JPH10185997A - Inspection jig - Google Patents

Abstract

PROBLEM TO BE SOLVED: To minimize positioning error by fitting the wall part of electronic circuit containing part for inspecting object to the wall part of a containing room, positioning an inspecting object terminal and substrate contact and setting the coupling accuracy of both wall parts to be better than a certain relative position accuracy. SOLUTION: To a positioning member 48 in the nearly center of a printed board 46, a recess part 48a where a projection part 24c of a semiconductor element 24 fits is provided and the tolerance of the gap between the projection part 24c and the recess part 48a is set to satisfy a required relative position accuracy. The projection part 24c of the semiconductor element 24 is positioned in the recess 48a of the printed board 46 and put on a selective conduction substrate 50 and each terminal part 24da to 24dd of the semiconductor element 24 and each thermal part 50da to 50dd of the selective conductor substrate 50 are contacted. By this, each terminal part 24da to 24dd and each terminal part 50da to 50dd are able to be highly accurately positioned. Also by this, positioning error can be minimized and testing of the semiconductor element 24 having high density terminals can easily be done.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an inspection jig used for a non-destructive test of an electronic circuit on an inspection object having an electronic circuit therein.

[0002]

2. Description of the Related Art Various tests are performed on a semiconductor integrated circuit mounted on an electronic device or the like before mounting to remove potential defects. The test is performed nondestructively by applying voltage stress, operating at high temperature, storing at high temperature, and the like corresponding to thermal and mechanical environment tests. Among the various tests, a burn-in test for performing an operation test for a certain period of time under a high temperature condition is performed as a test that is effective for removing an initial operation defective integrated circuit. The inspection jig used for this burn-in test
For example, as shown in FIGS.
A printed circuit board 2 having an input / output unit 2A disposed thereon and having a predetermined test voltage supplied thereto and transmitting an abnormality detection signal indicating a short circuit or the like from the object to be inspected; A semiconductor integrated circuit as an object to be inspected is accommodated, for example, a surface mount type Q
An inspection object accommodation member 10 having an accommodation part to which an FP (quad flat package) type semiconductor element 12 is mounted, and an abutting part 8a which abuts on the upper surface of the semiconductor element 12 and is pressed with a predetermined pressure. A cover member 8 that covers the upper part of the inspection object storage member 10, and a hook member 16 that engages with both the cover member 8 and the inspection object storage member 10 to fix the cover member 8 to the inspection object storage member 10. Have been.

[0005] One end of the cover member 8 is rotatably supported by a support shaft 10 a provided at one end of the inspection object housing member 10 and is connected to the inspection object housing member 10. Thereby, when the hook member 16 is disengaged, the cover member 8 is supported so as to be capable of opening and closing with respect to the inspection object storage member 10.

When the cover member 8 is in a closed state, the inner surface of the cover member 8 faces the outer shell of the semiconductor element 12 when the cover member 8 is closed. An abutting portion 8a for pressing is provided.

[0005] Terminals extending in four directions from each side of the substantially square semiconductor element 12 mounted inside the inspection object accommodating member 10 are each terminal 2a of the printed wiring board 2.
And is positioned in contact with. The portion of each terminal 2a that contacts the terminal of the semiconductor element 12 is formed in an arc shape and has elasticity. Further, each terminal 2a is connected to the input / output unit 2A via a printed wiring network (not shown). Accordingly, when the cover member 8 is in the closed state, each terminal of the semiconductor element 12 is connected to each terminal 2a.
When the predetermined urging force due to the elastic force of the above is applied, the terminals of the semiconductor element 12 and the respective terminals 2a of the printed wiring board 2 are electrically connected.

In this configuration, the semiconductor element 12 is mounted inside the inspection object housing member 10, and the cover member 8 is closed by the hook member 16 being engaged with the terminal of the semiconductor element 12. Each terminal 2 on the printed wiring board 2
When a is made conductive, a predetermined test voltage is supplied to the input / output unit 2A of the printed wiring board 2 and, for example, a burn-in test is performed.

[0007]

Each terminal 2 on the printed wiring board 2 at the tip of each terminal in the semiconductor element 12
Since the positioning with respect to a affects the reliability of the test, high precision is required to minimize the positioning error. Conventionally, the positioning is performed by, for example, positioning pins inserted into through holes provided in a package of the semiconductor element 12 being provided at predetermined positions on the substrate. It will be affected by the molding accuracy of the package. However, in a semiconductor device having high-density terminals, the distance between the terminals is relatively minimal, and the molding accuracy of the package of the semiconductor device 12 is not more than the required positioning accuracy. There is a possibility that the method cannot cope.

In such a case, it is conceivable that the position of the tip of each terminal of the semiconductor element 12 with respect to each terminal 2a of the printed wiring board 2 is determined by using an image processing technique. However, the manufacturing cost increases as a simple inspection jig. This is not a good idea.

In view of the above problems, the present invention relates to an inspection jig used for a non-destructive test of an electronic circuit on an object to be inspected having an electronic circuit therein, wherein the jig for each terminal of a semiconductor device has An object of the present invention is to provide an inspection jig that can minimize a positioning error with respect to a terminal and can easily perform a test on a semiconductor element having a high-density terminal.

[0010]

In order to achieve the above-described object, an inspection jig according to the present invention is electrically connected to a terminal of an inspection object having an electronic circuit storage section for storing an electronic circuit therein. And a substrate having an input / output unit to which an input signal is input and an output signal from the inspection object is transmitted, and a wall portion arranged on the substrate and forming an electronic circuit storage unit of the inspection object. An inspection object storage member having an inspection object storage chamber formed by a wall portion to be engaged, wherein the inspection object is disposed in the inspection object storage chamber, and a wall portion of the electronic circuit storage section of the inspection object. Is engaged with the wall of the inspection object storage chamber, and positioning of the terminal of the inspection object with respect to the contact point of the substrate is performed. The accuracy of the fit with respect to the predetermined It is intended to be set high above to location accuracy.

The semiconductor device further includes a connection portion provided between the substrate and the terminal of the inspection object, the connection portion being provided corresponding to the contact and the terminal of the substrate. May be additionally provided with a selective conductive substrate for selectively turning on.

Further, the connecting portion on the selected conductive substrate is
It may be formed of a composite conductive material that selectively conducts when a predetermined pressure is applied.

[0013]

FIG. 2 schematically shows an example of the structure of an inspection jig according to the present invention.

In FIG. 2, a printed circuit board 20 having an input / output section 20A for supplying a predetermined test voltage and transmitting an abnormality detection signal indicating a short circuit or the like from an object to be inspected, and a printed circuit board 20 on the printed circuit board 20 A plurality of semiconductor elements 24 arranged in a predetermined position vertically and horizontally as an object to be inspected.
And an object-to-be-inspected accommodating member 22 having an accommodating chamber in which is mounted.

The semiconductor element 24 as the object to be inspected is, for example, as shown in FIG.
4a and the chip portion 2 electrically connected to the chip portion 24a.
And a package part 24b surrounding the periphery of the package 4a. Chip portion 24 having a substantially rectangular plate shape
a is disposed at a substantially central portion of the package portion 24b and protrudes downward from one surface of the package portion 24b with a predetermined thickness. Projection portion 24c projecting from one surface of package portion 24b in chip portion 24a
Has a short side and a long side orthogonal to each other. On the short side and the long side, end faces finished with relatively high precision are formed, respectively.

Terminal portions 24da and 24dc which are connected to the chip portion 24a and used for connection to external terminals are provided on the periphery of the relatively thin plate-shaped package portion 24b. The terminal portions 24da and 24db, which are provided opposite to the sides and are similar to the terminal portions 24da and 24dc, respectively.
dd are provided opposite to the short sides of the chip portion 24a, respectively.

As shown in FIG. 3, the inspection object housing member 22 includes a base 26 on which the semiconductor element 24 is mounted and a base 26 shown in FIG.
And a cover member 28 disposed on the upper surface of the base 26 to cover the upper surface of the base 26, as shown in FIG.

As shown in FIGS. 4 and 5, the cover member 28 includes a cover body 30 forming an outer shell, and a guide member 36 fixed to a concave portion 30a provided on the upper surface of the cover body 30. , Recess 30a of cover body 30
A pressing member 40 disposed in an internal space 30b formed below the semiconductor device 24 and pressing the peripheral portion of the package portion 24b of the semiconductor element 24 with a predetermined pressure; and an upper surface of the pressing member 40 and the internal space 30b.
And a leaf spring 38 that is arranged between the wall and the upper surface of the semiconductor device 24 and urges the pressing body 40 downward, that is, in the direction toward the semiconductor element 24.

On the upper surface of the cover body 30, a slope 30c having a predetermined inclination angle is formed over the entire circumference. A step portion 30h to be engaged with a peripheral portion of a base 26, which will be described later, is formed on the entire peripheral portion on the lower surface of the cover main body portion 30. On opposite sides in the longitudinal direction, there are provided recesses 30d with which engagement surface portions 42a of hook members 42 described later are engaged.

Openings 30e for communicating the outside with the internal space 30b are provided at four locations opposite to each other at the bottom of the concave portion 30a provided at the top of the cover main body 30.
A locking piece 30f for holding the pressing body 40 is provided on the periphery of each opening 30e. The locking piece 30f is provided at each opening 3
It is formed to extend downward along the periphery of 0e.

A plate member 32 is fixed to the bottom of the center of the recess 30a with a screw BS2. The lower surface of the plate member 32 has an opening 30g.
The guide member 36 to be inserted into the screw is fixed by a screw BS1.

The pressing member 40 has a contact portion 4 which is in contact with each terminal portion 24da to 24dd of the package portion 24b of the semiconductor element 24 mounted at a position facing the lower surface portion.
0a. A guide member 36 is provided at a center portion side of the pressing body 40 with respect to a portion where the contact portion 40a is provided.
Is provided in the through hole 40b. Further, around the through hole 40b, positioning pins 52a, 52b, 52c provided on the base 26 to be described later, and
A through hole 40c into which the tip of 52d is inserted is provided.

With such a configuration, the pressing body 40 is attached to the leaf spring 38 with its outer peripheral portion being held by the locking piece 30f and guided by the guide member 36 inserted into the through hole 40b. It is urged downward by forces.

As shown in FIGS. 3 and 5, the base 2 placed at a predetermined position on the printed wiring board 20 is provided.
6 has a printed circuit board 46 having a terminal portion 46a connected to the contact point of the printed circuit board 20 inside the peripheral wall portion.

Therefore, the inspection object storage chamber is formed by the surface of the printed circuit board 46, the inner peripheral wall surface of the base 26, and the space surrounded by the inner surface of the cover member 28 described above.

On the outer side of the peripheral wall along the longitudinal direction of the base 26, hook members 42 having an engaging surface 42a to be engaged with the recess 30d of the cover main body 30 are opposed to the base 26, respectively. It is provided. The hook member 42 is
It is rotatably supported by a support shaft 56 provided on the base 26. The engagement surface 4 of the pair of hook members 42
2a is engaged with the concave portion 30d of the cover member 28 so that the cover member 28 is mounted on the base 26 as shown in FIG.
Will be held.

At a substantially central portion of the printed circuit board 46,
A positioning member 48 having a concave portion 48a into which a projection 24c as an engagement portion of the chip portion 24a in the semiconductor element 24 to be mounted is provided. The positioning member 48 is made of a heat-resistant material, for example, ceramic. The recess 48a is provided for the semiconductor element 24 to be mounted.
Are formed in a substantially rectangular shape corresponding to the shape of the projection 24c of the chip portion 24a. The length of the long side and the length of the short side are set such that a predetermined minimum gap is formed between the peripheral edge of the concave portion 48 and the outer peripheral surface of the projection 24c of the tip 24a. The length is larger than the length of the portion 24c. At the periphery of the concave portion 48, arc portions 48b are formed at four corners. Also,
The gap is formed between the terminal portions 24 da to 24 d of the semiconductor element 24.
The value d is set in accordance with the relative positional accuracy of the later-described selective conductive substrate 50 with respect to the terminal portion. That is, the allowable tolerance of the gap is set so as to satisfy the required relative position accuracy.

Thus, the terminal portion 24 of the semiconductor element 24
The relative positional accuracy of da to 24dd with respect to the terminal portion of the later-described selective conductive substrate 50 is maintained in accordance with the accuracy of the gap.

Although the positioning member 48 is formed separately from the printed circuit board 46 as in the above-described example, it is not always necessary to do so. For example, the positioning member 48 may be formed integrally with the printed circuit board 46. Good.

In a portion of the printed circuit board 46 where a later-described selective conductive substrate 50 is mounted, a terminal portion 46d is provided.
a, 46 db, 46 dc, and 46 dd are provided at positions corresponding to the terminals of the selected conductive substrate 50 and the terminals 24 da to 24 dd of the semiconductor element 24 to be mounted, so as to surround the positioning member 48.

Terminal part 46d on printed circuit board 46
As shown in FIG. 3, a and 46dc oppose each other with a predetermined interval across the long side of the positioning member 48, and 46db and 46dd mutually oppose each other across the short side of the positioning member 48. Are arranged facing each other with an interval of.

The terminal 4 on the printed circuit board 46
Positioning the terminal of the selected conductive substrate 50 with respect to the terminal of the printed circuit board 46 at a position facing the long side of the positioning member 48 with the 6 da interposed therebetween.
And 52b are provided to face each other. Further, a similar positioning pin 52d is provided opposite to the pin 52a with the terminal portion 46dd interposed therebetween, and a similar positioning pin 52c is opposed to the long side of the positioning member 48 with the terminal portion 46dc interposed therebetween. And is provided opposite to the pin 52d.

Terminal part 46da on printed circuit board 46
One end is connected to the terminals 46da to 46dd by conductors (not shown), and the other end is an input / output unit connected to each contact of the printed circuit board 20 around the outer periphery of the printed wiring board 20. An output terminal 46a is provided.

As shown in FIG. 1, the selected conductive substrate 50 mounted on the printed circuit board 46 includes the printed circuit board 4.
Terminal portions 50da, 50db, 50dc, and 50dd respectively corresponding to the respective terminal portions of the semiconductor element 24 mounted on 6 are made of a composite conductive material, for example, one made of silicone rubber and metal particles, and provided. ing. As the composite conductive material, an anisotropic conductive rubber is used. Anisotropic conductive rubber is a material having conductivity in the thickness direction and not in the direction along the plane. In addition, the anisotropic conductive rubber includes a dispersion type in which conductive portions are dispersed in an insulating rubber, and an uneven distribution type in which a plurality of conductive portions are partially distributed. May be used. Since the terminal portions 50da to 50dd are made of such anisotropic conductive rubber, each terminal portion of the semiconductor element 24 and the terminal portions 50da to 50dd are connected by surface contact, so that a contact failure can be avoided and Damage due to contact with the terminal portions 50da to 50dd of the element 24 is avoided.

Positioning member 4 on selective conductive substrate 50
As shown in FIG. 1, an opening 50 e through which the protrusion 24 c of the semiconductor element 24 penetrates is provided at a position opposed to 8. Further, at positions corresponding to the pins 52a to 52d on the printed circuit board 46 in the selective conductive substrate 50, through holes 50a, 50b into which the corresponding pins are inserted,
50c and 50d are provided. Thus, the positioning of the terminal portions 50da to 50dd of the selected conductive substrate 50 with respect to 46da to 46dd of the printed circuit board 46 is performed.

When testing the semiconductor device 24 with such a configuration, first, the semiconductor device 24
As shown in FIG. 6, the protrusion 24 c as the engaging portion is positioned by being fitted into the concave portion 48 a of the printed board 46, and is mounted on the selected conductive board 50. At this time, each of the terminal portions 24 da to 2
4dd is each terminal part 50da-50 of the selective conductive substrate 50
dd.

Therefore, each terminal portion 24d of the semiconductor element 24
a to 24dd of each terminal portion 50da of the selected conductive substrate 50
Positioning with respect to 50dd can be easily and reliably performed with high accuracy because the fitting accuracy of the projection 24c and the concave portion 48a is maintained relatively high.

Next, the pressing member 40 of the cover member 28
6 are arranged above the semiconductor element 24 so as to face each other.
As shown by a two-dot chain line, the projection 40a of the pressing body 40 is moved downward, and
, And the step 30h of the cover main body 30 is engaged with the peripheral edge of the base 26.

Subsequently, as shown in FIG. 5, each hook member 42 is rotated upward so as to approach each other, and its engaging surface 42a engages with each recess 30d in the cover body 30. Is done. As a result, the terminal portions 24 da to 24 dd of the semiconductor element 24 and the terminal portions 50 da to 50 dd of the selective conductive substrate 50 are
Of each terminal portion 2 of the semiconductor element 24.
4 da to 24 dd and each terminal portion 50 d of the selective conductive substrate 50
a to 50dd are electrically connected.

Then, in a predetermined atmosphere, a test voltage is supplied via the input / output unit 20A of the printed wiring board 20 to perform a test. Further, a potential defect of the semiconductor element 34 is determined by a diagnostic device (not shown) based on an output signal obtained from the input / output unit 20A.

[0041]

As is apparent from the above description, according to the inspection jig of the present invention, the wall forming the electronic circuit storage portion of the inspection object is engaged with the wall of the inspection object storage chamber. When the terminal of the inspected object is positioned with respect to the contact point of the substrate, the fitting accuracy of the wall of the electronic circuit storage portion of the inspected object with the wall of the inspected object accommodating chamber is determined by the accuracy of the terminal of the inspected terminal. Since it is set higher than the predetermined relative positional accuracy with respect to the contact, the positioning error of each terminal of the semiconductor element with respect to each terminal of the substrate can be minimized.

In addition, there is provided a selective conductive substrate for selectively conducting between the terminal and the contact of the portion to be inspected, and the connecting portion is selectively brought into conduction when a predetermined pressure is applied. When it is formed of a composite conductive material, there is an advantage that a test can be easily performed even on a semiconductor element having high-density terminals.

[Brief description of the drawings]

FIG. 1 is a plan view showing a main part of an example of an inspection jig according to the present invention.

FIG. 2 is a schematic configuration diagram of an example of an inspection jig according to the present invention.

FIG. 3 is a plan view showing a base of an example of an inspection jig according to the present invention.

FIG. 4 is a plan view showing an example of an inspection jig according to the present invention.

FIG. 5 is a sectional view taken along line VV in the example shown in FIG. 4;

FIG. 6 is a partially enlarged sectional view of the example shown in FIG. 1;

FIG. 7 is a perspective view showing the appearance of a semiconductor element to which an example of the inspection jig according to the present invention is applied.

FIG. 8 is a schematic configuration diagram showing a configuration of a conventional device.

FIG. 9 is a partial cross-sectional view of the device shown in FIG.

[Explanation of symbols]

 22 Inspection object accommodation member 24 Semiconductor element 24c Projection 26 Base 30 Cover body 46 Printed circuit board 46a Input / output terminal 48 Positioning member 48a Depression 50 Selection conductive substrate

Claims (3)

[Claims] A contact point electrically connected to a terminal of an inspection object having an electronic circuit storage unit for storing an electronic circuit therein;
A substrate having an input / output unit to which an input signal is input and to which an output signal from the inspection object is sent; and a wall portion arranged on the substrate and forming an electronic circuit storage unit of the inspection object. An inspection object storage member having an inspection object storage chamber formed by a wall portion to be combined, wherein the inspection object is disposed in the inspection object storage chamber, and an electronic circuit storage section of the inspection object is provided. When the wall is engaged with the wall of the inspection object storage chamber to position the terminal of the inspection object with respect to the contact point of the substrate, the wall of the inspection object in the electronic circuit storage unit is closed. An inspection jig, wherein the accuracy of fitting of the terminal of the object to be inspected with respect to the contact point of the substrate is set higher than the accuracy of the relative position of the terminal of the object to be inspected to the contact point of the substrate. And a connection portion provided between the substrate and a terminal of the object to be inspected, the connection portion being provided in correspondence with the contact point of the substrate and the terminal. The inspection jig according to claim 1, further comprising a selective conductive substrate that selectively brings a terminal and a contact point of the substrate into a conductive state. 3. The inspection jig according to claim 2, wherein the connection portion of the selective conductive substrate is formed of a composite conductive material that selectively becomes conductive when a predetermined pressure is applied.