JPH10255942A - Ic socket - Google Patents

Abstract

PROBLEM TO BE SOLVED: To easily perform the attachment and detachment of a package body even when outer form dimensions of package bodies are uneven by moving a receiving member by a projection member provided on a lid member according to the motion of closing the opening of a socket body by the lid member, and bringing the receiving member into contact with four corners of the package body. SOLUTION: The package body 8 of an IC is placed on a base 2 in the state where a lid 7 is opened. When the lid 7 connected to a body 6 by a hinge pin starts to close, the locking part 6a of the body 6 is fitted into the recessed part 7a of the lid 7 to ensure the positions of the lid 7 and the body 6. When the lid 7 starts to close the opening of the body 6, the tapered surface 3a of a projection member 4 makes contact with the tapered surface 1a on the back surface side of a receiving member 1, and the projection member 3 presses the receiving member 1. When the lid 7 is perfectly closed, the swollen part of the receiving member 1 makes contact with the package body 6 or a lead. The lid 7 is fixed by a clamp 10 to inspect the IC package.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC socket for placing an IC package on a base and making an electrical contact with a lead extending from a side surface of the package to perform an electrical test.

[0002]

2. Description of the Related Art In general, there are various types of IC packages, and at present, there are many ICs having different package sizes depending on the number of pins and the number of leads.
As described above, when inspecting the same type of IC having different package bodies, an IC socket is prepared and inspected according to the size of the package. However, there is a problem in that the number of IC sockets for the measurement increases, so that the inspection cost and management man-hour also increase.

An IC socket that solves this problem is disclosed in Japanese Utility Model Laid-Open No. 5-53177. In this IC socket, a mounting table of an IC package is detachably mounted on a socket base, and IC mounting is provided at four corners of the mounting table.
This is a configuration in which a receiving member for a package is provided. Then, several types of mounting tables having different positions and sizes of the receiving members are prepared for receiving IC packages of various sizes, and the mounting tables are set in accordance with the sizes of the IC packages to be inspected. It is characterized in that it is mounted on a vehicle and inspected.

[0004]

Although the above-mentioned conventional IC socket can be applied to inspection of ICs having different package sizes, even packages of the same size vary in size due to the result of resin sealing. For this reason, it is difficult to insert a slightly larger package, and even if it is inserted, it takes time to remove the package, which lowers the efficiency of the package attaching / detaching operation.

In the case of an IC having an LCC structure having a plurality of leads extending from the four sides of the package and extending along the side walls and bent inside the lower surface, the leads of the IC package rise up side by side around the mounting table of the IC socket. There are a plurality of electrical contacts that make contact. In addition to the electric contacts, positioning receiving members are provided for pressing the four corners of the IC package. The receiving member is formed of a plate member having a spring property in order to absorb a variation in resin, and is disposed slightly inward of the electric contact. For this reason,
When mounting the IC package on the mounting base of the IC socket, if the package is slightly larger, the push-in force is increased, and once mounted, the IC package is firmly mounted, so it is difficult to remove the IC package and it takes time. Occurs. In particular, the package tends to be thinner, and this problem has become more and more serious.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide an IC socket in which a package can be easily attached and detached in a short time even if the external dimensions vary.

[0007]

SUMMARY OF THE INVENTION The present invention is characterized in that a socket body having a base into which an IC package is placed and on which the package is mounted, and that the package is disposed around the base and includes the base. A plurality of electrical contacts that come into contact with the leads around the socket, and a locking mechanism that presses and holds the package body placed on the base, closes an opening of the socket body, and determines a relative position with respect to the socket body. A leaf spring-shaped receiving member disposed adjacent to the electric contact at four corners of the package body; and the receiving member accompanying an operation of closing the opening of the socket body with the lid member. And a projecting member protruding from the lid member while pressing the back surface of the package member to move the receiving member so that the receiving member contacts four corners of the package body. It is preferable that the receiving member is an electric contact that comes into contact with the lead.

[0008]

Next, the present invention will be described with reference to the drawings.

FIG. 1 shows an IC according to an embodiment of the present invention.
It is a top view of a socket. As shown in FIG. 1, the IC socket is separated from the outer periphery of the package body 8 of the IC mounted on the base 2 of the main body 6 so that the tongue piece comes outside the outer shape of the IC spring. Have been placed. The receiving member 1 is provided adjacent to the contacts 5 at the four corners of the package body 8. Also, as will be described later, when the lid 7 is closed, the back surface of the receiving member 1 is pushed and moved by the projection member 3 provided on the lid 7 with the operation, and the receiving member 1 comes into contact with the four corners of the package body 8 and the package is closed. The main body 8 is fixed and positioned.

Further, the receiving member 1 does not need to be specially provided.
The contacts at the four corners of the package body may be used.
By using the receiving member 1 which also serves as a contact as described above, the space in the recess of the main body 6 of the socket can be effectively used, and the present invention can be applied to a multi-pin IC. The contact 5 that is in electrical contact with the lead 9 interposed between the receiving members 1 is a package 8
Is designed to have a spring constant so as to have a constant contact pressure when mounted on the base 2.

FIGS. 2A and 2B are cross-sectional views for explaining the operation of attaching and detaching the IC to and from the IC socket shown in FIG. First, as shown in FIG. 2A, the IC package 8 is placed on the base 2 with the lid 7 opened. At this time, the contact 5 indicated by a broken line is deformed outward by the pushing operation of the package 8, and further, the contact 5 springs back by the pushing operation, and the bulging portion of the contact 5 presses the lead of the package 8.

Next, as shown in FIG. 2 (a) to FIG. 2 (b), first, when the lid 7 connected to the main body 6 is closed with a loose hinge pin, the locking portion 6a of the main body 6 is first depressed. 7a to secure the position of the lid 7 and the body 6 to each other. Next, as shown in FIG. 2 (b), when the lid 7 starts closing the opening of the main body 6, the tapered surface 3 a of the projection member 3 and the tapered surface 1 a on the back side of the receiving member 1 come into contact with each other. With the closing operation, the protrusion member 3 pushes and moves the receiving member 1. When the lid 7 is completely closed, the bulging portion of the receiving member 1 comes into contact with the package 6 or the lead 9. At this time, since the receiving member 1 is made of a plate material having a spring property, the package body 8 is pressed with an appropriate contact pressure. Of course, if the receiving member 1 also serves as a contact, the receiving member 1 contacts the lead 9. Then, the lid 7 is fixed by the clamp 10 so as not to come off, and measurement is performed.

Here, the projecting member 3 for moving the receiving member 1
Is precisely located at a position away from the position of the recess 7a, so that the position of the IC package body 8 determined by the movement of the receiving member 1 is always determined to be a fixed position. Also,
When the measurement is completed and the IC is to be removed, the clamp 10 is removed and the lid 7 is opened. As a result, the receiving member 1 is released from the projecting member 3 and springs back, and the tongue piece retreats. Then, the pusher protrudes from the hole of the base 2 and the package body 8
Extrude.

[0014]

As described above, according to the present invention, the receiving member for pressing the four corners of the IC package body is made of a leaf spring-like member having a resilient property. By providing the tongue piece at a position separated from the package body and moving the tongue piece of the receiving member along with the closing operation of the lid to provide the receiving member moving projection member on the lid so as to contact the package body, the Even if there is a variation in the external dimensions, it can be easily attached to and detached from the socket, and there is an effect that the efficiency of the IC measurement operation is improved.

[Brief description of the drawings]

FIG. 1 is a plan view of an IC socket according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view for explaining an operation of attaching / detaching an IC to / from the IC socket of FIG. 1;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Receiving member 1a, 3a Tapered surface 2 Base 3 Projection member 5 Contact 6 Main body 7 Lid 7a Depression 8 Package body 9 Lead 10 Clamp

Claims (2)

[Claims] 1. A socket body having a base on which an IC package is placed and on which the package is mounted, and a plurality of electrical contacts arranged around the base and in contact with leads around the package. A contact member, a lid member having a locking mechanism for holding and holding the package body placed on the base, closing an opening of the socket body, and determining a relative position with respect to the socket body; A leaf spring-shaped receiving member arranged adjacent to the electric contact at the four corners, and pressing the back surface of the receiving member with the operation of closing the opening of the socket main body with the lid member to move the receiving member. An IC socket, comprising: a projection member projecting from the lid member, the projection member being in contact with the receiving member at four corners of the package body. 2. The IC socket according to claim 1, wherein the receiving member is an electric contact that contacts the lead.