JPH10125501A - Terminal connection method for electronic components - Google Patents

Abstract

(57) [Summary] [Problem] To provide a method for connecting a flat element of an electronic component to a terminal, the method including an insert molding process for preventing an influence of a solder flux when soldering and connecting to a wiring board of a device to be used. It is an object of the present invention to provide a method for connecting terminals of electronic components that is not shared and does not affect the element due to heat during molding. A heat-resistant resin is provided at a predetermined pitch with intermediate portions 11D of a predetermined number of terminals 11 having one end serving as a caulking leg 11A to a resistance element substrate 12 and the other end serving as a connection leg 11B to a wiring board. After the insert molding, the caulking legs 11A of each terminal 11 are caulked and connected to the connection holes 12A of the resistance element substrate 12, so that the insert molding process can be shared regardless of the specifications of the resistance element substrate 12. At the same time, the resistance element substrate 12 is not affected by the forming process.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for connecting terminals of an electronic component having a flat element such as a variable resistor or a switch, which is used when connecting the terminal to the element.

[0002]

2. Description of the Related Art In recent years, various electronic devices have been miniaturized in order to be used for portable purposes or to aggregate multiple functions, and electronic components used for such devices have also been required to be reduced in size and thickness. ing.

[0003] For this reason, the terminals of electronic parts are also arranged in a short pitch with a short dimension, and the connecting portions between the terminals and the elements are insert-molded with a heat-resistant molding resin and soldered to a wiring board of a device to be used. So that it is not affected by solder flux.

[0004] Such a conventional method of connecting terminals of electronic parts will be described with reference to FIGS. 4 to 6 using a variable resistor as an example. First, as shown in an exploded perspective view of FIG. The crimping legs 1A at one end of the predetermined number of terminals 1 are respectively inserted into the connection holes 2A of the flat resistive element substrate 2 made of the heat-resistant insulating substrate described above, and the crimp connection is performed as shown in the perspective view of FIG. After that, as shown in the cross-sectional view of FIG.
And the back surface and outer periphery of the resistive element substrate 2 except for the resistive element surface 2B were covered with the resin.

Thereafter, the leg 1B at the other end of the terminal 1 is cut and bent to a predetermined size and assembled into a variable resistor. The leg 1B of the terminal 1 is soldered to a wiring board of a device to be used. The solder flux at the time of connection was configured such that the molded resin portion 3A covering the caulking connection portion 3 prevented the intrusion of the resistance element substrate 2 into the resistance element surface 2B.

[0006]

However, in the above-mentioned conventional method for connecting terminals of electronic parts, it is necessary to divide production lots according to the specifications of elements in the process of manufacturing electronic parts. Although it is necessary to classify production lots according to differences in the resistance value of the substrate 2 and the like, in the above-described conventional terminal connection method, it is necessary to classify even the most troublesome insert molding process in the manufacturing process. In addition, there is a problem that the production efficiency is deteriorated. In addition, in order to suppress a change in element characteristics due to heat or pressure at the time of insert molding of the resistance element substrate 2, expensive materials are used or special management is performed. There is also a problem that the cost must be increased because it must be done.

The present invention solves such a conventional problem, and it is not necessary to classify the most troublesome insert molding process in the manufacturing process of this kind of electronic component into lots according to the specification of the element. It is an object of the present invention to provide an inexpensive terminal connection method for electronic components that does not require special consideration for changes in element characteristics due to heat or pressure during molding.

[0008]

In order to solve the above-mentioned problems, a method for connecting terminals of an electronic component according to the present invention comprises a metal plate having one end connected to an element and the other end connected to a wiring board. After insert molding and fixing around a middle portion of a predetermined number of terminals with a heat-resistant molding resin at a predetermined pitch, a connection portion of each terminal is caulked to a flat element.

Accordingly, the insert molding process for providing a blocking portion for preventing the solder flux from entering the element portion when the electronic component is connected to the wiring board by soldering can be shared regardless of the element specifications. In addition to this, it is not necessary to consider the influence of the forming process on the element.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The invention according to claim 1 of the present invention is an intermediate between a predetermined number of metal plate terminals, one end of which is a connection to an element and the other end of which is a connection leg to a wiring board. Around the part
A terminal connection method of an electronic component in which a connection portion of each terminal is fixed to a heat-resistant resin at a predetermined pitch by insert molding and then caulked and connected to a flat element. The process of forming the resin part by insert molding to prevent the solder flux from entering the element part through the connection leg part of the terminal when soldering to the terminal is shared regardless of the element specifications. And the effect of eliminating the influence of heat or the like during molding on the element.

According to a second aspect of the present invention, in the first aspect of the present invention, the case having the support portion on the bottom surface of the flat element except for the crimp connection portion with each terminal and the regulating portion on the outer periphery is heat-resistant. In order to reduce the size and thickness of electronic components, a flat element is formed on a thin sheet-shaped insulating substrate, and the surface of the element is controlled like a variable resistor or switch. Even when the elastic movable contact makes elastic contact, there is an effect that there is no bending or deformation of the element and that the position of the element can be accurately determined.

According to a third aspect of the present invention, in the first or second aspect of the invention, at least a portion of the plurality of terminals connected to the wiring board near the connection leg is formed at a predetermined pitch to form a continuous hoop. Then, after fixing the periphery of the intermediate portion of the predetermined number of terminals by insert molding with a heat-resistant resin, the flat plate-shaped element is caulked and then the connecting portion between the terminals is cut off. The arrangement of the terminals when fixing the periphery of the intermediate portion of the predetermined number of terminals to the resin by insert molding is accurate, it is hard to bend or deform, and therefore the working efficiency is good including the caulking connection with the flat element. Has an action.

An embodiment of the present invention will be described below using a variable resistor as an example with reference to the drawings.

FIG. 1 is a perspective view for explaining a method of connecting terminals of a variable resistor according to the first embodiment. FIG. 1A shows a plurality of connected hoop-shaped terminals, and FIG. Case in which the terminal is fixed by insert molding, FIG.
Represents a flat resistive element substrate, and FIG. 4D shows a resistive element case with terminals in which the resistive element substrate is caulked to the case.

The terminal connection method will be described. First, the terminal 11 shown in FIG. 1A is an elongated plate formed by punching and bending a metal plate, and has one end connected to the resistance element substrate 12. Has a pair of caulking legs 11A, and the other end has a connection leg 11B for connecting to a wiring board of a device to be used.
The ends of the connection legs 11B are connected to the connection band 11C at a predetermined pitch, and a large number of terminals 11 are formed in a continuous hoop shape.

Next, with respect to the large number of terminals 11 connected in a hoop shape, a predetermined number of intermediate portions 11 of the terminals 11 are provided.
The periphery of D was fixed by heat-resistant resin by insert molding, and the supporting portion 13A on the bottom surface of the resistance element substrate 12 (shown in FIG. 1C) and the regulating portion 13B on the outer periphery were simultaneously formed integrally with the resin. The case 13 is shown in FIG.

In this case 13, each terminal 1
One pair of caulking legs 11A is a through hole 13C that is not covered with resin.

Then, the resistance element substrate 12 is fitted into the recess formed by the support portion 13A and the regulation portion 13B of the case 13, and the terminal hole of each terminal 11 fixed by insert molding into the connection hole 12A at the end. By caulking and connecting the pair of caulking legs 11A to each other, FIG.
The resistance element case with terminals shown in FIG.

Note that this caulking connection is made by the above-described through hole 1.
The jig can be easily and reliably inserted by inserting a jig from above and below in the 3C.
By separating 1B from the connecting band 11C,
This is completed as a resistance element case 14 with individual terminals.

Then, the connecting leg 11B of the terminal 11 is cut and bent into a predetermined size and shape in accordance with the specification of the variable resistor to be used, and assembled into a variable resistor. As shown in the sectional view of FIG. 2, the resistance element case 14
3B, the resistive element substrate 12 is formed of a thin sheet-like insulating substrate, and the resistive element substrate 12 is formed of a thin sheet-like insulating substrate, as shown in the sectional view of FIG. Even when the elastic movable contact 15 elastically contacts the surface of the element substrate 12, the element does not bend or deform, and the position of the resistance element substrate 12 is stable.

In the above description, after the resistance element substrate 12 is fitted into the case 13 in which the terminals 11 are fixed by insert molding and caulked, the ends of the connection legs 11B of the terminals 11 are cut off from the connection band 11C and individually formed. Although the method of assembling a variable resistor as the resistor element case 14 with terminals was adopted, this method does not separate the connection leg 11B of the terminal 11 from the connection band 11C even after the resistor element substrate 12 is caulked to the case 13. Needless to say, it may be supplied continuously to the automatic assembling machine while being connected in the shape, and may be individually cut off after completion as a variable resistor.

[0022]

As described above, according to the present invention, the insert molding step for preventing the influence of the flux when the connection terminals are connected by soldering, which is the most troublesome step in the manufacturing process of the electronic component. Can be shared irrespective of the type of element, and it is not necessary to consider the influence of heat or the like on the element during molding, so that stable characteristics can be achieved.
The advantageous effect that an inexpensive electronic component terminal connection method can be provided is obtained.

[Brief description of the drawings]

FIG. 1A is a perspective view of a hoop-shaped terminal for explaining a method of connecting a terminal of a variable resistor according to an embodiment of the present invention. FIG. 1B is a perspective view of a case in which the terminal is insert-molded. (D) Perspective view of resistive element case with terminal

FIG. 2 is a cross-sectional view of the resistance element case with the terminal.

FIG. 3 is a sectional view of the variable resistor.

FIG. 4 is an exploded perspective view illustrating a conventional method of connecting terminals of a variable resistor.

FIG. 5 is a perspective view after the caulking connection.

FIG. 6 is a cross-sectional view after the insert molding.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 Terminal 11A Leg for caulking 11B Connection leg 11C Connecting band 11D Intermediate part 12 Resistance element board 12A Continuous hole 13 Case 13A Supporting part 13B Regulation part 13C Through hole 14 Resistance element case with terminal 15 Elastic movable contact

Continued on the front page (72) Inventor Yoshinori Satsuma 1006 Kazuma Kadoma, Kadoma City, Osaka Matsushita Electric Industrial Co., Ltd.

Claims (3)

[Claims] An intermediate portion of a predetermined number of terminals made of a metal plate, one end of which is a connection portion to an element and the other end of which is a connection leg to a wiring board, is made of heat-resistant resin at a predetermined pitch. A terminal connection method for an electronic component in which a connection portion of each terminal is caulked to a flat element after being fixed by insert molding. 2. The electronic device according to claim 1, wherein a case having a support portion on the bottom surface and a regulating portion on the outer periphery of the plate-shaped element excluding a caulking connection portion with each terminal is integrally formed of a heat-resistant resin. How to connect the terminals of parts. 3. A plurality of terminals, at least in the vicinity of connection legs to the wiring board, are connected at a predetermined pitch to form a continuous hoop shape, and a heat-resistant resin is formed around the intermediate portion of the predetermined number of terminals. 3. The terminal connecting method for an electronic component according to claim 1 or 2, wherein the flat element is caulked and fixed, and then the connecting portion between the terminals is cut off.