JPH10135367A - Device package - Google Patents

Abstract

(57) [Problem] To provide a package suitable for mounting a low-cost CCD image sensor that is compact, has high mounting efficiency, is easy to mount and position including lenses and filters, and is inexpensive. SOLUTION: An element chip 2 having a pad portion for connecting a signal, a resin molded body 1 configured to house the element chip 2, and a plurality of conductive patterns 6 provided on an outer surface of the resin molded body 1 In the element package having the conductive pattern 6 and the wiring for connecting the pad 5 of the element chip 2, a plurality of grooves 12 provided on the side surface of the resin molded body 1 and in which the conductive pattern 6 is arranged on the lower surface are formed. The conductive pattern 6 has a resin molded body 1 in which the element chip 2 is housed.
From the front surface to the rear surface of the resin molded body 1 via the bottom surface of the groove 12.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to an element package, and more particularly to an improvement in a CCD image sensor package.

[0002]

2. Description of the Related Art CCD (Chage Coupled Device) is an MO
It has a function of sequentially transferring charges of the semiconductor surface layer in which the S-shaped electrodes are arranged like a chain from one electrode to another.
The signal is stored under the transfer electrode in the form of a charge. The signal charge is injected from a transistor to which an electric signal is input, or is introduced from a photodiode to which an optical signal is input and excited thereby. When a two-phase or four-phase clock pulse is applied to the transfer electrode, the electric charges stored under the electrode are sequentially transferred one by one, and finally the PN
It is transferred to the floating capacitor at the junction and changes its potential. The potential of the floating capacitor is output from the source follower circuit of the MOS transistor.

A CCD image sensor used for a camera or the like has a P-type impurity layer formed on an N-type semiconductor substrate, and a photodiode and a CCD formed thereon. The photodiode converts the light received by the photodiode into electric charges, and stores, transfers and reads the electric charges, thereby converting the image into an electric signal and outputting the electric signal.

[0004] By the way, the following are conventionally used as such element packages of the CCD image sensor.

1) Ceramic DIP (Dual Inline Pack)
age) Package Ceramic is used as the base material of the element package of the CCD image sensor. Although the metal terminals are sandwiched between ceramic materials and then fired, the handling and positioning of the terminals are difficult, and there is a limit to providing minute terminals on the element, and as a result, the package size is sufficient. Can't be smaller. FIG. 6 is a sectional view (a) and an external view (b) showing the configuration of a so-called ceramic DIP type CCD image sensor of this type.

2) Chip carrier package In order to increase the mounting density, a leadless type is used, and pattern electrodes are provided on the surface layer of the ceramic package instead of metal terminals, so that the substrate can be mounted on a flat surface. However, this method has a problem in terms of cost because the ceramic base portion cannot be formed in one step in manufacturing and has a multilayer structure of several layers. FIG. 7 shows a so-called ceramic chip carrier type CC of this type.
FIG. 3A is a cross-sectional view illustrating the configuration of the D image sensor, and FIG.

[0007] 3) Plastic Package As for a plastic package as a base material, a metal package formed by insert molding of a metal terminal or a press-fitted pin has been proposed. However, since it is necessary to secure a space for the terminal portion in these devices, the ceramic D
As in the case of the IP package, it cannot be said that it is sufficiently suitable for miniaturization. FIG. 8 is a sectional view (a) and an external view (b) showing an example of the configuration of a CCD image sensor of this type.
It is.

4) Others There is a structure such as a TAB (Tape Automated Bonding) type package in which a lead wire is directly provided from a CCD image sensor. In such a structure, the width and thickness of the lead are reduced. It is very small, so it is very difficult to handle it on the mounting surface, especially for positioning with optical system elements, and it requires a separate member to position the entire package. Does not become Also,
Because of the use of a special technology, it is difficult to reduce the price, and it is difficult to replace the package with a normal type. FIG. 9 is a sectional view (a) and an outline view (b) showing an example of the configuration of a CCD image sensor of this type.

As described above, the conventional device package of the CCD image sensor has advantages in terms of simplicity and cost of the manufacturing process, miniaturization, workability in positioning with the optical system, handling of signal lead lines, and the like. There were many problems.

[0010]

As described above, the structure of a conventional CCD image sensor package is not always optimal for miniaturization, and there are many problems in terms of positioning and lens focusing. Was.

An object of the present invention is to provide a package which is small in size, has a high mounting efficiency, is easy to mount and position including a lens and a filter, and is suitable for mounting an inexpensive CCD image sensor. And

[0012]

In order to achieve the above object, the present invention provides an element chip having a pad portion for connecting a signal, a resin molded body configured to house the element chip, In an element package having a plurality of conductive patterns provided on an outer surface of a molded body and a wiring connecting the conductive pattern and pads of the element chip, the conductive pattern provided on a side surface of the resin molded body has a lower surface. Having a plurality of groove portions, the conductive pattern extends from a surface of the resin molded body in which the element chip is housed to a back surface of the resin molded body via a bottom surface of the groove portion. Features.

[0013]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an element package according to the present invention will be described in detail with reference to the accompanying drawings. FIG.
FIG. 2 is a top view of an embodiment of the element package of the present invention configured as a CCD image sensor package, and FIG. 2 is a bottom view thereof. 3 and 4 are cross-sectional views when the element package is mounted on a lens barrel. FIG. 3 is a cross-sectional view along axis a in FIG. 1, and FIG. 4 is a cross-sectional view along axis b in FIG. However, in FIG. 4, only the side surface portion of the resin base 1 is shown as a side surface, not a cross section. Also,
FIG. 5 is an external view of a resin base (resin molded body).

1 to 4, reference numeral 1 denotes a resin base (resin molded body), 2 denotes a CCD imager (CCD image sensor element chip), 3 denotes a connector, 4 denotes a bonding wire, 5 denotes a pad portion at 13 places, and 6 denotes a pad portion. Denotes 14 conductive pattern portions (hatched portions), 7 denotes a low-pass filter, 8 denotes an infrared cut filter, 9 denotes a lens barrel, 10 denotes a rear stopper, 11
Is a front stopper. Also, in FIG. 5, 12 is a groove, 13
Is a tray, 14 is an edge, 15 is a cylindrical outer peripheral surface, and 16 is a depression.

As can be seen from FIGS. 1, 2, 4, 5 and the like, a CCD imager 2 is fixed in the resin base 1 by a method such as bonding. Conductive pattern portions 6 are formed on the surface of the resin base 1, and each conductive pattern portion 6 is connected to the pad portion 5 of the CCD imager 2 by a bonding wire 4. On the side surface of the resin base 1, there are provided grooves 12 in which the respective conductive pattern portions 6 are arranged. Each conductive pattern portion 6 is provided on the bottom surface of the groove portion 12 so that the side surface of the resin base 1 becomes a lens barrel. Even if they come into contact with a metal surface such as 9, they are not short-circuited or interfere with each other.

On the back surface of the resin base 1, the conductive pattern portion 6 is formed in a pattern such that the connector 3 can be mounted, for example. In connector 3,
A flexible printed board or a normal board (not shown) is connected to transmit a signal from the CCD imager 2 to the outside. An optical quartz low-pass filter 7 and an infrared cut filter 8 are adhered to the upper surface of the resin base 1 while maintaining a specific orientation with respect to the CCD imager 2.

The CCD package blocks 1 to 8 configured as described above are arranged inside a cylindrical lens barrel 9. The inner peripheral surface of the lens barrel 9 and the outer peripheral surfaces of the CCD package blocks 1 to 8 are configured to fit together with a certain gap. The lens barrel 9 of the CCD package blocks 1 to 8
Positioning in the length direction on the center line is performed by stoppers 10 and 11 before and after the CCD package blocks 1 to 8. Further, the stoppers 10 and 11 are press-fitted into the inner diameter surface of the lens barrel 9. The inner surface of the lens barrel 9 on the left end side in FIGS. 3 and 4 is threaded, and a lens block (not shown) can be attached to the lens barrel 9 using this screw to perform focusing.

As can be seen from FIG. 5, the resin base 1 is formed of a resin molded body (commonly called MID: Molded Interconnection Device) integrally formed of a plastic resin. A receiving portion 13 for receiving the CCD imager 2 is provided inside the resin base 1.
In the figure, 14 conductive pattern portions 6 are formed from the edge portion 14 of the third through the groove portion 12 on the side surface to the back surface of the resin base 1. With this configuration, it is easy to fix the CCD imager 2 to the resin base 1 with an adhesive, and it is also easy to connect the pad portion 5 and the conductive pattern portion 6 of the CCD imager 2 by wire bonding. .

The conductive pattern portion 6 extends from the edge portion 14 of the tray portion 13 through the side surface of the resin base 1 to the back surface of the resin base 1. A groove 12 for receiving the conductive pattern portion 6 is provided on the side surface of the resin base 1, thereby preventing a short circuit between adjacent conductive pattern portions 6 and a short circuit via the lens barrel 9 when the lens barrel 9 is made of metal. Is done.

The conductive pattern portions 6 are arranged on the back surface of the resin base 1 so that the connector 3 can be connected and mounted. Further, instead of the connector 3, it is also possible to directly mount a board or a plate-like resin board (such as a flexible board) having a conductive pattern formed on the surface layer. By adopting such a configuration, it is possible to easily execute wiring processing collectively.

The quartz low-pass filter 7 and the infrared cut filter 8 of the optical system can be adhered to the upper surface of the resin base 1 as an integral part so as to be oriented in a predetermined direction with respect to the light receiving surface of the CCD imager 2. As described above, since the positions of the crystal low-pass filter 7 and the infrared cut filter 8 can be adjusted in advance before being mounted on the lens barrel 9, the mounting becomes easy.

A part or all of the side surface of the resin base 1 forms a cylindrical outer peripheral surface 15 having a diameter to fit into the inner peripheral surface of the lens barrel 9. Further, when the resin base 1 is fitted to the inner peripheral surface of the lens barrel 9 with the cylindrical outer peripheral surface 15, the central axis of the light receiving surface of the CCD imager 2 is the central axis of the lens barrel 9, that is, the optical axis of a lens block (not shown). It is configured to match. Therefore, the alignment between the optical axis of the lens block and the CCD imager 2 is very easy.

Further, in order to attach a chuck for pushing the resin base 1 into the lens barrel 9, a concave recess 16 is provided in a part of the outer shape of the resin base 1. Thereby, it is easy to push the resin base 1 to an appropriate position in the lens barrel 9 and position it.

In the above description, the number of conductive pattern portions 6 is set to 14
However, the present invention is not limited to this, and arbitrary plural conductive patterns can be arranged as long as it is allowed. In the above description, the case where the chip component is used as a CCD image sensor package in the CCD imager 2 has been described. However, the resin base 1, the element chip, the connector 3, the bonding wire 4, the pad portion 5,
The combination using the conductive pattern portion 6 can be used for mounting elements other than the CCD image sensor.

[0025]

As described above, according to the first aspect of the present invention, there is provided an element chip having a pad portion for connecting a signal, a resin molded body configured to house the element chip, and a resin molding. In an element package having a plurality of conductive patterns provided on an outer surface of a body and a wiring connecting the conductive pattern and pads of an element chip, the conductive pattern provided on a side surface of the resin molded body is disposed on a lower surface thereof. The conductive pattern extends from the surface of the resin molded body in which the element chip is housed to the back surface of the resin molded body via the bottom surface of the groove. With this configuration, the terminals can be omitted, and the wiring can be collectively processed on the back surface of the resin molded body. Therefore, the element package can be made compact, and the wiring from the element can be easily processed.

The invention according to claim 2 of the present invention is characterized in that the conductive patterns are arranged on the back surface of the resin molded body so that connector means or a substrate can be mounted thereon. As a result, the wiring from the element can be processed more easily and collectively, so that the processing cost can be reduced accordingly.

The invention according to claim 3 of the present invention is characterized in that part or all of the side surface of the resin molded body forms a cylindrical outer peripheral surface, and the resin molded body is configured to be housed inside the hollow cylinder. And This makes it extremely easy to mount the device inside the hollow cylinder and align the center of the device chip. When the device chip is used as a CCD image sensor, and when the device package is used for a CCD image sensor, the number of steps for mounting and positioning is increased. Can be greatly reduced.

According to a fourth aspect of the present invention, the element chip is a CCD image sensor. Since the mounting inside the hollow cylinder and the alignment of the center of the element chip are easy, a CCD image sensor can be easily realized by separately mounting a lens on the hollow cylinder.

The invention of claim 5 of the present invention is characterized in that a means for attaching an optical system element is provided on the surface of the resin molded product. This makes it possible to mount an optical filter or the like directly on the resin molded body and align the direction with the CCD image sensor before mounting the device inside the hollow cylinder of the element package, thereby easily realizing the CCD image sensor. it can.

[Brief description of the drawings]

FIG. 1 is a top view of a CCD image sensor package which is an embodiment of an element package of the present invention.

FIG. 2 is a bottom view of the package of the CCD image sensor of FIG. 1;

FIG. 3 is a sectional view of a package of the CCD image sensor of FIG. 1;

FIG. 4 is a sectional view of a package of the CCD image sensor of FIG. 1;

FIG. 5 is an external view of a resin base of the CCD image sensor of FIG. 1;

FIG. 6 is a sectional view and an outline view of a conventional ceramic DIP type CCD image sensor.

FIG. 7 is a cross-sectional view and an external view of a conventional ceramic chip carrier type CCD image sensor.

FIG. 8 is a cross-sectional view and an external view of an example of a conventional plastic package CCD image sensor.

9A and 9B are a cross-sectional view and an external view of an example of a CCD image sensor having a structure in which a lead wire is directly output from a conventional sensor.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Resin base (resin molding), 2 ... CCD imager (CCD image sensor element chip), 3 ... Connector 4, ... Bonding wire, 5 ... Pad part, 6
...... Conductive pattern part, 7 ... Low-pass filter, 8 ...
Infrared cut filter, 9 ... lens barrel, 10 ... rear stopper, 11 ... front stopper, 12 ... groove, 13 ... tray, 14 ... edge, 15 ... cylindrical outer peripheral surface, 16 …
... hollows.

Claims (5)

[Claims] An element chip having a pad portion for connecting a signal; a resin molded body configured to house the element chip; a plurality of conductive patterns provided on an outer surface of the resin molded body; An element package having a conductive pattern and a wiring for connecting pads of the element chip, comprising: a plurality of grooves provided on a side surface of the resin molded body, wherein the conductive pattern is disposed on a lower surface thereof; The device package according to claim 1, wherein the device package extends from a surface of the resin molded body in which the element chip is stored to a back surface of the resin molded body via a bottom surface of the groove. 2. The element package according to claim 1, wherein the conductive patterns are arranged on a back surface of the resin molded body so that a connector means or a substrate can be mounted. 3. A part or all of a side surface of the resin molded body forms a cylindrical outer peripheral surface, and the resin molded body is configured to be housed inside the hollow cylinder by the cylindrical outer peripheral surface. The element package according to claim 1 or 2, wherein 4. The device package according to claim 1, wherein said device chip is a CCD image sensor. 5. The element package according to claim 4, further comprising means for mounting an optical element on the surface of the resin molded body.