JPH0997780A - Spin dryer - Google Patents

Abstract

(57) An object of the present invention is to provide a spin drying apparatus capable of preventing reattachment of a cleaning liquid scattered from a work when the work is rotated at a high speed and dried. It is in. SOLUTION: In a spin drying apparatus which holds a cleaned work 21 and rotates it at a high speed to perform a drying process, a rotating body 3, a step motor 6 for rotationally driving the rotating body, and the rotating body. A holding member 11 provided on the body for holding the periphery of the work and having a shape for generating an air flow toward the outside of the work when the work rotates together with the rotating body. It is characterized by

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a spin-drying processing device for rotating a washed work by rotating it at a high speed.

[0002]

2. Description of the Related Art For example, in a manufacturing process of a semiconductor device or a liquid crystal display device, a film forming process or a photo process for forming a circuit pattern on a semiconductor wafer as a work or a rectangular glass substrate. There is. In these processes, the work and cleaning of the above work are repeated.

In order to dry the washed work,
The work is carried out by holding the work on a rotating body, rotating the work at a high speed together with the rotating body, and utilizing the centrifugal force generated thereby to remove the cleaning liquid adhering to the work.

The work is contaminated not only on the top surface but also on the back surface. Therefore, the back surface is also washed with a washing liquid prior to the drying process. The back surface of the work is cleaned in a cleaning process or in a drying process prior to the drying process.

As a structure for holding the work on the rotating body, a cylindrical holding member is provided upright on the rotating body. At the upper end of the holding member, a support pin that supports the lower surface of the peripheral portion of the work and a lock pin that engages with the outer peripheral surface are provided. Therefore, the work is held by the holding member by supporting the peripheral portion of the lower surface by the support pin and engaging the outer peripheral surface with the lock pin.

In such a holding state, the rotary member is
By rotating the work at a high speed together with the work, the washing liquid adhering to the upper and lower surfaces of the work is blown off by centrifugal force, and the work is dried.

However, when the work is rotated at a high speed to be dried, the cleaning liquid scattered from the lower surface of the work collides with the portion of the holding member located on the lower surface side of the work and bounces off. It may redeposit and the mist may remain on the lower surface. As a result, the work may be contaminated in the drying process after the cleaning process.

[0008]

As described above, when the work held by the holding member is rotated at a high speed and dried, the cleaning liquid scattered from the work collides with the holding member and bounces off the work. -There was a case where the mist was reattached to the bottom surface of the clay and remained and was contaminated.

The present invention has been made in view of the above circumstances. An object of the present invention is to prevent the cleaning liquid scattered from the work from reattaching to the work during the drying process. To provide a device.

[0010]

According to a first aspect of the present invention, there is provided a spin drying apparatus for holding a cleaned work and rotating the work at a high speed to dry the work. Driving means for rotating the body, and a shape for holding the periphery of the work provided on the rotating body and for generating an airflow toward the outside of the work when rotated integrally with the rotating body And a holding member set to.

According to a second aspect of the present invention, in a spin drying apparatus for holding a cleaned work and rotating it at a high speed to perform a drying process, a rotating body and a drive for rotationally driving the rotating body. Means, a support pin rotatably erected on the rotating body and supporting the lower peripheral portion of the work at the upper end, and a lock for eccentrically rotating by the rotation of the rotating body to hold the peripheral portion of the work. A holding member provided with a pin and a holding state of the work supported by the support pin by rotatably driving the holding member to eccentrically rotate the lock pin to bring it into contact with the outer peripheral surface of the work. The holding member locks the air flow toward the outside of the work when the lock pin rotates integrally with the rotating body while holding the work. Is set to the shape that occurs And wherein the Rukoto.

According to the inventions of claims 1 and 2, the work
When the work is rotated at a high speed and dried, a holding member that holds the work generates an air flow toward the outside of the work. Therefore, the cleaning liquid scattered from the work rides on the work flow and is discharged from the work. It is prevented from flowing out and reattaching.

Further, according to the invention of claim 2, a holding member for holding the work is rotatably provided, and the lock pin provided on the upper surface of the holding member is eccentrically rotated, whereby the work is held. Can be locked or unlocked.
Therefore, by setting the locked state, the work can be surely held during the drying process, and by releasing the locked state, the work can be easily attached and detached.

[0014]

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of the present invention will be described below with reference to the drawings. The spin drying apparatus of the present invention shown in FIG. 1 has a main body base 1. This body base 1
A cylindrical support body 2 is provided in the vertical direction to penetrate therethrough. A cylindrical rotating body 3 is also provided on the support body 2 such that the intermediate portion is rotatably supported by a bearing 4.

A lower end portion of the rotating body 3 projects from the support body 2, and a driven pulley 5 is fitted to the lower end portion thereof. A step motor 6 is arranged in the vicinity of the driven pulley 5. A drive pulley 7 is fitted on the rotary shaft 6a of the step motor 6, and a belt 8 is stretched between the drive pulley 7 and the driven pulley 5. Therefore, if the step motor 6 operates, the rotating body 3
Is driven to rotate.

A turntable 9 having a die 10 joined to the upper surface thereof is integrally attached to the upper end of the rotating body 3. On the turntable 9, four holding members 1 are provided at intervals of 90 degrees in the circumferential direction.
1 is rotatably erected via a bush 12.
The holding member 11 has a cylindrical portion 13 as shown in FIG. The cylindrical portion 13 has an upper end closed and a lower end opened. A support shaft 14 is hung from the cylindrical portion 13 with its lower end protruding, and the support shaft 14 is rotatably supported by the bush 12.

A support portion 15 having a streamlined cross section is integrally provided on the upper surface of the cylindrical portion 13. A support pin 16 and a lock pin 17 which is taller than the support pin 16 are provided upright on the upper surface of the support portion 15. The support pin 16 is substantially coaxial with the support shaft 14, and the lock pin 17 is provided eccentrically with respect to the axis.

As shown in FIG. 3, a semiconductor wafer 21 as a work is held by the four holding members 11 having the above structure. That is, the semiconductor wafer 21 is provided with the lower surface of the peripheral portion thereof being supported by the support pins 16. The holding member 1 with the semiconductor wafer 21 supported by the support pins 16
1 is rotated by a spring 54 described later. Thereby, the lock pin 17 provided on the holding member 11
3 rotates eccentrically and contacts the outer peripheral surface of the semiconductor wafer 21 as indicated by the chain line in FIG. 3, so that the semiconductor wafer 21 is held without being displaced in the radial direction.

As shown in FIG. 1, a through hole 25 is formed in the central portion of the turntable 9 and the die 10. A nozzle body 26 is fitted in the through hole 25 in a non-contact state.
The nozzle body 26 has a conical shape, and a nozzle hole 27 is formed on the upper surface thereof with one end open. The upper end of a support shaft 28 is connected to the lower end surface of the nozzle body 26. An upper portion of the support shaft 28 is held by a bracket 31 rotatably supported by a bearing 29 in the rotating body 3.

The bracket 3 inside the rotating body 3
Below 1, there is provided a housing 33 whose upper and lower ends are rotatably supported by the bearing 29 and another bearing 32. The housing 33 has a first through hole 34 through which the support shaft 28 is inserted, and a second through hole 36 through which a supply tube 35 having one end connected to the nozzle hole 27 is inserted. ing. The other end of the supply tube 35 communicates with a cleaning liquid supply unit (not shown).

Therefore, the cleaning liquid from the supply tube 35 can be sprayed from the nozzle hole 27 toward the center of the lower surface of the semiconductor wafer 21 held by the holding member 11. That is, the semiconductor wafer 21
The lower surface can be rinsed before being dried. Further, the nozzle body 26 held by the support shaft 28 is held in a non-contact state with the die 10 and the rotary body 9 so as not to rotate even if the rotary disk 9 rotates integrally with the rotary body 3.

A cylindrical lock cylinder 41 is rotatably provided on the outer peripheral surface of the rotating body 3 on the lower surface side of the rotating disk 9. A flange 42 is provided on the upper end of the lock cylinder 41 as shown in FIGS. 1 to 4, and four locking pins 43 are provided on the upper surface of the flange 42 at intervals of 90 degrees in the circumferential direction. ing.

The locking pin 43 is engaged with an engaging groove 45 formed at one end of the lever 44 and opened. The other end of the lever 44 is connected and fixed to the lower end portion of the support shaft 14 of the holding member 11 that projects toward the lower surface of the rotary disk 9.
Therefore, when the lock cylinder 41 is rotated clockwise as shown by the arrow in FIG. 3 and the lever 44 is rotated by the locking pin 43, the spindle 14 connected to the lever 44 is rotated.
The holding member 11 can be rotated via the.

As a result, the lock pin 17 rotates eccentrically, so that the semiconductor wafer 21 supported by the support pin 16 is rotated.
The support state of the semiconductor wafer 21 can be locked by bringing the lock pin 17 into contact with the outer peripheral surface of the semiconductor wafer 21. That is, the support pin 1
The semiconductor wafer 21 supported by 6 is prevented from moving in the radial direction. By rotating the lock cylinder body 41 counterclockwise, the locked state of the semiconductor wafer 21 by the lock pin 17 can be released.

With the semiconductor wafer 21 locked, as shown in FIG. 3, the supporting portion 1 of the holding member 11 is formed.
5, the central axis O of the streamline shape is inclined at a predetermined angle θ with respect to the tangent line S of the semiconductor wafer 21. Thereby,
When the holding member 11 rotates integrally with the turntable 9 provided on the rotating body 3, the semiconductor wafer 21 is attached to the streamlined support portion 15 of the holding member 11 as indicated by an arrow A in FIG.
An air flow is generated to the outside of the.

The streamline shape of the support portion 15 has a center line O
Is inclined at a predetermined angle (accuracy smaller than the accuracy θ) with respect to the tangent line S even when the upper part 21 is not locked.

The semiconductor wafer 2 using the lock pins 17
1 lock and unlock, that is, the lock cylinder 41
Is rotated by the release mechanism 51. As shown in FIGS. 4 and 6, the release mechanism 51 includes a first engaging piece 52 provided on the outer peripheral surface of the rotating body 3 and a second engaging piece provided on the outer peripheral surface of the lock cylinder 41. And a stop piece 53.

A spring 54 is stretched between the first locking piece 52 and the second locking piece 53. The spring 54 biases the lock cylinder 41 toward the first locking piece 52 via the second locking piece 53. That is, the lock cylinder 41
Is biased in the counterclockwise direction indicated by the arrow in FIGS. Therefore, since the spring 54 rotates the lock cylinder 41, the holding member 11 is rotated via the locking pin 43 and the lever 44, and the lock pin 17 contacts the outer peripheral surface of the semiconductor wafer 21. It becomes a state.

To release the locked state of the semiconductor wafer 21 by the lock pin 17, as shown in FIGS. 5 and 6, the first cylinder 61 constituting the release mechanism 51 arranged near the step motor 6 is used. , Second cylinder 62.

That is, as shown in FIG. 5, the first cylinder 61 is provided on the main body base 1 via the first substrate 62. The first cylinder 62 is provided on the first substrate 62.
A first movable body 64 is slidably supported by a first linear guide 63 on the side of the. The first movable body 64 is connected to the rod 61a of the first cylinder 61. As a result, the first movable body 64 is driven to reciprocate along the first linear guide 63 by the operation of the first cylinder 61.

A pair of holding rollers 65 are provided at a predetermined interval at the tip of the upper surface of the first movable body 64.
When the first movable body 64 is driven in the forward direction, these holding rollers 65 hold the first locking piece 52 of the rotating body 3 stopped at a predetermined rotation angle as shown by the chain line in FIG. To do. As a result, the first rotating body 64 is prevented from rotating.

The second cylinder 62 is attached to the main body base 1 via a second substrate 66. Second
A second movable body 68 is slidably provided on the base plate 66 on the side of the second cylinder 62 by a second linear guide 67. A pressing roller 69 is rotatably provided at the tip of the upper surface of the second movable body 68. Therefore, the pressing roller 69 is driven back and forth by the second cylinder 62.

The rotating body 3 stops at a predetermined rotation angle,
When the second cylinder 62 is actuated and the second movable body 68 is driven in the forward direction while the first locking piece 52 is sandwiched by the pair of sandwiching rollers 65, 6
As shown by the chain line, the pressing roller 69 provided on the tip end of the second locking piece 5 provided on the lock cylinder body 41.
Press 3. As a result, the lock cylinder 41 is rotated against the urging force of the spring 54, so that the holding member 11 is rotated in the direction opposite to the locked state via the locking pin 43 and the lever 44. Therefore, the lock pin 17 is eccentrically rotated to release the locked state of the semiconductor wafer 21.

As shown in FIG. 1, a dog 71 is provided on the outer peripheral surface of the lower end portion of the rotating body 3, and the dog 71 is detected by a microphotosensor 72. The rotation angle of the rotating body 3 by the step motor 6 is controlled by the detection signal of the micro photo sensor 72. That is, when the locked state of the semiconductor wafer 21 is released, the first and second cylinders 61 and 62 of the release mechanism 51 are set to the first position.
The rotation angle of the rotating body 3 is controlled so that the tongue piece 52 and the second tongue piece 53 are located at predetermined positions.

On the upper surface side of the main body substrate 1, the rotating body 3 is provided.
And a lower cup 75 for accommodating the upper part of the above, and an upper cup 76 having an opening on the upper surface for covering the peripheral portion on the upper surface side of the semiconductor wafer 21 held by the holding member 11.
The upper cup 76 is provided so as to be vertically movable, and a rod 76 of a vertical drive cylinder (not shown) is connected to the upper cup 76. By operating this cylinder, the upper cup 76 is vertically driven.
When the upper cup 76 is lowered to the position shown by the chain line in FIG. 1, the upper part of the holding member 11 projects from the upper surface opening. Therefore, the unprocessed semiconductor wafer 21 can be supplied to the holding member 11 or the dried semiconductor wafer 21 can be taken out by a robot (not shown). Further, the discharge pipe 7 is attached to the lower cup 75.
7 is connected.

When the wafer 21 cleaned by the spin drying apparatus having the above-described structure is dried, first, the upper cup 75 is lowered, and the first and second release mechanisms 51 are moved. Rod 61 of cylinder 61, 62
By driving a and 62a in the forward direction, the lock cylinder body 41 is rotated against the biasing force of the spring 54, and the lock pin 17 provided on the holding member 11 is eccentrically rotated to the lock release position.

Then, if the semiconductor wafer 21 is supplied onto the support pins 16 of the four holding members 11 by a robot (not shown), the first and second cylinders 61 and 62 are provided.
The rods 61a and 62a are driven backward to rotate the lock cylinder 41 by the restoring force of the spring 54. As a result, the holding member 11 rotates, and the lock pin 17 provided on the holding member 11 eccentrically rotates.
7 contacts the outer peripheral surface of the semiconductor wafer 21 and is locked so that the semiconductor wafer 21 does not move in the radial direction.

Next, the step motor 6 is operated to rotate the rotating body 3 at a high speed. At the same time, if the cleaning liquid is supplied from the nozzle hole 27 toward the center of the lower surface of the semiconductor wafer 21 for a predetermined time to rinse the lower surface of the semiconductor wafer 21, the supply of the cleaning liquid is stopped and the rotating body 3 is rotated at a high speed for a predetermined time. Let As a result, the cleaning liquid attached to the upper surface and the lower surface of the semiconductor wafer 21 is blown off by the centrifugal force, so that the semiconductor wafer 21 is dried.

When the semiconductor wafer 21 is dried, the supporting portion 15 of the holding member 11 holding the semiconductor wafer 21 has a streamline cross-sectional shape, and when the semiconductor wafer 21 is locked and rotated, the streamlined axis line thereof is formed. O is inclined at a predetermined angle θ with respect to the tangent line S of the outer peripheral surface of the semiconductor wafer 21.

Therefore, since the holding member 11 rotates together with the rotating body 3 to generate an airflow toward the outside of the semiconductor wafer 21 as shown by an arrow A in FIG. The cleaning liquid scattered toward the outside flows out from the lower surface side of the semiconductor wafer 21 to the outside together with the airflow A.

That is, since the cleaning liquid scattered from the lower surface side of the semiconductor wafer 21 is prevented from being reflected by the holding member 11 and redeposited on the lower surface thereof, mist is attached to the lower surface of the semiconductor wafer 21 during the drying process. It will never be polluted.

When the drying process of the semiconductor wafer 21 is completed, the step motor 6 is stopped while the rotation angle of the rotating body 3 reaches a predetermined position. Then, the first cylinder 6 and the second cylinder 62 of the release mechanism 51 are operated to rotate the lock cylinder 41 against the urging force of the spring 54, so that the lock state of the semiconductor wafer 21 by the lock pin 17 is maintained. To release.

When the locked state of the semiconductor wafer 21 is released, the upper cup 76 is driven downward to expose the semiconductor wafer 21 held by the holding member 11 from the opening in the upper surface thereof. Next, if the semiconductor wafer 21 is unloaded by a robot (not shown) and a new semiconductor wafer 21 that has not been dried is supplied, the semiconductor wafer 21
The drying process is repeated according to the procedure described above.

The semiconductor wafer 21 held by the support pins 16 of the holding member 11 is locked in the holding state by the lock pins 17 so as not to move in the radial direction during the drying process. Therefore, unlike the case where the semiconductor wafer 21 is dried without being locked, the semiconductor wafer 21 does not move in the radial direction during the drying process so that the peripheral portion collides with the pin and the chipping does not occur.

Moreover, the locked state of the semiconductor wafer 21 by the lock pin 17 can be released. Therefore, by keeping the lock pin 17 in the unlocked position, the lock pin 17 does not interfere when the semiconductor wafer 21 is supplied to the holding member 11 or when the dried semiconductor wafer 21 is taken out. . In other words, it becomes possible to efficiently and surely perform the supply / removal work of the semiconductor wafer 21.

The present invention is not limited to the above embodiment,
Various modifications are possible. For example, although the semiconductor wafer is used as the work in the above-described embodiment, even if a rectangular glass substrate used in a liquid crystal display device is used instead of the semiconductor wafer, the drying process is performed by the device of the present invention. It is clear that

Further, although the upper half of the holding member is formed as a supporting portion having a streamline cross-sectional shape, the portion serving as the supporting portion is not limited to the upper half of the holding member, and may be more than half or less than half. Well, the point is that at least at the time of rotary drying
The cross-sectional shape of the portion where the cleaning liquid splashing from the lower surface of the gear hits when the rotational speed exceeds a predetermined value is streamlined. Further, the cross-sectional shape of the support portion is not limited to the streamline shape,
The point is that it should have a shape that produces an air flow toward the outside of the work during rotation.

[0048]

As described above, according to the first and second aspects of the present invention, when the work is rotated at a high speed to perform the drying process, the work is held by the holding member holding the work outside the work. The shape of the holding member was set so that an airflow directed in the direction was generated.

Therefore, during the drying process, the cleaning liquid scattered from the work flows along with the air stream and flows out of the work, so that the cleaning liquid is reflected by the holding member as in the conventional case.
It is prevented from reattaching to the black.

Further, according to the invention of claim 2, the holding member for holding the work is rotatably provided, and the lock pin provided on the upper surface of the holding member is eccentrically rotated so that the work is held. You can now lock or unlock the lock.

Therefore, by keeping the work in the locked state, the work can be surely held during the drying process, and by releasing the locked state, the work can be easily attached and detached. You can

[Brief description of drawings]

FIG. 1 is a cross-sectional view of a schematic configuration of the entire apparatus showing an embodiment of the present invention.

FIG. 2 is a perspective view of the holding member.

FIG. 3 is an explanatory view showing the relationship between the lock cylinder and the support member.

FIG. 4 is a schematic view showing a relationship between a lock cylinder and a release mechanism.

FIG. 5 is a front view of the releasing mechanism.

FIG. 6 is a plan view of the release mechanism.

[Explanation of symbols]

3 ... Rotating body, 6 ... Step motor (driving means), 11 ...
Holding member, 16 ... Support pin, 17 ... Lock pin, 21 ...
Semiconductor wafer (work).

Claims (2)

[Claims] 1. A spin drying apparatus for holding a washed work and rotating it at a high speed to perform a drying process, wherein a rotating body, a driving means for rotationally driving the rotating body, and the rotating body are provided. And a holding member configured to hold a peripheral portion of the work and generate an airflow toward the outside of the work when the work rotates integrally with the rotating body. Spin drying treatment device. 2. A spin drying apparatus for holding a washed work and rotating it at a high speed to perform a drying process, a rotating body, a driving means for rotating the rotating body, and a rotating body for rotating the rotating body. A support member which is freely erected and provided at its upper end with a support pin for supporting the peripheral portion of the lower surface of the work and a lock pin for eccentrically rotating by the rotation of the rotating body to retain the peripheral portion of the work; A lock mechanism for locking the holding state of the work supported by the support pin by rotationally driving the holding member to eccentrically rotate the lock pin to bring it into contact with the outer peripheral surface of the work. The holding member, when the lock pin rotates integrally with the rotating body while holding the work, holds the work.
A spin-drying processing device, characterized in that the spin-drying processing device is set to have a shape that generates an air flow toward the outside of the chamber.