JPH10247766A - Circuit board - Google Patents

Circuit board

Info

Publication number
JPH10247766A
JPH10247766A JP9065538A JP6553897A JPH10247766A JP H10247766 A JPH10247766 A JP H10247766A JP 9065538 A JP9065538 A JP 9065538A JP 6553897 A JP6553897 A JP 6553897A JP H10247766 A JPH10247766 A JP H10247766A
Authority
JP
Japan
Prior art keywords
plating layer
circuit board
plating
hole
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP9065538A
Other languages
Japanese (ja)
Inventor
Yoshitaka Inoue
善貴 井上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alps Alpine Co Ltd
Original Assignee
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Priority to JP9065538A priority Critical patent/JPH10247766A/en
Priority to GB9802869A priority patent/GB2322974A/en
Priority to FR9802353A priority patent/FR2760313B1/en
Priority to KR1019980006707A priority patent/KR19980079794A/en
Priority to CN98100591A priority patent/CN1091339C/en
Priority to DE19808932A priority patent/DE19808932C2/en
Publication of JPH10247766A publication Critical patent/JPH10247766A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09181—Notches in edge pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

PROBLEM TO BE SOLVED: To prevent burrs, peel-off or the like from occurring in a circuit board by a method wherein a first plating layer and a second plating layer of material higher in hardness than that of the first plating layer are formed on a side through-hole. SOLUTION: Side through-holes 5 are provided to the edge faces 4 of a circuit board 1. A first plating layer 5a of copper as a base layer and a second plating layer 5b of material such as nickel higher in hardness than that of the first plating layer are formed on the side through-holes 5. A third plating layer 5c of material such as gold or silver excellent in solderability and comparatively small in thickness is formed on the second plating layer 5b of nickel. By this setup, the second plating layer 5b is set higher in hardness than the first plating layer 5a, so that the second plating layer 5b restrains burrs or the like from occurring in the cut surface of the first plating layer 5a.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【発明の属する技術分野】本発明は、回路基板に関し、
詳しくはサイドスルーホール構造を備えた回路基板に関
する。TECHNICAL FIELD The present invention relates to a circuit board,
More specifically, the present invention relates to a circuit board having a side through hole structure.

【０００２】[0002]

【従来の技術】回路基板は、多くの電気機器製品に多用
されており、小型化・軽量化の傾向のために回路基板の
集積度は、日々高められている。そして、近年では、例
えばテレビセット側のメイン基板となるマザー回路基板
上に比較的小型の回路基板を載置して、重ね合わせによ
り形成されたマザー回路基板が用いられている。2. Description of the Related Art Circuit boards are widely used in many electric equipment products, and the degree of integration of circuit boards is increasing day by day due to the trend of miniaturization and weight reduction. In recent years, for example, a relatively small circuit board is mounted on a mother circuit board serving as a main board on a television set side, and a mother circuit board formed by overlapping is used.

【０００３】このとき載置される小型の回路基板を、マ
ザー回路基板上に電気的に接続する方法のひとつは、回
路基板の端面に形成されたサイドスルーホール部によっ
て接続端子を形成し、この接続端子を用いてマザー回路
基板の回路パターンと接続を行うことができる。One of the methods for electrically connecting a small circuit board to be mounted on the mother circuit board at this time is to form connection terminals by side through holes formed in the end face of the circuit board. The connection with the circuit pattern of the mother circuit board can be performed using the connection terminal.

【０００４】ここで従来の回路基板を図５〜図８に基づ
いて説明する。図５は、従来の回路基板１０、図６は、
図５の従来の回路基板のサイドスルーホール部のＢ−Ｂ
線による要部断面図、図７は、従来の回路基板に係わ
り、その製造を説明するための回路基板母材の上面図、
図８は、図７のＤ部の拡大上面図である。まず、図５に
示すように、従来の回路基板１０は、絶縁材料から成
り、略方形であって、その上面１０ａには、所定の回路
パターン２０が形成されており、該回路パターン２０に
は、チップ部品３０やディスクリート部品（図示せず）
などが載置され、所定の機能を備えた回路基板１０を構
成している。Here, a conventional circuit board will be described with reference to FIGS. FIG. 5 shows a conventional circuit board 10, and FIG.
BB of the side through hole portion of the conventional circuit board of FIG.
FIG. 7 is a top view of a circuit board base material related to a conventional circuit board and illustrating its manufacture,
FIG. 8 is an enlarged top view of a portion D in FIG. First, as shown in FIG. 5, a conventional circuit board 10 is made of an insulating material, has a substantially rectangular shape, and has a predetermined circuit pattern 20 formed on an upper surface 10a thereof. , Chip components 30 and discrete components (not shown)
And the like are mounted thereon, and constitute a circuit board 10 having a predetermined function.

【０００５】また、該回路基板１０は、回路基板母材Ｂ
を分割することによって形成される。また、回路基板１
０の端面４０には、スルーホール７０（図８参照）によ
って形成された複数個の例えば半円状や円弧状などのサ
イドスルーホール部５０が形成されている。前記スルー
ホール７０は、銅メッキ層５０ａ、半田コーティング層
５０ｂがそれぞれ２分割され、サイドスルーホール部５
０となる。また、図５、図８に示すように、従来のこの
回路基板１０のサイドスルーホール部５０には、下地と
して銅メッキ層５０ａが被着されており、該銅メッキ層
５０ａの上には、半田からなる半田コーティング層５０
ｂが、比較的厚い厚さ（例えば約２０μｍ厚）で形成さ
れている。The circuit board 10 is made of a circuit board base material B.
Is formed by dividing Also, the circuit board 1
A plurality of side through-hole portions 50, for example, semi-circular or arc-shaped, formed by the through-hole 70 (see FIG. 8) are formed on the end surface 40 of the zero. The through-hole 70 is formed by dividing the copper plating layer 50a and the solder coating layer 50b into two parts, respectively.
It becomes 0. As shown in FIGS. 5 and 8, a copper plating layer 50a is applied as a base to the side through-hole portion 50 of the conventional circuit board 10, and on the copper plating layer 50a, Solder coating layer 50 made of solder
b is formed with a relatively large thickness (for example, about 20 μm thick).

【０００６】なお、該半田コーティング層５０ｂは、図
示していないマザー回路基板の回路パターンに半田によ
ってサイドスルーホール部５０を接続する際に、半田付
け性を良くするために設けられている。また、前記スル
ーホール７０の分割は、回転刃を用いての切断によって
行われる。The solder coating layer 50b is provided for improving the solderability when the side through hole 50 is connected to a circuit pattern of a mother circuit board (not shown) by soldering. The division of the through hole 70 is performed by cutting using a rotary blade.

【０００７】[0007]

【発明が解決しようとする課題】しかしながら、図７に
示すように、上述の如き構成の回路基板１０では、同時
に同一基板にて形成され、それぞれが接続された形態で
ある複数個の回路基板１０、・・からなる回路基板母材
Ｂを、切断線６０ａ、６０ｂにて個々の回路基板１０に
切断し分割する際に、回転刃を備えたカッター（図示せ
ず）によって切断するのであるが、この切断時には、サ
イドスルーホール部５０となるスルーホール７０に形成
された半田コーティング層５０ｂ（図５参照）の粘性が
大きいことから回転刃に半田がまつわりつくことが生じ
る。However, as shown in FIG. 7, in the circuit board 10 having the above-described structure, a plurality of circuit boards 10 which are simultaneously formed on the same substrate and are connected to each other. When the circuit board base material B composed of... Is cut into individual circuit boards 10 along the cutting lines 60a and 60b and divided, the cutting is performed by a cutter (not shown) having a rotary blade. At the time of this cutting, the solder coating layer 50b (see FIG. 5) formed in the through-hole 70 which becomes the side through-hole portion 50 has a large viscosity, so that the solder may be entangled with the rotary blade.

【０００８】また、半田コーティング層５０ｂは、塑性
変形し易く粘度が大きいので完全に切断されにくく切り
粉が落下し難い。また、切り粉が回転刃に粘り付き回転
刃の切れ味が悪くなる。そして、回転刃の切れ味が悪い
ので銅メッキ層５０ａの切り口にバリ、メクレが生じ、
また、半田コーティング層５０ｂは柔らかいので、これ
らのバリ、メクレを許してしまうという問題点がある。Further, since the solder coating layer 50b is easily deformed plastically and has a high viscosity, it is difficult to cut completely, and it is difficult for chips to fall. Further, the cutting powder sticks to the rotary blade, and the rotary blade becomes less sharp. Then, since the sharpness of the rotary blade is poor, burrs and burrs occur on the cut surface of the copper plating layer 50a,
In addition, since the solder coating layer 50b is soft, there is a problem that these burrs and burrs are allowed.

【０００９】この銅メッキ層５０ａと半田コーティング
層５０ｂとから生じる比較的大きなバリは、端面４０に
サイドスルーホール部５０を備えた、この回路基板１０
を、マザー回路基板（図示せず）に載置する際に、時と
して、この比較的大きなバリが回路基板１０のサイドス
ルーホール部５０から剥がれ、例えばマザー回路基板上
の他の回路パターンに当接して、回路間を短絡すること
があり、問題となる。The relatively large burrs generated from the copper plating layer 50a and the solder coating layer 50b are caused by the circuit board 10 having a side through hole 50 on the end face 40.
When the substrate is mounted on a mother circuit board (not shown), the relatively large burrs are sometimes peeled off from the side through-hole portions 50 of the circuit board 10 to be applied to other circuit patterns on the mother circuit board, for example. Contact may cause a short circuit between the circuits, causing a problem.

【００１０】[0010]

【課題を解決するための手段】本発明の回路基板は、絶
縁基板と、該絶縁基板の端面に設けられたサイドスルー
ホール部とから成り、該サイドスルーホール部には第一
のメッキ層と、該第一のメッキ層の上に第一のメッキ層
よりも硬度の高い材料からなる第二のメッキ層とが形成
されていることである。A circuit board according to the present invention comprises an insulating substrate and a side through-hole provided on an end face of the insulating substrate. A second plating layer made of a material having a higher hardness than the first plating layer is formed on the first plating layer.

【００１１】また、本発明では、第一のメッキ層が銅メ
ッキで、且つ第二のメッキ層がニッケルメッキであるこ
とである。In the present invention, the first plating layer is copper plating, and the second plating layer is nickel plating.

【００１２】また、本発明では、第二のメッキ層の上に
第三のメッキ層として金メッキが形成されていることで
ある。Further, in the present invention, gold plating is formed as a third plating layer on the second plating layer.

【００１３】[0013]

【発明の実施の形態】本発明を図１〜図４に基づいて説
明する。本発明は、図１に示すように、絶縁材料から成
る回路基板１は、略方形である絶縁基板１ａから成り、
その上面１ｂには、所望の回路パターン２が設けられ、
該回路パターン２には、例えば抵抗やコンデンサなどの
チップ部品３やディスクリート部品（図示せず）などが
載置され、所望の機能を備えた回路基板１が形成されて
いる。DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described with reference to FIGS. In the present invention, as shown in FIG. 1, a circuit board 1 made of an insulating material is made of an insulating board 1a having a substantially rectangular shape.
A desired circuit pattern 2 is provided on the upper surface 1b,
A chip component 3 such as a resistor and a capacitor, a discrete component (not shown), and the like are mounted on the circuit pattern 2, and a circuit board 1 having a desired function is formed.

【００１４】前記回路基板１の端面４には、例えば半円
状や円弧状などの複数個のサイドスルーホール部５、・
・が形成されている。また、図２に示すように、このサ
イドスルーホール部５、・・には、下地としての例えば
銅メッキなどからなる第一のメッキ層５ａと、該第一の
メッキ層５ａの上に、例えばニッケルメッキなどの、前
記第一のメッキ層５ａよりも硬度の高い材料からなる第
二のメッキ層５ｂとが形成されている。なお、銅メッ
キ、ニッケルメッキの硬度は、メッキする際の条件や、
メッキ素材の成分によって異なるが、一般に銅メッキよ
りもニッケルメッキの方が高い。The end face 4 of the circuit board 1 has a plurality of side through holes 5, for example, semicircular or arcuate.
・ Is formed. Further, as shown in FIG. 2, the side through-hole portions 5,... Are provided with a first plating layer 5a made of, for example, copper plating as a base, and a first plating layer 5a on the first plating layer 5a. A second plating layer 5b made of a material having a higher hardness than the first plating layer 5a, such as nickel plating, is formed. The hardness of copper plating and nickel plating depends on the plating conditions,
Although it depends on the components of the plating material, nickel plating is generally higher than copper plating.

【００１５】また、前記第二のメッキ層５ｂの上には、
例えば金や銀などの半田付け性の良い材料からなる第三
のメッキ層５ｃが、比較的薄く（例えば数μｍ厚）形成
されている。なお、前記サイドスルーホール部５、・・
は、マザー回路基板（図示せず）の回路パターンとの接
続端子部となる。On the second plating layer 5b,
For example, the third plating layer 5c made of a material having good solderability such as gold or silver is formed relatively thin (for example, several μm thick). In addition, the said side through-hole part 5, ...
Are connection terminals for connection with circuit patterns on a mother circuit board (not shown).

【００１６】また、図３、図４に示すように、回路基板
１を製造する場合、この回路基板母材Ａの縦切断線６ａ
上には、複数個の例えば円形状や長円形状などのスルー
ホール７が設けられており、該スルーホール７には、前
記第一、第二及び第三のメッキ層５ａ、５ｂ、５ｃが形
成されている。そして、該スルーホール７は、回転刃に
よる切断によって分割され、それぞれサイドスルーホー
ル部５を有する回路基板１が製造される。As shown in FIGS. 3 and 4, when manufacturing the circuit board 1, a vertical cutting line 6a of the circuit board base material A is used.
On the upper side, a plurality of through holes 7 having, for example, a circular shape or an oval shape are provided. In the through holes 7, the first, second, and third plating layers 5a, 5b, 5c are provided. Is formed. Then, the through holes 7 are divided by cutting with a rotary blade, and the circuit board 1 having the respective side through hole portions 5 is manufactured.

【００１７】また、図３に示すように、前記回路基板１
は、同一基板に複数行×複数列に配置された複数個（例
えば６行×５列で３０個）の回路基板１が連結されて形
成された回路基板母材Ａを、それぞれ複数本の縦切断線
６ａと横切断線６ｂとに沿って、回転刃を備えたカッタ
ー（図示せず）にて切断することによって、個別の前記
回路基板１が製造されている。なお、回路基板母材Ａの
両端部には、回路基板母材Ａを治具（図示せず）よって
支持するための一対の耳部８、８が設けられている。Further, as shown in FIG.
Means that a plurality of (for example, 30 in 6 rows × 5 columns) circuit boards 1 arranged in a plurality of rows × a plurality of columns are connected to each other, and a plurality of circuit board preforms A are formed on each of the plurality of vertical boards. The individual circuit board 1 is manufactured by cutting along a cutting line 6a and a horizontal cutting line 6b with a cutter (not shown) having a rotary blade. At both ends of the circuit board base material A, a pair of ears 8 for supporting the circuit board base material A with a jig (not shown) is provided.

【００１８】[0018]

【発明の効果】本発明の回路基板は、端面に形成された
サイドスルーホール部に、第一のメッキ層（例えば銅メ
ッキ）と、該第一のメッキ層の上に第一のメッキ層より
も硬度の高い材料からなる第二のメッキ層（例えばニッ
ケルメッキ）とが形成されていることから、回路基板母
材のスルーホールが形成された縦切断線を、回転刃によ
って切断する際に、第二のメッキ層は、回転刃に張り付
き、また粉末状態となって切断される。また、第二のメ
ッキ層は、半田コーティング層よりも粘度が低いので回
転刃に張り付きにくく、回転刃の切れ味を損なわない。
また、第二のメッキ層は、第一のメッキ層よりも硬度が
高いので、仮に第一のメッキ層の切断部にバリ、メクレ
が生じようとしても、それを抑える効果がある。According to the circuit board of the present invention, a first plating layer (for example, copper plating) is formed on a side through-hole portion formed on an end face, and a first plating layer is formed on the first plating layer. Also, since a second plating layer (for example, nickel plating) made of a material having high hardness is formed, when a vertical cutting line having a through hole formed in a circuit board base material is cut by a rotary blade, The second plating layer is attached to the rotary blade and cut into a powder state. Further, the second plating layer has a lower viscosity than the solder coating layer, so that it does not easily stick to the rotary blade and does not impair the sharpness of the rotary blade.
In addition, since the second plating layer has a higher hardness than the first plating layer, even if burrs and rounds occur at the cut portion of the first plating layer, they have an effect of suppressing them.

【００１９】このため、回転刃での回路基板母材の切断
では、第一、第二のメッキ層におけるバリの発生は比較
的少なく、また、発生しても比較的小さなバリであり、
このバリは、回路基板から剥がれることはなく、よって
剥がれたバリによる回路間の短絡（ショート）は生じる
ことがなく、安定した性能の回路基板を提供できるとい
う効果を奏する。For this reason, when the circuit board base material is cut by the rotary blade, the generation of burrs in the first and second plating layers is relatively small, and even if it occurs, the burrs are relatively small.
The burrs do not peel off from the circuit board, so that short-circuits between circuits due to the burrs do not occur, and an effect that a circuit board with stable performance can be provided.

【００２０】また、本発明では、第二のメッキ層の上に
第三のメッキ層として金メッキや銀メッキなどの第二の
メッキ層よりも半田付け性が良い金属メッキが形成され
ていることから、金メッキは、半田との相性がよく、よ
って半田付け性の良い接続端子部を構成するサイドスル
ーホール部を提供することができるという効果を奏す
る。また、第三のメッキ層は、第二のメッキ層に比べて
格段に薄いので、その硬度や粘度は切断に対して影響を
与えないという効果を奏する。Further, in the present invention, since the third plating layer is formed on the second plating layer by metal plating such as gold plating or silver plating, which has better solderability than the second plating layer. Gold plating has an effect that it has good compatibility with solder and can provide a side through-hole portion which forms a connection terminal portion having good solderability. Further, since the third plating layer is much thinner than the second plating layer, there is an effect that its hardness and viscosity do not affect cutting.

【図面の簡単な説明】[Brief description of the drawings]

【図１】本発明の実施の形態の回路基板の斜視図であ
る。FIG. 1 is a perspective view of a circuit board according to an embodiment of the present invention.

【図２】図１の本発明の実施の形態の回路基板のサイド
スルーホール部のＡ−Ａ線による要部断面図である。FIG. 2 is a cross-sectional view of an essential part taken along line AA of a side through-hole portion of the circuit board according to the embodiment of FIG. 1;

【図３】本発明の回路基板に係わり、その製造を説明す
るための回路基板母材の上面図である。FIG. 3 is a top view of a circuit board base material for explaining the manufacture of the circuit board according to the present invention.

【図４】本発明の図３のＣ部の拡大上面図である。FIG. 4 is an enlarged top view of a portion C in FIG. 3 of the present invention.

【図５】従来の回路基板の斜視図である。FIG. 5 is a perspective view of a conventional circuit board.

【図６】図５の従来の回路基板のサイドスルーホール部
のＢ−Ｂ線による要部断面図である。6 is a cross-sectional view of a main part of a side through-hole portion of the conventional circuit board of FIG. 5 taken along line BB.

【図７】従来の回路基板に係わり、その製造を説明する
ための回路基板母材の上面図である。FIG. 7 is a top view of a circuit board base material for explaining a conventional circuit board and its manufacture.

【図８】図７のＤ部の拡大上面図である。FIG. 8 is an enlarged top view of a portion D in FIG. 7;

【符号の説明】[Explanation of symbols]

１ 回路基板 １ａ 絶縁基板 ２ 回路パターン ５ サイドスルーホール部 ５ａ 第一のメッキ層（銅メッキ） ５ｂ 第二のメッキ層（ニッケルメッキ） ５ｃ 第三のメッキ層（金メッキ） DESCRIPTION OF SYMBOLS 1 Circuit board 1a Insulating board 2 Circuit pattern 5 Side through hole 5a First plating layer (copper plating) 5b Second plating layer (nickel plating) 5c Third plating layer (gold plating)

Claims (3)

【特許請求の範囲】[Claims] 【請求項１】 絶縁基板と、該絶縁基板の端面に設けら
れたサイドスルーホール部とから成り、該サイドスルー
ホール部には第一のメッキ層と、該第一のメッキ層の上
に、半田よりも粘度が低く、且つ第一のメッキ層よりも
硬度の高い材料からなる第二のメッキ層とが形成されて
いることを特徴とする回路基板。1. An insulating substrate, comprising a side through-hole portion provided on an end surface of the insulating substrate, wherein the side through-hole portion has a first plating layer, A circuit board comprising: a second plating layer formed of a material having a lower viscosity than solder and a higher hardness than the first plating layer. 【請求項２】 前記第一のメッキ層が銅メッキで、且つ
第二のメッキ層がニッケルメッキであることを特徴とす
る請求項１記載の回路基板。2. The circuit board according to claim 1, wherein said first plating layer is copper plating, and said second plating layer is nickel plating. 【請求項３】 前記第二のメッキ層の上に第三のメッキ
層として前記第二のメッキ層よりも半田付け性の良い金
属メッキが形成されていることを特徴とする請求項１又
は２記載の回路基板。3. A metal plating having a better solderability than the second plating layer is formed as a third plating layer on the second plating layer. The described circuit board.
JP9065538A 1997-03-03 1997-03-03 Circuit board Withdrawn JPH10247766A (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP9065538A JPH10247766A (en) 1997-03-03 1997-03-03 Circuit board
GB9802869A GB2322974A (en) 1997-03-03 1998-02-12 Circuit board having edge vias
FR9802353A FR2760313B1 (en) 1997-03-03 1998-02-26 PRINTED CARD
KR1019980006707A KR19980079794A (en) 1997-03-03 1998-03-02 Circuit board
CN98100591A CN1091339C (en) 1997-03-03 1998-03-02 Return circuit basilar plate
DE19808932A DE19808932C2 (en) 1997-03-03 1998-03-03 Circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9065538A JPH10247766A (en) 1997-03-03 1997-03-03 Circuit board

Publications (1)

Publication Number Publication Date
JPH10247766A true JPH10247766A (en) 1998-09-14

Family

ID=13289903

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9065538A Withdrawn JPH10247766A (en) 1997-03-03 1997-03-03 Circuit board

Country Status (6)

Country Link
JP (1) JPH10247766A (en)
KR (1) KR19980079794A (en)
CN (1) CN1091339C (en)
DE (1) DE19808932C2 (en)
FR (1) FR2760313B1 (en)
GB (1) GB2322974A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100451926B1 (en) * 2002-10-14 2004-10-08 타이코에이엠피 주식회사 The method to form side metalline for division high current of printed circuit board for car junction box and printed circuit board for car junction box manufactured by this method
KR100495211B1 (en) * 2002-11-25 2005-06-14 삼성전기주식회사 Ceramic multilayer board and its manufacture
JP2017130591A (en) * 2016-01-22 2017-07-27 日立オートモティブシステムズ株式会社 Automotive electronic modules, card edge connectors, and connectors

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2346734B (en) 1999-01-28 2003-09-24 Marconi Electronic Syst Ltd Optical interface arrangement
TW498602B (en) * 2000-05-30 2002-08-11 Alps Electric Co Ltd Circuit unit
TW527856B (en) * 2001-02-16 2003-04-11 Siemens Dematic Electronics As Interconnection circuit and method of fabricating the same
DE10224057A1 (en) * 2002-05-31 2004-01-08 Robert Bosch Gmbh Ceramic electronics device, of multiple layer construction, has internal electrical connections provided by external conductor grooves, transverse to the layer edges
DE10325550B4 (en) 2003-06-05 2007-02-01 Novar Gmbh Electrical contacting method
CN1324932C (en) * 2003-10-16 2007-07-04 光宝科技股份有限公司 Printed circuit boards with anti-cutting flash
JP4850596B2 (en) * 2006-06-19 2012-01-11 株式会社 日立ディスプレイズ Liquid crystal display
EP3512313A1 (en) * 2018-01-16 2019-07-17 ZKW Group GmbH Printed circuit board assembly
KR102867266B1 (en) 2020-10-20 2025-10-01 삼성전자주식회사 Module substrate and semiconductor module including the same

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1085209B (en) * 1959-12-12 1960-07-14 Dielektra Ag Printed electrical circuit board
US3747210A (en) * 1971-09-13 1973-07-24 Int Standard Electric Corp Method of producing terminal pins of a printed circuit board
GB8412674D0 (en) * 1984-05-18 1984-06-27 British Telecomm Integrated circuit chip carrier
US5060369A (en) * 1990-01-31 1991-10-29 Ford Motor Company Printed wiring board construction
US5235139A (en) * 1990-09-12 1993-08-10 Macdermid, Incorprated Method for fabricating printed circuits
JPH07122831A (en) * 1993-10-25 1995-05-12 Taiyo Yuden Co Ltd Circuit board and manufacture thereof

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100451926B1 (en) * 2002-10-14 2004-10-08 타이코에이엠피 주식회사 The method to form side metalline for division high current of printed circuit board for car junction box and printed circuit board for car junction box manufactured by this method
KR100495211B1 (en) * 2002-11-25 2005-06-14 삼성전기주식회사 Ceramic multilayer board and its manufacture
JP2017130591A (en) * 2016-01-22 2017-07-27 日立オートモティブシステムズ株式会社 Automotive electronic modules, card edge connectors, and connectors
WO2017126283A1 (en) * 2016-01-22 2017-07-27 日立オートモティブシステムズ株式会社 Vehicle-mounted electronic module, card edge connector, and connector
US10601158B2 (en) 2016-01-22 2020-03-24 Hitachi Automotive Systems, Ltd. Vehicle-mounted electronic module, card edge connector, and connector

Also Published As

Publication number Publication date
FR2760313A1 (en) 1998-09-04
FR2760313B1 (en) 2000-09-22
GB9802869D0 (en) 1998-04-08
CN1195960A (en) 1998-10-14
CN1091339C (en) 2002-09-18
DE19808932A1 (en) 1998-09-10
DE19808932C2 (en) 2001-02-22
GB2322974A (en) 1998-09-09
KR19980079794A (en) 1998-11-25

Similar Documents

Publication Publication Date Title
JP3060896B2 (en) Structure of bump electrode
JPH10247766A (en) Circuit board
US6609915B2 (en) Interconnect for electrically connecting a multichip module to a circuit substrate and processes for making and using same
JP2001160630A (en) Chip type semiconductor device
JPH10313157A (en) Printed board
US5181317A (en) Method of making an engineering change to a printed wiring board
JPH05102621A (en) Conductive pattern
JPH08107264A (en) High density wiring board and manufacturing method thereof
JPH06296076A (en) Side face electrode forming method of smd module
CN210016697U (en) Flexible circuit board and electronic device
JPH0750464A (en) Cut-through hole substrate and manufacturing method thereof
JP2819321B2 (en) Electronic component mounting substrate and method of manufacturing the electronic component mounting substrate
JPH01183192A (en) Flexible printed wiring board and manufacture thereof
JPH0443698A (en) Multilayer laminated wiring board
JP4051751B2 (en) Manufacturing method for terminals of electronic components
JPH1051094A (en) Printed wiring board and manufacturing method thereof
JP2003060323A (en) Flexible circuit board having projecting terminal
JP2600774B2 (en) Manufacturing method of square electronic components
JP2712344B2 (en) Manufacturing method of square electronic components
JP2000012772A (en) Manufacturing method of integrated semiconductor device
JP2008103462A (en) Chip type network resistor, surface mounting component, and method for manufacturing the same
JPH03255691A (en) Printed wiring board
JPH03203208A (en) Chip-shaped electronic parts
JPS6114790A (en) Pc board device and method of producing same
JP2020155694A (en) Double-sided wiring board

Legal Events

Date Code Title Description
A300 Application deemed to be withdrawn because no request for examination was validly filed

Free format text: JAPANESE INTERMEDIATE CODE: A300

Effective date: 20040511