JPH1015776A - Method and apparatus for removing punched debris from printed wiring board - Google Patents

Abstract

(57) [Summary] [PROBLEMS] To automatically remove chips attached to a component mounting hole of a printed wiring board and the surface of the printed wiring board. SOLUTION: The printed wiring boards 1 which are separated one by one from a loading section 13 by a printed wiring board supply device 18 and fall down on a conveyer 14 with a chip transfer roller 1 having an adhesive layer.
1 and 12 and the waste chip transfer rolls 11 and 12
By passing through the gap, the punching debris adhering to the component mounting hole 4 of the printed wiring board 1 is removed.
Transfer to 2B and remove automatically.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for removing debris from a printed wiring board, which is suitable for removing debris adhered to a component mounting hole formed by pressing a wiring portion in a printed wiring board. And its device.

[0002]

2. Description of the Related Art A single-sided printed wiring board uses a substrate on which copper foil is adhered on one side. A wiring pattern is formed on the copper foil of the substrate by a photographic method or screen printing, and the wiring pattern is formed by etching. Remove copper foil other than
Next, after removing the resist layer on the wiring pattern, a component mounting hole is formed in a component mounting position of the wiring pattern by a press die, and finally, the outer shape is finished and characters are printed to obtain a product. For punching such single-sided printed wiring boards, punches and dies are generally used.Punches are pressed against the component mounting locations of the wiring pattern to form the component mounting holes by punching the printed wiring board. At the same time, the scraps are drawn down through the die holes to below the dice.

[0003] By the way, depending on the state of the punch and the die with respect to the substrate, the properties of the substrate and the copper foil, or the properties of the chips including the substrate and the copper foil at the time of punching, the punched-out chips are caught at the end of the hole. Frequently, a part of the copper foil to be punched or a part of the copper foil to be punched remains connected to the copper foil of the wiring pattern, thereby closing the component mounting hole. This means
The smaller the hole diameter is, the more easily it occurs. As a result, in addition to hindering the mounting and soldering of circuit components on the printed wiring board,
There is a possibility that the debris detached at the time of component mounting adheres to the wiring pattern, and there is a problem that the copper foil separated from the debris causes a short circuit between the wirings. Therefore, conventionally, a jig in which pins are implanted at locations corresponding to the respective component mounting holes of the printed wiring board is formed, and each pin of the jig is inserted into each of the component mounting holes of the printed wiring board. As a result, debris closing the component mounting hole is pushed out and removed by brushing with a brush.

[0004]

However, in the above-described conventional method of removing chips from a printed wiring board, each pin of a jig is inserted into each component mounting hole of the printed wiring board and then brushed with a brush. It requires a lot of manpower, makes the removal work complicated,
In addition to the low removal efficiency, there are problems that the pins are bent during brushing and the surface of the printed wiring board is damaged by the pins and brushes.

SUMMARY OF THE INVENTION The present invention has been made in view of the above points, and it is possible to automatically remove debris adhering to a component mounting hole of a printed wiring board and a surface of the printed wiring board, thereby improving the processing ability. An object of the present invention is to provide a method and an apparatus for removing punched chips from a printed wiring board.

[0006]

According to the present invention, there is provided a printed wiring board formed by forming a wiring pattern on at least one side and punching out a component mounting hole at a component mounting portion of the wiring pattern. A method for removing punching debris adhered to the component mounting hole portion, by pressing at least one roll with an adhesive layer against at least one surface of the printed wiring board,
The present invention is characterized in that punching debris adhering to the component mounting hole portion is transferred to an adhesive layer and removed.

Further, according to the present invention, after a wiring pattern is formed on at least one surface, a punching process is performed to punch out a component mounting hole in a component mounting portion of the wiring pattern, thereby removing punching debris adhering to a component mounting hole portion of a printed wiring board. An apparatus for removing the printed wiring board, comprising: a conveying unit for conveying the printed wiring board; and a midway of the conveying unit, the conveying unit facing at least one surface of the printed wiring board and perpendicular to a conveying direction of the printed wiring board. And at least one waste chip transfer roll that rotates while being pressed against the at least one surface, and punching waste attached to the component mounting hole portion is attached to an outer peripheral surface of the chip waste transfer roll. Characterized in that an adhesive layer to be formed is formed. The present invention further comprises a removing means for scraping the punched waste transferred to the adhesive layer of the waste transfer roll. The present invention further comprises a loading section for accommodating the printed wiring boards in a stacked state, and a printed wiring board supply means for separating the printed wiring boards in the loading section one by one and supplying the separated printed wiring boards to the transport means. Things.

[0008] In the present invention, by rotating the waste scrap transfer roll provided with an adhesive layer against the printed wiring board while pressing it, the punched waste adhering to the component mounting hole of the printed wiring board can be reliably applied to the adhesive layer. Since transfer can be performed, punching debris adhering to the printed wiring board can be automatically removed without causing secondary defects in the printed wiring board. Further, in the present invention, the punching debris transferred to the pressure-sensitive adhesive layer of the waste-dust transfer roll is scraped off by a removing means such as a rotating brush, so that the performance of removing the punching debris by the pressure-sensitive adhesive layer can be maintained. Further, in the present invention, the printed wiring boards in the loading section are separated one by one by the supply means and sent to the scrap transfer roll by the transport means, thereby facilitating the automation of the punch scrap removal.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a method and an apparatus for removing punched chips from a printed wiring board according to the present invention will be described with reference to FIGS. FIG. 1 is a schematic side view showing the entire configuration of a punching debris removing apparatus, and FIG. 2 is a perspective view of a printed wiring board. First, in FIG. 2, reference numeral 1 denotes a single-sided printed wiring board. A wiring pattern 3 is formed on one surface of a substrate 2 constituting the printed wiring board 1 by etching or the like. The component mounting hole 4 is formed by an omitted press die.

Next, the configuration of the punching debris removing apparatus shown in FIG. 1 will be described. In FIG. 1, a punching chip removing device prints on a pair of chip transferring rolls 11 and 12, a printed wiring board accommodation / feeding unit 13, conveyors 14 and 15 for transporting a printed circuit board, and cutting waste transferring rolls 11 and 12. Rotary brushes 16 and 17 are provided for removing punched debris transferred from the wiring board 1. The input unit 13 is shown in FIG.
The printed wiring board 1 shown in FIG.
Below the loading section 13, there is provided a supply device 18 which separates the printed wiring boards 1 in the loading section 13 one by one from the lowermost layer and supplies the printed wiring boards 1 onto the conveyor 14. Conveyor 14
Transports the printed wiring boards 1 that drop from the supply device 18 one by one to the scrap transfer rollers 11 and 12. In addition, the conveyor 15 conveys the printed wiring board 1 that has passed through the scrap transfer rollers 11 and 12 to the outside of the apparatus.

The above-mentioned scrap transfer rollers 11 and 12 are located at the end of the printed wiring board unloading of the conveyor 14, hold the printed wiring board 1 from the upper and lower surfaces, and move the printed wiring board 1 in the conveying direction of the conveyor 14. It is disposed at a right angle, is rotatably supported by a support member (not shown), and a scrap transfer roller 11 on the lower surface side is driven by a motor 20 via a rotation transmission mechanism 19 including a pulley and a belt. The rotation of the chip transfer roller 11 is transmitted to the chip transfer roller 12 on the upper surface by a rotation transmission mechanism such as a gear train (not shown). Also,
The scrap transfer rollers 11 and 12 have a desired diameter (for example, 5 mm).
0mm) and desired length (for example, about 300mm)
Roll bodies 11A, 12A and the roll body 11
A and 12A are formed on the outer peripheral surfaces of the adhesive layers 11B and 12B of about 2 to 3 mm. Adhesive layers 11B, 12
For B, an adhesive made of a rubber-based elastomer such as an eraser rubber or a synthetic resin-based plastomer is used.

The rotating brushes 16 and 17 are disposed in parallel and rotatably in contact with the surfaces of the adhesive layers of the respective scrap transfer rolls 11 and 12. The rotating brushes 16 and 17 are provided with the respective scrap transfer rolls 1.
It is configured to be rotated by a motor (not shown) in a direction opposite to the rotation direction of the rolls 1 and 12, and further rotated at a higher peripheral speed than the scrap transfer rollers 11 and 12. Further, the outer periphery of the rotating brushes 16 and 17 other than the portion that circumscribes the scrap transfer rollers 11 and 12 is covered with covers 21 and 22 that also serve as scrap collection.

Next, the operation of the embodiment constructed as described above will be described. Scrap transfer roll 1
1, 12, conveyors 14, 15 and rotating brushes 16, 1
When the printed wiring board supply device 18 is started in a state where the printed wiring board 7 is driven, the printed wiring board 1
Are separated one by one and fall on the conveyor 14. The printed wiring board 1 dropped onto the conveyor 14 is
Is transported to the waste chip transfer rolls 11 and 12, and when the leading end reaches the waste chip transfer rolls 11 and 12, it is gripped between the waste chip transfer rollers 11 and 12 rotating in the direction of the arrow, and pinched from both sides. While being conveyed onto the conveyor 15.

The printed wiring board 1 is used for removing scrap transfer rolls 1
When passing between Nos. 1 and 12, the scrap transfer rolls 11 and 1
2 of the printed wiring board 1
3, as shown in FIG. 3, punching waste 5 adhered to the component mounting hole 4 of the printed wiring board 1 or adhered to the component mounting hole 4 of the wiring pattern 3 of the printed wiring board 1. Waste copper foil 6 has adhesive layer 11B, 1
2B and removed from the printed wiring board 1. On the other hand, the adhesive layers 11B, 1
The punching waste 5 and the copper foil waste 6 transferred to 2B are scraped off by the rotating brushes 16 and 17. In the same manner, the printed wiring boards 1 are separated one by one from the loading section 13 by the printed wiring board supply device 18 in synchronization with the transport speed (5 to 7 m / min) of the conveyor 14 without overlapping on the conveyor 14. If supplied, punching debris and copper foil debris adhering to the component mounting holes 4 of the printed wiring board 1 are automatically removed.

According to such an embodiment, the printed wiring boards 1 which are separated one by one from the input section 13 by the printed wiring board supply device 18 and fall down are transferred to the conveyer 14 by a scrap transfer roller having an adhesive layer. 11 and 12 and pass between the scrap transfer rollers 11 and 12 to remove the punching scrap and copper foil scrap attached to the component mounting hole 4 of the printed wiring board 1 to the adhesive layers 11B and 12B. Since it is configured to be transferred, it is possible to automatically remove punching debris and copper foil debris adhering to the component mounting holes 4 of the printed wiring board 1. Along with this, the efficiency of removal of punched chips is improved, manual labor is not required, and the wiring pattern of the printed wiring board is not damaged, and it is attached to the surface of the printed wiring board other than the component mounting holes. Since the scraps can be removed, the printed wiring board can be finely finished. Further, according to the present embodiment, the punching debris transferred to the adhesive layers of the chip-removing rolls 11 and 12 are scraped off by the rotating brushes 16 and 17 to improve the performance of removing the punching debris by the adhesive layers. Can be maintained. Further, according to the present embodiment, the input unit 13
The printed wiring boards 1 in the inside are separated one by one by a supply device 18 and supplied onto the conveyor 14, and the waste scrap transfer roll 1
Feeding to 1 and 12 facilitates automation of punching debris removal.

In the above-described embodiment, the case of removing punched chips from a single-sided printed wiring board has been described. However, the present invention is not limited to this, and can be similarly applied to a double-sided printed wiring board. In addition, the scrap transfer roll 1
When the adhesive performance of the adhesive layers 11B and 12B of 1 and 12 is reduced, the whole scrap transfer rolls 11 and 12 or the adhesive layers 11B and 12B are replaced with new ones. Further, the number of the waste chip transfer rolls used in the punching waste removing apparatus of the present invention is not limited to one pair, and a plurality of pairs of the waste chip transfer rolls may be provided. There is no need to provide on both surfaces, and a method may be used in which a chip transfer roller is provided only on the surface on the chip discharge side of a printed wiring board to be punched by a press die. Further, in the present invention, scraping of the punched waste transferred to the adhesive layers 11B and 12B of the waste scrap transfer rolls 11 and 12 is not limited to the rotating brushes 16 and 17, and the adhesive performance of the adhesive layer is significantly reduced. If it can be removed without
Any structure may be used.

[0017]

As described above, according to the present invention, a punch attached to a component mounting hole of a printed wiring board is rotated by rotating a scrap transfer roller having an adhesive layer with the printed wiring board while pressing the same. Since debris can be reliably transferred to the adhesive layer, punched debris adhering to the printed wiring board can be automatically removed without causing secondary defects in the printed wiring board. Further, according to the present invention, by scraping the punching waste transferred to the pressure-sensitive adhesive layer of the drawing waste transfer roll by removing means such as a rotating brush,
The performance of removing punched chips by the adhesive layer can be maintained. Further, according to the present invention, the printed wiring boards in the input section are separated one by one by the supply means and sent to the scrap transfer roller by the transport means, thereby providing an effect of facilitating the automation of the punch scrap removal. .

[Brief description of the drawings]

FIG. 1 is a schematic side view showing the entire configuration of a punched-out debris removing apparatus for a printed wiring board according to an embodiment of the present invention.

FIG. 2 is a perspective view of a printed wiring board according to the embodiment of the present invention.

FIG. 3 is an operation explanatory diagram according to the embodiment of the present invention.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 printed wiring board 3 wiring pattern 4 component mounting hole 5 punching waste 6 copper foil waste 11, 12 waste scrap transfer roll 11B, 12B adhesive layer 13 loading section 14, 15 conveyor (transporting means) 16, 17 rotating brush (removing means) 18) Printed circuit board supply device

Claims (5)

[Claims] 1. A method of forming a wiring pattern on at least one surface and then punching out a component mounting hole in a component mounting portion of the wiring pattern to remove punching debris adhering to a component mounting hole portion of a printed wiring board. And pressing and pressing at least one roll with an adhesive layer on at least one surface of the printed wiring board, thereby removing punching debris adhering to the component mounting hole portion by transferring to the adhesive layer. A method for removing punched chips from a printed wiring board, the method comprising: 2. The method according to claim 1, wherein the adhesive layer comprises an adhesive made of a rubber-based elastomer such as an eraser rubber or a synthetic resin-based plastomer. 3. A device for forming a wiring pattern on at least one side and punching out a component mounting hole at a component mounting portion of the wiring pattern to remove punching debris attached to the component mounting hole of the printed wiring board. Transport means for transporting the printed wiring board, and disposed in the direction perpendicular to the transport direction of the printed wiring board, facing the at least one surface of the printed wiring board in the middle of the transporting means; At least one waste chip transfer roll that rotates while being pressed against at least one surface, and an adhesive layer that adheres punched waste adhered to the component mounting hole portion is provided on an outer peripheral surface of the chip waste transfer roller. An apparatus for removing punched chips from a printed wiring board, wherein the apparatus is formed. 4. The apparatus according to claim 3, further comprising removing means for scraping the punched waste transferred to the pressure-sensitive adhesive layer of the waste scrap transfer roll. 5. The printing apparatus according to claim 1, further comprising: an input unit for housing the printed wiring boards in a stacked state; and a printed wiring board supply unit for separating the printed wiring boards in the input unit one by one and supplying the separated printed wiring boards to the transport unit. 5. The punching debris removing device for a printed wiring board according to 3 or 4.