JPH10209231A - Probe device and inspection method using probe device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a probe device for inspecting electrical characteristics of an object to be inspected, a means for detecting foreign matter adhering to a probe needle by inspection, and removing the foreign matter as needed. An object of the present invention is to provide a cleaning means for preventing poor contact at the time of inspection and extending the life of the probe needle. A control unit (250) is provided at a position close to a mounting table (40) on which an object to be inspected (120) is mounted, and the probe unit (10) is connected to the plate (10) by the control unit (250).
A program for determining whether to clean the probe needle 10 based on the contact resistance value with the probe needle 60 and for determining whether or not to replace a probe card composed of a plurality of probe needles is recorded. A recording medium is provided in the control unit 250 so that cleaning of the probe needle can be performed at an appropriate time so that the number of times of cleaning can be minimized.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a probe apparatus and an inspection method using the probe apparatus, and more particularly, to a mechanism for measuring contact resistance of a probe needle for inspecting electrical characteristics of an object to be inspected and cleaning. The present invention relates to a probe device having a mechanism and an inspection method using the probe device.

[0002]

2. Description of the Related Art Conventionally, as a probe apparatus of this type, a probe needle is brought into contact with an electrode pad of an object to be inspected such as a semiconductor wafer mounted on a mounting table which can be rotated horizontally, vertically and horizontally. 2. Description of the Related Art A probe device for inspecting an electric characteristic by using a probe is known. This probe apparatus generally inspects electrical characteristics by bringing a large number of probe needles, which are obliquely implanted in a probe card, into contact with electrode pads of a semiconductor wafer.

In recent semiconductor devices, the arrangement of electrode pads tends to be complicated and large in number with miniaturization.
It is difficult to make accurate contact with each electrode pad in the inspection by the probe device. Therefore, a technique has been developed which can perform an inspection in a state where the probe needles are uniformly pressed against the electrode pads having a complicated arrangement and a large number of electrodes by using a probe card on which vertical probe needles are arranged.

However, since such a probe needle is brought into contact with an electrode pad on a semiconductor wafer, foreign materials such as aluminum and tungsten, which are the material of the pad, adhere to the probe during the inspection, which hinders the inspection of the inspection object. In addition to the problem, the problem of shortening the life of the probe card itself arises.

[0005] Therefore, an integrated type apparatus in which an abrasive is attached to a wafer stage disclosed in JP-A-4-177849, or a wafer stage disclosed in JP-A-4-364746.
Type with a cleaning material attached near the edge
The probe needle is cleaned using a probe device.

In the above-described conventional probe apparatus, foreign matters such as aluminum and silicon adhered to the probe needle are removed by contacting a cleaning material attached in the apparatus. The frequency of removal is set for each wafer or chip and cleaning is performed.

[0007]

However, in the above-mentioned conventional probe apparatus, when the setting of the cleaning time is later than the adhesion of the foreign matter such as aluminum or silicon, a measurement failure which has been conventionally observed is caused. .

On the other hand, if it is too soon before the foreign matter adheres, the number of times that the probe needle comes into contact with the cleaning material increases, which causes a problem that the life of the probe card itself is shortened.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and has as its object to provide a probe apparatus which can solve the above-mentioned problems of the prior art and can drastically extend the life of a probe card. And

[0010]

A probe device according to the present invention comprises a probe device for inspecting electrical characteristics of a device under test by bringing a probe needle into contact with an electrode pad of the device under test. A control unit is newly provided at a position close to a mounting table (wafer stage) on which the inspection object is mounted, and a plate for measuring contact resistance of the probe needle and the probe are provided on the control unit. A cleaning material for polishing the probe needle, whether or not the probe needle can be cleaned based on a contact resistance value between the probe needle and the plate; A probe device having a recording medium in which a program for evaluating the degree of wear and judging the life is recorded is used.

Further, the inspection method using the probe device according to the present invention is the inspection method using the probe device, wherein a control unit is provided in the probe device, and the probe needle is connected to the probe unit by the control unit. Based on the contact resistance value with the contact resistance measurement plate, the probe needle
The present invention is characterized in that maintenance of the probe needle is automatically performed by evaluating the life of the probe needle by evaluating whether or not the probe needle is worn and the degree of wear of the probe needle.

[0012]

BEST MODE FOR CARRYING OUT THE INVENTION

[0013]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic view showing a semiconductor wafer measuring system control unit of a measuring system unit according to an embodiment of the present invention and a main configuration of a probe apparatus. FIG. 6 shows a semiconductor wafer measuring system control unit and a probe device constituting a conventional measuring system unit. FIG. 2 is a schematic view showing a main part of a probe apparatus according to one embodiment of the present invention.

FIG. 3 is an exploded perspective view showing a state where the plate and the cleaning material are mounted, and FIG. 4 is a sectional view showing a state where the plate and the cleaning material are mounted. The probe apparatus according to one embodiment of the present invention has a configuration in which a control unit 250 for measuring and cleaning contact resistance is newly attached to the conventional measurement system unit shown in FIG. An outline of a control flow by the control unit 250 will be described with reference to FIG.

[0015] The contact resistance of each pin of the probe card to which a plurality of probe needles are attached is measured, and when the measured value is out of a specified value (spec value), cleaning is performed. . After the cleaning, the contact resistance between the probe needle and the plate is measured again. If the contact resistance value is out of the range of the specification value, the cleaning is performed again to measure the contact resistance value. If the contact resistance value does not fall within the range of the specification value even after performing the cleaning a specified number of times, the probe card is replaced. In accordance with the above control flow, cleaning and replacement of the probe needle are appropriately performed.

The structure of the probe device of this embodiment is shown in FIG.
As shown in FIG. 1, a probe card 30 having a plurality of probe needles 10 attached thereto via a probe needle fixing block 20, and an X, Y and Z direction below the probe card 30. A mounting table 40 movably disposed, a cleaning material 50 and a plate 60 attached to the side of the mounting table 40,
The control unit 250 (not shown) for measuring the contact resistance of the needle 10 and determining whether or not the contact is possible is provided.

The mounting table 40 is arranged along the Y direction.
A Y stage 80 mounted on the directional rail 70, an X stage 100 mounted on an X direction rail 90 arranged along the X direction, and an X stage 100 mounted on the X stage 100 The chuck 110 is configured to be able to move up and down in the Z direction and to rotate at an arbitrary angle θ. The chuck 110 can suction-hold the semiconductor wafer 120 as the object to be inspected by the suction method on the upper surface.

The cleaning material 50 may be any material, such as ceramic, nylon fiber, polyester fiber, etc., as long as it does not damage the needle tip as much as possible during polishing. The plate 60 may be made of a conductive material, but it is preferable to use gold having a low resistance value. In this embodiment, a gold plate is used. The size and shape of the plate 60 may be any size and shape other than those shown in FIG. In addition, a detachable type, which can be replaced periodically rather than a fixed type, is employed to contact the needle tip a plurality of times.

The cleaning material 50 and the plate 60 are mounted close to the X stage 100 as shown in FIGS. 2, 3 and 4, and the cleaning material 50 and the plate 60 are attached. Are electrically insulated, and plate 60 is connected to ground. Specifically, the plate 60 is placed on the upper surface of the cap-shaped base portion 130 and is fixed by the set screw 140.
It is fixed in the state pressed by.

A holding member attached to the mounting table 40
160 (FIG. 2) Elevating plate 170 installed so as to be able to move up and down
(FIG. 4) and a spring guide 1 fixed on a lifting plate 170
A guide base 190 (FIGS. 3 and 4) is provided on the outer periphery of 80 (FIGS. 3 and 4) so as to prevent the guide base 190 from coming out upward. As shown in FIG. 4, a system recess 190a is provided at an appropriate position on the outer peripheral surface of the guide base 190, and a bob of the spring plunger 200 mounted on the side wall of the cap-shaped base 130 is provided in the system recess 190a. The screw 200a is detachably snapped while being pressed by the spring 200b.

At this time, the cap base 130 and the spring guide
180, a compression spring 210 for pressing the cap-shaped base 130 and the cleaning material 50 upward is always provided between the lower surface of the cap-shaped base 130 and the upper surface of the elevating plate 170. The cleaning material is
50 is the probe needle 10 and the probe needle fixing block.
The pressure applied to the probe 20 can be buffered, and an error for ensuring proper contact between the cleaning material 50 and the probe needle 10 can be absorbed. I have.

At this time, the overdrive amount of the plate 60 and the probe needle 10 for measuring the contact resistance is as follows.
Set to 30 to 50 μm. In this case, it is necessary to provide at least a gap L between the lower surface of the cap-shaped base portion 130 and the upper end surface of the spring guide 180.
A plunger 230a of an air-cylinder 230, which is an elevating means, is fixed to the lower surface of the elevating plate 170. Waiting in position.

The cleaning material 50 and the plate 60 attached as described above can be raised and lowered by the operation of the air cylinder 23 in addition to being raised and lowered by the raising and lowering operation of the mounting table 40. Further, the cleaning material 50 and the plate 60 can be replaced by removing the cap-shaped base 130 from the guide base 190.

Next, the operation when the cleaning material 50 and the plate 60 are used in the probe device of the present embodiment will be described. As shown in FIG. 2, the mounting table 40 holding the semiconductor wafer 120 by suction is moved in the X, Y, and Z directions, so that the probe needle is moved to the electrode pad of the semiconductor wafer 120.
The electrical characteristics are inspected by bringing the probe 10 into contact, but if this inspection step is performed a plurality of times, a foreign substance such as aluminum adheres to the probe needle 10 and an appropriate inspection cannot be performed. Then, after performing the inspection process a plurality of times, for example, a plurality of inspections for each inspection of one semiconductor wafer, the mounting table 40 is moved and the plate 60 is moved.
Is arranged at a position facing the probe needle 10 below and the plate 60 is brought into contact with the probe needle 10.

At this time, a voltage is applied from the control unit 250 to each pin of the probe needle 10 and the resistance value is measured. This operation is performed for each inspection of one semiconductor wafer, and is continued until the contact resistance value of each pin of the probe needle 10 set by the control unit 250 is out of the specification. When the contact resistance value is out of the specification, the mounting table 40 is moved to dispose the cleaning material 50 at a position opposing the probe needle 10 below, and ascending and descending, the cleaning of the probe needle 10 is performed. −
The tip of the needle is polished. FIG. 5 shows the contact resistance between the ten probe needles 10 and the plate 60. If the measured contact resistance is out of the specification (in this case, pin 6), the tip of the needle is polished.

After cleaning, the mounting table 40 is moved,
The contact resistance is measured by bringing the plate 60 into contact with the probe 60. This operation is repeated until the contact resistance satisfies the specifications. If the contact resistance value is out of the specification even if it is repeated a plurality of times, the probe card 30 is replaced (lifetime). When the contact resistance returns to the specification after the above-described processing, the electrical characteristics can be inspected by contacting the probe needle 10 and the electrode pad of the semiconductor wafer 120.

The control unit 250 controls the applied voltage (or current), the specification of the contact resistance value, and the timing of contact between the plate 60 and the probe needle 10 (for example, measurement is performed for each wafer and every 10 wafers). Etc.), the number of repetitions after cleaning can be freely set. Also, after the contact location between the plate 60 for measuring the contact resistance value and the probe needle 10 is measured a plurality of times, the mounting table 40 is slightly moved to
The facing surfaces of the probe 60 and the probe needle 10 can be shifted.

This is to prevent the plate from being roughened so that an accurate contact resistance cannot be obtained when the contact is made a plurality of times at the same position. Of course, the shift distance and the number of times can be freely set. Similarly, after cleaning the cleaning material 50 a plurality of times, the cleaning position can be changed. This is to prevent foreign substances such as aluminum polished by the cleaning material 50 from reattaching.

After the contact resistance measurement step and the cleaning step are inspected a plurality of times based on a program stored in a recording medium in advance, cleaning is performed as necessary based on the resistance measurement of the probe needle. Do. If the measured contact resistance value is out of the specified range even after the specified number of cleanings, it is determined that the service life has expired and the probe needle is replaced. Equipment probe needle 10
Maintenance can be performed automatically, and the time for replacing the probe needle can be accurately determined.

[0030]

As described above, the probe device according to the present invention can be used to adjust the probe needle at an appropriate time based on the resistance value measured by contacting the probe needle with the conductive plate. Since the cleaning is performed, the number of times of cleaning can be minimized, so that the life of the probe card can be extended to the maximum and the life of the probe card can be easily determined.

Further, according to the present invention, since the cleaning time is determined based on the contact resistance value of the probe needle, the electrical characteristics of the test object can be ensured.

[Brief description of the drawings]

FIG. 1 is a configuration diagram showing a main part of a measurement system unit according to an embodiment of the present invention.

FIG. 2 is a configuration diagram showing a main part of a probe device according to one embodiment of the present invention.

FIG. 3 is an exploded perspective view of a probe device according to an embodiment of the present invention in a state where a plate and a cleaning material are attached.

FIG. 4 is a sectional view showing a mounting state of a plate and a cleaning material of the probe device according to one embodiment of the present invention.

FIG. 5 is a view showing an embodiment of a needle tip polishing by a contact resistance value between a probe needle and a plate of the probe device of the present invention.

FIG. 6 is a configuration diagram showing a main part of a conventional measurement system unit.

[Explanation of symbols]

 10 Probe needle 20 Probe needle fixing block 30 Probe card 40 Mounting table 50 Cleaning material 60 Plate for probe needle contact 70 Y rail 80 Y stage 90 X rail 100 X Stage 110 Chuck 120 Semiconductor wafer 130 Cap-shaped base 140 Set screw 150 Holding frame 160 Holding member 170 Lifting plate 180 Spring guide 190 Guide base 200 Spring plunger 210 Compression spring 230 Air cylinder 250 Control unit

Claims (6)

[Claims] 1. A probe apparatus for inspecting electrical characteristics of an object to be inspected by bringing a probe needle into contact with an electrode pad of the object to be inspected. A control unit is provided at a position, and a plate for measuring the contact resistance of the probe needle and a cleaning material for polishing the probe needle are provided on the control unit. A recording medium storing a program for evaluating whether the probe needle can be cleaned and the degree of wear of the probe needle based on the contact resistance value with the plate and judging the life of the probe needle is described above. A probe device provided with a control unit. 2. The probe device according to claim 1, wherein said plate for measuring the contact resistance of said probe needle is a detachable and conductive gold plate. Probe device. 3. The probe device according to claim 1, wherein a mounting table on which the object to be inspected is mounted is moved according to a preset contact resistance measurement and the number of times of cleaning. A probe device for performing the measurement and the cleaning by changing a contact position between the probe and the plate and the cleaning material. 4. The probe device according to claim 1, wherein the recording medium includes a timing for measuring a contact resistance between the plate and the probe needle, an applied voltage, and a measured contact resistance value. A specification value for evaluation, the number of repetitions of cleaning for judging the life of the probe needle, a change distance of a contact position between the probe needle and the plate and the cleaning material, and A probe apparatus characterized in that a program for setting an allowable number of times at the same contact position is recorded. 5. The probe device according to claim 1, wherein a program for performing a contact resistance measuring step and a cleaning step is stored in the recording medium in advance,
After inspecting the electrical characteristics of the object to be inspected a specified number of times, the resistance of the probe needle, cleaning and life judgment are performed based on the program, and the maintenance of the probe needle can be automatically performed. A probe device characterized in that: 6. An inspection method using a probe device, wherein a control unit is provided in the probe device, and the contact resistance value between the probe needle and a contact resistance measuring plate is provided by the control unit. Automatically performing maintenance of the probe needle by evaluating whether or not the probe needle is to be cleaned and evaluating the degree of wear of the probe needle based on the above. An inspection method using a probe device.