JPH10178148A - Lead frame member and manufacturing method thereof - Google Patents

Abstract

(57) [Problem] To form a resin layer for fixing an inner lead directly by a screen printing method or a dispensing method without using an expensive fixing tape requiring cutting by a mold as an inner lead fixing portion. Provided is a lead frame member including a lead frame and an inner lead fixing portion, which can solve the problem in the case. At the same time, a method for manufacturing such a lead frame member is provided. A lead frame member having a lead frame and an inner lead fixing portion used for a resin-sealed semiconductor device, wherein the lead frame is provided with a die pad, and is provided on one side of the lead frame. The inner lead surface is a lead frame material surface, and a thin portion thinner than the thickness of the material is formed at the tip of the inner lead, and the inner lead fixing portion is made of insulating resin, and the lead frame material of the thin portion is formed. At the leading end on the side of the surface that is recessed from the surface, the inner leads are fixed so as to straddle the bridge and are connected to the tab suspension bar, and are supported by the tab suspension bar, and the tab suspension bar is formed of a lead frame material. It is formed with a plate thickness.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead frame member as an assembly member of a resin-sealed semiconductor device, and more particularly to a lead frame member for a semiconductor device having a fine inner lead pitch and a method of manufacturing the same.

[0002]

2. Description of the Related Art In recent years, with the trend toward higher performance of electronic devices and lighter, thinner and smaller electronic devices, LSIs, as typified by ASICs, have been increasingly integrated and functionalized. Multi-terminal ICs, especially ASICs represented by gate arrays and standard cells, microcomputers, DS
P (Digital Signal Processo)
As a package for providing a user with high cost performance such as r), a plastic QFP (Quad Flat Package) using a lead frame has become mainstream, and has now been put to practical use up to 300 pins or more.

The QFP has been developed as a structure in which outer leads for electrically connecting to an external circuit are provided in four directions of a package and which can cope with multi-terminals.
Generally, a lead frame member 520 composed of a lead frame 530 and an inner lead fixing tape 540 shown in FIG. 5A is used. As shown in FIG.
The semiconductor element 510 is mounted on the die pad 531, and the tip of the inner lead 532, which has been subjected to a surface treatment such as silver plating, is connected to the terminal 511 of the semiconductor element 510 with a wire 512, and the whole is sealed with a sealing resin 513. Stop, and
The dam bar portion 534 is cut, and the outer lead 533 is formed in a gull wing shape. FIG. 5 (a)
5B is an enlarged view of a part of the cross section taken along line D1-D2 in FIGS. The single-layer lead frame 530 used here generally has a high electrical conductivity such as a 42 alloy (42% nickel-iron alloy) or a copper alloy.
In addition, a metal material having high mechanical strength is used as a material, and the outer shape is processed by a photo etching method or a stamping method.

FIG. 5 shows a multi-terminal resin-sealed semiconductor device (plastic-sealed package).
The production of the lead frame member shown in (a) was performed in the process shown in FIG. Hereinafter, the process shown in FIG. 6 will be briefly described. First, a lead frame material made of a thin metal plate is externally processed by etching or stamping. (FIG. 6A) The outer shape processing is performed in a state where the connecting portion 538 is provided to extend to the tip of the inner lead 532 and connect the inner leads 532 to each other. The connecting portion 538 is unnecessary when manufacturing a semiconductor device, and is removed in a step described later. In this case, it is also connected to the die pad 531. Next, a noble metal plating 550 such as silver plating is applied to the tip of the inner lead 532. (FIG. 6B) If necessary, the die pad 531 is also plated with a noble metal. Noble metal plating 5 at the tip of inner lead 532
50 is for wire bonding, and the noble metal plating of the die pad 531 is for die bonding. Next, after attaching the inner lead fixing tape 540 so as to straddle the inner lead 532,
It is attached to the inner lead 532 by thermocompression bonding. (FIG. 6 (c)) As the fixing tape 540 for the inner leads 532, a polyimide tape with an adhesive is generally used. It is attached to the inner lead 532 by crimping. Next, a connecting portion 538 extending to the inner lead 532 and connecting the inner leads 532 to each other.
Is removed with a press. (FIG. 6D) Thereafter, if necessary, the die pad 531 is down-set. (FIG. 6E) In the case of a lead frame member used for a resin-encapsulated semiconductor device that does not require multiple terminals, the connecting portion 538 is used.
In some cases, the inner lead fixing tape 540 is stuck without providing the tape. In this case, the step shown in FIG. 6D is not required in the step shown in FIG.

[0005] However, there is a strong demand for more terminals in a semiconductor device, and there is an increasing demand for miniaturization of the outer shape of a lead frame. Then, FIG.
In the miniaturization processing by thinning the lead frame material in the lead frame member 520 shown in (1), there are limitations due to the lead strength and the strength required at the time of mounting, and have exceeded the limit. For this reason, a lead frame has been developed in which only the tip of the inner lead is made thinner than the lead frame material, and further miniaturization is possible, and the strength of the lead and the entire lead frame is secured.

FIG. 4 shows an example in which a part of a lead frame material is formed to be thinner in order to easily explain a method of processing the outer shape of a lead frame in which only the tip of the inner lead is made thinner than the lead frame material. I will. FIG.
FIG. 4 is a cross-sectional view of each step of the inner lead tip portion formed in a thin shape at the inner lead tip portion. In addition, about the place to process the outer shape with the thickness of the lead frame material,
A resist pattern having substantially the same shape and size is formed on both sides of the lead frame material and etching is performed. In FIG.
410 is a lead frame material, 410A is a thin portion, 42
0A and 420B are resist patterns, 430 is a first opening, 440 is a second opening, 450 is a first recess,
60 is a second concave portion, 470 is a flat surface, and 480 is an etching resistance layer (filler layer). First, after cleaning and degreasing both sides of a lead frame material made of a copper alloy and having a thickness of 0.15 mm and having a strip shape, a mixed solution of a casein aqueous solution using potassium dichromate as a photosensitive agent is used. Resist on both sides and after drying the resist,
Using a predetermined pattern plate, predetermined regions of the resist on both sides of the lead frame material are respectively exposed and developed, and a first opening 430 and a second opening 44 having a predetermined shape are formed.
The resist patterns 420A and 420B having 0 were formed. (FIG. 4 (a)) The first opening 430 is for etching the lead frame material 410 from the opening to a thinner thickness than the lead frame material 410 in a later etching process. The second opening 440 is for forming the shape of the tip of the inner lead. Next, using a ferric chloride solution having a liquid temperature of 50 ° C. and a specific gravity of 46 Baume, a spray pressure of 3.0 kg / cm ² was used to etch both surfaces of the lead frame material 410 on which the resist pattern was formed, thereby forming a solid state. The etching was stopped when the depth h of the first recess 450 corroded (flat) reached about ／ of the lead frame member. (FIG. 4B) Lead frame material 41 in the first etching
The reason for simultaneous etching from both sides is to shorten the second etching time, which will be described later, by etching from both sides. Compared to the case of single-side etching only from the resist pattern 420B side, the first etching The total time of the second etching is reduced.

Next, an etching-resistant hot-melt type wax (acid wax manufactured by The Inktec Co., Ltd., model no. MR) is used as an etching resistance layer 480 in the corroded first concave portion 450 on the first opening 430 side. −WB6),
It was applied using a die coater and embedded in the first concave portion 450 which was corroded in a solid shape (flat shape). The resist pattern 420B was also applied to the etching resistance layer 480. (FIG. 4C) The etching resistance layer 480 is formed by using a resist pattern 420B.
Although it is not necessary to apply to the entire upper surface, it is difficult to apply only to a part including the first concave portion 450. Therefore, as shown in FIG. An etching resistance layer 480 was applied to the entire surface of the part 430 side. Although the etching resistance layer 480 used in this embodiment is an alkali-soluble wax, it is preferably a layer which is basically resistant to an etchant and has some flexibility at the time of etching, and is not particularly limited to the above wax. , UV curing type may be used. Thus, the etching resistance layer 480
Is embedded in the corroded first concave portion 450 on the surface side on which the pattern for forming the shape of the tip of the inner lead is formed, so that the first concave portion 450 does not become corroded during etching in a later step. As well as mechanical strength reinforcement for high-definition etching, and high spray pressure (3.0 kg / c
m ² ), which facilitates the progress of etching in the depth direction. Thereafter, a second etching is performed to remove the first concave portion 450 which has been corroded in a solid shape (flat shape).
The lead frame material 410 was etched and penetrated from the side of the concave portion 460 opposite to the formation surface to form a thin portion at the tip of the inner lead. (FIG. 4 (d)) The etching-formed surface parallel to the lead frame surface produced by the first etching process is flat, but the two surfaces sandwiching this surface are concave toward the inner lead. . Next, cleaning, removal of the etching resistance layer 480, and removal of the resist film (resist patterns 420A and 420B) were performed to obtain a lead frame in which the thin portion at the tip of the inner lead was finely processed. (FIG. 4E) The etching resistance layer 480 and the resist films (resist patterns 420A and 420B) were removed by dissolving them with an aqueous sodium hydroxide solution.

As described above, the etching method in which etching is performed in two stages is generally referred to as a two-step etching method, and is a processing method excellent in accuracy in particular. In the manufacture of the lead frame shown in FIG. 4, a two-step etching method and a method of externally processing the lead frame material while partially reducing the lead frame material by devising a pattern shape are employed. . still,
The method of forming the thinner end of the inner lead of the lead frame is not limited to the above etching method.

The fine processing of the thin portion at the tip of the inner lead by the above method depends on the shape of the second concave portion 860 and the thickness t of the tip of the inner lead finally obtained. When the thickness t is reduced to 50 μm, fine processing can be performed up to the inner lead tip pitch p of 0.15 mm with the flat width W1 shown in FIG. When the plate thickness t is reduced to about 30 μm and the flat width W1 is set to about 70 μm, fine processing can be performed until the tip p of the inner lead is about 0.12 mm. However, depending on how the thickness t and the flat width W1 are set, the inner lead may be formed. The tip pitch p can be manufactured to a smaller pitch.

[0010]

However, in such a lead frame in which only the tip of the inner lead is formed thin, when the above-described tape for fixing the inner lead is used, the thickness of the thin portion and the thickness of the lead frame material are reduced. Since there is a step between the first and second portions, it is difficult to apply the fixing tape uniformly at the step, and in some cases, there is a problem that the fixing tape cannot be attached. If the fixing tape cannot be uniformly attached, the clamp during wire bonding cannot be stably performed. Also, separately
The polyimide film used as the base of the fixing tape is expensive, and since it is necessary to use a mold for its outer shape processing, there is a problem that for small-volume products, the cost is high and the delivery time is long. Response was required.

There is also known a method of forming an inner lead fixing resin layer by screen printing directly on a lead frame without using a fixing tape. According to this screen printing method, when the coating amount is small, the resin is selectively applied only to the upper surface of the lead, and a bridge structure between the leads cannot be formed. When the coating amount is large, the resin extends to the lead and the stage. It is necessary to clean the resin because it is applied, and even if the application amount can be set appropriately, the viscosity is set to a relatively low viscosity for printing, and the resin located at the bridge between the leads during the curing reaction It falls between, and the surface of the resin on the lead becomes a curved surface,
There is a problem that the clamp at the time of bonding may be insufficient. In addition, a method of directly forming a resin layer for fixing the inner lead by a dispensing method without using a fixing tape is also known.
Basically, it has the same problems as screen printing. When a resin layer for fixing the inner lead is formed by the screen printing method or the dispensing method, the resin is completely cured in order to make the surface of the resin on the lead a planar shape and to sufficiently clamp the wire bonding. Before, that is, crush the resin by thermocompression bonding in a semi-cured state,
Although the height of the surface is made uniform, the resin bleeds to the upper surface of the lead when being crushed, thereby deteriorating the accuracy of the resin layer shape. Furthermore, in the dispensing method, since the amount of application is large at the dispense start point and the dispense point, applicable leads have certain restrictions such that the tab suspension bar is used as a start point and an end point, and the width of the tab suspension bar is increased. Is necessary,
There are restrictions on applicable lead shapes. As described above, even when the resin layer for fixing the inner leads is directly formed by the screen printing method or the dispensing method without using the fixing tape, there are various problems, and a measure has been required. Under such circumstances, the present invention is based on the problem of using a fixing tape and the case where the inner lead fixing resin layer is directly formed by a screen printing method and a dispensing method without using the fixing tape. It is an object of the present invention to provide a lead frame member having a lead frame and an inner lead fixing portion, which can solve the above problem. At the same time, it is intended to provide a method for manufacturing the lead frame member.

[0012]

A lead frame member of the present invention is a lead frame member having a lead frame and an inner lead fixing portion used for a resin-encapsulated semiconductor device, wherein the lead frame comprises a die pad. With the inner lead surface on one side of the lead frame as the lead frame material surface, a thin portion thinner than the material thickness is formed at the tip of the inner lead, the inner lead fixing portion is At the front end portion of the thin-walled portion, which is recessed from the lead frame material surface, made of an insulating resin, the inner leads are fixed so as to bridge over the inner leads, are connected to the tab hanging bar, and are supported by the tab hanging bar. And the tab suspension bar is formed with the thickness of the lead frame material. The inner lead fixing portion is made of a single-layer insulating resin.

Further, the method for manufacturing a lead frame member according to the present invention comprises the steps of:
In addition, a step of processing the outer shape of the lead frame in a state where a connecting portion for connecting the inner leads is provided, and (B) forming an insulating resin portion for forming an inner lead fixing portion into a predetermined shape in a semi-cured state. (C) an insulating resin portion fixing step of fixing an insulating resin portion formed in a predetermined shape in a semi-cured state to a predetermined position of a lead frame by thermocompression bonding, and (D) resin Curing the insulating resin part fixed in the part fixing step by heating means and / or ultraviolet irradiation means; and (E) after the curing step,
Removing the connecting portion of the lead frame.

Here, the thickness of the lead frame material is the original thickness when a lead frame is formed by etching or the like, and refers to the thickness at a location where etching does not enter. In the etching shown in FIG. , FIG.
This refers to the thickness of t ₀ shown in (e). In addition, the tip of the inner lead means the tip of the inner lead on the die pad side.

[0015]

According to the lead frame member of the present invention having such a structure, the problem in the case of using the fixing tape or the direct fixing of the inner lead by the screen printing method or the dispensing method without using the fixing tape is adopted. To provide a lead frame member consisting of a lead frame and an inner lead fixing portion, which can solve the problem of forming a resin layer for use, and make the thickness of the tab suspension bar the same as the thickness of the lead frame material. Because it is provided, the occurrence of deformation defects in the lead frame manufacturing process is reduced,
The lead deformation defect in the semiconductor assembly process is reduced. As a result, it is possible to further increase the number of terminals of the resin-encapsulated semiconductor device using the lead frame member. Specifically, the lead frame is provided with a die pad, the inner lead surface on one side of the lead frame is used as the lead frame material surface, and the inner lead tip has a thin portion thinner than the material thickness. The inner lead fixing portion is formed of an insulating resin, and is fixed so as to bridge over the inner leads at the end portion of the thin portion, which is recessed from the lead frame material surface, so as to straddle the tab suspension bar. The tab suspension bar is supported by the tab suspension bar, and the tab suspension bar is formed with the thickness of the lead frame material. And the occurrence of deformation defects in the lead frame manufacturing process and the occurrence of lead deformation defects in the semiconductor assembly process are small. It is set to. Also, by forming the inner lead fixing part from a single layer of insulating resin,
It has good processability. Incidentally, in the lead frame member of the present invention, by adjusting the thickness of the inner lead fixing portion so that the exposed surface of the inner lead fixing portion is the same as or recessed from the lead frame material surface, when stacking, In addition, stacking can be performed stably with the thickness of the lead frame, and no jamming occurs at the inner lead fixing portion during transfer during wire bonding.

In the method of manufacturing a lead frame member of the present invention, by adopting such a configuration, it is possible to further increase the number of terminals of the resin-encapsulated semiconductor device using the lead frame member. In the present manufacturing method, the inner lead fixing portion is formed at the foremost portion of the inner lead,
By cutting the tip of only the connection part of the lead frame that has been processed by providing the connection part, that is, only the metal part,
Since the connecting portion is not cut together with the resin forming the inner lead fixing portion, it is possible to eliminate the occurrence of resin burrs due to the cutting at the end. Further, the life of the tip cutting die can be made longer than the case of cutting the connecting part together with the resin forming the inner lead fixing part.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a lead frame member according to the present invention will be described with reference to the drawings. FIG. 1A is a plan view of the lead frame member of the embodiment, and FIG. 1B is a cross-sectional view of an inner lead portion, showing a part of a cross section taken along line A1-A2 of FIG. FIG. 1C shows a cross section taken along line A3-A4 in FIG. FIG. 2A is an enlarged plan view of a corner portion including a tab suspension bar of the lead frame member shown in FIG. 1, and FIG.
FIG. 2A is a diagram showing a part of a cross section taken along line B1-B2 in FIG. 2A, and FIG. 2C is a perspective view showing an enlarged part of a fixed state of an inner lead near a tab suspension bar. . FIG.
Inside, 100 is a lead frame member, 110 is a lead frame, 111 is a die pad, 112 is an inner lead,
112A is a thin portion, 112B is a thick portion, 112C is a cut surface, 112E is an etched surface, 112S is a lead frame material surface, 113 is an outer lead, 114 is a dam bar, 115 is a tab hanging bar, 116 is a frame portion, 12
0 is an inner lead fixing portion, 120C is a cut surface, 150
Is silver plating. Lead frame member 10 of the present embodiment
Reference numeral 0 denotes a lead frame member used for a resin-encapsulated semiconductor device and including a lead frame 110 and an inner lead fixing portion 120 formed of a thermosetting insulating resin. In particular, by providing the inner lead fixing portion 120 at the tip of the inner lead, it is possible to cope with a multi-terminal semiconductor device. The lead frame 110 is
A die pad 111 is provided, one surface of the entire surface is a lead frame material surface, the tip of the inner lead 112 is formed thinner than the thickness of the material, and the inner lead fixing portion 120 is made of an insulating resin. The inner lead 1 is formed on the thin-frame portion forming surface side of the lead frame 110.
12 is fixed to the die pad 111 side of the thin region in such a manner as to bridge over the inner leads 112, continues to the tab hanging bar 115, is supported by the tab hanging bar 115, and is supported by the tab hanging bar 115. Reference numeral 115 is formed to a thickness of the lead frame material. Lead frame 11
0 is a copper material having a thickness of 0.15 mm, the outer lead pitch is 0.4 mm, and the lead frame member 100 is a QFP having a package size of 28 mm square.
(Quad Flat Package). The lead frame 110 has been subjected to an outer shape processing by etching shown in FIG. 4, and a tip portion of the inner lead 111 is provided with a thin portion 112A formed thinner than the plate thickness of the lead frame material. Is an etching surface 112E, and the other surface is a lead frame material surface 112S. Only the tip portion of the inner lead 111 is as thin as 50 μm, and the other portions are 0.15 mm in thickness of the lead frame material. Inner lead fixing part 1
Numeral 20 is formed at the tip of the inner lead, and extends across the inner lead 112 on the etching surface 112E side of the thin portion 112A, extends to the tab suspension lead 115, and extends. As shown in FIG. 1C, the inner leads 112 are fixed to each other in a state where a part of the inner lead 112 is embedded in the inner lead fixing portion 120. The embedded amount of the inner lead 112 into the inner lead fixing portion 120 may be such that the inner leads can be fixed to each other. However, the smaller the variation in the embedded amount of the inner lead, the better. Is preferably 10% or less.
The thickness of the inner lead fixing portion 120 is 25 μm in this embodiment, but is preferably 30 μm or less, and the thickness variation is preferably within 5% of the average value. In the present embodiment, the silver plating 150 is
Although not provided below 20, the inner lead fixing portion 120 may be provided on the silver plating portion 150.

As shown in FIG. 2A, the inner lead fixing portion 120 extends to the tab hanging bar 115, thereby firmly fixing the inner lead. That is, the inner lead fixing portion is supported by the tab hanging bar 115.

The tip surface of the inner lead of this embodiment is formed by a manufacturing method shown in FIG.
At 12C, the die pad side of the inner lead fixing portion 120 also becomes the cut surface 120C, and both cut surfaces form the same surface. In the present embodiment, the die pad side surface of the inner lead fixing portion is also cut when forming the inner lead tip surface, but it is preferable not to cut the die in terms of the life of the cutting (press) die.

In the above embodiment, a copper alloy was used as the lead frame material, but the invention is not limited to this. For example, a 42 alloy (42% nickel-iron alloy) may be used.
Although an epoxy-based thermosetting resin was used as the inner lead fixing portion, another material having heat resistance, such as a thermosetting polyimide resin, may be used.

Next, an embodiment of a method for manufacturing a lead frame member of the present invention will be described with reference to FIG. The manufacturing method of the present embodiment is a manufacturing method of the lead frame member shown in FIG. First, a lead frame 110 having a thin portion 112A in which the tip of the inner lead 112 was formed thinner than the thickness of the lead frame material was prepared by the etching method shown in FIG. (FIG. 3 (a)) Lead frame 1 whose outer shape has been processed by etching
The tip of the inner lead 112 is connected to the extended connecting portion 1.
18 integrally connects with the die pad 111.
Since the connecting portion 118 is unnecessary when fabricating the semiconductor device, it is removed by a press in a step described later. Next, silver plating 150 was applied to the wire bonding area of the inner lead 112 by an ordinary partial plating method. (FIG. 3
(B) If necessary, the die pad 111 is also plated with a noble metal such as silver plating for die bonding.

On the other hand, a thermosetting insulating resin 160 mainly composed of an epoxy resin for forming the inner lead fixing portion 120 is formed into a shape corresponding to the inner lead fixing portion 120 of the lead frame 110 by a 100 μm thick PET. After coating and forming to a thickness of 40 μm on a resin film substrate 170 made of (polyethylene terephthalate) by screen printing, a thermosetting insulating resin mainly composed of an epoxy resin applied and formed on the resin film substrate 170 is A volatilization treatment for volatilizing the solvent was performed.
(FIG. 3 (c)) Incidentally, FIGS. 3 (c) and (b) are C1-C2 in FIGS. 3 (c) and (a).
FIG. The viscosity of the epoxy resin was adjusted to 200,000 cps by adding a filler to the resin, but the viscosity was from 30,000 cps to 300,000 cps.
Is preferable. It is preferable to use a solvent having a boiling point of 120 ° C. or higher in order to prevent a change in the viscosity of the resin on the screen.
N-methyl-2-pyrrolidone was used. As the filler, a low ionic impurity or a low radioactive substance containing material for a semiconductor package is used. In this embodiment, R-2 manufactured by Nippon Aerosil Co., Ltd. is used.
00 (average particle size: 0.5 μm) was used. If necessary, 3 to 30% by weight is added. The resin film substrate 170 has solvent resistance to a solvent of an epoxy resin which is a thermosetting resin to be screen-printed, and has heat resistance,
Also, an epoxy resin having releasability is suitable. PET
Besides, PPS (polyphenylene sulfide), polypropylene, PI (polyimide), aramid fiber, PE
(Polyethylene) and the like can be used. Resin film substrate 1
The thickness of 70 is desirably 12.5 μm to 120 μm, and 30 μm to 100 μm from the viewpoint of material cost and mechanical strength.
m is preferred. Epoxy resin film substrate 170
As a screen plate used for printing on the surface, a solvent-resistant emulsion (MSP-2 manufactured by Murakami Screen Co., Ltd.) 40 μm # 150 mesh screen was used. The volatilization treatment was performed by heating to 80 ° C. for 30 minutes. The volatilization condition may be 80 ° C. for 20 minutes, and the time is shorter as the temperature is increased. 1
In the case of 00 ° C., one minute is sufficient. However, when the temperature is high, the working efficiency is improved, but air bubbles are easily generated. Therefore, the temperature is preferably 60 ° C to 120 ° C. 8
It takes 10 minutes at 0 ° C and 2 minutes at 100 ° C.

Next, the resin film substrate 1 subjected to the volatilization treatment obtained in the step shown in FIG. 3C is applied to the lead frame after the silver plating obtained in the step shown in FIG.
The thin portion 120 of the inner lead 112 of the lead frame 110 is aligned with the thermosetting insulating resin 160 mainly composed of an epoxy resin applied and formed on the
Jigs 180 and 181 at positions straddling A and thick portion 120B.
And heat-pressed from both sides of the lead frame. (FIG. 3D) The jig 181 sandwiching the thermosetting insulating resin 160 with the lead frame 110 is formed in the shape of the lead frame 110 so that the thermosetting insulating resin 160 that has been crimped becomes flat. A matching projection 181A is provided.
In this embodiment, the thermocompression bonding was performed at 160 ° C. for 0.3 seconds, but the thermocompression bonding was performed at 40 to 260 ° C., and the compression time corresponds to the temperature, but is preferably about 0.1 to 60 seconds.

Next, the resin film substrate 170 is peeled off from the lead frame 110 while the thermosetting insulating resin 160 is still attached to the lead frame 110,
C, a curing treatment of heating and curing the thermosetting insulating resin 160 for 3 minutes was performed. (FIG. 3 (e))

Thereafter, the connecting portion 118, which is unnecessary when the semiconductor device is manufactured, is removed by a press, and the lead frame member 100 of Example 1 shown in FIG. 1 is manufactured. (FIG. 3
(F) Further, if necessary, a down-set processing of the die pad 111 is performed.

In the method of manufacturing the lead frame member of this embodiment shown in FIG. 3, an octopus printing, a dispensing method or the like may be used instead of the application of the thermosetting insulating resin by screen printing. In the method for manufacturing a lead frame member of the present embodiment shown in FIG. 3, after the resin film substrate 170 is peeled off from the lead frame 110,
Although the hardening process for hardening the thermosetting insulating resin 160 is performed, the resin film substrate 170 may be separated from the lead frame 110 after the hardening process for hardening the thermosetting insulating resin 160 is performed.

The method for manufacturing the lead frame member of the present invention is not limited to the method for manufacturing the lead frame member of the above embodiment. For example, after forming a solvent-free thermosetting resin containing no varnish-like solvent in a predetermined shape on a film having releasability from the thermosetting resin, the mixture is left at room temperature and heated or depressurized to be thermoset. A viscosity increasing process for increasing the viscosity of the thermosetting resin is performed, and a thermosetting resin is attached to a predetermined portion of the inner lead of the lead frame by thermocompression bonding using a jig in the same manner as in the step of FIG. A heat treatment for peeling and removing the film from the lead frame and curing the thermosetting resin may be performed. Also in this method, the resin film substrate may be peeled off from the lead frame after performing a curing treatment for curing the thermosetting insulating resin.

[0028]

According to the present invention, as described above, it is necessary to provide an inner lead fixing portion in order to cope with the increase in the number of terminals in a semiconductor device. A lead consisting of a lead frame and an inner lead fixing part that can solve the problem of directly forming the inner lead fixing resin layer by a screen printing method or a dispensing method without using a fixing tape requiring cutting processing. It is possible to provide a frame member. Further, it is possible to provide a method for manufacturing such a lead frame member. In particular, the lead frame member of the present invention makes the tip of the inner lead thin, and by providing the inner lead fixing portion at the tip of the inner lead, enables fine processing at the tip of the inner lead,
In addition, the clamp in wire bonding can be stably performed. As a result, the present invention makes it possible to provide a resin-encapsulated semiconductor device that can cope with the increase in the number of terminals in a resin-encapsulated semiconductor device accompanying the high integration of semiconductor elements.

[Brief description of the drawings]

FIG. 1 is a plan view and a main part cross-sectional view of a lead frame member of an embodiment.

FIG. 2 is a partially enlarged plan view of the lead frame member of the embodiment.

FIG. 3 is a manufacturing process diagram of the lead frame member of the embodiment.

FIG. 4 is a manufacturing process diagram of a lead frame used for the lead frame member of the embodiment.

FIG. 5 is a view for explaining a conventional lead frame member and a resin-sealed semiconductor device using the same.

FIG. 6 is a manufacturing process diagram of a conventional lead frame member.

[Explanation of symbols]

 REFERENCE SIGNS LIST 100 Lead frame member 110 Lead frame 111 Die pad (tab) 112 Inner lead 112A Thin portion 112B Thick portion 112C Cutting surface 112E Etching surface 112S Lead frame material surface 113 Outer lead 114 Dam bar 115 Tab suspension lead 116 Frame portion 118 Connecting portion 120 Inner Lead fixing portion 120C Cut surface 150 Silver plating 160 Thermosetting insulating resin 170 Resin film substrate 180, 181 Jig 181A Projection 410 Lead frame material 410A 410A is thin portion 420A, 420B Resist pattern 430 First opening 440 Second Opening 450 first recess 460 second recess 470 flat surface 480 etching resistance layer (filler layer) 500 semiconductor device 510 semiconductor element 51 DESCRIPTION OF SYMBOLS 1 Pad of semiconductor element 512 Wire 513 Resin part 520 Lead frame member 530 Lead frame 531 Die pad part 532 Inner lead part 533 Outer lead part 534 Dam bar 535 Dam suspension bar 536 Frame (frame) part 538 Connection part 540 Fixing tape 550 Silver plating

Claims (3)

[Claims] 1. A lead frame member having a lead frame and an inner lead fixing portion used in a resin-sealed semiconductor device, wherein the lead frame is provided with a die pad, and is provided on one side of the lead frame. The inner lead surface is a lead frame material surface, and a thin portion thinner than the thickness of the material is formed at the tip of the inner lead, and the inner lead fixing portion is made of an insulating resin, and the lead frame of the thin portion is formed. At the leading end on the surface side recessed from the material surface, the inner leads are fixed so as to cross over the inner leads, are connected to the tab hanging bar, are supported by the tab hanging bar, and the tab hanging bar is a lead frame material. A lead frame member characterized by being formed with a thickness of: 2. The lead frame member according to claim 1, wherein the inner lead fixing portion is made of a single-layer insulating resin. 3. The method for manufacturing a lead frame member according to claim 1, wherein (A) the lead frame is provided with a connecting portion integrally connected to the tip of the inner lead and connecting the inner leads. The step of external processing,
(B) a step of forming an insulating resin part for forming an inner lead fixing part into a predetermined shape in a semi-cured state;
(C) an insulating resin part fixing step of fixing an insulating resin part formed in a predetermined shape in a semi-cured state to a predetermined position of a lead frame by thermocompression bonding; and (D) a resin part fixing step. Curing the insulating resin portion fixed by heating with heating means and / or ultraviolet irradiation means; and (E)
Removing the connection portion of the lead frame after the curing step.