JPH10150090A - Substrate processing system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To protect a substrate against contamination by carrying a substrate, being received by means of a first substrate carrying robot, to any one of a plurality of processing units and then carrying out the processed substrate to a substrate containing arm by means of a second substrate carrying robot. SOLUTION: A first substrate carrying robot 35 carries a received substrate (w) into a chemical processing chamber 33 where the substrate (w) is subjected to chemical processing. Upon finishing chemical processing, a carrying robot 36 carried the substrate (w) into a water washing/drying chamber 34 where the substrate (w) is cleaned and dried. Subsequently, a second substrate carrying robot 37 carries out the substrate (w) from the water washing/drying chamber 34. Thereafter, an indexer robot 12 receives the substrate (w), moves the substrate in front of the cassette C in which the substrate is originally contained and contains the substrate in that cassette C. According to the arrangement, the substrate (w) is protected against contamination and the processing tact can be shortened.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a substrate processing apparatus for processing a substrate such as a semiconductor wafer or a glass substrate for a liquid crystal display.

[0002]

2. Description of the Related Art In a manufacturing process of a semiconductor device or a liquid crystal display device, a processing liquid is used to form a thin film on a substrate such as a semiconductor wafer or a glass substrate for a liquid crystal display device or to clean the substrate. A substrate processing step is indispensable. A configuration for performing such a substrate processing step is disclosed, for example, in Japanese Patent Application Laid-Open No. 5-152266.

FIG. 7 is a schematic plan view showing a substrate processing apparatus disclosed in the above publication. The substrate processing apparatus includes a base 2 on which a plurality of cassettes C each capable of accommodating a plurality of substrates W can be mounted along a predetermined mounting direction.
00 is provided. On the side of the base 200, an indexer transport unit 201 for loading / unloading the substrate W with respect to the cassette C is provided so as to be movable in the placement direction described above. Base 2 of indexer transport unit 201
On the side opposite to 00, a substrate cleaning unit 210 is provided.

The substrate cleaning unit 210 includes a process transport unit 211 that can move in a direction substantially perpendicular to the direction in which the indexer transport unit 201 moves. A pair of unit groups 220A and 220B are arranged so as to sandwich the process transfer unit 211. The unit group 220B includes two processing units 221a and 221b for performing processing for cleaning / drying the substrate W. The unit group 220A includes three processing units 22 for performing a process of evaporating water molecules on the surface of the substrate W after drying.
2a, 222b, and 222c are included.

[0005] The indexer transport unit 201 includes a substrate unloading arm 202 and a processed substrate storage arm 203.
And These arms 202 and 203 are provided on substrate support surfaces 204 and 2 for supporting the substrate W by vacuum suction.
05, and each of the substrate support surfaces 204, 20
5 can be shifted from one another in the vertical direction. The process transfer unit 211 includes one arm 2
The substrate 212 is supported by the arm 212.

When an unprocessed substrate W is carried out of the cassette C, the indexer transport unit 201 shifts the substrate support surface 204 of the substrate take-out arm 202 above the substrate support surface 205 of the processed substrate storage arm 203. In this state, the arms 202 and 203 are simultaneously inserted into the cassette C. Thereby, the substrate W in the cassette C is supported on the substrate support surface 204 of the substrate unloading arm 202.
Then, after returning the arms 202 and 203 to unload the substrate W from the cassette C, the substrate W is transferred to the process transfer unit 211. The process transfer unit 211 holds the substrate W on the arm 212 and
21a and 221b, the processed substrate W is taken out and further processed.
22c.

[0007] The substrate W after all the processes are completed is carried out by the process transport unit 211 and transferred to the indexer transport unit 201. At this time, the indexer transport unit 201 is provided with the processed substrate storing arm 20.
3 is shifted above the substrate support surface 204 of the substrate unloading arm 202, and the processed substrate W
Is supported on the substrate support surface 205 of the processed substrate storage arm 203. Indexer transport unit 201
Moves to the front of the cassette C originally stored while supporting the processed substrate W, and each arm 202, 2
03 is simultaneously inserted into the cassette C, and the processed substrate W is carried into the cassette C.

[0008]

Incidentally, particles may be attached to the unprocessed substrate W, and the particles may be transferred to the arm 212 of the process transfer unit 211 for transferring the substrate W. . In the process transfer unit 211, the unprocessed substrate W and the processed substrate W are supported by one arm 212. Therefore, there is a problem that particles adhere to the processed substrate W and recontaminate the substrate W.

Further, since there is only one process transfer unit 211, the substrate W is transferred to the processing units 221a and 221a.
1b; the operation of carrying in from 222a to 222c and the operation of carrying out from processing units 221a, 221b; 222a to 222c cannot be performed at the same time, and there is a limit in shortening the processing tact. However, recently, from the viewpoint of improving the efficiency of substrate processing, there is a demand for further shortening of the processing tact.

An object of the present invention is to solve the above-mentioned technical problems and to provide a substrate processing apparatus capable of preventing contamination of a substrate and shortening a processing tact.

[0011]

According to the first aspect of the present invention, there is provided a cassette mounting portion on which a cassette for accommodating a plurality of substrates is mounted, and a cleaning device for cleaning the substrates. A plurality of processing units for performing a series of processing on the substrate, including at least one cleaning processing unit, and a substrate for removing an unprocessed substrate stored in a cassette mounted on the cassette mounting unit An unloading arm, a substrate storage arm for storing a substrate processed in any one of the processing units in a cassette mounted on the cassette mounting unit, and receiving an unprocessed substrate from the substrate unloading arm. A first substrate transfer robot for transferring the received substrate to one of the plurality of processing units, and a first substrate transfer robot for transferring the received substrate to one of the plurality of processing units. Unloads the substrate processed from management unit is a substrate processing apparatus which comprises a second substrate transfer robot for transferring the substrate loading arm.

In the present invention, since the robot for transporting the unprocessed substrate to the processing unit and the robot for unloading the processed substrate from the processing unit are separate from each other, the robot is transferred from the unprocessed substrate to the robot. Even if the particles are transferred, the particles do not adhere to the processed substrate. Further, since the arm for taking out the unprocessed substrate from the cassette and the arm for storing the processed substrate in the cassette are separate, the arm for the processed substrate is also used when storing the processed substrate in the cassette. No particles transferred to the surface will adhere.

Therefore, even when the processing unit includes a cleaning processing unit for cleaning the substrate, recontamination of the processed substrate can be prevented. In addition, since the substrate loading operation and the substrate unloading operation can be performed simultaneously with respect to the processing unit, the processing tact can be improved. The invention according to claim 2 is the substrate processing apparatus according to claim 1, wherein the substrate take-out arm and the substrate storage arm are selectively inserted into the cassette.

According to the present invention, the substrate take-out arm and the substrate storage arm can be selectively inserted into the cassette. Therefore, when storing the processed substrate in the cassette, it is possible to prevent the substrate unloading arm from which particles may transfer from the unprocessed substrate from being inserted into the cassette. Therefore, even when the substrates are stored sequentially from the lower side of the cassette, the particles from the substrate take-out arm do not fall on the processed substrates already stored in the cassette.

According to a third aspect of the present invention, a plurality of the cassettes are mounted on the cassette mounting portion along a predetermined cassette mounting direction, and the substrate unloading arm and the substrate storage arm are mounted on the cassette mounting arm. 1 that can move along the direction
3. The substrate processing apparatus according to claim 1, wherein the substrate processing apparatus is provided in one of the indexer robots.

According to the present invention, since the substrate take-out arm and the substrate storage arm are provided in one indexer robot, even if a plurality of cassettes are mounted on the cassette mounting portion, one robot is used. Good. Therefore, the cost can be reduced as compared with a case where each arm is provided in a separate robot. The invention according to claim 4 is the substrate processing apparatus according to any one of claims 1 to 3, wherein the substrate take-out arm is disposed below the substrate storage arm.

According to the present invention, particles adhering to an unprocessed substrate held by the substrate unloading arm and particles transferred from the unprocessed substrate to the substrate unloading arm can be prevented from dropping into the substrate storage arm. . Further, when the processed substrate is held on the substrate storage arm, the particles do not drop onto the processed substrate.

[0018]

Embodiments of the present invention will be described below in detail with reference to the accompanying drawings. FIG. 1 is a plan view conceptually showing a configuration of a substrate processing apparatus according to an embodiment of the present invention. This substrate processing apparatus includes an integrated circuit element (I
C) for performing a series of processes on a semiconductor wafer (hereinafter, referred to as “substrate”) W used in the manufacture of the plurality of cassettes C capable of accommodating a plurality of substrates W, respectively. An indexer 10 for loading / unloading the substrate W, and an unprocessed substrate W supplied from the indexer 10
Is subjected to a series of processes, and the processed substrate W is indexed by the indexer 10.
And a processing module 20 that discharges the paper toward the printer.

The indexer 10 includes an indexer robot 12 that can reciprocate on a linearly extending indexer transport path 11 and a cassette loading section 13 that can place a plurality of cassettes C along the indexer transport path 11. And Cassette loading section 1 of indexer transport path 11
On the opposite side to 3, a processing module 20 is coupled to the indexer 10.

The processing module 20 includes a main transfer robot 22 that can reciprocate along a main transfer path 21 that extends linearly in a direction orthogonal to the indexer transfer path 11 from near an intermediate portion of the indexer transfer path 11. A pair of unit sections 30A, 30B is arranged so as to sandwich the main transport path 21. The unit units 30A and 30B are respectively arranged along the main transport path 21 and each include therein processing devices 31 and 32 for performing processing on the substrate W.
Robots 35 for loading and / or unloading substrates W into and out of the processing chambers 33 and 34.
Transfer chambers 38, 39, 40 having therein 36, 37.

The indexer robot 12 and the main transfer robot 22 can be reciprocated linearly along the indexer transfer path 11 and the main transfer path 21 by a drive mechanism (not shown) including a linear transfer mechanism such as a ball screw mechanism. Is configured. Indexer robot 12
Has a mechanism for taking out and holding the substrates W in the cassette C one by one. The main transfer robot 22 has a mechanism for holding the substrate W, transferring the substrate W to and from the indexer robot 12, and transferring the substrate W to and from the transfer robot 35. The indexer robot 12 and the main transfer robot 22 operate according to a predetermined program under the control of a system computer (not shown).

The unit sections 30A and 30B are for performing, for example, the same series of processing on the substrate W.
Reference numerals 3 and 34 are arranged at predetermined intervals along the main transport path 21. When the processing module 20 performs a chemical treatment and a water washing treatment on the substrate W, for example, the processing chamber 33 on the far side from the indexer 10 is a chemical treatment chamber for supplying a chemical to the substrate W for etching. (Hereinafter, referred to as “MTC”), and the processing chamber 34 on the side close to the indexer 10 is a washing / drying processing chamber (hereinafter, referred to as “DTC”) for washing and drying the substrate W after the chemical treatment with pure water. It is. The reason why the MTC 33 is arranged on the side far from the indexer 10 is to make it difficult for the chemical solution atmosphere generated in the MTC 33 to reach the indexer 10.

On the side of the MTC 33 opposite to the position where the indexer 10 is installed, a loading robot 3 for receiving an unprocessed substrate W from the main transfer robot 22 and loading it into the MTC 33.
5 is provided. Also,
Between the MTC 33 and the DTC 34, a transfer chamber 39 having therein a transfer robot 36 for receiving the substrate W after the chemical treatment from the MTC 33 and carrying the substrate W into the DTC 34 is provided. Further, on the indexer 10 side of the DTC 34, an unloading chamber 40 having an unloading robot 37 for receiving the substrate W after the washing / drying processing from the DTC 34 and transferring the substrate W to the indexer robot 12 is provided. Loading robot 35, transfer robot 36, and unloading robot 3
7 is, for example, a scalar type robot.

In this embodiment, the main transfer robot 22 and the carry-in robot 35 correspond to a first substrate transfer robot, and the carry-out robot 37 corresponds to a second substrate transfer robot. At the start of the processing, the indexer robot 12
Unloading only one substrate W from any one of the plurality of cassettes C mounted on the cassette mounting portion 13,
Indexer transport path 11 to the vicinity of the junction with main transport path 21
After moving up, the unloaded substrate W is transferred to the main transfer robot 22. Main transfer robot 22 receiving substrate W
Moves on the main transfer path 21 to the front of the carry-in chamber 38 and transfers the received substrate W to the carry-in robot 35.

The carry-in robot 35 receives the transferred substrate W
Is carried into the MTC 33 and delivered to the chemical solution treatment device 31. The chemical liquid processing apparatus 31 supplies the chemical liquid to the substrate W while rotating the substrate W at a high speed while holding the transferred substrate W. Thus, the substrate W is subjected to the chemical treatment. When the chemical solution processing is completed, the transfer robot 36 unloads the substrate W after the chemical solution processing from the MTC 33, loads the substrate W into the DTC 34, and transfers the substrate W to the washing / drying processing device 32. Washing / drying equipment 32
Supplies the pure water to the substrate W while rotating the substrate W at a high speed while holding the transferred substrate W. Thus,
The cleaning process is performed on the substrate W. Further, the substrate W is rotated at a high speed with the supply of pure water stopped, and the moisture on the substrate W is shaken off to dry the substrate W. Thereafter, the unloading robot 37 unloads the processed substrate W from the DTC 34.

When the processed substrate W is unloaded from the DTC 34, the indexer robot 12 moves on the indexer transport path 11 to a position before the unloading chamber 40 and receives the substrate held by the unloading robot 37. Thereafter, the indexer robot 12 moves to a position in front of the cassette C in which the received substrate W is originally stored, and stores the held substrate W in the cassette C. Thus, a series of processes for one substrate W is completed.

FIG. 2 is a schematic perspective view showing the configuration of the indexer robot 12. As shown in FIG. The indexer robot 12 is mounted on two guide rails 15a and 15b extending at predetermined intervals along the longitudinal direction L1 of the indexer transport path 11 on the indexer transport path 11 (see FIG. 1). A movable base 50, a base 60 provided on the upper part of the movable base 50 so as to be vertically movable with respect to the movable base 50, and a substrate holding mechanism 70 provided on the upper part of the base 60 are provided. I have.

In the following description, for convenience, the direction along the longitudinal direction L1 of the indexer transport path 11 from the unit 30B to the unit 30A in FIG. 1 is referred to as the "+ L1 direction", and the direction from the unit 30A to the unit 30A. 3
The direction toward 0B is referred to as "-L1 direction". Movable table 50
Is provided with a ball screw mechanism 52 including a screw shaft 51 extending along the longitudinal direction L1 of the indexer transport path 11. When the screw shaft 51 is driven to rotate in the rotation direction C1 or C2 by the first motor M1, the movable base 50 moves on the guide rails 15a and 15b in the + L1 direction or the -L1 direction. With this movement, the base 60 and the substrate holding mechanism 70 also move in the same direction.

The base 60 is provided with a ball screw mechanism 61 for vertically moving the base 60 with respect to the movable base 50. The ball screw mechanism 61 includes a movable table 50.
Screw shaft 6 erected upward from the upper center of the center
2 is included. When the screw shaft 62 is driven to rotate in the rotation direction C3 or C4 by the second motor M2, the base 60 moves upward or downward with respect to the movable base 50. With this vertical movement, the substrate holding mechanism 70 also moves in the same direction.

The substrate holding mechanism 70 includes a substrate take-out arm 80 for taking out an unprocessed substrate W from the cassette C, and a substrate storage arm 90 for storing the processed substrate W in the cassette C. The substrate unloading arm 80 includes an unloading arm 81 for holding the substrate W and an unloading positioning guide 82 for positioning the substrate W held by the unloading arm 81.

The take-out arm portion 81 is connected to an upper portion of the upper portion of the base 60, which is an arm column 81a which is erected upward at a position shifted toward the + L1 direction side, and is connected to the upper portion of the arm column 81a in the -L1 direction. Connecting member 81b extending toward
And the indexer transport path 11 connected to the connecting member 81b.
A lever 81c extending along a cassette access direction L2 which is a direction substantially orthogonal to the longitudinal direction L1 of the lever 8;
1c, and a substrate holding member 81d attached to the front end and the middle.

The arm support 81a is positioned at a position shifted in the + L1 direction on the upper portion of the base 60 in the cassette access direction L.
2 can be moved along the guide groove 83 formed along. Thus, the entire take-out arm portion 81 can move in the cassette access direction L2. The driving force generated by the third motor M3 is transmitted to the arm support 81a by a belt mechanism (not shown), whereby the arm support 81a can move in the cassette access direction L2.

The take-out positioning guide portion 82 has a guide portion main body 82b formed with a contact surface 82a having a shape such that the peripheral edge of the substrate W held by the take-out arm portion 81 contacts. The main body 82b includes an arm support 81a.
Is supported by a guide column 82c erected at a position close to. The guide post 82c is made movable along the cassette access direction L2 by the first cylinder S1, so that when the unprocessed substrate W taken out of the cassette C is transferred to the main transfer robot 22, the positioning of the substrate W is performed. The state can be released.

The substrate storage arm 90 basically has the same configuration as the substrate take-out arm 80. That is, the arm support 91a, the connecting member 91b connected to the upper portion of the arm support 91a, and the lever 9 connected to the connecting member 91b.
1c, substrate holding member 91 attached to lever 91c
d including a storage arm portion 91 and a guide post 92
c, abutment surface 92a supported by guide post 92c
And a storage positioning guide portion 92 including a guide portion main body 92b formed with a groove.

The arm support 91a is erected at a position shifted in the + L1 direction on the upper part of the base 60,
It is movable along a guide groove 93 formed along the cassette access direction L2 at a position shifted in the direction side. The guide support 92c is provided upright at a position near the arm support 91a. The driving sources of the arm support 91a and the guide support 92c are the fourth motor M4 and the second cylinder S2, respectively.

Substrate take-out arm 80 and substrate storage arm 90
Are shifted from each other in the up-down direction, so that the substrate take-out arm 80 is located below the substrate storage arm 90. That is, when the substrate unloading arm 80 is positioned above the substrate storage arm 90, the unprocessed substrate W and particles transferred from the unprocessed substrate W to the substrate unloading arm 80 are transferred to the substrate storage arm 90 and the substrate storage arm 90. This is because there is a risk of dropping on the substrate W held in the substrate W. Further, a substrate take-out arm 80 and a substrate storage arm 90
If the heights are the same, the length of the indexer robot 12 along the indexer transport path 11 increases, and the size of the apparatus increases.

The operations of the first to fourth motors M1 to M4 and the first and second cylinders S1 and S2 are independently controlled by a control unit 100 constituted by, for example, a microcomputer. .
Thus, the take-out arm 81 and the storage arm 91
Can be selectively moved along the cassette access direction L2. Also, the take-out positioning guide 82
And the storage positioning guide portion 92 can be selectively displaced into a positioning state and a positioning release state.

A plurality of substrate storage grooves 110 are formed on the inner peripheral surface of the cassette C along the inner peripheral surface of the cassette C. One substrate W is stored in each substrate storage groove 110. When a plurality of substrates W are stored in the cassette C, a space is provided between the substrates W such that the unloading arm portion 81 and the storage holding arm portion 91 can be inserted.

FIG. 3 is a conceptual diagram for explaining the operation when taking out an unprocessed substrate W from the cassette C.
When removing an unprocessed substrate W from the cassette C, the control unit 1
00, first, the first motor M1 is driven, to move the indexer robot 12 before the cassette C substrate W ₀ of the retrieval target is accommodated, take-out arm 81 is substantially of the substrate W ₀ of the take-out target Stop when it reaches the center position.

Thereafter, the second motor M2 is driven, and the base 6
0 and increase the substrate holding mechanism 70 is stopped at a position reached between the substrate W ₁ of one of a substrate W ₀ and the substrate W ₀ takeout arm portion 81 of the retrieval target substrate unloading arm 80 (FIG. 3 (a)). Then, the third motor M3 is driven, the take-out arm 81 is moved toward the cassette C, is stopped at a position below the substrate W ₀ of the take-out target (Figure 3
(b)).

Next, the second motor M2 is driven again, and
The table 60 and the substrate holding mechanism 70 are raised. At this time
The rise width of the substrate W₀The arm 81 for taking out holds
Distance enough for As a result, the substrate W₀
Is held by the take-out arm 81 (FIG. 3 (c)). That
Then, the third motor M3 is driven, and the unloading arm 81 is closed.
Move in the direction away from set C. The result of this move
As a result, the substrate W held by the unloading arm 81₀Lap of
The rim abuts on the abutment surface 82a of the take-out positioning guide 82
And substrate W ₀Is positioned (FIG. 3 (d)). This
Thus, the removal of the unprocessed substrate W is completed.

Thereafter, the control unit 100 controls the first motor M1
Is driven to move the indexer robot 12 to the vicinity of the connection with the main transfer path 21, and at this position, the substrate W ₀ held is transferred to the main transfer robot 22. At this time, the first cylinder S1 is moved to take out the positioning guide portion 82 for removal.
Is slightly moved in a direction away from the cassette C, and the substrate W
Release the ₀ positioning state. Further, the second motor M2
Is driven to lower the base 60 and the substrate holding mechanism 70. As a result, the substrate W ₀ is transferred to the lifter pin provided in the middle its lowered (not shown). Main transfer robot 2
Reference numeral 2 denotes a substrate W ₀ placed on the lifter pins.
Of extending the arm downwards, it receives the substrate W ₀ from lifter pins by raising the arm. afterwards,
By shortening the arm, it receives the substrate W ₀ is completed.

FIG. 4 is a conceptual diagram for explaining the operation when the processed substrate W is stored in the cassette C. Rear unit sections 30A and 3 taken out of cassette C
The substrate W ₀ processed at 0B is transferred from the unloading robot 37 to the indexer robot 12 as described above. On the other hand, when the substrate W ₀ is transferred to the unloading robot 37, the control unit 100 drives the first motor M1 to move the indexer robot 12 to a position just before the unloading chamber 40. In this state, out robot 37 places the substrate W ₀ of processed on unillustrated lifter pins.

Thereafter, the control unit 100 controls the second cylinder S
2 to move the storage positioning guide portion 92 to the release position, drive the second motor M2, and raise the substrate storage arm 91. As a result, the substrate W ₀ on the lifter pins
Moves to the substrate storage arm 91. Then, the second cylinder S
2 Move to position the substrate W _0. Then, the first motor M1 is driven, the indexer robot 12 is moved to the front of the cassette C in which the substrate W ₀ was originally housed, stopped when the substrate loading arm 91 has reached almost the center front of the cassette C Let it.

Thereafter, the second motor M2 is driven to
0 and the substrate holding mechanism 70 are raised, and at the position where the unloading arm portion 91 of the substrate storage arm 90 reaches almost the same height as the substrate storage groove 110 (see FIG. 2) for storing the processed substrate W ₀ . It is stopped (FIG. 4 (a)). Then, the fourth motor M4 is driven, the substrate loading arm 91 is moved toward the cassette C, and carries the substrate W ₀ in a cassette C (Figure 4 (b)). Next, the second motor M2 is driven to lower the substrate storage arm 91 (FIG. 4C). As a result, the substrate W ₀ fits in the predetermined substrate storage groove 110 in the cassette C. Thereafter, the fourth motor M4 is driven to move the substrate storage arm 91 in a direction away from the cassette C (FIG. 4).
(d)). This completes the substrate storing operation.

As described above, according to the present embodiment, the dedicated main transfer robot 22 for receiving the unprocessed substrate W from the indexer robot 12, the unprocessed substrate W is received from the main transfer robot 22, and is loaded into the MTC 33. And a dedicated unloading robot 37 for transferring the processed substrate W to the indexer robot 12, so that the unprocessed substrate is transferred to the unloading robot 37 that is in charge of transferring the processed substrate W. The particles attached to W do not transfer. Therefore, the substrate W after the cleaning is not re-contaminated.

Further, the indexer robot 12 is provided with a dedicated substrate take-out arm 80 for taking out an unprocessed substrate W from the cassette C and a dedicated substrate storage arm 90 for storing the processed substrate W in the cassette C. The substrate storage arm 9 that is in charge of transporting the processed substrate W.
Particles adhering to the unprocessed substrate W do not transfer to zero. In addition, since the substrate unloading arm 81 is provided below the substrate storage arm 91, processing in which unprocessed substrates W and particles adhering to the substrate unloading arm 81 are held by the substrate storage arm 80 and the substrate storage arm 80. Does not fall on the substrate W which has already been used. Therefore, even after the processed substrate W is delivered to the indexer robot 12, the cleaned substrate W is not re-contaminated.

Thus, the quality of the substrate W can be improved. Also, the unit sections 30A, 3 of the unprocessed substrate W
Since the loading into the OB and the unloading of the processed substrate W can be performed at the same time, the processing tact can be improved. Therefore, the efficiency of the substrate processing can be further improved. Although the description of one embodiment of the present invention is as described above, the present invention is not limited to the above-described embodiment. For example, in the above-described embodiment, as the configuration of the processing module 20, a configuration in which a pair of unit units 30A and 30B that perform the same processing with each other with the main transport path 21 interposed therebetween is adopted. As shown in the plan view, the sequential transfer type processing module 20 in which the processing units 150 and the scalar type transfer robots 151 are alternately arranged is formed in a substantially U-shape in plan view.
A carry-in robot 160 for receiving an unprocessed substrate W from the indexer robot 12 and a carry-out robot 161 for transferring the processed substrate W to the indexer 12 may be provided at one end and the other end of the zero. .
According to this configuration, the robot that handles the unprocessed substrate W and the robot that handles the processed substrate W are separated from each other, so that the processed substrate W is not re-contaminated similarly to the above-described embodiment. The quality of the substrate W can be improved, and the processing tact can be improved.

Further, as the configuration of the processing module 20, a configuration as shown in FIG. 6 may be employed. The processing module 20 having this configuration includes the loading robot 1 that moves on a loading path 170 that extends from near one end of the indexer transport path 11 in a direction substantially orthogonal to the transport direction of the indexer robot 12.
71 and the loading path 1 from near the other end of the indexer transport path 11.
The apparatus includes an unloading robot 181 that moves on an unloading path 180 extending substantially parallel to 70, and a unit 190 disposed so as to be sandwiched between the unloading path 170 and the unloading path 180. In the unit section 190, two cleaning processing units 191a and 191b and chemical solution processing units 192a and 192b are arranged in a row in order from the side close to the indexer 10. The unloading robot 181 receives the processed substrate W only from the cleaning processing unit.
1 is half the length of the carry-in path 171.

Upon receiving the unprocessed substrate W from the indexer robot 12, the carry-in robot 171 carries the substrate W into one of the chemical processing units 192a and 192b. After the completion of the chemical treatment, the carry-in robot 171 takes out the processed substrate W from the chemical treatment unit 192a or 192b, and carries it into one of the cleaning units 191a and 191b. After the completion of the cleaning process, the processed substrate W is unloaded by the unloading robot 181, and the indexer robot 1
Passed to 2.

According to this configuration, the robot for transferring the unprocessed substrate W to the chemical processing units 192a and 192b and the cleaning unit 191a and 191 for cleaning the processed substrate W are also provided.
b, and the robot that is taken out of the substrate W and passed to the indexer robot 12 is separate, so that the processed substrate W is not re-contaminated, and the quality of the substrate W can be improved. Tact can be improved.

Since the substrate W after the chemical treatment is carried out of the unit by the carry-in robot for transporting the untreated substrate W, particles may adhere to the substrate W after the chemical treatment. However, since the substrate W after the chemical treatment is cleaned by the cleaning unit, the particles attached to the substrate W can be washed away. Therefore, there is no particular problem.

Further, in the above-described embodiment, the case where the substrate W is stored in the cassette C in which the substrate W was originally stored is described, but for example, the cassette C in which the unprocessed substrate W is stored and the processed substrate W are separated. The cassettes C to be stored may be separately provided. In this case, for example, even when the processed substrates W are sequentially stored in the upper substrate storage groove 110 from the lower substrate storage groove 110 of the cassette C, the substrate take-out arm 80 and the substrate storage arm 9
If 0 is selectively allowed to enter the cassette C, particles do not fall off the substrate take-out arm 80 onto the processed substrate W already stored in the cassette C. Therefore, recontamination of the substrate W can be prevented.

Further, in the above embodiment, one indexer robot 12 is provided with the substrate take-out arm 80 and the substrate storage arm 90. However, even if there are a plurality of cassettes C, one indexer robot 12 has one robot. Therefore, if this point is not particularly important, for example, the substrate take-out arm 80 and the substrate storage arm 90 are provided in different robots, respectively. You may do so.

In addition, various design changes can be made within the scope described in the claims.

[0056]

As described above, according to the present invention, the robot for carrying out the substrate transfer operation to the processing unit and the robot for carrying out the substrate unloading operation are separated from each other. Even if is transferred, the particles do not adhere to the processed substrate. Therefore, recontamination of the processed substrate can be prevented. Therefore, the quality of the substrate can be improved.

In addition, the substrate transfer operation and the substrate unload operation to the processing unit can be performed simultaneously, so that the processing tact can be improved. Therefore, the efficiency of the substrate processing can be further improved. According to the second aspect of the present invention, when storing processed substrates in the cassette, the substrate take-out arm can be prevented from being inserted into the cassette, so that the substrates are stored sequentially from the lower side of the cassette. Even at this time, particles from the substrate unloading arm do not fall on the processed substrate already stored in the cassette. Therefore, re-contamination of the substrate can be prevented, and the quality of the substrate can be further improved. This effect is particularly effective when the cassette storing the unprocessed substrates is different from the cassette storing the processed substrates.

According to the third aspect of the present invention, even if a plurality of cassettes are mounted on the cassette mounting portion, only one robot is required to access the cassettes.
The cost can be reduced as compared with a case where each arm is provided in a separate robot. According to the fourth aspect of the present invention, the unprocessed substrate and the particles adhering to the substrate unloading arm do not fall onto the substrate storage arm or the processed substrate held by the substrate storage arm. The substrate can be further improved in quality without recontaminating the substrate.

[Brief description of the drawings]

FIG. 1 is a plan view schematically showing a configuration of a substrate processing apparatus according to an embodiment of the present invention.

FIG. 2 is a perspective view illustrating a configuration of an indexer robot.

FIG. 3 is a conceptual diagram for explaining a substrate unloading operation by the indexer robot.

FIG. 4 is a conceptual diagram for explaining a substrate storing operation by the indexer robot.

FIG. 5 is a plan view schematically showing a configuration of a substrate processing apparatus according to another embodiment of the present invention.

FIG. 6 is a plan view schematically showing a configuration of a substrate processing apparatus according to another embodiment of the present invention.

FIG. 7 is a plan view schematically showing a configuration of a conventional substrate processing apparatus.

[Explanation of symbols]

 Reference Signs List 12 indexer robot 13 cassette mounting part 22 main transfer robot 30A, 30B unit part 33 MTC 34 DTC 35, 160, 171 carry-in robot 37, 161, 181 carry-out robot 80 substrate take-out arm 90 substrate storage arm 100 control part C cassette M1- M4 motor W board

Claims (4)

[Claims] An apparatus includes a cassette mounting section on which a cassette for accommodating a plurality of substrates is mounted, and at least one cleaning processing section for cleaning the substrates, for performing a series of processing on the substrates. A plurality of processing units, a substrate take-out arm for taking out an unprocessed substrate stored in a cassette mounted on the cassette mounting portion, and a substrate that has been processed in any of the processing units. A substrate accommodating arm for accommodating in a cassette mounted on a cassette mounting portion, receiving an unprocessed substrate from the substrate unloading arm, and transferring the received substrate to one of the plurality of processing units. A first substrate transport robot for transporting, and unloading a processed substrate from any one of the plurality of processing units, A substrate processing apparatus which comprises a second substrate transfer robot for transferring the serial substrate loading arm. 2. The substrate processing apparatus according to claim 1, wherein said substrate take-out arm and said substrate storage arm are selectively inserted into said cassette. 3. A plurality of the cassettes are mounted on the cassette mounting portion along a predetermined cassette mounting direction, and the substrate take-out arm and the substrate storage arm are movable along the cassette mounting direction. The substrate processing apparatus according to claim 1, wherein the substrate processing apparatus is provided in a single indexer robot. 4. The substrate processing apparatus according to claim 1, wherein said substrate take-out arm is disposed below said substrate storage arm.