JPH10180932A - Manufacture of metal-clad laminate - Google Patents
Manufacture of metal-clad laminateInfo
- Publication number
- JPH10180932A JPH10180932A JP8343459A JP34345996A JPH10180932A JP H10180932 A JPH10180932 A JP H10180932A JP 8343459 A JP8343459 A JP 8343459A JP 34345996 A JP34345996 A JP 34345996A JP H10180932 A JPH10180932 A JP H10180932A
- Authority
- JP
- Japan
- Prior art keywords
- woven fabric
- resin
- glass
- glass woven
- bisphenol
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 9
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims abstract description 43
- 239000011521 glass Substances 0.000 claims abstract description 42
- 239000003822 epoxy resin Substances 0.000 claims abstract description 33
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 33
- 229920005989 resin Polymers 0.000 claims abstract description 31
- 239000011347 resin Substances 0.000 claims abstract description 31
- 239000002759 woven fabric Substances 0.000 claims abstract description 31
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 claims abstract description 28
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 claims abstract description 28
- 229910052794 bromium Inorganic materials 0.000 claims abstract description 28
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims abstract description 24
- 239000002131 composite material Substances 0.000 claims abstract description 13
- 238000000034 method Methods 0.000 claims abstract description 12
- 239000004745 nonwoven fabric Substances 0.000 claims abstract description 8
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 claims abstract description 7
- 239000011888 foil Substances 0.000 claims abstract description 4
- 229920001187 thermosetting polymer Polymers 0.000 claims description 8
- 239000000835 fiber Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims 1
- 238000010030 laminating Methods 0.000 claims 1
- 238000003825 pressing Methods 0.000 claims 1
- 239000004593 Epoxy Substances 0.000 abstract description 14
- 238000001723 curing Methods 0.000 abstract description 13
- 239000000470 constituent Substances 0.000 abstract 2
- 238000006068 polycondensation reaction Methods 0.000 abstract 2
- 206010061592 cardiac fibrillation Diseases 0.000 abstract 1
- 230000002600 fibrillogenic effect Effects 0.000 abstract 1
- 238000007731 hot pressing Methods 0.000 abstract 1
- 238000001029 thermal curing Methods 0.000 abstract 1
- 230000000052 comparative effect Effects 0.000 description 13
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Chemical compound FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 description 10
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 9
- 150000001875 compounds Chemical class 0.000 description 9
- 229920003986 novolac Polymers 0.000 description 8
- 239000002966 varnish Substances 0.000 description 7
- 239000003795 chemical substances by application Substances 0.000 description 6
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 5
- 229910015900 BF3 Inorganic materials 0.000 description 5
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 5
- 239000012535 impurity Substances 0.000 description 5
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 4
- 238000003763 carbonization Methods 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 239000002344 surface layer Substances 0.000 description 4
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 230000005856 abnormality Effects 0.000 description 3
- 150000001412 amines Chemical class 0.000 description 3
- 239000007795 chemical reaction product Substances 0.000 description 3
- 238000010891 electric arc Methods 0.000 description 3
- 239000003063 flame retardant Substances 0.000 description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- BVYPJEBKDLFIDL-UHFFFAOYSA-N 3-(2-phenylimidazol-1-yl)propanenitrile Chemical compound N#CCCN1C=CN=C1C1=CC=CC=C1 BVYPJEBKDLFIDL-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 2
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 2
- NQRYJNQNLNOLGT-UHFFFAOYSA-N Piperidine Chemical compound C1CCNCC1 NQRYJNQNLNOLGT-UHFFFAOYSA-N 0.000 description 2
- -1 bromine compound Chemical class 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- FBHPRUXJQNWTEW-UHFFFAOYSA-N 1-benzyl-2-methylimidazole Chemical compound CC1=NC=CN1CC1=CC=CC=C1 FBHPRUXJQNWTEW-UHFFFAOYSA-N 0.000 description 1
- DURPTKYDGMDSBL-UHFFFAOYSA-N 1-butoxybutane Chemical compound CCCCOCCCC DURPTKYDGMDSBL-UHFFFAOYSA-N 0.000 description 1
- CIPOCPJRYUFXLL-UHFFFAOYSA-N 2,3,4-tris[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC=C(O)C(CN(C)C)=C1CN(C)C CIPOCPJRYUFXLL-UHFFFAOYSA-N 0.000 description 1
- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 description 1
- MLPBASQNOQYIGL-UHFFFAOYSA-N 2-(2-propan-2-yl-1h-imidazol-5-yl)propanenitrile Chemical compound CC(C)C1=NC=C(C(C)C#N)N1 MLPBASQNOQYIGL-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- FUIQBJHUESBZNU-UHFFFAOYSA-N 2-[(dimethylazaniumyl)methyl]phenolate Chemical compound CN(C)CC1=CC=CC=C1O FUIQBJHUESBZNU-UHFFFAOYSA-N 0.000 description 1
- PQAMFDRRWURCFQ-UHFFFAOYSA-N 2-ethyl-1h-imidazole Chemical compound CCC1=NC=CN1 PQAMFDRRWURCFQ-UHFFFAOYSA-N 0.000 description 1
- YTWBFUCJVWKCCK-UHFFFAOYSA-N 2-heptadecyl-1h-imidazole Chemical compound CCCCCCCCCCCCCCCCCC1=NC=CN1 YTWBFUCJVWKCCK-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- FUOZJYASZOSONT-UHFFFAOYSA-N 2-propan-2-yl-1h-imidazole Chemical compound CC(C)C1=NC=CN1 FUOZJYASZOSONT-UHFFFAOYSA-N 0.000 description 1
- LLEASVZEQBICSN-UHFFFAOYSA-N 2-undecyl-1h-imidazole Chemical compound CCCCCCCCCCCC1=NC=CN1 LLEASVZEQBICSN-UHFFFAOYSA-N 0.000 description 1
- SESYNEDUKZDRJL-UHFFFAOYSA-N 3-(2-methylimidazol-1-yl)propanenitrile Chemical compound CC1=NC=CN1CCC#N SESYNEDUKZDRJL-UHFFFAOYSA-N 0.000 description 1
- SZUPZARBRLCVCB-UHFFFAOYSA-N 3-(2-undecylimidazol-1-yl)propanenitrile Chemical compound CCCCCCCCCCCC1=NC=CN1CCC#N SZUPZARBRLCVCB-UHFFFAOYSA-N 0.000 description 1
- XGQUSGCBVBFRGX-UHFFFAOYSA-N 3-[4,5-bis(2-cyanoethoxymethyl)-2-phenylimidazol-1-yl]propanenitrile Chemical compound N#CCCN1C(COCCC#N)=C(COCCC#N)N=C1C1=CC=CC=C1 XGQUSGCBVBFRGX-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- TYOXIFXYEIILLY-UHFFFAOYSA-N 5-methyl-2-phenyl-1h-imidazole Chemical compound N1C(C)=CN=C1C1=CC=CC=C1 TYOXIFXYEIILLY-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 1
- UGJVZXBXVRMUSG-UHFFFAOYSA-K [B+3].[F-].[F-].[F-] Chemical compound [B+3].[F-].[F-].[F-] UGJVZXBXVRMUSG-UHFFFAOYSA-K 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- 239000004842 bisphenol F epoxy resin Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- USFPINLPPFWTJW-UHFFFAOYSA-N tetraphenylphosphonium Chemical compound C1=CC=CC=C1[P+](C=1C=CC=CC=1)(C=1C=CC=CC=1)C1=CC=CC=C1 USFPINLPPFWTJW-UHFFFAOYSA-N 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
Landscapes
- Laminated Bodies (AREA)
- Moulding By Coating Moulds (AREA)
- Reinforced Plastic Materials (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は電気・電子機器等に
用いられるプリント配線板用金属張り積層板の製造方法
に関し、特に耐トラッキング性に優れた金属張り積層板
の製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a metal-clad laminate for a printed wiring board used for electric and electronic equipment, and more particularly to a method for manufacturing a metal-clad laminate having excellent tracking resistance.
【0002】[0002]
【従来の技術】民生用電子機器、産業用電子機器の小型
化、高性能化に伴い計測機器やコンピュータ、テレビ、
エアコン等の高電圧が印加される電源用基板にはガラス
エポキシ積層板が多く使われている。最近では表面層以
外のところにガラス不織布を用いたコンポジット積層板
が低コストで加工性に優れていることから使用され始め
ている。 これらの積層板を用いた民生用や産業用の電
子機器は、PL法の施行により耐トラッキング性や難燃
性などの安全性に対する要求が非常に多くなっている。
しかしながら、従来のガラスエポキシ積層板やコンポジ
ット積層板では機械、電気、熱的特性に優れているもの
の、耐トラッキング指数は200V程度であり安全上の
問題となっている。この耐トラッキング性を改善するた
め、臭素含有量の低減や充填剤の添加による方法が主流
となっている。2. Description of the Related Art As consumer electronic devices and industrial electronic devices have become smaller and more sophisticated, measuring instruments, computers, televisions,
A glass epoxy laminate is often used as a power supply substrate to which a high voltage is applied such as an air conditioner. Recently, composite laminates using a glass non-woven fabric in places other than the surface layer have begun to be used because of their low cost and excellent workability. The demand for safety such as tracking resistance and flame retardancy has become extremely large for consumer and industrial electronic devices using these laminated plates due to the enforcement of the PL method.
However, although the conventional glass epoxy laminate and composite laminate have excellent mechanical, electrical and thermal properties, their tracking resistance index is about 200 V, which is a safety problem. In order to improve the tracking resistance, a method of reducing the bromine content and adding a filler has become mainstream.
【0003】[0003]
【発明が解決しようとする課題】耐トラッキング性を改
善するために行われている臭素含有量の低減は、臭素化
合物が難燃性を呈するため樹脂が炭化し導電路となるた
め、その含有量を低下させ炭化を防ぐ方法である。ま
た、充填剤の添加は、充填剤の添加により相対的に樹脂
の含有量を低下させ炭化する樹脂の割合を下げる方法で
ある。しかし、これらの方法において、臭素含有量の低
減や充填剤の添加による方法は、難燃性の低下や耐熱性
などの一般特性の低下が避けられず、耐トラッキング性
と難燃性を満足することができなかった。The reduction of the bromine content, which is carried out to improve the tracking resistance, is attributable to the fact that the bromine compound exhibits flame retardancy and the resin is carbonized to form a conductive path. This is a method of reducing carbonization and preventing carbonization. The addition of the filler is a method of relatively lowering the content of the resin by adding the filler and lowering the proportion of the resin to be carbonized. However, in these methods, the method by reducing the bromine content or adding a filler inevitably reduces the general properties such as flame retardancy and heat resistance, and satisfies tracking resistance and flame retardancy. I couldn't do that.
【0004】[0004]
【課題を解決するための手段】本発明は上記の問題点を
解決するため、ガラスエポキシ積層板やコンポジット積
層板の耐熱性などの一般特性や難燃性を低下させること
なく耐トラッキング性に優れた金属張り積層板を提供す
るものである。本発明は、(a)エポキシ樹脂、(b)
ビスフェノールAとホルムアルデヒドの重縮合物、
(c)硬化促進剤、(d)高純度水酸化アルミニウムを
必須成分とし、かつ臭素含有率が5〜15wt%となる
熱硬化性樹脂をガラス織布に含浸して得られたプリプレ
グを金属箔と積層し加熱加圧成形する金属張り積層板の
製造方法である。また、ガラス織布が開繊処理したガラ
ス織布である金属張り積層板である。SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention has excellent tracking resistance without deteriorating general properties such as heat resistance and flame retardancy of a glass epoxy laminate or a composite laminate. To provide a metal-clad laminate. The present invention relates to (a) an epoxy resin, (b)
Polycondensate of bisphenol A and formaldehyde,
A prepreg obtained by impregnating a glass woven fabric with (c) a hardening accelerator and (d) a thermosetting resin containing high-purity aluminum hydroxide as an essential component and having a bromine content of 5 to 15 wt% is a metal foil. This is a method for producing a metal-clad laminate which is laminated and heated and pressed. Further, the metal-clad laminate is a glass woven fabric in which the glass woven fabric has been subjected to an opening treatment.
【0005】[0005]
【発明の実施の形態】以下、本発明について詳細に説明
する。本発明で使用する(a)のエポキシ樹脂は、分子
内に2個以上のエポキシ基を有するものであればよく、
例えば、ビスフェノールA型エポキシ樹脂、ビスフェノ
ールF型エポキシ樹脂、ビスフェノールS型エポキシ樹
脂等のビスフェノール型エポキシ樹脂、フェノールノボ
ラック型エポキシ樹脂、クレゾールノボラック型エポキ
シ樹脂等のフェノール類ノボラック型エポキシ樹脂、脂
環式エポキシ樹脂、グリシジルアミン型エポキシ樹脂等
があり、またこれらを臭素化したものがより好ましい。
なお、臭素化したエポキシ樹脂を用いない場合には、テ
トラブロモビスフェノールAやテトラフェニルホスフィ
ン等を難燃剤として添加することも可能である。また、
これらのエポキシ樹脂の分子量は特に制限はなく、何種
類かを併用することもできる。BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described in detail. The epoxy resin (a) used in the present invention may be any one having two or more epoxy groups in the molecule.
For example, bisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol epoxy resin such as bisphenol S epoxy resin, phenol novolak epoxy resin, phenol novolak epoxy resin such as cresol novolak epoxy resin, alicyclic epoxy Resins, glycidylamine-type epoxy resins, and the like, and those obtained by brominating these are more preferable.
When a brominated epoxy resin is not used, tetrabromobisphenol A, tetraphenylphosphine, or the like can be added as a flame retardant. Also,
The molecular weight of these epoxy resins is not particularly limited, and several types can be used in combination.
【0006】本発明で用いるエポキシ樹脂の硬化剤であ
る(b)のビスフェノールAとホルムアルデヒドの重縮
合物は、分子量の制限はなく、ビスフェノールAモノマ
ーが含まれていてもよい。また、本発明の効果を損なわ
ない範囲で、フェノールノボラック樹脂等のフェノール
樹脂を併用するこども可能である。硬化剤の配合量は、
使用する硬化剤の水酸基当量に対しエポキシ当量が水酸
基当量/エポキシ当量=0.8〜1.2となるように配
合するのが好ましい。0.8未満及び1.2を越えると
耐熱性に劣るようになるためである。[0006] The polycondensate of bisphenol A and formaldehyde (b), which is a curing agent for the epoxy resin used in the present invention, is not limited in molecular weight, and may contain a bisphenol A monomer. Further, a phenol resin such as a phenol novolak resin can be used in combination as long as the effects of the present invention are not impaired. The amount of the curing agent
It is preferable to mix the epoxy equivalent to the hydroxyl equivalent of the curing agent to be used so that hydroxyl equivalent / epoxy equivalent = 0.8 to 1.2. If the ratio is less than 0.8 and exceeds 1.2, the heat resistance becomes poor.
【0007】本発明で用いる(c)の硬化促進剤とし
て、イミダゾール化合物やアミン類等があるが特に制限
はない。イミダゾールとしては、2−メチルイミダゾー
ル、2−エチル−4−メチルイミダゾール、2−ウンデ
シルイミダゾール、2−ヘプタデシルイミダゾール、2
−フェニルイミダゾール、2−フェニル−4―メチルイ
ミダゾール、1−ベンジル−2−メチルイミダゾール、
2−エチルイミダゾール、2−イソプロピルイミダゾー
ル、1−シアノエチル−2−メチルイミダゾール、1−
シアノエチル−2−フェニルイミダゾール、1−シアノ
エチル−2−ウンデシルイミダゾール、1−シアノエチ
ル−2−イソプロピルイミダゾール、1−シアノエチル
−2−フェニルイミダゾール、1−シアノエチル−2−
フェニルイミダゾリウムトリメリテート、1−シアノエ
チル−2−エチル−4−メチルイミダゾールトリメリテ
ート、1−シアノエチル−2−ウンデシルイミダゾール
トリメリテート、1−シアノエチル−2−フェニルイミ
ダゾールトリメリテート、1−シアノエチル−2−フェ
ニル−4,5−ジ(シアノエトキシメチル)イミダゾー
ル等が挙げられる。アミン類として、ジメチルアミノメ
チルフェノール、2,4,6−トリ(ジメチルアミノメ
チル)フェノール、トリ(ジメチルアミノメチル)フェ
ノールのトリ−2−エチルへキサン塩等が挙げられる。
また、この他に、3ふっ化ほう素錯化合物である、3ふ
っ化ほう素・モノエチルアミン錯化合物、3ふっ化ほう
素・トリエチルアミン錯化合物、3ふっ化ほう素・ピペリ
ジン錯化合物、3ふっ化ほう素・n−ブチルエーテル錯
化合物、3ふっ化ほう素・アミン錯化合物等が挙げられ
る。硬化促進剤は、(a)エポキシ樹脂と(b)ビスフ
ェノールAとホルムアルデヒドの重縮合物の合計100
重量部に対し0.1〜10重量部配合することが好まし
い。0.1重量部未満では、効果に乏しく、10重量部
を越えるとプリプレグの保存安定性が悪くなる。The curing accelerator (c) used in the present invention includes imidazole compounds and amines, but is not particularly limited. Examples of imidazole include 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole,
-Phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-methylimidazole,
2-ethylimidazole, 2-isopropylimidazole, 1-cyanoethyl-2-methylimidazole, 1-
Cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-isopropylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-
Phenylimidazolium trimellitate, 1-cyanoethyl-2-ethyl-4-methylimidazole trimellitate, 1-cyanoethyl-2-undecylimidazole trimellitate, 1-cyanoethyl-2-phenylimidazole trimellitate, 1- And cyanoethyl-2-phenyl-4,5-di (cyanoethoxymethyl) imidazole. Examples of the amines include dimethylaminomethylphenol, 2,4,6-tri (dimethylaminomethyl) phenol, and tri-2-ethylhexane salt of tri (dimethylaminomethyl) phenol.
In addition, a boron trifluoride complex compound, a boron trifluoride / monoethylamine complex compound, a boron trifluoride / triethylamine complex compound, a boron trifluoride / piperidine complex compound, a trifluoride Boron / n-butyl ether complex compounds, boron trifluoride / amine complex compounds, and the like. The curing accelerator is (a) an epoxy resin and (b) a polycondensate of bisphenol A and formaldehyde in total of 100.
It is preferable to mix 0.1 to 10 parts by weight with respect to parts by weight. If the amount is less than 0.1 part by weight, the effect is poor, and if it exceeds 10 parts by weight, the storage stability of the prepreg deteriorates.
【0008】本発明で用いる(d)の高純度水酸化アル
ミニウムは、水酸化アルミニウムに含まれる不純物Na
20の含有率が0.2wt%以下のものてあれば良く、
形状については特に制限はない。高純度水酸化アルミニ
ウムは、市販されているものを使用することができる。
この高純度水酸化アルミニウムは、樹脂100重量部に
対し70〜180重量部配合するのが好ましい。70重
量部未満では、耐トラッキング性が劣り、180重量部
を越えると塗工作業性の低下や成形性が悪化し、耐熱
性、ピール強度が低下する。[0008] The high-purity aluminum hydroxide (d) used in the present invention is the same as the impurity Na contained in aluminum hydroxide.
2 0 content is well if Te the following 0.2 wt%,
There is no particular limitation on the shape. Commercially available high-purity aluminum hydroxide can be used.
This high-purity aluminum hydroxide is preferably blended in an amount of 70 to 180 parts by weight based on 100 parts by weight of the resin. If the amount is less than 70 parts by weight, the tracking resistance is inferior. If the amount exceeds 180 parts by weight, the coating workability and moldability deteriorate, and the heat resistance and peel strength decrease.
【0009】本発明においては、熱硬化性樹脂の重量に
対し臭素元素の含有率である臭素含有率が、5〜15重
量%とされる。熱硬化性樹脂の重量に対する臭素元素の
含有率とは、必須成分とする(a)エポキシ樹脂、
(b)ビスフェノールAとホルムアルデヒドの重縮合
物、(c)硬化促進剤とその他に配合した樹脂重量の合
計量に対する臭素元素の含有率である。臭素含有率が5
wt%未満では難燃性の低下が著しく、また、臭素含有
率が15wt%を超えると耐トラッキング性の低下が避
けられないためである。臭素元素は、エポキシ樹脂骨格
中に臭素原子が導入されたブロム化エポキシ樹脂を使用
すると良い。テトラブロムビスフェノールAとエピクロ
ロヒドリンとの反応物、ビスフェノールA型エポキシ樹
脂とテトラブロムビスフェノールAとの反応物、ブロム
化フェノールノボラックとエピクロロヒドリンとの反応
物により得られるブロム化エポキシ樹脂を好適に使用す
ることができる。さらに、難燃剤としてテトラブロムビ
スフェノールA等の臭素含有化合物を配合することもで
きる。In the present invention, the bromine content, which is the content of bromine element, is 5 to 15% by weight based on the weight of the thermosetting resin. The content of the bromine element relative to the weight of the thermosetting resin is defined as an essential component (a) an epoxy resin,
(B) Content of bromine element with respect to the total amount of the polycondensate of bisphenol A and formaldehyde, and (c) the total weight of the curing accelerator and other resin blended. 5 bromine content
When the content is less than 15 wt%, the flame retardancy is significantly reduced, and when the bromine content exceeds 15 wt%, the reduction in tracking resistance is inevitable. As the bromine element, a brominated epoxy resin in which a bromine atom is introduced into an epoxy resin skeleton is preferably used. A reaction product of tetrabromobisphenol A with epichlorohydrin, a reaction product of bisphenol A type epoxy resin with tetrabromobisphenol A, and a brominated epoxy resin obtained by a reaction product of brominated phenol novolak and epichlorohydrin It can be suitably used. Further, a bromine-containing compound such as tetrabromobisphenol A can be blended as a flame retardant.
【0010】本発明で使用するガラス織布は、積層板分
野で使用されている通常のガラス織布を使用することが
できる。特に、ガラス織布に高圧の水を吹き付けたり、
ロールにより絞ったりすることで開繊処理したガラス織
布を用いるのが好ましい。上記の熱硬化性樹脂を溶剤に
溶かしたり分散させワニスとし、ガラス織布に含浸、乾
燥しプリプレグを作製する。これを複数枚構成し、金属
箔である、銅箔を上下または、片面に配し、加熱、加圧
してガラス布基材エポキシ樹脂銅張積層板を製造するこ
とができる。また、上記のプリプレグをガラス不織布プ
リプレグの複数枚の上下に構成したコンポジット積層板
をも製造することができる。The glass woven fabric used in the present invention may be a usual glass woven fabric used in the field of laminates. In particular, spraying high-pressure water on glass woven fabric,
It is preferable to use a glass woven fabric that has been opened by being squeezed with a roll. The thermosetting resin is dissolved or dispersed in a solvent to form a varnish, impregnated in a glass woven fabric, and dried to prepare a prepreg. By forming a plurality of these, a copper foil, which is a metal foil, is arranged on the upper and lower sides or on one side, and heated and pressed to produce a glass cloth base epoxy resin copper-clad laminate. Further, it is also possible to manufacture a composite laminate in which the above prepregs are formed on and under a plurality of glass nonwoven fabric prepregs.
【0011】本発明は、(a)エポキシ樹脂、(b)ビ
スフェノールAとホルムアルデヒドの重縮合物、(c)
硬化促進剤、(d)高純度水酸化アルミニウムを必須成
分とし、かつ臭素含有率が5〜15wt%となる熱硬化
性樹脂をガラス織布に含浸して得られたプリプレグを使
用する、すなわち、エポキシ樹脂の硬化剤に特定のビス
フェノールAとホルムアルデヒドの重縮合物を用い、さ
らに不純物として含まれるNa2Oの少ない高純度水酸
化アルミニウムそして、熱硬化性樹脂の臭素含有率を特
定の値にすることにより、耐熱性と耐トラッキング性の
両立をはかることができたものである。さらに、ガラス
織布に開繊処理したガラス織布を用いることにより耐ト
ラッキング性が著しく向上する。本発明のプリプレグ
は、積層板の外部(表面層)に用いれば耐トラッキング
性を改良できるので、積層板の表層以外には、通常に使
用されているプリプレグを用いことができる。特にコン
ポジット積層板は、積層板の外部にガラス織布のプリプ
レグ、内部に不織布を用いるので特に好適である。The present invention relates to (a) an epoxy resin, (b) a polycondensate of bisphenol A and formaldehyde, (c)
A prepreg obtained by impregnating a glass woven fabric with a curing accelerator, (d) a thermosetting resin containing high-purity aluminum hydroxide as an essential component and having a bromine content of 5 to 15% by weight, that is, Using a specific polycondensate of bisphenol A and formaldehyde as a curing agent for the epoxy resin, and further adjusting the bromine content of the thermosetting resin to a specific value with high purity aluminum hydroxide containing less Na 2 O as an impurity. As a result, both heat resistance and tracking resistance can be achieved. Furthermore, the tracking resistance is remarkably improved by using a glass woven fabric which has been subjected to an opening treatment. When the prepreg of the present invention is used on the outside (surface layer) of the laminate, the tracking resistance can be improved. Therefore, other than the surface layer of the laminate, a commonly used prepreg can be used. In particular, a composite laminate is particularly preferable because a prepreg of glass woven fabric is used outside the laminate and a nonwoven fabric is used inside.
【0012】耐トラッキング性は、積層板の表面が湿潤
または汚染された基板が、アーク放電により漏電性の経
路が形成されるのに耐える性質のことであり、トラッキ
ングは、回路間の高電圧によるアーク放電などで樹脂が
炭化し発生する。本発明では、これを防止するため、特
定の硬化剤を使用し、水酸化アルミニウムに含まれる不
純物のNa2Oの少ない高純度水酸化アルミニウムを使
用することにより樹脂の炭化を抑制し耐トラッキング特
性を向上させた。なお、水酸化アルミニウムを高純度に
することで熱分解温度が向上し積層板の耐熱性の低下を
抑制させることができる。また、本発明者らは、ガラス
織布については通常のガラス織布を用いた場合、積層板
表面のガラス織布のクロス目付近の樹脂付着量が少なく
耐トラッキング特牲を低下させる傾向にあることが分か
った。これは、おそらく積層板の表面層近傍に露出する
ガラスに付着した少量の樹脂がガラス界面と接触してい
るため、アーク放電による熱、熱伝導、触媒的作用が絡
み合い熱分解炭化が促進されるためではないかと思われ
る。そこで開繊処理したガラス織布を用いることによ
り、ガラス織布への樹脂の含浸性を向上させ、積層板表
面のクロス目付近の樹脂付着量が均一で極端に薄くなら
ないようにして、耐トラッキング特性を向上させること
ができた。また、おそらくガラスと同様に触媒的な作用
をすると思われる不純物のNa2O含有量の少ない高純
度の水酸化アルミニウムを用いることで、臭素含有率が
高くても耐トラッキング性に優れ、難燃性を従来の積層
板と同様に維持した積層板を得ることができた。[0012] The tracking resistance is a property of a substrate whose surface is wet or contaminated to withstand the formation of a leakage path by an arc discharge, and the tracking is caused by a high voltage between circuits. Resin is carbonized by arc discharge or the like and is generated. In the present invention, in order to prevent this, a specific curing agent is used, and carbonization of the resin is suppressed by using a high-purity aluminum hydroxide having a small amount of Na 2 O as an impurity contained in the aluminum hydroxide, thereby improving the anti-tracking property. Improved. In addition, by making aluminum hydroxide high in purity, the thermal decomposition temperature is improved, and a decrease in the heat resistance of the laminate can be suppressed. In addition, the present inventors have found that when using a normal glass woven fabric for the glass woven fabric, the amount of resin adhering to the vicinity of the cross line of the glass woven fabric on the surface of the laminated plate tends to decrease the tracking resistance characteristic. I understood that. This is because a small amount of resin adhering to the glass, which is probably exposed near the surface layer of the laminate, is in contact with the glass interface, and the heat, heat conduction, and catalytic action of the arc discharge are entangled, promoting pyrolytic carbonization It seems to be because. Therefore, by using a glass woven fabric that has been opened, the impregnating property of the resin into the glass woven fabric is improved, and the amount of resin adhering near the crosses on the surface of the laminated board is kept uniform and does not become extremely thin. The characteristics could be improved. In addition, by using high-purity aluminum hydroxide having a low content of Na 2 O, which is an impurity which is supposed to act as a catalyst similarly to glass, it has excellent tracking resistance even with a high bromine content, and has a flame-retardant property. A laminate having the same properties as the conventional laminate was obtained.
【0013】以下に本発明を実施例により具体的に説明
する。Hereinafter, the present invention will be described specifically with reference to examples.
(実施例1) 臭素化ビスフェノールA型エポキシ樹脂(エポキシ当量480、臭素含有量21 .5wt%) 60重量部 ビスフェノールA型エポキシ樹脂(エポキシ当量450) 40重量部 ビスフェノールA型ノボラック樹脂(水酸基当量118) 24.5重量部 2−エチル−4−メチルイミダゾール 0.2重量部 高純度水酸化アルミニウム 150重量部 (Na20の含有量0.03wt%) 上記化合物をメチルエチルケトンに溶解、分散し、不揮
発分75wt%、臭素含有量10wt%の樹脂ワニスを
作製した。このワニスを開繊処理したガラス織布(厚み
0.2mm、坪量210g/m2)に樹脂分が46wt%
になるように含浸、乾燥しプリプレグAを得た。また、
ガラス不織布(日本バイリーン株式会社製、EPM一4
075を使用)に上記樹脂ワニスの樹脂分が90wt%
になるように含浸、乾燥し不織布プリプレグBを得た。
この不織布プリプレグBを3枚中間層とし、その上下に
プリプレグAを配置し、さらにその両面に18μmの銅
箔を配し、170℃、90分、4MPaの条件で成形
し、厚さ1.6mmのコンポジット積層板を作製した。(Example 1) Brominated bisphenol A type epoxy resin (epoxy equivalent: 480, bromine content: 21.5 wt%) 60 parts by weight Bisphenol A type epoxy resin (epoxy equivalent: 450) 40 parts by weight Bisphenol A type novolak resin (hydroxyl equivalent 118) ) 24.5 parts by weight of 2-ethyl-4-methylimidazole 0.2 parts by weight of high purity aluminum hydroxide 150 parts by weight (content of 0.03 wt% of Na 2 0) dissolving the compound in methyl ethyl ketone, and dispersed, non-volatile A resin varnish having a content of 75 wt% and a bromine content of 10 wt% was prepared. A glass woven fabric (thickness: 0.2 mm, basis weight: 210 g / m 2 ) obtained by subjecting the varnish to fiber-opening processing has a resin content of 46 wt%.
And dried to obtain prepreg A. Also,
Glass non-woven fabric (EPM-14 manufactured by Japan Vilene Co., Ltd.)
075), the resin content of the above resin varnish is 90 wt%
And dried to obtain a nonwoven fabric prepreg B.
Three nonwoven fabric prepregs B were used as an intermediate layer, prepregs A were arranged above and below the intermediate layer, and 18 μm copper foils were further arranged on both surfaces thereof. Was produced.
【0014】(比較例1) 臭素化ビスフェノールA型エポキシ樹脂(エポキシ当量480、臭素含有量21 .5wt%) 58重量部 ビスフェノールA型エポキシ樹脂(エポキシ当量450) 64重量部 ジシアンジアミド 3重量部 2−エチル−4−メチルイミダゾール 0.2重量部 エチレングリコールモノメチルエーテル 25重量部 N、Nジメチルホルムアミド 25重量部 高純度水酸化アルミニウム 150重量部 (Na20の含有量0.03wt%) 上記化合物を混合、分散し樹脂ワニスを作製し、実施例
1と同様にしてコンポジット積層板を得た。(Comparative Example 1) Brominated bisphenol A type epoxy resin (epoxy equivalent: 480, bromine content: 21.5 wt%) 58 parts by weight Bisphenol A type epoxy resin (epoxy equivalent: 450) 64 parts by weight Dicyandiamide 3 parts by weight 2- ethyl-4-methylimidazole 0.2 parts by weight of ethylene glycol monomethyl ether 25 parts by weight N, (content 0.03 wt% of Na 2 0) N-dimethylformamide 25 parts by weight of high-purity aluminum hydroxide 150 parts by weight mixture of the above compound This was dispersed to produce a resin varnish, and a composite laminate was obtained in the same manner as in Example 1.
【0015】(比較例2)実施例1の高純度水酸化アル
ミニウム(Na20の含有量0.03wt%)を一般的
な水酸化アルミニウム(Na20の含有量0.2wt
%)にした他は実施例1と同様にしてコンポジット積層
板を得た。[0015] (Comparative Example 2) The content of a typical aluminum hydroxide (Na 2 0 high purity aluminum hydroxide (content 0.03 wt% of Na 2 0) Example 1 0.2 wt
%) To obtain a composite laminate in the same manner as in Example 1.
【0016】(比較例3)実施例1のワニス配合比を以
下に示すように変更し、臭素含有量を4wt%とした。
その他は実施例1と同様にしてコンポジット積層板を得
た。 臭素化ビスフェノールA型エポキシ樹脂(エポキシ当量480、臭素含有量21 .5%) 23重量部 ビスフェノールA型エポキシ樹脂(エポキシ当量450) 76重量部 ビスフェノールA型ノボラック樹脂(水酸基当量118) 25.6重量部 2−エチル−4−メチルイミダゾール 0.2重量部 高純度水酸化アルミニウム 150重量部 (Na20の含有量0.03wt%)Comparative Example 3 The varnish compounding ratio of Example 1 was changed as shown below, and the bromine content was 4 wt%.
Otherwise in the same manner as in Example 1, a composite laminate was obtained. 23 parts by weight of brominated bisphenol A type epoxy resin (epoxy equivalent: 480, bromine content: 21.5%) 76 parts by weight bisphenol A type epoxy resin (epoxy equivalent: 450) 25.6 parts by weight bisphenol A type novolak resin (hydroxyl equivalent 118) parts of 2-ethyl-4-methylimidazole 0.2 parts by weight of high purity aluminum hydroxide 150 parts by weight (content of 0.03 wt% of Na 2 0)
【0017】(比較例4)実施例1のワニス配合比を以
下に示すように変更し、臭素含有量を16wt%とし
た。その他は実施例1と同様にしてコンポジット積層板
を得た。 臭素化ビスフェノールA型エポキシ樹脂(エポキシ当量480、臭素含有量21 .5%) 92重量部 ビスフェノールA型エポキシ樹脂(エポキシ当量450) 7重量部 ビスフェノールA型ノボラック樹脂(水酸基当量118) 25重量部 2−エチル−4−メチルイミダゾール 0.2重量部 高純度水酸化アルミニウム 150重量部 (Na20の含有量0.03wt%)Comparative Example 4 The varnish compounding ratio of Example 1 was changed as shown below, and the bromine content was 16 wt%. Otherwise in the same manner as in Example 1, a composite laminate was obtained. 92 parts by weight of brominated bisphenol A type epoxy resin (epoxy equivalent: 480, bromine content: 21.5%) 7 parts by weight bisphenol A type epoxy resin (epoxy equivalent: 450) 7 parts by weight Bisphenol A type novolak resin (hydroxyl equivalent: 118) 25 parts by weight 2 - ethyl-4-methylimidazole 0.2 parts by weight of high purity aluminum hydroxide 150 parts by weight (content of 0.03 wt% of Na 2 0)
【0018】(実施例2)実施例1の開繊処理ガラス織
布を一般のガラス織布(厚み0.2mm、坪量210g
/m2)に変更し、その他は実施例1と同様にしてコン
ポジット積層板を得た。(Example 2) The fiber-opened glass woven fabric of Example 1 was replaced with a general glass woven fabric (thickness 0.2 mm, basis weight 210 g).
/ M 2 ), and the others were the same as in Example 1 to obtain a composite laminate.
【0019】実施例、比較例で得らたコンポジット積層
板を以下に示す試験法により評価し、その結果を表1に
示した。The composite laminates obtained in Examples and Comparative Examples were evaluated by the following test methods, and the results are shown in Table 1.
【0020】(耐トラッキング性):白金電極を用いI
EC法により試験を行いトラッキング電圧曲線よりCT
I値(耐トラッキング性)を求めた。 (難燃性):UL燃焼試験に準拠して行った。 (はんだ耐熱性):全面エッチングした50×50mm
の試験片を121℃、1215hPaのプレッシャーク
ッカーで所定時間吸湿処埋後、260℃のはんだに20
秒間浸漬し、異常の有無を目視で観察した。試験片を3
枚とし、その結果を各々について評価し、ふくれ等の異
常のあったものを×で、異常のないものを○で示した。(Tracking resistance): I
Test by EC method and CT from tracking voltage curve
The I value (tracking resistance) was determined. (Flame retardancy): Performed according to the UL combustion test. (Solder heat resistance): 50 × 50 mm etched over the entire surface
Of the test piece in a pressure cooker at 121 ° C. and 1215 hPa for a predetermined time,
After immersion for 2 seconds, the presence or absence of abnormality was visually observed. 3 test pieces
Sheets were evaluated, and the results were evaluated for each of them. Those having abnormalities such as blisters were indicated by x, and those without abnormalities were indicated by ○.
【0021】[0021]
【表1】 ―――――――――――――――――――――――――――――――――――― 項目 実施例1 実施例2 比較例1 比較例2 比較例3 比較例4 ―――――――――――――――――――――――――――――――――――― 硬化系 フェノール フェノール シ゛シアン フェノール フェノール フェノール 臭素含有率(wt%) 10 10 10 10 4 16 水酸化アルミの 0.03 0.03 0.03 0.2 0.03 0.03 Na20含有率 開繊処埋織布 有 無 有 有 有 有 耐トラッキンク゛性 600 550 400 500 600 500 IEC法(V) 難燃性 V-0 V-0 V-0 V-0 V-1 V-0 は耐 PCT1h ○○○ ○○○ ○○○ ○○○ ○○○ ○○○ ん熱 PCT2h ○○○ ○○○ ○○○ ○○○ ○○○ ○○○ だ性 PCT3h ○○○ ○○○ ○○○ ○○× ○○○ ○○○ PCT4h ○○○ ○○○ ××× ××× ○○○ ○○○ ――――――――――――――――――――――――――――――――――――[Table 1] ―――――――――――――――――――――――――――――――――― Item Example 1 Example 2 Comparative Example 1 Comparative Example 2 Comparative Example 3 Comparative Example 4 ―――――――――――――――――――――――――――――――――― Phenol Phenol Phenol Bromine content (wt%) 10 10 10 10 4 16 Aluminum hydroxide 0.03 0.03 0.03 0.2 0.03 0.03 Na20 content Spreading embedded fabric Yes No Yes Yes Yes Yes Yes IEC method (V) Flame retardancy V-0 V-0 V-0 V-0 V-1 V-0 is PCT1h ○○○ ○○○ ○○○ ○○○ ○○○ ○○○ Heat PCT2h ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ PC PC PC T T T PC PC T PC T T T T T T T T T T T PCT3h ×× ○○○ ○○○ ―――――――――――――――― -------------------
【0022】以上の結果から明らかなように硬化剤の違
いにより耐トラッキング特性が向上し(実施例1と比較
例1)、また、水酸化アルミニウムとして不純物の少な
い高純度のものを使用することて耐トラッキング性、耐
熱性が向上している(実施例1と比較例2)。また臭素
含有率については5wt%未満では難燃性が低下し(比
較例3)、15wt%を超える場合では耐トラッキング
性が低下することが分かる(比較例4)。また、ガラス
織布については開繊処理したガラス織布を使用すること
てより安定した耐トラッキング特性が得られることが分
かった(実施例1と実施例2)。As is clear from the above results, the tracking resistance is improved by the difference in the curing agent (Example 1 and Comparative Example 1), and the use of aluminum hydroxide having a high purity with few impurities is used. The tracking resistance and heat resistance are improved (Example 1 and Comparative Example 2). It is also found that the bromine content is less than 5 wt%, the flame retardancy is reduced (Comparative Example 3), and the bromine content is more than 15 wt%, the tracking resistance is reduced (Comparative Example 4). Further, it was found that more stable tracking resistance can be obtained by using the glass woven fabric which has been subjected to the fiber opening treatment (Examples 1 and 2).
【0023】[0023]
【発明の効果】本発明は、(a)エポキシ樹脂、(b)
ビスフェノールAとホルムアルデヒドの重縮合物、
(c)硬化促進剤、(d)高純度水酸化アルミニウムを
必須成分とし、かつ臭素含有率を5〜15wt%に配合
した熱硬化性樹脂をガラス織布に含浸して得られたプリ
プレグを用いることにより、耐熱性などの一般特性およ
び難燃性を低下させることなく耐トラッキング性に優れ
た金属張り積層板を提供することができ、またガラス織
布として開繊処理したガラス織布を用いることにより耐
トラッキング性がより向上し安定した特性を得ることが
できる。The present invention relates to (a) an epoxy resin, (b)
Polycondensate of bisphenol A and formaldehyde,
A prepreg obtained by impregnating a glass woven fabric with (c) a curing accelerator and (d) a thermosetting resin containing high-purity aluminum hydroxide as an essential component and having a bromine content of 5 to 15 wt% is used. By this, it is possible to provide a metal-clad laminate excellent in tracking resistance without lowering general properties such as heat resistance and flame retardancy, and to use a glass woven fabric which has been subjected to fiber opening treatment as a glass woven fabric. Thereby, tracking resistance is further improved and stable characteristics can be obtained.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 FI C08J 5/10 CFC B29C 67/14 G // B29K 63:00 105:08 309:08 B29L 9:00 ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 6 Identification code FI C08J 5/10 CFC B29C 67/14 G // B29K 63:00 105: 08 309: 08 B29L 9:00
Claims (3)
ルAとホルムアルデヒドの重縮合物、(c)硬化促進
剤、(d)高純度水酸化アルミニウムを必須成分とし、
かつ臭素含有率が5〜15wt%となる熱硬化性樹脂を
ガラス織布に含浸して得られたプリプレグを金属箔と積
層し加熱加圧成形することを特徴とする金属張り積層板
の製造方法。1. An essential component comprising (a) an epoxy resin, (b) a polycondensate of bisphenol A and formaldehyde, (c) a curing accelerator, and (d) high-purity aluminum hydroxide.
A method for producing a metal-clad laminate, comprising laminating a prepreg obtained by impregnating a glass woven fabric with a thermosetting resin having a bromine content of 5 to 15% by weight and a metal foil, followed by heating and pressing. .
る請求項1記載の金属張り積層板の製造方法。2. The method for manufacturing a metal-clad laminate according to claim 1, wherein the glass woven fabric is a glass woven fabric that has been subjected to a fiber opening treatment.
コンポジット積層板において、少なくとも外部の最外層
に請求項1または請求項2に記載の樹脂を含浸して得ら
れたプリプレグを用いることを特徴とする金属張り積層
板の製造方法。3. A composite laminate comprising a nonwoven fabric inside and a glass woven fabric outside, wherein a prepreg obtained by impregnating at least the outermost outer layer with the resin according to claim 1 or 2 is used. A method for producing a metal-clad laminate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP34345996A JP4346045B2 (en) | 1996-12-24 | 1996-12-24 | Method for producing metal-clad laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP34345996A JP4346045B2 (en) | 1996-12-24 | 1996-12-24 | Method for producing metal-clad laminate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH10180932A true JPH10180932A (en) | 1998-07-07 |
| JP4346045B2 JP4346045B2 (en) | 2009-10-14 |
Family
ID=18361694
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP34345996A Expired - Lifetime JP4346045B2 (en) | 1996-12-24 | 1996-12-24 | Method for producing metal-clad laminate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4346045B2 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001260157A (en) * | 2000-03-22 | 2001-09-25 | Sumitomo Bakelite Co Ltd | Manufacturing method of laminated board |
| JP2002212394A (en) * | 2001-01-17 | 2002-07-31 | Hitachi Chem Co Ltd | Prepreg for printed circuit board and metal-clad laminate |
| JP2003171482A (en) * | 2001-09-25 | 2003-06-20 | Sumitomo Bakelite Co Ltd | Method for manufacturing composite laminate |
| JP2014231566A (en) * | 2013-05-29 | 2014-12-11 | パナソニック株式会社 | Prepreg, metal-clad laminate, and printed wiring board |
| JP2015145115A (en) * | 2014-02-04 | 2015-08-13 | 日立化成株式会社 | Method for producing metal-clad laminated plate, and metal-clad laminated plate |
| JP2019083244A (en) * | 2017-10-30 | 2019-05-30 | ダイキン工業株式会社 | Multilayer substrate |
-
1996
- 1996-12-24 JP JP34345996A patent/JP4346045B2/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001260157A (en) * | 2000-03-22 | 2001-09-25 | Sumitomo Bakelite Co Ltd | Manufacturing method of laminated board |
| JP2002212394A (en) * | 2001-01-17 | 2002-07-31 | Hitachi Chem Co Ltd | Prepreg for printed circuit board and metal-clad laminate |
| JP2003171482A (en) * | 2001-09-25 | 2003-06-20 | Sumitomo Bakelite Co Ltd | Method for manufacturing composite laminate |
| JP2014231566A (en) * | 2013-05-29 | 2014-12-11 | パナソニック株式会社 | Prepreg, metal-clad laminate, and printed wiring board |
| JP2015145115A (en) * | 2014-02-04 | 2015-08-13 | 日立化成株式会社 | Method for producing metal-clad laminated plate, and metal-clad laminated plate |
| JP2019083244A (en) * | 2017-10-30 | 2019-05-30 | ダイキン工業株式会社 | Multilayer substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4346045B2 (en) | 2009-10-14 |
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