JPH098435A - Mounting base plate for can-sealing element - Google Patents
Mounting base plate for can-sealing elementInfo
- Publication number
- JPH098435A JPH098435A JP7176556A JP17655695A JPH098435A JP H098435 A JPH098435 A JP H098435A JP 7176556 A JP7176556 A JP 7176556A JP 17655695 A JP17655695 A JP 17655695A JP H098435 A JPH098435 A JP H098435A
- Authority
- JP
- Japan
- Prior art keywords
- sealing element
- base plate
- mounting base
- mounting
- inclined surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
Landscapes
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】
【目的】 搭載される回路基板表面でのキャン封止素子
の占有面積が小さく、プリント配線基板の面方向寸法が
短くなる実装台座板構造を得るにある。
【構成】 キャン封止素子２のリードピン２ｄを受け入
れるスルーホール１ａが形成されたキャン封止素子の実
装台座板において、前記キャン封止素子２の素子基板２
ｂと略等大・等形状の絶縁性レジンの積層体からなり、
前記実装面１ｂから側面１ｆに向かって連続された傾斜
面１ｉ，１ｋを端部に形成し、前記スルーホール１ａと
導通状態にあるハンダフィレットＸ1 ，Ｘ2形成用の実
装台座板のランド部１ｊを同傾斜面１ｉ，１ｋの表面に
形成したキャン封止素子の実装台座板。
(57) [Abstract] [Purpose] An object is to obtain a mounting pedestal board structure in which the can sealing element occupies a small area on the surface of a circuit board to be mounted and the planar dimension of the printed wiring board becomes short. A mounting base plate of a can sealing element having a through hole 1a for receiving a lead pin 2d of the can sealing element 2, wherein an element substrate 2 of the can sealing element 2 is provided.
b is composed of a laminated body of insulating resin of approximately the same size and shape,
Land portions of the mounting pedestal plate for forming the solder fillets X 1 and X 2 in which the inclined surfaces 1i and 1k that are continuous from the mounting surface 1b toward the side surface 1f are formed at the ends and are in conduction with the through holes 1a. A mounting base plate for a can sealing element in which 1j is formed on the surfaces of the inclined surfaces 1i and 1k.
Description
【０００１】[0001]
【産業上の利用分野】本発明はプリント配線基板等の回
路基板に対するキャン封止素子の実装構造に関し、特
に、キャン封止素子の平面搭載に用いる実装台座板の構
造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting structure of a can sealing element on a circuit board such as a printed wiring board, and more particularly to a mounting base plate used for mounting the can sealing element on a plane.
【０００２】[0002]
【従来の技術】周知のように、例えば表面弾性波素子や
水晶振動子のような電気素子においては、コスト等の点
から、素子チップをキャン中に封入した構造が採用され
る場合があるが、このようなキャン封止素子をプリント
配線基板に搭載するには、図５及び図６に示すような実
装台座板１を用いる。つまり、図５及び図６のキャン封
止素子２は、素子チップ２ａを金属性のステム２ｂに固
定し、同ステム２ｂと封止キャン２ｃで覆われた状態を
もつが、このキャン封止素子２のリードピン２ｄはプリ
ント配線基板３に対する面接合のため、いわゆるガラス
エポキシ樹脂等の積層基板材からなる実装台座板１のス
ルーホール１ａに挿入される。2. Description of the Related Art As is well known, an electric element such as a surface acoustic wave element or a crystal oscillator may have a structure in which an element chip is enclosed in a can in view of cost and the like. To mount such a can-sealing element on a printed wiring board, a mounting base plate 1 as shown in FIGS. 5 and 6 is used. That is, the can sealing element 2 of FIGS. 5 and 6 has a state in which the element chip 2a is fixed to the metallic stem 2b and is covered with the stem 2b and the sealing can 2c. The two lead pins 2d are inserted into the through holes 1a of the mounting base plate 1 made of a laminated substrate material such as so-called glass epoxy resin for surface bonding to the printed wiring board 3.
【０００３】即ち、実装台座板１の各スルーホール１ａ
の内面には、プリント配線基板３に対面される実装面１
ｂのスルーホールランド１ｃに連続された導体層１ｄが
フォトエッチング手法等で形成され、各スルーホールラ
ンド１ｃは、プリント配線基板３のプリント配線基板の
ランド３ａに確実にハンダ接合できるように、実装台座
板１の端部に形成するスルーホールの一部で構成される
切欠き１ｅに位置する実装台座板のランド１ｆと導通状
態におかれる。That is, each through hole 1a of the mounting base plate 1
The inner surface of the mounting surface 1 facing the printed wiring board 3
The conductor layer 1d continuous to the through hole land 1c of FIG. 2B is formed by a photoetching method or the like, and each through hole land 1c is mounted so that it can be securely soldered to the land 3a of the printed wiring board of the printed wiring board 3. The pedestal plate 1 is placed in electrical connection with the land 1f of the mounting pedestal plate located in the notch 1e formed by a part of the through hole formed at the end of the pedestal plate 1.
【０００４】[0004]
【発明が解決しようとする課題】ところで、前述したよ
うな従来の実装台座板１では、実装時にハンダフィレッ
トＸ（図６図示）を形成させるための、切欠き１ｅ内に
ある実装台座板のランド部１ｆをもつ。同実装台座板の
ランド部１ｆをキャン封止素子２のステム２ｂに近付け
ると、組み合せのズレで接触したり、ハンダフィレット
Ｘにより実装台座板のランド部１ｆとステム２ｂが短絡
するおそれがある。このため、従来の実装台座板１にお
いては、実装台座板１の長さｈ1をキャン封止素子２の
外形寸法ｈ2よりも充分に長くし、実装台座板１の切欠
き１ｅ及び実装台座板のランド部１ｆの位置を封止キャ
ン２ｃから離間させる構成を採用せざるを得なかった。In the conventional mounting base plate 1 as described above, the land of the mounting base plate in the notch 1e for forming the solder fillet X (shown in FIG. 6) at the time of mounting. It has a part 1f. When the land portion 1f of the mounting base plate is brought close to the stem 2b of the can sealing element 2, there is a risk of contact due to misalignment or a short-circuit between the land portion 1f of the mounting base plate and the stem 2b due to the solder fillet X. Therefore, in the conventional mounting base plate 1, the length h 1 of the mounting base plate 1 is made sufficiently longer than the outer dimension h 2 of the can sealing element 2, and the notch 1e of the mounting base plate 1 and the mounting base 1 are mounted. There has been no choice but to adopt a configuration in which the position of the land portion 1f of the plate is separated from the sealing can 2c.
【０００５】したがって、従来のキャン封止素子２の実
装構造では、キャン封止素子２の外形寸法ｈ2よりも長
さｈ1の大きな実装台座板１を用いるから、プリント配
線基板３の表面でのキャン封止素子２の占有面積が大き
くなり、プリント配線基板３の実装密度が低下し、プリ
ント配線基板３や全体機器が大型化してしまう不都合が
あった。また、このような実装密度低下の問題は、図６
から理解されるように、前述した実装台座板のランド部
１ｆとプリント配線基板のランド３ａとの間に形成され
るハンダフィレットＸの面方向寸法Ｈ1が長く、ハンダ
フィレットＸが切欠き１ｅ外にはみ出すことによって
も、より大きくなる。Therefore, in the conventional mounting structure of the can-sealing element 2, the mounting base plate 1 having a length h 1 larger than the outer dimension h 2 of the can-sealing element 2 is used. However, the area occupied by the can sealing element 2 becomes large, the mounting density of the printed wiring board 3 is lowered, and the printed wiring board 3 and the entire device are increased in size. In addition, the problem of such a reduction in mounting density is shown in FIG.
As can be understood from the above, the surface dimension H 1 of the solder fillet X formed between the land portion 1f of the mounting base plate and the land 3a of the printed wiring board is long, and the solder fillet X is outside the notch 1e. It also becomes larger by protruding.
【０００６】本発明の目的は、以上に述べたような従来
のキャン封止素子の実装台座板の問題に鑑み、搭載され
る回路基板表面でのキャン封止素子の占有面積が小さ
く、プリント配線基板の面方向寸法が短くなる実装台座
板構造を得るにある。In view of the problems of the conventional mounting base plate for a can-sealing element as described above, the object of the present invention is that the area occupied by the can-sealing element on the surface of the circuit board to be mounted is small, and the printed wiring is small. This is to obtain a mounting pedestal structure in which the surface dimension of the substrate is shortened.
【０００７】[0007]
【課題を解決するための手段】この目的を達成するた
め、本発明は、キャン封止素子のリードピンを受け入れ
るスルーホールが形成されたキャン封止素子の実装台座
板において、前記キャン封止素子の素子基板と略等大・
等形状のレジンの成形体からなり、前記実装面から側面
に向かって連続された傾斜面を端部に形成し、前記スル
ホールと導通状態にあるハンダフィレット形成用の実装
台座板のランド部を同傾斜面の表面に形成したキャン封
止素子の実装台座板を提案するものである。また、後述
する本発明の好ましい実施例においては、前記傾斜面
は、前記端部のコーナ部に形成された円弧状傾斜面、及
び、前記端部のコーナ部に形成された直線状傾斜面であ
るとして具体化される。In order to achieve this object, the present invention provides a mounting base plate for a can sealing element in which a through hole for receiving a lead pin of the can sealing element is formed. About the same size as the element substrate
It is composed of a molded body of resin of the same shape, and has an inclined surface that is continuous from the mounting surface toward the side surface at the end, and the land portion of the mounting pedestal plate for forming the solder fillet that is in conduction with the through hole is the same. The mounting base plate of the can sealing element formed on the surface of the inclined surface is proposed. Further, in a preferred embodiment of the present invention described later, the inclined surface is an arcuate inclined surface formed in the corner portion of the end portion, and a linear inclined surface formed in the corner portion of the end portion. It is embodied as being.
【０００８】[0008]
【実施例】以下、図１から図４について本発明の実施例
の詳細を説明する。図１から図３は本発明の第１実施例
によるキャン封止素子の実装台座板を示し、図示するキ
ャン封止素子２は、従来と同様に、素子チップ２ａを金
属性のステム２ｂに固定し、同ステム２ｂを封止キャン
２ｃで覆った構造をもつもので、このキャン封止素子２
のリードピン２ｄはプリント配線基板３に対する面接合
のために、例えば芳香族系ポリエステル等の耐熱・絶縁
性レジンの成形体からなる実装台座板１Ａのスルーホー
ル１ａに挿入されることになる。同実装台座板１Ａの素
材としては、芳香属系ポリエステルである所謂液晶ポリ
マー樹脂であればよいけれども、導体パターン形成の観
点から無電解メッキを可能にする無機材料を添加したコ
ンパウンド・液晶ポリマー樹脂が最適である。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below in detail with reference to FIGS. 1 to 3 show a mounting base plate of a can sealing element according to a first embodiment of the present invention. The can sealing element 2 shown in the figure fixes an element chip 2a to a metallic stem 2b as in the conventional case. The can sealing element 2 has a structure in which the stem 2b is covered with a sealing can 2c.
The lead pin 2d is inserted into the through hole 1a of the mounting base plate 1A made of a molded body of a heat resistant / insulating resin such as aromatic polyester for surface bonding to the printed wiring board 3. The material of the mounting base plate 1A may be a so-called liquid crystal polymer resin which is an aromatic polyester, but a compound liquid crystal polymer resin added with an inorganic material that enables electroless plating from the viewpoint of conductor pattern formation. Optimal.
【０００９】また、実装台座板１Ａの各スルーホール１
ａの内面にはプリント配線基板３に対面される実装面１
ｂのスルーホールランド１ｃに連続された導体層１ｄが
フォトエッチング手法等で形成されるが、留意すべき点
は、同実装台座板１Ａの長さｈ3はキャン封止素子２の
対応外形寸法と略等しい寸法にされている点にある。即
ち、実装台座板１Ａの端部コーナ部には複数の凹所１ｈ
が形成され、実装面１ｂから側面１ｇを連続させるこの
凹所１ｈの円弧状傾斜面１ｉ（傾斜面）には各スルーホ
ールランド１ｃと導通状態におかれた実装台座板のラン
ド部１ｊとして形成される。Further, each through hole 1 of the mounting base plate 1A
A mounting surface 1 facing the printed wiring board 3 is provided on the inner surface of a.
The conductor layer 1d connected to the through-hole land 1c of FIG. 2b is formed by a photo-etching method or the like, but the point to be noted is that the length h 3 of the mounting base plate 1A is the corresponding external dimension of the can sealing element 2. The point is that the dimensions are almost equal to. That is, a plurality of recesses 1h are formed at the end corners of the mounting base plate 1A.
Is formed, and is formed as a land portion 1j of the mounting base plate that is in conduction with each through-hole land 1c on the arc-shaped inclined surface 1i (inclined surface) of the recess 1h that connects the mounting surface 1b to the side surface 1g. To be done.
【００１０】これらのスルーホールランド１ｃ、導体パ
ターン１ｃ’及び実装台座板のランド部１ｊを形成する
には、実装台座板１Ａとなるマザー基板全体に導電金属
層を全面メッキし、同スルーホールランド１ｃ、導体パ
ターン１ｃ’及び実装台座板のランド部１ｊをフォトエ
ッチング手法で残し、必要箇所に絶縁性レジスト被膜を
施した後、ダイシング加工で必要な大きさに裁断するこ
とで簡単に製造できる。To form the through hole land 1c, the conductor pattern 1c 'and the land portion 1j of the mounting base plate, a conductive metal layer is entirely plated on the entire mother substrate to be the mounting base plate 1A, and the through hole land is formed. 1c, the conductor pattern 1c ', and the land portion 1j of the mounting pedestal plate are left by a photoetching method, an insulating resist film is applied on a required portion, and then the wafer is cut into a required size by a dicing process, so that it can be easily manufactured.
【００１１】図３は前述した本発明の第１実施例による
実装台座板１Ａを用いてキャン封止素子２をプリント配
線基板３に実装した状態を示し、同図から理解されるよ
うに、この場合、ハンダフィレットＸ1は凹所１ｈの内
部にある円弧状傾斜面１ｉに沿って形成される。このた
め、キャン封止素子２のステム２ｂとハンダフィレット
Ｘ1が近接した状態にあっても、ハンダフィレットＸ1の
表面張力の関係で、ハンダフィレットＸ1でステム２ｂ
が短絡されるおそれはなくなる。また、同ハンダフィレ
ットＸ1は凹所１ｈの外部へ張り出すけれども、ハンダ
フィレットＸ1の一部が台座基板下部で構成されるので
同張り出し量Ｈ2は従来の面方向寸法Ｈ1よりもはるかに
短くなるため、結果として、プリント配線基板３の表面
でのキャン封止素子２の占有面積は少なくなり、プリン
ト配線基板３の表面での実装密度の向上を図ることがで
きる。FIG. 3 shows a state in which the can sealing element 2 is mounted on the printed wiring board 3 by using the mounting base plate 1A according to the first embodiment of the present invention described above. In this case, the solder fillet X 1 is formed along the arcuate inclined surface 1i inside the recess 1h. Therefore, even if the stem 2b of the can sealing element 2 and the solder fillet X 1 are in close proximity to each other, due to the surface tension of the solder fillet X 1 , the stem 2b does not contact the solder fillet X 1.
Is no longer short-circuited. Further, although the solder fillet X 1 is protruding to the outside of the recess 1h, the overhang amount H 2 since a part of the solder fillet X 1 is composed of a base substrate bottom is much than conventional surface direction dimension H 1 As a result, the area occupied by the can sealing elements 2 on the surface of the printed wiring board 3 is reduced, and the mounting density on the surface of the printed wiring board 3 can be improved.
【００１２】本発明の第２実施例を示す図４は図３相当
拡大断面図であり、図３と同一構造部分については同一
符号を付して示してある。第２実施例の特徴は、傾斜面
として説明された実装台座板１Ａの円弧状傾斜面１ｉ
が、実装面１ｂと側面１ｇとを連絡する実装台座板１Ｂ
の直線状傾斜面１ｋとして変形されている点にある。換
言すると、このような直線状傾斜面１ｋによっても、凹
所１ｈの内部に確実にハンダフィレットＸ2を形成でき
るばかりでなく、同ハンダフィレットＸ2の張り出し量
Ｈ3は従来の面方向寸法Ｈ1よりもはるかに短くなる。FIG. 4 showing a second embodiment of the present invention is an enlarged sectional view corresponding to FIG. 3, and the same structural parts as those in FIG. 3 are designated by the same reference numerals. The feature of the second embodiment is that the mounting base plate 1A described as an inclined surface has an arcuate inclined surface 1i.
However, the mounting pedestal plate 1B that connects the mounting surface 1b and the side surface 1g.
Is a point which is deformed as the linear inclined surface 1k. In other words, even by such a straight inclined surface 1k, not only can form a reliable solder fillet X 2 in the interior of the recess 1h, the amount of projection H 3 of the solder fillet X 2 are conventional surface direction dimension H Much shorter than 1 .
【００１３】[0013]
【発明の効果】以上の説明から明らかなように、本発明
によれば、キャン封止素子と略等しい長さの実装台座板
でプリント配線基板等の回路基板にキャン封止素子を面
実装できるため、回路基板表面でのキャン封止素子の占
有面積が小さくなり、回路基板の実装密度を高めて電子
機器の小型を実現できる。また、本発明によるこの効果
は、下向きの傾斜面の表面に形成されるハンダフィレッ
トの張り出し量の短縮によっても増長される。As is apparent from the above description, according to the present invention, the can sealing element can be surface-mounted on the circuit board such as the printed wiring board by the mounting pedestal plate having substantially the same length as the can sealing element. Therefore, the area occupied by the can sealing element on the surface of the circuit board becomes small, and the packaging density of the circuit board can be increased, and the electronic device can be made compact. Further, this effect of the present invention is also enhanced by shortening the amount of protrusion of the solder fillet formed on the surface of the downward inclined surface.
【図１】本発明の第１実施例による実装台座板とキャン
封止素子との関係を示す分解断面図である。FIG. 1 is an exploded sectional view showing a relationship between a mounting base plate and a can sealing element according to a first embodiment of the present invention.
【図２】下方から見た同実装台座板端部の拡大斜視図で
ある。FIG. 2 is an enlarged perspective view of an end portion of the mounting base plate viewed from below.
【図３】同実装台座板端部の拡大断面図である。FIG. 3 is an enlarged cross-sectional view of an end portion of the mounting base plate.
【図４】本発明の第２実施例による実装台座板端部の図
３相当拡大断面図である。FIG. 4 is an enlarged cross-sectional view corresponding to FIG. 3 of an end portion of a mounting base plate according to a second embodiment of the present invention.
【図５】従来の実装台座板とキャン封止素子との関係を
示す分解断面図である。FIG. 5 is an exploded cross-sectional view showing a relationship between a conventional mounting base plate and a can sealing element.
【図６】同実装台座板端部の拡大断面図である。FIG. 6 is an enlarged cross-sectional view of an end portion of the mounting base plate.
１Ａ，１Ｂ 実装台座板 １ａ スルーホール １ｂ 実装面 １ｃ スルーホールランド １ｆ，１ｊ 実装台座板のランド １ｇ 側面 １ｉ 円弧状傾斜面 １ｋ 直線状傾斜面 ２ キャン封止素子 ２ａ 素子チップ ２ｂ 素子基板 ２ｃ 封止キャン ２ｄ リードピン ３ プリント配線基板 ３ａ プリント配線基板のランド ３ｂ レジスト Ｘ1 ，Ｘ2 ハンダフィレット1A, 1B Mounting base plate 1a Through hole 1b Mounting surface 1c Through hole land 1f, 1j Mounting base plate land 1g Side surface 1i Arc-shaped inclined surface 1k Linear inclined surface 2 Can sealing element 2a Element chip 2b Element substrate 2c Sealing Can 2d lead pin 3 printed wiring board 3a land of printed wiring board 3b resist X 1 , X 2 solder fillet
Claims (3)
るスルーホールが形成されたキャン封止素子の実装台座
板において、前記キャン封止素子の素子基板と略等大・
等形状の絶縁性レジンの成形体からなり、前記実装面か
ら側面に向かって連続された傾斜面を端部に形成し、前
記スルーホールと導通状態にあるハンダフィレット形成
用の実装台座板のランド部を同傾斜面の表面に形成した
ことを特徴とするキャン封止素子の実装台座板。1. A mounting base plate for a can-sealing element having a through hole for receiving a lead pin of the can-sealing element, wherein the mounting base plate has a size substantially equal to that of the element substrate of the can-sealing element.
A land of a mounting pedestal plate for forming a solder fillet, which is formed of a molded body of an insulating resin having the same shape and has an inclined surface continuous from the mounting surface toward the side surface at the end and is in conduction with the through hole. A mounting base plate for a can-sealing element, characterized in that the portion is formed on the surface of the inclined surface.
された円弧状傾斜面であることを特徴とする請求項１記
載のキャン封止素子の実装台座板。2. The mounting base plate for a can sealing element according to claim 1, wherein the inclined surface is an arcuate inclined surface formed in a corner portion of the end portion.
された直線状傾斜面であることを特徴とする請求項１記
載のキャン封止素子の実装台座板。3. The mounting base plate for a can sealing element according to claim 1, wherein the inclined surface is a linear inclined surface formed in a corner portion of the end portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7176556A JPH098435A (en) | 1995-06-20 | 1995-06-20 | Mounting base plate for can-sealing element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7176556A JPH098435A (en) | 1995-06-20 | 1995-06-20 | Mounting base plate for can-sealing element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH098435A true JPH098435A (en) | 1997-01-10 |
Family
ID=16015651
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7176556A Pending JPH098435A (en) | 1995-06-20 | 1995-06-20 | Mounting base plate for can-sealing element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH098435A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015041745A (en) * | 2013-08-23 | 2015-03-02 | 北川工業株式会社 | Noise countermeasure component |
-
1995
- 1995-06-20 JP JP7176556A patent/JPH098435A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015041745A (en) * | 2013-08-23 | 2015-03-02 | 北川工業株式会社 | Noise countermeasure component |
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