JPH0992365A - Pitch conversion connector, manufacturing method thereof, and connector device - Google Patents

Abstract

(57) Abstract: A front surface electrode element having a minute arrangement pitch and a back surface electrode element having a different arrangement pitch in one direction from the front surface electrode element are provided, and the front surface electrode element and the back surface electrode element are surely electrically connected. Has a short-circuiting wire that connects electrically, and has high reliability,
Provided are a pitch conversion connector which is easy to manufacture, a manufacturing method thereof, and a connector device. SOLUTION: A connector is composed of a large number of insulating plate elements integrally laminated, and has a plate-shaped substrate body having flat front and back surfaces formed along the lamination direction, and insulating bodies adjacent to each other in the substrate body. Formed on at least one plate surface forming the interface in the plate element, extending in the thickness direction of the substrate body and being separated from each other in the interface direction with one end surface and the other end surface exposed on the front surface and the back surface of the substrate body, respectively. A wiring path pattern having a plurality of wiring paths composed of metal film strips arranged side by side, and an arrangement pitch of one end surface of the wiring path in the interface direction is smaller than an arrangement pitch of the other end surface.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pitch conversion connector used for electrically connecting a circuit board and a tester, a method for manufacturing the same, and a connector device including the pitch conversion connector.

[0002]

2. Description of the Related Art Generally, in a circuit board such as a printed circuit board, as shown in FIG. 22, a functional element region 91 in which functional elements are formed with a high degree of integration is provided in a central portion of a circuit board 90. A lead electrode region 93 in which a large number of lead electrodes 92 for the functional element region 91 are arranged in a grid pattern is formed on the peripheral portion thereof. At present, the number of lead electrodes in the lead electrode region 93 tends to further increase with the increase in the degree of integration of the functional element region 91, resulting in higher density.

In order to inspect the electrical characteristics of such a circuit board, an electrical continuity test device called a tester is generally used, and normally, a circuit to be inspected through an electrical connector device. The substrate is electrically connected to the tester. Here, the electrical connector device is made of an insulating substrate, has a connecting electrode on the surface arranged in a layout pattern corresponding to the electrode to be inspected of the circuit board to be inspected, and is usually a standard grid corresponding to the tester. A pitch conversion connector having a pattern of terminal electrodes arranged at dot positions on the back surface is used.

Therefore, in the pitch conversion connector, it is necessary to form the connection electrodes with a small arrangement pitch corresponding to the arrangement pitch of the electrodes to be inspected on the circuit board to be inspected. Conventionally, when forming an electrode pattern with a small arrangement pitch, it is known that, for example, photolithography can reliably form a highly reliable pattern. Then, a connection electrode is formed on the surface of the pitch conversion connector by photolithography.

However, if the electrodes to be inspected on the circuit board to be inspected are arranged at the positions on the lattice points and the arrangement pitch is a fine pitch such as 0.3 mm or less, Although it is possible to form a corresponding fine pitch connection electrode on the front surface of the pitch conversion connector, it is necessary to electrically connect the connection electrode to one of the terminal electrodes on the back surface. However, it is extremely difficult to form a short-circuiting wire that extends in the thickness direction of the pitch conversion connector in the thickness direction and extends so as to spread two-dimensionally in the plane direction.

In order to form such short-circuit wiring,
Conventionally, a wiring path is formed, for example, by photolithography on both sides and each interface of a stack formed by stacking a large number of insulating plates, and through holes or via holes formed by penetrating each insulating plate are used. Then, it is known to form a penetrating short-circuit portion that extends through each insulating plate in the thickness direction.

However, in such a structure, there are great restrictions on the formation of the wiring path extending in the thickness direction of the pitch converting connector, and it is possible to form the minute penetrating short-circuit portion itself with high reliability at a minute arrangement pitch. Can not. For this reason, in practice, the pitch conversion connector for effectively inspecting the electrodes to be inspected with a fine pitch formed on the inspection target circuit board has an extremely complicated structure and is very expensive. Become.

[0008]

SUMMARY OF THE INVENTION The present invention has been made based on the above circumstances, and a first object thereof is to have a surface electrode element having an extremely fine arrangement pitch on the surface, A short-circuit wire extending in the thickness direction, which has the front surface electrode element and a back surface electrode element having a different arrangement pitch in one direction on the back surface, and surely electrically connects the corresponding front surface electrode element and the back surface electrode element. Have
An object of the present invention is to provide a pitch conversion connector which has high reliability and can be easily manufactured.

A second object of the present invention is to provide a surface electrode element having an extremely minute arrangement pitch on the surface in the method for manufacturing the pitch conversion connector described above, and to provide the surface electrode element and its one direction. A pitch conversion connector having a short-circuiting wire extending in the thickness direction capable of forming back surface electrode elements having different arrangement pitches on the back surface and securely electrically connecting the corresponding front surface electrode element and the back surface electrode It is an object of the present invention to provide a method capable of easily manufacturing.

A third object of the present invention is to provide the above-mentioned pitch converting connector, to have a connecting electrode formed on the front surface at a required minute arrangement pitch, and to arrange it at a standard lattice point position on the back surface. The present invention provides a connector device for pitch conversion, which has a formed terminal electrode and is suitable for inspecting a circuit board.

[0011]

A pitch conversion connector of the present invention comprises a laminate in which a large number of rectangular insulating plate elements are integrally laminated, and has a flat surface along the stacking direction of the insulating plate elements. A plate-shaped substrate body having a back surface formed,
Formed on at least one plate surface forming an interface between insulating plate elements adjacent to each other in this substrate body,
A plurality of wiring paths each formed of a metal film strip extending in the thickness direction of the substrate body and having one end surface and the other end surface thereof exposed on the front surface and the back surface of the substrate body, respectively, and arranged side by side in the interface direction. Consisting of a wiring pattern,
The arrangement pitch of one end face of each wiring path on the front surface of the substrate body in the interface direction is smaller than the arrangement pitch of the other end surface of each wiring passage on the back surface of the substrate body.

A method of manufacturing a pitch conversion connector according to the present invention is a method of manufacturing the pitch conversion connector described above, wherein a wiring path pattern having a plurality of wiring paths made of metal film strips arranged in one direction and spaced from each other. A plurality of plate-shaped insulating plate element forming materials having a surface formed with are stacked in the thickness direction to manufacture a laminated body, and the laminated body is cut flat along the stacking direction of the insulating plate element forming materials. By cutting so as to form a surface, a front surface and a back surface are formed by the cut surface, and one end surface and the other end surface of each wiring path are exposed on the front surface and the back surface, respectively.

The connector device of the present invention comprises the above pitch conversion connector, one connection wiring layer provided on the surface of the pitch conversion connector, and the other connection wiring layer provided on the lower surface of the pitch conversion connector. Wherein the one connection wiring layer is formed on its surface,
A plurality of connection electrodes arranged corresponding to one end surface of each wiring portion on the surface of the pitch conversion connector and electrically connecting the connection electrodes to one end surface of a wiring path corresponding to the connection electrode; And a short circuit portion extending in the thickness direction of the connection wiring layer, the other connection wiring layer is formed on the surface thereof, the terminal electrode arranged on a standard grid point, and the wiring path in the pitch conversion connector. And an in-layer wiring portion including a short-circuit portion extending in the thickness direction of the other connection wiring layer for electrically connecting the other end portion to any one of the terminal electrodes.

[0014]

BEST MODE FOR CARRYING OUT THE INVENTION The pitch conversion connector of the present invention will be described in detail below. FIG. 1 is an explanatory perspective view showing a partially broken structure of an example of a pitch conversion connector of the present invention. This pitch conversion connector 10
Is a plate-like body made of a laminate in which a large number of rectangular insulating plate elements 12 (the length direction of which is the Y direction and the width direction thereof is the Z direction) are stacked in the thickness direction (X direction in the drawing). Substrate body 1
1 and the wiring path pattern 20 having the same shape formed on the same side surface of the plate surface forming the interface between the adjacent insulating plate elements 12 in the substrate body 11. Each wiring path pattern 20 is formed by arranging a plurality of wiring paths 21 each made of a metal film strip extending in the Z direction so as to be electrically separated from each other in the Y direction.

In the substrate body 11, each insulating plate element 1
A flat front surface 13 and a back surface 1 extending along the stacking direction X of the insulating plate element 12 due to the assembly of the two lengthwise side surfaces.
4 are formed. The substrate body 11 may be a hexahedron having a flat surface and a back surface, and the flat surface and the back surface may not be the largest of the surfaces of the hexahedron. The material of the insulating plate element 12 that constitutes the substrate body 11 is preferably a heat-resistant material having high dimensional stability, and various resins can be used. For example, glass fiber reinforced epoxy resin is preferably used. You can

Each of the wiring paths 21 in the wiring path pattern 20 has one end surface 22 exposed on the front surface 13 of the substrate body 11 and the other end surface 23 exposed on the back surface 14 of the substrate body 11. One end surface 22 of each wiring path 21 forms a front surface electrode element, and the other end surface 23 of each wiring path 21 forms a back surface electrode element. That is, each wiring path 21 is in a state where both ends thereof extend to both end surfaces in the Z direction on the plate surface of the insulating plate element 12, and one end surface 22 and the other end surface 2 of each wiring path 21 are formed.
3 is a state in which the insulating plate element 12 is integrally connected by a connecting portion 24 extending in the Z direction, and the connecting portion 24 in each wiring path 21 is located at the center of the insulating plate element 12. It is assumed that the direction going from Y to both sides in the Y direction extends to a state in which the angle of inclination expanding outward increases.

The surface electrode element formed by the one end surface 22 of each wiring path 21 corresponds to the pattern of the electrode to be inspected on the circuit board to be inspected when the pitch conversion connector is used for inspecting the circuit board. The pitch p1 in the interface direction of the one end surface 22 of the wiring path 21, that is, the pitch p1 in the Y direction, which is arranged on the grid points, corresponds to the pitch p2 in the Y direction of the corresponding back surface electrode element by the other end surface 23 of the wiring path 21. It is in a smaller state.

As a material forming each wiring path 21, for example, a conductive metal material such as copper is used.

In the above, the thickness and the number of the insulating plate elements 12 are appropriately selected according to the number and the arrangement pitch of the electrodes of the circuit board to be inspected. For example, the thickness of the insulating plate element 12 is 0. 1 to 0.5 mm, and the number of insulating plate elements 12 is 7 to 50. The thickness of the metal film forming each wiring path 21 is, for example, 9 to 50 μm,
The width of each wiring path 21 is, for example, 40 to 300 μm.

With this structure, the wiring path pattern 20 can be formed in an accurate shape by, for example, photolithography, so that each wiring path 21 has one end face 2
Even if the arrangement pitch of 2 is minute, the electrical connection state of the connection portion 24 with the other end surface 23 can be made reliable and have extremely high reliability. Moreover, since the arrangement pitch in the X direction basically follows the thickness of the insulating plate element 12, it is also easy to make it minute. Therefore, in the obtained pitch conversion connector, it is possible to form a surface electrode element having a fine pitch on the surface and also to form a back surface electrode element having a different arrangement pitch in one direction from the surface electrode element on the back surface. Moreover, the short-circuit wiring extending in the thickness direction that electrically connects the corresponding front electrode element and back electrode element can be made extremely highly reliable.

In the above example, the wiring path pattern 20
Are formed in the same shape on the plate surfaces facing the same side of each stacked insulating plate element 12, but on both sides of one of the stacked insulating plate elements in a specific thickness direction. It is also possible to form the wiring path pattern in a form in which the projected images match and not to form the wiring path pattern on the insulating plate element interposed therebetween.

Further, it is not necessary that all the wiring path patterns 20 have the same shape. For example, if the wiring path patterns 20 at intervals are the same shape and the adjacent wiring path patterns 20 have different shapes. It is possible to combine a plurality of types of wiring path patterns such as ones. In this case, the arrangement pitch in the X direction and the Y direction can be adjusted, so that the degree of freedom in forming the inner layer wiring portion of the connection wiring layer described later can be increased.

Next, a method for manufacturing the pitch conversion connector of the present invention will be described. As shown in FIG. 2, for example, a required number of plate-shaped insulating plate element forming materials 15 each having a metal thin film 25 made of copper formed on both surfaces thereof are prepared. And
By patterning the thin metal layer 25 of each insulating plate element forming material 15 by, for example, a photoetching method,
As shown in FIG. 3, on both surfaces of each insulating plate element forming material 15,
The wiring path pattern 20 including the plurality of wiring paths 21 including the one end face 22, the connecting portion 24, and the other end face 23 in the state described with reference to FIG. 1 is formed. For each insulating plate element forming material 15, for example, by a numerically controlled drilling device,
A plurality of guide holes 16 that penetrate the insulating plate element forming material 15 are formed in advance, and the wiring path pattern 20 is formed at a required position with reference to the guide holes 16. The wiring path patterns 20 on both surfaces are formed in such a manner that projected images in a specific thickness direction match each other.

Next, as shown in FIG. 4, a required number of plate-like adhesive insulating plate element forming materials 17 made of thermosetting adhesive resin are prepared, and each adhesive insulating plate element forming material 17 is provided in each adhesive insulating plate element forming material 17. ,
For example, a numerical control type drilling device forms a plurality of guide holes 18 penetrating the adhesive insulating plate element forming material 17.

Then, as shown in FIG. 5, the insulating plate element forming material 15 and the adhesive insulating plate element forming material 17 are positioned in a state where the guide pins 26 are inserted into the guide holes 16 and 18. , The pressure plates 27 and 28 are alternately stacked, and the whole of them is pressed and bonded in the stacking direction under heating, so that a plurality of insulating plate element forming materials 15 and a plurality of insulating plate element forming materials 15 are formed as shown in FIG. And the adhesive insulating plate element forming material 17 are alternately laminated integrally to form an intermediate laminated body 19. On both sides of the intermediate laminated body 19 in the stacking direction, ordinary insulating plate elements having no wiring path pattern formed thereon are arranged via an adhesive insulating plate element forming material.

Then, the intermediate laminate 19 is cut by, for example, a numerical control type router device so that two cut surfaces C1 and C2 extending in the stacking direction are formed.
The cut surface C1 forms a flat surface, and the cut surface C
2 forms a flat back surface, and by selecting the levels in the Z direction of these cut surfaces C1 and C2, the one end surface 22 and the other end surface 23 of the wiring path 21 are exposed to the front surface and the back surface, respectively. The electrode element and the back surface electrode element are formed, and thereby the pitch conversion connector having the configuration shown in FIG. 1 is manufactured.

According to such a manufacturing method, the pitch conversion connector having the above-described structure can be reliably and extremely easily manufactured, and the one end surface 22 and the other end surface of the wiring path 21 constituting the electrode terminal are manufactured. Although 23 has a very small cross-sectional area, it can be surely exposed on the front surface and the back surface, and the front surface electrode element and the back surface electrode element can be reliably formed.

Next, the connector device of the present invention will be described in detail. FIG. 7 is an explanatory cross-sectional view showing the configuration of an example of the connector device of the present invention. This connector device is basically provided with the pitch conversion connector 10 having the configuration shown in FIG. 1, the upper connection wiring layer 30 provided on the upper surface of the pitch conversion connector 10, and the lower surface of the pitch conversion connector 10. , The lower connection wiring layer 40 having a sectional area considerably larger than the sectional area of the pitch conversion connector 10. In the illustrated example, in order to fix and support the pitch conversion connector 10 and the second connection wiring layer 40, the contour shape of the outer shape conforms to the contour shape of the second connection wiring layer 40, and the contour shape of the pitch conversion connector 10 is centered. A plate-shaped support frame member 35 having a through hole having a shape conforming to the above is provided in a state of being fitted to the lower portion of the pitch conversion connector 10 and being fixed by an adhesive.

Connection electrodes 31 are formed on the upper surface of the upper connection wiring layer 30 at positions on grid points corresponding to the pattern of the electrodes to be inspected of the circuit board to be inspected so as to project from the upper surface. . Then, the wiring path 20 in the connection electrode 31 and the pitch conversion connector 10 is formed by the short-circuit portion 32 extending through the upper connection wiring layer in the thickness direction thereof.
Is electrically connected to the surface electrode element by the one end surface 21.

The lower connection wiring layer 40 is composed of a laminated body of a first insulating layer 41 formed on the lower surface of the pitch conversion connector 10 and a second insulating layer 42 formed on the lower surface of the first insulating layer 41. Has been done.

An inner layer wiring portion 43 having an appropriate pattern is formed on the lower surface of the first insulating layer 41 along a plane perpendicular to the plane of the drawing in the drawing. A short-circuit portion 44 extending through the layer 41 in the thickness direction is connected to the back electrode element by the other end portion 22 of the wiring path 20 in the pitch conversion connector 10.

On the lower surface of the second insulating layer 42, a terminal electrode 45 electrically connected to the tester by an appropriate means is provided at a position on a standard grid point. The terminal electrode 45 and the inner-layer wiring portion 43 are electrically connected to each other by a short-circuit portion 46 that extends through the second insulating layer 42 at an appropriate position in the thickness direction thereof.

As described above, in the above-mentioned connector device, each of the connecting electrodes 31 has the short-circuit portion 32 and the wiring path 2.
0, the short-circuit portion 44, the inner-layer wiring portion 43, and the short-circuit portion 46 are electrically connected to the terminal electrode 45.

In an actual configuration, the electrical connection between the connection electrode 31 and the terminal electrode 45 may be achieved in a manner suitable for the purpose of inspecting the circuit board. Therefore, it is not always necessary that all the connection electrodes 31 and the terminal electrodes are connected in a one-to-one correspondence, and all the terminal electrodes 45, the inner-layer wiring portions 43, the wiring paths 20 and the connection electrodes 31 have various connections. The requested connection state can be realized.

In the above, the surface area of the connection electrodes 31 is, for example, 0.003 to 0.09 mm ² , the arrangement pitch of the connection electrodes 31 is, for example, 0.1 to 0.5 mm, and the adjacent connections are connected. The separation distance between the working electrodes 31 is, for example, 0.05 to 0.4 mm. The surface area of the terminal electrodes 45 is, for example, 0.04 to 1.5 mm ² , and the arrangement pitch of the terminal electrodes 45 is, for example, 0.9 to 2.54 mm.
It is.

According to the above configuration, the upper connection wiring layer 30
The relationship between each of the connection electrodes 31 formed on the upper surface of each of the connection electrodes 31 arranged at a minute pitch and the terminal electrode 45 formed on the lower surface of the lower connection wiring layer 40 depends on the configuration of the wiring path 21 of the pitch conversion connector 10. The pitch in the Y direction is converted, and the inner wiring portion 4 in the lower connection wiring layer 40 is converted.
By 3, the pitch in the X direction and the pitch in the Y direction are converted. Then, the wiring path 21 for this pitch conversion
Since each of the inner layer wiring portion 43 and the inner layer wiring portion 43 can be formed with a large degree of freedom, it is a connector device having a desired electrode arrangement, has connection electrodes with a minute arrangement pitch, and has extremely high reliability. You can easily get what you have.

Further, the surface electrode element and the back surface electrode element themselves have a very small area as described above, but by forming the upper connection wiring layer 30, they are brought into contact with, for example, the electrode to be inspected. The connecting electrode can be formed to have a required contact area. Moreover, since the connecting electrode 31 is independently formed on the upper surface of the upper connecting wiring layer 30, the connecting electrode can be reliably formed at a desired position. Therefore, for example, when the wiring path patterns are formed on both surfaces of the insulating plate elements that are spaced apart from each other,
Compared with the case where the wiring path pattern is formed on the same side plate surface of each insulating plate element, a slight displacement may occur in the pitch in the X direction due to the thickness of the metal film of the wiring path 21. However, the intended connection electrode 3 is not affected by this.
1 can be formed.

In the above example, the upper connection wiring layer 30
By only the short-circuit portion 32 extending through in the thickness direction of
Although the one end face 22 of the wiring path 21 and the connection electrode 31 are connected to each other, two-dimensional wiring can be performed also in the upper connection wiring layer 30, whereby the connection electrode 31 is formed.
Can be formed with an arrangement pattern different from the arrangement pattern of the one end surface 22 of the wiring path 21. In this case, it is possible to form the wiring portion on the lower surface of the upper connection wiring layer 30, but it is preferable to form the inner wiring portion as a two-layer structure like the lower connection wiring layer 40.

In the above connector device, an insulating material layer made of a radiation curable resin is formed on the upper surface of the pitch conversion connector, and the upper surface of the insulating material layer is electrically connected to one end surface of the wiring path in the pitch conversion connector. And the upper connection wiring layer is formed, and an insulating material layer made of a radiation curable resin is formed on the lower surface of the pitch conversion connector and the lower surface of the supporting frame member. An inner wiring part is provided, and on the lower surface of this insulating material layer,
It can be manufactured by forming a terminal electrode electrically connected to the other end surface of the wiring path in the pitch conversion connector to form a lower connection wiring layer.

Hereinafter, a specific method for manufacturing the connector device of the present invention will be described. As shown in FIG. 8, the upper surface of the pitch conversion connector 10 is coated with a curable resin that is cured by the irradiation of radiation to form an upper insulating material layer 36 and the pitch conversion connector 1
The lower insulating material layer 51 is formed on the lower surface of the pitch conversion connector 10 and the lower surface of the support frame member 35 in the same manner as described above, with the lower part of 0 fitted and fixed in the through hole of the support frame member 35. It An epoxy resin adhesive can be used to fix the pitch conversion connector 10 and the support frame member 35.

Thereafter, as shown in FIG. 9, the insulating material layer 36 and the insulating material layer 51 are subjected to photolithography including irradiation with radiation sensitive to the insulating material layer 36 and the insulating material layer 51. Short-circuit forming hole 37 and short-circuit forming hole 52 penetrating each of the layers 51
To form

Next, as shown in FIG. 10, the entire short-circuit portion forming hole 37 and the short-circuit portion forming hole 52 are copper-plated by electroless copper plating or electrolytic copper plating. Thus, the short-circuit portion 32 that extends through the insulating material layer 36 in the thickness direction while being connected to the one end surface 22 of the wiring path 21 is formed, and is connected to the other end surface 23 of the wiring path 21. Thus, the short-circuit portion 44 that extends through the insulating material layer 51 in the thickness direction is formed. Then, by this plating process, the metal thin layer 38 is formed on the entire upper surface of the insulating material layer 36, and the metal thin layer 53 is formed on the lower surface of the insulating material layer 51.

Next, the thin metal layer 38 is polished and removed by, for example, a buffing machine, and gold is plated on the upper end position of the short-circuit portion 32 on the upper surface of the insulating material layer 36, as shown in FIG. The electrodes 31 are formed, thereby forming the upper connection wiring layer 30.

On the other hand, as shown in FIG. 12, a part of the metal thin layer is removed by photoetching the metal thin layer 53 formed by copper plating on the lower surface of the insulating material layer 51. Inner layer wiring part 4 of required pattern
3 is formed, whereby the first insulating layer 41 is formed.

Next, as shown in FIG. 13, the first insulating layer 4
A curable resin that is cured by irradiation with radiation is applied to the lower surface of No. 1 to form an insulating material layer 54, and the insulating material layer 54 is subjected to photolithography by irradiation with radiation that is curable by the curable resin. By this, as shown in FIG. 14, a short-circuit forming hole 55 penetrating the insulating material layer 54 is formed.

Then, as shown in FIG. 15, the short circuit portion forming hole 54 is formed by an electroless copper plating method, an electrolytic copper plating method, or the like.
The inside is copper-plated, thereby forming a short-circuit portion 46 that extends through the insulating material layer 54 in the thickness direction while being connected to the inner layer wiring portion 43. Then, the metal thin layer 56 formed by copper plating on the lower surface of the insulating material layer 54 is polished and removed by, for example, a buffing machine, and the lower end of the short circuit portion 46 on the lower surface of the insulating material layer 54 is removed as shown in FIG. The terminal electrode 45 is formed by gold-plating the position,
As a result, the lower connection wiring layer 40 is formed. Then, if necessary, the upper surface of the upper connection wiring layer 30 and the lower surface of the lower connection wiring layer 40 are polished to remove the excess copper plating layer, whereby the connector device having the configuration shown in FIG. 7 is manufactured. It

FIG. 17 is an explanatory sectional view showing the structure of another example of the connector device of the present invention. In this connector device, similarly to the connector device shown in FIG. 7, the pitch conversion connector 10 and the upper connection wiring layer 3 are formed.
0, the lower connection wiring layer 40 and the support frame member 35 are provided, and the anisotropic conductive elastomer layer 60 is integrally provided on the upper surface of the upper connection wiring layer 30.

In this anisotropic conductive elastomer layer 60, as shown in FIG. 18, a large number of conductive portions 61, each of which is a dense packing of conductive particles P in an insulating elastic polymer substance E, are used as connecting electrodes. The conductive portions 61 adjacent to each other are positioned on the surface 31 and are insulated from each other by the insulating portion 62. In each conductive portion 61, the conductive particles P are oriented so as to be aligned in the thickness direction, and a conductive path extending in the thickness direction is formed. The conductive portion 61 may be a pressed conductive portion whose resistance value is reduced to form a conductive path when pressed and compressed in the thickness direction. On the other hand, in the insulating portion 62, no conductive path is formed in the thickness direction even when pressure is applied.

The filling rate of the conductive particles P in the conductive portion 61 of the anisotropic conductive elastomer layer 60 is 10% by volume or more, preferably 15% by volume or more. When the conductive portion is the pressure conductive portion, when the filling rate of the conductive particles is high, it is preferable in that the desired electrical connection can be reliably achieved even when the pressing force is small. However, if the arrangement pitch of the connection electrodes 31 is small, there is a possibility that sufficient insulation cannot be ensured between the adjacent conductive parts. Therefore, the filling rate of the conductive particles P in the conductive part 61 is 40% by volume or less. Is preferred.

In the illustrated example, on the outer surface of the anisotropic conductive elastomer layer 60, the conductive portion 61 forms a protruding portion protruding from the surface of the insulating portion 62. According to such an example, since the degree of compression due to the pressurization is larger in the conductive portion 61 than in the insulating portion 62, a conductive path having a sufficiently low resistance value is reliably formed in the conductive portion 61, whereby the applied pressure It is possible to reduce the change in resistance value with respect to changes or fluctuations, and as a result, even if the pressure applied to the anisotropic conductive elastomer layer 60 is non-uniform, the conductivity between the conductive portions 61 is reduced. It is possible to prevent the occurrence of variations.

When the conductive portion 61 forms a protrusion in this way, the protrusion height h of the protrusion is the total thickness t of the anisotropic conductive elastomer layer 60 (t = h + d, d is the insulating portion 62).
Is the thickness of. ) Is preferably 8% or more. The total thickness t of the anisotropic conductive elastomer layer 60 is preferably 300% or less of the arrangement pitch p defined as the center-to-center distance of the connecting electrodes 31, that is, t ≦ 3p. By satisfying such a condition, even when the pressure applied to the anisotropic conductive elastomer layer 60 changes, the change in the conductivity of the conductive portion 61 due to the change is suppressed to be sufficiently small. is there.

In the case where the conductive portion 61 forms a protruding portion, it is not always necessary that the entire plane of the protruding portion has conductivity. For example, the peripheral portion of the protruding portion has a conductivity of 20% or less of the arrangement pitch. There may be a non-passage forming portion. Further, the minimum value of the separation distance r between the adjacent conductive portions 61 is preferably 10% or more of the width R of the conductive portions 61. By satisfying such a condition, it is possible to sufficiently avoid the possibility that the conductive portions 61 adjacent to each other electrically contact each other due to the lateral displacement when the protrusion is deformed by being pressed. You can In the above example, the planar shape of the conductive portion 61 can be a rectangular shape having the same width as the connecting electrode 31, but it can be a circular shape having a required area or any other suitable shape.

As the conductive particles of the conductive portion 61, for example, particles of a metal exhibiting magnetism such as nickel, iron and cobalt, particles of an alloy thereof, or gold of these particles,
Those plated with silver, palladium, rhodium, etc.,
Inorganic particles such as non-magnetic metal particles or glass beads or polymer particles plated with a conductive magnetic material such as nickel or cobalt can be used.

In the method described below, nickel, iron,
Alternatively, conductive magnetic particles made of an alloy thereof or the like are used, and gold-plated particles can be preferably used in terms of electrical characteristics such as low contact resistance. Further, particles which are made of a conductive superparamagnetic material can be preferably used because they do not exhibit magnetic hysteresis.

The particle size of the conductive particles is 3 to 200 μm so that the conductive part 61 can be easily deformed under pressure and sufficient electrical contact can be obtained between the conductive particles in the conductive part 61. The thickness is preferably 10 to 100 μm.

As the insulating and elastic polymer substance forming the conductive portion 61, a polymer substance having a crosslinked structure is preferable. Examples of the curable polymer material that can be used to obtain the crosslinked polymer material include silicone rubber, polybutadiene, natural rubber, polyisoprene, styrene-butadiene copolymer rubber, acrylonitrile-butadiene copolymer rubber. , Ethylene-propylene copolymer rubber, urethane rubber, polyester rubber, chloroprene rubber, epichlorohydrin rubber, soft liquid epoxy resin and the like.

Specifically, it is preferable to use a material for a polymer substance which is in a liquid state before the curing treatment and which is integrated with the upper connection wiring layer 30 after the curing treatment in a close contact state or an adhesive state. From such a point of view, examples of the material for the polymer material suitable for the present invention include liquid silicone rubber, liquid urethane rubber, and soft liquid epoxy resin.
Additives such as a silane coupling agent and a titanium coupling agent may be added to the polymer material in order to improve the adhesion to the upper connection wiring layer 30.

The material forming the insulating portion 62 may be the same as or different from the polymer substance forming the conductive portion 61. A unit that holds the bonded state and is integrated is used.

By forming such an insulating portion,
Since the integrity of the anisotropic conductive elastomer layer itself and its integrity to the upper connection wiring layer are surely increased,
The strength of the connector device as a whole is increased, so that excellent durability against repeated compression can be obtained.

In the connector device having the above-mentioned structure, the circuit board to be inspected is arranged on the upper surface of the connector device, the electrodes to be inspected of the circuit board are contacted with the connecting electrodes 31, and the terminal electrodes 45 on the lower surface are arranged. It is connected to the tester via an appropriate connecting means, and is further pressed so that the whole is compressed in the thickness direction. In this state, the conductive portion 61 of the anisotropic conductive elastomer layer 60 of the connector device is in a conductive state, whereby the required electrical connection between the electrode under test and the tester is achieved.

According to the connector device having such a configuration, the electrical connection between the connecting electrode 31 and the electrode to be inspected of the circuit board to be inspected is achieved through the anisotropic conductive elastomer layer 60. High connection reliability can be obtained.

The anisotropic conductive elastomer layer 60 in the above connector device is formed on the upper surface of the upper connection wiring layer 30 as follows, for example. The connector material made of a fluid mixture is prepared by dispersing conductive magnetic particles in a polymer material that becomes an insulating elastic polymer material by curing treatment, and as shown in FIG. The connector material layer 65 is formed by applying the connector material to the upper surface of the upper connection wiring layer, and this is disposed in the cavity of the mold.

This mold is composed of an upper mold 7 which constitutes an electromagnet.
1 and a lower mold 72, and the upper mold 71 has a connection electrode 3
A magnetic pole plate 73 having a flat lower surface, which is composed of a ferromagnetic material portion (shown with diagonal lines) M having a pattern corresponding to 1 and a nonmagnetic material portion N other than that, is provided. The flat lower surface of the plate 73 is separated from the surface of the connector material layer 65 so that the gap G is formed. In addition,
19 and 20, details of portions other than the connection electrode 31 are omitted.

In this state, the electromagnets of the upper mold 71 and the lower mold 72 are operated, and thereby a parallel magnetic field in the thickness direction of the upper connection wiring layer is applied. As a result, the connector material layer 65
In, in the portion located on the connection electrode 31, a stronger parallel magnetic field is applied in the thickness direction than the other portions, and by the parallel magnetic field having this distribution,
As shown in FIG. 20, the conductive magnetic particles in the connector material layer 65 are gathered in the portion located on the connection electrode 31 by the magnetic force of the ferromagnetic portion M and are further oriented in the thickness direction.

At this time, however, the connector material layer 6
Since the gap G exists on the surface side of 5, the material for polymer substance also moves due to the moving assembly of the conductive magnetic particles, and as a result, the surface of the material for polymer substance located on the connection electrode 31. Are raised, and a protruding conductive portion 61 is formed. Therefore, the thickness t ₁ of the formed insulating portion 62 is smaller than the initial thickness t ₀ of the connector material layer 65. Then, the anisotropic conductive elastomer layer 60 composed of the conductive portion 61 and the insulating portion 62 forming the protruding portion is connected to the upper side by performing a curing treatment while the parallel magnetic field is applied or after the parallel magnetic field is removed. The connector device can be integrally provided on the wiring layer to manufacture the connector device.

As shown in FIG. 21, instead of the magnetic pole plate 73, the upper die 71 is composed of a ferromagnetic material portion M having a pattern corresponding to the connecting electrode 31 and a nonmagnetic material portion N other than the ferromagnetic material portion M. It is also possible to use the magnetic pole plate 75 in which the ferromagnetic material portion M projects downward from the non-magnetic material portion N on the lower surface of 71. Further, it is possible to use a magnetic pole plate which is entirely made of a ferromagnetic material and in which a portion of the pattern corresponding to the connecting electrode 31 is projected downward from other portions. In these cases as well, a stronger parallel magnetic field acts on the connector material layer 65 in the region of the connecting electrode 31.

Further, the upper mold 7 is operated with the parallel magnetic field applied.
1 and the lower mold 72 use a variable mold, the upper mold 7 first
1 is arranged at the same level as the upper surface of the connector material layer 65, and the protrusion of the connector material layer 65 is raised by gradually increasing the distance between the upper mold 71 and the lower mold 72 while applying a parallel magnetic field. It can also be generated and then cured.

In the present invention, it is not essential that the conductive portion 61 of the anisotropic conductive elastomer layer 60 protrudes from the insulating portion 62, and it may have a flat surface. In such a case, for example, a mold having the configuration shown in FIG. 19 may be used and processing may be performed without forming the gap G.

The thickness of the connector material layer 65 is, for example, 0.1 to 3 mm. This connector material layer 65
In order to facilitate the movement of the conductive magnetic particles, the material for a polymer substance having a viscosity of 10 ⁴ to 10 ^{4 at a} temperature of 25 ° C. and a strain rate of 10 ¹ sec ^-1 is used.
It is preferably about ⁷ centipoise. The hardening treatment of the connector material layer 65 is preferably performed in a state where the parallel magnetic field is still applied, but it can also be performed after the action of the parallel magnetic field is stopped.

Further, the ferromagnetic material portion M of the magnetic pole plate 73 is iron,
A ferromagnetic material such as nickel, and a non-magnetic material portion N
Can be formed of a non-magnetic metal such as copper, a heat resistant resin such as polyimide, or an air layer. The strength of the parallel magnetic field applied to the connector material layer 65 is preferably 200 to 20,000 gauss on average in the cavity of the mold.

The curing treatment is appropriately selected depending on the material used, but is usually performed by heat treatment. For the specific heating temperature and heating time, the material layer 65 for a connector is used.
It is appropriately selected in consideration of the type of the polymer material, the time required to move the conductive magnetic particles, and the like. For example, when the material for polymer substance is room temperature curable silicone rubber, the curing treatment is performed at room temperature for about 24 hours, 40 ° C. for about 2 hours, and 80 ° C. for about 30 minutes.

The preferred embodiments of the present invention will be listed below. (1) A plurality of plate-shaped insulating plate element forming materials each having a wiring path pattern having a plurality of wiring paths formed of metal film strips arranged in one direction and spaced from each other on at least one surface are provided in a thickness direction. The insulating plate element forming material is stacked by interposing the plate-like adhesive insulating plate element forming material made of a thermosetting adhesive resin, and the stacked body is subjected to thermocompression bonding so that the insulating plate element forming material becomes an adhesive insulating plate element forming material. To form a front cut surface and a back surface by cutting the intermediate laminated body formed by adhering the intermediate laminated body with a flat cut surface along the stacking direction of the insulating plate element forming material. A method for manufacturing a pitch conversion connector, characterized in that one end surface and the other end surface of each wiring path are exposed on the front surface and the back surface, respectively. (2) The wiring board pattern is formed on both surfaces of the insulating plate element forming material, and both wiring path patterns have the same projected images in the same thickness direction. Method. (3) A connector device in which an anisotropic conductive elastomer layer having a conductive path forming portion extending in the thickness direction is integrally provided on the surface of one of the connection wiring layers.

[0073]

Hereinafter, embodiments of the present invention will be described.
The present invention is not limited to these examples.

(1) Manufacture of connector 170 mm (length) x 280 mm (width) x 0.2 mm
(Thickness) 18 μm on each side of the insulating plate element forming material (15) made of glass fiber reinforced epoxy resin
The material made by laminating the metal thin film (25) made of copper
Six sheets are prepared, and a dry film resist for etching "NK350 (manufactured by Hitachi Chemical Co., Ltd.)" having a thickness of 50 μm is laminated on the metal thin films (25) on both sides of these materials by a dry film resist laminator to form a resist. Layers were formed. This resist layer is exposed through a pattern mask by an exposure device, then developed by a spray developing method using a developing solution containing sodium carbonate as a main component, and further containing ferric chloride as a main component. A wiring path pattern composed of a plurality of wiring paths (21) was formed on both surfaces of the insulating plate element forming material (15) by performing an etching treatment with the Entic liquid. In this wiring path pattern, the pitch of one end surface of the wiring path is 0.2 mm and the pitch of the other end surface is 1.8 mm.
It is.

A plurality of guide holes (1) having an outer diameter of 5 mm which penetrate the insulating plate element forming material (15) are formed in the insulating plate element forming material (15) by a numerical control type drilling device.
6) was formed (see FIG. 3).

On the other hand, 170 mm (vertical width) x 280 mm
Twenty-seven plate-like adhesive insulating plate element forming materials (17) made of glass fiber reinforced thermosetting adhesive resin (width) × 0.2 mm (thickness) were prepared, and these adhesive insulating plates were prepared. A plurality of guide holes (18) having an outer diameter of 5 mm which penetrate the adhesive insulating plate element forming material (17) are formed in the element forming material (17) by a numerical control type drilling device (FIG. 4).
reference).

Next, six adhesive insulating plate element forming materials (17) were stacked on a pressure plate (28) made of stainless steel (SUS) via a plastic release sheet having a thickness of 50 μm, 16 sheets of the insulating plate element forming material (16) and 16 sheets of the adhesive insulating plate element forming material (17) are alternately laminated thereon, and 5 sheets of the adhesive insulating plate element forming material (17) are further formed thereon.
The sheets are stacked and the guide pin (26) having an outer diameter of 4.98 mm and a length of 25 mm is inserted into the guide holes (15, 17) of the insulating plate element forming material (16) and the adhesive insulating plate element forming material (17). Positioned by inserting it, and the thickness is 50μ
Stainless steel (S
A pressure plate (27) made of US) was placed (see FIG. 5). Then, a plurality of insulating plate element forming materials (15) and a plurality of insulating plate element forming materials (15) are formed by thermocompression bonding the whole of them under the conditions of a temperature of 170 ° C., a pressing force of 30 kg / cm ² , and a pressing time of 2 hours by a vacuum laminating press. Adhesive insulating plate element forming material (17)
An intermediate laminated body (19) was formed by integrally laminating and (see FIG. 6).

Then, the obtained intermediate laminate (19) was
Extends in the stacking direction by a numerically controlled router device 2
By cutting so that one cut surface (C1, C2) is formed, one cut surface C1 forms a flat surface, and the other cut surface (C2) forms a flat back surface, and the wiring path ( The one end surface (22) and the other end surface (23) of 21) were exposed on the front surface and the back surface to manufacture the pitch conversion connector (10) of the present invention (see FIG. 1).

(2) Formation of Upper Connection Wiring Layer and Lower Connection Wiring Layer Under the obtained pitch conversion connector (10), overall dimensions are 120 mm (vertical width) × 120 mm (horizontal width) ×
It is fitted into a through hole of a supporting frame member (35) made of a glass fiber reinforced epoxy resin of 3.6 mm (thickness) and fixed using a two-pack type epoxy resin adhesive, and then the pitch conversion connector (10). The upper and lower surfaces and the lower surface of the support frame member (35) were polished and smoothed using a buffing machine and sandpaper.

Next, on the upper surface of the pitch conversion connector (10), a liquid resist "NP which is cured by irradiation with radiation is used.
R-EXB (manufactured by Nippon Polytech Co., Ltd.) "is applied to form an upper insulating material layer (36) having a thickness of 30 μm, and then the insulating material layer (36) is patterned by an exposure device. After exposure through a mask, a short-circuit forming hole (37) was formed by developing with a spray developing method using a developer containing sodium carbonate as a main component. On the other hand, pitch conversion connector (1
Liquid resist "NPR-EXB" that is cured by irradiation of radiation on the lower surface of (0) and the lower surface of the support frame member (35).
To form a lower insulating material layer (51) having a thickness of 30 μm, and thereafter, the insulating material layer (5) is formed.
1) is exposed through a pattern mask with an exposure device, and then developed by spray development using a developing solution containing sodium carbonate as a main component to form a short-circuit forming hole (52). (See FIG. 9).

Next, the whole is subjected to a plating treatment by an electroless copper plating method and an electrolytic copper plating method thereafter, so that the inside of the short circuit portion forming hole (37) and the short circuit portion forming hole (5) are formed.
2) The inside of the wiring is copper-plated, thereby forming the short-circuit portion 32 extending through the insulating material layer 36 in the thickness direction while being connected to the one end face (22) of the wiring path (21), and at the same time, wiring path. Insulating material layer 5 while being connected to the other end surface 23 of 21
A short-circuit portion 44 was formed to extend through 1 in the thickness direction (see FIG. 10).

Then, the thin metal layer (38) formed on the surface of the upper insulating material layer (36) is polished and removed by a buffing machine and sandpaper, and the upper surface of the insulating material layer (36) is removed. By placing the upper end position of the short-circuit part (32) on a gold plate, the short-circuit part (32) is arranged at a position on a grid point,
A connection electrode (31) having a thickness of 10 μm was formed, thereby forming an upper connection wiring layer (30) (see FIG. 11).

On the other hand, a portion of the metal thin layer is removed by photoetching the copper thin metal layer (53) formed on the lower surface of the lower insulating material layer (51). The inner layer wiring part (43) was formed, and thereby the first insulating layer (41) was formed (see FIG. 12).

Next, on the lower surface of the first insulating layer (41), a liquid resist "NPR-EX" which is cured by irradiation with radiation is applied.
By coating "B", an insulating material layer (54) having a thickness of 30 μm was formed (see FIG. 13). Then, the insulating material layer (54) is exposed to light through a pattern mask by an exposure device, and then developed by a spray developing method using a developing solution containing sodium carbonate as a main component, thereby forming a short-circuited portion. Formed holes (55) were formed (see FIG. 14).

Thereafter, the inside of the short-circuit forming hole (54) is copper-plated by an electroless copper plating method to penetrate the insulating material layer (54) in the thickness direction while being connected to the inner wiring portion (43). A short-circuited portion (46) extending vertically was formed (see FIG. 15). Then, the copper thin metal layer (56) formed on the lower surface of the insulating material layer (54) is polished and removed by a buffing machine and sandpaper, and a short-circuited portion ( The lower end position of 46) was plated with gold to form a terminal electrode (45), thereby forming a lower connection wiring layer (40) (see FIG. 16).

In the above, the connection electrode (31) has a size of each electrode of 0.1 mm square and the electrode arrangement pitch is 0.2 mm, and the terminal electrode (45) has a size of 1 mm for each electrode. It has a circular shape of 1 mm and the electrode arrangement pitch is 1.8.
mm.

(3) Formation of Anisotropic Conductive Elastomer Layer A room temperature curable urethane rubber was mixed with conductive magnetic particles of nickel having an average particle diameter of 26 μm at a ratio of 15% by volume to prepare a connector material. Then, what was applied onto the surface of the above-mentioned upper connection wiring layer (30) was treated basically according to a method using a mold having a configuration shown in FIG. That is, using a magnetic pole plate (75) in which the ferromagnetic material portion M projects from the nonmagnetic material portion N by 0.1 mm on the lower surface
A gap of 0.03 mm is formed between the lower surface of the ferromagnetic material portion M and the connector material layer to cause a parallel magnetic field to act to elevate the connector material layer, and in this state, it is left to stand at room temperature for 24 hours for curing. As a result, an anisotropic conductive elastomer layer having a thickness t of the conductive portion of 0.3 mm, a thickness d of the insulating portion of 0.27 mm, and a protrusion ratio (t−d) / t of the conductive portion of 10% is obtained. Then, a connector device was manufactured.

[Experimental Example 1] With respect to the above connector device, a resistance measuring device "Milliohm High Tester" (manufactured by Hioki Electric Co., Ltd.) was used, and a common conductive plate was arranged on the lower surface side of the lower connection wiring layer for all terminals. The electrodes were short-circuited, and the electric resistance value between this conductive plate and each connection electrode was measured using a probe pin. As a result, it was confirmed that the electrical resistance values of all the connecting electrodes were as small as 33 mΩ or less, and that the electrical connection between the terminal electrode to be connected and the connecting electrode was sufficiently achieved. .

[Experimental Example 2] Further, with respect to the connector device, the same resistance measuring device as described above was used to measure the electric resistance value between the adjacent connecting electrodes to be insulated from each other using the probe pin. As a result, it was confirmed that the electric resistance values were very large, 2 MΩ or more, and that a sufficient insulation state was achieved.

[0090]

According to the pitch conversion connector of the present invention, since the wiring path pattern can be formed in an accurate shape by, for example, photolithography, each wiring path has a minute arrangement pitch on one end face. However, the electrical connection state between this and the other end surface can be made reliable and have extremely high reliability. Further, since the arrangement pitch in the stacking direction basically follows the thickness of the insulating plate element, it is also easy to make it minute. Therefore, in the obtained pitch conversion connector, it is possible to form a surface electrode element having a fine pitch on the surface and also to form a back surface electrode element having a different arrangement pitch in one direction from the surface electrode element on the back surface. ,
Moreover, the short-circuit wiring extending in the thickness direction for electrically connecting the corresponding front electrode element and back electrode element can be made extremely reliable.

According to the method for manufacturing the pitch conversion connector of the present invention, the pitch conversion connector having the above-mentioned structure can be reliably and extremely easily manufactured, and
The cross-sectional areas of the one end surface and the other end surface of the wiring path constituting the electrode terminal are very small, but it can be surely exposed on the front surface and the back surface. A back electrode element can be formed.

According to the connector device of the present invention, each of the connection electrodes formed on the upper surface of one connection wiring layer and arranged at a fine pitch, and the terminal electrode formed on the lower surface of the other connection wiring layer. As for the relationship, the pitch in one direction is converted by the configuration of the wiring path of the pitch conversion connector, and the pitch in one direction and the other direction perpendicular to the one direction are converted by the inner layer wiring portion in the other connection wiring layer. It becomes a state. Since the wiring path and the inner layer wiring portion for the pitch conversion can be formed with a large degree of freedom, the connector device has a desired electrode arrangement, and the connection electrodes having a minute arrangement pitch can be formed. It is possible to easily obtain a product that has a very high reliability.

An anisotropic conductive elastomer layer can be provided on the surface of one of the connection wiring layers, whereby the electrical connection between the connection electrode and the inspected electrode of the circuit board to be inspected is anisotropic. Since it is achieved through the conductive elastomer layer, high connection reliability is obtained.

[Brief description of drawings]

FIG. 1 is an explanatory view showing a partially broken structure of an example of a pitch conversion connector of the present invention.

FIG. 2 is an explanatory view showing an insulating plate element forming material used in the method for manufacturing the pitch conversion connector in FIG.

FIG. 3 is an explanatory cross-sectional view showing a state in which a wiring path is formed on the surface of an insulating plate element forming material.

FIG. 4 is an explanatory sectional view showing an adhesive insulating plate element forming material used in the method for manufacturing the pitch conversion connector in FIG.

FIG. 5 is an explanatory cross-sectional view showing a state in which an insulating plate element forming material and an adhesive insulating plate element forming material are stacked.

FIG. 6 is an explanatory view showing a partially broken structure of the intermediate laminate.

FIG. 7 is an explanatory cross-sectional view showing the configuration of an example of the connector device of the present invention.

FIG. 8 is an explanatory cross-sectional view showing a state in which an upper insulating material layer and a lower insulating material layer are formed on each of the front surface and the back surface of the pitch conversion connector.

FIG. 9 is an explanatory cross-sectional view showing a state in which a short-circuit forming hole is formed in an upper insulating material layer and a lower insulating material layer.

FIG. 10 is an explanatory cross-sectional view showing a state in which a short circuit portion is formed in an upper insulating material layer and a lower insulating material layer.

FIG. 11 is an explanatory cross-sectional view showing a state in which a connection electrode is formed on the upper surface of an upper insulating material layer and thus an upper connection wiring layer is formed.

FIG. 12 is an explanatory cross-sectional view showing a state in which an inner layer wiring portion is formed on the lower surface of a lower insulating material layer and thus a first insulating layer is formed.

FIG. 13 is an explanatory cross-sectional view showing a state in which an insulating material layer is formed on the lower surface of the first insulating layer.

FIG. 14 is an explanatory cross-sectional view showing a state in which a short-circuit forming hole is formed in the insulating material layer formed on the lower surface of the first insulating layer.

FIG. 15 is an explanatory cross-sectional view showing a state in which a short-circuit forming hole is formed in the insulating material layer formed on the lower surface of the first insulating layer.

FIG. 16 shows that a terminal electrode is formed on the lower surface of the insulating material layer,
It is an explanatory sectional view showing a state in which a lower connection wiring layer is formed.

FIG. 17 is an explanatory sectional view showing a configuration of an example of a connector device having an anisotropic conductive elastomer layer according to the present invention.

18 is an explanatory cross-sectional view showing, in an enlarged manner, an anisotropic conductive elastomer layer portion in the connector device shown in FIG.

FIG. 19 is an explanatory cross-sectional view showing a state in which a connector material layer is formed on the upper surface of an upper connection wiring layer and set in a mold.

20 is an explanatory cross-sectional view showing a state in which a parallel magnetic field is applied in FIG.

FIG. 21 is an explanatory cross-sectional view showing another example of the mold used for forming the anisotropic conductive elastomer layer.

FIG. 22 is an explanatory diagram showing an example arrangement of a printed circuit board.

[Explanation of symbols]

 10 pitch conversion connector 11 substrate body 12 insulating plate element 13 front surface 14 back surface 15 insulating plate element forming material 16 guide hole 17 adhesive insulating plate element forming material 18 guide hole 19 intermediate laminated body 20 wiring path pattern 21 wiring path 22 one end surface 23 Other end surface 24 Connection part 25 Metal thin film 26 Guide pin 27, 28 Pressurizing plate 30 Upper connection wiring layer 31 Connection electrode 32 Short circuit part 35 Support frame member 36 Insulating material layer 37 Short circuit part formation hole 38 Metal thin layer 40 Lower connection wiring layer 41 First Insulating Layer 42 Second Insulating Layer 43 Inner Layer Wiring Section 44 Short Circuit Section 45 Terminal Electrode 46 Short Circuit Section 51 Insulating Material Layer 52 Short Circuit Section Forming Hole 53 Metal Thin Layer 54 Insulating Material Layer 55 Short Circuit Section Forming Hole 56 Metal Thin Layer 60 Anisotropically conductive elastomer layer 61 Conductive part 62 Insulating part 65 Connector material 71 Upper mold 72 Lower mold 73, 75 Magnetic pole plate 90 Circuit board 91 Functional element area 92 Lead electrode 93 Lead electrode area E Elastic polymer substance P Conductive particle N Non-magnetic material part M Ferromagnetic material part G Gap

Claims (3)

[Claims] 1. A plate-shaped substrate body having a laminated body in which a large number of rectangular insulating plate elements are integrally laminated, and having flat front and back surfaces formed along the stacking direction of the insulating plate elements. Formed on at least one plate surface forming an interface between insulating plate elements adjacent to each other in this substrate body,
A plurality of wiring paths each formed of a metal film strip extending in the thickness direction of the substrate body and having one end surface and the other end surface thereof exposed on the front surface and the back surface of the substrate body, respectively, and arranged side by side in the interface direction. A wiring path pattern, wherein the arrangement pitch of one end surface of each wiring path on the front surface of the substrate body in the interface direction is smaller than the arrangement pitch of the other end surface of each wiring path on the back surface of the substrate body. Conversion connector. 2. The method for manufacturing the pitch conversion connector according to claim 1, wherein a surface on which a wiring path pattern having a plurality of wiring paths made of metal film strips arranged in one direction and spaced from each other is formed. A plurality of plate-shaped insulating plate element forming materials having the above are stacked in the thickness direction to manufacture a laminated body, and a flat cut surface is formed along the stacking direction of the insulating plate element forming material. A method for manufacturing a pitch conversion connector, characterized by forming the front surface and the back surface by the cut surface and exposing one end surface and the other end surface of each wiring path to the front surface and the back surface, respectively. 3. The pitch conversion connector according to claim 1, one connection wiring layer provided on a surface of the pitch conversion connector, and the other connection wiring layer provided on a lower surface of the pitch conversion connector. The one connection wiring layer is formed on the surface thereof, and a plurality of connection electrodes arranged corresponding to one end faces of the respective wiring portions on the surface of the pitch conversion connector, and the connection electrodes. Is electrically connected to one end face of the corresponding wiring path, and has a short-circuit portion extending in the thickness direction of the one connection wiring layer, the other connection wiring layer is formed on the surface, A terminal electrode arranged on a standard grid point and a short-circuit portion extending in the thickness direction of the other connection wiring layer for electrically connecting the other end of the wiring path in the pitch conversion connector to one of the terminal electrodes. Including Connector apparatus characterized by having a layer inside the wiring portion.