JPH1012421A - Multiple chip electronic component and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a multiple chip electronic component wherein, when swarf and evaporized materials stick to a part between surface film type electrodes of both sides of a chip substratum which are produced by adjustment or the like of electronic element bodies formed on the chip substratum, bridges or short circuit are not caused at the plating process of an electrode plating layer in the later processes, and a manufacturing method of it. SOLUTION: A plurality of pairs of surface film type electrodes 12 are formed on the surface of an insulating chip substratum 10 along both side edges facing each other. The respective electronic element bodies 13 are formed between the surface film type electrodes 12 of both sides making pairs. Protective films 15, 17 are formed on almost the entire surface containing space parts 14 between the adjacent surface film type electrodes 12, exposing the surface film type electrodes 12 on the surface of the chip substratum 10. Electrode plating layers 18 are formed on the surface film type electrodes 12, on the end surface of the chip substratum 10.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multiple type combining a plurality of electronic elements such as a plurality of resistor elements, a resistor element and a capacitor element, or a resistor element or a capacitor element and a coil element. The present invention relates to a chip electronic component and a method for manufacturing the same.

[0002]

2. Description of the Related Art As shown in FIG. 8, a conventional multi-chip electronic component of this type has a plurality of pairs of surfaces opposing each other along both side edges on the surface of each chip base 1 of an insulating body. The film electrode 2, the end face film electrode, and the back film electrode are formed by printing and baking, and the electronic elements such as a resistor element, a capacitor element, and a coil element are respectively disposed between each pair of the surface film electrodes 2 on both sides. The element body 3 is formed by printing and baking, and the surface film electrode 2 and the space 4 between the adjacent surface film electrodes 2 are exposed on the surface of the chip base 1 so as to expose the electronic element body 3 and the adjacent electrons. A first glass protective film 6 covering the space 5 between the element bodies 3 is formed by printing and baking, and then the electronic element body 3 is cut or evaporated by a cutting blade, sandblast, laser light, or the like, and is trimmed with a trimming groove 3a or the like. Resistance value, capacity, etc. After adjustment, a second glass protective film 7 is formed on the surface of the glass protective film 6 by printing and baking, and the insulative body is cut for each chip substrate 1. Surface membrane electrode,
A method of forming the electrode plating layers 8 and 9 by chemical treatment for connecting to the front surface film electrode 2 from the end surface film electrode and the back surface film electrode to the back surface has been adopted.

[0003]

In the above-mentioned conventional multiple chip electronic component, the protective film 6 is provided between the adjacent surface film electrodes 2 of the surface film electrodes 2 formed along both side edges of the chip base 1. , 7 are not formed, so that the trimming grooves 3a formed by cutting or evaporating the electronic element body 3 are formed.
In some cases, cutting chips and evaporating substances generated by the scattering may be scattered between the adjacent surface film electrodes 2 and adhere to the surface of the chip base.

[0004] The scattered substance contains a metal substance and a glass substance of each component in the electronic element body 3 and the glass protective film 6, and when the electronic element body 3 is a coil element body, the conductive film in the central through hole. When the scattered substance is attached, when an electrode connected to the surface film electrode 2 is formed by chemical treatment such as plating from the end face to the back face of the chip base 1,
The scattered substance causes plating nuclei or nucleation in the subsequent step of forming the electrode plating layers 8 and 9, and causes defective products such as bridges or short circuits between adjacent surface film-shaped electrodes 2. Had a problem such as bad.

The present invention has been made in view of the above-mentioned problems. Even if cutting chips and evaporative substances generated by adjustment of an electronic element formed on a chip base adhere to the surface film electrodes on both sides of the chip base. An object of the present invention is to provide a multiple chip electronic component which does not cause a bridge or a short circuit at the time of plating of an electrode plating layer in a later step, and a method of manufacturing the same.

[0006]

According to a first aspect of the present invention, there is provided a multi-chip electronic component comprising: an insulating chip base; and a plurality of chip bases formed on the surface of the chip base and opposed to each other along both side edges. A pair of surface film electrodes, an end film electrode connected to the surface film electrode and formed on the end surface of the chip base, and a back film formed on the back surface of the chip base connected to the end film electrode and connected to the end film electrode Electrode element, an electronic element body formed between each pair of surface film electrodes on both sides of the chip substrate, and an adjacent surface film electrode exposing the film electrode on the surface of the chip substrate. A protective film is formed on substantially the entire surface including the space between the electrodes, and a surface plating electrode, an end plating electrode, and an electrode plating layer formed on the back film electrode of the chip substrate.

Since a protective film is formed between adjacent surface film-like electrodes formed along both side edges of the insulating chip substrate, the resistance value is reduced by trimming the electronic element body.
Even if scattered substances including metal substances and glass substances generated by cutting or evaporation grooves formed by adjusting the capacity etc. scatter between adjacent surface film electrodes, the space between adjacent surface film electrodes Is covered with a protective film formed on almost the entire surface, including the surface, and does not cause defective products such as a bridge or a short circuit between adjacent surface film electrodes in a later step of forming an electrode plating layer. .

According to a second aspect of the present invention, there is provided a method of manufacturing a multiple chip electronic component, wherein a plurality of chip bases are connected to each other along a side edge of each of the chip bases on a surface of an insulating plate connected to the plurality of chip bases. Forming a pair of surface film electrodes, an end surface film electrode on the inner peripheral surface of a through hole penetrating through both side edges of each chip substrate, and a back film electrode on the back surface of each chip substrate; A step of forming an electronic element body between the pair of surface film electrodes on both sides, and a step of coating at least the electronic element body on the surface of each chip base and exposing the surface film electrode. Forming a first protective film, trimming each electronic element body of each chip substrate, and forming a second protective film on the surface of the first protective film of each chip substrate. And the insulating base plate is attached to each chip base. It is intended to include a step of cutting, the surface film electrode of the chip substrate, and forming an electrode plated layer on the end face film electrode and the back surface film electrode on.

A plurality of pairs of surface film electrodes, end film electrodes, and back film electrodes are provided on the surface of the insulating base plate having a plurality of chip substrates connected to each other along both side edges of each chip substrate. Subsequent to the forming step, after a step of forming an electronic element body between each pair of surface film-like electrodes on each surface of each chip base is performed on the surface of each chip base, the surface of each chip base is slightly lessened in the next step. In addition to covering the electronic element body, the first protective film is formed on almost the entire surface including the space between the adjacent film electrodes by exposing the surface film electrode,
In the step of trimming each electronic element body of each chip base performed after this step, even if cutting chips scattered and evaporated substances scatter between adjacent surface film electrodes and adhere to the first protective film, This is covered with a second protective film formed in a step performed after this step, and a surface film electrode in a subsequent step is provided.
In the step of forming the electrode plating layer formed on the end surface film-shaped electrode and the back surface film-shaped electrode, a defective product such as a bridge or a short circuit between adjacent surface film-shaped electrodes does not occur.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, an embodiment of a multiple chip electronic component of the present invention will be described with reference to FIG.

In FIG. 1, reference numeral 10 denotes an insulative chip base made of ceramic, and semicircular concave parts 11 are provided at a plurality of positions along both side edges of the chip base 10 at predetermined intervals. Is formed. Then, a plurality of pairs of surface film-like electrodes 12 are formed on the surface of the chip substrate 10 at positions corresponding to the concave portions 11 along both side edges so as to face each other.
An end face film-like electrode 19 is formed on the end face part of the concave portion 11 following the surface film-like electrode 12, and further, the end face film-like electrode 19 is formed.
The back surface film-like electrode is formed on the back surface of the chip substrate 10 continuously. Each surface film electrode 12 is formed by printing and baking a silver-palladium paste, for example.

An electronic element body 13 whose both ends are overlapped and connected to the surface film-shaped electrodes 12 is formed between the surface film-shaped electrodes 12 on both sides of the chip base 10 along both side edges. Each is formed.

The electronic element body 13 is formed by, for example, printing a ruthenium oxide (RuO ₂ ) -based paste and forming it by firing, or a barium titanate (BaTiO ₂ ) -based paste by printing and firing. A coil or inductor element is formed by printing and firing a capacitor element body, or gold, silver, aluminum, chromium, nickel, copper or an alloy thereof, preferably a copper-based paste. Note that when a copper-based paste is used, it is easily oxidized, so that it is fired in a non-oxidizing atmosphere.

A multiple type in which only a plurality of resistor elements are formed in parallel, a multiple type in which a resistor element and a capacitor element are combined, a multiple type in which a resistor element and a capacitor element are combined, and a resistor A network is formed by combining appropriate element bodies such as a multiple type combining an element body and a coil or an inductor element body, or a multiple type combining a capacitor element body and a coil or an inductor element body.

Further, the surface film-like electrode 12 is exposed on the surface of the chip base 10 and includes a space portion 14 between the adjacent surface film-like electrodes 12 so as not to overlap with the surface film-like electrode 12. Almost all over the electronic element body 13
A first protective film 15 is formed by forming a lead silicate-based glass into a paste, printing and firing the paste. Note that the first protective films 15 are not formed on both ends of the chip substrate 10.

The electronic element 13 is cut or evaporated by a cutting blade, sand blast, laser light, or the like, so that the resistance value, the capacity, and the like are trimmed.
At this time, since the electronic element body 13 is covered with the first protective film 15, there is no obstacle such as heat loss at the time of trimming by laser light or the like, and the trimming can be surely adjusted. For example, in the case of a resistance element body, the resistance value is adjusted in the adjustment trimming groove 16 so that the surface of the chip base 10 is exposed at the center.

The surface film electrode 12 is exposed on the surface of the chip base 10 where the electronic element body 13 is trimmed and adjusted so as not to overlap with the surface film electrode 12. The electronic element body including the space 14 between
A second protective film 17 is formed on almost the entire surface so as to cover 13, which is formed by pasting and printing boro-lead silicate glass and then firing.

The thickness of the first protective film 15 and / or the second protective film 17 between the adjacent surface film electrodes 12 and between the electronic element bodies 13 depends on the thickness of the surface film electrode 12 or the end surface film electrode. The thickness is smaller than or equal to the thickness of 19, so that it does not protrude from the surface of the surface film electrode 12 or the end surface film electrode 19.

Next, the surface film electrode of the chip base 10
12, an electrode plating layer 18 is formed on the end face film electrode 19 and the back film electrode.

A network circuit can be formed on the end face and the back face of the chip base 10 by forming an electronic element body connected to the surface film electrode 12 as required.

Next, the operation of this embodiment will be described.

Since the first and second protective films 15 and 17 are formed between the adjacent surface film electrodes 12 formed along both side edges of the insulating chip substrate 10, the Cutting chips and evaporating substances generated by cutting or evaporating grooves formed by adjusting the resistance value, capacity, etc. by trimming or the like are scattered between adjacent surface film electrodes 12 and adhere to the first protective film 15, Even if a scattered substance containing a metallic substance and a glass substance of each component adheres to the first protective film 15, the first protective film 15 including the space between the surface film electrodes 12 is formed on the first protective film 15. Since the second protective film 17 is formed almost on the front surface, the electrode plating layer
In the step of forming 18, no bridge or short circuit between the adjacent surface film-like electrodes 12 occurs.

In the above embodiment, the first protective film 15
Is formed on almost the entire surface of the chip base 10 by exposing the surface film-like electrode 12, but it is sufficient that at least the electronic element body 13 is covered.

Next, an embodiment of a method of manufacturing a multiple chip electronic component according to the present invention will be described with reference to FIGS.

In FIG. 2, reference numeral 20 denotes an insulative base plate formed of ceramic, and has cut grooves 21 formed in the vertical and horizontal directions so that a large number of chip bases 10 can be dividedly formed. Circular through holes 22 are formed at a plurality of locations along the cutting grooves 21 on both side edges which are the longitudinal direction of the chip base 10 so as to face each other at predetermined intervals. The through holes 22 form the arc-shaped concave portions 11 on both side edges of the chip base 10 formed by cutting along the cutting grooves 21.

In the first step, as shown in FIG. 2, a plurality of chip bases 10 are connected to each other along the side edges of each of the chip bases 10 on the surface of the insulating base plate 20 connecting the plurality of chip bases 10. In the step of forming the pair of surface film-shaped electrodes 12 and forming the end surface film-shaped electrodes 19 and the back film-shaped electrodes, the surface of the chip base 10 is opposed to each other at the position of the concave portion 11 along both side edges. A pair of surface film electrodes 12 is formed. In the step of forming the surface film-like electrode 12, the paste of the surface film-like electrode 12 is sucked from the through-hole 22 and flows into the through-hole 22. Next, the insulating base plate 20 is inverted to form a back film electrode on the back surface of each chip base 10. In the step of forming the back film electrode, the paste of the back film electrode is sucked from the through-hole 22 to flow the paste of the back film electrode into the through hole 22, and the surface film electrode is formed on the inner peripheral surface of the through hole 22.
The end face film-like electrode 19 is formed by connecting the paste of No. 12 and the paste of the back face film-like electrode and firing. In addition,
The surface film electrode 12, the end surface film electrode 19, and the back film electrode are formed, for example, by printing and firing a silver-palladium paste.

In the second step, as shown in FIG. 3, an electronic element body 13 is formed between each pair of surface film electrodes 12 on both sides of each chip substrate 10, and the chip substrate 10 is formed.
Surface membrane electrodes on each side paired with each other along both sides of the
An electronic element body 13 whose both ends are connected to the surface film-like electrode 12 is formed between the two. This electronic element body 13
For example, a resistor element formed by printing and firing a ruthenium oxide (RuO ₂ ) -based paste, a capacitor element formed by printing and firing a barium titanate (BaTiO ₂ ) -based paste, or gold, A coil or inductor element body is formed by printing a silver-based paste, preferably a copper-based paste such as silver, aluminum, chromium, nickel, copper, or an alloy thereof, followed by firing.

A multiple type in which only a plurality of resistor elements are formed in parallel, a multiple type in which a resistor element and a capacitor element are combined, a multiple type in which a resistor element and a capacitor element are combined, a resistor A network is formed by combining appropriate element bodies such as a multiple type combining an element body and a coil or an inductor element body, or a multiple type combining a capacitor element body and a coil or an inductor element body.

In the third step, as shown in FIG. 4, the surface film-like electrodes 12 are exposed on the surface of each of the chip bases 10 and substantially including the space 14 between the adjacent surface film-like electrodes 12. In the step of forming the first protective film 15 on the entire surface, the chip base
The surface film electrode 12 is exposed on the surface of the surface film electrode 10 so as not to overlap the surface film electrode 12.
A first protective film 15 is formed by pasting and printing boro-lead silicate glass over almost the entire surface so as to cover the electronic element body 13 including the space 14 between the 12 and then firing. In addition,
The first protective film 15 is not formed on both ends of the chip substrate 10.

The fourth step is a step of trimming each of the electronic element bodies 13 of each of the chip bases 10, and as shown in FIG. 5, the electronic element bodies 13 are cut with a cutting blade, sand blast or laser light. Alternatively, the resistance value and the capacity are trimmed by evaporation. At this time, since the electronic element body 13 is covered with the first protective film 15, there is no obstacle such as heat loss at the time of trimming by a laser beam or the like.
Trimming adjustment can be performed reliably. For example, in the case of a resistance element body, the resistance value is adjusted in the adjustment trimming groove 16 so that the surface of the chip base 10 is exposed at the center.

The fifth step is a step of forming a second protective film 17 on the surface of the first protective film 15 of each of the chip substrates. The electronic element body 13 is trimmed and adjusted on the surface of the chip substrate 10. In order to expose the surface film-like electrode 12, the adjacent surface film-like electrode 12 is not overlapped with the surface film-like electrode 12.
A second protective film 17 is formed by pasting and printing boro-lead silicate glass over almost the entire surface so as to cover the electronic element body 13 including the space portion 14 between the layers 12, and then firing.

The thickness of the first protective film 15 and / or the second protective film 17 between the adjacent surface film electrodes 12 and between the electronic element bodies 13 is determined by the surface film electrode 12 or the end surface film electrode 19. Is smaller than or equal to the thickness of the surface film-shaped electrode 12 or the end surface film-shaped electrode 19 so as not to protrude.

The sixth step is a step of cutting the insulative base plate 20 for each chip base 10, and cutting along the cutting grooves 21 as shown in FIG. At this time, circular through-holes 22 formed opposite to each other at predetermined intervals at a plurality of locations along the cutting groove 21 facilitate cutting along the cutting groove, and the through-hole 22 extends along the cutting groove 21. Arc-shaped concave portions 11 are formed on both side edges of the chip base 10 formed by the cutting.

In the seventh step, the surface film-like electrode 12 of the chip base 10, the terminal film-like electrode 19 connected to the surface film-like electrode 12, and the back film-like electrode connected to the terminal film-like electrode 19 are formed. An electrode plating layer 18 is formed on the electrode by a chemical treatment.

On the back surface of the chip substrate 10, an electronic element connected to the surface film electrode 12 is formed as necessary to form a network circuit.

Next, the operation of this embodiment will be described.

An insulating base plate in which a plurality of chip bases 10 are connected.
Subsequent to the step of forming a plurality of pairs of surface film-like electrodes 12 facing each other along both side edges of each chip substrate 10 on the surface of 20, each pair of surface film-like electrodes 12 After the step of forming the electronic element bodies 13 in between, the surface film-shaped electrodes 13 are exposed on the surface of each chip substrate 10 and substantially include the space 14 between the adjacent surface film-shaped electrodes 13. A step of forming a first protective film 15 on the entire surface, and each electronic element body 13 of each chip base 10 performed after this step.
In the step of trimming the surface, the cutting debris and the evaporant scattered between the adjacent surface film electrodes 12 and the first protective film
Even if it adheres on the first protective film 15, a second protective film 17 is formed on the first protective film 15, so that the surface film electrode 12, the terminal film electrode In the step of forming the electrode plating layer on the film electrode 19 and the back film electrode, defective products such as a bridge or a short circuit between adjacent surface film electrodes 12 do not occur.

In the above embodiment, the first protective film is used.
Although 15 is formed on almost the entire surface of the chip base 10, at least the electronic element body 13 may be covered.

In both of the above embodiments, when the electronic element 13 is a coil element, the chip substrate 10 is plated,
The outer peripheral side is connected to the back surface film electrode 12 connected to the front surface film electrode 12 and / or the end film electrode 19 of the chip base 10 by printing and baking, vacuum deposition, etc. to form a film coil element body. The film-shaped coil element body is covered with a first protective film 15, and the film-shaped coil element body is spirally scribed with a laser beam, and is positioned at the center of the spiral film-shaped coil element body. Then, a through-hole is formed in the chip base, a conductive film connected to the center of the film-shaped coil element body is formed in the through-hole, and the through-hole is connected to the back film electrode formed on the back of the chip base 10.

In both of the above embodiments, the first and second protective films 15 and 17 may be formed by applying and curing an epoxy resin.

[0041]

According to the present invention, cutting chips and vaporized substances generated by adjusting the electronic element formed on the chip base do not adhere to the electrodes on both sides of the chip base to cause a bridge or a short circuit. , Increase the production yield,
The reliability can be improved without shortening the distance between the film electrodes.

Further, even if cutting chips and evaporated substances scattered in the step of trimming each electronic element body of each chip base scatter between adjacent surface film electrodes, a second protective film is formed between the surface film electrodes. Is formed, so that in the step of forming an electrode plating layer on the surface film-like electrode of the chip substrate performed after this step, a cause of defective product generation such as a bridge or a short circuit between adjacent surface film-like electrodes is generated. Thus, a multi-chip electronic component with high reliability can be easily manufactured without increasing the manufacturing yield and without reducing the distance between the film-shaped electrodes.

[Brief description of the drawings]

FIG. 1 is a plan view, partially cut away, of a multiple chip electronic component showing an embodiment of the present invention.

FIG. 2 is a plan view of an insulating base plate showing a film-like electrode forming step of the method of manufacturing a multiple chip electronic component according to one embodiment of the present invention.

FIG. 3 is a plan view of the insulating base plate, showing an electronic element body forming step of the method for manufacturing a multiple chip electronic component according to the first embodiment.

FIG. 4 is a plan view of the insulating base plate, showing a first protective film forming step of the method for manufacturing a multiple chip electronic component according to the first embodiment;

FIG. 5 is a plan view of the insulating base plate, showing a trimming step of the method for manufacturing a multiple chip electronic component according to the first embodiment;

FIG. 6 is a plan view of the insulating base plate showing a second protective film forming step of the method for manufacturing a multiple chip electronic component according to the first embodiment.

FIG. 7 is a plan view of the chip base, showing a cutting step of the method for manufacturing a multiple chip electronic component according to the first embodiment;

FIG. 8 is a plan view of a conventional multiple chip electronic component with a part cut away.

[Explanation of symbols]

 10 Chip substrate 12 Surface film electrode 13 Electronic element body 14 Space 15 First protective film 17 Second protective film 18 Electrode plating layer 19 End film electrode 20 Insulating base plate 22 Through hole

Claims (2)

[Claims] 1. An insulative chip base, a plurality of pairs of surface film electrodes formed on a surface of the chip base along both side edges to face each other, and the chip base connected to the surface film electrodes. Between the end surface film-shaped electrodes formed on the end surface of the chip substrate, the back surface film-shaped electrodes connected to the end surface film-shaped electrodes and formed on the back surface of the chip substrate, and the surface film electrodes on both sides of each pair of the chip substrate. An electronic element body respectively formed on the chip base; a protective film formed by exposing the film-shaped electrode on the surface of the chip base and forming a substantially entire surface including a space between adjacent surface film-shaped electrodes; A multi-chip electronic component comprising: a surface film electrode, an end surface film electrode, and an electrode plating layer formed on the back film electrode. 2. A plurality of pairs of surface film-like electrodes, which penetrate both sides of each chip base, facing each other along both sides of the chip base on the surface of the insulating base plate in which a plurality of chip bases are connected. Forming an end surface film-like electrode on the inner peripheral surface of the through hole and a back surface film-like electrode on the back surface of each chip base; and an electronic element body between the pair of surface film-like electrodes on both sides of each pair of the chip base surface. Forming a first protective film formed by covering at least the electronic element body on the surface of each chip base and exposing a surface film-shaped electrode; and forming each chip base. Trimming each electronic element body, forming a second protective film on the surface of the first protective film of each chip substrate, and cutting the insulating base plate for each chip substrate. A surface film-shaped electrode of the chip substrate; Forming an electrode plating layer on the end surface film-shaped electrode and the back surface film-shaped electrode.