JPH097938A - Coating device and control method thereof - Google Patents

Abstract

(57) [Summary] [Purpose] Performs gas-liquid separation without solidifying the waste liquid collected from the spin coater. According to the present invention, gas-liquid separation is not performed in the cup DC, and common discharge means 122a, 122b from the cup are used.
Waste liquid and exhaust gas are stored together through storage means 124a, 1
The waste liquid and the exhaust gas are separated by the storing means. This prevents the waste liquid from solidifying or clogging in the cup. In addition, since the storage means of this device always stores a predetermined amount of stored water,
The liquid surface of the waste liquid can absorb the mist and the solidification of the waste liquid in the storage means can be prevented. Further, even when the apparatus is stopped, the minimum amount of exhaust is performed by the exhaust damper whose opening degree can be adjusted, so that the vaporized stored water can be appropriately exhausted without solidifying the stored water in the storage means.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a coating apparatus, and more particularly to a spinner type coating apparatus for mounting a treatment object on a spin chuck and applying a treatment liquid onto the treatment object surface.

[0002]

2. Description of the Related Art A conventional resist coating apparatus will be described with reference to FIG. In this resist coating apparatus, a spin chuck 202 is arranged at the center of the inside of an annular cup 200, a semiconductor wafer W is placed on this spin chuck 202, and a resist solution is applied onto the surface of the wafer W from above through a resist nozzle 204. The spin chuck 202 is dropped and the semiconductor wafer W is rotated integrally with the spin chuck 202, and the resist solution is diffused by a centrifugal force so that the entire surface of the wafer is uniformly coated.

During this resist coating process, the resist solution scattered from the semiconductor wafer W to the periphery hits the inner wall of the upper portion of the cup (drain cup) 200 as shown by the solid line R, is guided to the bottom of the cup 200, and the waste liquid outlet 200a. Is sent to a waste liquid tank (not shown) through the pipe 206. Further, in the cup 200, the intermediate hanging wall 201 and the intermediate upright wall 20 are provided.
An exhaust path 200b having a labyrinth structure formed by 3 and 3 is provided. The exhaust passage 200b has a function as a mist trap, and the exhaust gas is guided to the exhaust chamber 200c on the inner peripheral side of the cup by removing the mist of the resist solution in the exhaust passage 200b as shown by the dotted line G. It is sent from an exhaust port 200d of the exhaust chamber 200c through a pipe 208 to an exhaust pump (not shown).

[0004]

As described above,
In the conventional apparatus, the resist liquid and the exhaust gas are separated in the drain cup 200, and separate discharge ports 200a,
It is designed to be discharged from 200d. However, the mist of the resist liquid guided to the exhaust path 200b together with the exhaust gas adheres to the wall surfaces of the intermediate hanging wall 201 and the intermediate upright wall 203, is dried and solidified, and is exhausted (mist trap) 20.
There was a problem that 0b was clogged with the resist.
For this reason, the exhaust path (mist trap) 200b must be frequently washed with a solvent such as thinner, which is troublesome in terms of management and work.

Further, in the conventional apparatus, only the on / off control of the exhaust system is performed, and when the exhaust is constantly performed during the processing, the peripheral portion of the object to be processed is solidified faster than the central portion and the film thickness uniformity is improved. There was a problem of getting worse. Further, if the gas is constantly evacuated during non-treatment, there is a problem that the treatment liquid such as the resist liquid is dried and solidified in the exhaust system, and the apparatus must be washed before restarting the treatment.
On the other hand, if the exhaust is stopped during non-treatment, the exhaust system will be filled with vaporized solvent, causing an offensive odor, and the vaporized solvent will easily catch fire, so care must be taken when restarting the treatment. There was also. In particular, the above problem was more serious when the device had to be stopped for a long period of time.

The present invention has been made in view of the problems of the conventional coating apparatus, and an object thereof is to solidify or clog the processing liquid in the drain cup for collecting the processing liquid scattered from the object to be processed. It is an object of the present invention to provide a new and improved coating device capable of eliminating the above and improving the maintainability.

Another object of the present invention is to improve the uniformity of the film thickness of the object to be processed by adopting an inexpensive exhaust damper which is easy to operate and which allows the exhaust amount of the apparatus to be adjusted. Together with the new and improved, it is possible to prevent coagulation of the processing liquid in the exhaust system of the apparatus and prevent the exhaust system from being filled with the vaporized processing liquid while the processing target is not being processed. It is to provide a coating device.

[0008]

In order to solve the above-mentioned problems, according to a first aspect of the present invention, a container, a rotary mounting table which is arranged in the container and can be raised and lowered and rotated, and a rotating table. And a coating film forming means for forming a predetermined coating film on the surface of the object to be processed by rotating the rotary mounting table while supplying a predetermined coating liquid to the surface of the object to be processed placed on the transfer table. A coating device is provided. As described in claim 1, the coating apparatus discharges the coating liquid scattered from the object to be treated and collected inside the container as a waste liquid together with the exhaust gas from the container, and the discharging device. Storage means for temporarily storing waste liquid, gas-liquid separation means for separating waste liquid and exhaust gas by the storage means, and storage for adjusting the storage amount of waste liquid so that a predetermined amount of waste liquid is stored in the storage means It is characterized by having a quantity adjusting means.

In the above coating apparatus, the discharging means has an opening at a position higher than the liquid level of the waste liquid stored in the storing means in the maximum amount, and the gas-liquid separating means comprises: It can be composed of an exhaust port provided at a position higher than the opening and a waste liquid port provided at a position lower than the opening.

As described above, in the coating apparatus according to the present invention, gas-liquid separation is not performed in the cup, and the waste liquid and the exhaust gas are sent together from the cup to the storage means through the common discharge means, and the storage means The waste liquid and the exhaust gas are separated by the gas-liquid separating means. This prevents the waste liquid from solidifying or clogging in the cup. Further, unlike the conventional apparatus, the storage means does not become empty, and since the predetermined amount of waste liquid is stored in the storage means of the coating apparatus according to the present invention, the gas-liquid mixed flow collides with the liquid surface of the waste liquid. As a result, mist can be removed effectively, and
It is possible to prevent the waste liquid from solidifying in the storage means.

Further, the opening of the discharging means may be tapered as described in claim 3.
Further, the opening of the discharge means is such that at least a part thereof is in contact with the inner wall surface of the storage means as described in claim 4, or at least one of the openings is defined as described in claim 5. A small piece that communicates the portion with the inner wall surface of the storage means; or, as in claim 6,
It may be configured to include a strip piece extending at least to the liquid surface of the waste liquid stored in the storage means. Further, as described in claim 7, the discharge means may be provided with a vortex flow generating means for generating a vortex flow at least near the opening. According to such a configuration, it is possible to store the waste liquid in the storage means and discharge the waste liquid without generating much mist.

In order to solve the above problems, the second aspect of the present invention
From the viewpoint of, the container, the rotary mounting table which is disposed in the container and can be raised and lowered and freely rotated, and the predetermined coating liquid is supplied to the surface of the object to be processed mounted on the rotary mounting table while being rotated. A coating film forming means for forming a predetermined coating film on the surface of the object to be processed by rotating the transfer table, and the coating liquid scattered from the object to be processed and collected inside the container as waste liquid together with the exhaust gas from the container. A discharge means for discharging the waste liquid from the discharge means, a storage means for temporarily storing the waste liquid from the discharge means, a gas-liquid separation means for separating the waste liquid and the exhaust gas by the storage means, and a predetermined amount of waste liquid stored in the storage means. There is provided a coating device provided with a storage amount adjusting means for adjusting the storage amount of waste liquid. And this coating apparatus, as described in claim 8,
An exhaust system for exhausting the exhaust gas separated by the gas-liquid separating means is provided with an exhaust damper, and the exhaust amount is adjusted by adjusting the opening degree of the exhaust damper. According to such a configuration, the exhaust amount can be adjusted by the inexpensive and easily operated exhaust damper without using an expensive flow rate control device such as a mass flow controller.

Further, in order to solve the above-mentioned problems, according to another aspect of the present invention, a container, a rotary mounting table which is arranged in the container and can be raised and lowered and rotated, and is mounted on the rotary mounting table. A coating film forming means for forming a predetermined coating film on the surface of the object to be processed by supplying a predetermined coating liquid to the surface of the object to be processed and rotating the rotary mounting table, and a container scattered from the object to be processed. Discharging means for discharging the coating liquid collected inside the container as waste liquid together with the exhaust gas from the container, storing means for temporarily storing the waste liquid from the discharging means, and separating the waste liquid and the exhaust gas by the storing means. Provided in a gas-liquid separation means, a storage amount adjusting means for adjusting the storage amount of the waste liquid so that a predetermined amount of waste liquid is stored in the storage means, and an exhaust system for exhausting the exhaust gas separated by the gas-liquid separation means Exhaust gas with adjustable opening The method of coating apparatus and a path is provided.

When controlling the exhaust of the coating device,
According to the ninth aspect, when the object to be processed is not being processed, the opening degree of the exhaust damper is reduced, and the exhaust is performed at a flow rate such that the waste liquid or the solvent stored in the storage means does not solidify. With such a configuration, even when the apparatus is stopped, the minimum exhaust is performed, so that the waste liquid and the solvent that have vaporized do not remain in the storage means, the bad odor is prevented, and the risk of ignition is also increased. At the same time, the waste liquid and the solvent do not solidify even when exhausted, so that the process can be restarted immediately without cleaning the device.

According to a tenth aspect of the present invention, when controlling the exhaust of the coating apparatus, the opening of the exhaust damper is throttled at the stage of determining the thickness of the coating film applied to the surface of the object to be processed. Is reduced. As a result, it is possible to reduce the phenomenon in which the peripheral part of the object to be processed solidifies faster than the central part by performing normal evacuation to determine the film thickness. The film thickness of the film can be made uniform.

[0016]

BEST MODE FOR CARRYING OUT THE INVENTION Preferred embodiments of a coating apparatus according to the present invention will be described in detail below with reference to the accompanying drawings.

FIG. 1 is an explanatory view showing a schematic configuration of an embodiment in which a coating apparatus according to the present invention is applied to a resist coating unit (COT). In this resist coating unit (COT), an annular cup DC that functions as a drain cup is arranged at the center of the bottom of the unit, and the spin chuck 102 is arranged inside it. The spin chuck 102 is configured to rotate by the rotational driving force of the drive motor 104 while the semiconductor wafer W is fixedly held by vacuum suction. The drive motor 104 is disposed on the unit bottom plate 106 so as to be movable up and down, and via a cap-shaped flange member 108 made of, for example, aluminum,
For example, the lifting and lowering drive means 110 and the lifting and lowering guide means 112, which are air cylinders, are connected.

When the resist is applied, as shown in the drawing, the lower end 108a of the flange member 108 is in close contact with the unit bottom plate 106 near the outer periphery of the opening 106a so that the inside of the unit is sealed. When the semiconductor wafer W is transferred between the spin chuck 102 and a wafer transfer mechanism (not shown), the elevating drive means 110 drives the drive motor 1.
04 or the spin chuck 102 is lifted upward, the lower end of the flange member 108 floats above the unit bottom plate 106.

Further, at an upper position facing substantially the center of the processing surface of the object W to be processed placed on the spin chuck 102,
A coating liquid supply nozzle 114 is installed. The coating liquid supply nozzle 114 is connected to a tank (not shown), and at the time of processing, a predetermined amount of the coating liquid (for example, resist liquid containing a solvent such as thinner) is taken out from the tank, and the treated surface of the object W to be processed is almost completely removed. It is configured so that it can be dropped in the center.

In the cup DC, one chamber is formed by the outer peripheral wall surface, the inner peripheral wall surface and the bottom surface, and two drain ports 120a and 120b are provided on the bottom surface.
Although two drain ports are shown in the illustrated example, it goes without saying that one or more drain ports may be used. These drain ports 120a and 120b are connected to the drain pipe 122.
tank 124 through the discharging means including a, 122b, etc.
It is connected to a storage means 124 for temporarily storing a waste liquid composed of a, 124b and the like. Drain pipe 122a, 122
As shown in FIG. 2, the lower end portions 122c and 122d of b are projected to the middle of the tanks 124a and 124b.
It can be dropped on the liquid surface of a waste liquid (resist liquid) or a solvent (hereinafter, referred to as a stored liquid) 144 stored in 24b.

According to the present embodiment, as shown in FIG. 2, for example, the tank 1 of the drain pipes 122a and 122b.
Lower end portions 123a, 1 of the portions protruding to 24a, 124b
The numeral 23b is formed in a tapered shape so that dripping can be performed well. In addition, according to the present embodiment, since the tanks 124a and 124b have the same configuration,
Only 123a is shown in FIG. Further tank 124
As shown in an enlarged scale in FIG. 2, a and 124b are hermetically sealed containers, and have waste liquid outlets 126a and 126b on the bottom surface thereof. The waste liquid ports 126a and 126b are provided in the pipe 1 respectively.
It is connected to an exhaust system 131 including 28a, 128b, a valve 130, a waste liquid processing unit (not shown), and the like. In the illustrated example, two tanks 12 are used as a waste liquid storage means.
Although only 4a and 124b are shown, it is also possible to configure these as an intermediate tank and separately provide a larger capacity waste liquid storage tank downstream.

Further, the waste liquid outlets 126a and 126b have lids 1 each having a ceiling made of a blind plate and a large number of holes formed in the periphery.
27a and 127b are installed. If the object to be processed is damaged during processing due to some force majeure, the damaged pieces are transferred through the drain pipes 122a and 122b to the tanks 124a and 124, respectively.
However, according to the present embodiment, the lids 127a, 12 are attached to the waste liquid outlets 126a, 126b.
Since 7b is installed, the broken pieces do not fall into the waste liquid pipe.

Liquid level sensors HH, H, L for detecting the liquid level of the waste liquid stored in the tanks 124a, 124b are provided at predetermined height positions. These liquid level sensors HH, H, L are respectively connected to the controller 132, and the controller 132 is connected to the liquid level sensor H.
By opening and closing the valve 130 as the storage amount adjusting means in response to the signals from H, H, and L, a predetermined amount is constantly stored in the tank (amount within the range from the liquid level of the sensor L to the sensor H or less).
It is possible to adjust the liquid level so that the stored liquid is stored. The height of the liquid surface is set so that the gas-liquid separated state can be optimally obtained depending on, for example, the type of the resist liquid and the degree of exhaust gas. The sensor HH is an overflow prevention sensor. For example, when the height of the stored liquid exceeds the sensor HH, the device should be set to stop until the height of the stored liquid is restored to the normal state. You can

Further, exhaust ports 134a and 134b are provided on the upper surfaces of the tanks 124a and 124b. These exhaust ports 134a and 134b are connected to an exhaust system 13 including an exhaust pump 138 via an exhaust damper 136 described later.
The exhaust gas of the gas-liquid mixed flow sent to the tanks 124a and 124b via the drain pipes 122a and 122b can be exhausted. Although not shown, a mist trap such as a replaceable mesh filter can be installed in the exhaust pipes 134a and 134b to prevent the mist from flowing into the exhaust pump.

Further, according to the present embodiment, the tank 12
Cleaning mechanisms 140a and 140b for spraying a solvent such as thinner are provided on the upper portions of the 4a and 124b. As shown in FIG. 2, the cleaning mechanisms 140a and 140b are nozzle-shaped ones having a large number of holes 142a and 142b for spraying the solvent at the tip thereof, and spray the solvent into the tank if necessary. It is possible to wash the processing liquid such as the resist liquid coagulated in the tanks 124a and 124b. The cleaning mechanisms 140a and 140b not only simply clean the inside of the tanks 124a and 124b,
When the amount of the stored liquid stored in the tanks 124a and 124b is equal to or less than a predetermined amount (that is, when a warning is issued by the liquid level sensor L), the tanks 124a and 124b
It is also used to supply the solvent as a stored liquid.

Regarding the cleaning of the drain pipes 122a and 122b, as in the configuration of the drain pipe 122a 'shown in FIG. 3, a large number of solvent ejection ports 144a are provided in the upper portion of the inner wall surface of the drain pipe 122a to provide a solvent supply system. It is also possible to adopt a configuration in which a solvent such as thinner supplied from 146a is flowed if necessary. Of course, this drain pipe 122
When the amount of the stored liquid stored in the tanks 124a and 124b of the solvent supply system 146a provided in a'is less than a predetermined amount (that is, the warning is given by the liquid level sensor L, as in the cleaning mechanism 142a). It can also be used to supply the solvent as a stored liquid in the tanks 124a and 124b (when emitted).

Referring again to FIG. 2, the drain tube 122
a, 122b open ends 123a and 123b, and the exhaust port 1
Regarding the height positional relationship with 34a and 134b, the latter is installed so as to be higher than the former. With this configuration, the drain pipes 122a and 122b allow the tank 1
Of the gas-liquid mixed flow introduced into 24a and 124b, only the liquid of the waste liquid and the gas from which the mist portion has been removed are exhausted 1
It is possible to exhaust from 34a and 134b via the exhaust system 137. Further, as described above, the waste liquid outlets 126a and 126b of the tanks 124a and 124b have the open ends 123a and 123b of the drain pipes 122a and 122b.
Since it is installed at a position lower than that of the gas-liquid mixed flow introduced into the tanks 124a and 124b by the drain pipes 122a and 122b, only the waste liquid portion is discharged from the waste liquid ports 126a and 126b through the waste liquid system 131. It is possible to waste liquid. As described above, according to the present embodiment, the gas-liquid mixed flow is effectively gas-liquid separated in the tanks 124a and 124b, and is discharged from the exhaust system 137 or the waste liquid system 131, which are configured as separate systems, to the outside of the apparatus. To be done.

Further, according to the present embodiment, the drain pipe 1
Since the liquid 22a, 122b continuously flows into the stored liquid stored in the tanks 124a, 124b in a predetermined amount, it is possible to prevent the waste liquid from solidifying in the tank. The mist-like droplets generated in the process of being introduced into the tanks 124a and 124b from the drain pipes 122a and 122b are also stored in the tanks 124a and 124b.
The liquid collides with the liquid surface of the stored liquid in b and is adsorbed and dissolved on the liquid surface, so that gas-liquid separation including removal of mist is effectively performed. Also, if necessary, the tanks 124a, 12
It is also possible to prevent the solidification of the waste liquid more effectively by providing a heater for heating the stored liquid portion stored in 4b and a heating device that uses a temperature-controlled liquid or the like to lower the viscosity. Is.

Next, the exhaust system 137 of the coating apparatus according to this embodiment will be described with reference to FIGS. 1 and 4. As shown in detail in FIGS. 4A and 4B, the exhaust system 137 is provided with an exhaust damper 136 capable of limiting the amount of exhaust flowing through the exhaust system 137 by an elliptical air flow restricting member 137. . This exhaust damper 136
According to the signal from the controller 132, the opening degree can be freely adjusted between the fully open and the fully closed.
Further, in the illustrated example, since the airflow restricting member 137 has an elliptical shape (see FIG. 4A), the airflow restricting member 137 is in a fully closed state as shown in FIG. 4B. Since it is in contact with the inner wall of the exhaust pipe 139 inclining to the air flow direction, the airtightness is better than that of a conventional exhaust damper having a structure in which the inner wall of the exhaust pipe is in contact with the air flow direction in a direction perpendicular to the air flow direction. Can be improved.

Further, the exhaust damper applicable to the coating apparatus according to the present embodiment is not limited to that shown in FIG. 4, and for example, the exhaust damper 13 having a structure as shown in FIG.
It is also possible to use 6 '. This exhaust damper 13
6'is the two airflow restricting blades 137 arranged in different stages.
a, 137b, and each wing 137a, 137b
In the fully closed state, each blade 137 is attached to the inner wall of the exhaust pipe 139 '.
a and 137b, provided with stepped portions 139a and 139
It is possible to contact with 9b, and such a configuration improves the hermeticity.

Since the exhaust damper applicable to the coating apparatus according to the present embodiment is constructed as described above, even if an expensive apparatus such as a mass flow controller is not used, it can be operated in the mode described below. It is possible to drive.

(A) Idling mode In the coating apparatus according to the present embodiment, the tank 124a,
A fixed amount of the stored liquid 144 is always stored in 124b. However, the coating device can be driven in the idling mode when the device is not being processed, especially when the device has to be stopped for a long period of time due to a long vacation or production adjustment. In this idling mode, the exhaust damper 136 causes the tank 124a,
The opening degree is adjusted so that exhaust is performed at a flow rate such that the stored liquid 144 stored in 124b does not dry and solidify. Regarding this opening, the tanks 124a, 124b
Can be set in consideration of the capacity, the type of the stored liquid 144, the suspension period of the device, and the like. As described above, by performing the exhaust in the idling mode while the processing is not being performed in the apparatus, it is possible to exhaust the vaporized and stored liquid 144 in the tanks 124a and 124b without confining it. Moreover, since the exhaust is also performed to the minimum, the stored liquid 144 does not solidify in the tanks 124a and 124b. Note that, for example, when the stored liquid 144 falls below a predetermined amount while the apparatus is stopped for a long period of time, the solvent may be appropriately replenished via the cleaning mechanism 142a or the like.

(B) Film Thickness Adjustment Mode As described above, when the gas is constantly exhausted in the normal exhaust mode during processing, the coating liquid dripped from the nozzle 114 is applied to the wafer near the drain ports 120a and 120b. The peripheral area may dry faster than the central area, and the thickness of the coating film may become uneven. Therefore, according to the present embodiment, after the coating liquid is dropped, the exhaust damper 13 is temporarily
By narrowing the opening of 6 and reducing the exhaust amount, the coating film can be uniformly dried over the entire surface of the wafer, and the film thickness of the coating film can be made uniform. Then, after the film pressure of the coating film is determined, the exhaust damper 136 is opened again to return to the normal exhaust mode. The time for performing the film thickness adjustment mode in which the exhaust damper 136 is temporarily squeezed, and the exhaust amount in the film thickness adjustment mode are as follows:
It can be determined in consideration of the size of the object to be processed, the capacity of the exhaust system, and the like.

Next, the operation of the above apparatus will be described.
First, the spin chuck 102 is lifted from the cup DC by the elevating mechanism 110 to transfer an object to be processed, for example, a semiconductor wafer w from a transfer arm (not shown), and the spin chuck 102 is vacuum-sucked. Then, the spin chuck 102 is lowered to bring the spin chuck 102 into close contact with the bottom plate 106 of the unit. Next, a predetermined amount of resist liquid, which is a coating liquid, is dropped onto the central portion of the wafer W from the nozzle 114. During this time, the exhaust system 137 is operating in the normal exhaust mode.

Then, the driving device 104 is driven to apply a rotational driving force to the spin chuck 102, whereby the wafer W-shaped resist liquid placed on the spin chuck 102 is extended by the centrifugal force, and the wafer W is thus stretched. The surface of is coated, whereby a resist layer which is a coating film having a predetermined thickness is formed. At that time, according to the present embodiment,
A uniform resist layer can be formed by adjusting the opening degree of the exhaust damper 136 and operating the exhaust system 137 in the film thickness adjustment mode. After the resist layer is formed, the exhaust system 137 is again operated in the normal exhaust mode.
After that, the rotation of the spin chuck 102 is stopped, the spin chuck 102 is raised again by the elevating mechanism 110, the wafer W is transferred to a transfer arm (not shown), and a new wafer W is transferred to the spin chuck 102.

During the coating process, the wafer W is spun by centrifugal force.
The resist liquid that has been blown away and becomes unnecessary and becomes a waste liquid becomes droplets or mist and is received by the cup DC, or is conveyed by the exhaust flow formed in the cup DC and collected at the bottom portion, and the bottom portion of the cup DC. From the drain ports 120a and 120b provided in the exhaust gas (cup DC
By the exhaust from the drain ports 120a and 120b at the bottom of the cup, the air from the outside that has flowed into the cup DC and the mixed gas composed of the above vaporized solvent in the resist solution) are sucked and passed through the drain pipes 122a and 122b. hand,
It is sent to the tanks 124a and 124b. At this time, according to the present embodiment, since the gas-liquid mixed flow is continuously sent from the drain pipes 122a and 122b to the tanks 124a and 124b, it is possible to prevent the waste liquid from solidifying in the tanks 124a and 124b. be able to. Then, from the drain pipes 122a and 122b to the tanks 124a and 124b.
The mist-like droplets generated in the process of being introduced into the inside also collide with the liquid surface of the stored liquid in the tanks 124a and 124b and become adsorbed and dissolved on the liquid surface. Is effectively separated. Then, in the gas-liquid mixed flow that has been gas-liquid separated, the waste liquid is the waste liquid outlet 126a,
Exhaust gas that has been discharged from 126b to the waste liquid processing unit via the waste liquid system 131 and has its mist removed is exhausted from the exhaust ports 136a and 136b via the exhaust system 137.

Further, in the above coating apparatus, when the apparatus is not processing, particularly when it is necessary to stop the apparatus for a long period of time due to a long vacation or production adjustment, the coating apparatus is operated in the idling mode. Can be driven. By performing the exhaust in the idling mode, it is possible to exhaust the vaporized and stored liquid 144 in the tanks 124a and 124b without trapping it. In addition, since the exhaust is also performed to the minimum, the tank 1
The stored liquid 144 does not solidify in 24a and 124b.

Although the above-mentioned coating apparatus can be used as a single apparatus, it can be used, for example, by incorporating it in the coating / developing apparatus for LCD substrate shown in FIG. In FIG. 6, reference numeral 71 denotes a carrier stage, and this carrier stage has a carrier C1 in which a plurality of unprocessed substrates are accommodated.
And the carrier C2 in which the processed substrate is stored is placed. Reference numeral 72 is a carry-in / out tweezers, 73 and 74 are main arms for transferring substrates, and 75 is a transfer table.

A brush cleaning device 81, a jet water cleaning part 82, a coating device 83, an adhesion processing part 84, and a cooling processing part 85 are provided on both sides of the main arm 73 or 74 on the conveying path.
Further, a heating processing section 86 and a development processing section 87 are provided, and an exposure apparatus 93 is connected to the right end side of the coating / developing processing apparatus via a carrying-in / out tweezers 91 and a delivery table 92.

In the coating / developing apparatus having the above-described structure, the unprocessed substrate accommodated in the cassette C1 is taken out by the carry-in / take-out tweezers 72, then transferred to the main arm 73, and the brush cleaning section is provided. It is conveyed into 81. The substrate cleaned with the brush in the brush cleaning section 81 is subsequently cleaned with high-pressure jet water in the jet water cleaning section 82 as needed. After that, the substrate is subjected to a hydrophobizing process in an adhesion processing section 84, cooled in a cooling processing section 85, and then a photoresist film, that is, a photosensitive film is applied and formed in a coating device 83. Then, after this, the exposure device 93 exposes a predetermined pattern. The exposed substrate is then processed by the development processing unit 87.
After being conveyed in and developed by the developing solution degassed by the degassing mechanism 300 according to the present invention, the developing solution is washed away by the rinse solution and the developing process is completed.

The preferred embodiments of the coating apparatus according to the present invention have been described above with reference to the accompanying drawings.
The present invention is not limited to the above example. It is obvious to those skilled in the art that various changes and modifications can be conceived within the scope of the technical idea described in the claims, and naturally, these are also within the technical scope of the present invention. It is understood that it belongs.

For example, not only the lower end openings 123a and 123b of the drain pipes 122a and 122b are tapered but also at least a part of the openings 123a and the tank 124a as shown in FIG. 8 is provided, or, as shown in FIG. 8, the strip piece 1 extending to at least the liquid surface of the stored liquid 144 stored in the tank 124a.
27, or as shown in FIG. 9, the openings 123a and 123b of the drain pipes 122a and 122b are simply configured as tanks 124a and 124b, respectively, so that the air flowing through the drain pipes 122a and 122b can be prevented. It is also possible to continuously and smoothly introduce the liquid mixed flow into the stored liquid 144 in the tanks 124a and 124b.

Further, regarding the structure of the lower end openings 123a and 123b of the drain pipes 122a and 122b, FIG.
As shown in FIG. 12, for example, the drain pipes 122a, 12a
It is possible to provide a spiral groove 140 or a spiral protrusion inside the lower end of the portion of the 2b projecting into the tanks 124a, 124b.

For example, in the example shown in FIG. 10, the drain pipe 1
A spiral groove 140 is cut inside the lower end portion of the portion 22a 'of the cup (not shown) that projects the gas-liquid mixed flow flowing out from the drain port 120a of the cup DC into the spiral groove 14a.
A vortex can be formed by flowing along 0.
By making the gas-liquid mixed flow flowing in the lower end part a vortex in this way, waste liquid is less likely to stay in the drain pipe 122a ′, clogging of the drain pipe 122a ′ can be prevented, and the gas-liquid mixed flow can be prevented. Tanks 124a, 124b
The liquid surface of the stored liquid stored therein can be caused to collide reliably and smoothly. As a result, the separation of the mist on the liquid surface of the waste liquid is promoted and the liquid surface of the waste liquid is shaken and agitated, so that the stored liquid can be prevented from solidifying in the tanks 124a and 124b. Further, gas-liquid separation can be performed to some extent in the drain pipe 122a 'by the centrifugal force of the vortex flow. The drain pipe 122
The spiral groove 140 cut inside the a ′ may be provided at least near the open end as described above, and the drain pipe 122 may be provided.
It may be provided over the entire length of a '. In the above case, the vortex flow forming portion in which the spiral groove 140 is formed can be configured by separately forming the drain pipes 122a and 122b, and can be detachably configured via an appropriate joint.

In the above embodiment, the drain pipe 12
Although the vortex flow is formed by forming the spiral groove 140 in the vicinity of the open ends in 2a and 122b, the present invention is not limited to such an embodiment. For example, as shown in FIGS. 11 to 13, it is possible to provide spiral projections on the inner wall surfaces of the drain pipes 122a and 122b. 11 to 13, (a) is a drain pipe 122a according to each of the above embodiments,
FIG. 12B is a schematic perspective view showing a part of 122b as seen through, and FIG. 12B is a plan view of the drain pipes 122a and 122b according to each of the above embodiments.

First, the embodiment shown in FIG. 11 will be described. FIG. 11 shows a structure in which the spiral projection 146 formed in a single (single) band shape is arranged in the drain pipe 122a ". According to this configuration, the drain pipe 122
Since the gas-liquid mixed flow introduced into the a ”flows along the spiral protrusion 146, a downward swirl flow is formed. Further, in FIG. 12, a spiral formed in a double (two) band shape. Another embodiment is shown in which the protrusions 148a, 148b are located within the drain tube 122a "'. According to this structure, the formation of the vortex is further promoted by the double spiral protrusions 148a and 148b. The spiral protrusions arranged in the drain pipe do not necessarily have to be continuous as shown in FIGS. 11 and 12. For example, as shown in FIG.
A plurality of protruding pieces 150a, 15 forming a part of a spiral
By arranging 0b obliquely, it is possible to act as a substitute for a continuous spiral protrusion to form a vortex flow.

Further, in the embodiment shown in FIGS. 1 and 2, a predetermined amount of stored water 144 is stored in the tanks 124a and 124b.
Although the electric liquid level sensors HH, H, and L are provided to store the water, the present invention is not limited to such an example, and a predetermined amount of the stored water 144 is formed by a mechanical configuration as shown in FIG. It may be configured to store. According to such a configuration, the waste liquid outlet 150 projects by L into the tank 124a, so that the stored water 144 is configured not to be stored in the tank 124a at a height L or more. In this embodiment also, the waste liquid outlet 150 is provided with the lid 152 having the same structure as that shown by 127a in FIG. 1 so that the broken pieces of the wafer W do not enter the waste liquid system. There is. However, in such a configuration, the stored water 144 may be emptied, and therefore, in order to constantly ensure the minimum storage amount, it is necessary to separately provide a mechanical or electrical sensor. Therefore, in this embodiment, the tank 124a is
It can be suitably applied to the developing device in which the risk of vaporization and solidification of the stored water 144 stored therein is relatively small.

The preferred embodiment of the coating apparatus according to the present invention has been described above. However, the structure, shape, etc. of each part in the above-described embodiment are merely examples, and various changes and modifications are possible. Needless to say. For example, although the above embodiment has been described by taking the apparatus for applying the resist solution on the semiconductor wafer as an example, the present invention is applicable to the apparatus and the developing apparatus for applying the application solution to other objects to be processed such as LCD substrates. It can also be applied.

[0049]

As described above, according to the present invention,
Gas-liquid separation is not performed in the cup, but the waste liquid and the exhaust gas are sent together from the cup to the storage means through the common discharge means, and the storage means separates the waste liquid and the exhaust gas by the gas-liquid separation means. . This prevents the waste liquid from solidifying or clogging in the cup. Further, unlike the conventional apparatus, the storage means does not become empty, and the storage means of the coating apparatus according to the present invention always stores a predetermined amount of waste liquid, so that the mixed stream of airflow collides with the liquid surface of the stored water. By doing so, it is possible to effectively remove the mist of the waste liquid, and it is possible to prevent the waste liquid from solidifying in the storage means.

Further, according to the present invention, the exhaust system for exhausting the exhaust gas separated by the gas-liquid separating means is provided with an exhaust damper, and the exhaust amount is adjusted by adjusting the opening degree of the exhaust damper. Therefore, the exhaust amount can be adjusted by the inexpensive and easily operated exhaust damper without using an expensive flow rate control device such as a mass flow controller.

For example, when the object to be processed is not being processed, the opening of the exhaust damper can be narrowed and exhaust can be performed at such a flow rate that the waste liquid or solvent stored in the storage means does not solidify. Even when stopped, vaporized waste liquid and solvent do not remain in the storage means, prevent bad odor and reduce the risk of ignition, and at the same time waste liquid and solvent do not solidify even when exhausted. Therefore, the process can be immediately restarted without cleaning the device.

Further, when controlling the exhaust of the coating apparatus, at the stage of determining the film thickness of the coating film applied to the surface of the object to be processed, the opening of the exhaust damper can be narrowed to reduce the exhaust flow rate. , As in the conventional device, by performing the normal evacuation when determining the film thickness, the phenomenon that the peripheral portion of the object to be processed solidifies faster than the central part is reduced, and it is formed on the surface of the object to be processed. The thickness of the coating film can be made uniform.

[Brief description of drawings]

FIG. 1 is a configuration diagram showing a schematic configuration of an embodiment of a coating apparatus according to the present invention.

FIG. 2 is a schematic cross-sectional view showing an embodiment of a waste liquid storage tank applicable to the coating apparatus according to the present invention.

FIG. 3 is a schematic cross-sectional view showing another embodiment of the drain pipe applicable to the coating apparatus according to the present invention.

4A and 4B are explanatory views showing an embodiment of an exhaust damper applicable to the coating apparatus according to the present invention, in which FIG. 4A is a schematic plan view of an air flow restricting member, and FIG. 4B is a schematic sectional view of the exhaust damper. Is.

FIG. 5 is a schematic cross-sectional view showing another embodiment of an exhaust damper applicable to the coating apparatus according to the present invention.

FIG. 6 is a schematic perspective view showing a coating / developing apparatus incorporating the coating apparatus according to the present invention.

FIG. 7 is a schematic cross-sectional view showing an embodiment of the structure of the drain pipe applicable to the coating apparatus according to the present invention.

FIG. 8 is a schematic cross-sectional view showing another embodiment of the structure of the drain pipe applicable to the coating apparatus according to the present invention.

FIG. 9 is a schematic sectional view showing still another embodiment of the structure of the drain pipe applicable to the coating apparatus according to the present invention.

FIG. 10 is a schematic cross-sectional view showing an embodiment of a vortex flow generating means applicable to a coating apparatus according to the present invention.

11A and 11B are explanatory views showing an embodiment of a vortex flow generating means applicable to a coating apparatus according to the present invention, FIG. 11A is a partially transparent perspective view, and FIG. 11B is a plan view.

FIG. 12 is an explanatory view showing another embodiment of the vortex flow generating means applicable to the coating apparatus according to the present invention, (a)
Is a partially transparent perspective view, and (b) is a plan view.

FIG. 13 is an explanatory view showing another embodiment of the vortex flow generating means applicable to the coating apparatus according to the present invention, (a)
Is a partially transparent perspective view, and (b) is a plan view.

FIG. 14 is a schematic cross-sectional view showing another configuration for storing a predetermined amount of stored water in the storage means of the coating apparatus according to the present invention.

FIG. 15 is a schematic sectional view of a conventional coating apparatus.

[Explanation of symbols]

 HH, H, L Liquid level sensor DC cup W wafer 102 Spin chuck 114 Nozzle 120a, 120b Drain port 122a, 122b Drain pipe 123a, 123b Opening 124a, 124b Tank 126a, 126b Waste liquid port 128a, 128b Waste liquid pipe 130 Valve 131 Waste liquid system 132 controller 134a, 134b exhaust port 136 exhaust damper 137 exhaust system 138 exhaust pump 142a, 142b cleaning mechanism

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Yuji Matsuyama 2655 Tsukyu, Kikuyo-cho, Kikuchi-gun, Kumamoto Prefecture Tokyo Electron Kyushu Kumamoto Plant

Claims (10)

[Claims] 1. A container; a rotary mounting table which is disposed in the container and can be raised and lowered and rotated; a predetermined coating liquid is supplied to a surface of an object to be processed mounted on the rotary mounting table. In a coating device, comprising: a coating film forming means for forming a predetermined coating film on the surface of the object to be processed by rotating a transfer table: the particles scattered from the object to be collected and collected inside the container. Discharge means for discharging the coating liquid together with exhaust gas from the container as waste liquid; storage means for temporarily storing the waste liquid from the discharge means; and separation of the waste liquid and the exhaust gas by the storage means A coating device, comprising: a gas-liquid separating unit; and a storage amount adjusting unit that adjusts the storage amount of the waste liquid so that a predetermined amount of the waste liquid and / or the solvent is stored in the storage unit. 2. The discharge means has an opening at a position higher than the liquid level of the waste liquid in which the maximum amount is stored in the storage means; and the gas-liquid separation means at a position higher than the opening. The exhaust port provided and a waste liquid port provided at a position lower than the opening are provided.
3. The coating device according to claim 1. 3. The coating apparatus according to claim 1, wherein the opening of the discharging unit has a taper. 4. The coating apparatus according to claim 1, wherein at least a part of the opening of the discharge means is in contact with the inner wall surface of the storage means. 5. The opening of the discharge means is provided with a small piece that communicates at least a part of the opening with an inner wall surface of the storage means. The coating device according to 1. 6. A strip piece extending at least to a liquid level of waste liquid and / or solvent stored in the storage means, the opening of the discharge means being provided with a strip piece. The coating device according to any one of 3 above. 7. The coating apparatus according to claim 1, wherein the discharging unit includes a vortex flow generating unit that generates a vortex flow at least near the opening. . 8. A container; a rotary mounting table which is disposed in the container and can be raised and lowered and rotated; a predetermined coating liquid is supplied to a surface of an object to be processed which is mounted on the rotary mounting table. Coating film forming means for forming a predetermined coating film on the surface of the object to be processed by rotating the transfer table; and the container, which is the coating solution scattered from the object to be collected and collected inside the container, as the waste liquid Discharge means for discharging together with the exhaust gas from the discharge means; storage means for temporarily storing the waste liquid from the discharge means; gas-liquid separation means for separating the waste liquid and the exhaust gas by the storage means; In a coating apparatus including: a storage amount adjusting unit that adjusts the storage amount of the waste liquid so that a predetermined amount of the waste liquid and / or the solvent is stored in the storage unit: the exhaust gas separated by the gas-liquid separating unit Exhaust exhaust An applicator, wherein an exhaust damper is provided in the air system, and the exhaust amount is adjusted by adjusting the opening of the exhaust damper. 9. A container; a rotary mounting table which is disposed in the container and can be raised and lowered and rotated; a predetermined coating liquid is supplied to a surface of an object to be processed mounted on the rotary mounting table. Coating film forming means for forming a predetermined coating film on the surface of the object to be processed by rotating the transfer table; and the container, which is the coating solution scattered from the object to be collected and collected inside the container, as the waste liquid Discharge means for discharging together with the exhaust gas from the discharge means; storage means for temporarily storing the waste liquid from the discharge means; gas-liquid separation means for separating the waste liquid and the exhaust gas by the storage means; A storage amount adjusting means for adjusting the storage amount of the waste liquid so that a predetermined amount of the waste liquid and / or the solvent is stored in the storage means; and an exhaust system for exhausting the exhaust gas separated by the gas-liquid separating means. Adjustable opening A method for controlling a coating apparatus provided with an exhaust damper capable of performing exhaust gas treatment, comprising: reducing a degree of opening of the exhaust damper to remove waste liquid and / or solvent stored in the storage means when the object to be processed is not being processed. A method for controlling a coating apparatus, which comprises exhausting at a flow rate that does not solidify. 10. A container; a rotary mounting table which is disposed in the container and can be raised and lowered and rotated; a predetermined coating liquid is supplied to a surface of an object to be processed which is mounted on the rotary mounting table. Coating film forming means for forming a predetermined coating film on the surface of the object to be processed by rotating the transfer table; and the container, which is the coating solution scattered from the object to be collected and collected inside the container, as the waste liquid Discharge means for discharging together with the exhaust gas from the discharge means; storage means for temporarily storing the waste liquid from the discharge means; gas-liquid separation means for separating the waste liquid and the exhaust gas by the storage means; A storage amount adjusting means for adjusting the storage amount of the waste liquid so that a predetermined amount of the waste liquid and / or the solvent is stored in the storage means; and an exhaust system for exhausting the exhaust gas separated by the gas-liquid separating means. Opening adjustment A method of controlling a coating device having a possible exhaust damper: reducing the opening of the exhaust damper to reduce the exhaust flow rate in the step of determining the film thickness of the coating film applied to the surface of the object to be processed. A method for controlling a coating device, comprising: