JPH10137657A - Adhesive coating device - Google Patents
Adhesive coating deviceInfo
- Publication number
- JPH10137657A JPH10137657A JP8306486A JP30648696A JPH10137657A JP H10137657 A JPH10137657 A JP H10137657A JP 8306486 A JP8306486 A JP 8306486A JP 30648696 A JP30648696 A JP 30648696A JP H10137657 A JPH10137657 A JP H10137657A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- nozzle
- tip
- circuit board
- applying
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Coating Apparatus (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
(57)【要約】
【課題】 非接触で接着剤を回路基板に塗布するにあた
り、高い位置精度と安定した塗布精度が得られる接着剤
塗布装置を提供する。
【解決手段】 接着剤の供給手段と加圧手段を有し、ノ
ズル15の先端から接着剤を噴射して接着対象物に対して
非接触で接着剤を塗布する接着剤の塗布装置であって、
ノズル15の先端の開孔面４の外周縁寸法ａを70μm以下
に設定したものである。
(57) Abstract: Provided is an adhesive applying apparatus which can obtain high positional accuracy and stable application accuracy when applying an adhesive to a circuit board in a non-contact manner. SOLUTION: This is an adhesive applying device which has an adhesive supplying means and a pressure means, sprays the adhesive from a tip of a nozzle 15, and applies the adhesive to a bonding object in a non-contact manner. ,
The outer peripheral edge dimension a of the opening surface 4 at the tip of the nozzle 15 is set to 70 μm or less.
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、電子回路部品を接
着剤で回路基板に仮固定し、実装作業を行うための接着
剤塗布装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an adhesive applying apparatus for temporarily fixing an electronic circuit component to a circuit board with an adhesive and performing a mounting operation.
【０００２】[0002]
【従来の技術】従来より、回路基板上に電子部品を半田
付けする一手段として、回路基板の接合電極間に接着剤
を塗布し、部品装着後、加熱硬化して仮固定を行い、最
終的に溶融半田を噴流して接合を行うフロー半田付け工
法が知られており、以下この工法において接着剤の塗布
工程に使用される接着剤塗布装置の構成と動作を説明す
る。図５はこの従来の接着剤塗布装置の概略構成を示す
斜視図であり、ロボットステージ10上のＸ移動ロボット
11とＹ移動テーブル12からなる位置決め手段の内、Ｘ移
動ロボット11上には接着剤を充填したバレル13を装着し
た塗布ヘッド14が設けられている。電気的に制御された
エアバルブが開き、バレル13内にエアーが送りこまれる
と、バレル13の先端に取り付けられたノズル15の先端か
ら接着剤が押し出される機構になっている。回路基板16
上の接着剤を塗布する位置は、Ｘ移動ロボット11とＹ移
動テーブル12のＸＹ移動によって定まり、移動後、塗布
ヘッド14が下降しノズル15の先端と回路基板16が接触
し、接着剤が回路基板16の表面に転写される状態で塗布
される。接着剤を回路基板16に塗布した後、塗布ヘッド
14は直ちに上昇し、ＮＣプログラム上で指示された次の
ポイントへの位置決めを開始する。接着剤の塗布を完了
した回路基板16は次の電子部品装着工程へ移動し、部品
装着，接着剤硬化，及び半田付け工程を経て完成する。
接着剤の塗布量は、ノズル孔径，エアー圧力，エアーバ
ルブの開放時間，ノズル先端部の温度などの条件で変化
させることが可能である。2. Description of the Related Art Conventionally, as a means for soldering electronic components on a circuit board, an adhesive is applied between bonding electrodes of the circuit board, and after mounting the components, it is cured by heating and temporarily fixed. There is known a flow soldering method in which a molten solder is jetted to perform joining, and a configuration and an operation of an adhesive applying apparatus used in an adhesive applying step in this method will be described below. FIG. 5 is a perspective view showing a schematic configuration of this conventional adhesive coating apparatus, and shows an X-moving robot on a robot stage 10.
Among the positioning means composed of 11 and the Y moving table 12, on the X moving robot 11, a coating head 14 equipped with a barrel 13 filled with an adhesive is provided. When an electrically controlled air valve is opened and air is sent into the barrel 13, the adhesive is extruded from the tip of a nozzle 15 attached to the tip of the barrel 13. Circuit board 16
The position at which the adhesive is applied is determined by the XY movement of the X-moving robot 11 and the Y-moving table 12. After the movement, the applying head 14 descends and the tip of the nozzle 15 and the circuit board 16 come into contact. It is applied in a state of being transferred to the surface of the substrate 16. After applying the adhesive to the circuit board 16, the application head
14 immediately rises and begins positioning to the next point indicated on the NC program. The circuit board 16 on which the application of the adhesive has been completed moves to the next electronic component mounting step, and is completed through the component mounting, adhesive curing, and soldering steps.
The amount of the adhesive to be applied can be changed according to conditions such as the nozzle hole diameter, the air pressure, the opening time of the air valve, and the temperature of the nozzle tip.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら、このよ
うな従来の接着剤塗布装置では、ノズルの先端と回路基
板を接触させるために塗布ヘッドの上下動作時間が必要
であり、装置としての更なる高速化が望みにくい。また
塗布ヘッド上昇時に接着剤が糸状に伸び、糸状に塗布さ
れたり、飛び散ったりするなど、塗布精度が悪化するほ
か、電極上に接着剤がかかり、半田付け不良の発生する
原因となっている。接着剤についても塗布精度を改善す
るため粘度特性等の改善がなされているが塗布品質の面
からも塗布速度の高速化は困難となっている。一方、塗
布ヘッドの上下動作時間をなくし、高速化を可能にする
ため、ノズルから接着剤を噴射し非接触で回路基板に供
給するジェット方式が考えられているが、非接触方式の
場合、ノズル先端部に付着した剰余の接着剤が噴射の障
害となり、噴射が停止したり、噴射方向のバラツキが生
じるなど、塗布位置精度や塗布形状等の不安定に直接影
響する。この傾向は噴射するノズル先端と回路基板面の
距離に比例して更に増大する。However, in such a conventional adhesive coating apparatus, a vertical operation time of the coating head is required to bring the tip of the nozzle into contact with the circuit board. It is hard to hope for. In addition, when the application head is lifted, the adhesive spreads in a thread form, and is applied in a thread form or scatters, thereby deteriorating the application accuracy. In addition, the adhesive is applied to the electrodes, causing soldering failure. Adhesives are also improved in viscosity characteristics and the like in order to improve coating accuracy, but it is difficult to increase the coating speed in terms of coating quality. On the other hand, in order to eliminate the up-and-down operation time of the coating head and enable high-speed operation, a jet method in which an adhesive is injected from a nozzle and supplied to a circuit board in a non-contact manner has been considered. Excess adhesive adhered to the front end portion impedes the ejection, and directly affects the instability of the application position accuracy and the application shape, such as the stoppage of the ejection and the variation of the ejection direction. This tendency further increases in proportion to the distance between the tip of the nozzle to be sprayed and the surface of the circuit board.
【０００４】本発明は、このような従来の問題点を解決
するものであり、非接触で接着剤を回路基板に塗布する
にあたり、高い位置精度と安定した塗布精度が得られる
接着剤塗布装置を提供するものである。SUMMARY OF THE INVENTION The present invention solves the above-mentioned conventional problems. In applying an adhesive to a circuit board in a non-contact manner, an adhesive applying apparatus capable of obtaining high positional accuracy and stable application accuracy is provided. To provide.
【０００５】[0005]
【課題を解決するための手段】本発明の接着剤塗布装置
は、接着剤の供給手段と加圧手段を有し、ノズル先端か
ら接着剤を噴射して接着対象物に対して非接触で接着剤
を供給する接着剤の塗布装置であって、ノズル先端開孔
部の外周が70μm以下となるように構成したものであ
る。An adhesive applying apparatus according to the present invention has an adhesive supplying means and a pressurizing means, and sprays an adhesive from a nozzle tip to adhere to an object to be bonded in a non-contact manner. An adhesive application device for supplying an agent, wherein an outer circumference of a nozzle tip opening is 70 μm or less.
【０００６】この本発明によれば、非接触で接着剤を回
路基板に塗布するにあたり、高い位置精度と安定した塗
布精度が得られる接着剤塗布装置を実現することができ
る。According to the present invention, it is possible to realize an adhesive applying apparatus capable of obtaining high positional accuracy and stable applying accuracy when applying an adhesive to a circuit board in a non-contact manner.
【０００７】[0007]
【発明の実施の形態】一般に、接着剤をノズルから噴射
する場合、前工程で噴射した接着剤の残りが表面張力に
よってノズル開孔面に付着し、最終的に全面に広がり、
この付着した接着剤は、その粘度と表面張力で噴射抵抗
となり、付着が不均一な場合噴射方向のバラツキを生じ
るほか最終的には噴射しなくなる。接着剤の付着量は開
孔面積に比例し、例えば、開口径0.15mm、外周径が0.3m
mのノズルの場合約0.019mm3、開孔径が0.15mm、外周径
が0.5mmの場合約0.087mm3の付着があった。DESCRIPTION OF THE PREFERRED EMBODIMENTS In general, when an adhesive is sprayed from a nozzle, the remainder of the adhesive sprayed in the previous process adheres to the nozzle opening surface due to surface tension, and finally spreads over the entire surface.
The adhered adhesive becomes a jet resistance due to its viscosity and surface tension. If the adhesion is not uniform, the jet direction will vary, and finally the jet will not be jetted. The amount of adhesive attached is proportional to the opening area, for example, the opening diameter is 0.15 mm, the outer diameter is 0.3 m
In the case of a nozzle of m, about 0.019 mm 3 , the opening diameter was 0.15 mm, and when the outer diameter was 0.5 mm, about 0.087 mm 3 adhered.
【０００８】本発明は、この付着量を最小限に抑えるも
のであり、以下本発明の各実施の形態について図面を参
照しつつ説明する。なお、前記従来の装置と同一の部分
については同一の符号を付し、その詳細な説明は省略す
る。The present invention is to minimize the amount of adhesion, and each embodiment of the present invention will be described below with reference to the drawings. The same parts as those of the conventional device are denoted by the same reference numerals, and detailed description thereof will be omitted.
【０００９】(実施の形態１)図１は本発明の接着剤塗布
装置の実施の形態１において用いられるノズルの構成を
示す拡大断面図である。図中、１はノズル本体、２はそ
の先端に設けられた吐出部、３は吐出孔で、吐出部２と
ノズル本体１を貫通し、孔内を接着剤が流動するように
構成されており、このノズル本体１は図３に示す噴射ヘ
ッドの先端に取付けられ、更にこの噴射ヘッドは図４に
示す接着剤塗布装置の本体に取付けられる。以下これら
図１，図３，図４を参照して説明する。なお、図３は本
発明の接着剤塗布装置の各実施の形態において共通に用
いられる噴射ヘッドの構成を示す断面図、図４は同各実
施の形態において共通に用いられる装置全体の構成を示
す斜視図であり、その基本的構成は前記図５に示したも
のに準じる。(Embodiment 1) FIG. 1 is an enlarged sectional view showing the configuration of a nozzle used in Embodiment 1 of the adhesive coating apparatus of the present invention. In the drawing, 1 is a nozzle body, 2 is a discharge portion provided at the tip thereof, and 3 is a discharge hole, which penetrates the discharge portion 2 and the nozzle body 1 so that the adhesive flows through the hole. The nozzle body 1 is attached to the tip of the ejection head shown in FIG. 3, and the ejection head is attached to the body of the adhesive coating device shown in FIG. Hereinafter, description will be made with reference to FIGS. FIG. 3 is a cross-sectional view showing a configuration of an ejection head commonly used in each embodiment of the adhesive application apparatus of the present invention, and FIG. 4 shows an overall configuration of an apparatus commonly used in each embodiment. It is a perspective view, and the basic structure is based on what was shown in said FIG.
【００１０】まず、図３において、５はプランジャー、
６はプランジャーガイド、７はリニアソレノイド、８は
タンク、９はタンク８内に充填された接着剤であり、プ
ランジャー５はリニアソレノイド７により任意の高さか
ら任意の速度でタンク８の底面に衝突するように構成さ
れている。接着剤９を噴射させるにはプランジャー５を
タンク８の底面に向かって前進させ、この際、タンク８
内のプランジャー５の全面の接着剤が圧縮されるので、
これがタンク８の先端に取り付けられたノズル15の先端
から噴射される。この噴射後プランジャー５は直ちにリ
ニアソレノイド７で引き戻され、ノズル15の先端に付着
した接着剤９を吐出孔内に吸入する。この動作におい
て、接着剤が付着するのはノズル15の先端、即ち、図１
に示す吐出部２の先端の開孔面４に限られており、この
部分に付着する接着剤量が多いと、前記の吸入手段では
吸入しきれず、前記従来装置のように、これが噴射の障
害となり、噴射が停止したり、噴射方向のバラツキが生
じるなど、塗布位置精度や塗布形状等の不安定に直接影
響することになる。First, in FIG. 3, 5 is a plunger,
6 is a plunger guide, 7 is a linear solenoid, 8 is a tank, 9 is an adhesive filled in the tank 8, and a plunger 5 is a bottom surface of the tank 8 at an arbitrary speed from an arbitrary height by the linear solenoid 7. It is configured to collide with. To spray the adhesive 9, the plunger 5 is advanced toward the bottom of the tank 8, and
Since the adhesive on the entire surface of the plunger 5 inside is compressed,
This is jetted from the tip of a nozzle 15 attached to the tip of the tank 8. After this injection, the plunger 5 is immediately pulled back by the linear solenoid 7, and the adhesive 9 attached to the tip of the nozzle 15 is sucked into the discharge hole. In this operation, the adhesive adheres to the tip of the nozzle 15, that is, FIG.
Is limited to the opening surface 4 at the tip of the discharge portion 2 shown in FIG. 5, and if the amount of adhesive adhering to this portion is large, the above-mentioned suction means cannot completely inhale, and as in the above-described conventional device, this may cause an obstacle to ejection. This directly affects the instability of the coating position, the coating shape, and the like, such as when the injection is stopped or the injection direction varies.
【００１１】本実施の形態においては、この吐出孔３の
外周寸法を極小にすることで開孔面４への接着剤の付着
量を最小限に抑えるものであり、実際に作製したノズル
形状としては、所望の接着剤塗布量で決まる吐出孔を0.
15mm、吐出部外径を0.3mm、吐出部外径のエッジ部を面
カットして開孔面外周の縁寸法ａを0.01mmとした。この
ようにすると、開孔面４の外周の縁が極めて薄いので、
この部分に付着する接着剤量は非常に少なくなり、前記
の問題点は解消する。In the present embodiment, the amount of the adhesive adhering to the opening surface 4 is minimized by minimizing the outer peripheral dimension of the discharge hole 3. Is set to 0.
The edge of the outer diameter of the discharge portion was 15 mm, the outer diameter of the discharge portion was 0.3 mm, and the edge of the outer diameter of the discharge portion was cut to make the outer peripheral edge dimension a 0.01 mm. In this case, since the outer peripheral edge of the opening surface 4 is extremely thin,
The amount of adhesive adhering to this portion becomes very small, and the above-mentioned problem is solved.
【００１２】このようにして作成されたノズル15を図４
に示す接着剤塗布装置の本体に噴射ヘツド17として取付
け、そのプランジャー５の速度を１m／sとし、回路基板
16とノズル15の先端の距離を５mm(非接触)で接着剤を塗
布した時、その塗布位置精度，形状不良，飛び散り不良
をカウントとしたところ、従来の非接触塗布方法に比べ
て１／10に低減できた。FIG. 4 shows the nozzle 15 thus formed.
The plunger 5 is mounted at a speed of 1 m / s on the main body of the adhesive application device shown in FIG.
When the adhesive was applied with the distance between the nozzle 16 and the tip of the nozzle 15 being 5 mm (non-contact), the application position accuracy, shape defect, and scattering defect were counted and found to be 1/10 that of the conventional non-contact coating method. Was reduced to
【００１３】以上のように本実施の形態によれば、吐出
部外径のエッジ部をテーパ状に面カットして開孔面外周
の縁を薄くしているので、この部分に付着する接着剤量
は非常に少なくなり、また剰余の接着剤は吐出孔の中心
軸方向に集まる傾向になり、吐出孔内に吸入しやすい状
態となる。As described above, according to the present embodiment, the edge of the outer diameter of the discharge portion is tapered so that the outer peripheral edge of the opening surface is thinned. The amount becomes very small, and the surplus adhesive tends to gather in the direction of the central axis of the discharge hole, so that the adhesive is easily sucked into the discharge hole.
【００１４】(実施の形態２)図２は本発明の接着剤塗布
装置の実施の形態２において用いられるノズルの構成を
示す拡大断面図である。図中、前記実施の形態１と同一
部分には同一符号を付し、その詳細な説明は省略する。
この図２に示すとおり、その基本的構成は実施の形態１
と同様であるが、ここでは吐出部２の開孔面４の外周を
筒状に切込むことにより開孔面４の縁の寸法ａを0.01mm
としたものである。このように開孔面４の外周の縁が極
めて薄いので、前記の実施の形態１と同様、この部分に
付着する接着剤量は非常に少なくなり、同様の効果が得
られる。(Embodiment 2) FIG. 2 is an enlarged sectional view showing the configuration of a nozzle used in Embodiment 2 of the adhesive application apparatus of the present invention. In the figure, the same parts as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.
As shown in FIG. 2, the basic configuration is the same as that of the first embodiment.
However, the dimension a of the edge of the opening surface 4 is set to 0.01 mm by cutting the outer periphery of the opening surface 4 of the discharge portion 2 into a cylindrical shape.
It is what it was. As described above, since the outer peripheral edge of the opening surface 4 is extremely thin, the amount of the adhesive adhering to this portion is very small, as in the first embodiment, and the same effect is obtained.
【００１５】以上のように本実施の形態によれば、吐出
部外径の外周を筒状に切込むことにより開孔面外周の縁
を薄くしているので、この部分に付着する接着剤量は非
常に少なくなり、また剰余の接着剤は吐出孔の中心軸方
向に集まる傾向になり、吐出孔内に吸入しやすい状態と
なる。As described above, according to the present embodiment, since the outer periphery of the opening surface is thinned by cutting the outer periphery of the outer diameter of the discharge portion into a cylindrical shape, the amount of adhesive adhering to this portion is reduced. And the excess adhesive tends to gather in the direction of the central axis of the discharge hole, so that the adhesive is easily sucked into the discharge hole.
【００１６】なお、前記各実施の形態においては開孔面
４の縁の寸法ａを0.01mmとした場合を例示したが、70μ
m以下であれば同等の効果が得られる。また、吐出部２
は金属製であると、先端部に軽い衝撃が加わっても変形
する可能性があるので、吐出部２としてセラミックスや
ルビーなどの硬い素材を研磨加工したものを用い、これ
をノズル本体１に接合することが望ましい。In each of the above embodiments, the case where the dimension a of the edge of the opening surface 4 is set to 0.01 mm is exemplified.
If it is less than m, the same effect can be obtained. Also, the discharge unit 2
Is made of metal, it may be deformed even if a light impact is applied to the tip. Therefore, the ejection part 2 is made of a hard material such as ceramics or ruby and polished and joined to the nozzle body 1. It is desirable to do.
【００１７】[0017]
【発明の効果】以上のように本発明によれば、非接触で
接着剤を回路基板に塗布するにあたり、高い位置精度と
安定した塗布精度が得られる接着剤塗布装置が実現でき
るという有利な効果が得られる。As described above, according to the present invention, when applying an adhesive to a circuit board in a non-contact manner, an advantageous effect of realizing an adhesive applying apparatus capable of obtaining high positional accuracy and stable application accuracy can be realized. Is obtained.
【図１】本発明の接着剤塗布装置の実施の形態１におい
て用いられるノズルの構成を示す拡大断面図。FIG. 1 is an enlarged sectional view showing a configuration of a nozzle used in a first embodiment of an adhesive application device of the present invention.
【図２】本発明の接着剤塗布装置の実施の形態２におい
て用いられるノズルの構成を示す拡大断面図。FIG. 2 is an enlarged cross-sectional view showing a configuration of a nozzle used in a second embodiment of the adhesive application device of the present invention.
【図３】本発明の接着剤塗布装置の各実施の形態におい
て共通に用いられる噴射ヘッドの構成を示す断面図。FIG. 3 is a cross-sectional view showing a configuration of an ejection head commonly used in each embodiment of the adhesive application device of the present invention.
【図４】本発明の接着剤塗布装置の各実施の形態におい
て共通に用いられる装置全体の構成を示す斜視図。FIG. 4 is a perspective view showing a configuration of an entire apparatus commonly used in each embodiment of the adhesive application apparatus of the present invention.
【図５】従来の接着剤塗布装置の一例を示す斜視図。FIG. 5 is a perspective view showing an example of a conventional adhesive application device.
１…ノズル本体、 ２…吐出部、 ３…吐出孔、 ４…
開孔面、 ５…プランジャー、 ６…プランジャーガイ
ド、 ７…リニアソレノイド ８…タンク、９…接着
剤、 11…Ｘ移動ロボット、 12…Ｙ移動テーブル、
13…バレル、14…塗布ヘッド、 15…ノズル、 16…回
路基板、 17…噴射ヘツド。DESCRIPTION OF SYMBOLS 1 ... Nozzle main body, 2 ... Discharge part, 3 ... Discharge hole, 4 ...
Opening surface 5 Plunger 6 Plunger guide 7 Linear solenoid 8 Tank 9 Adhesive 11 X moving robot 12 Y moving table
13 ... Barrel, 14 ... Coating head, 15 ... Nozzle, 16 ... Circuit board, 17 ... Injection head.
Claims (3)
ズル先端から接着剤を噴射して接着対象物に対して非接
触で接着剤を塗布する接着剤の塗布装置であって、ノズ
ル先端開孔部の外周が70μm以下であることを特徴とす
る接着剤塗布装置。1. An adhesive application device comprising an adhesive supply means and a pressure means, wherein the adhesive is applied from a nozzle tip by spraying the adhesive to an object to be bonded in a non-contact manner. An adhesive coating device, wherein the outer circumference of a nozzle tip opening is 70 μm or less.
部に残る接着剤を吸入する機構を更に備えたことを特徴
とする請求項１記載の接着剤塗布装置。2. The adhesive applying apparatus according to claim 1, further comprising a mechanism for sucking the adhesive remaining at the tip after the adhesive is ejected by the nozzle.
ジャーを用い、プランジャーの動作ストロークと速度を
任意に可変して吸入量を制御可能としたことを特徴とす
る請求項２記載の接着剤塗布装置。3. The adhesive according to claim 2, wherein a plunger is used as a mechanism for sucking the adhesive, and the suction stroke can be controlled by arbitrarily varying the operation stroke and speed of the plunger. Coating device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8306486A JPH10137657A (en) | 1996-11-18 | 1996-11-18 | Adhesive coating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8306486A JPH10137657A (en) | 1996-11-18 | 1996-11-18 | Adhesive coating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH10137657A true JPH10137657A (en) | 1998-05-26 |
Family
ID=17957606
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8306486A Pending JPH10137657A (en) | 1996-11-18 | 1996-11-18 | Adhesive coating device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH10137657A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10314640A (en) * | 1997-05-19 | 1998-12-02 | Matsushita Electric Ind Co Ltd | Method and apparatus for applying adhesive |
| WO2004112060A1 (en) * | 2003-06-11 | 2004-12-23 | Yazaki Corporation | Coloring nozzle for electric wire |
| JP2008178852A (en) * | 2006-12-26 | 2008-08-07 | Ulvac Japan Ltd | Nozzle, liquid crystal material discharge apparatus, nozzle manufacturing method and nozzle manufacturing apparatus |
| JP2015208753A (en) * | 2014-04-24 | 2015-11-24 | 三菱電機株式会社 | Molten solder supply equipment |
| JP2023121216A (en) * | 2022-02-21 | 2023-08-31 | 三郎 宮崎 | Nozzle body of mixed liquid discharge device |
-
1996
- 1996-11-18 JP JP8306486A patent/JPH10137657A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10314640A (en) * | 1997-05-19 | 1998-12-02 | Matsushita Electric Ind Co Ltd | Method and apparatus for applying adhesive |
| WO2004112060A1 (en) * | 2003-06-11 | 2004-12-23 | Yazaki Corporation | Coloring nozzle for electric wire |
| JP2008178852A (en) * | 2006-12-26 | 2008-08-07 | Ulvac Japan Ltd | Nozzle, liquid crystal material discharge apparatus, nozzle manufacturing method and nozzle manufacturing apparatus |
| JP2012230386A (en) * | 2006-12-26 | 2012-11-22 | Ulvac Japan Ltd | Nozzle, liquid crystal material discharge apparatus, and nozzle manufacturing method |
| JP2015208753A (en) * | 2014-04-24 | 2015-11-24 | 三菱電機株式会社 | Molten solder supply equipment |
| JP2023121216A (en) * | 2022-02-21 | 2023-08-31 | 三郎 宮崎 | Nozzle body of mixed liquid discharge device |
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