin in a softened state is injected into the upper surface of the sealing member and cured by heating to form the epoxy resin layer 11.
【0020】さらに、表面実装用の縦チップ型とする場
合には、図3に示すように、リ−ド端子51、52をプ
ラスチック製の台座12の孔に挿入し、貫通させ、折り
曲げて、コンデンサ本体を台座に固定する。Further, in the case of the vertical chip type for surface mounting, as shown in FIG. 3, the lead terminals 51 and 52 are inserted into the holes of the plastic pedestal 12, penetrated, and bent. Fix the capacitor body to the pedestal.
【0021】また、横チップ型とする場合には、図4に
示すように、リ−ド端子51、52を所定の形状に折り
曲げ成形した後、コンデンサ本体を外装用プラスチック
ケ−ス13の空洞部に収納固定する。Further, in the case of the horizontal chip type, as shown in FIG. 4, the lead terminals 51 and 52 are bent and formed into a predetermined shape, and then the capacitor body is formed into a cavity of the exterior plastic case 13. Store and fix in the section.
【0022】[0022]
【発明の効果】本発明によれば、電解質材料を含浸させ
たコンデンサ素子を第1のケ−スから引き抜いた後、該
コンデンサ素子のリード端子の根元部分にゴム製のケー
ス封用部材を装着して該封口部材付コンデンサ素子第2
のケース内に収納することにより、リ−ド端子の位置ず
れに起因する諸問題が解決され、表面実装用等として好
適な小型の固体電解コンデンサが提供される。According to the present invention, after the capacitor element impregnated with the electrolyte material is pulled out from the first case, a rubber case sealing member is attached to the root portion of the lead terminal of the capacitor element. And then the capacitor element with the sealing member second
By accommodating in the case of 1, the various problems caused by the displacement of the lead terminals are solved, and a small solid electrolytic capacitor suitable for surface mounting or the like is provided.
【0023】また、ゴム製封口部材の上面にエポキシ樹
脂層を形成することにより、リード端子折り曲げ時の機
械的ストレスからコンデンサ素子が保護され、表1に示
すように漏れ電流不良の発生が抑制される。Further, by forming an epoxy resin layer on the upper surface of the rubber sealing member, the capacitor element is protected from mechanical stress when the lead terminals are bent, and as shown in Table 1, generation of leakage current defects is suppressed. It
【0024】[0024]
【表1】 [Table 1]
【0025】表1は、電解質としてTCNQ錯塩を用い
た定格電圧16V、定格容量3.3μFの固体電解コン
デンサでゴム封口とエポキシ樹脂層形成を併用した実施
例1と、電解質としてTCNQ錯塩を用いた定格電圧1
6V、定格容量3.3μFの固体電解コンデンサでゴム
封口のみによる比較例1と、電解質としてTCNQ錯塩
を用いた定格電圧10V、定格容量10μFの固体電解
コンデンサでゴム封口とエポキシ樹脂層形成を併用した
実施例2と、電解質としてTCNQ錯塩を用いた定格電
圧10V、定格容量10μFの固体電解コンデンサでゴ
ム封口のみによる比較例2の試料各100個について、
リード端子成形後における漏れ電流不良(LC不良)の
発生状況を調べたものである。Table 1 shows Example 1 in which a TCNQ complex salt was used as an electrolyte, a solid electrolytic capacitor having a rated voltage of 16 V and a rated capacity of 3.3 μF was used in combination with rubber sealing and epoxy resin layer formation, and TCNQ complex salt was used as an electrolyte. Rated voltage 1
Comparative example 1 with a solid electrolytic capacitor of 6 V and a rated capacity of 3.3 μF using only a rubber sealing, and a solid electrolytic capacitor with a rated voltage of 10 V and a rated capacity of 10 μF using TCNQ complex salt as an electrolyte were combined with rubber sealing and epoxy resin layer formation. For each of 100 samples of Example 2 and Comparative Example 2 using a TCNQ complex salt as an electrolyte, a solid electrolytic capacitor having a rated voltage of 10 V and a rated capacity of 10 μF and only a rubber seal,
The state of occurrence of leakage current failure (LC failure) after molding the lead terminals was examined.
【0026】ゴム封口のみによる比較例1、2において
は、漏れ電流不良が発生しているが、ゴム封口とエポキ
シ樹脂層形成を併用した実施例1、2においては、漏れ
電流不良が皆無となっている。In Comparative Examples 1 and 2 using only the rubber seal, defective leakage current occurred, but in Examples 1 and 2 in which the rubber seal and epoxy resin layer formation were used together, there was no leakage current defect. ing.
【0027】さらに、ゴム封口とエポキシ樹脂層形成を
併用することは、表2に示すように耐湿性の向上にも寄
与する。Further, the combined use of the rubber sealing and the epoxy resin layer formation also contributes to the improvement of moisture resistance as shown in Table 2.
【0028】[0028]
【表2】 [Table 2]
【0029】表2は、上記実施例2と比較例2の試料各
50個について、温度60℃、湿度90%の環境下で2
000時間の耐湿試験を行い、その前後での静電容量変
化(ΔC/C)を調べたものである。Table 2 shows 50 samples of each of Example 2 and Comparative Example 2 under the environment of a temperature of 60 ° C. and a humidity of 90%.
The humidity resistance test was performed for 000 hours, and the change in capacitance (ΔC / C) before and after the test was examined.
【0030】ゴム封口とエポキシ樹脂層形成を併用した
実施例2においては、ゴム封口のみによる比較例2に比
べて、耐湿試験による静電容量変化が少なくなってい
る。In Example 2 in which rubber sealing and epoxy resin layer formation were used together, the change in capacitance due to the humidity resistance test was smaller than in Comparative Example 2 in which only rubber sealing was performed.
【図1】本発明実施例による固体電解コンデンサのリー
ド端子折り曲げ加工前の断面図である。FIG. 1 is a sectional view of a solid electrolytic capacitor according to an embodiment of the present invention before bending a lead terminal.
【図2】本発明実施例における電解質含浸工程を説明す
るための断面図である。FIG. 2 is a cross-sectional view for explaining an electrolyte impregnation step in the example of the present invention.
【図3】コンデンサ素子の部分分解斜視図である。FIG. 3 is a partially exploded perspective view of a capacitor element.
【図4】縦チップ型コンデンサの側面図である。FIG. 4 is a side view of a vertical chip type capacitor.
【図5】横チップ型コンデンサの斜視図である。FIG. 5 is a perspective view of a horizontal chip type capacitor.
【図6】従来例による固体電解コンデンサの断面図であ
る。FIG. 6 is a cross-sectional view of a conventional solid electrolytic capacitor.
51、52 リ−ド端子 61、62 リードボス 7 コンデンサ素子 91 第1のケ−ス 92 第2のケ−ス 10 ゴム製の封口部材 11 エポキシ樹脂層 51, 52 Lead terminals 61, 62 Lead boss 7 Capacitor element 91 First case 92 Second case 10 Rubber sealing member 11 Epoxy resin layer
───────────────────────────────────────────────────── フロントページの続き (72)発明者 渕上 秀見 佐賀県杵島郡大町町大字福母217番地 佐 賀三洋工業株式会社内 (72)発明者 中本 徳三郎 大阪府守口市京阪本通2丁目5番5号 三 洋電機株式会社内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Hidemi Fuchigami, Inami, 217 Fukumo, Omachi-machi, Kishima-gun, Saga Prefecture, inside Saga Sanyo Kogyo Co., Ltd. No. 5-5 Sanyo Electric Co., Ltd.
Claims (3)
が含浸され、該コンデンサ素子が有底筒状のケース内に
収納された固体電解コンデンサにおいて、 前記ケースの開口端部がゴム製の封口部材にて密封され
ると共に該封口部材に設けられた貫通孔から前記コンデ
ンサ素子のリード端子が引き出され、 前記封口部材の上面にエポキシ樹脂層が形成され、 前記リード端子の先端部が表面実装用の形状に折り曲げ
成形されたことを特徴とする固体電解コンデンサ。1. A solid electrolytic capacitor in which a spirally wound capacitor element is impregnated with a solid electrolyte, and the capacitor element is housed in a cylindrical case having a bottom, wherein an opening end of the case is made of rubber. The lead terminal of the capacitor element is pulled out from the through hole provided in the sealing member while being sealed by a member, an epoxy resin layer is formed on the upper surface of the sealing member, and the tip portion of the lead terminal is for surface mounting. A solid electrolytic capacitor, which is formed by bending into the shape of.
が、TCNQ錯塩であることを特徴とする請求項1また
は2記載の固体電解コンデンサ。2. The solid electrolytic capacitor according to claim 1, wherein the electrolyte impregnated in the capacitor element is a TCNQ complex salt.
材料の中へ巻回型のコンデンサ素子を挿入浸漬すること
により該コンデンサ素子の内部に前記電解質材料を含浸
させる工程と、 前記コンデンサ素子を前記第1のケ−スから引き抜くと
共に該コンデンサ素子内部の前記電解質材料を冷却固化
させる工程と、 前記コンデンサ素子のリード端子の根元部分にゴム製の
ケース封口用部材を装着する工程と、 前記封口部材付コンデンサ素子を第2のケ−ス内に収納
すると共に該第2のケースの開口端部を前記封口部材に
て密封する工程と、 前記封口部材の上面にエポキシ樹脂層を形成する工程
と、 前記リード端子の先端部を表面実装用の形状に折り曲げ
成形する工程とを備えることを特徴とする固体電解コン
デンサの製造方法。3. A step of impregnating the electrolytic material into the inside of the capacitor element by inserting and immersing the wound type capacitor element in the molten and liquefied electrolytic material in the first case, and the capacitor element. Removing from the first case and cooling and solidifying the electrolyte material inside the capacitor element; mounting a rubber case sealing member at the root of the lead terminal of the capacitor element; A step of housing the capacitor element with a sealing member in a second case and sealing the opening end of the second case with the sealing member, and a step of forming an epoxy resin layer on the upper surface of the sealing member. And a step of bending and forming the tip portion of the lead terminal into a shape for surface mounting.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15028595A JP3481011B2 (en) | 1995-06-16 | 1995-06-16 | Solid electrolytic capacitor and method of manufacturing the same |
| US08/562,063 US5766271A (en) | 1994-11-24 | 1995-11-22 | Process for producing solid electrolyte capacitor |
| DE69508889T DE69508889T2 (en) | 1994-11-24 | 1995-11-23 | Solid electrolytic capacitor and manufacturing process |
| EP95118486A EP0714109B1 (en) | 1994-11-24 | 1995-11-23 | Solid electrolyte capacitor and process for producing same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15028595A JP3481011B2 (en) | 1995-06-16 | 1995-06-16 | Solid electrolytic capacitor and method of manufacturing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH097901A true JPH097901A (en) | 1997-01-10 |
| JP3481011B2 JP3481011B2 (en) | 2003-12-22 |
Family
ID=15493643
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15028595A Expired - Fee Related JP3481011B2 (en) | 1994-11-24 | 1995-06-16 | Solid electrolytic capacitor and method of manufacturing the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3481011B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009272320A (en) * | 2008-04-30 | 2009-11-19 | Nippon Chemicon Corp | Electrolytic capacitor |
| JP2010010293A (en) * | 2008-06-25 | 2010-01-14 | Fanuc Ltd | Electrolytic capacitor, motor driving device having the same and electrolytic capacitor mounting method |
| WO2017208984A1 (en) | 2016-05-31 | 2017-12-07 | パナソニックIpマネジメント株式会社 | Electrolytic capacitor and method for manufacturing same |
-
1995
- 1995-06-16 JP JP15028595A patent/JP3481011B2/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009272320A (en) * | 2008-04-30 | 2009-11-19 | Nippon Chemicon Corp | Electrolytic capacitor |
| JP2010010293A (en) * | 2008-06-25 | 2010-01-14 | Fanuc Ltd | Electrolytic capacitor, motor driving device having the same and electrolytic capacitor mounting method |
| WO2017208984A1 (en) | 2016-05-31 | 2017-12-07 | パナソニックIpマネジメント株式会社 | Electrolytic capacitor and method for manufacturing same |
| US10755865B2 (en) | 2016-05-31 | 2020-08-25 | Panasonic Intellectual Property Management Co., Ltd. | Electrolytic capacitor and method for manufacturing same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3481011B2 (en) | 2003-12-22 |
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