JPH0992805A - Optical integrated circuit device - Google Patents
Optical integrated circuit deviceInfo
- Publication number
- JPH0992805A JPH0992805A JP7244825A JP24482595A JPH0992805A JP H0992805 A JPH0992805 A JP H0992805A JP 7244825 A JP7244825 A JP 7244825A JP 24482595 A JP24482595 A JP 24482595A JP H0992805 A JPH0992805 A JP H0992805A
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- light
- integrated circuit
- optical integrated
- outside
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Abstract
(57)【要約】
【課題】 外部からの光照射による光電流の発生を生じ
ない光集積回路を提供する。
【解決手段】 受光部と、回路部とを有し、回路部上に
は遮光膜が被覆され、回路部より外部に導出され外部と
電気的に接続される少なくとも電源端子と、出力端子
と、接地端子となる外部導出端子と、外部と電気的に接
続されることのない内部端子とを有し、内部端子に対す
る少なくとも一部の保護ダイオードの接続を省略した光
集積回路装置。
(57) Abstract: An optical integrated circuit that does not generate a photocurrent due to external light irradiation is provided. A light receiving portion and a circuit portion, a light shielding film is coated on the circuit portion, and at least a power supply terminal led out from the circuit portion and electrically connected to the outside, and an output terminal, An optical integrated circuit device having an external lead-out terminal which is a ground terminal and an internal terminal which is not electrically connected to the outside, and in which at least a part of the protection diode is not connected to the internal terminal.
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、例えばリモコンセ
ンサー、赤外線通信等に用いられて好適な光集積回路装
置いわゆる光ＩＣ装置に係わる。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical integrated circuit device suitable for use in, for example, a remote controller sensor, infrared communication, etc., a so-called optical IC device.
【０００２】[0002]
【従来の技術】例えばリモコンセンサーを構成する光集
積回路装置は、例えば図４に概略平面図を示し、図５に
概略断面図を示すように、フォトダイオードなどの受光
部１と、これによって受光した光信号例えば赤外線信号
による電気信号を、信号処理して所要の信号出力を取り
出す信号処理回路部等を有する回路部２とが、共通の半
導体チップ３もしくはそれぞれの半導体チップに形成さ
れて、例えばリードフレーム４上にマウントされる。2. Description of the Related Art For example, an optical integrated circuit device forming a remote control sensor has a light receiving portion 1 such as a photodiode and a light receiving portion 1 such as a photodiode as shown in a schematic plan view of FIG. 4 and a schematic sectional view of FIG. A circuit unit 2 having a signal processing circuit unit or the like for processing an optical signal such as an infrared signal to obtain a desired signal output is formed on a common semiconductor chip 3 or each semiconductor chip. It is mounted on the lead frame 4.
【０００３】半導体チップ３の受光部１以外の回路部２
等の表面にはＡｌ膜等の遮光膜７が被覆される。一方、
半導体チップ３の例えば側縁部上には、遮光膜７外に、
回路部２から配線層８が導出されその先端部において端
子部となるパッド５が形成されて配列される。これらパ
ッド５は、それぞれ外部と接続される例えば電源Ｖｃｃ
が供給される電源端子５ｓと、信号出力端子５ｓｉｇ
と、接地端子５ｅ等の外部導出端子と、さらに外部と接
続されることがない例えば半導体チップに予め組み込ま
れた抵抗や容量等を信号処理回路等の回路部２に接続な
いしは遮断することによってこの回路部の回路特性等を
調整するために用いられる特性調整用端子等の内部端子
５ｃとよりなる。Circuit part 2 other than light receiving part 1 of semiconductor chip 3
A light-shielding film 7 such as an Al film is coated on the surfaces such as. on the other hand,
On the side edge of the semiconductor chip 3, for example, outside the light shielding film 7,
The wiring layer 8 is led out from the circuit portion 2, and the pads 5 serving as terminal portions are formed and arranged at the tip portion thereof. These pads 5 are connected to the outside, for example, a power source Vcc.
Power supply terminal 5s to which is supplied and signal output terminal 5sig
By connecting or disconnecting an external lead-out terminal such as the grounding terminal 5e and a resistor or a capacitor which is not connected to the outside, for example, a resistor or a capacitor built in advance in a semiconductor chip, to or from the circuit unit 2 such as a signal processing circuit. An internal terminal 5c such as a characteristic adjusting terminal used for adjusting the circuit characteristic of the circuit section.
【０００４】リードフレーム４は、例えば接地リードと
なるリード部４ｅが導出された半導体チップ３の載置部
４ｄを有し、これの上に、上述の半導体チップ３がボン
ディングされる。そして、接地リード部４ｅに、半導体
チップ３上の接地端子５ｅがリードワイヤ６によって電
気的に接続される。また、リードフレーム４には、例え
ばリード部４ｅと平行に、半導体チップ３上の電源端子
５ｓと信号出力端子５ｓｉｇとが、それぞれリードワイ
ヤ６によって電気的に接続されるリード部４ｓと４ｓｉ
ｇとを有してなる。The lead frame 4 has a mounting portion 4d for the semiconductor chip 3 from which a lead portion 4e, which is, for example, a ground lead, is led out, and the semiconductor chip 3 is bonded thereon. Then, the ground terminal 5e on the semiconductor chip 3 is electrically connected to the ground lead portion 4e by the lead wire 6. Further, in the lead frame 4, for example, in parallel to the lead portion 4e, the power source terminal 5s and the signal output terminal 5sig on the semiconductor chip 3 are electrically connected by the lead wire 6 respectively, and the lead portions 4s and 4si.
g and.
【０００５】そして、半導体チップ３を、リードフレー
ム４の半導体チップ３のマウント部、リードフレーム４
のワイヤ６のボンディング部を含んで樹脂モールド１０
によって包み込む。この樹脂モールド１０には、例えば
染料が混入され、この樹脂モールド１０によって可視光
が遮断され、赤外線のみが透過される構成とされる。ま
た、樹脂モールド１０は、例えば集束レンズ形状に構成
され、受光部１に赤外光が有効に入射されるようになさ
れる。Then, the semiconductor chip 3 is mounted on the mount portion of the semiconductor chip 3 of the lead frame 4 and the lead frame 4.
The resin mold 10 including the bonding portion of the wire 6 of
Wrap up by. For example, a dye is mixed in the resin mold 10, and visible light is blocked by the resin mold 10 and only infrared rays are transmitted. Further, the resin mold 10 is configured, for example, in the shape of a focusing lens, and infrared light is effectively incident on the light receiving unit 1.
【０００６】一方、例えば図６にその接続態様を示すよ
うに、例えば上述した信号出力端子５ｓｉｇと電源端子
５ｓとの間に第１の保護ダイオードｄ1 が接続され、接
地端子５ｅとの間に第２の保護ダイオードｄ2 が接続さ
れ、一方上述した特性調整用端子のパッド５ｃと電源端
子５ｓとの間に第３の保護ダイオードｄ3 が接続され、
接地端子５ｅとの間に第４の保護ダイオードｄ4 が接続
され、さらに電源端子５ｓと接地端子５ｅとの間に電源
端子用の保護ダイオードｄｓがそれぞれ接続されて、各
端子に不用意に外部から静電電圧が印加された場合にお
いても、信号処理回路等の回路部２に破損、誤動作が生
じないようになされている。On the other hand, for example, as shown in the connection mode in FIG. 6, for example, the first protection diode d 1 is connected between the above-mentioned signal output terminal 5sig and the power supply terminal 5s, and is connected between it and the ground terminal 5e. The second protection diode d 2 is connected, while the third protection diode d 3 is connected between the pad 5c of the characteristic adjusting terminal and the power supply terminal 5s,
The fourth protection diode d 4 is connected between the ground terminal 5e and the power terminal protection diode ds between the power terminal 5s and the ground terminal 5e. Even when an electrostatic voltage is applied to the circuit section 2, the circuit section 2 such as the signal processing circuit is prevented from being damaged or malfunctioning.
【０００７】これら保護ダイオードは、半導体チップ３
上の、遮光膜７によって覆われた部分に形成されてい
て、外光から遮断されてこれら保護ダイオードに光が照
射されることによって、図６中破線で示す光電流ｉを発
生させるような不都合が生じることがないようになされ
ている。These protection diodes are semiconductor chips 3
An inconvenience that a photocurrent i shown by a broken line in FIG. 6 is generated by being formed in the upper portion covered with the light shielding film 7 and being shielded from external light and being irradiated with light to these protection diodes. It is designed so that no
【０００８】[0008]
【発明が解決しようとする課題】ところが、上述した構
成による光集積回路装置においては、実際には図４のＡ
−Ａ線上の一部の断面図を図７に示すように、配線層８
上には絶縁層９を介して遮光膜７が被覆されていること
から、遮光膜７の端縁下には光学的な空洞が生じ、これ
を通じて遮光膜７下に光が直接的にもしくは各部での反
射の繰り返しによって遮光膜７下にある保護ダイオード
に外光が伝搬されて実質的に保護ダイオードに光が照射
されてしまい上述した光電流ｉが発生してしまう不都合
が生じることが判明した。However, in the optical integrated circuit device having the above-described configuration, the A
As shown in FIG. 7 which is a partial cross-sectional view taken along line A, the wiring layer 8
Since the light-shielding film 7 is covered therewith via the insulating layer 9, an optical cavity is formed below the end edge of the light-shielding film 7, through which light directly or below each portion of the light-shielding film 7 is formed. It was found that the external light propagates to the protection diode below the light-shielding film 7 due to the repeated reflections at 1, and the protection diode is substantially irradiated with the light, and the above-described photocurrent i is generated. .
【０００９】本発明は、このような不都合を回避するこ
とを目的とするものである。The present invention aims at avoiding such an inconvenience.
【００１０】[0010]
【課題を解決するための手段】本発明による光集積回路
は、受光部と、これよりの受光信号による電気信号に対
し所要の信号処理を行う信号処理回路等の回路部とを有
し、この回路部上には遮光膜が被覆され、外部と電気的
に接続される少なくとも電源端子と、出力端子と、接地
端子となる外部導出端子とが上記回路部より外部に導出
され、このように外部と接続されることのない内部端子
については少なくとも一部の保護ダイオードの接続を省
略する構成とする。言い換えれば、外部に導出される端
子のみに関してその所要の端子、例えば電源端子、ある
いは出力端子、またはその双方に関して保護ダイオード
の接続を行うものの、外部導出端子以外の内部端子につ
いては、少なくとも一部の保護ダイオードの接続を回避
する。An optical integrated circuit according to the present invention has a light receiving portion and a circuit portion such as a signal processing circuit for performing a required signal processing on an electric signal by a light receiving signal from the light receiving portion. A light-shielding film is coated on the circuit portion, and at least a power supply terminal electrically connected to the outside, an output terminal, and an external lead terminal serving as a ground terminal are led out from the circuit portion to the outside. For internal terminals that are not connected to, the connection of at least some protection diodes is omitted. In other words, the protection diode is connected only to the terminal to be led out to the outside, for example, the power supply terminal, the output terminal, or both, but at least some of the internal terminals other than the external lead terminal are connected. Avoid connecting protection diodes.
【００１１】上述の本発明の構成によれば、外部に導出
される端子については、外部から不用意に電流、電圧が
印加されやすいことから、必要とする端子に保護ダイオ
ードの接続を行うものの、外部に導出されない端子につ
いては保護ダイオードの接続を回避するものであるが、
これは、完成された光集積回路装置において、実際には
このように外部に導出されない端子について保護ダイオ
ードの接続がなされずとも、事故の発生に問題が生じな
いことを見い出したことによるものであり、このような
保護ダイオードの接続を回避したことによって、冒頭に
述べた遮光膜端縁からの光の入り込みによって保護ダイ
オードに光照射がなされて生じた光電流による回路への
影響を問題が生じない程度に抑制できた。According to the above-described structure of the present invention, with respect to the terminal led to the outside, it is easy to apply a current or voltage from the outside carelessly. Therefore, although the protection diode is connected to the required terminal, For terminals that are not led to the outside, the connection of protection diodes is avoided,
This is because, in the completed optical integrated circuit device, it was found that there is no problem in the occurrence of an accident even if the protection diode is not connected to such a terminal that is not actually led to the outside. , By avoiding the connection of such a protection diode, there is no problem with the influence of the photocurrent generated by the irradiation of the light from the edge of the light-shielding film, which was mentioned at the beginning, on the protection diode to the circuit. It could be suppressed to a certain degree.
【００１２】[0012]
【発明の実施の形態】以下に、図１および図２を参照し
て本発明の光集積回路装置の一例について説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An example of the optical integrated circuit device of the present invention will be described below with reference to FIGS.
【００１３】この例では光集積回路（光ＩＣ）装置は図
１にその概略平面図を示し、図２に概略断面図を示すよ
うに、ｐｎ接合によるフォトダイオードなどの受光部１
と、これによって受光した光信号例えば赤外線信号によ
る電気信号を、信号処理して所要の信号出力を取り出す
信号処理回路部等を有する回路部２とが、共通の半導体
チップ３に形成されてリードフレーム４上にマウントさ
れてなる。In this example, an optical integrated circuit (optical IC) device is shown in a schematic plan view in FIG. 1 and a schematic sectional view in FIG.
And a circuit portion 2 having a signal processing circuit portion for processing a light signal received thereby, for example, an electric signal by an infrared signal to obtain a desired signal output, are formed on a common semiconductor chip 3, and a lead frame is formed. It is mounted on 4.
【００１４】半導体チップ３の受光部１以外の回路部２
の表面には、Ａｌ膜からなる遮光膜７が被覆される。一
方、半導体チップ３の例えば側縁部上遮光膜７外に、回
路部２から配線層８が導出され、その先端部において端
子部となるパッド５が形成されて配列される。これらパ
ッド５は、それぞれ外部と接続される例えば電源Ｖｃｃ
が供給される電源端子５ｓと、信号出力端子５ｓｉｇ
と、接地端子５ｅと、さらに例えば半導体チップに予め
組み込まれた抵抗や容量等を信号処理回路等の回路部２
に接続ないしは遮断することによってこの回路部の回路
特性等を調整するために用いられる特性調整用端子等の
外部との接続がされない内部端子５ｃとよりなる。Circuit part 2 other than light receiving part 1 of semiconductor chip 3
The surface of is covered with a light shielding film 7 made of an Al film. On the other hand, for example, outside the light shielding film 7 on the side edge portion of the semiconductor chip 3, the wiring layer 8 is led out from the circuit portion 2 and the pad 5 serving as a terminal portion is formed and arranged at the tip portion thereof. These pads 5 are connected to the outside, for example, a power source Vcc.
Power supply terminal 5s to which is supplied and signal output terminal 5sig
A grounding terminal 5e, and a circuit unit 2 such as a signal processing circuit for further incorporating a resistor, a capacitance, etc., which are previously incorporated in a semiconductor chip.
It is composed of an internal terminal 5c which is not connected to the outside, such as a characteristic adjusting terminal used for adjusting the circuit characteristic or the like of this circuit portion by connecting or disconnecting.
【００１５】リードフレーム４は、例えば接地リードと
なるリード部４ｅが導出された半導体チップ３の載置部
４ｄを有し、これの上に、上述の半導体チップ３がボン
ディングされる。そして、接地リード部４ｅに、半導体
チップ３上の接地端子のパッド５ｅがリードワイヤ６に
よって電気的に接続される。また、リードフレーム４に
は、例えばリード部４ｅと平行に、半導体チップ３上の
電源端子５ｓと信号出力端子５ｓｉｇとが、それぞれリ
ードワイヤ６によって電気的に接続されるリード部４ｓ
と４ｓｉｇとを有してなる。The lead frame 4 has a mounting portion 4d of the semiconductor chip 3 from which a lead portion 4e, which is, for example, a ground lead, is led out, and the semiconductor chip 3 is bonded onto the mounting portion 4d. Then, the pad 5e of the ground terminal on the semiconductor chip 3 is electrically connected to the ground lead portion 4e by the lead wire 6. Further, in the lead frame 4, for example, in parallel with the lead portion 4e, the power source terminal 5s and the signal output terminal 5sig on the semiconductor chip 3 are electrically connected by the lead wire 6 respectively.
And 4 sig.
【００１６】そして、半導体チップ３を、リードフレー
ム４の半導体チップ３のマウント部、リードフレーム４
のワイヤ６のボンディング部を含んで樹脂モールド１０
によって包み込む。この樹脂モールド１０には、例えば
染料が混入され、この樹脂モールド１０によって可視光
が遮断され、赤外線のみが透過される構成とされる。ま
た、樹脂モールド１０は、例えば集束レンズ形状に構成
され、受光部１に赤外光が有効に入射されるようになさ
れる。Then, the semiconductor chip 3 is mounted on the mount portion of the semiconductor chip 3 of the lead frame 4, the lead frame 4
The resin mold 10 including the bonding portion of the wire 6 of
Wrap up by. For example, a dye is mixed in the resin mold 10, and visible light is blocked by the resin mold 10 and only infrared rays are transmitted. Further, the resin mold 10 is configured, for example, in the shape of a focusing lens, and infrared light is effectively incident on the light receiving unit 1.
【００１７】そして、特に本発明装置の構成において
は、例えば図３にその接続態様を示すように、電気的に
外部と接続すべく導出されることのない各端子（パッ
ド）５ｃについては、保護ダイオードの接続を回避し
て、外部と接続される端子に関してのみ、すなわち例え
ば上述した信号出力端子５ｓｉｇと電源端子５ｓとの間
に第１の保護ダイオードｄ1 が接続され、接地端子５ｅ
との間に第２の保護ダイオードｄ2 が接続され、さらに
電源端子５ｓと接地端子５ｅとの間に電源端子用の保護
ダイオードｄｓがそれぞれ接続されて、各端子に不用意
に外部から静電電圧が印加された場合においても、信号
処理回路等の回路部２に破損、誤動作が生じないように
なされている。In particular, in the structure of the device of the present invention, for example, as shown in the connection mode of FIG. 3, each terminal (pad) 5c which is not led out to electrically connect to the outside is protected. By avoiding the diode connection, the first protection diode d 1 is connected only to the terminal connected to the outside, that is, for example, between the signal output terminal 5sig and the power supply terminal 5s described above, and the ground terminal 5e.
The second protection diode d 2 is connected between the power supply terminal 5 s and the ground terminal 5 e, and the power supply terminal protection diode ds is connected between the power supply terminal 5 s and the ground terminal 5 e. Even when a voltage is applied, the circuit section 2 such as the signal processing circuit is prevented from being damaged or malfunctioning.
【００１８】すなわちこの光集積回路装置においては、
図６に示した従来の光集積回路装置の例の接続態様と比
較すると、特性調整用端子のパッド５ｃと電源端子５ｓ
との間の第３の保護ダイオードｄ3 と、接地端子５ｅと
の間の第４の保護ダイオードｄ4 とが接続されていない
構成である。That is, in this optical integrated circuit device,
Compared with the connection mode of the example of the conventional optical integrated circuit device shown in FIG. 6, the pad 5c of the characteristic adjustment terminal and the power supply terminal 5s are compared.
Is not connected to the third protection diode d 3 connected to the ground terminal 5e and the fourth protection diode d 4 connected to the ground terminal 5e.
【００１９】因みに、光ＩＣではない通常の集積回路
（ＩＣ）においては、保護ダイオードが設けられない構
成をとるものもあるが、この場合光集積回路装置を構成
するものではないことから全体がパッケージ内に収容さ
れ、このパッケージはガラスフィラー入り樹脂等の光を
透過しない材料で構成されており、光が透過しないので
光電流が生じないことから、前述の光電流による内部回
路への影響を考慮した本発明構成とは本質的に異なる。Incidentally, there are some ordinary integrated circuits (ICs) that are not optical ICs, but are not provided with a protection diode. In this case, however, since they do not constitute an optical integrated circuit device, they are entirely packaged. This package is housed inside, and this package is made of a material that does not transmit light, such as resin with glass filler, and does not transmit light, so no photocurrent is generated.Therefore, consider the above-mentioned influence of the photocurrent on the internal circuit. It is essentially different from the configuration of the present invention.
【００２０】上述したように、本発明装置においては、
外部に導出されない特性調整用端子のパッド５ｃに保護
ダイオードを接続しないことにより、図６において見ら
れたような、光電流ｉの発生を抑制することができる。
外部に導出される端子については、外部から不用意に電
流、電圧が印加されやすいことから、必要とする端子に
保護ダイオードの接続を行うものである。As described above, in the device of the present invention,
By not connecting the protection diode to the pad 5c of the characteristic adjusting terminal that is not led to the outside, it is possible to suppress the generation of the photocurrent i as seen in FIG.
Regarding a terminal led out to the outside, a protection diode is connected to a required terminal because a current and a voltage are easily applied from the outside carelessly.
【００２１】上述の例では、特性調整用端子のパッド５
ｃに対して電源電位側と接地電位側の両方ともに保護ダ
イオードを設けない構成であったが、いずれか一方の保
護ダイオードを設けないで、もう一方の保護ダイオード
を配置する構成としても、図６に示した従来の場合と比
較して光電流による回路部の動作への影響を抑制するこ
とができる。In the above example, the pad 5 of the characteristic adjusting terminal is used.
Although the protection diode is not provided on both the power supply potential side and the ground potential side with respect to c, if one of the protection diodes is not provided and the other protection diode is provided, the configuration shown in FIG. It is possible to suppress the influence of the photocurrent on the operation of the circuit section as compared with the conventional case shown in FIG.
【００２２】尚、上述の例は本発明の一例であり、本発
明の要旨を逸脱しない範囲でその他様々な構成が取り得
る。The above-mentioned example is an example of the present invention, and various other configurations can be adopted without departing from the gist of the present invention.
【００２３】上述の例ではフォトダイオード等による受
光部６と信号処理回路部７とがモノリシックに形成配置
された例であったが、これらを別々チップにして接続し
同一のパッケージ内に収納する構成、いわゆるハイブリ
ッドな構成としてもよい。In the above-mentioned example, the light receiving portion 6 and the signal processing circuit portion 7 formed of a photodiode or the like are monolithically formed and arranged. However, these are connected as separate chips and housed in the same package. Alternatively, a so-called hybrid structure may be used.
【００２４】[0024]
【発明の効果】上述の本発明の光集積回路装置によれ
ば、保護ダイオードを設けないことにより、保護ダイオ
ードに外部から光が照射されて生じる光電流を抑制し、
これにより回路部の動作への影響を低減することができ
る。これにより、外部から照射される光の乱れに対し
て、安定した動作特性を有する光集積回路装置を実現す
ることができる。According to the above-described optical integrated circuit device of the present invention, since the protection diode is not provided, the photocurrent generated when the protection diode is irradiated with light from the outside is suppressed,
This can reduce the influence on the operation of the circuit section. As a result, it is possible to realize an optical integrated circuit device having stable operation characteristics against the disturbance of light emitted from the outside.
【図１】本発明の光集積回路装置の一例を示す概略平面
図である。FIG. 1 is a schematic plan view showing an example of an optical integrated circuit device of the present invention.
【図２】本発明の光集積回路装置の一例を示す概略断面
図である。FIG. 2 is a schematic sectional view showing an example of an optical integrated circuit device of the present invention.
【図３】図１および図２に示した光集積回路装置の接続
態様を示す模式図である。FIG. 3 is a schematic diagram showing a connection mode of the optical integrated circuit device shown in FIGS. 1 and 2.
【図４】従来の光集積回路装置を示す概略平面図であ
る。FIG. 4 is a schematic plan view showing a conventional optical integrated circuit device.
【図５】従来の光集積回路装置を示す概略断面図であ
る。FIG. 5 is a schematic sectional view showing a conventional optical integrated circuit device.
【図６】図４および図５に示した光集積回路装置の接続
態様を示す模式図である。6 is a schematic diagram showing a connection mode of the optical integrated circuit device shown in FIGS. 4 and 5. FIG.
【図７】図４のＡ−Ａ線上の一部の断面図である。7 is a partial cross-sectional view taken along the line AA of FIG.
１ 受光部 ２ 回路部 ３ 半導体チップ ４ リードフレーム ４ｄ 半導体チップ載置部 ４ｓ、４ｓｉｇ、４ｅ リード部 ５ パッド ５ｓ 電源端子 ５ｓｉｇ 信号出力端子 ５ｅ 接地端子 ５ｃ 特性調整用端子 ６ リードワイヤ ７ 遮光膜 ８ 配線層 ９ 絶縁膜 １０ 樹脂モールド ｄ1 、ｄ2 、ｄ3 、ｄ4 、ｄｓ 保護ダイオード ｉ 光電流1 light receiving part 2 circuit part 3 semiconductor chip 4 lead frame 4d semiconductor chip mounting part 4s, 4sig, 4e lead part 5 pad 5s power supply terminal 5sig signal output terminal 5e ground terminal 5c characteristic adjustment terminal 6 lead wire 7 light-shielding film 8 wiring Layer 9 Insulating film 10 Resin mold d 1 , d 2 , d 3 , d 4 , ds Protection diode i Photocurrent
Claims (2)
れる少なくとも電源端子と、出力端子と、接地端子とな
る外部導出端子と、 外部と電気的に接続されることのない内部端子とを有
し、 該内部端子に対する少なくとも一部の保護ダイオードの
接続を省略したことを特徴とする光集積回路装置。1. A light-receiving part and a circuit part, wherein the circuit part is covered with a light-shielding film, at least a power supply terminal led out from the circuit part and electrically connected to the outside, An output terminal, an external lead-out terminal that serves as a ground terminal, and an internal terminal that is not electrically connected to the outside, and at least a part of the protection diode is not connected to the internal terminal. Optical integrated circuit device.
端子と、接地端子となる外部導出端子が上記回路部より
外部に導出され、 上記外部導出端子の所要の端子に関してのみ保護ダイオ
ードが接続されることを特徴とする光集積回路装置。2. A light-receiving portion, a circuit portion, a light-shielding film covering the circuit portion, and at least a power supply terminal electrically connected to the outside, an output terminal, and an external portion serving as a ground terminal. An optical integrated circuit device, wherein a lead-out terminal is led out from the circuit section, and a protection diode is connected only to a required terminal of the external lead-out terminal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7244825A JPH0992805A (en) | 1995-09-22 | 1995-09-22 | Optical integrated circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7244825A JPH0992805A (en) | 1995-09-22 | 1995-09-22 | Optical integrated circuit device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0992805A true JPH0992805A (en) | 1997-04-04 |
Family
ID=17124520
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7244825A Pending JPH0992805A (en) | 1995-09-22 | 1995-09-22 | Optical integrated circuit device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0992805A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100444216B1 (en) * | 2001-08-22 | 2004-08-16 | 삼성전기주식회사 | Optical signal processing chip structure and a optical mouse apparatus including the chip |
| JP2008130611A (en) * | 2006-11-16 | 2008-06-05 | Nec Electronics Corp | Semiconductor laser device |
| JP2008267884A (en) * | 2007-04-17 | 2008-11-06 | Sharp Corp | Object detection circuit |
| US9635297B2 (en) | 2013-10-22 | 2017-04-25 | Canon Kabushiki Kaisha | Image capturing apparatus, solid-state image sensor, and camera that may suppress electrical interference |
-
1995
- 1995-09-22 JP JP7244825A patent/JPH0992805A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100444216B1 (en) * | 2001-08-22 | 2004-08-16 | 삼성전기주식회사 | Optical signal processing chip structure and a optical mouse apparatus including the chip |
| JP2008130611A (en) * | 2006-11-16 | 2008-06-05 | Nec Electronics Corp | Semiconductor laser device |
| JP2008267884A (en) * | 2007-04-17 | 2008-11-06 | Sharp Corp | Object detection circuit |
| US9635297B2 (en) | 2013-10-22 | 2017-04-25 | Canon Kabushiki Kaisha | Image capturing apparatus, solid-state image sensor, and camera that may suppress electrical interference |
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