JPH10209663A - Electronic part container - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic part container which is hardly deformed, fixed by a simple operation and fixed without causing temperature rise. SOLUTION: An electronic part container incorporates a plane plate part 1 formed of metal and a cover part 2 formed of metal and constituted to cover the plate part 1. A bent part 1a which is formed by bending and raising two sides is provided to two sides of opposite end parts of the plate part 1, a projection part 1b which is almost rectangular toward above is provided to two places of an end part of the bent part 1a, and a slit 2a which is enough large to allow the projection part 1b to be fit therein is provided to a position corresponding to a place wherein the projection part 1b is formed in the cover part 2. The projection part 1b is fit in the slit 2a, the cover part 2 is put to cover the plate part 1 and a thickness of the projection part 1b is rolled, thereby the plate part 1 is fixed to the cover part 2 by caulking.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component housing for storing electronic components, and more particularly to an electronic component housing for storing an electronic component such as a vibrating gyroscope that detects a minute displacement.

[0002]

2. Description of the Related Art A conventional electronic component housing is disclosed, for example, in Japanese Utility Model Application Laid-Open No. 63-187398. This is because the slot (slit) provided in the shield cover (cover part) is inserted into the chassis base (plate part).
The shield cover is fixed to the chassis base by inserting a tongue piece (projecting portion) for caulking provided on the chassis base and twisting the tongue piece.

Further, as another general electronic component housing, there is a structure in which a cover and a plate are fixed by soldering.

[0004]

However, the above-mentioned conventional electronic component housing has the following problems. That is, in the tongue piece, that is, in the electronic component housing that twists the projection,
When the projection is twisted, a force is also applied to the shield cover, that is, the cover, and the chassis base, that is, the plate. Therefore, the cover and the plate are easily deformed, and are housed in the electronic component housing. The deformation of the cover and the plate, particularly the deformation of the plate, may be added to the electronic component as vibration noise. In particular, when the electronic component detects minute vibration such as a vibrating gyroscope, a slight deformation of the electronic component housing greatly affects the deterioration of characteristics (sensitivity). In addition, twisting the protruding portion requires time and labor, both in manual work and in automated equipment.

Further, in an electronic component housing using fixing by soldering, since the electronic component is housed in the electronic component housing and then soldered, the characteristics of the electronic component change as the temperature rises due to the soldering. In particular, when storing electronic components having low heat resistance or electronic components that are likely to be thermally deformed, soldering cannot be used to fix the cover and the plate.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to solve the above-mentioned problems, and it is difficult to deform the shape, can be fixed by a simple operation, and can be fixed without increasing the temperature. It is an object of the present invention to provide an electronic component housing that can be used.

[0007]

SUMMARY OF THE INVENTION In order to achieve the above object, the present invention is directed to a plate portion which is made of a flat plate and has a bent portion, a cover portion which covers the plate portion, a plate portion and a cover. An electronic component storage body comprising an electronic component housed by the portion, wherein the bent portion has a projection, the cover has a slit for fitting the projection, and the projection fitted to the slit is rolled. Then, the plate portion is caulked and fixed to the cover portion.

Thus, the work can be simplified because the cover portion of the electronic component housing and the plate portion can be fixed by caulking only by rolling the projection provided on the plate portion.

Further, the cover portion and the plate portion are fixed by caulking only by rolling the projection, so that an excessive force is hardly applied to the plate portion and the plate portion is hardly deformed.

Furthermore, since no solder is used for fixing the cover portion and the plate portion, the fixing can be performed without increasing the temperature.

[0011]

Embodiments of the present invention will be described below in detail with reference to the drawings. The electronic component housing shown in FIGS. 1 to 4 includes a flat plate portion 1 made of metal and a substantially box-shaped cover portion 2 made of metal and configured to cover the plate portion 1. 2 at the opposite end of the plate 1
The side is provided with a bent portion 1a formed by bending and standing two sides. At the two end portions of the bent portion 1a, substantially rectangular protrusions 1b are provided upward. The cover 2 is provided with a slit 2a having a length substantially equal to the width of the protrusion 1b at a position corresponding to the position where the protrusion 1b is formed.

In this embodiment, an electronic component is accommodated therein. In this embodiment, a vibrator 10 constituting a vibrating gyroscope is accommodated in a state supported by a support member 11 and fixed to a mounting board 12. The mounting substrate 12 is placed and fixed on the mounting portion 1c on the plate portion 1.

Here, with the vibrator 10 mounted and fixed, the projection 1b is fitted into the slit 2a, and the cover 2 is covered so as to cover the plate 1.

As shown in FIGS. 2, 3 and 4, the thickness of the projection 1b near the center thereof is rolled to extend the projection 1b in the width direction, thereby obtaining the width of the projection 1b. The plate part 1 is caulked and fixed to the cover part 2 so that the length in the direction is longer than the length in the longitudinal direction of the slit 2a, and the electronic component housing is formed.

The electronic component housing configured as described above is
Since the plate portion 1 and the cover portion 2 can be caulked and fixed only by rolling the thickness of the projection portion 1b, the plate portion 1 and the cover portion 2 can be fixed in comparison with the conventional operation of twisting the projection portion.
It can be easily fixed without applying excessive force to it. Also, since it is a simple operation of rolling the thickness of the projection, compared to the conventional operation of twisting the projection,
In manual work, work becomes very easy, and also in the case of work using an automatic device, the configuration of the device can be simplified. Also, since no soldering is required,
The plate portion and the cover portion can be fixed without increasing the temperature.

In the above embodiment, the length in the width direction is increased by rolling the vicinity of the center of the projection 1b. However, although not particularly shown, the end of the projection 1b is rolled. By doing so, the length in the width direction of the tip of the protrusion 1b may be increased.

Further, the positions and the number of the bent portions and the projections can be appropriately changed according to the size of the electronic component housing and the necessity of the shielding effect of the electronic component housing.

Further, in the above embodiment, the vibration gyro was shown as the electronic component. However, it is needless to say that the present invention is not limited to the vibration gyro, and that the present invention can be applied to electronic components in general.

[0019]

As described above, in the electronic component housing according to the present invention, the cover portion and the plate portion of the electronic component housing can be fixed by caulking simply by rolling the thickness of the projection provided on the plate portion. The work becomes simple, and the cost can be reduced.

Further, the cover and the plate are fixed by caulking only by rolling the thickness of the projection, so that an excessive force is hardly applied to the plate and the plate is hardly deformed. Therefore, the stored electronic components vibrate (deform).
No noise is transmitted, and the characteristics of the electronic component are always stable.

Further, since no solder is used for fixing the cover and the plate, the fixing can be performed without increasing the temperature, and there is no possibility that the electronic parts are thermally deformed or deteriorated by heat. The reliability of the parts is also improved.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view showing an electronic component housing according to an embodiment of the present invention.

FIG. 2 is a perspective view showing an electronic component housing according to the embodiment of the present invention.

FIG. 3 is a sectional view taken along line AA in FIG. 2;

FIG. 4 is a partial plan view showing the electronic component housing according to the embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Plate part 1a Bend part 1b Projection part 2 Cover part 2a Slit

Claims (1)

[Claims] 1. An electronic component comprising: a plate portion formed of a flat plate and having a partly bent portion; a cover portion covering the plate portion; and an electronic component housed by the plate portion and the cover portion. In the storage body, the bent portion has a projection, the cover has a slit for fitting the projection, and the projection fitted in the slit is rolled to form the plate. An electronic component housing, which is fixed by caulking to the cover.